CN112113899A - Adhesive force detection method and detection system - Google Patents
Adhesive force detection method and detection system Download PDFInfo
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 31
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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Abstract
An adhesive force detection method and a detection system are provided, wherein the detection method comprises the following steps: providing a substrate, wherein the substrate comprises a bearing wafer; forming a plastic packaging layer on the bearing wafer; after the plastic package layer is formed, cutting the plastic package layer and the substrate, and taking the cut substrate as a structure to be detected; and after the cutting treatment, detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected. In the step of forming the plastic package layer, the plastic package layer is formed on the bearing wafer, and the adhesive force is detected after cutting treatment, so that the detection method can simulate the process conditions of the plastic package process and each process before and after the plastic package process in actual production, and obtain the adhesive force under the influence of the process conditions, thereby improving the reliability of the detection result.
Description
Technical Field
The embodiment of the invention relates to the field of semiconductor manufacturing, in particular to an adhesive force detection method and an adhesive force detection system.
Background
With the trend of very large scale integrated circuits, the feature size of the integrated circuits is continuously decreasing, and the requirements of people on the packaging technology of the integrated circuits are also increasing correspondingly. Among them, System In Package (SIP) is a System or subsystem that combines a plurality of active elements, passive elements, micro-electro-mechanical systems (MEMS), optical elements, etc. having different functions into one unit to form a System or subsystem that can provide multiple functions, allowing heterogeneous ICs to be integrated. Compared with a System on Chip (SoC), the System on Chip has the advantages of relatively simple integration of System-in-package, shorter design period and market period, lower cost, capability of realizing a more complex System, and relatively common packaging technology.
At present, in order to meet the objectives of lower cost, more reliability, faster performance and higher density of integrated circuit packaging, an advanced packaging method mainly adopts Wafer Level Package (WLP), which completes a packaging process on a Wafer (Wafer).
The plastic packaging (molding) process is a key step of wafer-level packaging, the chip and the interior of the chip are sealed and protected through the plastic packaging process, and the bonding force between a plastic packaging layer formed through the plastic packaging process and the wafer has a large influence on the packaging reliability.
Disclosure of Invention
The embodiment of the invention aims to provide a method and a system for detecting adhesive force, which can improve the reliability of a detection result.
In order to solve the above problem, an embodiment of the present invention provides an adhesion force detection method, including: providing a substrate, wherein the substrate comprises a bearing wafer; forming a plastic packaging layer on the bearing wafer; after the plastic package layer is formed, cutting the plastic package layer and the substrate, and taking the cut substrate as a structure to be detected; and after the cutting treatment, detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
Optionally, in the step of providing a substrate, the substrate further includes: a product simulation layer covering the bearing wafer; the plastic packaging layer is formed on the product simulation layer.
Optionally, before forming the molding compound layer on the carrier wafer, the method further includes: and performing hydrophilic treatment on the top surface of the substrate.
Optionally, before the cutting process is performed on the molding compound layer and the substrate, the method further includes: selecting a region to be detected on the bearing wafer; the steps of cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected comprise: cutting the structure to be detected from the substrate of the region to be detected.
Optionally, before the cutting process is performed on the molding compound layer and the substrate, the method further includes: selecting a region to be detected on the bearing wafer; the steps of cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected comprise: cutting the substrate into a plurality of chip structures; and taking the chip structure positioned in the area to be detected as the structure to be detected.
Optionally, the cross-sectional shape of the structure to be detected is rectangular, the length of the structure to be detected is 0.5 mm to 10 mm, and the width of the structure to be detected is 0.5 mm to 10 mm.
Optionally, the regions to be detected include a first region to be detected and a second region to be detected, the first region to be detected is located in a central region of the carrier wafer, and the second region to be detected is located in an edge region of the carrier wafer.
Optionally, the step of detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected includes: and carrying out a thrust test on the plastic package layer on the structure to be detected, wherein the thrust test is suitable for representing the adhesive force.
Optionally, the step of thrust testing includes: applying a pushing force to any side wall of the plastic packaging layer; acquiring a thrust value when the plastic package layer is pushed away from the structure to be detected as a thrust detection value; and calculating a thrust value on a unit area of the structure to be detected as a unit area adhesive strength, wherein the unit area adhesive strength is suitable for representing the adhesive force.
Optionally, the carrier wafer is a semiconductor wafer.
Accordingly, an embodiment of the present invention provides an adhesion force detecting system, including: a substrate comprising a carrier wafer; the plastic packaging unit is used for forming a plastic packaging layer on the bearing wafer; the cutting acquisition unit is used for cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected; and the measuring unit is used for detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
Optionally, the adhesive force detection system of the plastic package layer further includes: and the surface treatment unit is used for performing hydrophilic treatment on the top surface of the substrate before the plastic package layer is formed on the bearing wafer.
Optionally, the adhesive force detection system of the plastic package layer further includes: the selection unit is used for selecting a region to be detected on the bearing wafer; the cutting acquisition unit is used for cutting the structure to be detected from the substrate of the area to be detected; or the cutting acquisition unit is used for cutting the substrate into a plurality of chip structures and taking out the chip structures located in the region to be detected as the structures to be detected.
Optionally, the measurement unit is adapted to perform a thrust test on the plastic encapsulation layer on the structure to be detected, and is adapted to characterize the adhesive force, and the measurement unit includes: the thrust applying subunit is used for applying thrust to any side wall of the plastic packaging layer; the thrust measuring subunit is used for acquiring a thrust value when the plastic package layer is pushed away from the structure to be detected; and the calculation subunit is used for calculating a thrust value on a unit area of the structure to be detected as a unit area bonding strength, and the unit area bonding strength is suitable for representing the bonding force.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following advantages:
in the method for detecting the adhesive force of the plastic package layer, after the plastic package layer is formed on a carrier wafer (carrier wafer), the plastic package layer and a substrate are cut, the cut substrate is used as a structure to be detected, and then the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected is detected; compared with the scheme that the plastic package layer is directly formed on the substrate (such as a chip structure) with the preset size, in the step of forming the plastic package layer, the plastic package layer is formed on the bearing wafer, and the adhesive force is detected after cutting treatment, so that the detection method can simulate the process conditions of the plastic package process and the processes before and after the plastic package process in actual production, and the adhesive force under the influence of the process conditions is obtained, so that the reliability of the detection result is improved.
Drawings
FIG. 1 is a flow chart of one embodiment of the adhesion force detection method of the present invention;
fig. 2 to 8 are schematic structural diagrams corresponding to respective steps in the embodiment shown in fig. 1;
FIG. 9 is a functional block diagram of an embodiment of an adhesive force detection system of the present invention.
Detailed Description
As can be seen from the background art, the adhesive force between the plastic package layer formed by the plastic package process and the wafer has a large influence on the package reliability.
In actual production, the plastic package process itself and its preceding and following processes may affect the bonding force of the plastic package layer. Specifically, the plastic package material used for the plastic package layer, the conditions of the plastic package process, and the contamination on the surface of the wafer may cause insufficient adhesion between the plastic package layer and the wafer, thereby causing the problem of peeling or cracking of the plastic package layer.
At present, one measure for the bonding force of the molding compound layer is to drop the molding compound (e.g., resin) on a material with a predetermined size or a cut silicon wafer, and perform a thrust test after the curing is completed. However, the method can only simply monitor the bonding force between the plastic package layer and the wafer, but cannot simulate and detect the bonding force under the influence of the process conditions of each process, so that when the process conditions, the plastic package material adopted by the plastic package layer and other conditions change, whether the specific size of the bonding force between the plastic package layer and the wafer meets the production process requirements cannot be known.
In order to detect the bonding force under the influence of the process conditions of each process, another method is to observe whether the plastic package layer has the problems of peeling (peeling) or cracking (crack) and the like in the current plastic package process or the process after the plastic package process so as to qualitatively judge whether the bonding force of the plastic package layer is strong or weak or whether the bonding force of the plastic package layer meets the requirements of the production process, but this method cannot obtain quantitative data to judge whether the bonding force of the plastic package layer and the wafer meets the requirements of the production process.
Therefore, the reliability of the detection result obtained by the current detection method is low.
In order to solve the technical problem, an embodiment of the present invention provides an adhesion force detection method, including: providing a substrate, wherein the substrate comprises a bearing wafer; forming a plastic packaging layer on the bearing wafer; after the plastic package layer is formed, cutting the plastic package layer and the substrate, and taking the cut substrate as a structure to be detected; and after the cutting treatment, detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
Compared with the scheme that the plastic package layer is directly formed on the substrate with the preset size, in the step of forming the plastic package layer, the plastic package layer is formed on the bearing wafer, and the adhesive force is detected after cutting treatment, so that the detection method can simulate the process conditions of the plastic package process and each process before and after the plastic package process in actual production, and obtain quantized data under the influence of the process conditions to represent the adhesive force, thereby improving the reliability of the detection result.
Referring to FIG. 1, a flow chart of one embodiment of the adhesion force detection method of the present invention is shown. The detection method of the embodiment comprises the following basic steps:
step S1: providing a substrate, wherein the substrate comprises a bearing wafer;
step S2: forming a plastic packaging layer on the bearing wafer;
step S3: after the plastic package layer is formed, cutting the plastic package layer and the substrate, and taking the cut substrate as a structure to be detected;
step S4: and after the cutting treatment, detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
Fig. 2 to 8 are schematic structural diagrams corresponding to the steps in the embodiment shown in fig. 1.
Referring to fig. 1, and with combined reference to fig. 2 and fig. 3, fig. 2 is a top view, and fig. 3 is a cross-sectional view based on fig. 2, step S1 is performed to provide a substrate 50, where the substrate 50 includes a carrier wafer 100.
The substrate 50 is used to provide a process platform for the subsequent formation of the molding compound layer, so as to prepare for the subsequent detection of the adhesive force of the molding compound layer.
In the actual packaging process, the plastic package layer is usually formed on the wafer, so that the substrate 50 including the carrier wafer 100 can simulate the process conditions of the processes before the plastic package process in the actual production, and accordingly, the reliability of the detection result is higher when the adhesive force of the plastic package layer is subsequently detected.
In this embodiment, the carrier wafer 100 is a semiconductor wafer. The semiconductor wafer is a wafer type commonly used in the packaging process, has higher process compatibility and is easy to obtain.
As an embodiment, the semiconductor wafer is a bare wafer (bare wafer), and the bare wafer is a monitor wafer (monitor wafer) for determining whether the adhesive force of a subsequently formed plastic package layer meets the requirement of the production process, so as to adjust the optimal process condition of the plastic package process according to the detection result and apply the optimal process condition to a wafer actually used for manufacturing an integrated circuit.
In particular, the semiconductor wafer may be a silicon substrate.
In other embodiments, the carrier wafer may be a wafer of other material types according to the substrate selected in actual production. For example: oxide crystal wafers, ceramic wafers, metal wafers, organic plastic wafers, inorganic oxide wafers, ceramic material wafers, or the like.
With continued reference to fig. 2 and 3, in this embodiment, the substrate 50 further includes: a product simulation layer 200 covering the carrier wafer 100.
The product simulation layer 200 is used for simulating a film layer which is in contact with a plastic package layer in actual production.
By forming the product simulation layer 200 on the carrier wafer 100, the subsequent detection results are more reliable.
Wherein, the material, thickness and forming method of the product simulation layer 200 are selected according to the actual process requirements.
In other embodiments, the substrate may not contain the product simulation layer, that is, the substrate only includes the carrier wafer, according to practical situations.
It should be noted that, with continued reference to fig. 1, the detection method further includes: step S11 is performed to perform hydrophilic treatment on the top surface of the substrate 50.
The hydrophilic treatment serves to increase the hydrophilicity of the top surface of the substrate 50, thereby increasing the adhesion between the subsequent molding layer and the substrate 50.
The hydrophilic treatment is also used for simulating the working procedures before the plastic packaging process in the actual production.
Specifically, the process conditions of the hydrophilic treatment may be set according to actual process requirements.
In this embodiment, the carrier wafer 100 has a product simulation layer 200 formed thereon, and thus, the top surface of the substrate 50 refers to the surface of the product simulation layer 200.
In other embodiments, when the substrate does not contain the product simulation layer, the top surface of the substrate refers to the surface of the carrier wafer.
In other embodiments, the hydrophilic treatment may not be performed, depending on the actual situation.
With combined reference to fig. 1 and fig. 4, step S2 is performed to form a molding layer 300 on the carrier wafer 100.
Specifically, the molding layer 300 is formed on the product simulation layer 200 and contacts with the product simulation layer 200 to simulate the process conditions of actual production.
In this embodiment, the plastic package layer 300 is made of an epoxy plastic package material. Wherein the epoxy molding compound is prepared from epoxy resin and SiO2A curing agent, an additive and the like.
In this embodiment, according to actual process requirements, a corresponding plastic package process (e.g., an injection molding process or a thermal compression process) and process conditions are selected to form the plastic package layer 300.
In order to improve the reliability of the subsequent detection results, each step of the molding process, the step before forming the molding layer 300, and the step after forming the molding layer 300 may be simulated.
With continuing reference to fig. 1 and with combined reference to fig. 5-7, step S3 is performed, after the molding layer 300 is formed, the molding layer 300 and the substrate 50 (shown in fig. 5) are cut, and the cut substrate 50 is used as the structure 55 to be detected (shown in fig. 7).
The substrate 50 is cut out to serve as a structure 55 to be detected, so as to prepare for subsequent detection of the adhesive force between the molding layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected.
In actual production, after the plastic package process is completed, a step of cutting is further included, so when the adhesive force of the plastic package layer is detected, compared with a scheme of directly forming the plastic package layer on a substrate with a preset size, in the step of forming the plastic package layer 300, the plastic package layer 300 is formed on the carrier wafer 100, and the adhesive force is detected after the cutting process, therefore, the detection method can simulate the process conditions of the plastic package process itself and each process before and after the plastic package process in actual production, and obtain the adhesive force under the influence of the process conditions, so that the reliability of the detection result is improved.
In this embodiment, the cross section of the structure 55 to be detected is rectangular, so that the difficulty of cutting processing is reduced, the process compatibility with the existing cutting processing is high, and meanwhile, the cutting processing in actual production can be simulated.
It should be noted that the size of the structure 55 to be detected is not too small, nor too large. If the size of the structure 55 to be detected is too small, the detection process is prone to be inoperable in the subsequent process of detecting the adhesive force between the plastic package layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected; if the size of the structure 55 to be detected is too large, the adhesion between the plastic package layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected is too large, and in the subsequent adhesion detection process, the plastic package layer 300 is easily cracked due to insufficient strength, so that the normal operation of the detection process is affected. For this purpose, in the present embodiment, the length of the structure 55 to be detected is 0.5 mm to 10 mm, and the width of the structure 55 to be detected is 0.5 mm to 10 mm.
Referring to fig. 5 in combination, fig. 5 is a top view, and it should be noted that before the cutting process is performed on the molding layer 300 and the substrate 50, the method further includes: an area (not shown) to be inspected is selected on the carrier wafer 100 (shown in fig. 4).
The region to be detected is the position of the subsequent structure to be detected on the carrier wafer 100.
As shown in fig. 5, the cross-sectional shape of the handle wafer 100 is a circle, a region surrounded by a dotted line in fig. 5 is a central region of the handle wafer 100, and the remaining region is an edge region of the handle wafer 100, the edge region surrounding the central region. The central region refers to a region of the carrier wafer 100 near a center C of the carrier wafer 100.
In this embodiment, the regions to be detected include a first region to be detected 50c and a second region to be detected 50e, the first region to be detected 50c is located in a central region of the carrier wafer 100, and the second region to be detected 50e is located in an edge region of the carrier wafer 100.
Accordingly, the structure 55 to be detected is obtained from the central region and the edge region of the carrier wafer 100, so that the bonding force of the plastic package layer at a specific position of the carrier wafer 100 can be monitored, that is, the bonding force under the influence of different forming positions can be obtained, and the reliability of the detection result can be further improved.
Referring to fig. 6 and 7 in combination, fig. 6 is a top view, fig. 7 is a cross-sectional view, in this embodiment, the step of performing a cutting process on the molding layer 300 and the substrate 50, and using the cut substrate 50 as the structure 55 to be detected includes: cutting the substrate 50 into a plurality of chip structures 51 (shown in fig. 6); the chip structure 51 located in the region to be detected (not labeled) is taken out as the structure to be detected 55.
By cutting the substrate 50 into a plurality of chip structures 51, it is convenient to subsequently take out the single chip structure 51 from the position of the substrate 50 to be monitored according to actual requirements, so as to prepare for subsequent detection of the adhesive force.
In other embodiments, after the area to be detected is selected on the carrier wafer, the structure to be detected is only cut out of the substrate of the area to be detected, that is, the substrate of other areas does not need to be cut, so that the productivity is saved.
With combined reference to fig. 1 and 8, step S4 is performed, and after the cutting process, the adhesive force between the molding layer 300 on the structure to be detected 55 and the corresponding structure to be detected 55 is detected.
In the steps, the plastic packaging process and the process conditions of the processes before and after the plastic packaging process in the actual production are simulated, so that the deviation of the detection result and the adhesive force in the actual production is smaller, and the detection result has higher reliability.
Moreover, compared with a mode of observing whether the plastic packaging layer has the problems of falling or cracking and the like, the embodiment adopts a mode of detecting the adhesive force to obtain quantitative data to judge whether the adhesive force between the plastic packaging layer and the substrate meets the requirements of the production process; correspondingly, when the process conditions, the plastic package materials adopted by the plastic package layer and other conditions are changed, whether the specific size of the adhesive force between the plastic package layer and the substrate meets the production process requirements or not can be known in time, so that each process condition can be adjusted according to the detection result, the process conditions are further optimized, and accordingly the improvement of the packaging reliability is facilitated.
In this embodiment, the step of detecting the adhesive force includes: the plastic encapsulation layer 300 on the structure 55 to be tested is subjected to a thrust test suitable for characterizing the adhesive force.
Specifically, the step of thrust testing includes: applying a pushing force to any side wall of the plastic package layer 300; acquiring a thrust value when the plastic package layer 300 is pushed away from the structure to be detected 55 as a thrust detection value; the thrust test value is divided by the surface area of the structure 55 to be inspected to obtain a unit area bond strength suitable for characterizing the adhesive force.
In this embodiment, a pushing force is applied to any one of the sidewalls of the molding layer 300 by a pushing force applying member. By applying a pushing force, the force at which the molding layer 300 is pushed away from the structure 55 to be tested can be tested, thereby characterizing the adhesion force.
Specifically, the thrust applying member is a thrust machine. Correspondingly, the structure 55 to be detected is placed on a test bench of a pusher, and the pusher comprises a push broach; and applying the pushing force to any side wall of the plastic package layer 300 by using the push broach.
During the application of the pushing force, the value of the pushing force continuously increases from 0 until the push-knife pushes the molding layer 300 away from the structure to be tested 55.
In this embodiment, the thrust applying component is connected to a thrust measuring component, and the thrust measuring component is configured to obtain a magnitude of thrust when the plastic package layer 300 is pushed away from the structure to be detected 55.
In this embodiment, after obtaining the thrust force detection value, the thrust force detection value is divided by the surface area of the structure 55 to be detected to obtain the unit area adhesion strength, which is suitable for characterizing the adhesion force.
The unit area adhesive strength represents the magnitude of the thrust force applied to the unit area, and is used to characterize the adhesive force, thereby eliminating the detection difference caused by the different surface areas of the structure 55 to be detected.
Referring to fig. 9, a functional block diagram of an embodiment of an adhesion detection system for a molding layer of the present invention is shown.
Correspondingly, the embodiment of the invention also provides an adhesive force detection system.
The adhesive force detection system includes: a substrate 50, the substrate 50 including a carrier wafer 100 (shown in fig. 4); a molding unit 430, configured to form a molding layer 300 (as shown in fig. 4) on the carrier wafer 100; a cutting obtaining unit 440, configured to perform cutting processing on the mold layer 300 and the substrate 50, and use the cut substrate 50 as a structure 55 to be detected (as shown in fig. 7); the measuring unit 450 is configured to detect an adhesive force between the molding layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected.
In the detection system, the plastic package unit 430 is configured to form a plastic package layer 300 on the carrier wafer 100, the cutting acquisition unit 440 is configured to cut the plastic package layer 300 and the substrate 50, and the cut substrate 50 is used as a structure 55 to be detected, compared with a scheme in which a plastic package layer is directly formed on a substrate (e.g., a chip structure) with a preset size, the plastic package layer 300 of the embodiment is formed on the carrier wafer 100 and the adhesive force is detected after the cutting process, so that the detection system can simulate process conditions of the plastic package process itself and each process before and after the plastic package process in actual production and obtain the adhesive force under the influence of the process conditions, thereby improving reliability of a detection result.
The substrate 50 is used to provide a process platform for forming the molding layer 300, thereby providing for detecting the adhesion of the molding layer.
In the actual packaging process, the plastic package layer 300 is usually formed on the wafer, so that the substrate 50 including the carrier wafer 100 can simulate the process conditions of the processes before the plastic package process in the actual production, and accordingly, the reliability of the detection result is higher when the adhesive force of the plastic package layer 300 is subsequently detected.
In this embodiment, the carrier wafer 100 is a semiconductor wafer. The semiconductor wafer is a wafer type commonly used in the packaging process, has higher process compatibility and is easy to obtain.
As an embodiment, the semiconductor wafer is a bare wafer, and the bare wafer is used as a monitoring wafer for determining whether the adhesive force of the plastic package layer meets the requirement of the production process, so as to adjust the optimal process condition of the plastic package process according to the detection result and apply the optimal process condition to the wafer actually used for manufacturing the integrated circuit.
In particular, the semiconductor wafer may be a silicon substrate.
In other embodiments, the carrier wafer may be a wafer of other material types according to the substrate selected in actual production. For example: oxide crystal wafers, ceramic wafers, metal wafers, organic plastic wafers, inorganic oxide wafers, ceramic material wafers, or the like.
In this embodiment, the substrate 50 further includes a product simulation layer 200 (as shown in fig. 4) covering the carrier wafer 100.
The product simulation layer 200 is used for simulating a film layer contacting with the plastic package layer 300 in actual production.
By forming the product simulation layer 200 on the carrier wafer 100, the detection result is more reliable.
Wherein, the material, thickness and forming method of the product simulation layer 200 are selected according to the actual process requirements.
In other embodiments, the substrate may not contain the product simulation layer, that is, the substrate only includes the carrier wafer, according to practical situations.
It should be noted that, the adhesion force detection system of the plastic package layer further includes: a surface treatment unit 420 for performing a hydrophilic treatment on the top surface of the substrate 50.
The hydrophilic treatment serves to increase the hydrophilicity of the top surface of the substrate 50, thereby increasing the adhesion between the subsequent molding layer and the substrate 50.
The hydrophilic treatment is also used to simulate the process steps prior to the plastic packaging process in actual production.
Specifically, the process conditions of the hydrophilic treatment may be set according to actual process requirements.
In this embodiment, the carrier wafer has a product simulation layer 200 formed thereon, and thus, the top surface of the substrate 400 refers to the surface of the product simulation layer 200.
In other embodiments, when the substrate does not contain the product simulation layer, the top surface of the substrate refers to the surface of the carrier wafer.
In other embodiments, the detection system may also include the surface treatment unit, depending on the actual situation.
The molding unit 430 is configured to form a molding layer 300 on the carrier wafer 100.
Specifically, the molding layer 300 is located on the product simulation layer 200 and contacts with the product simulation layer 200 to simulate the process conditions of actual production.
In this embodiment, the plastic package layer 300 is made of an epoxy plastic package material. Wherein the epoxy molding compound is prepared from epoxy resin and SiO2A curing agent, an additive and the like.
In this embodiment, according to actual process requirements, the plastic package unit 430 may select a corresponding plastic package process (e.g., an injection molding process or a thermal compression process) and process conditions to form the plastic package layer 300.
In order to improve the reliability of the detection result, each step of the molding process, the step before forming the molding layer 300, and the step after forming the molding layer 300 may be simulated.
The cutting obtaining unit 440 is configured to perform cutting processing on the molding compound layer 300 and the substrate 50, and use the cut substrate 50 as the structure 55 to be detected.
The substrate 50 is cut out as a structure 55 to be tested, so as to prepare for testing the adhesive force between the molding layer 300 on the structure 55 to be tested and the corresponding structure 55 to be tested.
In this embodiment, the cross section of the structure 55 to be detected is rectangular, so that the difficulty of cutting processing is reduced, the process compatibility with the existing cutting processing is high, and meanwhile, the cutting processing in actual production can be simulated.
It should be noted that the size of the structure 55 to be detected is not too small, nor too large. If the size of the structure 55 to be detected is too small, the detection process is prone to be inoperable in the subsequent process of detecting the adhesive force between the plastic package layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected; if the size of the structure 55 to be detected is too large, the adhesion between the plastic package layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected is too large, and in the subsequent adhesion detection process, the plastic package layer 300 is easily cracked due to insufficient strength, so that the normal operation of the detection process is affected. For this purpose, in the present embodiment, the length of the structure 55 to be detected is 0.5 mm to 10 mm, and the width of the structure 55 to be detected is 0.5 mm to 10 mm.
Correspondingly, in this embodiment, the adhesive force detection system of the plastic package layer 300 further includes: a selecting unit 410, configured to select an area to be detected on the carrier wafer 100.
The region to be detected is the position of the structure to be detected 55 on the carrier wafer 100.
As shown in fig. 5, fig. 5 is a top view from the molding layer side, the cross-sectional shape of the carrier wafer 100 is circular, a region surrounded by a dotted line in fig. 5 is a central region of the carrier wafer 100, and the remaining region is an edge region of the carrier wafer 100, where the edge region surrounds the central region. The central region refers to a region of the carrier wafer 100 near a center C of the carrier wafer 100.
In this embodiment, the regions to be detected include a first region to be detected 50c and a second region to be detected 50e, the first region to be detected 50c is located in a central region of the carrier wafer 100, and the second region to be detected 50e is located in an edge region of the carrier wafer 100.
Correspondingly, the cutting obtaining unit 440 is configured to obtain the structure 55 to be detected from the central region and the edge region of the carrier wafer 100, so as to monitor the bonding force of the molding compound layer at a specific position of the carrier wafer 100, that is, obtain the bonding force under the influence of different forming positions, and further improve the reliability of the detection result.
As an example, the cutting acquisition unit 440 is configured to cut the substrate 50 into a plurality of chip structures 51 (as shown in fig. 6), and take out the chip structures 51 located in the to-be-detected region as the to-be-detected structures 55.
By cutting the substrate 50 into a plurality of chip structures 51, it is convenient to subsequently take out the single chip structure 51 from the position of the substrate 50 to be monitored according to actual requirements, so as to prepare for detecting the adhesive force.
In other embodiments, the cutting and acquiring unit may also be configured to cut the structure to be detected from the substrate of the region to be detected, that is, the substrate of other regions does not need to be cut, so as to save productivity.
The measuring unit 450 is used for detecting the adhesive force between the molding layer 300 on the structure 55 to be detected and the corresponding structure 55 to be detected. Because the plastic package unit 430 is used for forming the plastic package layer 300 on the carrier wafer 100, the cutting acquisition unit 440 is used for cutting the plastic package layer 300 and the substrate 50, and the cut substrate 50 is used as the structure 55 to be detected, the detection system can simulate the process conditions of the plastic package process itself and the processes before and after the plastic package process in actual production, so that the deviation between the detection result and the adhesive force in the actual production is smaller, and the detection result has higher reliability.
Moreover, compared with the mode of observing whether the plastic package layer has the problems of falling off or cracking and the like, the embodiment adopts the measuring unit 450 to detect the adhesive force so as to obtain a quantitative data to judge whether the adhesive force between the plastic package layer 300 and the structure to be detected 55 meets the requirements of the production process; accordingly, in the embodiment, when the process conditions, the plastic package material adopted by the plastic package layer 300, and other conditions change, whether the specific size of the adhesive force between the plastic package layer 300 and the structure to be detected 55 meets the production process requirement can be known in time, so that each process condition can be adjusted according to the detection result, the process conditions are further optimized, and accordingly, the improvement of the packaging reliability is facilitated.
In this embodiment, the measurement unit 450 is adapted to perform a thrust test on the molding layer 300 on the structure 55 to be tested, and is adapted to characterize the adhesive force.
Specifically, the measurement unit 450 includes: a thrust applying subunit 451 for applying a thrust to any one of the sidewalls of the plastic package layer 300; a thrust measurement sub-unit 452, configured to obtain a thrust value when the plastic package layer 300 is pushed away from the structure to be detected 55; a calculation subunit 453 is provided for calculating a thrust value per unit area of the structure to be inspected 55 as a unit area adhesion strength, which is suitable for characterizing the adhesion force.
In the present embodiment, the thrust applying subunit 451 includes a thrust applying member.
Specifically, the thrust applying member is a thrust machine. Correspondingly, the structure 55 to be detected is placed on a test bench of a pusher, and the pusher comprises a push broach; and applying the pushing force to any side wall of the plastic package layer 300 by using the push broach.
During the application of the pushing force, the value of the pushing force continuously increases from 0 until the push-knife pushes the molding layer 300 away from the structure to be tested 55.
In this embodiment, the thrust measuring subunit 452 includes a thrust measuring component, the thrust measuring component is connected to the thrust applying component, and the thrust measuring component is configured to obtain a magnitude of a thrust when the plastic package layer 300 is pushed away from the structure 55 to be detected.
The calculation subunit 453 is configured to calculate a thrust value per unit area of the structure to be detected 55 as the unit area adhesion strength. The unit area adhesive strength represents the magnitude of the thrust force applied to the unit area, and is used to characterize the adhesive force, thereby eliminating the detection difference caused by the different surface areas of the structure 55 to be detected.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (14)
1. An adhesive force detection method characterized by comprising:
providing a substrate, wherein the substrate comprises a bearing wafer;
forming a plastic packaging layer on the bearing wafer;
after the plastic package layer is formed, cutting the plastic package layer and the substrate, and taking the cut substrate as a structure to be detected;
and after the cutting treatment, detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
2. The method for testing adhesive force according to claim 1, wherein in the step of providing a substrate, the substrate further comprises: a product simulation layer covering the bearing wafer;
the plastic packaging layer is formed on the product simulation layer.
3. The method for detecting adhesion according to claim 1 or 2, further comprising, before forming the molding layer on the carrier wafer: and performing hydrophilic treatment on the top surface of the substrate.
4. The method for testing adhesion of claim 1, wherein before the cutting the molding layer and the substrate, the method further comprises: selecting a region to be detected on the bearing wafer;
the steps of cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected comprise: cutting the structure to be detected from the substrate of the region to be detected.
5. The method for testing adhesion of claim 1, wherein before the cutting the molding layer and the substrate, the method further comprises: selecting a region to be detected on the bearing wafer;
the steps of cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected comprise: cutting the substrate into a plurality of chip structures; and taking the chip structure positioned in the area to be detected as the structure to be detected.
6. The adhesion force detection method according to claim 1, 4 or 5, wherein the cross-sectional shape of the structure to be detected is rectangular, the length of the structure to be detected is 0.5 mm to 10 mm, and the width of the structure to be detected is 0.5 mm to 10 mm.
7. The adhesion detection method according to claim 4 or 5, wherein the areas to be detected comprise a first area to be detected located in a central region of the carrier wafer and a second area to be detected located in an edge region of the carrier wafer.
8. The adhesion force detection method as claimed in claim 1, wherein the step of detecting the adhesion force between the molding layer on the structure to be detected and the corresponding structure to be detected comprises: and carrying out a thrust test on the plastic package layer on the structure to be detected, wherein the thrust test is suitable for representing the adhesive force.
9. The method for testing adhesive force according to claim 8, wherein the step of the push test comprises: applying a pushing force to any side wall of the plastic packaging layer;
acquiring a thrust value when the plastic package layer is pushed away from the structure to be detected;
and calculating a thrust value on a unit area of the structure to be detected as a unit area adhesive strength, wherein the unit area adhesive strength is suitable for representing the adhesive force.
10. The method for detecting adhesion according to claim 1, wherein the carrier wafer is a semiconductor wafer.
11. An adhesive force detection system, comprising:
a substrate comprising a carrier wafer;
the plastic packaging unit is used for forming a plastic packaging layer on the bearing wafer;
the cutting acquisition unit is used for cutting the plastic packaging layer and the substrate, and taking the cut substrate as a structure to be detected;
and the measuring unit is used for detecting the adhesive force between the plastic package layer on the structure to be detected and the corresponding structure to be detected.
12. The adhesion detection system of claim 11, wherein the adhesion detection system of the mold layer further comprises: and the surface treatment unit is used for performing hydrophilic treatment on the top surface of the substrate before the plastic package layer is formed on the bearing wafer.
13. The adhesion detection system of claim 11, wherein the adhesion detection system of the mold layer further comprises: the selection unit is used for selecting a region to be detected on the bearing wafer;
the cutting acquisition unit is used for cutting the structure to be detected from the substrate of the area to be detected; or the cutting acquisition unit is used for cutting the substrate into a plurality of chip structures and taking out the chip structures located in the region to be detected as the structures to be detected.
14. The adhesion force detection system of claim 11, wherein the measurement unit is adapted to perform a push test on the mold layer on the structure to be inspected, adapted to characterize the adhesion force, the measurement unit comprising:
the thrust applying subunit is used for applying thrust to any side wall of the plastic packaging layer;
the thrust measuring subunit is used for acquiring a thrust value when the plastic package layer is pushed away from the structure to be detected;
and the calculation subunit is used for calculating a thrust value on a unit area of the structure to be detected as a unit area bonding strength, and the unit area bonding strength is suitable for representing the bonding force.
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