CN111970819A - Satellite-borne circuit board supporting device - Google Patents
Satellite-borne circuit board supporting device Download PDFInfo
- Publication number
- CN111970819A CN111970819A CN202010961572.1A CN202010961572A CN111970819A CN 111970819 A CN111970819 A CN 111970819A CN 202010961572 A CN202010961572 A CN 202010961572A CN 111970819 A CN111970819 A CN 111970819A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- plate
- cover plate
- support column
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
Abstract
The invention relates to a satellite-borne circuit board supporting device, which comprises: a circuit board support member, a housing, and a circuit board connector; the circuit board support member includes: the circuit board comprises a first cross beam, a second cross beam, a circuit board and a vertical rod, wherein the first cross beam and the second cross beam are respectively fixed at the top and the bottom of the circuit board, the vertical rod is fixedly connected with the first cross beam and the second cross beam, a plurality of circuit board supporting members are connected together by a circuit board connecting piece, and the circuit board supporting members and the circuit board connecting piece are all located inside the shell.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a satellite-borne circuit board supporting device.
Background
The PCB is also called as a printed circuit board, is a provider for electrical connection of electronic components, and has been developed for more than 100 years; the circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. The existing circuit board mainly adopts an integral structure to support the circuit board, and a plurality of integral structures are penetrated through a connecting rod to form integral equipment. The heat on the circuit board is conducted through the whole machine shell, the heat is conducted to the whole machine shell, and the heat is radiated out in a radiation mode.
The existing circuit board has at least the following problems:
1. the supporting structure adopting the integral processing mode has high processing cost, and a large base material is processed into the shell, so that the waste of the base material is serious.
2. The support structure adopting the integral processing mode has low heat dissipation efficiency, and the heat dissipation efficiency is much lower than that of a heat dissipation plate adopting the accelerated heat dissipation mode.
Disclosure of Invention
The invention aims to provide a satellite-borne circuit board supporting device, and aims to solve the technical problems of reducing the processing cost of a supporting structure and improving the heat dissipation efficiency of the supporting structure.
The purpose of the invention is realized by adopting the following technical scheme. According to the satellite-borne circuit board supporting device provided by the invention, the circuit board supporting member, the shell and the circuit board connecting piece are arranged; the circuit board support member includes: first crossbeam, second crossbeam, circuit board and montant, first crossbeam, second crossbeam are fixed in the top, the bottom of circuit board respectively, the montant with the equal fixed connection of first crossbeam, second crossbeam, the circuit board connecting piece will be a plurality of circuit board supporting member links together, circuit board supporting member, circuit board connecting piece all are located inside the casing.
The object of the invention can be further achieved by the following technical measures.
In the satellite-borne circuit board supporting device, the circuit board supporting member further comprises a temperature-equalizing plate, the temperature-equalizing plate is fixedly connected with the vertical rod, and the temperature-equalizing plate is abutted to the first cross beam and the second cross beam.
In the satellite-borne circuit board supporting device, the inside of the temperature equalization plate is provided with the micro-tube, and the inside of the micro-tube is filled with the liquid medium.
In an embodiment, the circuit board supporting member further includes a first pillar, a second pillar, a third pillar, and a fourth pillar, and the first pillar, the second pillar, the third pillar, and the fourth pillar are used to fixedly connect the circuit board to the first beam and the second beam, respectively.
In the satellite borne circuit board supporting device, the ends of the first support column, the second support column, the third support column and the fourth support column are in the same plane.
In the satellite-borne circuit board supporting device, the circuit board supporting member further comprises a heat conducting plate for conducting heat on the circuit board to the temperature equalizing plate, the heat conducting plate is fixed on the circuit board, and the heat conducting plate is abutted against the temperature equalizing plate of the other electric heating plate supporting member.
In the satellite-borne circuit board supporting device, the circuit board supporting member includes three vertical rods, a supporting block is fixed between two of the three vertical rods, and the supporting block abuts against the circuit board.
In the satellite-borne circuit board supporting device, the circuit board connecting piece is a locking rod, and locking nuts are installed at two end parts of the locking rod.
The casing comprises two side cover plates, a rear cover plate, an upper cover plate, a lower cover plate and a front cover plate, wherein the upper cover plate is fixedly connected with the two side cover plates, the front cover plate and the rear cover plate, and the lower cover plate is fixedly connected with the two side cover plates, the front cover plate and the rear cover plate.
Compared with the prior art, the invention has obvious advantages and beneficial effects. By means of the technical scheme, the satellite-borne circuit board supporting device provided by the invention solves the problems of high processing cost and serious raw material waste of the whole supporting structure by adopting a multi-part assembling supporting mode. The liquid flow in the micro-tube structure inside the temperature-equalizing plate increases the heat dissipation efficiency, the heat is quickly led out, and the problem that the heat dissipation capacity of the original integrated supporting structure is insufficient is solved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic perspective view of a satellite-borne circuit board supporting device according to an embodiment of the invention;
FIG. 2 is an exploded perspective view of a circuit board support member according to one embodiment of the present invention;
FIG. 3 is a schematic perspective view of a circuit board support member according to one embodiment of the present invention, illustrating the rear, side, and top portions of the circuit board support member, wherein a vapor chamber is not shown;
fig. 4 is a schematic diagram of a circuit board support member according to an embodiment of the present invention, and a perspective view schematically illustrates a positive portion, a side portion, and a top portion of the circuit board support member.
Fig. 5 is a schematic illustration of a plurality of circuit board support members connected by circuit board connectors according to one embodiment of the present invention.
Detailed Description
To further illustrate the technical means and effects of the present invention adopted to achieve the predetermined objects, the following detailed description of the embodiments, structures, features and effects of the satellite-borne circuit board supporting device according to the present invention will be made with reference to the accompanying drawings and preferred embodiments.
Fig. 1 is a schematic perspective view illustrating a satellite-borne circuit board supporting device according to an embodiment of the present invention, fig. 2 is an exploded perspective view illustrating a circuit board supporting member according to an embodiment of the present invention, and referring to fig. 1, fig. 2, fig. 3, and fig. 4, an exemplary satellite-borne circuit board supporting device according to the present invention includes: circuit board supporting member 1, casing 2, and circuit board connector 3, circuit board supporting member 1 includes: the circuit board 13 comprises a large board card 131 and a small board card 132, the whole first beam 11 is formed by combining two cuboids, the length of one cuboid 111 is equal to that of the large board card 131, the length of the other cuboid 112 is slightly smaller than that of the small board card 132, the cuboid 111 abuts against the top of the large board card, the cuboid 112 abuts against the top of the small board card, the first beam 11 is designed into the shape so as to support the circuit board 13, three first notches 113 matched with the vertical rod 14 are arranged on one side, away from the circuit board 13, of the first beam 11, the second beam 12 abuts against the bottom of the circuit board 13, three second notches 121 matched with the vertical rod 14 are arranged on one side, away from the circuit board 13, of the second beam 12, the first notches 113 and the second notches 121 are on the same straight line in the vertical direction, and the vertical rod 14 is respectively connected with the first beam 11 and the small board card 132 through screws in each notch, The second beam 12 is fixedly connected and the first beam 11 and the second beam 12 are fixedly connected with the circuit board 13 through screws, so as to form a structure for supporting the circuit board 13, which is shown in detail in fig. 3. The bottom of the large board 131 and the bottom of the small board 132 are respectively provided with a first groove 1311 and a second groove 1321, the first pillar 17 and the second pillar 16 respectively pass through the first groove 1311 and the second groove 1321 and are respectively matched with a third hole 122 and a fourth hole 123 arranged on the second beam 12, the top of the large board 131 and the top of the small board 132 are respectively provided with a third groove 1312 and a fourth groove 1322, the third pillar 100 and the fourth pillar 200 respectively pass through the third groove 1312 and the fourth groove 1322 and are respectively matched with a first hole 114 and a second hole 115 arranged on the first beam 11, which is shown in detail in fig. 4. The end 171 of the first support column 17, the end 161 of the second support column 16, the end (not shown) of the third support column 100, and the end (not shown) of the fourth support column 200 are all in the same plane, so that when the circuit board connector 3 is used to thread a plurality of circuit board support members 1 together, the first support column 17, the second support column 16, the third support column 100, and the fourth support column 200 enable the circuit board support members 1 to form a stable structure when pressed against each other.
Further, as shown in fig. 2, the circuit board support member 1 further includes a heat conducting plate 19 for guiding heat on the circuit board 13 to the temperature equalizing plate 18, the heat conducting plate 19 is fixed on two sides of the circuit board 13, after the circuit board connecting member 3 penetrates a plurality of circuit board support members together, the circuit board support member 1 shown in the figure contacts and compresses another circuit board support member (not shown in the figure), so that the heat conducting plate 19 fixed on the large board card 131 abuts against the temperature equalizing plate of the other circuit board support member, and the circuit board 19 fixed on the small board card 132 abuts against the temperature equalizing plate 18, so that the heat conducting plate 19 conducts heat on the circuit board 13 to the temperature equalizing plate of the other circuit board support member and the temperature equalizing plate 18.
Further, as shown in fig. 2 and 5, the circuit board supporting member 1 further includes a temperature-uniforming plate 18, the temperature-uniforming plate 18 is provided with 4 first through holes 181, the first beam 11 and the second beam 12 are respectively provided with 2 second through holes (not shown), the circuit board connectors 3 are locking rods, 4 groups of circuit board connectors 3 respectively pass through the 4 first through holes 181 on the temperature-uniforming plate 18, the first beam 11 and the 2 second through holes (not shown) on the second beam 12, and both ends of the 4 groups of circuit board connectors 3 are screwed by nuts to form an integrally fixed structure.
As shown in fig. 2, the top and bottom of the vapor chamber 18 are in contact with the first and second beams 11 and 12, respectively, and the vapor chamber 18 has micro tubes (not shown) therein filled with a medium (e.g., water) for heat transfer, so that heat in the vapor chamber 18 can be transferred to the first and second beams 11 and 12.
Further, as shown in fig. 3, the circuit board supporting member 1 includes three vertical bars 14, a supporting block 15 is fixed between two of the three vertical bars 14 through screws, one side of the supporting block 15 is fixedly connected with the vertical bar 14, and the other side of the supporting block is abutted against the small board clip 132 for supporting the circuit board 13.
Further, as shown in fig. 1, the housing 2 includes two side covers 21, a rear cover 22, an upper cover 23, a lower cover 24, and a front cover 25, the upper cover 23 is fixedly connected to the two side covers 21, the front cover 25, and the rear cover 22, and the lower cover 24 is fixedly connected to the two side covers 21, the front cover 25, and the rear cover 22 to form a whole.
In the above way, the satellite-borne circuit board supporting device provided by the invention is utilized to connect the first beam and the second beam through the three vertical rods to form a stable structure, the first support and the second support are arranged on the first beam, the third support and the fourth support are arranged on the second beam, the supporting capability of the integral frame structure processed by a whole base material can be realized, and because the integral frame structure is split into a plurality of small parts, the processing cost of the parts is low, the raw materials cut in the processing process are less, the waste of the raw materials is less, in the aspect of heat dissipation, because the invention adopts a plurality of parts to combine into the supporting device, the heat dissipation effect is better than that of the integrated supporting device, in addition, the heat conducting plate is arranged on the circuit board, the heat conducting plate is abutted with the temperature equalizing plate, and the temperature equalizing plate is abutted with the first cross beam and the second cross beam, so that heat can be effectively radiated out.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A satellite-borne circuit board supporting device is characterized by comprising: a circuit board support member, a housing, and a circuit board connector;
the circuit board support member includes: first crossbeam, second crossbeam, circuit board and montant, first crossbeam, second crossbeam are fixed in respectively the top, the bottom of circuit board, the montant with the equal fixed connection of first crossbeam, second crossbeam, the circuit board connecting piece will be a plurality of circuit board supporting member links together, circuit board supporting member, circuit board connecting piece all are located inside the casing.
2. The on-board circuit board support device of claim 1, wherein: the circuit board supporting member further comprises a temperature equalizing plate, and the temperature equalizing plate is abutted to the first cross beam and the second cross beam.
3. The on-board circuit board support device of claim 2, wherein: the inside of the temperature equalization plate is provided with a micro-tube, and the interior of the micro-tube is filled with a liquid medium.
4. The on-board circuit board support device of claim 2, wherein: the circuit board supporting member further comprises a first support column, a second support column, a third support column and a fourth support column, and the first support column, the second support column, the third support column and the fourth support column are used for fixedly connecting the circuit board with the first cross beam and the second cross beam respectively.
5. The on-board circuit board support device of claim 4, wherein: the ends of the first, second, third, and fourth struts are in the same plane.
6. The on-board circuit board support device of claim 5, wherein: the circuit board supporting member further comprises a heat conducting plate used for conducting heat on the circuit board out of the temperature equalizing plate, the heat conducting plate is fixed on two sides of the circuit board, and the heat conducting plate is respectively abutted against the temperature equalizing plate of the other electric heating plate supporting member and the temperature equalizing plate of the circuit board supporting member.
7. The on-board circuit board support device of claim 6, wherein: the circuit board supporting component comprises three vertical rods, a supporting block is fixed between two of the three vertical rods, and the supporting block is abutted to the circuit board.
8. The on-board circuit board support device of claim 6, wherein: the circuit board connecting piece is a locking rod, and locking nuts are installed at two end parts of the locking rod.
9. The on-board circuit board support device of claim 6, wherein: the shell comprises two side cover plates, a rear cover plate, an upper cover plate, a lower cover plate and a front cover plate, wherein the upper cover plate is fixedly connected with the two side cover plates, the front cover plate and the rear cover plate, and the lower cover plate is fixedly connected with the two side cover plates, the front cover plate and the rear cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010961572.1A CN111970819B (en) | 2020-09-14 | 2020-09-14 | Satellite-borne circuit board supporting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010961572.1A CN111970819B (en) | 2020-09-14 | 2020-09-14 | Satellite-borne circuit board supporting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111970819A true CN111970819A (en) | 2020-11-20 |
| CN111970819B CN111970819B (en) | 2021-09-17 |
Family
ID=73393155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010961572.1A Active CN111970819B (en) | 2020-09-14 | 2020-09-14 | Satellite-borne circuit board supporting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970819B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423246A (en) * | 2021-06-29 | 2021-09-21 | 长光卫星技术有限公司 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
| US5869353A (en) * | 1997-11-17 | 1999-02-09 | Dense-Pac Microsystems, Inc. | Modular panel stacking process |
| US6172874B1 (en) * | 1998-04-06 | 2001-01-09 | Silicon Graphics, Inc. | System for stacking of integrated circuit packages |
| CN102781163A (en) * | 2012-07-13 | 2012-11-14 | 北京控制工程研究所 | Damping support structure between printed circuit boards of satellite-bone electronic equipment |
| CN105934082A (en) * | 2016-04-15 | 2016-09-07 | 上海微小卫星工程中心 | Cube satellite integrated circuit board and connecting line thereof |
| CN206005081U (en) * | 2016-06-28 | 2017-03-08 | 郭筠彤 | Modular combination back board structure |
| CN206302675U (en) * | 2016-12-12 | 2017-07-04 | 深圳市盛弘电气股份有限公司 | A kind of mounting structure of charging module |
| CN111132445A (en) * | 2019-12-16 | 2020-05-08 | 中国人民解放军军事科学院国防科技创新研究院 | Satellite-borne stack and standardization module thereof |
-
2020
- 2020-09-14 CN CN202010961572.1A patent/CN111970819B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5016138A (en) * | 1987-10-27 | 1991-05-14 | Woodman John K | Three dimensional integrated circuit package |
| US5869353A (en) * | 1997-11-17 | 1999-02-09 | Dense-Pac Microsystems, Inc. | Modular panel stacking process |
| US6172874B1 (en) * | 1998-04-06 | 2001-01-09 | Silicon Graphics, Inc. | System for stacking of integrated circuit packages |
| CN102781163A (en) * | 2012-07-13 | 2012-11-14 | 北京控制工程研究所 | Damping support structure between printed circuit boards of satellite-bone electronic equipment |
| CN105934082A (en) * | 2016-04-15 | 2016-09-07 | 上海微小卫星工程中心 | Cube satellite integrated circuit board and connecting line thereof |
| CN206005081U (en) * | 2016-06-28 | 2017-03-08 | 郭筠彤 | Modular combination back board structure |
| CN206302675U (en) * | 2016-12-12 | 2017-07-04 | 深圳市盛弘电气股份有限公司 | A kind of mounting structure of charging module |
| CN111132445A (en) * | 2019-12-16 | 2020-05-08 | 中国人民解放军军事科学院国防科技创新研究院 | Satellite-borne stack and standardization module thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113423246A (en) * | 2021-06-29 | 2021-09-21 | 长光卫星技术有限公司 | Light device for efficient heat dissipation of cubic satellite electronic equipment |
| CN114173540A (en) * | 2021-12-13 | 2022-03-11 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
| CN114173540B (en) * | 2021-12-13 | 2022-07-19 | 中国科学院空间应用工程与技术中心 | Thermal control structure and device for satellite-borne on-orbit information processing and service load |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111970819B (en) | 2021-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111970819B (en) | Satellite-borne circuit board supporting device | |
| US8398429B2 (en) | Cable assembly for a connector system | |
| US20100015851A1 (en) | Cable assembly having improved configuration for suppressing cross-talk | |
| CN102236136B (en) | Opto-electronic device assembly | |
| US9538685B2 (en) | Power distribution device and assembling method thereof | |
| CN103687303A (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| US20200381872A1 (en) | Connector system with wafers | |
| US20090316365A1 (en) | Heat sink system having thermally conductive rods | |
| CN219107800U (en) | Battery management system and battery pack | |
| CN108519802B (en) | Multi-GPU card fixing mechanism of 2U server | |
| CN216819794U (en) | Full-glue-pouring split type photovoltaic junction box and photovoltaic cell assembly | |
| US20220046819A1 (en) | Server | |
| CN218482493U (en) | Fixing device of vertical electric connector and circuit assembly thereof | |
| US3139560A (en) | Circuit board assembly | |
| CN2819709Y (en) | Circuit board combination | |
| CN217283516U (en) | Anticreep just has PCB circuit board of high heat conduction function | |
| CN2682645Y (en) | Electric connector | |
| CN210781612U (en) | Power module support and power module mechanism thereof | |
| CN110571553B (en) | Power connector and PCB | |
| CN115589166B (en) | Three-level power module structure based on device straight string | |
| CN218998506U (en) | Waterproof power supply main board | |
| CN218969393U (en) | Water-cooled conductive busbar for foil producing machine and copper foil production equipment | |
| CN210536490U (en) | Power electronic device | |
| TWI829506B (en) | Electrical connection device | |
| CN210007171U (en) | Power supply cabinet and power supply system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 905-1, 8 / F, No.8, Haidian North 2nd Street, Haidian District, Beijing 100080 Applicant after: Beijing Ultimate Frontier Deep Space Technology Co., Ltd Address before: Room 905, SOHO building, Zhongguancun, No.8, Haidian North 2nd Street, Haidian District, Beijing 100080 Applicant before: Beijing frontier exploration deep space technology Co.,Ltd. |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |