CN112123687A - Injection molding process for battery protection layer of Bluetooth headset - Google Patents
Injection molding process for battery protection layer of Bluetooth headset Download PDFInfo
- Publication number
- CN112123687A CN112123687A CN202010872648.3A CN202010872648A CN112123687A CN 112123687 A CN112123687 A CN 112123687A CN 202010872648 A CN202010872648 A CN 202010872648A CN 112123687 A CN112123687 A CN 112123687A
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- CN
- China
- Prior art keywords
- bluetooth headset
- injection molding
- pcb
- battery
- melt adhesive
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3468—Batteries, accumulators or fuel cells
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The invention discloses an injection molding process of a battery protection layer of a Bluetooth headset, which can quickly package a battery core and a PCB together, simplifies the packaging process in response to the traditional method that the battery core and the PCB are packaged together through an upper cover and a lower cover or are packaged together through bonding, and has good sealing performance and difficult cracking.
Description
Technical Field
The invention relates to the field of injection molding, in particular to an injection molding process of a battery protection layer of a Bluetooth headset.
Background
In bluetooth headset battery manufacturing process, need encapsulate electric core and PCB board together, prior art has two kinds of modes, one kind is with both through the shell encapsulation that possesses upper and lower cover together, but, this scheme exists that technology is loaded down with trivial details, and the process is troublesome, and the cost is higher. The other method is to bond the battery cell and the PCB together by glue and then encapsulate the battery cell and the PCB together, which is relatively simple in process and low in cost, however, the glue used for bonding often damages the PCB or the battery cell or has viscosity and often has the situations of easy cracking and no sealing in the process of bonding the battery cell and the PCB.
Disclosure of Invention
The invention provides an injection molding process for a battery protection layer of a Bluetooth headset, which solves the problems that a battery core and a PCB are packaged together in a traditional method, the process is complex, the battery is easy to damage, and the cost is high.
In order to solve the technical problems, the technical scheme of the invention is as follows: a Bluetooth headset battery protective layer injection molding process comprises the following steps:
s1: preparing materials, namely preparing a polyamide hot-melt adhesive material, an injection molding machine, a Bluetooth headset battery core and a PCB (printed circuit board) of a protective layer to be injected, a pretreatment protective film and a mold for injecting the Bluetooth headset battery protective layer;
s2: placing a pretreatment protective film, stacking the Bluetooth headset battery cell and the PCB together in the mold according to the step S1, and placing the pretreatment protective film above and/or at the bottom of the whole body of the Bluetooth headset battery cell and the PCB;
s3: carrying out hot melting treatment on the polyamide hot melt adhesive material, adding the polyamide hot melt adhesive material into an injection molding machine for hot melting according to the preparation material in the step S1, and then obtaining liquefied polyamide hot melt adhesive;
s4: injection molding, namely injecting the liquefied polyamide hot melt adhesive treated in the step S3 into a mold in which the protective film is pretreated in the step S2 through an injection molding machine;
s5: and (5) cooling the mold with the Bluetooth headset battery cell and the PCB after the injection molding in the step S4, and obtaining a protective layer formed by one layer of package on the surfaces of the Bluetooth headset battery cell and the PCB.
Preferably, the polyamide hot-melt adhesive material is hot-melt-processed in the step S3, and the hot-melt temperature of the injection molding machine is 180 ℃ to 190 ℃.
Preferably, in step S1, the material of the pre-treated protective film is a plastic film or a paper film.
Preferably, in the step S4, during the process of injecting the liquefied polyamide hot melt adhesive into the mold, the injection time (T) of the injection molding machine and the number (N) of the sets of the bluetooth headset cores and the PCB boards placed in the mold are calculated, that is, the injection time (T) of the injection molding machine is calculated according to T =2N, and the unit of the injection time (T) is seconds.
Preferably, in the step S5, the total mass of the polyamide hot melt adhesive used for forming the protective layer on each bluetooth headset battery is 2g-5 g.
Preferably, the temperature of the cooling in the step S5 is set to-5 ℃ to 40 ℃.
Preferably, in step S5, a protection layer is formed on the surface of the bluetooth headset battery cell and the PCB, and the battery cell and the PCB are completely wrapped, or only the PCB and one end of the PCB connected to the battery cell are wrapped.
The invention has the following beneficial effects: (1) according to the injection molding process of the battery protection layer of the Bluetooth headset, the battery core and the PCB can be quickly packaged together, compared with the traditional method that the battery core and the PCB are packaged together through an upper cover and a lower cover or are bonded together and then packaged, the packaging process is simplified in response, and the battery core and the PCB which are packaged are integrally formed, so that the battery protection layer of the Bluetooth headset is good in sealing performance and not prone to cracking. (2) In addition, the invention is also provided with a pretreatment protective film, and the polyamide hot melt adhesive for injection molding can be placed to damage the battery cell or the PCB due to high temperature. (3) Meanwhile, the invention has simple process and low cost.
Drawings
Fig. 1 is a flow chart of the injection molding process of the battery protection layer of the bluetooth headset of the invention.
Fig. 2 is a sectional view of the protective layer manufactured by the bluetooth headset battery protective layer injection molding process of the invention only wrapping the PCB and the connected end of the PCB and the battery core.
Fig. 3 is a cross-sectional view of a battery core and a PCB board all wrapped by a protective layer manufactured by the bluetooth headset battery protective layer injection molding process of the present invention.
Names of the corresponding components or flow names represented by numerals or letters in the drawings: 1, a PCB board; 2. an electric core; 3. a protective layer; 4. and (4) pretreating the protective film.
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted; the same or similar reference numerals correspond to the same or similar parts; the terms describing positional relationships in the drawings are for illustrative purposes only and are not to be construed as limiting the patent.
Detailed Description
In order to facilitate understanding for those skilled in the art, the present invention will be described in further detail with reference to the accompanying drawings and examples. The method comprises the following specific steps:
detailed description of the invention
As shown in fig. 1, the injection molding process of the battery protection layer of the bluetooth headset comprises the following steps:
s1: preparing materials, namely preparing a polyamide hot-melt adhesive material, an injection molding machine, a Bluetooth headset battery core 2 and a PCB 1 of a protective layer to be injection molded, a pretreatment protective film 4 and a mold for injection molding of the Bluetooth headset battery protective layer;
s2: placing a pretreatment protective film, stacking the Bluetooth headset battery cell and the PCB in a mold according to the step S1, and placing the pretreatment protective film above and/or at the bottom of the whole body of the Bluetooth headset battery cell and the PCB; in the embodiment, only the pretreatment protective film is arranged above the whole body of the battery cell and the PCB;
s3: carrying out hot melting treatment on the polyamide hot melt adhesive material, adding the polyamide hot melt adhesive material into an injection molding machine for hot melting according to the preparation material in the step S1, and then obtaining liquefied polyamide hot melt adhesive;
s4: injection molding, namely injecting the liquefied polyamide hot melt adhesive treated in the step S3 into a mold in which the protective film is pretreated in the step S2 through an injection molding machine;
s5: and (5) cooling the mold with the Bluetooth headset battery cell and the PCB after the injection molding in the step S4, and obtaining the protective layer 3 formed by one layer of package on the surfaces of the Bluetooth headset battery cell and the PCB.
Specifically, in step S3, the polyamide hot-melt adhesive material is hot-melted by an injection molding machine at a temperature of 180 ℃ to 190 ℃. The temperature of the injection molding machine in step S3 of this example was 180 ℃.
Specifically, in step S1, the material of the pre-treatment protective film is a plastic film or a paper film. In this embodiment, the material of the pre-treated protective film in step S1 is a plastic film.
Specifically, in the step S4, in the process of injecting the liquefied polyamide hot melt adhesive into the mold, the injection time (T) of the injection molding machine and the number (N) of the sets of the bluetooth headset core and the PCB board placed in the mold are calculated, that is, the injection time (T) of the injection molding machine is calculated according to T =2N, and the unit of the injection time (T) is second. The number of the groups of the bluetooth headset battery cells and the PCB board placed in the mold in this embodiment is 4, and T =8 s.
Specifically, in step S5, the total mass of the polyamide hot melt adhesive used for forming the protective layer on each bluetooth headset battery is 2g-5 g. In this embodiment, the total mass of the polyamide hot melt adhesive used for forming the protective layer in step S5 is 2 g.
Specifically, the temperature of the cooling in step S5 is set to-5 ℃ to 40 ℃. In the present embodiment, the temperature of cooling in step S5 is set to-5 ℃.
Specifically, in step S5, a wrapped protection layer is formed on the surfaces of the battery cell and the PCB, and the battery cell and the PCB are all wrapped, or only the PCB and one end of the PCB connected to the battery cell are wrapped. In this embodiment, the protective layer 3 formed on the surfaces of the bluetooth headset electric core 2 and the PCB 1 in step S5 only wraps the PCB and the end of the connection between the PCB and the electric core. As shown in fig. 2.
Detailed description of the invention
The second embodiment is basically the same as the first embodiment, and the main differences are as follows: (1) the temperature of the injection molding machine hot melt in step S3 was 190 ℃. (2) The total mass of the polyamide hot melt adhesive used for forming the protective layer in step S5 was 5 g. (3) The temperature cooled in step S5 was set to 40 ℃. (4) All place preliminary treatment protection film 4 in the whole top and the bottom of bluetooth headset electricity core and PCB board, as shown in fig. 3, the preliminary treatment protection film is the paper membrane.
Detailed description of the invention
The third embodiment is basically the same as the first embodiment, and the main differences are as follows: (1) the temperature of the injection molding machine hot melt in step S3 was 185 ℃. (2) The total mass of the polyamide hot melt adhesive used for forming the protective layer in step S5 was 3 g. (3) The temperature cooled in step S5 is set to 25 ℃.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (7)
1. The utility model provides a bluetooth headset battery protective layer injection moulding process which characterized in that: the method comprises the following steps:
s1: preparing materials, namely preparing a polyamide hot-melt adhesive material, an injection molding machine, a Bluetooth headset battery core and a PCB (printed circuit board) of a protective layer to be injected, a pretreatment protective film and a mold for injecting the Bluetooth headset battery protective layer;
s2: placing a pretreatment protective film, stacking the Bluetooth headset battery cell and the PCB together in the mold according to the step S1, and placing the pretreatment protective film above and/or at the bottom of the whole body of the Bluetooth headset battery cell and the PCB;
s3: carrying out hot melting treatment on the polyamide hot melt adhesive material, adding the polyamide hot melt adhesive material into an injection molding machine for hot melting according to the preparation material in the step S1, and then obtaining liquefied polyamide hot melt adhesive;
s4: injection molding, namely injecting the liquefied polyamide hot melt adhesive treated in the step S3 into a mold in which the protective film is pretreated in the step S2 through an injection molding machine;
s5: and (5) cooling the mold with the Bluetooth headset battery cell and the PCB after the injection molding in the step S4, and obtaining a protective layer formed by one layer of package on the surfaces of the Bluetooth headset battery cell and the PCB.
2. The injection molding process of the battery protection layer of the Bluetooth headset according to claim 1, wherein: in the step S3, the polyamide hot-melt adhesive material is hot-melt-processed, and the hot-melt temperature of the injection molding machine is 180-190 ℃.
3. The injection molding process of the battery protection layer of the Bluetooth headset according to claim 1, wherein: in the step S1, the material of the pre-treated protective film is a plastic film or a paper film.
4. The injection molding process of the battery protection layer of the Bluetooth headset according to claim 1, wherein: in the step S4, in the process of injecting the liquefied polyamide hot melt adhesive into the mold, the injection time (T) of the injection molding machine and the number (N) of the sets of the bluetooth headset cores and the PCB boards placed in the mold are calculated, that is, calculated according to T =2N, and the unit of the injection time (T) of the injection molding machine is second.
5. The injection molding process of the battery protection layer of the Bluetooth headset according to claim 4, wherein: in the step S5, the total mass of the polyamide hot melt adhesive for forming the protective layer on each bluetooth headset battery is 2g-5 g.
6. The injection molding process of a battery protection layer of a bluetooth headset according to any one of claims 1 to 4, wherein: the temperature of the cooling in the step S5 is set to-5 ℃ to 40 ℃.
7. The injection molding process of the battery protection layer of the Bluetooth headset according to claim 6, wherein: in step S5, a wrapped protection layer is formed on the surfaces of the battery cell and the PCB, and the battery cell and the PCB are completely wrapped, or only the PCB and one end of the PCB connected to the battery cell are wrapped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010872648.3A CN112123687A (en) | 2020-08-26 | 2020-08-26 | Injection molding process for battery protection layer of Bluetooth headset |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010872648.3A CN112123687A (en) | 2020-08-26 | 2020-08-26 | Injection molding process for battery protection layer of Bluetooth headset |
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| Publication Number | Publication Date |
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| CN112123687A true CN112123687A (en) | 2020-12-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010872648.3A Pending CN112123687A (en) | 2020-08-26 | 2020-08-26 | Injection molding process for battery protection layer of Bluetooth headset |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784159A (en) * | 2009-01-21 | 2010-07-21 | 谈剑锋 | Method for encapsulating PCB by adopting low pressure injection molding technology |
| CN102148402A (en) * | 2010-02-10 | 2011-08-10 | 珠海市雷鸣达通讯技术发展有限公司 | Process for packaging split-structure battery |
| CN204927366U (en) * | 2015-08-11 | 2015-12-30 | 东莞市伊斯诺电池有限公司 | Battery for mobile telephone set |
| CN108148198A (en) * | 2017-12-22 | 2018-06-12 | 山东凯恩新材料科技有限公司 | One kind can low-pressure injection molding polyamide hot and preparation method thereof |
| CN110459822A (en) * | 2019-08-07 | 2019-11-15 | 珠海冠宇电源有限公司 | Novel protected plate insulation-encapsulated technique and lithium battery |
-
2020
- 2020-08-26 CN CN202010872648.3A patent/CN112123687A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101784159A (en) * | 2009-01-21 | 2010-07-21 | 谈剑锋 | Method for encapsulating PCB by adopting low pressure injection molding technology |
| CN102148402A (en) * | 2010-02-10 | 2011-08-10 | 珠海市雷鸣达通讯技术发展有限公司 | Process for packaging split-structure battery |
| CN204927366U (en) * | 2015-08-11 | 2015-12-30 | 东莞市伊斯诺电池有限公司 | Battery for mobile telephone set |
| CN108148198A (en) * | 2017-12-22 | 2018-06-12 | 山东凯恩新材料科技有限公司 | One kind can low-pressure injection molding polyamide hot and preparation method thereof |
| CN110459822A (en) * | 2019-08-07 | 2019-11-15 | 珠海冠宇电源有限公司 | Novel protected plate insulation-encapsulated technique and lithium battery |
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Application publication date: 20201225 |