CN111988960A

CN111988960A - Heat radiator for electronic device

Info

Publication number: CN111988960A
Application number: CN202010813619.XA
Authority: CN
Inventors: 侯馨
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-08-13
Filing date: 2020-08-13
Publication date: 2020-11-24

Abstract

The invention relates to the technical field of electronic components, in particular to a heat dissipation device of an electronic device, which comprises a mounting seat, wherein a placing plate for fixing the electronic device is arranged on the inner side of the mounting seat in a bolted connection manner, a heat dissipation groove is arranged on the lower side of the placing plate, an air cooling mechanism is arranged on the inner side of the heat dissipation groove, and a water cooling mechanism is arranged on the inner side of the mounting seat. The effectiveness of the operation of the water cooling mechanism can be ensured.

Description

Heat radiator for electronic device

Technical Field

The invention relates to the technical field of electronic components, in particular to a heat dissipation device of an electronic device.

Background

Electronic devices refer to devices made by utilizing and controlling the laws of motion of electrons in vacuum, gas, or solid. Divided into electro-vacuum devices, gas-filled tube devices and solid-state electronic devices. In the analog circuit, the functions of rectification, amplification, modulation, oscillation, frequency conversion, phase locking, control, correlation and the like are performed; in digital circuits for sampling, limiting, logic, storage, counting, delaying, etc. The gas tube device is mainly used for rectifying, stabilizing voltage and displaying.

Air cooling is a conventional heat dissipation method for electronic devices, and mainly utilizes equipment such as a fan and the like to enable air and the electronic devices to form forced convection so as to take away heat of the electronic devices. This fan generally sets up in the wind channel, and conventionally, the wind channel is hollow pipeline structure, but, the air-cooled heat dissipation receives external environment influence great, and when the difference in temperature of electron device temperature and ambient temperature is not big, the radiating effect is just not obvious, consequently, to above current situation, the urgent need develops a heat abstractor of electron device to overcome not enough in the current practical application.

Disclosure of Invention

The present invention is directed to a heat dissipation device for electronic devices, so as to solve the problems of the related art.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a heat abstractor of electronic device, includes the mount pad, the inboard bolted connection of mount pad is provided with the board of placing that is used for fixed electronic device, it is provided with the radiating groove to place the board downside, the radiating groove inboard is provided with air-cooled mechanism, the mount pad inboard is provided with water-cooling mechanism.

As a further scheme of the invention: the air cooling mechanism comprises a cooling fan which is arranged on the inner side of the heat dissipation groove in a bolted connection mode, a partition plate which is fixedly connected with the mounting seat is arranged on the lower side of the cooling fan, a connecting pipe is arranged on the inner side of the partition plate in a fixedly connected mode, the other end of the connecting pipe is connected with a filtering mechanism which is arranged on the inner side of the heat dissipation groove, the output end of the filtering mechanism is connected with a cavity which is arranged on the inner side of the mounting seat through an air guide mechanism, and a plurality of air outlets are.

As a further scheme of the invention: the filtering mechanism comprises a filtering box fixedly connected and arranged on the inner side of the heat dissipation groove, a filtering net is detachably connected and arranged on the inner side of the filtering box, and a water absorbing layer connected with the filtering box in a clamped mode is arranged on the lower side of the filtering net.

As a further scheme of the invention: the air guide mechanism comprises an air guide pipe fixedly connected with the bottom of the filter box, the other end of the air guide pipe is connected with a cavity arranged on the inner side of the mounting seat, a cooling pipe is arranged on the outer side of the air guide pipe in a surrounding mode, the input end of the cooling pipe is connected with the water cooling mechanism, and the output end of the cooling pipe is connected with the water cooling mechanism through a circulating pipe arranged on the inner side of the mounting seat.

As a further scheme of the invention: the water cooling mechanism comprises a water tank arranged on the inner side of the mounting seat, a water pump is arranged on the inner side of the water tank in a bolted connection mode, the output end of the water pump is connected with the water guide pipe, the output end of the water guide pipe is connected with the cooling pipe and a heat absorption pipe arranged on the inner side of the placing plate respectively, the output end of the heat absorption pipe is connected with a condenser arranged on the inner side of the mounting seat in a bolted connection mode through a water outlet pipe, and the output end of the condenser is.

As a further scheme of the invention: the condenser outside fixed connection is provided with heat absorption silica gel, heat absorption silica gel keeps away from condenser one side and is provided with a plurality of and mount pad fixed connection's fin.

As a further scheme of the invention: the water tank is characterized in that a water injection pipe is fixedly connected to the top of the right end of the water tank, a drain pipe fixedly connected with the water tank is arranged on the lower side of the water injection pipe, and valves are fixedly connected to the inner sides of the joints of the water injection pipe, the drain pipe and the water tank.

Compared with the prior art, the invention has the beneficial effects that:

1. the air cooling mechanism is arranged, so that the electronic device can be rapidly cooled, and the running stability of the electronic device is ensured;

2. by arranging the filtering mechanism, dust can be prevented from being accumulated on the surface of the electronic device, and air around the device can be kept dry, so that the service life of the electronic device is prolonged;

3. through setting up water-cooling mechanism, can dispel the heat to electron device under the little condition of electron device temperature and ambient temperature difference in temperature, strengthen the heat-sinking capability of device greatly, through setting up the condenser, can guarantee the validity of water-cooling mechanism operation.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation device of an electronic device.

Fig. 2 is a top view of a heat dissipation device for an electronic device.

Fig. 3 is a schematic perspective view of a heat dissipation device of an electronic device.

In the figure: 1-mounting seat, 2-placing plate, 3-radiating holes, 4-radiating groove, 5-radiating fan, 6-partition plate, 7-filtering box, 8-filtering screen, 9-water absorbing layer, 10-air duct, 11-water tank, 12-water pump, 13-water guide pipe, 14-cooling pipe, 15-heat absorbing pipe, 16-cavity, 17-air outlet, 18-connecting pipe, 19-water outlet pipe, 20-condenser, 21-circulating pipe, 22-heat absorbing silica gel, 23-radiating fin, 24-water injecting pipe and 25-water discharging pipe.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Reference will now be made in detail to embodiments of the present patent, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present patent and are not to be construed as limiting the present patent.

Example 1

Referring to fig. 1-3, in an embodiment of the present invention, a heat dissipation apparatus for an electronic device includes an installation base 1, a placement plate 2 for fixing the electronic device is connected to an inner side of the installation base 1 by a bolt, a heat dissipation groove 4 is disposed at a lower side of the placement plate 2, an air cooling mechanism is disposed at an inner side of the heat dissipation groove 4, and a water cooling mechanism is disposed at an inner side of the installation base 1.

Example 2

In this embodiment, air cooling mechanism includes bolted connection and sets up radiator fan 5 at the radiating groove 4 inboard, radiator fan 5 downside is provided with baffle 6 with 1 fixed connection of mount pad, 6 inboard fixed connection of baffle are provided with connecting pipe 18, the connecting pipe 18 other end is connected with the filter mechanism who sets up at the radiating groove 4 inboard, the filter mechanism output passes through the air guide mechanism and is connected with the cavity 16 that sets up at the mount pad 1 inboard, cavity 16 is close to and places 2 one sides of board and is provided with a plurality of gas outlets 17, through setting up air cooling mechanism, can dispel the heat fast electronic device, guarantees the stability of electronic device operation.

In this embodiment, filtering mechanism includes that fixed connection sets up the rose box 7 in 4 inboards of radiating groove, 7 inboards of rose box can be dismantled and connect and be provided with

filter screen

8, 8 inboards of filter screen are provided with the layer 9 that absorbs water with 7 joints of rose box, through setting up filtering mechanism, can avoid the dust to pile up on the electron device surface, can make the air around the device keep dry simultaneously, do benefit to the life who improves electron device.

In this embodiment, the air guide mechanism includes air duct 10 that fixed connection set up in rose box 7 bottom, the air duct 10 other end is connected with the cavity 16 that sets up at the mount pad 1 inboard, the air duct 10 outside is encircleed and is provided with cooling tube 14, the cooling tube 14 input is connected with water cooling mechanism, the cooling tube 14 output is connected with water cooling mechanism through the circulating pipe 21 that sets up at mount pad 1 inboard.

In this embodiment, water-cooling mechanism is including setting up at 1 inboard basin 11 of mount pad, 11 inboard bolted connection in basin is provided with water pump 12, water pump 12 output is connected with aqueduct 13, aqueduct 13 output is connected at the condenser 20 of 1 inboard of mount pad with cooling tube 14 and setting respectively with the heat absorption pipe 15 of setting in placing 2 inboards, heat absorption pipe 15 output passes through outlet pipe 19 and bolted connection setting, condenser 20 output is connected with basin 11, through setting up water-cooling mechanism, can dispel the heat to electronic device under the little condition of electronic device temperature and ambient temperature difference in temperature, has strengthened the heat-sinking capability of device greatly, through setting up condenser 20, can guarantee the validity of water-cooling mechanism operation.

In this embodiment, the outer side of the condenser 20 is fixedly connected with a heat absorption silica gel 22, and one side of the heat absorption silica gel 22 away from the condenser 20 is provided with a plurality of radiating fins 23 fixedly connected with the mounting base 1.

In this embodiment, a water injection pipe 24 is fixedly connected to the top of the right end of the water tank 11, a water discharge pipe 25 fixedly connected to the water tank 11 is arranged on the lower side of the water injection pipe 24, and valves are fixedly connected to the inner sides of the joints of the water injection pipe 24 and the water discharge pipe 25 and the water tank 11.

In this embodiment, the placing plate 2 is provided with a plurality of heat dissipation holes 3.

In this embodiment, the outer side of the mounting base 1 is fixedly connected with a temperature sensor, and the temperature sensor is electrically connected with a controller for controlling the switches of the cooling fan 5 and the water pump 12.

The working principle of the invention is as follows: when the electronic device temperature is far higher than the ambient temperature, radiator fan 5 can dispel the heat to the electronic device fast, guarantee the stability of electronic device operation, can collect the dust in the air among the heat dissipation process, thereby avoid the dust to pile up on the electronic device surface, can make the air around the device keep dry simultaneously, do benefit to the life who improves the electronic device, when the difference in temperature of electronic device temperature and ambient temperature is not big, water cooling mechanism can dispel the heat to the electronic device, the heat-sinking capability of device has been strengthened greatly, condenser 20 can guarantee the validity of water cooling mechanism operation.

The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, it is possible to make several variations and modifications without departing from the concept of the present invention, and these should be considered as the protection scope of the present invention, which will not affect the effect of the implementation of the present invention and the utility of the patent.

Claims

1. The utility model provides a heat abstractor of electron device, includes mount pad (1), its characterized in that, the inboard bolted connection of mount pad (1) is provided with board (2) of placing that are used for fixed electron device, it is provided with radiating groove (4) to place board (2) downside, radiating groove (4) inboard is provided with air-cooled mechanism, mount pad (1) inboard is provided with water-cooling mechanism.

2. The heat dissipation device for electronic devices according to claim 1, wherein the air cooling mechanism comprises a heat dissipation fan (5) bolted to the inside of the heat dissipation groove (4), a partition (6) fixedly connected to the mounting base (1) is disposed on the lower side of the heat dissipation fan (5), a connecting pipe (18) is fixedly connected to the inside of the partition (6), the other end of the connecting pipe (18) is connected to a filtering mechanism disposed on the inside of the heat dissipation groove (4), the output end of the filtering mechanism is connected to a cavity (16) disposed on the inside of the mounting base (1) through an air guide mechanism, and a plurality of air outlets (17) are disposed on one side of the cavity (16) close to the placement plate (2).

3. The heat dissipation device for electronic devices according to claim 2, wherein the filtering mechanism comprises a filtering box (7) fixedly connected and disposed inside the heat dissipation slot (4), a filtering net (8) is detachably connected and disposed inside the filtering box (7), and a water absorption layer (9) clamped with the filtering box (7) is disposed below the filtering net (8).

4. The heat dissipation device for the electronic device according to claim 3, wherein the air guide mechanism comprises an air guide tube (10) fixedly connected and arranged at the bottom of the filter box (7), the other end of the air guide tube (10) is connected with a cavity (16) arranged at the inner side of the mounting seat (1), a cooling tube (14) is arranged around the outer side of the air guide tube (10), the input end of the cooling tube (14) is connected with the water cooling mechanism, and the output end of the cooling tube (14) is connected with the water cooling mechanism through a circulating tube (21) arranged at the inner side of the mounting seat (1).

5. The heat dissipation device for electronic devices as claimed in claim 1, wherein the water cooling mechanism comprises a water tank (11) disposed inside the mounting seat (1), a water pump (12) is disposed inside the water tank (11) in a bolted connection manner, an output end of the water pump (12) is connected with a water conduit (13), an output end of the water conduit (13) is respectively connected with a cooling pipe (14) and a heat absorption pipe (15) disposed inside the placement plate (2), an output end of the heat absorption pipe (15) is connected with a condenser (20) disposed inside the mounting seat (1) in a bolted connection manner through a water outlet pipe (19), and an output end of the condenser (20) is connected with the water tank (11).

6. The heat dissipation device for electronic devices, according to claim 5, is characterized in that a heat absorption silica gel (22) is fixedly connected to the outer side of the condenser (20), and a plurality of heat dissipation fins (23) fixedly connected with the mounting base (1) are arranged on one side of the heat absorption silica gel (22) away from the condenser (20).

7. The heat dissipation device for electronic devices as claimed in claim 6, wherein a water injection pipe (24) is fixedly connected to the top of the right end of the water tank (11), a water discharge pipe (25) fixedly connected to the water tank (11) is arranged below the water injection pipe (24), and valves are fixedly connected to the inner sides of the joints of the water injection pipe (24) and the water discharge pipe (25) and the water tank (11).