CN112015245A

CN112015245A - Tower architecture for computer

Info

Publication number: CN112015245A
Application number: CN202010122052.1A
Authority: CN
Inventors: B·K·安德烈; E·J·库珀; B·W·德格纳; H·R·法拉哈尼; S·A·杰拉西莫夫; W·H·格林鲍姆; J·T·汉迪; D·D·赫希; 黄鹏远; E·A·克诺夫; R·D·科索洛; M·L·拉纳斯; M·E·勒克莱尔; M·D·麦克布鲁姆; R·杜特维尔穆巴拉克; D·C·帕雷尔; S·K·帕西曼; E·R·普莱瑟; J·W·鲁瑟斯; C·G·西格尔
Original assignee: Apple Inc
Current assignee: Apple Inc
Priority date: 2019-05-31
Filing date: 2020-02-27
Publication date: 2020-12-01

Abstract

The present disclosure relates to computer tower architectures. The electronic device may include: a frame configured to receive and support an electronic component; a housing defining an interior volume and sized to enclose the frame and the electronic component, the housing being slidably removable from the frame; the electronic component positioned within the interior volume and comprising an aperture; and a sealing member comprising a sealing body and a compressible lip extending from the sealing body, the sealing member at least partially surrounding the electronic component. The compressible lip is oriented such that the housing compresses the lip in a direction against the seal body at a first location adjacent the electronic component and in the direction against the seal body at a second location adjacent the electronic component opposite the first location.

Description

Tower architecture for computer

Cross Reference to Related Applications

This application claims priority from U.S. provisional patent application No. 62/855,804 entitled "consumer power equipment ARCHITECTURE" filed on 31/5/2019, the entire disclosure of which is hereby incorporated by reference.

Technical Field

The described embodiments relate generally to housings. More particularly, the present embodiments relate to a case for an electronic device.

Background

The components of the electronic device, such as the processor, memory, and cooling apparatus, may determine, in part, the performance level of the electronic device. However, the placement of these components in the device relative to each other may also determine the performance level of the electronic device.

The continued development of electronic devices and their components has resulted in considerable improvements in performance. However, existing components and structures of electronic devices may limit the performance level of such devices. For example, existing electronic device enclosures may limit the performance of the electronic device by failing to effectively dissipate or remove heat generated by components of the electronic device to the surrounding environment. Further, the components and their arrangement may also affect other performance of the device, such as one or more of the components being easily accessible and replaceable by a user, the amount of noise generated by the device, the modularity and configurability of the device, and the cost of manufacturing the device. Accordingly, it may be desirable to further customize and arrange the components of an electronic device to provide additional or enhanced functionality without introducing or adding undesirable device characteristics.

Disclosure of Invention

According to one aspect of the present disclosure, a housing for an electronic device may include a body having an outer surface and a second surface disposed opposite the outer surface, the second surface at least partially defining an interior volume. The body defines a first repeating pattern of apertures extending therethrough from the outer surface to the second surface, and the component defines a second repeating pattern of apertures extending therethrough, the component being positioned substantially adjacent to the second surface in the interior volume. The first repeating pattern of apertures and the second repeating pattern of apertures may combine to define an open area of at least about 70%.

In some examples, the first repeating pattern of apertures defined by the body and the second repeating pattern of apertures defined by the component may reduce electromagnetic radiation passing therethrough by at least about 5, 10, 20, 30, or even more dB μ V for frequencies between about 2GHz and about 5 GHz. The body may define the first repeating pattern of apertures as a continuous matrix of channels. The first repeating pattern of apertures and the second repeating pattern of apertures may combine to define an open area of between about 75% and about 85%. The component may be adhered to the second surface by a pressure sensitive adhesive. The component may be a substantially planar sheet of material having a thickness of about 3 mm. The component may define the second repeating pattern of apertures as a pattern of substantially circular apertures, each aperture having a diameter greater than about 2 mm.

According to some other aspects of the disclosure, an electronic device may include: a housing defining an outer surface including a recess; a port configured to receive and engage a corresponding connector of a cable; and a component removably attachable to the housing to define an aperture sized to allow a cable to pass therethrough. The component may include a body, a pin sized to engage with a recess on the outer surface to removably attach the component to the housing, the pin being at least partially retractable into the body when the body is removed from the housing. The aperture may be positioned relative to the port such that when the connector is engaged with the port and the cable is passed through the aperture, the cable is retained at an angle of at least about 5 °, 10 °, 15 °, 20 °, or 30 ° or more relative to the connector.

In some examples, the component may also include a pin magnet that exerts an attractive force on the pin. The housing may include a housing magnet disposed substantially adjacent to the recess, the housing magnet exerting a stronger attractive force on the pin than the attractive force exerted by the component magnet to move the pin away from the body. The outer portion may include a second recess, and the component may include a second pin sized to engage with the second recess to removably attach the component to the housing, the second pin being at least partially retractable into the body when the body is removed from the housing. The aperture may be oriented orthogonal to the direction of insertion of the connector into the port. The component may include a tab configured to engage a portion of the housing to prevent removal of the component by a force exerted on the component in a direction parallel to a direction of insertion of the connector into the port. The component can be removed from the housing by applying a force to the component in a direction orthogonal to the direction in which the connector is inserted into the port.

According to some other aspects of the present disclosure, a housing for an electronic device may include a body at least partially defining an exterior surface and an interior volume. The body may also define a cavity in a top portion of the outer surface, a first antenna disposed in a first half of the cavity, a second antenna disposed in a second half of the cavity and oriented parallel and aligned with the first antenna in the cavity, and an interposer disposed in the cavity and extending substantially an entire length and width thereof. The first and second antennas disposed in the cavity may be dual-band antennas, respectively. The insert may cover the first and second dual-band antennas and may define a first central slot aligned with a length of the cavity and may be positioned approximately at a midpoint of a width of the first half of the cavity, the central slot may be configured to allow passage of electromagnetic radiation having a frequency of approximately 5GHz therethrough. The insert may further define a second central slot aligned with the length of the cavity and positioned approximately at a midpoint of the width of the second half of the cavity, the second central slot may be configured to allow passage of electromagnetic radiation having a frequency of about 5GHz therethrough. Further, a first pair of edge slots may be aligned with the first central slot and positioned along a perimeter of the insert in the first half of the cavity, the first pair of edge slots may be configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough, and a second pair of edge slots may be aligned with the second central slot and positioned along the perimeter of the insert in the second half of the cavity, the second pair of edge slots may be configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough.

In some examples, the enclosure may further include a seal comprising a material transparent to electromagnetic radiation having a frequency greater than 2.4GHz, the seal may be positioned in the cavity and may block the first central slot, the second central slot, the first pair of edge slots, and the second pair of edge slots. The cavity may have a depth of less than about 10 mm. The cavity may have a length and a width. The housing may also include a handle having a length and a width substantially similar to the length and width of the cavity, the handle covering the cavity. The body may also define a second cavity oriented parallel to the first cavity in a top portion of the outer surface, the cavity further including a third dual-band antenna disposed in a first half of the second cavity, a fourth dual-band antenna disposed in a second half of the second cavity and oriented parallel and aligned with the third dual-band antenna in the second cavity, a second insert disposed in the second cavity and extending substantially an entire length and width thereof. The second insert may cover the third and fourth dual-band antennas and may define a third central slot aligned with a length of the second cavity and may be positioned approximately at a midpoint of a width of the first half of the second cavity and may be configured to allow passage of electromagnetic radiation having a frequency of about 5GHz therethrough. The second insert may further define a fourth central slot aligned with the length of the second cavity and positioned approximately at a midpoint of the width of the second half of the second cavity, the fourth central slot may be configured to allow passage of electromagnetic radiation having a frequency of about 5GHz therethrough. Further, a third pair of edge slots may be aligned with the third central slot and may be positioned along a perimeter of the second insert in the first half of the second cavity, the third pair of edge slots may be configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough, and a fourth pair of edge slots may be aligned with the fourth central slot and may be positioned along a perimeter of the second insert in the second half of the second cavity, the fourth pair of edge slots may be configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough.

According to some other aspects of the disclosure, an electronic device may include: a frame defining a space configured to receive a power supply unit; and a casing defining an interior volume and sized to surround the frame, the casing being slidably removable from the frame, and the casing further defining an opening sized to receive an Alternating Current (AC) input of the power supply unit and expose the AC input to an exterior environment. The electronic device may also include a power supply unit including a body defining an exterior surface and an interior volume of the power supply unit and contacts electrically connecting the power supply unit to one or more electronic components of the electronic device to provide Direct Current (DC) power thereto. The AC input may be electrically connected to the contacts and mechanically connected to the body by an arm within the interior volume of the power supply such that the AC input may be configured to move at least about 0.3mm in two or more axes relative to the body of the power supply unit.

In some examples, the body of the power supply unit may include aluminum. The main body of the power supply unit may have a generally rectangular prismatic shape, and may include a first part defining a top outer surface, a bottom outer surface, and a first side outer surface, and a second part defining a front outer surface, a rear outer surface, and a second side outer surface disposed opposite the first side outer surface. The case may further include a ground engaging member including an elongated body, a first set of arms extending from a first side of the body, and a second set of arms extending from a second side of the body opposite the first side, wherein the first and second sets of arms are offset from each other such that when the first and second sets of arms are folded over the body, the arms in the second set are positioned between two arms in the first set. Each of the arms in the first and second sets may be configured to act as a leaf spring when folded over the body to provide electrical ground to the electronic device. The electronic device may further include: a modular component comprising a processor and an attachment feature, wherein the frame further defines a space configured to receive the modular component. A cleat including an aperture, and an attachment member sized to extend at least partially through the aperture of the cleat and configurable to engage with an attachment feature of the modular component to retain the modular component in the space.

The case may define a recess in a top surface thereof, and may further include a handle attached to the case in the recess, the handle being movable between a first stable position in which the handle is substantially fully disposed within the recess and substantially below the top surface of the case, and a second stable position in which the handle extends away from the top surface of the case and is configured to be grasped by a user. The handle is rotatable relative to the case in a second stable position, wherein rotating the handle disengages the case from the frame to allow a user to slidably remove the case therefrom. The frame may define a slot including a first slot end and a second slot end positioned higher than the first slot end, and the handle is connected to a pin configured to engage the slot, wherein rotating the handle in a second stable position moves the pin from the first slot end to the second slot end such that the casing moves relative to the frame a distance corresponding to a height difference between the first slot end and the second slot end. The case may further include an input component positioned on a top surface of the case and connected to an electrical contact attached to the case, wherein the electrical contact is configured to engage with a corresponding electrical contact attached to the frame such that an input detected by the input component at least partially determines whether the power supply unit provides power to the one or more electronic components. The case may also include an indicator positioned at a top surface thereof, the indicator configured to provide a visible indication of whether the power supply unit is providing power to the one or more electronic components. The frame may include one or more perforated plates disposed substantially adjacent to one or more components of the electronic device and the power supply, wherein the casing cooperates with the one or more perforated plates to define an exterior surface of the electronic device, and the one or more perforated plates allow airflow into the interior volume. The electronic device may also include one or more casters attached to the frame and configured to physically support the electronic device, the one or more casters each including a ball bearing assembly and defining a bore through a central portion thereof. The electronic device may include four casters attached to a bottom portion of the frame. The frame may comprise a substantially hollow tubular portion extending substantially the entire height of the frame, the hollow tubular portion comprising an aperture in a side wall thereof. The retaining member may be disposed within the hollow tubular portion and attached thereto. The attachment member may be retained in the hollow tubular portion by a retaining component. The securing member is accessible through the aperture and is configurable to extend out of the hollow tubular member through an end portion thereof to be received by and engaged with a corresponding attachment feature of a component disposed substantially adjacent the hollow tubular member.

According to some other aspects of the present disclosure, an electronic device may include a processor, a backplate located below the processor and defining a backplate aperture, a lifter defining a lifter aperture, the lifter disposed on the backplate and positioned substantially adjacent to an edge of the processor such that the lifter aperture is aligned with the backplate aperture. The riser may also define an attachment feature configured to receive the attachment member. The spring may be located below the backplate and may be aligned with the backplate aperture. The spring may be coupled to the back plate and the lifter by a retaining member passing through the spring, the back plate aperture, and the first lifter aperture. The heat sink assembly may cover the processor and may include an attachment member, the heat sink assembly being coupled to the riser by the attachment member engaging the attachment feature. The back plate, the first riser, and the second riser may exert a force of at least about 400N on the processor through the heat sink assembly.

In some examples, the back plate may further define a second aperture and may further include a second lifter defining a second lifter aperture, which may be disposed on the back plate and may be positioned substantially adjacent an edge of the disposer opposite the first lifter such that the second lifter aperture is aligned with the second aperture. The lifter may also define a second attachment feature configured to receive a second attachment member and a second spring located below the back plate and aligned with the second aperture. The second spring may be coupled to the back plate and the second riser by a second retaining member that passes through the second spring, the second aperture, and the second riser aperture, wherein the heat sink assembly is coupled to the second riser by a second attachment member that engages the second attachment feature.

According to some aspects of the disclosure, an electronic device may include: a frame configured to receive and support one or more electronic components; and a housing defining an interior volume and sized to surround the frame and the one or more electronic components, wherein the case is slidably removable from the frame. The electronic component may be positioned within the interior volume and may include an aperture. A sealing member including a sealing body may at least partially surround the electronic component. The seal member may include a compressible lip extending from the seal body, wherein the lip may be oriented relative to the seal body such that the housing compresses the lip in a direction against the seal body at a first location adjacent the electronic component and in a direction against the seal body at a second location adjacent the electronic component opposite the first location. Further, the electronic component and the sealing member may divide the interior volume into a first region and a second region that are fluidly isolated except at the aperture.

In some examples, the sealing body may include a top portion located above the electronic component, a bottom portion located below the electronic component, and two side portions connecting the top portion to the bottom portion to define the aperture. The lip may extend from the seal body along substantially the entire top portion and the entire bottom portion such that the lip is compressible against the seal body in the same direction along the top portion and the bottom portion. The electronic component may include a main logic board having a first surface including a processor disposed thereon and a second surface opposite the first surface including a memory component disposed thereon. A cover may be included on the electronic component, the cover being movable between a closed position covering and substantially surrounding the reservoir component and an open position exposing the reservoir component. The latch portion may be coupled to the cover and movable between a first position and a second position. The latch may be configured to secure and retain the cover in the closed position when in the first position and include a visible marking for indicating that the cover is in the open position, wherein moving the latch to the second position allows the cover to move to the open position. The latch portion may include a spring configured to force the cover into the open position when the latch portion is moved to the second position. The cover may be configured to direct airflow into the interior volume over the reservoir component.

Drawings

The present disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like structural elements, and in which:

FIG. 1 illustrates a perspective system diagram of a computing system including an electronic device.

Fig. 2 shows a front perspective view of the electronic device.

Fig. 3 shows a rear perspective view of the electronic device of fig. 2.

Fig. 4 shows a front perspective view of the electronic device.

Fig. 5A shows a partially exploded front perspective view of components of an electronic device.

Fig. 5B shows a partially exploded rear perspective view of components of the electronic device.

Fig. 6A shows a close-up view of a portion of an electronic device.

Fig. 6B shows a top view of a portion of an electronic device.

Fig. 7A shows a perspective view of components of an electronic device.

Fig. 7B illustrates a perspective view of components of the electronic device of fig. 7A in an alternative configuration.

Fig. 8A shows an exploded view of various components of the electronic device.

Fig. 8B shows a top view of a component of an electronic device.

Fig. 9A shows a cross-sectional front view of a component of an electronic device.

Fig. 9B shows a cross-sectional side view of the component of fig. 9.

Fig. 10A shows a perspective view of a portion of the structure of the component of fig. 9.

Fig. 10B shows a top view of this portion of the structure.

Fig. 10C shows a back view of the portion of the structure of fig. 10B.

Fig. 10D shows a front view of the portion of the structure of fig. 10B.

Fig. 10E shows a cross-sectional view of the portion of the structure of fig. 10B.

Fig. 10F shows a perspective view of the spherical recess of the structure of fig. 10B.

Fig. 11A shows a cross-sectional view of a component of an electronic device.

Fig. 11B shows an exploded view of components of the electronic device.

Fig. 11C shows a front perspective view of components of the electronic device.

Fig. 11D shows a rear perspective view of components of the electronic device.

Fig. 12 illustrates a perspective front view of the interior of an electronic device.

Fig. 13A shows an exploded cross-sectional view of a portion of an electronic device.

Fig. 13B shows a cross-sectional perspective view of a component of an electronic device.

Fig. 13C shows a cross-sectional side view of a component of an electronic device.

Fig. 14 illustrates a perspective rear view of the interior of the electronic device of fig. 12.

Fig. 15 shows a perspective rear view of the interior of the electronic device of fig. 12 including components in an alternative configuration.

Fig. 16 shows an exploded view of the interior of the electronic device of fig. 12.

17A-C illustrate various views of components of an electronic device.

Fig. 18 shows a side perspective view of a component of an electronic device.

Fig. 19 shows a side perspective view of the component of fig. 18.

Fig. 20 shows a partially exploded perspective view of the electronic device.

Fig. 21 shows a cross-sectional view of the component of fig. 20.

Fig. 22 shows a perspective view of components of an electronic device.

Fig. 23A-B show top views of the component of fig. 22 in various configurations.

Fig. 24 shows an exploded cross-sectional view of components of an electronic device.

Fig. 25 shows a cross-sectional perspective view of the component of fig. 24.

Fig. 26 shows a perspective view of components of an electronic device.

Fig. 27 shows a side view of the component of fig. 26.

Fig. 28 shows a top view of the component of fig. 26.

Detailed Description

This description provides examples, and does not limit the scope, applicability, or configuration set forth in the claims. It is therefore to be understood that changes may be made in the function and arrangement of the elements discussed and that other processes or components may be omitted, substituted or added as appropriate to the various embodiments without departing from the spirit and scope of the disclosure. For example, the described methods may be performed in an order different than that described, and various steps may be added, omitted, or combined. Additionally, in other embodiments, features described with respect to some embodiments may be combined.

One aspect of the present disclosure relates to an electronic device that includes a frame configured to receive and attach removable electronic components thereto. The electronic device may also include a housing defining an interior volume sized to enclose the frame and the electronic components. The housing may be removably attached to the frame and may cooperate with portions of the frame to define an exterior surface of the electronic device. An electronic component, such as a logic board, positioned within the interior volume may divide the interior volume into one or more regions and may substantially fluidly isolate the first region and the second region, except at one or more apertures defined by the component through which the regions may be in fluid communication. The electronic equipment may include a first air moving device, such as one or more fans, that generates a positive pressure in the first zone and a second air moving device, such as a blower, that generates a negative pressure in the second zone. The electronic device may also include a number of additional features and components that may allow for a desired level of device performance, allow for a desired level of accessibility and modularity of device components, and may provide a desired electronic device user experience.

In some examples, the components of the electronic device and their arrangement may allow for a desired user experience with respect to various features of the electronic device. In some examples, a user may interact with an electronic device in a number of ways, including physically interacting with various components of the electronic device in order to perform certain tasks with the device. For example, in some examples, a user may add, remove, or replace one or more components of a device to provide a desired level of performance for the device, to allow the device to perform certain tasks, enable certain features, or customize the device as desired. In some examples, the components of the electronic device and their arrangement may enable a user to add, remove or replace components in a relatively simple manner, which reduces the risk of erroneously adding, removing or replacing components, and at the same time allows the user or a technician a high degree of access to the components.

Conventional electronic equipment, such as computer towers, include an enclosure that typically only allows a user to access a single side of the equipment after the enclosure is removed. In one example, the housing of the present exemplary electronic device can be removed from the frame by unlocking the housing and sliding it off the frame, as described herein. Once the housing has been removed, the user may access areas or volumes on, for example, the left and right sides of the device. Further, components within the interior volume of the device that may be exposed when the housing is removed or disengaged from the frame may include features that are easily removed, added, and/or replaced. For example, the frame may include attachment features that allow a user to easily slide a component into a space defined by the frame, and then the attachment features may engage with the component to secure it to the frame without requiring extensive or awkward attachment hardware. Such an increased level of access to components within the interior volume of the device, as defined at least in part by the housing, may allow a user to easily configure the electronic device as desired.

In some examples, the location of one or more components relative to other components of the device, as well as the device itself, may allow for a desired level of performance and a desired user experience. In some examples, an electronic device may include a housing defining a cavity in a top surface of the electronic device and one or more antennas disposed in the cavity. In some examples, the antennas may be Wi-Fi antennas, bluetooth antennas, cellular antennas, and similar wireless signal antennas. The cavity may be positioned at a location on a top surface of the device configured to provide a high level of performance in the transmission and reception of wireless signals. Additionally, the antenna may be located under other functional features on the top surface of the device, such as a handle, to prevent the user from accidentally blocking portions of the antenna without the need for additional hardware. In this way, the performance of the device may reach a desired level based on the component orientation and geometry and the ability to perform a variety of desired functions with certain components.

Components and their placement in the interior volume of a typical electronic device may create airflow dead spots in the interior volume. That is, there may be locations in the interior volume where the airflow is insufficient to adequately remove heat from the device. These dead spots may be caused by the spatial arrangement of components within the electronic device or by eliminating interference between air flows from competing fans. Thus, these dead spots may require additional or more powerful fans to be incorporated into the device to achieve the desired level of performance. However, the use of additional or more powerful fans may increase the noise generated by the electronic device, or may require more space to accommodate the fans, undesirably increasing the overall size of the electronic device. Another way to traditionally enhance airflow and heat dissipation in electronic devices is to provide more space within the interior volume to allow air to flow between components that require cooling. However, adding space in the interior volume to allow air to circulate may also undesirably increase the overall volume of the electronic device.

Accordingly, it is desirable to design and arrange the components of an electronic device to create an airflow channel that can effectively remove or redistribute heat in the electronic device without requiring a significant increase in the internal volume of the electronic device or the need to provide a high power and noisy air moving system, such as by including an undesirably large number of fans. In some examples, a housing or shell of an electronic device may include features that provide a desired level of airflow and achieve a desired level of thermal management. For example, the housing may define a plurality of perforations or holes on one or more surfaces to allow airflow therethrough. Further, the holes may be arranged and the housing may have a shape or geometry that defines the holes such that a large amount of air may pass through the housing without generating a high level of noise. Furthermore, the aperture defined by the housing may have a large surface area compared to the direct and unconnected through-holes. This larger surface area can be used to greatly enhance the ability of the electronic device to transfer heat away from itself or from other components, such as by direct convection with the surrounding air.

The electronic device may also include components that cooperate with the housing to provide a desired level of electromagnetic shielding while still maintaining a desired level of airflow and thermal management. For example, the electronic device may include a sheet or panel defining a second set of holes that cooperate with the holes or perforations of the housing to act as electromagnetic interference (EMI) and/or electromagnetic compatibility (EMC) noise shields for other components of the electronic device.

Users of electronic devices, such as desktop computers, often attempt to replace one or more internal components of the computer. For example, if advances in technology resulted in the creation of more powerful Graphics Processing Units (GPUs), users may attempt to replace existing GPUs in their electronic devices with more powerful GPUs. It may be desirable that components of the electronic device be easily accessible and replaceable by a user or technician. Thus, the arrangement and design of components of the electronic device, such as the housing, may provide a user with access to one or more components of the electronic device in addition to the desired airflow and heat dissipation features described herein.

Conventional desktop computers typically provide access to only the internal components on one side of the device. Thus, conventional components are arranged within a desktop computer such that they can be accessed and removed from a single side of the device. However, such arrangements may not be compatible with space-saving component arrangements that generate a desired amount of airflow through or within the electronic device. Such tension between accessibility and thermal management may again lead to dead spots and require larger housings or an undesirably large number of fans, increasing the size of the device or causing the device to generate a high level of noise during operation.

In some examples, the components and methods for forming and assembling the components described herein may be used to provide an electronic device that utilizes multiple isolated volumes or regions that may cooperate to produce a desired level of thermal management without requiring an extremely powerful or large air moving system, while still providing access to the components for a user or technician of the electronic device.

Further, the components of the electronic device may be formed and arranged to allow high configurability, modularity, and accessibility, while minimizing the overall volume and size of the electronic device. In some examples, multiple areas of electronic equipment may be isolated by seals, but may communicate at selected locations to effectively control and direct the airflow provided by the air moving system. For example, one region may have a positive air pressure relative to the ambient environment, while another region may have a negative air pressure relative to the ambient environment. The pressure in each zone may be controlled by an air movement system to provide air flow into, out of, and between the zones to achieve a desired level of thermal management of the electronic device components.

Fig. 1 illustrates a computing system including an electronic device 100. The electronic device 100 shown in fig. 1 is a computer, such as a desktop computer, and may be connected to a display or monitor 110. However, this is merely one representative example of devices that may be used in connection with the concepts disclosed herein. For example, the electronic device 100 may correspond to a portable media player, a media storage device, a portable digital assistant ("PDA"), a tablet, a display, a mobile communication device, a GPS unit, a remote control device, and similar electronic devices. The electronic device 100 may be referred to as an electronic device or a consumer device. As shown, the electronic device 100 may also be connected to any number of input devices, such as a keyboard 120, a mouse 130, a touch pad, a stylus, a microphone, or any combination of known input devices. More details of the electronic device 100 are illustrated in fig. 2.

FIG. 2 illustrates an electronic device 200, such as used in the computing system shown in FIG. 1. The electronic device 200 may be connected to a display and one or more input devices. The electronic device 200 is configured for placement above, below, or near a work surface, such as a table or desk. In some examples, the electronic device 200 of the computing system may be referred to as a desktop computer. Electronic device 200 may include a plurality of internal electronic components including at least a Central Processing Unit (CPU), which in some examples resides on one or more logic boards, such as a main logic board, one or more Graphics Processing Unit (GPU) boards, and other primary and secondary internal components. The electronic device 200 may also include a housing 201 that may define an interior volume of the electronic device 200 and may at least partially define an exterior surface of the electronic device 200. Although the housing 201 of the electronic device 200 is illustrated as having a generally rectangular shape, in some examples, the electronic device 200 and the housing 201 may assume substantially any shape as desired. In some embodiments, the electronic device may also be coupled to other electronic devices to form a multi-computer system that may be used, for example, as a server computer system (such as in a data farm) or as a network computing system with each electronic device 200 as a node (or nodes).

In some examples, the electronic device 200 may include a housing 201 that may define an interior volume in which internal components of the electronic device are disposed. The housing 201 is easily removable for access or maintenance by a user. The housing 201 may comprise a metallic material, such as stainless steel or aluminum. In some examples, the housing 201 may have an anodized aluminum oxide layer that both protects the housing 201 and facilitates heat transfer to cool the interior volume. In some examples where the housing 201 comprises a metal, such as aluminum, the conductivity of the housing 201 may provide a ground for internal electronic components arranged to fit and operate within the housing 201. The housing 201 may also provide electromagnetic interference (EMI) shielding to protect sensitive electronic components from external electromagnetic energy and to reduce the amount of electromagnetic energy emitted by internal components within the electronic device from penetrating the housing 201, thereby providing a desired level of electromagnetic compatibility (EMC).

The housing 201 may include a mechanism 214, such as a mechanical latch, that may be used to securely couple the housing 201 of the electronic device 200 to internal structures of the electronic device 200, as further described herein. The mechanism 214 may take the form of a twist latch or other such operable mechanism that may be manually engaged and disengaged, for example, by a user or technician. In this way, the housing 201 may be easily removed to expose the internal components and structures of the electronic device 200 for user maintenance, upgrades, or repairs by a technician. In some examples, detection circuitry (not shown) of the electronic device 200 may be used to detect whether the housing 201 is properly positioned in place relative to the internal components and structures. This detection circuit may serve a useful role because the thermal management strategy of the electronic device 200 may rely on the proper placement and use of the housing 201, in conjunction with the placement of internal components and the air movement system within the interior volume defined by the housing 201.

In some examples, the detection circuitry may determine that the housing 201 is not properly positioned or aligned relative to internal structures or components of the electronic device 200, and the detection circuitry may prevent the electronic device 200 from operating, or at least from operating at full capacity. In some examples, the detection circuit may include a magnetic sensor (such as a hall effect device) positioned to detect one or more magnets disposed on the housing 201 when the external housing 201 is properly placed and aligned on the electronic device 200. The housing 201 may also include one or more features, such as a handle 212, that may allow a user or technician to manipulate or transport the electronic device 200.

The housing 201 may also include one or more support features 216, for example in the form of feet or wheels. The support features 216 may be used to provide physical support to the electronic device 200 when it is resting on a surface, and may also prevent the large surface of the housing 201 from directly contacting the surface on which it is located. As such, the support features 216 may provide space between the housing 201 and the surface to allow air to flow therethrough, thereby facilitating thermal management of the electronic device 200.

A plurality of holes, apertures, perforations, or channels 210 may be formed in the front surface of the housing 201 that may provide fluid communication between the ambient environment and the interior volume defined by the housing 201. The aperture 210 may be substantially any shape, but in some examples, may be circular or spherical, as described herein. In some examples, the aperture 210 may allow direct fluid communication between the ambient environment and the interior volume. However, in some examples, the aperture 210 may allow fluid communication between the ambient environment and the interior volume through one or more components, such as an air moving device or system, as described herein.

In some examples, the holes or voids 210 may be in the form of three-dimensional structures that may include spherical recesses that interfere or intersect with each other to create through-holes 210 arranged in a specified pattern. The spherical recesses may have a base form of three spherical recesses that at least partially intersect or interfere in a common plane, and a fourth spherical recess that intersects or interferes with each of the three spherical recesses on adjacent planes to create a network of interconnected vias 210. This base form can then be propagated or repeated throughout the structure to form an aggregated three-dimensional structure. For example, where the housing 201 includes such a three-dimensional structure, the structure may maximize the surface area and distribution of pores 210 for heat transfer while maintaining a robust structural lattice. That is, the housing 201 including the interconnect vias 210 may optimize its ability to dissipate or remove heat from the electronic device 200 while remaining lightweight and rugged, thereby improving the performance of the electronic device 200 as compared to conventional unitary or closed continuous structures.

In some examples, the one or more three-dimensional structures defining the aperture 210 may be included as a portion or a region of a housing or shell, such as a portion of a housing or shell defining a first exterior surface and a second interior surface. In some examples, the portion of the housing may be a unitary body, such as a unitary body formed from a single piece, section, or portion of material. The first and second surfaces of the body may be opposing surfaces. At least a portion of the housing may include a three-dimensional pattern or matrix of apertures or channels therein. In some embodiments, the three-dimensional pattern may extend through at least a portion or an area of the housing or substantially throughout the entire housing. The three-dimensional pattern may extend across one or more of the entire height, width and depth of the housing or a portion thereof. The three-dimensional pattern or matrix may be formed or defined by a combination of one or more cavities extending into the housing from the first surface and one or more cavities extending into the housing from the second surface of the housing.

In some examples, one or more cavities extending into the housing from the first surface may intersect with one or more cavities extending into the housing from the second surface to form a three-dimensional pattern or matrix. That is, in some examples, a negative space extending from a first surface of the housing to a cavity in the housing may intersect or interfere with a negative space extending from a second surface of the housing to one or more cavities in the housing. Additionally, in some embodiments, the cavities may intersect, merge, or interfere eccentrically to form the aperture 210. The one or more apertures 210 may be through holes in the housing. As used herein, the term "aperture" may refer to a hole in the body that passes completely through the body. In some embodiments, the surface area of the three-dimensional pattern of apertures 210 as described herein can be at most two times, at most five times, at most ten times, or even several orders of magnitude greater than the surface area of a similarly sized and shaped housing that does not include the three-dimensional pattern of apertures 210. This larger surface area can be used to greatly enhance the ability of the enclosure to transfer thermal energy or heat away from itself or from other components of the electronic device, for example, by direct convection with the surrounding air. In some examples, cavities extending into the housing from a surface of the housing may be arranged in a pattern. Such a pattern may be a regular or repeating pattern of cavities that extends over a portion of the entire surface, or in some examples, over substantially the entire surface of the housing.

In some examples, the housing or case 201 may include input components disposed on an outer surface thereof that are operable by a user to at least partially control the power state of the electronic device 200. For example, the housing 201 may include an input component 225 that may receive input from a user and may determine, at least in part, whether the power supply unit provides power to one or more electronic components of the electronic device 200. Thus, in some examples, input component 225 may function as an on/off switch or control for electronic device 200. In some examples, input component 225 may take the form of buttons, switches, touch sensors, and/or combinations thereof. Further, in some examples, the input component 225 may be disposed on the housing 201 at a location that facilitates user operation, such as a top surface of the housing 201. In some examples, input component 225 accepts user touches to initiate power-up sequences (including, for example, a boot process) as well as power-down sequences. In some examples, the input component 225 may be illuminated and provide an activity indication to the user, for example, under software control of a processing unit in the electronic device 200.

The housing 201 may also include one or more ports 223 disposed on the housing 201 at locations that are easily and quickly accessible to a user. In some examples, one or more ports 223 may be configured to receive and connect or interface with a cable or additional electronic device, or may facilitate the transfer of power or signals to or from electronic device 200. Although the electronic device 200 may include multiple ports at various locations, as described herein, one or more ports 223 may be disposed on a top surface of the housing 201, for example, to maximize ease of use and user access. In some examples, the ports 223 may include universal serial bus type (USB) ports and Thunderbolt ports.

The electronic device 200 may also include one or more visual indicators 221 integrated into the housing 201 and positioned on the housing at locations that are easily visible to a user. For example, the visual indicator 221 may be positioned on a top surface of the housing 201. In some examples, the visual indicator 221 may be positioned substantially adjacent or proximate to the input component 225 of the electronic device 200. In some examples, the visual indicator 221 may provide a visible indication of whether power is being provided to one or more components of the electronic device 200. In other words, the visual indicator 221 may provide a visible indication of whether the electronic device 200 is in an "on" state or an "off" state. In some examples, visual indicator 221 may provide a visual indication of other states of electronic device 200, such as whether electronic device 200 is performing certain processes, receiving transmitted data, and/or experiencing errors. The visual indicator 221 may include one or more lights (such as LED lights) and may provide a visual indicia by illuminating the one or more lights or by illuminating a light of a certain color. For example, a green LED may be illuminated to indicate an "on" state, and a red LED may be illuminated to indicate an "off" state. In some examples, the visual indicator 221 may be illuminated and provide an activity indication to the user, for example, under software control of a processing unit in the electronic device 200.

In some examples, the housing 201 of the electronic device 200 may define one or more recesses or cavities in a surface thereof configured to receive one or more antenna components. For example, the top surface of the housing 201 may include a cavity and may include an antenna component 226 disposed in the cavity and connected to one or more other components of the electronic device 200. The housing 201 may include a second cavity and a second antenna component 228 disposed at a second different location on the housing 201. As further described herein, in some examples, the insert may be sized to correspond to the cavity and/or the

antenna component

226, 228, and may cover, underlie, and/or surround the

antenna component

226, 228 to provide a surface that is substantially flush or aligned with a surface (e.g., a top surface) of the housing 201 while being substantially transparent to the electromagnetic spectrum in the frequencies utilized by the

antenna component

226, 228, yet providing a desired appearance. Further, in some examples, an antenna component (e.g., antenna component 226) may be disposed on the housing 201 at a location that may prevent or impede shadowing or partial shadowing and subsequent performance degradation thereof due to a user resting an object on the top surface of the electronic device 200. For example, the

antenna components

226, 228 may be disposed below the handle 212 of the electronic device 200. Additional views of the electronic device are described in detail below with reference to FIG. 3.

As shown in fig. 3, in some examples, the housing 201 of the electronic device 200 may include an interface panel 220 located on a rear surface of the housing 201. The interface panel 220 may include various ports 222 that may be used to transfer data and/or power between the electronic device 200 and various external systems. For example, the interface panel 220 may include a set of audio ports that may be used to provide audio streams to an external audio system, such as headphones, speakers, or an audio processor. The set of audio ports may also be used to receive audio streams from an external audio system such as a microphone or audio recording device. The interface panel 220 may also include one or more ports including one or more bus ports, one or more high speed expansion ports, one or more networking ports, and/or one or more video ports. The data port may be used to transfer data and/or power between one or more external circuits and the electronic device 200. The data ports may be used to accommodate a wide range of data connections according to different wired data communication protocols, such as one or more Universal Serial Bus (USB) ports, one or more Thunderbolt high speed expansion ports, one or more ethernet networking ports, one or more High Definition Media Interface (HDMI) ports, and/or other data ports.

Electronic device 200 may be interconnected to other computing systems (e.g., to a data storage device, a portable media player, and/or a video device) through one or more data ports provided on interface panel 220 to form a computing system network. Thus, the interface panel 220 and associated data ports of the electronic device 200 may be used to form connections from the electronic device 200 to a large number and variety of external computing systems and circuits, which may prove particularly useful when a large amount of computing resources are required. Moreover, in some representative embodiments and applications, the size and shape of the electronic device 200 may lend itself to space-efficient computing networks or data fields.

The interface panel 220 may also include a video port that may be used to transmit high-speed video between the electronic device 200 and an external video monitor or other external video processing circuitry, for example, as shown in FIG. 1. The interface panel 220 may include an Alternating Current (AC) power input port 224 that may be sized and shaped to receive a power plug adapted to transmit external power to the operable electronic components within the housing 201, for example, through a power supply unit as described herein. In some examples, the electronic device 200 may include an internal power resource (such as a battery) that may be charged and recharged according to the power transferred through the power input port 224.

The housing 201 may also include or define a plurality of holes, apertures, perforations, or channels 211 formed on a rear surface of the housing 201. The aperture 211 may be substantially similar to the aperture 210 described with respect to fig. 2, and may provide fluid communication between the ambient environment and the interior volume defined by the housing 201. The aperture 211 may be substantially any shape, but in some examples, may be circular or spherical, as described herein. In some examples, the aperture 211 may allow direct fluid communication between the ambient environment and the internal volume. However, in some examples, the aperture 211 may allow fluid communication between the ambient environment and the interior volume through one or more components (such as an air moving device or system), as described herein.

In some examples, the electronic device may include a cable retention or cable management component 230. The cable retention component 230 is engageable with a portion of the housing 201, such as a recess or slot, and is removable from the housing 201 by a user. As further described herein, in some examples, the cable retention component 230 may be secured by a magnet of the housing 201 that is disposed adjacent to an area where the cable retention component 230 is to be positioned. The cable retention component 230 may at least partially define an aperture and, when attached to the housing 201, may cooperate therewith to define an aperture sized to allow passage of one or more cables therethrough. In some examples, where one or more cables may be connected to the ports 222 of the interface panel 220, the cables may pass through apertures defined by the cable retention component 230 and the housing 201. Additionally, in some examples, the holes may be disposed substantially perpendicular to the direction of insertion of the cable connector into the port 222. Thus, in some examples, the aperture defined by the cable retention component 230 and the housing 201 can retain a cable passing therethrough at an angle of at least about 5 °, 10 °, 15 °, 20 °, or 30 ° or more relative to the connector when the connector is engaged with the port 222. By maintaining such cable orientations, the cable retention component 230 may prevent or inhibit accidental removal of one or more cables if the user moves the electronic device 200. The angle of the cable relative to the connector and port 222 may, for example, ensure that a desired amount of force, e.g., a force greater than about 100N, is required to remove the cable when the cable retention member 230 is attached to the housing. Additional examples or configurations of the electronic device 200 are provided below with reference to fig. 4.

Turning now to fig. 4, as described herein, in some examples, the electronic device 200 may include one or more support features 216 that may be used to provide physical support to the electronic device 200 when it is resting on a surface, and may also prevent the large surface of the housing 201 from directly contacting the surface on which it is located. While the support features 216 may include feet as described herein, in some other examples, the support features 216 may include wheels or casters, as shown in fig. 4. In some examples, the electronic device 200 may include four casters, each positioned generally at a corner area of the floor of the housing 201. In some examples, the casters 216 may allow a user to easily roll the electronic device 200 as desired. In some examples, the caster wheels 216 may include wheels and ball bearings that allow the wheels to rotate. Further, in some examples, a central portion of the caster 216, such as the shaft, may be substantially hollow or have a hole therethrough. Additional embodiments of the structure and arrangement of an electronic device including a housing defining an interior volume divided into one or more regions by one or more components in the interior volume are described below with reference to fig. 5A-B.

Fig. 5A shows a partially exploded perspective view of an electronic device 400 including a housing component 401 separate from a frame or chassis component 440. Electronic device 400 may be, for example, a desktop computer, and may be substantially similar to and include any of the features of

electronic devices

100 and 200 described herein. The housing of the electronic device 400 may be substantially similar to the housing 201 described herein, which may define the interior volume and exterior surfaces of the electronic device 400.

As can be seen in fig. 5A, the enclosure may include a housing 401 that may define an interior volume sized to enclose portions of the frame 440 and the electronic components received and supported by the frame 440, as described herein. The shell 401 may be coupled with the frame 440 to define an outer surface of the enclosure. In some examples, as shown in fig. 5A, housing 401 may be removed entirely from frame 440, e.g., by a user. In some examples, housing 401 may be coupled to frame 440 by a locking mechanism, which may have a locked state and an unlocked state. In the locked state, as shown for example in fig. 2-3, the housing 401 is retained on the frame 440, and when in the unlocked state, the housing 401 may be removed from the frame as desired, for example by a user lifting or sliding the housing 401 from the frame 440.

The housing 401 may include a top panel 402 that may at least partially define an exterior surface of the enclosure (e.g., a top surface thereof). In some examples, the top panel 402 may include or define one or more apertures 403 through which a portion of the frame 440 may be allowed to extend. For example, the frame 440 may include one or more handles 409 that may pass through the holes 403 of the top panel 402 and may be exposed to the external environment. The housing 401 may also include a plurality of panels coupled or attached to and extending from the top panel 402, e.g., extending from and perpendicular to the top panel 402. The housing 401 may include a first or front panel 404 that may be substantially the entire height of the electronic device 400. In some examples, the front panel 404 may define a plurality of holes, apertures, perforations, or channels 410 extending therethrough and may provide fluid communication between the ambient environment and the interior volume defined by the housing 401. In some examples, the aperture 410 may be substantially similar to the aperture 210 described herein.

In some examples, the housing 401 may also include a mesh or perforated member 408 that may be coupled to or disposed substantially adjacent to a surface of the front panel 404. Mesh 408 at least partially defines an interior volume. In some examples, mesh 408 may substantially cover holes 410 such that any fluid (such as air) passing through holes 410 must also pass through mesh 408. The mesh may include holes or perforations of substantially any size, shape or distribution.

Fig. 5B shows a partially exploded rear perspective view of the electronic device 400 including the housing 401 separated from the frame 440. As can be seen, the frame 440 may include a port panel or interface panel 442, which may include one or more ports and may be substantially similar to the interface panel 220. The frame 440 may also include a floor panel or bottom panel 444 that may at least partially define the interior volume of the device as well as the exterior surfaces of the device. When the housing 401 is positioned on the frame 440, the housing may be peripherally engaged with the bottom panel 444, for example, to at least partially define the exterior surface and interior volume of the device. The interface panel 442 may be coupled to the bottom panel 444 and disposed substantially perpendicular to the bottom panel, and may further define an exterior surface and an interior volume of the electronic device 400.

The housing 401 may include a second or back panel 405 that may be substantially the entire height of the electronic device 400. In some examples, the back panel 405 may define a plurality of holes, apertures, perforations, or channels 411 extending therethrough and that may provide fluid communication between the ambient environment and the interior volume defined by the housing 401. In some examples, the aperture 411 may be substantially similar to the aperture 210 described herein. The back panel 405 may also define an engagement or mating slot 406 that may be sized to receive and engage or mate with the perimeter of the interface panel 442. Thus, the housing 401 and the interface panel 442 and the bottom panel 444 of the frame 440 may cooperate to define an exterior surface and an interior volume of the electronic device 400.

In some examples, the housing 401 may further include a mesh or perforated member 409 that may be coupled to or disposed substantially adjacent to a surface of the back panel 405 that at least partially defines the interior volume. In some examples, the mesh may substantially cover the holes 411 such that any fluid (such as air) passing through the holes 411 must also pass through the mesh 409. Mesh 409 may include holes or perforations of substantially any size, shape, or distribution. As can be seen, in some examples, the front panel 404 and the back panel 405 of the housing 401 may be connected or coupled to the side panels 407 which together form the unitary removable housing 401 with the top panel 402. Further details of the electronic device 400 and the housing 401 are provided below with reference to fig. 6.

Fig. 6A shows a close-up view of a portion of the electronic device 400 including the top surface of the housing 401. In some examples, the housing 401 may be substantially similar to the housing 201, and may include some or all of the features described with respect to fig. 2 and 3, and may define the aperture 450, and may include a mesh plate 470 similar to the

mesh plates

408, 409 described herein.

In some examples, the housing or case 401 may include input components 465 disposed on an outer surface thereof that are operable by a user to at least partially control a power state of the electronic device 400. The housing 401 may also include one or more ports 463 disposed on the housing 401 at locations that are easily and quickly accessible to a user. In some examples, ports 463 may include a universal serial bus type port and a Thunderbolt port. The electronic device 400 may also include one or more visual indicators 461 integrated into the housing 401 and positioned on the housing at locations that are easily visible to a user. In some examples, the visual indicator 461 may be illuminated and provide an activity indication to the user, for example, under software control of a processing unit in the electronic device 400.

As shown in fig. 6B and as further described herein, in some examples, the housing 401 of the electronic device 400 may define one or more recesses or cavities 467 in a surface thereof that are configured to receive one or more antenna components 466 (also referred to as antenna components 466). For example, the top surface of housing 401 may include one or more cavities 467, and may include an antenna assembly 466 disposed in each cavity 467 and connected to one or more other components of electronic device 400. In some examples, the antenna assembly 446 may be disposed below the handle 452 of the electronic device 400. In some examples, multiple antenna assemblies 466 may be disposed in the cavity 467, e.g., two, three, four, or more antenna assemblies 466 may be disposed in each cavity 467 of the housing 401. In some examples, the antenna assemblies 466 may be disposed substantially adjacent to one another in the cavity 467, e.g., with a first antenna assembly disposed in a first half of the cavity 467 and a second antenna assembly disposed in a second half of the cavity 467. In some examples where the antenna assembly 466 includes two antennas, the antennas may be aligned in the cavity 467 relative to each other such that the fields produced by the antennas are perpendicular and adjacent antennas do not receive each other's signals. In these examples, the cavity 467 may eliminate physical or separation walls between portions or halves of the cavity housing each antenna. In some examples, antenna assembly 466 may include a Wi-Fi antenna, a bluetooth antenna, a cellular antenna, or a combination or complex number thereof. In some examples, cavity 467 can include an antenna assembly 466 that includes two or more different types of antennas, such as a bluetooth antenna and a Wi-Fi antenna. In some examples, the cavity 467 can have a shape that can create a resonant mode for one or more of the antennas in the antenna assembly 466.

The housing 401 of the electronic device 400 may also include a locking mechanism 454. In some examples, the locking mechanism 454 takes the form of a handle (e.g., a semi-circular handle), although the locking mechanism 454 can be substantially any shape or size. In some examples, the locking mechanism 454 may be a bi-stable locking mechanism including a first stable position and a second, different stable position. In some examples, as shown in fig. 7A-B, the first stable position may be a position in which the handle is disposed substantially horizontally or flush with the top surface of the housing 401. Thus, in some examples, the housing 401 may include a recess sized to receive the locking mechanism 454 such that the locking mechanism 454 is disposed below the level of the top surface of the housing 401.

Further, the first stable position of the locking mechanism 454 may lock the housing 401 to the frame 440, as described herein. Thus, in some examples, for example as shown in fig. 6A and 6B, the first stable position of the locking mechanism 454 may indicate to a user that the locking mechanism is in a locked position and that the housing 401 is secured to the frame 440, as described herein. Further details of the locking mechanism are described below with reference to fig. 7A-B.

Fig. 7A shows a locking mechanism 454, e.g., including a handle 455, in a second of two bi-stable positions. In this second bistable position, handle 455 is positioned vertically or perpendicularly and protrudes from the top surface of housing 401. In some examples, a user may physically move handle 455 from a first bi-stable position to a second bi-stable position shown in fig. 7A. In some examples, the handle 455 of the locking mechanism 454 can be positioned substantially perpendicular to one or more other handles 452 of the housing 401. Although the handle 455 is shown in the second raised position, the locking mechanism 454 may still be in a locked state. While the locking mechanism may still be in a locked state in the configuration shown in fig. 7A, in this second bi-stable position, the locking mechanism may be rotated, for example, by a user to unlock housing 401 from frame 440, as described herein. Further, while not a desirable use, handle 455 is capable of supporting the entire weight of electronic device 400 when in the second bi-stable position, but still in the locked state.

Fig. 7B shows the locking mechanism 454 after having been rotated to achieve an unlocked state, wherein the housing 401 is unlocked from the frame 440 and freely removable, for example by a user, via the handle 455 of the locking mechanism 454. Thus, in some examples, the handle 455 may be positioned substantially parallel to one or more other handles 452 of the housing 401 when the locking mechanism 454 is in the unlocked state. Further, the position of the handle 455 may provide an indication to the user of the locked or unlocked state of the locking mechanism 454. In some examples, twisting or rotating the locking mechanism 454 between the locked and unlocked positions may also move the housing 401 relative to the frame 440, as described herein. For example, when a user rotates the locking mechanism 454 from the locked position to the unlocked position, in addition to unlocking the housing 401 from the frame 440, the housing 401 may also move vertically relative to the frame 440 to break the seal or otherwise initiate removal therefrom. In some examples, such initial movement of housing 401 by rotating the locking mechanism may be used to overcome any initial stiction between housing 401 and frame 440 and/or other components of electronic device 400, allowing housing 401 to be more easily removed from frame 440. Additional features of the locking mechanism 454 and the electronic device 400 will now be described with reference to fig. 8A-B.

Fig. 8A shows an exploded view of the top portion of the electronic device 400, including the locking mechanism 454, the top surface 402 of the housing 401, a portion of the frame 440, and various other components.

As described above with respect to fig. 7A-B, the locking mechanism 454 can include a handle 455 that can be bi-stable in two positions (e.g., a raised position and a lowered position). In some examples, the locking mechanism 454 may include a plunger 457 attached to the handle 455 and drivable to either of two bi-stable positions by a spring 458 (e.g., a coil spring). In some examples, handle 455 may be actuated to a bi-stable position closest to its physical orientation. For example, if a user moves handle 455 to a partially raised position that is substantially near vertical and releases handle 455, spring 458 can drive plunger 457 to move handle 455 to the second raised bi-stable position without further user input.

In some examples, the locking mechanism 454 may be engaged with a retention component 444 secured to the frame 440. The interaction between the locking mechanism 454 and the retention member 444 may be used to retain the housing 401 on the frame 440 or to allow the housing 401 to be removed therefrom. In some examples, the locking mechanism 454 may include one or more protruding articles, such as pins 456 that may extend outward from the locking mechanism 454 to engage features of the retention component 444. For example, the retention component 444 may include a slot, recess, or projection 445 sized to receive and engage the pin 456. The pin 456 may be connected to a rotatable portion of the locking mechanism 454 (e.g., the handle 455) such that rotation of the handle 455 also results in rotation of the pin 456 relative to the retaining member 444. When the desired amount of rotation (e.g., about 90 °) is reached, pin 456 may no longer be positioned in slot 445, and thus may be free to lift vertically and disengage from retaining member 444, thereby allowing housing 401 to be removed from frame 440 as described.

Further, in some examples, slots 445 may be angled or sloped such that rotation of pins 456 relative to slots 445 causes the slots to exert an upward force on pins 456 to lift housing 401 from frame 440 a distance of, for example, about 1mm, about 2mm, about 3mm, or about 5mm or more. In some examples, slot 445 may include a first slot end and a second slot end positioned higher than the first slot end such that rotating handle 455 in a second bi-stable position moves pin 456 from the first slot end to the second slot end such that case 401 moves relative to frame 440 a distance corresponding to a height difference between the first slot end and the second slot end (e.g., about 3 mm). In some examples, the locking mechanism 454 may include three pins 456 and the retention component 444 may include three corresponding slots 445. In some examples, the pins 456 may be evenly distributed around the circumference of the locking mechanism 454.

In some examples, electronic device 400 may include a sensor that may indicate to electronic device 400 (e.g., to a processor of electronic device 400) that housing 401 is locked to frame 440 and in a desired position or that housing 401 has moved relative to frame 440. In some examples, certain features or systems of electronic device 400 may be configured to only function when a sensor detects that housing 401 and frame 440 are in a desired position relative to one another. In some examples, the sensors may include hall effect sensors attached to the frame 440 and magnets at corresponding locations of the housing 401 or the locking mechanism 454. Alternatively, the sensors may be attached to the housing 401 and magnets disposed at corresponding locations on the frame 440.

As described herein, the housing 401 of the electronic device 400 may include an input component 465 attached thereto. In some examples, top surface 402 of housing 401 may include an aperture 403 sized to receive a portion of input component 465 such that a user may access or touch the input component through aperture 403. In some examples, a portion of the input component 465 may at least partially protrude through the aperture 403, but in some other examples, the portion of the input component 465 disposed in the aperture may be substantially flush with the top surface 402 of the housing 401. The input component 465 may also include a body and one or more electrical contacts attached thereto. In some examples, electrical contacts of input component 465 may engage with corresponding electrical contacts attached to frame 440 such that an input detected by input component 465 at least partially determines whether the power supply unit provides power to one or more electronic components of electronic device 400. When the housing 401 is removed from the frame 440, the location of the input member 465 and its securing means on the housing 401 allows the input member 465 to be removed from the frame 440. Accordingly, such removal of input component 465 from frame 440 may prevent a user from opening electronic device 400 when housing 401 is not secured to frame 440 in a desired location.

As shown in fig. 8A and 8B, the electronic device 400 may also include a cavity or recess 467 sized to receive and house the antenna assembly 466 as described herein. Although in some examples, the cavity 467 can be part of the housing 401 or can be attached to the housing, in some other examples, the cavity or recess 467 can be part of the frame 440 or can be attached to the frame. In some examples, the cavity or recess 467 can have substantially any depth as desired. In some examples, the cavity may have a depth of about 9mm or about 10 mm.

The antenna component or antenna assembly 466 may be disposed in the cavity as described herein. In some examples, antenna component 466 may include a dual-band antenna that may transmit and receive signals having frequencies of about 2.4Ghz and about 5 Ghz. The antenna assembly 466 may also include a printed circuit board and/or a processor disposed thereon. In some examples, the antenna component 466 may include multiple antennas, e.g., a first antenna and a second antenna. In some examples, the antennas may be disposed in the cavity 467, e.g., substantially adjacent to each other, with the first antenna disposed in a first half of the cavity 467 and the second antenna disposed in a second half of the cavity 467. In some examples where the antenna assembly 466 includes two antennas, the antennas may be aligned in the cavity 467 relative to each other such that the fields produced by the antennas are perpendicular and adjacent antennas do not receive each other's signals. In these examples, the cavity may have no or no physical or dividing walls between the portions or halves of the cavity housing each antenna. In some examples, the antenna may be a Wi-Fi antenna, a bluetooth antenna, and a cellular antenna. In some examples, the cavity 467 can have a shape that can create a resonant mode for one or more of the antennas in the antenna assembly 466.

The electronic device 400 may also include an insert or cover 468 that may cover the cavity 467 and the antenna assembly 466. In some examples, the insert 468 may be integrated or attached to the housing 401, e.g., the top surface 402. The insert 468 may extend substantially the entire length and width of the cavity 467, and may be a shape that corresponds to the shape of the cavity. However, in some examples, the insert 468 may be greater than the length and/or width of the cavity 467. The insert 468 may include one or more apertures to allow signals received or transmitted by the antenna component 466 to pass therethrough. Further, the insert 468 may include a dust or tamper seal around the perimeter to protect the antenna component 466. In some examples, the seal may comprise a material transparent to electromagnetic radiation having a frequency greater than 2.4GHz, and may be positioned in the cavity 467 or at an edge thereof.

In some examples, the insert 468 may define a first central slot 471 that is aligned with the length of the cavity 467 and is positioned approximately at the midpoint of the width of the first half of the cavity. The first central slot 471 may be configured to allow electromagnetic radiation having a frequency of about 5GHz to pass therethrough. The insert 468 may also define a second central slot 472 aligned with the length of the cavity and positioned approximately at the midpoint of the width of the second half of the cavity. The second central slot 472 may also be configured to allow passage therethrough of electromagnetic radiation having a frequency of about 5 GHz. The insert 468 may define a first pair of edge slots 473 and a second pair of edge slots 474, the first pair of edge slots 473 being aligned with the first central slot 471 and positioned along a perimeter of the insert 468 in a first half of the cavity 467, the first pair of edge slots 473 being configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough, the second pair of edge slots 472 being aligned with the second central slot 472 and positioned along a perimeter of the insert 468 in a second half of the cavity 467, the second pair of edge slots 474 being configured to allow passage of electromagnetic radiation having a frequency of about 2.4GHz therethrough. In some examples, the seal may block all of the grooves of the insert 468.

Additionally, as shown in fig. 8A, the electronic device 400 may include a second cavity having a second antenna assembly disposed therein and a second insert overlying the second cavity and the second antenna assembly. In some examples, the second antenna assembly may be substantially similar to the first antenna assembly 466. However, in some other examples, the second antenna assembly may include one or more antennas that are not present in the antenna assembly 466. For example, the antenna assembly 466 may include two dual-band Wi-Fi antennas and the second antenna assembly may include one dual-band Wi-Fi antenna and one bluetooth antenna. Additional details of the housing are described with reference to fig. 9A and 9B, including the holes or perforations defined by the housing and associated components.

As described with respect to fig. 9A and 9B, the casing 501 of the electronic device may define a plurality of holes or perforations 502 that extend through the casing 501 and may provide fluid communication between the ambient environment and the interior volume defined by the casing 501. In some examples, housing 501 may be substantially similar to

housings

201 and 401 described herein and may include some or all of the features thereof, and aperture 502 may be substantially similar to

apertures

210, 211, 410, and 411 described herein.

As described above, the aperture 502 may be defined by the three-dimensional structure of the housing 501 including spherical recesses having a base pattern of three spherical recesses disposed in a common plane and intersecting or interfering at least partially with each other and a fourth spherical recess intersecting or interfering with each of the three spherical recesses on adjacent planes to form the aperture 502. Referring now to fig. 9, which illustrates a front view of the outer surface of the housing 501, one or more first cavities or recesses 554 may extend from the outer surface into the housing 501. The first cavities 554 may have substantially the same size and shape as one another, but in some embodiments, the size and shape of the first cavities 554 may be different from one another. The first cavity 554 may have a substantially spherical or hemispherical shape such that the negative space of the cavity 554 may have the shape of a portion or a region of a sphere. However, in some other embodiments, the first cavity 554 may have any shape. As can be seen, the first cavities 554 may be arranged in a pattern, such as a regular or repeating pattern of first cavities 554. In some embodiments, the pattern may include a close-packed pattern of substantially spherical first cavities 554, such as a hexagonal close-packed pattern of substantially spherical first cavities 554. As used herein, a hexagonal close-packed pattern is intended to be understood as a structure that substantially corresponds to a layer of spheres or portions of spheres that are packed such that the spheres or portions of spheres in alternating layers are superimposed on each other, aligned in the gaps of the preceding layer. As described above, the systems of the present disclosure may not only overlap each other, but may interfere or overlap adjacent spheres. The conventional packing factor for hexagonal close-packed systems is typically 0.74, but this factor can be higher in the system of the present disclosure due to the generation of overlapping or interference patterns. According to one example, a close-packed pattern is created by repeating and propagating a base pattern in various patterns or geometric arrangements throughout the structure to form a clustered three-dimensional structure.

The electronic device comprising the housing 501 may further comprise a component, such as a perforated or mesh component or plate 510, disposed substantially adjacent to a surface of the housing 501 that at least partially defines an interior volume of the device. In some examples, mesh component or plate 510 may be in direct contact with the surface of housing 501, but in some other examples, mesh component 510 may be spaced apart from the surface of housing 501 by a distance of, for example, at most about 1mm, at most about 3mm, at most about 5mm, or at most about 10mm, or even greater. Mesh component 510 may define a plurality of perforations or holes 511 extending therethrough and may be arranged in a repeating pattern. In some examples, the holes 511 may have a diameter of about 1mm, about 2mm, about 3mm, or even larger. For example, the apertures 511 may be arranged in a hexagonal close-packed pattern, wherein a desired spacing distance between adjacent apertures 511 may be less than about 1mm, less than about 0.75mm, less than about 0.5mm, less than about 0.25mm, or less than about 0.1mm or less. Apertures 511 are shown as being substantially circular and having substantially the same shape as one another, however, the apertures may be of substantially any size or shape, and may not all be of the same size or shape, as desired.

As described herein, in some examples, the housing 501 and mesh panel 510 may allow fluid communication between the ambient environment and the interior volume defined by the housing 501 to allow a desired level of air to flow into or out of the interior volume while also acting as an electromagnetic interference (EMI) and/or electromagnetic compatibility (EMC) noise shield for other components of the electronic device. For example, as further described herein, an air movement system of the electronic device may move air into or out of the interior volume through the

apertures

502, 511 of the housing 501 and mesh panel 510. In some examples, the speed and volume of air moving into or out of the interior volume may be controlled by the air movement system such that the air movement does not generate audible noise for the user.

In some examples, the outer surface of the housing 501 and the surface of the mesh plate 510 may at least partially define the outer surface of the electronic component. In some examples, the repeating pattern of apertures 502 of the housing 501 and the repeating pattern of apertures 511 of the mesh plate 510 may combine to define an open area of at least about 70%, at least about 73%, at least about 75%, or at least about 77% or more into the interior volume. In some examples, the open area defined by the housing 501 and mesh plate 510 may be less than about 95%, less than about 90%, less than about 85%, or less than about 80% or less. As used herein, the term "open area" may refer to a percentage of the total area of a surface defined at least in part by a component, wherein particles, fluids, or other substantially dimensionless objects incident on that portion of the surface have a path through the component from its incident side. Further, the surface may be defined by an outermost surface of the component, and in some examples, does not include a surface area of features (such as holes, recesses, or voids) that extend into the surface of the component. Thus, for example, in the example of the component shown in fig. 9A, the surface defining the open area is a continuous flat surface defined by the top surface 552 of the component that extends the height and width of the component and further extends linearly across any aperture 502 of the component.

Such a horizontal open area may allow a desired amount of air to move into or out of the interior volume. However, due to the arrangement and size of the holes formed therein, the housing 501 and the mesh member 510 can also function as an EMI/EMC shield even with such a high level of open area. For example, for frequencies between about 2GHz and about 5GHz, housing 501 and mesh component 510 may reduce electromagnetic radiation passing therethrough by at least about 20dB μ V. Further details of the housing 501 and the mesh member 510 are described with reference to fig. 9B.

As further shown in fig. 9B, at least one first cavity 554 extending into the housing 501 from an exterior surface may intersect or interfere with at least one second cavity 556 extending into the housing 501 from an interior surface to define the aperture 502. In some examples, the one or more first cavities 554 may intersect the one or more second cavities 556. Further, one or more first cavities 554 may intersect a different number of second cavities 556. For example, an amount of first cavities 554 may each intersect three second cavities 556, while an amount of different first cavities 554 (e.g., those first cavities 554 positioned near the perimeter of the housing 501) may each intersect two second cavities 556.

Similarly, in some embodiments, the one or more second cavities 556 may intersect with the one or more first cavities 554. Further, one or more second cavities 556 may intersect a different number of first cavities 554. For example, a plurality of second cavities 556 may each intersect three first cavities 554, while other second cavities 556 (e.g., those second cavities 556 positioned near the perimeter of the housing 501) may each intersect two first cavities 554.

The intersecting first and

second cavities

554, 556 together form or define a three-dimensional pattern of apertures 502 extending through the housing 501. In some examples, at least some of the three-dimensional patterns of holes 502 may be in fluid communication with one another to form or define a matrix of continuous channels in the housing 501. In some examples, the matrix of channels may extend substantially throughout the entire housing 501, or an entire face or panel of the housing 501, or only a portion of a face or panel of the housing 501, such that any one cavity may be in fluid communication with any other cavity via the channels. In addition, the three-dimensional pattern of apertures 502 holds the structural lattice of the material forming the housing 501 or its panels. The resulting lattice structure provides a thermal benefit in that the surface area for the transfer and release of thermal energy via convection is increased compared to conventional patterns, while providing a channel for convective heat transfer. In addition, the interconnected lattice structure provides structural support for the housing 501.

As described above, the electronic device may also include a mesh member or plate 510 that defines a pattern of apertures 511 extending therethrough. In some examples, mesh plate 510 may have a thickness of about 1mm, about 2mm, about 3mm, about 5mm, or even greater. Although shown as being spaced apart from the housing 501, in some examples, the mesh panel 510 may be disposed substantially adjacent to an inner surface of the housing 501. In some examples, mesh plate 510 may be bonded or adhered to housing 501, for example, by brazing, welding, and/or an adhesive. In some examples, the mesh plate 510 may be adhered or adhered to the housing 501 by a pressure sensitive adhesive disposed on portions of the mesh plate 510 between the apertures 511 and in contact with the housing 501 at locations between the apertures 502. In some examples, the mesh plate 510 may be electrically grounded along all or a portion of the perimeter of the mesh plate 510. Further, in some examples, the mesh plate 510 may be electrically connected to the housing 501 along all or a portion of the perimeter of the mesh plate 510 to electrically ground the mesh plate 510. Further details of the structure of the housing 501 forming the aperture or through-hole 502 are described with reference to fig. 10A-10F.

Fig. 10A is a perspective view of one exemplary pattern that may be defined by the housing 501. In some examples, a portion of the housing 501 may have a structure or unitary body 550 that may define one or more apertures 502. As shown, a plurality of top spherical recesses 554 may be formed in the top surface 552 of the unitary body 550. Unitary body 550 may include a three-dimensional structure defined by a number of top spherical recesses 554 extending from top surface 552 and engaging and interfering with a number of bottom spherical recesses 556 formed in the bottom surface (fig. 10C). Top spherical recesses 554 and bottom spherical recesses 556 may interfere with each other to create through holes arranged in a specified pattern. Fig. 10B-10E illustrate three-dimensional patterns of unitary bodies 550 in various orientations.

Fig. 10B is a top view of an exemplary three-dimensional pattern formed in unitary body 550. As shown, the top spherical recesses 554 formed in the top surface 552 of the unitary body 550 extend through and create through holes as they engage and interfere with the bottom spherical recesses 556. The front, back, and cross-sectional views shown in fig. 10C, 10D, and 10E illustrate the through-holes resulting from the engagement of the top spherical recess 554 and the bottom spherical recess 556, respectively. According to one example, the use of spherical concavities increases the exposed surface area of the three-dimensional pattern, enhancing heat transfer capability via convection. The three-dimensional pattern shown in fig. 10A to 10E may be a pattern aggregation of a basic pattern of apertures or recesses formed in the unitary body 550. One exemplary base orifice pattern is shown in fig. 10F and described in further detail below.

As described above, the spherical recesses may have a basic pattern of three spherical recesses disposed in a common plane and intersecting or interfering with each other at least partially, and a fourth spherical recess intersecting or interfering with each of the three spherical recesses on adjacent planes. Fig. 10F graphically illustrates one example of a base pattern 560 of spherical recesses. The base pattern 560 may include a first spherical recess 562, a second spherical recess 564, and a third spherical recess 566 arranged in a first plane and at least partially intersecting one another, as indicated by the intersection line 570. The intersecting regions of the cavities form through-holes in the formed unitary body that contains the three-dimensional pattern. The fourth spherical recess 570 is disposed in a different plane relative to the first, second, and third

spherical recesses

562, 564, 566. As shown, the fourth spherical recess 570 may intersect the first, second, and third

spherical recesses

562, 564, 566, as indicated by the intersection line 570, thereby forming a through-hole in the unitary body. According to one example, the first spherical recess 562, the second spherical recess 564, and the third spherical recess 566 may be top spherical recesses from a top surface of the unitary body, and the fourth spherical recess 568 may be bottom spherical recesses from a bottom surface of the unitary body to form a three-dimensional pattern. This base form or pattern 560 may then be repeated and propagated throughout the structure in various patterns or geometric arrangements to form a collective three-dimensional structure.

In some examples, and as shown in fig. 11A, the structure of the housing 501 may be formed from or include one or more portions or components that may be joined together to form the structure of the housing 501. In some examples, the housing 501 may include an outer or exterior portion 503 that may at least partially define an exterior surface of the device 500 and may also at least partially define a plurality of holes or perforations 502 that may extend into or completely through the exterior portion 503. As described herein, the outer portion 503 may include a metallic material, a polymeric material, a ceramic material, or a combination thereof. In some examples, the outer portion 503 may include a metallic material such as steel or aluminum.

The housing 501 may also include one or more

inner portions

504, 505 that may be bonded, adhered, fused, or otherwise joined to the outer portion 503. For example, inner portion 504 may be fused to a surface of outer portion 503 opposite the outer surface of housing 501. In some examples, the inner portion 504 may be joined or fused to substantially all of the inner surface of the outer portion 503. Further, in some examples, the inner portion 504 may include multiple pieces or portions, such as

portions

504 and 505, that may or may not be connected or otherwise engaged with one another. In some examples, the

inner portions

504, 505 may be directly joined to the outer portion 503, however, in some examples, one or more of the

inner portions

504 or 505 may be joined to the outer portion 503 by additional layers or materials (such as adhesives). In some examples, such as when the outer portion 503 comprises a metallic material, the inner portion 504 may be cast or molded onto the outer portion 503, for example, by injection molding. Thus, in some examples, one or more of the

interior portions

504, 505 may include a flowable material that may be cooled or solidified to form the one or more

interior portions

504, 505.

In some examples, the inner portion 504 may also define an aperture or perforation 502 at least partially defined by the outer portion 503. Thus, in some examples, the aperture may be partially defined by the outer portion 503 and may extend into the housing 501, and further defined by the inner portion 504. In some examples, the structure described with reference to fig. 10A-10F may be formed by or may be defined by a combination of outer portion 503 and inner portion 504. In some examples, the inner portion 504 may include a metallic material, a polymeric material, a ceramic material, a coating material, and/or combinations thereof. In some examples, the inner portion 504 may include one or more polymer materials. For example, at least some of the inner portion 504 (such as a section of the inner portion 504 that at least partially defines the aperture 502) may be formed from a first polymeric material, while other portions (such as a section that is joined to a sidewall of the outer portion 503) may be formed from a second polymeric material. The second polymeric material may, for example, be lighter, less dense, less expensive, or have superior thermal and/or acoustical insulation properties as compared to the first polymeric material.

As shown in fig. 11B, in some examples, mesh component or plate 510 may be disposed substantially adjacent to a surface of housing 501, such as a surface at least partially defined by interior portion 504 that at least partially defines an interior volume of device 500. Accordingly, inner portion 504 may function to maintain a desired distance between outer portion 503 and mesh component 510, for example, to provide a desired level of EMI or EMC noise shielding. In some examples, the inner portion 504 may have any desired thickness or thicknesses, such as up to about 1mm, up to about 3mm, or up to about 10mm, or even greater.

Fig. 11C and 11D show perspective views of a section of the housing 501 (e.g., a front section of the housing 501). In some examples, the housing 501 may be assembled from or may include multiple sections or panels that may be joined together or to other components. The sections of the panels of the housing 501 may be joined by any means known in the art or developed in the future, for example, by adhesives, welding, and/or attaching hardware such as screws or bolts. As can be seen, in some examples, a section of the housing 501 may include an outer portion 503 and an inner portion 504 bonded thereto, as described herein. Outer portion 503 and inner portion 504 may each at least partially define an aperture 502 through housing 501, and may combine to form the structure described herein with reference to fig. 10A-10F. Further details regarding the electronic device including the housing, frame, and various additional components are described with reference to fig. 12-16.

Fig. 12 shows a perspective view of the interior of the electronic device 600. Electronic device 600 is but one representative example of a device that can be used in connection with the systems and concepts disclosed herein. Electronic device 600 may be, for example, a desktop computer, and may be substantially similar to and include any of the features of

electronic devices

100, 200, and 400 described herein. The electronic device 600 may include a housing, such as the

housings

201, 401, 501 described herein, that may define an interior volume and at least partially define an exterior surface of the electronic device 600. In this example, a housing, which may be similar to

housings

201, 401 described herein, is not shown.

The electronic device 600 may include a frame or chassis 640 that may be connected to and at least partially support the housing when the housing is secured to the electronic device 600. The chassis 640 may also define a lower or bottom exterior surface of the apparatus 600. The housing and chassis 640 may together substantially define an exterior surface of the device 600. The chassis 640 may also provide structural support for the electronic device 600. The components of the electronic device 600 may be attached to the housing and/or chassis 640 via internal surfaces, attachment features, threaded connectors, studs, posts, and other fastening systems formed into, extending from, or otherwise being part of the housing and/or chassis 440.

In this example, the main logic board 630 may divide and separate the internal volume into a plurality of regions, such as a first region and a second region. Fig. 12 provides a view of a first region of an interior volume of an electronic device 600. In this example, the main logic board 630 is sized and positioned within the internal volume defined by the housing such that the main logic board 630 extends substantially the entire height and width of the internal volume, thereby dividing the internal volume into a first region located on one side of the main logic board 630 and a second region located on the other, opposite side of the main logic board 630.

A plurality of electronic devices, electrical components, and other components of the electronic device 600 may be disposed within the first area and may be connected to a first surface or side of the main logic board 630. In this example, a CPU 612, one or more Graphics Processing Units (GPUs), such as

GPUs

614 and 616, a power supply unit 618, and a first air moving device 620 are connected to a first side of a main logic board 630. In some examples, one or more components may be directly connected to the main logic board 630, for example, by soldering or by interfacing with one or more ports (such as PCIe ports on the main logic board 630). The electronic device 600 may include additional electronic components connected to the main logic board 630, for example, through ports provided on the main logic board 630. In some examples, the ports may include one or more ports to connect components, such as expansion cards, to the electronic device 600 through an expansion bus. Thus, in some examples, the main logic board 630 may include one or more computer expansion bus interconnects, e.g., a serial computer expansion bus interconnect such as a PCIe slot. The interconnect may allow a user to add additional components, such as

components

611 and 613, to the electronic device 600 to allow additional functionality as desired.

Further, when the housing is removed from the electronic device 600, the configuration of the components within both the interior volume and the first region, and the location of the expansion slots on the main logic board 630, allow for high access to these components, as shown. Thus, when the housing has been removed, a user or technician may easily add, remove, or replace components of the electronic device 600.

As described with respect to the electronic device 200, the electronic device 600 may include a first air moving device 620, which may include one or more air moving components, such as a fan. In this example, the air movement system may move air from the ambient environment into the first region through, for example, a void in the enclosure to create a positive air pressure in the first region relative to the ambient environment. The first air moving device 620 may include a first fan 622, a second fan 624, and a third fan 626. The

fans

622, 624, 626 may be attached together, for example, to components secured to the chassis 640. According to one example, the first air moving device 620 may extend substantially the entire height of the electronic device 600, effectively moving an air wall into the first region and past components located therein. In some examples, the speed of each

fan

622, 624, 626 may be independently controlled, such as by a processor of the electronic device 600, to produce a desired location and amount of airflow into the first volume. In some examples, the fan blade diameter of the

fans

622, 624, 626 may be about 140 mm.

The arrangement of the first air moving device 620 relative to the components and the expansion slots in the first region allows for the addition or removal of various components from the electronic device 600 without substantially affecting the airflow path through the electronic device 600. While adding components to a conventionally configured computer may result in airflow obstructions and dead spots, the use of an area and the first air moving device 620 that substantially extends the entire height of the first area allows airflow to be provided to the components without regard to whether additional components have been added or removed, thereby achieving a desired level of airflow and heat dissipation that is compatible with a highly modular and customizable design. As described with respect to the electronic device 200, in some examples, the electronic device 600 may include support features, such as feet 621, attached or connected to the frame 640. Additional details of the frame and support features of the electronic device 600 are provided below with reference to fig. 13A-C.

Fig. 13A shows an exploded cross-sectional view of a portion of the frame 640 indicated in fig. 12 (e.g., a portion adjacent to one of the support features 621). As can be seen, in some examples, various components may be positioned or housed within the hollow space defined by the tubular members of the frame 640. As shown, the hollow tubular portion of the frame 640 may define a port or aperture 641 that allows access to the interior space defined by the tubular members of the frame 640.

The aperture 641 may allow a user or technician to access one or more components that may be housed therein. Additionally, to provide a pleasing exterior appearance and limit accessibility to the remainder of the hollow space defined by the tubular members of the frame 640, the trim ring 672 may be contained within the hollow space and may be disposed substantially adjacent the aperture 641 such that the aperture of the trim ring 672 substantially abuts the aperture 641. In some examples, the trim ring 672 may be held in place within the frame 640 by a wedge 674 that is configured to receive a nut 676 and a screw 678 that may hold the wedge 674 and the trim ring 672 in a desired position. Thus, when a user or technician attempts to access the interior of the frame 640 through the aperture 641, the trim ring 672 may define which portions of the frame 640 are accessible and prevent access to certain other undesirable locations within the frame 640.

Turning now to fig. 13B and 13C, a user may attempt to access the interior of the frame 640 through the trim ring 672 in order to manipulate the captive attachment members 686 storable therein. In some examples, the attachment member 686 may be a screw or bolt, although any form of attachment member may be used as desired. The attachment member 686 may be retained in the frame 640 by a retaining member 684 that may engage with a corresponding feature (e.g., threads 680 of fig. 13A) on the interior of the frame 640. The retaining member 684 may retain the attachment member 686 in a desired position until it is manipulated by a user or technician, for example, by inserting a screwdriver or other tool through the trim member 672 and into the aperture 641 to engage the attachment member 686. During use, the tool may drive the attachment member 686 to displace it toward, for example, a bottom portion of the frame 640. As such, the attachment member 686 may thus be moved to protrude from the frame 640, whereby the attachment member may engage with a corresponding engagement feature of a component (such as the support feature 621, e.g., a foot or caster) disposed adjacent to the frame 640. In some examples, the support feature 621 may include a threaded portion 682 corresponding to the threads of the attachment member 686, and engagement between the attachment member 686 and the support feature 621 may affix the support feature to the frame 640. In examples where a user or technician may attempt to remove or replace the support feature 621, the retaining member 684 may retain the attachment member 686 at least partially within the frame 640 to facilitate future alignment and attachment of the support feature. Additional features of the electronic device 600 and related components are described with reference to fig. 14.

Fig. 14 shows a perspective view of the interior of the electronic device 600. Fig. 12 shows the right side of the electronic device 600 including the first region, while fig. 14 shows the left side of the electronic device 600 including the second region. In some examples, a component, such as main logic board 630, may divide the interior volume into multiple regions. Although the components described above with reference to fig. 12 are connected to one side or surface of the main logic board 630, the electronic device 600 may include components disposed in a second area and connected to a second, different side of the main logic board 630. In some examples, the electronic device 600 may include one or

more memory modules

632, 636, such as dual in-line memory modules (DIMMs). The

memory modules

632, 636 may be positioned and electrically connected to the main logic board 630. Each DIMM may also have a

cover

633, 637 associated with it, as further described herein. The electronic device 600 may also include data storage, for example in the form of a drive such as a Solid State Drive (SSD) 638. The SSD 638 may be disposed in the second area, and may also be positioned on the main logic board 630. SSD 638 may be electrically connected to one or more other components of electronic device 600.

The air moving system of the electronic device 600 may also include a second air moving device 628 positioned within the second area. In this example, the second air moving device 628 may include a blower 628 to move air from the second area to the ambient environment through the housing (e.g., through an aperture formed in the housing). In this way, the second air moving device 628 may generate a negative air pressure in the second region relative to the ambient environment. Creating negative air pressure in the second region causes air to flow between components in the second region. Although the second air moving device 628 is described as a blower, in some examples, any suitable components capable of moving air or generating an airflow may be included in the first air moving device 620. As used herein, the term "blower" may refer to a centrifugal fan that may include, for example, an impeller and a duct housing that directs air moved by the impeller.

The electronic device 600 may include an interface panel 642 that may be substantially similar to the interface panel 220 described with respect to fig. 3. The interface panel 642 may also include various ports that may be used to transfer data and/or power between the electronic device 600 and various external systems. For example, the interface panel 642 may include an Alternating Current (AC) power input port 619 that may be sized and shaped to receive a power plug of the power supply unit 618 that is adapted to transfer external power to the electronic device 600. The interface panel 642 may also include one or more holes, apertures, or perforations that allow air to move through the interface panel 642. For example, the interface panel may be located at an edge of an area (such as the first area), and air may move from the first area through the interface panel 642 to the ambient environment. In some examples, the interface panel 642 may include a plurality of panel portions 643, each panel portion 643 defining a plurality of apertures or through-holes. In some examples, the panel 643 may be sized to correspond to the size of a related component connected to an associated PCIe slot. For example, the height and width of panel 643 may be substantially similar to the height and width of a part (such as part 613). In some examples, panel 643 may even be attached or attached to component 613. Thus, in some examples, the electronic device 600 may include the same number of panels 643 as components connected to PCIe slots in the device 600. The perforated panel 643 helps to provide EMC shielding for the components of the electronic device 600 while also allowing airflow therethrough to help with thermal management. In addition, the holes provide a lower front surface area of the panel 643, which prevents a significant amount of heat from being transferred to a user, such as the touch panel 643, even if the panel itself is at an elevated temperature. Further details regarding the function of the electronic device 600 and components, such as DIMM covers 633, 637, are described with reference to fig. 15.

Fig. 15 shows the electronic device 600 in a manner similar to fig. 14, but includes DIMM covers 633 and 637 moved to an open position, exposing the associated

DIMMs

632, 636. For example, in the closed position, as shown in fig. 15, the DIMM cover 633 may be used to separate airflow between the DIMM 632 and other components of the electronic device 600 (such as the SSD 638) in order to control the airflow and achieve a desired level of thermal management of the various components of the device 600. Thus, the DIMM cover 633 can cover a portion (such as a top portion) of the DIMM 632 in a closed position while remaining open on side portions of the DIMM 632, thereby defining an airflow passage or channel below the DIMM cover 633 and above, for example, a heat sink portion of the DIMM 632. The size and shape of DIMM cover 633 can be selected as needed to achieve a desired level of airflow management. Additionally, various devices and components of the air moving system may be controlled, for example, by the processor, to provide a desired level of airflow to the

DIMMs

632, 636 in accordance with various variables (e.g., usage levels of certain applications running on the electronic device 600).

The DIMM cover 633 may be held in a locked or closed position by a locking mechanism, for example, as shown in fig. 14. The locking mechanism may include a toggle or latch, such as toggle or latch 670, 672, that may be manipulated by a user to unlock and open the

corresponding DIMM cover

633, 637. In some examples, the locking mechanism may comprise one or more springs that may force the

covers

633, 637 into the open position when the user manipulates the toggle to the unlocked state. Further, the toggle may include a visible indicator that may provide a visible indication of whether the toggle 670, and thus the associated DIMM cover 633, is in the locked or unlocked state. When a user attempts to close DIMM cover 633, the user may manipulate or move cover 633 to a closed position whereby it may engage with a locking mechanism. This engagement with the locking mechanism may occur automatically when the cover 633 is moved to the closed position to automatically lock the cover 633. The automatic engagement may also cause the toggle to move from the unlocked state to the locked state and may cause the visual indicator to display the correct associated visible indicia. In some examples, the visual indicator may include a plurality of colors, each color associated with a locked or unlocked state and displayed when the toggle is in such a state. In some examples, the visual indicator may include one or more associated graphics or lights (such as LED lights). Further details of the interior of the electronic device 600 are described below with reference to fig. 16.

Fig. 16 shows an exploded view of an electronic device 600 including a chassis 640, components disposed within an interior volume, and an air movement system. As described herein, a component (in this example, a main logic board 630 disposed within the internal volume) may be used to divide the internal volume into a plurality of regions. In this example, the main logic board 630 spans two major dimensions of the internal volume defined by the housing, thereby dividing the internal volume into two regions. Further, the first and second regions may be fluidly isolated from each other except at one or more desired locations.

In some examples, the electronic device 600 may also include one or more seals that may prevent airflow at undesired locations (e.g., between areas defined by the main logic board 630). The main logic board 630 and the enclosure together prevent airflow between the zones by providing a physical barrier to airflow when the enclosure is located on the electronic device. Accordingly, it may be undesirable for there to be unexpected or unintended gaps or spaces where the housing and the main logic board 630 intersect, as these gaps may allow for undesirable airflow and may inhibit the creation of pressure differentials between the regions, as described herein. To ensure that the areas are fluidly isolated from each other outside of the desired locations, one or more sealing components may be used to create an air-tight seal at the desired locations between the housing and the main logic board 630. In this example, the seal or sealing member 652 may at least partially surround the main logic board 630, and in some examples may substantially surround the entire perimeter of the main logic board 630. The seal 652 may comprise any compressible or compliant material, as desired, such as a polymer material, such as rubber, capable of forming a substantially air-tight seal between the components of the electronic device 600. When the housing is positioned on the electronic device 600, the alignment of the housing and components, such as the main logic board 630, may cooperate with the seal 652 to form a substantially air-impermeable barrier. For example, the housing and the main logic board 630 may exert pressure on the seal 652, and in some examples, may compress the seal 652 to create a substantially air impermeable barrier.

In some examples, the electronic device 600 may include one or more additional sealing components, for example, at any location in the device 600 where airflow is not required. In some examples, the seal 654 may at least partially surround one or more other components of the electronic device 600, such as the first air moving device 620. In this example, the seal 654 substantially surrounds the first air moving device 620 and cooperates with the housing to prevent airflow from flowing from the first region back to the ambient environment at this location. In some examples, where the first region has a positive air pressure, a seal, such as seal 652, may help prevent or inhibit backflow, i.e., airflow from the first region into the surrounding environment at an undesirable location.

In some examples, the regions may be fluidly isolated by the substantially gas impermeable main logic board 630 except at one or more desired locations. In this way, the main logic board 630 serves to selectively inhibit the movement of air between the first and second regions, except at desired locations. Thus, in some examples, components such as the main logic board 630 may include or be composed of a substantially air impermeable material. To control airflow between the zones, the main logic board 630 may include holes or through-holes 660 that may be used to fluidly connect the first and second zones and may allow air to predictably flow between the zones through the holes 660. As further described herein, in some examples, one region may have a positive air pressure while another region may have a negative air pressure. Thus, the relative pressure of each region will drive air flow from the positive to the negative air pressure regions, and the apertures 660 provide a path of least resistance to such flow occurring, thereby controlling the position of the air flow between the regions.

Fig. 16 also illustrates an arrangement of components, for example,

components

611, 613, 614, 616, and 618 in a first region of the interior volume may maximize or increase the surface area of the components exposed to the air moved by the first air moving device 620. In some examples, one or more of these components may include a heat sink, for example in the form of a highly thermally conductive material, which may transfer heat between the operational portion of the component and the air passing through. The orientation of these components relative to the airflow driven by, for example, the first air moving device 620, as implemented by the dual-sided configuration of the main logic board 630, may allow for the maximization of the heat sink surface area exposed to the flowing air, as compared to conventional computer and electronic device architectures. Additionally, each

component

611, 613, 614, 616, and/or 618 may be a modular component, and may include its own processor and one or more attachment features configured to engage with corresponding portions of the frame 640 to retain the modular component in a space defined by the frame that is sized to correspond to the modular component. The modular component may be secured to the frame 640 of the electronic device by a retaining component, such as a clamp plate, that includes holes and attaches the component to the frame, for example by attachment members, such as screws, that pass through the holes of the clamp plate so that they may engage with the modular component and attachment features of the frame 640 to retain the modular component. Additional embodiments of the structure and arrangement of an electronic device including a housing defining an interior volume divided into one or more regions by one or more components in the interior volume are described below with reference to fig. 17A-C.

Fig. 17A and 17B illustrate top and bottom perspective views of a grounding member or component 701 of an electronic device 700 (e.g.,

electronic devices

200, 400, 600 described herein) that may facilitate electrical grounding of one or more components of the electronic device. In some examples, the component 701 may be formed from a metallic material such as steel or aluminum, although essentially any conductive and flexible material such as a conductive polymer may be used. In some examples, the grounding member 701 may be formed from a single piece of metal, for example, it may be stamped from a single piece of metal.

The ground member 701 may include an elongated body including a first set of arms 710 extending from and folded over a first side of the body. The ground member 701 may also include a second set of arms 711 extending from a second side of the body opposite the first side. The second set of arms 711 may also overlap on the body. The sets of

arms

710, 711 may be offset from each other such that when the first set of arms 710 and the second set of arms 711 overlap on the body, the arms 711 in the second set are positioned between the two arms 710 in the first set. In this way, the sets of arms can act as leaf springs to provide a flexible electrical contact between the component and another portion of the electronic device.

Fig. 17C shows the grounding member 701 attached to a portion of the member 730, for example, by a hole 702 defined by the grounding member 701 and a hook 703 disposed opposite the hole 702. The ground member 701 may be connected to the member 730 by mating the hole 702 with a corresponding male attachment feature of the member 730 and by engaging the hook or lip 703 with an edge of the member 730. Thus, the

arms

710, 711 may directly contact and make electrical connection with the component 730, while the surface 720 of the grounding component 701 provides a large area for contacting the frame or some other portion of the electronic device to ground the component 730. The spring force generated by the

arms

710, 711 of the grounding member 701 ensures that electrical contact between the member 730 and electrical ground is maintained even if the member 730 is not properly aligned. Furthermore, the

arms

710, 711 of the grounding component 701 are arranged such that they are robust to shear forces. The ground component 701 or multiple ground components can be used to connect any of the electronic device components described herein to electrical ground, as desired. Additional embodiments of the structure and arrangement of an electronic device including a housing defining an interior volume divided into one or more regions by one or more components in the interior volume are described below with reference to fig. 18.

Fig. 18 shows a perspective view of a component of an electronic device, such as a main logic board 730. In some examples, the electronic device may be substantially similar to and may include some or all of the features of

electronic devices

100, 200, 400, and 600 described herein. Further, the main logic board 730 may be substantially similar to the components 430 and 630 described herein and may include some or all of its features.

In this example, the main logic board 730 may be, for example, a printed circuit board including a polymer substrate. In some examples, the main logic board 730 may include any substrate material, such as a composite material (such as a fiberglass material), a polymer-based composite material, a metal, and combinations thereof, as desired. The main logic board 730 may include a first surface 732 and a second surface 734 disposed opposite the first surface 732. However, in some examples, the main logic board 730 may have substantially any shape, number of surfaces, and orientation of surfaces as desired.

As shown, in some examples, one or more components of an air moving system of an electronic device may be attached or otherwise connected to a first surface 732 of a main logic board 730. In some examples, a first air moving device 720 including a first fan 722, a second fan 724, and a third fan 726 may be connected to a main logic board 730. In this way, the main logic board 730 and the first air moving device 720 may cooperate to fluidly isolate the first area from the second area and the ambient environment. As described herein, other components of the electronic device may be directly connected to the first surface 732 of the main logic board 730, such as by soldering or other securing methods. In some examples, the first surface 732 of the main logic board 730 may include one or more expansion slots. For example, the first surface 732 of the main logic board 730 may include one or more computer expansion bus interconnects. In some examples, the computer expansion interconnect may be a serial or parallel computer expansion bus interconnect, such as a PCI or PCIe slot.

Interconnects

761, 762, 763, 764, 765, 766, 767, 768, 769, and 770 may allow a user to add additional components and connect them to the electronic device as needed to allow additional functionality. While fig. 18 shows one particular arrangement of

interconnects

761, 762, 763, 764, 765, 766, 767, 768, 769, and 770, the interconnects can be arranged in substantially any orientation on the first surface 732 of the main logic board 730. In some examples, the arrangement of

interconnects

761, 762, 763, 764, 765, 766, 767, 768, 769, and 770 may allow for easy removal, addition, or replacement of one or more components, providing modularity and configurability for the electronic device, as described herein. In some examples, the main logic board 730 may include 10 interconnects, 11 interconnects, 12 interconnects, or even more.

The main logic board 730 may define a hole or via 760. As described herein, the aperture 760 may be used to provide a fluid communication path between pressure regions on either side of the main logic board 730. In some examples, the aperture 760 may have a substantially rectangular shape, as shown. In some examples, the apertures 760 may have any shape or size as desired and are determined by, for example, a desired level of airflow through the apertures 760. In some examples, the main logic board 730 may define a plurality of apertures as desired. In some examples, the plurality of apertures may be located at the approximate location of the apertures 760, or may be positioned anywhere on the main logic board 730 as desired to provide a desired level of airflow therethrough. Additional details of the main logic board 730 are provided below with reference to fig. 19.

Fig. 19 illustrates another perspective view of the main logic board 730 showing the second surface 734 disposed substantially opposite the first surface 732. As discussed herein, the main logic board 730 may include electronic components disposed on two opposing sides, allowing the components of the electronic device to be positioned in different pressure areas to allow for optimal cooling and thermal management while still providing easy access for a user or technician. Although components such as CPUs and GPUs may be connected to the first surface 732 of the main logic board 730, other components such as memory components may be positioned on the second surface 734.

In some examples, the main logic board 730 may include a plurality of slots 771 or connections that may receive modules (such as memory modules) that may be connected to an electronic device. In some examples, one or more memory modules 772, such as dual in-line memory modules (DIMMs), may be connected to the main logic board 730. The main logic board 730 may also include components disposed on the second surface 734, such as a heat sink 774. Likewise, the location of components (such as the heat sink 774) on the second surface 734 allows air to flow through the heat sink 774 to provide cooling and thermal management without interrupting or impeding air flow to other components (e.g., those positioned on the first surface 732). As discussed, the air movement system of the electronic equipment may include a second air moving device, such as blower 728. In some examples, blower 728 may be connected or attached to main logic board 730, e.g., via any manner of attachment feature in the blower housing and/or main logic board 730. In some examples, the blower 728 may be positioned at least partially on the main logic board 730 or may cover or block all or some of the apertures 760 of the main logic board. In this way, blower 728 may move air from the first area into the second area and out of the electronic device. That is, blower 728 may draw or draw air from the first region through apertures 760 to create an airflow between the regions and provide a negative air pressure in the second region, as described herein. The second air moving device may also include a panel 780 that may be used to further seal or isolate the second area, for example, by preventing air from flowing into the second area from the surrounding environment at the location of the panel 780. The panel 780 may also include a cutout, through hole, or aperture 775 that may be aligned with the exhaust of the blower 728 to allow the blower to vent air from the second area into the ambient environment. Additional embodiments of the structure and arrangement of an electronic device including a housing defining an interior volume divided into one or more regions by one or more components in the interior volume are described below with reference to fig. 20.

Fig. 20 shows a perspective view of components of an electronic device 800 including a seal or gasket 852, a frame 840, and a component 830 (such as a main logic board). Electronic device 800 is but one representative example of a device that can be used in connection with the systems and concepts disclosed herein. Electronic device 800 may be, for example, a desktop computer, and may be substantially similar to and include any of the features of

electronic devices

100, 200, 400, and 600 described herein. Additionally, the seal 852 may be substantially similar to the seal component 652 described with respect to fig. 16.

As shown, the seal 852 may include multiple portions that may be oriented in multiple directions relative to the frame 840 and the electronic device 800. For example, the top and bottom portions of the seal member may extend substantially along the length of the electronic device 800 (e.g., along a portion of the perimeter of the main logic board 830), while the side portions of the seal 852 may extend substantially vertically and perpendicular to the top and bottom portions along a portion of the perimeter of the main logic board 830. In this manner, the seal 852 may ensure that any gaps between the main logic board 830 and the frame 840 or casing of the electronic device are filled to a desired degree to prevent undesired airflow therethrough. The seal 852 may comprise any compressible or compliant material, such as, for example, a polymeric material, such as rubber, as desired. Importantly, the material and placement and configuration of seal 852 may be configured to prevent a high level of stiction between seal 852 and the housing of electronic device 800, such that the housing may be easily removed from frame 840 and seal 852 without requiring a high level of force.

Fig. 21 shows a cross-sectional view of a seal 852 including a body 853 and a compressible lip 854 extending from the body 853. The lip 854 can extend substantially around the entire perimeter of the body 853, but the orientation of the lip 854 relative to the body 853 can vary along different portions of the seal 852. This variation may allow the flexible lip 854 to collapse in the correct direction (i.e., toward the body 853) when engaged by the housing, rather than peeling away from the body 853, which may not provide the desired level of sealing. Thus, in some examples, the lip 854 is oriented relative to the seal body 853 such that the housing compresses the lip 854 in a direction against the seal body 853 (e.g., along a top portion of the seal 852) at a first position adjacent the electronics 830 and in a direction against the seal body 853 (e.g., along a bottom portion of the seal 852) at a second position adjacent the electronics 830 opposite the first position. Fig. 22 and 23A-B further describe details of additional components of the electronic device, as described herein.

Fig. 22 shows a perspective view of a cable holding member 901 of an electronic device. Cable retention component 901 may be substantially similar to cable retention component 230 described with respect to fig. 3. The cable holding member 901 is engageable with a portion of a housing of the electronic device, such as a recess or groove, and is removable from the housing by a user. In some examples, the cable retention component 901 may include a protrusion or flange 902 that may extend from a body of the component and may be sized to correspond to and engage a slot of the housing. In some examples, the cable retention component 901 may be secured by a magnet of the housing that is disposed adjacent to an area where the cable retention component 901 is to be positioned. Cable retention component 901 may at least partially define aperture 910 and may be combined with and attached to a housing to define an aperture sized to allow passage of one or more cables therethrough, as described above.

Fig. 23A and 23B show top views of the cable holding member 901, which includes a recess 903 shown in broken lines in the outer surface of the cable holding member 901. The recess 903 may receive a pin 904 that is movable between a first position, shown in fig. 23A, inside the recess 903 and a second position, shown in fig. 23B, in which the pin 904 extends at least partially outside the recess 903. Thus, pin 904 may be at least partially retracted into the body of cable retention component 901. In some examples, the cable retention component 901 may include a magnet within the body and/or within the recess 903, which may exert an attractive force on the pin 904 to retain it within the recess 903, for example, when the cable retention component 901 is not positioned on an electronic device. In use, for example, a magnet included in or on the housing and disposed substantially adjacent to recess 903 when cable retention component 901 is engaged with an electronic device to define aperture 910 may also exert an attractive force on pin 904 when cable retention component 901 is attached to the housing. In some examples, the magnets of the electronic device may exert a greater or stronger attractive force on the pin 904 than the magnets of the cable retention component 901 to cause the pin 904 to extend at least partially out of the recess 903. In some examples, the housing may include a recess or additional feature that may engage with pin 904 once it at least partially extends from recess 903 to hold or help hold cable retention component 901 in a desired position on the housing. In some examples, the cable retention component 901 may include two or more pins and corresponding recesses. For example, as shown in fig. 22, the cable holding member 901 may include two recesses 903 and two pins provided therein. Fig. 24 and 25 further describe details of additional components of an electronic device as described herein.

Fig. 24 illustrates an exploded view of a processor 1001 and a heat sink assembly 1010 of an electronic device, which may be substantially similar to the

electronic devices

100, 200, 400, 600 described herein, configured to contact the processor 1001 and exert pressure thereon to draw heat away from the processor 1001 and facilitate thermal management of both the processor 1001 itself and the entire electronic device. In some examples, the processor 1001 may be a central processing unit of an electronic device and may be attached to, disposed on, or otherwise attached to a logic board (such as any of the

main logic boards

630, 730 described herein).

The heat sink assembly 1010 may be held against the processor 1001 by one or more raised features or

risers

1020, 1022 that may cooperate with the back plate 1030 and the heat sink assembly 1010 to cause the heat sink assembly 1010 to exert a desired amount of pressure on the processor 1001. In some examples, the

risers

1020, 1022 and the back plate 1030 may exert a force on the processor 1001 of at least about 400N through the heat sink assembly 1010. In some examples, the relevant components of the electronic device may exert a force on the processor 1001 of at least about 900N, 1000N, 1100N, or even greater through the heat sink assembly 1010. The pressure exerted by the heat sink assembly 1010 on the processor 1001 may provide a close thermal contact between the processor 1001 and the heat sink assembly 1010, and may provide a desired level of thermal conduction away from the processor 1001 to achieve a desired level of processor performance. Additionally, as described herein, the geometry and configuration of the

risers

1020, 1022, heatsink assembly 1010, backplate 1030, processor 1001, and electronic device may provide airflow channels over the heatsink assembly 1010 to achieve a desired level of thermal management while still allowing single-sided access to the processor 1001 when the heatsink assembly 1010 is removed, e.g., to allow for repair, replacement, or upgrade of the processor 1001.

Thus, in some examples, processor 1001 may be disposed on or above backplane 1030 such that backplane 1030 is located below processor 1001. The back plate may also define a plurality of

back plate apertures

1031, 1033 that may be positioned substantially adjacent to a perimeter of the processor 1001. The first lifter 1020 may be disposed above the back plate 1030 and substantially adjacent or near the perimeter of the processor 1001. The first riser 1020 may have an elongated form, but may be of substantially any shape or design as desired. The first lifter 1020 may define a first aperture 1021 that may be positioned near an end or edge of the first lifter 1020 and a second aperture 1023 that may be positioned near an end or edge of the first lifter 1020 opposite the first aperture 1021, although substantially any configuration of apertures may be used. The first lifter 1020 may be positioned such that the first aperture 1021 and the second aperture 1023 may substantially align with the

apertures

1031, 1033 of the back plate 1030.

As shown in the cross-sectional view of fig. 25, the first lifter 1020 may also define a lifting or attachment feature 1024 that may be, for example, centrally located on the first lifter 1020, although substantially any location may be used. The lifting features 1024 may be configured to engage with corresponding attachment members 1012 that may pass through holes of the heat sink assembly 1010 to engage the lifting features 1024 and secure the heat sink assembly 1010 thereto. The heat sink assembly 1010 may thus directly cover the processor 1001 and may be coupled to the first riser 1020 by the attachment member 1012 and the lifting feature 1024. In some examples, the lifting features 1024 may include threads and the attachment members 1012 may include corresponding threads such that engagement therebetween holds the heat sink assembly 1010 against the processor 1001.

The lifter 1020 may also include a first spring 1041 and a second spring 1043 located below the back plate 1030 and substantially aligned with the

back plate apertures

1031, 1033. The first spring 1041 and the second spring 1043 may be coupled to the back plate 1030 by corresponding retaining members 1051, 1053 that may extend at least partially through the

springs

1041, 1043 and may engage the riser 1020, for example, through the

apertures

1031, 1033, such that the riser 1020 and attached heat sink assembly 1010 exert a desired amount of force on the processor 1001.

The electronic device may also include a second riser 1022, which may be substantially similar to the first riser 1020 and may likewise define an aperture 1027 that may be aligned with an aperture of the back plate 1030. As described with respect to the first lifter 1020, the

springs

1045, 1047 may be retained with the retaining

members

1055, 1057 in a similar manner as the first lifter 1020 and the second attachment member may engage the lifting features of the second lifter 1022. Although two risers are shown in this example, any number of risers may be used as desired. Fig. 26, 27, and 28 further describe details of additional components of an electronic device as described herein.

Fig. 26 shows a perspective view of a component of the electronic device (in this example, a power supply unit 1100). The power supply unit 1100 may be a component of any of the electronic devices described herein, including the

electronic devices

100, 200, 400, and 600. The power supply unit 1100 may also be substantially similar to the power supply units 418 and 618 described herein and may include any of its features.

As explained herein, in some examples, it may be desirable to flow air directly at or through a particularly high power component of an electronic device. In some examples, such components may be positioned directly in an airflow channel in an interior volume of the electronic device, for example at a communication location between a positive air pressure region and a negative air pressure region. In this way, a relatively large amount of air may move over or through the component to provide a desired level of thermal energy removal and thermal management for the component, such as the power supply unit 1100 and the entire electronic device.

In some examples, the power supply unit 1100 may be positioned in the airflow channel as it is typically the most dense component of the electronic device and prevents the greatest obstruction to airflow, as described herein. As such, it may be desirable to position the power supply unit 1100 in a large flow path of air flow. Further, in some examples, the power supply unit 1100 may be responsible for up to about 10% of the power, and thus the generation of thermal energy, of the components within the interior volume of the electronic device. Thus, in some examples, it may be desirable to provide a high level of airflow and thus cooling to the power supply unit 1100.

The power supply unit 1100 may include a housing or body 1106 that may define an exterior surface of the power supply unit 1100. In some examples, the body 1106 of the power supply 1100 has a generally rectangular prismatic shape and may be formed by a combination of two mating components. According to one example, the first component may define a top exterior surface, a bottom exterior surface, and a first side exterior surface, and the second component may define a front exterior surface, a back exterior surface, and a second side exterior surface disposed opposite the first side exterior surface. In some examples, the body 1106 may include or be formed of aluminum and may be anodized to a desired color, for example.

The power supply unit 1100 may also include connectors or contacts 1102 that may be connected, for example, to expansion slots or other interfaces on the main logic board, as described herein. Such a connection may allow the electronic device to control the power supply unit 1100 and the power distributed from the power supply unit 1100. An Alternating Current (AC) power input port 1104 of the power supply unit 1100 is available for connection to an external AC power source, which the power supply unit can convert to DC power for use by components of the electronic device. In some examples, the AC input port or input 1104 may be electrically connected to the connector 1102 and mechanically connected to the body 1106 by an arm within the interior volume of the power supply, and the AC input port 1104 may be configured to move at least about 0.3mm, at least about 0.5mm, or at least about 1mm in two or more axes relative to the body 1106 of the power supply unit 1100. Further details of the power supply unit 1100 are provided below with reference to fig. 27 and 28.

Fig. 27 shows a side view of the power supply unit 1100 including the heat sink 1108. The heat sink 1108 may be thermally connected to the power supply unit to help distribute the thermal energy generated by the power supply unit 1100 to the air flowing through the power supply unit 1100. In some examples, the heat sink 1108 may include any highly thermally conductive material, such as metallic materials, e.g., copper, aluminum, and other metals or alloys. As the air moved by the air moving system of the electronic device passes through the heat sink 1108, thermal energy is transferred to the air, which is then expelled from the electronic device into the surrounding environment, thereby cooling the power supply unit 1100 and the device.

Fig. 28 shows a top view of the power supply unit 1100. As can be seen, in some examples, the heat sink 1108 may be recessed into the body 1106 of the power supply unit 1100. Such a recess may provide a passage for air to flow to the heat sink 1108 and through the power supply unit 1100, thereby facilitating thermal management. In some examples, the recess may align with an aperture on a main logic board of the electronic device to provide an airflow channel between pressure zones of the device.

As noted above, any number or variety of components as described herein may be included in an electronic device. These components may include any combination of the features described herein and may be arranged in any configuration described herein. The structure and arrangement of an electronic device including an enclosure defining an interior volume divided into one or more regions by one or more components within the interior volume, and the concepts related to regional pressure and airflow are applicable not only to the specific examples discussed herein, but to any number of embodiments in any combination.

As noted above, one aspect of the present technology is to collect and use data from a variety of sources. The present disclosure contemplates that, in some instances, such collected data may include personal information data that uniquely identifies or may be used to contact or locate a particular person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, twitter IDs, home addresses, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

The present disclosure recognizes that the use of such personal information data in the present technology may be useful to benefit the user. In addition, the present disclosure also contemplates other uses for which personal information data is beneficial to a user. For example, health and fitness data may be used to provide insight into the overall health condition of a user, or may be used as positive feedback for individuals using technology to pursue health goals.

The present disclosure contemplates that entities responsible for collecting, analyzing, disclosing, transmitting, storing, or otherwise using such personal information data will comply with established privacy policies and/or privacy practices. In particular, such entities should enforce and adhere to the use of privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining privacy and security of personal information data. Users can conveniently access such policies and should update as data is collected and/or used. Personal information from the user should be collected for legitimate and legitimate uses by the entity and not shared or sold outside of these legitimate uses. Furthermore, such acquisition/sharing should be performed after receiving user informed consent. Furthermore, such entities should consider taking any necessary steps to defend and secure access to such personal information data, and to ensure that others who have access to the personal information data comply with their privacy policies and procedures. In addition, such entities may subject themselves to third party evaluations to prove compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to the particular type of personal information data collected and/or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the united states, the collection or acquisition of certain health data may be governed by federal and/or state laws, such as the health insurance association and accountability act (HIPAA); while other countries may have health data subject to other regulations and policies and should be treated accordingly. Therefore, different privacy practices should be maintained for different personal data types in each country.

Regardless of the foregoing, the present disclosure also contemplates embodiments in which a user selectively prevents use or access to personal information data. That is, the present disclosure contemplates that hardware elements and/or software elements may be provided to prevent or block access to such personal information data. For example, the present technology may be configured to allow a user to opt-in or opt-out of collecting personal information data at any time during or after registration service. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to accessing or using personal information. For example, the user may be notified that their personal information data is to be accessed when the application is downloaded, and then be reminded again just before the personal information data is accessed by the application.

Further, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of inadvertent or unauthorized access or use. Once the data is no longer needed, the risk can be minimized by limiting data collection and deleting data. In addition, and when applicable, including in certain health-related applications, data de-identification may be used to protect the privacy of the user. De-identification may be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at a city level rather than at an address level), controlling how data is stored (e.g., aggregating data on a user), and/or other methods, as appropriate.

Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may be implemented without the need to access such personal information data. That is, various embodiments of the present technology do not fail to function properly due to the lack of all or a portion of such personal information data.

As used herein, the terms exterior, outside, inside, and top are used for reference purposes only. The outer or exterior portion of the component may form a portion of the exterior surface of the component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior or inner portion of a component may form or define an interior or inner portion of a component, but may also form or define an outer or a portion of an outer surface of a component. The top portion of the component may be located above the bottom portion in certain orientations of the component, but may also be aligned with, below, or in other spatial relationships with the bottom portion depending on the orientation of the component.

As used herein, any directional, positional, and relational terms, such as, for example, orthogonal, adjacent, and parallel, are intended to encompass not only a specific and precise direction, position, and/or relationship, but also any direction, position, and/or relationship within 1%, 5%, 10%, 15%, or a range of degrees or so. For example, the term orthogonal may be intended to refer not only to two bodies being positioned at an angle of 90 ° with respect to each other, but also to two bodies being positioned at any angle between 80 ° and 110 ° with respect to each other.

Various inventions have been described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations are possible without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "comprising" and "having," as used in the specification and claims, shall have the same meaning as the term "comprising.

The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the embodiments. It will be apparent, however, to one skilled in the art that the embodiments may be practiced without the specific details. Thus, the foregoing descriptions of specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teaching.

Claims

1. An electronic device, comprising:

a frame defining a space configured to receive a power supply unit;

a case defining an interior volume and sized to surround the frame, the case being slidably removable from the frame, the case further defining an opening sized to receive and expose an Alternating Current (AC) input of the power supply unit to an exterior environment; and

a power supply unit, the power supply unit comprising:

a body defining an exterior surface and an interior volume of the power supply unit; and

a contact for electrically connecting the power supply unit to an electronic component of the electronic device;

the ac input electrically connected to the contact and mechanically connected to the body by an arm within the interior volume of the power supply unit, the ac input being translatable relative to the body of the power supply unit in two or more axes by at least 0.3 mm.

2. The electronic device of claim 1, wherein the body of the power supply unit comprises aluminum.

3. The electronic device of claim 1, wherein the body has a rectangular prism shape, and the body comprises:

a first component defining a top exterior surface, a bottom exterior surface, and a first side exterior surface of the body; and

a second component defining a front exterior surface, a rear exterior surface, and a second side exterior surface disposed opposite the first side exterior surface of the body.

4. The electronic device of claim 1, the case further comprising a ground member, the ground member comprising;

an elongated body;

a first set of arms extending from a first side of the body; and

a second set of arms extending from a second side of the body opposite the first side;

wherein the first set of arms and the second set of arms are offset from each other such that one arm of the second set of arms is positioned between two arms of the first set of arms when the first set of arms and the second set of arms overlap above the body; and is

Wherein each arm of the first and second sets of arms is slidably deflected to provide electrical ground to the electronic device.

5. The electronic device of claim 1, further comprising:

a modular component comprising a processor and an attachment feature, wherein the frame further defines a modular component space;

a splint comprising a hole; and

an attachment member sized to extend at least partially through the aperture of the cleat and sized to engage with the attachment feature of the modular component to retain the modular component in the modular component space.

6. The electronic device of claim 1, wherein the case comprises:

a top surface defining a recess; and

a handle attached to the case and positioned in the recess;

the handle is movable between a first stable position in which the handle is disposed within the recess and a second stable position in which the handle extends away from the top surface of the case;

the handle is rotatable relative to the case in the second stable position, wherein rotating the handle disengages the case from the frame in the second stable position.

7. The electronic device of claim 6, wherein the frame defines a slot including a first slot end and a second slot end positioned higher than the first slot end; and is

The handle is connected to a pin configured to engage the slot, wherein rotating the handle in the second stable position moves the pin from the first slot end to the second slot end and moves the casing relative to the frame a distance corresponding to a height difference between the first slot end and the second slot end.

8. The electronic device of claim 1,

the case further includes a top surface including an input part connected to an electrical contact attached to the case, an

The electrical contacts are positioned to engage with corresponding electrical contacts attached to the frame such that an input detected by the input component at least partially determines whether the power supply unit provides power to the electronic component.

9. The electronic device of claim 8, wherein the case further comprises an indicator positioned on the top surface, the indicator configured to provide a visible indication of whether the power supply unit is providing power to the electronic component.

10. The electronic device of claim 1, wherein the frame further comprises a member adjacent to the electronic device and a perforated plate disposed adjacent to the power supply,

wherein the shroud cooperates with the perforated panel to define an outer surface of the electronic device, and the perforated panel allows airflow into the interior volume.

11. The electronic device of claim 1, further comprising a caster attached to the frame, the caster comprising a ball bearing assembly and defining a hole through a central portion of the caster.

12. The electronic device of claim 11, wherein the electronic device comprises four casters attached to a bottom portion of the frame.

13. The electronic device of claim 1, wherein the frame comprises:

a hollow tubular portion extending the entire height of the frame, the hollow tubular portion including a sidewall defining an aperture;

a holding member disposed within and attached to the hollow tubular portion; and

an attachment member retained in the hollow tubular portion by the retaining means, the securing member being accessible through the aperture and extending beyond an end of the hollow tubular portion.

14. An electronic device, comprising:

a processor;

a back plate located below the processor and defining a back plate aperture;

a lifter defining a lifter aperture, the lifter disposed above the backplate, the lifter aperture aligned with the backplate aperture, the lifter further defining an attachment feature;

a spring positioned below the back plate and aligned with the back plate aperture, the spring coupled to the back plate and the lifter by a retaining member passing through the spring, the back plate aperture, and the lifter aperture; and

a heat sink assembly covering the processor and including an attachment member, the heat sink assembly coupled to the lifter by the attachment member engaging the attachment feature,

wherein the back plate and the lifter exert a force on the processor through the heat sink assembly of at least about 400N.

15. The electronic device of claim 14, wherein the backplate further defines a second aperture, the spring is a first spring, and the riser is a first riser, the electronic device further comprising:

a second lifter defining a second lifter aperture, the second lifter disposed above the backing plate, the second lifter aperture aligned with the second aperture, the second lifter further defining a second attachment feature; and

a second spring located below the back plate and aligned with the second aperture, the second spring coupled to the back plate and the second lifter by a second retaining member passing through the second spring, the second aperture, and the second lifter aperture,

wherein the heat sink assembly is coupled to the second riser by a second attachment member of the heat sink that engages the second attachment feature.

16. An electronic device, comprising:

a frame configured to receive and support an electronic component;

a housing defining an interior volume and sized to surround the frame and the electronic component, the housing being slidably removable from the frame;

the electronic component positioned within the interior volume and comprising an aperture;

a sealing member including a sealing body and a compressible lip extending from the sealing body, the sealing member at least partially surrounding the electronic component,

wherein the compressible lip is oriented relative to the sealing body such that the housing compresses the lip in a direction against the sealing body at a first position adjacent the electronic component and in a direction against the sealing body at a second position opposite the first position adjacent the electronic component, and

wherein the electronic component and the sealing member divide the interior volume into a first region and a second region that are fluidly isolated except at the aperture.

17. The electronic device of claim 16,

the sealing body includes a top portion located above the electronic component, a bottom portion located below the electronic component, and two side portions connecting the top portion to the bottom portion to define a perimeter; and is

The lip extends from the seal body along the top portion and the bottom portion such that the lip is compressible in the same direction partially against the seal body along the top portion and the bottom portion.

18. The electronic device of claim 16, wherein the electronic component comprises:

a main logic board having a first surface including a processor and a second surface opposite the first surface including a memory component;

a cover movable between a closed position covering and surrounding the reservoir component and an open position exposing the reservoir component; and

a latch movable between a first position and a second position, the latch coupled to the cover and configured to secure and retain the cover in the closed position when in the first position,

wherein movement of the latch to the second position releases the cover to move to the open position and includes a visible indicia for indicating that the cover is in the open position.

19. The electronic device of claim 18, wherein the latch includes a spring biased to bring the cover into the open position when the latch is moved to the second position.

20. The electronic device of claim 18, wherein the cover is configured to direct airflow into the interior volume over the reservoir component.