CN112104324B - Bypass diode for solar junction box - Google Patents
Bypass diode for solar junction box Download PDFInfo
- Publication number
- CN112104324B CN112104324B CN201910526647.0A CN201910526647A CN112104324B CN 112104324 B CN112104324 B CN 112104324B CN 201910526647 A CN201910526647 A CN 201910526647A CN 112104324 B CN112104324 B CN 112104324B
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- box body
- bypass diode
- junction box
- solar junction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 230000017525 heat dissipation Effects 0.000 claims abstract description 31
- 235000014676 Phragmites communis Nutrition 0.000 claims abstract description 17
- 244000273256 Phragmites communis Species 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000004033 plastic Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 9
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 238000010248 power generation Methods 0.000 description 9
- 239000000428 dust Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 7
- 238000009434 installation Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/30—Electrical components
- H02S40/34—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes
- H02S40/345—Electrical components comprising specially adapted electrical connection means to be structurally associated with the PV module, e.g. junction boxes with cooling means associated with the electrical connection means, e.g. cooling means associated with or applied to the junction box
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a bypass diode for a solar junction box, which belongs to the field of diodes and comprises a box body, wherein a box cover is fixedly connected to the top of the box body, a sliding rail is fixedly connected to the bottom of the inner wall of the box body, six connecting seats are movably connected to the surface of the sliding rail, connecting reeds are fixedly connected to the tops of the six connecting seats, connecting pins are fixedly connected to the tops of the connecting reeds, a diode body is fixedly connected between two adjacent connecting pins, two connectors are fixedly connected to one side of the box body, and wires are fixedly connected to one sides of the two connectors. According to the invention, the chips are assembled in parallel with the wires, the semiconductor chips with larger sizes can be placed in the same external dimension, the rated power of the product is improved, the area of copper wires in the product is increased, the heat dissipation area of the chips is enlarged, and the failure rate of the product can be effectively reduced.
Description
Technical Field
The invention relates to the field of diodes, in particular to a bypass diode for a solar junction box.
Background
Photovoltaic power generation devices are typically constructed from a number of photovoltaic modules. The photovoltaic module is formed by connecting photovoltaic power generation units in series according to required voltage, the photovoltaic power generation units are formed by connecting photovoltaic power generation units in series, when the photovoltaic module receives solar energy, under the condition that part of the photovoltaic power generation units cannot receive the solar energy or are damaged, a high power consumption state (hot spot) is displayed, the photovoltaic power generation units are damaged, and power generation operation faults are caused, so that the photovoltaic module needs to adopt a photovoltaic bypass diode circuit to protect the photovoltaic module and maintain normal operation of a photovoltaic power generation device, the product form of the photovoltaic bypass diode circuit appearing in the market at present is a photovoltaic bypass junction box, the junction box is composed of a junction box shell, a plurality of lead terminals and a plurality of discrete diodes, and the solar photovoltaic power generation module junction box is an important part for outputting a solar power supply and is a transition device for connecting a solar battery lead with an external lead.
At present, a lead type connection mode is adopted between a chip and a wire in a bypass diode, the chip is packaged through a packaging body, the chip and a copper wire are assembled in a side-by-side mode, the diameter size of the cylindrical packaging body limits the packaging of a large-size chip, the packaging of a chip with larger power size cannot be realized, meanwhile, the copper wire is too small in sectional area, heat dissipation of the chip is not facilitated, and high-temperature battery core failure is easy to cause.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide a bypass diode for a solar junction box, which is provided with the advantages that a semiconductor chip with larger size can be placed in the same outline dimension by assembling the chip parallel to a wire, the rated power of a product is improved, the copper wire area in the product is increased, the heat dissipation area of the chip is enlarged, and the failure rate of the product can be effectively reduced, so that the problems that the diameter size of a cylindrical packaging body limits the packaging of a large-size chip, the packaging of the chip with larger power size cannot be realized, and meanwhile, the copper wire has too small cross section area, the heat dissipation of the chip is not facilitated, and the high-temperature battery core is easy to fail are solved.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The utility model provides a bypass diode for solar junction box, includes the box body, the top fixedly connected with lid of box body, the inner wall bottom fixedly connected with slide rail of box body, the surface swing joint of slide rail has the connecting seat that is six in quantity, six the equal fixedly connected with connecting reed in top of connecting seat, the top fixedly connected with connecting foot of connecting reed, two adjacent fixedly connected with diode body between the connecting foot, one side fixedly connected with quantity of box body is two the connector of two, two equal fixedly connected with wire of one side of connector, two the wire with be located two of both sides connecting reed fixedly connected with radiator unit, diode body and radiator unit swing joint, the opposite side of box body is provided with the thermovent, the inner wall fixedly connected with dust screen of thermovent, the subassembly is in contact with the dust screen, the diode body is including semiconductor chip, first copper wire section and second copper wire section, semiconductor chip is located between first copper wire section and the first copper wire section, and the semiconductor plastic envelope surface of semiconductor chip, second copper wire section.
Preferably, the first copper wire segment and the second copper wire segment are both composed of copper wires and copper sheets, and the two copper sheets are placed in parallel.
Preferably, lead-tin solder is arranged on opposite sides of the first copper wire segment and the second copper wire segment, and the semiconductor chips are welded through the semiconductor chip lead-tin solder semiconductor chips.
Preferably, the insulating plastic package body is an epoxy resin material member.
Preferably, slots are formed in two sides of the top of the box body, inserting rods are fixedly connected to two sides of the bottom of the box cover, screws are connected to one sides of the inserting rods in a threaded mode, the inserting rods are fixedly connected with the slots through the screws, and rubber pads are fixedly connected to the top of the box body.
Preferably, the inner wall top fixedly connected with clamping device of connecting seat, the inner wall joint of clamping device and slide rail, clamping device is including the slider, the mounting groove has all been seted up to the both sides of slider, the first spring of inner wall fixedly connected with of mounting groove, one side fixedly connected with fixture block of first spring, fixture block and slide rail joint, and the shape of fixture block is triangle-shaped.
Preferably, the locating holes distributed at equal intervals are formed in one side of the sliding rail, the cavity is formed in the connecting seat, the locating rod is inserted into one side of the connecting seat, the locating rod penetrates through the cavity and is inserted into the locating hole, the baffle ring located in the cavity is sleeved on the surface of the locating rod, and the second spring located on one side of the baffle ring is sleeved on the surface of the locating rod.
Preferably, the heat dissipation assembly comprises a fixing frame, wherein metal copper sheets distributed at equal intervals are fixedly connected to the inner side of the fixing frame, and one end of the top of each metal copper sheet is arranged into an arc shape.
Preferably, one end of the wire is fixedly connected with a metal connecting sheet, the top thread of the metal connecting sheet is connected with a screw, and the metal connecting sheet and the connecting reed are fixedly connected with the connecting seat through the screw.
Preferably, a disassembly opening is formed in one side of the top of the sliding rail.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) According to the scheme, the semiconductor chip is parallel to the first copper wire section and the second copper wire section, the semiconductor chip with larger size can be placed in the insulating plastic package body with the same appearance size, the rated power of the product is improved, the copper wire area inside the product is increased, the heat dissipation area of the chip is enlarged, the product failure rate can be effectively reduced, the heat radiation area is increased by adjusting the copper wire packaged inside the insulating plastic package body into a flat structure through a lead wire, the heat dissipation capacity of the product is improved, the effective rated power is increased, meanwhile, the diode body is mounted on the heat dissipation assembly, air can enter and exit the box body through the heat dissipation opening, the heat dissipation of the diode body can be accelerated, dust-proof net can prevent dust and the like from entering from the heat dissipation opening, the service life of the diode inside the junction box is longer, the problem that the diameter size of the cylindrical package body limits the package of the chip, the package of the chip with larger power size cannot be realized is solved, and meanwhile, the copper wire is too small in cross section area and is unfavorable for the heat dissipation of the chip, and high-temperature battery core failure is easy to cause.
(2) This bypass diode for solar junction box constitutes through changing traditional copper wire into copper wire and copper sheet to through plumbous tin solder with semiconductor chip welding between two copper sheets, the semiconductor chip of easy to assemble size is great, and can enlarge the radiating area of chip, makes the life of diode body longer.
(3) This bypass diode for solar junction box is when carrying out the fixed of box body and lid, with the inserted bar grafting to the slot inside, then use the fix with screw can, and under the buffering of rubber pad, make the connection between box body and the lid inseparabler.
(4) This bypass diode for solar junction box through setting up the joint device, when the installation of needs connecting seat, can directly insert the slide rail inside, the in-process of insertible, the fixture block extrudees first spring, after the slide rail is inserted to inside, under the promotion of first spring, the fixture block stretches out from the mounting groove inside to the card is at the inner wall of slide rail, thereby can make the connecting seat install the slide rail inside that can be quick, it is very convenient to use.
(5) This bypass diode for solar junction box, through setting up the locating hole that the equidistance distributes, when the diode body of different quantity of needs installation, the connecting seat of accessible installation different quantity, then pulling locating lever makes the locating lever break away from the locating hole, adjusts the distance between each connecting seat this moment, after the regulation is accomplished, loosens the locating lever, and the locating lever grafting is inside the locating hole that corresponds this moment, can be at the diode body of box internally mounted not equidimension or quantity, application scope is wider.
(6) This bypass diode for solar junction box through setting up a plurality of metal copper sheets, can accelerate the heat dissipation on diode body surface, and through with metal copper sheet and dust screen contact, can accelerate the heat dissipation of metal copper sheet for the heat dissipation of diode body.
(7) According to the bypass diode for the solar junction box, the metal connecting sheet is arranged, so that a lead or a connecting reed can be detached from the connecting seat when needed, and subsequent replacement of accessories is facilitated.
(8) This bypass diode for solar junction box through setting up the dismantlement mouth, slides the position department of dismantling the mouth with the connecting seat, can be quick dismantle the connecting seat from the slide rail, it is very convenient to use.
Drawings
FIG. 1 is an exploded view of the present invention;
FIG. 2 is a schematic diagram of a diode body according to the present invention;
FIG. 3 is a perspective view of the connecting base of the present invention;
FIG. 4 is a schematic view of a connecting base according to the present invention;
FIG. 5 is an enlarged view of the invention at A in FIG. 1;
FIG. 6 is an enlarged view of the invention at B in FIG. 1;
fig. 7 is an enlarged view of the present invention at C in fig. 1.
The reference numerals in the figures illustrate:
1. a case body; 2. a box cover; 3. a slide rail; 4. a connecting seat; 5. connecting the reed; 6. a connecting pin; 7. a diode body; 71. a semiconductor chip; 72. a first copper wire segment; 73. a second copper wire segment; 74. an insulating plastic package body; 75. lead-tin solder; 8. a heat dissipation assembly; 81. a fixing frame; 82. a metal copper sheet; 9. a dust screen; 10. a connector; 11. a slot; 12. a rod; 13. a clamping device; 131. a slide block; 132. a first spring; 133. a clamping block; 14. positioning holes; 15. a positioning rod; 16. a metal connecting sheet; 17. and (5) detaching the opening.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-7, a bypass diode for a solar junction box includes a box body 1, a box cover 2 is fixedly connected to the top of the box body 1, a sliding rail 3 is fixedly connected to the bottom of the inner wall of the box body 1, six connecting seats 4 are movably connected to the surface of the sliding rail 3, connecting reeds 5 are fixedly connected to the tops of the six connecting seats 4, connecting feet 6 are fixedly connected to the tops of the connecting reeds 5, a diode body 7 is fixedly connected between two adjacent connecting feet 6, connectors 10 with two numbers are fixedly connected to one side of the box body 1, wires are fixedly connected to one sides of the two connectors 10, two wires are fixedly connected to the two connecting reeds 5 on two sides, a heat dissipation assembly 8 is fixedly connected to the bottom of the inner wall of the box body 1, the diode body 7 is movably connected to the heat dissipation assembly 8, a dust-proof net 9 is fixedly connected to the inner wall of the heat dissipation opening, the diode body 8 is in contact with the dust-proof net 9, the diode body 7 includes a semiconductor chip 71, a first copper wire segment 72 and a second copper wire segment 73, one side of the two connectors 10 are fixedly connected to the two copper wire segments 73, one side of the two copper wire segments 71 is fixedly connected to the second copper wire segment 73, one side of the two copper wire segment 73 is in the insulating plastic package with the second copper segment 73, and the second copper wire segment 73 is in the insulating plastic segment 72, and the insulating plastic segment 72 is located between the two copper wire segment and the first copper segment and the second copper segment is located between the copper segment and the copper segment is insulating segment and the insulating plastic segment and the insulating material.
Further, the first copper wire section 72 and the second copper wire section 73 are both composed of copper wires and copper sheets, the two copper sheets are placed in parallel, lead-tin solder 75 is arranged on opposite sides of the first copper wire section 72 and the second copper wire section 73, the semiconductor chips 71 are welded through the semiconductor chips 71 of the lead-tin solder 75 of the semiconductor chips 71, the traditional copper wires are changed into copper wires and copper sheets, and the semiconductor chips 71 are welded between the two copper sheets through the lead-tin solder 75, so that the semiconductor chips 71 with larger sizes are convenient to install, the heat dissipation area of the chips can be enlarged, and the service life of the diode body 7 is prolonged.
Further, slot 11 has all been seted up to the top both sides of box body 1, the equal fixedly connected with inserted bar 12 in the bottom both sides of lid 2, one side threaded connection of inserted bar 12 has the screw, inserted bar 12 passes through screw and slot 11 fixed connection, and the top fixedly connected with rubber pad of box body 1, when carrying out the fixed of box body 1 and lid 2, peg graft inserted bar 12 to slot 11 inside, then use the screw fixation can, and under the buffering of rubber pad, make the connection between box body 1 and the lid 2 inseparabler.
Further, the inner wall top fixedly connected with clamping device 13 of connecting seat 4, clamping device 13 and the inner wall joint of slide rail 3, clamping device 13 is including slider 131, the mounting groove has all been seted up to slider 131's both sides, the first spring 132 of inner wall fixedly connected with of mounting groove, one side fixedly connected with fixture block 133 of first spring 132, fixture block 133 and slide rail 3 joint, and the shape of fixture block 133 is triangle-shaped, through setting up clamping device 13, when the installation of connecting seat 4, can directly insert slider 131 inside slide rail 3, the in-process of insertition, fixture block 133 extrudes first spring 132, after slider 131 pegs into slide rail 3 inside, under the promotion of first spring 132, fixture block 133 stretches out from the mounting groove inside, and the inner wall of slide rail 3, thereby can make connecting seat 4 install slide rail 3 inside fast, it is very convenient to use.
Further, the locating hole 14 that the equidistance was distributed has been seted up to one side of slide rail 3, the cavity has been seted up to the inside of connecting seat 4, peg graft in one side of connecting seat 4 has locating lever 15, locating lever 15 runs through the cavity and peg graft with locating hole 14, the spacer ring that is located the cavity is cup jointed on the surface of locating lever 15, the surface cover of locating lever 15 is equipped with the second spring that is located spacer ring one side, through setting up the locating hole 14 that the equidistance was distributed, when the diode body 7 of different quantity of needs installation, the connecting seat 4 of accessible installation is different quantity, then pulling locating lever 15 makes locating lever 15 break away from locating hole 14, adjust the distance between each connecting seat 4 this moment, after adjusting, loosen locating lever 15, locating lever 15 peg graft in the locating hole 14 that corresponds this moment inside, can be at the diode body 7 of box 1 internally mounted not equidimension or quantity, application scope is wider.
Further, the heat dissipation assembly 8 comprises a fixing frame 81, the inner side of the fixing frame 81 is fixedly connected with equidistant arranged metal copper sheets 82, one end of the top of each metal copper sheet 82 is arranged into an arc shape, the heat dissipation of the surface of the diode body 7 can be quickened by arranging a plurality of metal copper sheets 82, and the heat dissipation of the metal copper sheets 82 can be quickened by contacting the metal copper sheets 82 with the dust screen 9, so that the heat dissipation of the diode body 7 is quickened.
Further, one end fixedly connected with metal connection piece 16 of wire, the top threaded connection of metal connection piece 16 has the screw, and metal connection piece 16 and connection reed 5 all pass through screw and connection seat 4 fixed connection, through setting up metal connection piece 16, can be when needing with wire or connection reed 5 from connection seat 4 pull down, have made things convenient for follow-up change accessory.
Further, the disassembly opening 17 is formed in one side of the top of the sliding rail 3, the connection seat 4 is slid to the position of the disassembly opening 17 through the disassembly opening 17, and the connection seat 4 can be quickly disassembled from the sliding rail 3, so that the use is very convenient.
Working principle: through the semiconductor chip 71 being parallel to the first copper wire section 72 and the second copper wire section 73 equipment, the semiconductor chip 71 of bigger size can be put into in the insulating plastic package body 74 that the overall dimension is the same, the rated power of product is improved, increase the copper wire area inside the product, enlarge the radiating area of chip, can effectually reduce the product failure rate, through adjusting the copper wire that encapsulates inside insulating plastic package body 74 into flat structure by the leaded wire, increase the heat radiating area, thereby improve the heat radiating capacity of product, increase effective rated power, simultaneously through installing diode body 7 on radiating assembly 8, air accessible thermovent business turn over box body 1, can accelerate the heat dissipation of diode body 7, and dust screen 9 has played and has prevented that dust etc. from getting into from the thermovent, make the inside diode life of terminal box longer, the diameter size of cylinder type encapsulation body has restricted the encapsulation of big size chip, can't realize the encapsulation of bigger power size chip, simultaneously, copper wire is because of the cross-section is too little, be unfavorable for the radiating of chip's heat dissipation problem of high temperature electric core easily causes.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (10)
1. The utility model provides a bypass diode for solar junction box, includes box body (1), the top fixedly connected with lid (2) of box body (1), its characterized in that: the semiconductor chip comprises a box body (1), a sliding rail (3) fixedly connected with the bottom of the inner wall of the box body (1), six connecting bases (4) with six surface swing joint numbers of the sliding rail (3), connecting reeds (5) fixedly connected with the top of the connecting base (4), connecting reeds (5) fixedly connected with connecting feet (6) at the top, two adjacent connecting feet (6) between fixedly connected with diode body (7), one side fixedly connected with of the box body (1) is connector (10) with two numbers of connectors (10), two one side of the connector (10) is fixedly connected with a wire, two wires are fixedly connected with two connecting reeds (5) at two sides, the bottom of the inner wall of the box body (1) is fixedly connected with a heat dissipation assembly (8), the diode body (7) is movably connected with the heat dissipation assembly (8), the other side of the box body (1) is provided with a heat dissipation port, the inner wall of the heat dissipation port is fixedly connected with a dustproof net (9), the assembly (8) is contacted with the dustproof net (9), the first semiconductor chip (73) is contacted with the dustproof net (73), the second semiconductor chip (71) is located between the first semiconductor chip (73) and the second semiconductor chip (71), and the second semiconductor chip (71) is located between the first semiconductor chip (73) and the second semiconductor chip 72 The surfaces of the first copper wire section (72) and the second copper wire section (73) are sealed and molded with insulating plastic packages (74).
2. A bypass diode for a solar junction box according to claim 1, wherein: the first copper wire section (72) and the second copper wire section (73) are both composed of copper wires and copper sheets, and the two copper sheets are placed in parallel.
3. A bypass diode for a solar junction box according to claim 1, wherein: the opposite sides of the first copper wire section (72) and the second copper wire section (73) are provided with lead-tin solder (75), and the semiconductor chips (71) are welded through the semiconductor chips (71) and the lead-tin solder (75) and the semiconductor chips (71).
4. A bypass diode for a solar junction box according to claim 1, wherein: the insulating plastic package body (74) is an epoxy resin material member.
5. A bypass diode for a solar junction box according to claim 1, wherein: the novel box comprises a box body (1), wherein slots (11) are formed in two sides of the top of the box body (1), inserting rods (12) are fixedly connected to two sides of the bottom of the box cover (2), screws are connected to one sides of the inserting rods (12) in a threaded mode, the inserting rods (12) are fixedly connected with the slots (11) through the screws, and rubber pads are fixedly connected to the top of the box body (1).
6. A bypass diode for a solar junction box according to claim 1, wherein: the inner wall top fixedly connected with clamping device (13) of connecting seat (4), clamping device (13) and the inner wall joint of slide rail (3), clamping device (13) are including slider (131), the mounting groove has all been seted up to the both sides of slider (131), the inner wall fixedly connected with first spring (132) of mounting groove, one side fixedly connected with fixture block (133) of first spring (132), fixture block (133) and slide rail (3) joint, and the shape of fixture block (133) is triangle-shaped.
7. A bypass diode for a solar junction box according to claim 1, wherein: the locating device is characterized in that locating holes (14) distributed at equal intervals are formed in one side of the sliding rail (3), a cavity is formed in the connecting seat (4), a locating rod (15) is inserted into one side of the connecting seat (4), the locating rod (15) penetrates through the cavity and is inserted into the locating holes (14), a baffle ring located in the cavity is sleeved on the surface of the locating rod (15), and a second spring located on one side of the baffle ring is sleeved on the surface of the locating rod (15).
8. A bypass diode for a solar junction box according to claim 1, wherein: the heat dissipation assembly (8) comprises a fixing frame (81), wherein metal copper sheets (82) distributed at equal intervals are fixedly connected to the inner side of the fixing frame (81), and one end of the top of each metal copper sheet (82) is arranged into an arc shape.
9. A bypass diode for a solar junction box according to claim 1, wherein: one end fixedly connected with metal connection piece (16) of wire, the top threaded connection of metal connection piece (16) has the screw, metal connection piece (16) and connection reed (5) are all through screw and connecting seat (4) fixed connection.
10. A bypass diode for a solar junction box according to claim 1, wherein: a disassembly opening (17) is formed in one side of the top of the sliding rail (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910526647.0A CN112104324B (en) | 2019-06-18 | 2019-06-18 | Bypass diode for solar junction box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910526647.0A CN112104324B (en) | 2019-06-18 | 2019-06-18 | Bypass diode for solar junction box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112104324A CN112104324A (en) | 2020-12-18 |
| CN112104324B true CN112104324B (en) | 2024-01-30 |
Family
ID=73749360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910526647.0A Active CN112104324B (en) | 2019-06-18 | 2019-06-18 | Bypass diode for solar junction box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112104324B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115642874A (en) * | 2022-09-09 | 2023-01-24 | 安徽钜芯半导体科技有限公司 | Packaging structure for improving thermal conductivity of photovoltaic module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944546A (en) * | 2010-09-16 | 2011-01-12 | 常熟市冠日新材料有限公司 | Solar photovoltaic module junction box |
| CN102054888A (en) * | 2010-12-14 | 2011-05-11 | 陈新初 | Photovoltaic assembly junction box |
| CN108551324A (en) * | 2018-06-17 | 2018-09-18 | 李婵珊 | A kind of efficient integrated junction box of photovoltaic |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101272039B (en) * | 2007-03-23 | 2010-04-14 | 励国庆 | Quick connection box |
| DE102008022049B4 (en) * | 2008-05-03 | 2010-07-15 | Lumberg Connect Gmbh | Connection box for connecting a solar module |
-
2019
- 2019-06-18 CN CN201910526647.0A patent/CN112104324B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101944546A (en) * | 2010-09-16 | 2011-01-12 | 常熟市冠日新材料有限公司 | Solar photovoltaic module junction box |
| CN102054888A (en) * | 2010-12-14 | 2011-05-11 | 陈新初 | Photovoltaic assembly junction box |
| CN108551324A (en) * | 2018-06-17 | 2018-09-18 | 李婵珊 | A kind of efficient integrated junction box of photovoltaic |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112104324A (en) | 2020-12-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112104324B (en) | Bypass diode for solar junction box | |
| CN102313196B (en) | Lamp holder of modularized intelligent street lamp and light module of lamp holder | |
| CN207303253U (en) | Lithium ion battery | |
| CN208058445U (en) | A kind of LED module encapsulating structure | |
| CN210219434U (en) | LED lamp with heat radiation structure | |
| WO2019227567A1 (en) | Ultra-narrow photovoltaic junction box with miniature power management module | |
| CN207962248U (en) | A kind of detachable advertisement position LED light | |
| CN213746242U (en) | LED hard strip lamp | |
| CN204664936U (en) | LED plant lamp encapsulating structure | |
| CN209030503U (en) | A kind of mobile phone plane plate refrigerator | |
| CN216243647U (en) | Protection type spotlight LED lamp | |
| CN107477542B (en) | Household LED heat dissipation lamp set convenient to replace | |
| CN219389447U (en) | External power supply of LED lamp and LED lamp | |
| CN219536404U (en) | Light-emitting diode lead frame | |
| CN215580698U (en) | Small-size motor for household electrical appliances with safety structure | |
| CN113091024A (en) | Supporting device for LED lamp | |
| CN207610010U (en) | A kind of LED lamp mounting plate buckle | |
| CN214313232U (en) | Full-view-angle LED chip packaging structure | |
| CN208889656U (en) | A kind of novel package structure of linear constant current chip | |
| CN217209106U (en) | Embedded rotary heat dissipation type LED lamp | |
| CN218772798U (en) | LED driving power supply structure | |
| CN220773883U (en) | Energy-saving LED display screen assembly | |
| CN208336243U (en) | Single group string power module | |
| CN208720163U (en) | A kind of LED light wiring board | |
| CN214038310U (en) | Detachable plant lamp of lamp strip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |