CN111968116A - Method and system for checking server mainboard mounting process - Google Patents
Method and system for checking server mainboard mounting process Download PDFInfo
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Abstract
The invention discloses a method and a system for inspecting a server mainboard mounting process, wherein the method for inspecting the server mainboard mounting process comprises the following steps: acquiring an image of the installed server mainboard to obtain an integral installation image of the server mainboard; carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages; respectively carrying out image enhancement processing on each main board segmentation subimage; splicing a plurality of main boards subjected to image enhancement processing to divide sub-images to obtain an integral installation image subjected to image enhancement processing; matching the integral installation image subjected to image enhancement processing with a preset normal installation image by using mainboard installation characteristics; and checking the installation process of the server mainboard according to the matching result of the mainboard installation characteristics. The technical scheme of the invention can solve the problems of low checking efficiency and insufficient checking precision of the server mainboard caused by the manual checking of the installation process of the server mainboard in the prior art.
Description
Technical Field
The invention relates to the technical field of servers, in particular to a method and a system for checking an installation process of a server mainboard.
Background
A server motherboard is also known as a motherboard, system board, or motherboard; the server is installed in a chassis of the server, is the most basic and important part of the server, and can meet the requirements of high stability, high myocardial infarction and high compatibility of each application of the server.
Because of the importance of the server mainboard, the batch production flow of the server mainboard has extremely high requirements on the test automation, the test efficiency and the test coverage rate of the server mainboard so as to ensure the stable performance of the server mainboard. In server motherboard production, there is usually an optimization principle according to which a motherboard installation process for guiding production operation can be formed, and the installation process should be strictly followed in the server motherboard production and assembly process. The installation process of the server mainboard is manual operation, and devices on the server mainboard are numerous, so that the installation steps are complicated; the assembly correctness of the server motherboard is checked after the assembly is finished. For optimum system performance, the installation process needs to be checked after the server motherboard is installed, for example: the number of CPUs, the number of memories, and the mounting order of each device are checked.
However, since the installation process of the server motherboard in the prior art usually uses manual inspection, the inspection efficiency is low and the inspection accuracy is not high.
Disclosure of Invention
The invention provides a method and a system for checking a server mainboard mounting process, and aims to solve the problems of low checking efficiency and low checking precision of a server mainboard caused by manual checking of the server mainboard mounting process in the prior art.
In order to achieve the above object, according to a first aspect of the present invention, there is provided an inspection method of a server motherboard mounting process, comprising:
acquiring an image of the installed server mainboard to obtain an integral installation image of the server mainboard;
carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages;
respectively carrying out image enhancement processing on each main board segmentation subimage;
splicing a plurality of main boards subjected to image enhancement processing to divide sub-images to obtain an integral installation image subjected to image enhancement processing;
matching the integral installation image subjected to image enhancement processing with a preset normal installation image by using mainboard installation characteristics;
and checking the installation process of the server mainboard according to the matching result of the mainboard installation characteristics.
Preferably, the step of performing image segmentation on the entire installation image to obtain a plurality of main board segmentation sub-images includes:
carrying out super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images;
dividing each first main board segmentation image into a plurality of image areas according to the position relation of each main board component in the first main board segmentation image;
extracting image characteristics of all adjacent image areas in the plurality of image areas to obtain the area edge gradient difference characteristics of any adjacent image area;
performing image enhancement processing on the first main board segmentation image by using the regional edge gradient difference characteristic to obtain a second main board segmentation image with the corresponding number;
and carrying out image segmentation on each second segmentation image according to the image characteristics of the main board component to obtain a plurality of main board segmentation sub-images of the integral installation image.
Preferably, the step of performing image enhancement processing on each of the main board divided sub-images includes:
dividing the main board segmentation sub-image into a plurality of image layers with different brightness according to the pixel brightness value of the main board segmentation sub-image;
respectively carrying out denoising processing and histogram equalization processing on a plurality of layers with different brightness to obtain a plurality of processed layers;
and splicing a plurality of processed image layers contained in the same main board segmentation sub-image to obtain the main board segmentation sub-image after image enhancement processing.
Preferably, the step of performing motherboard installation feature matching on the image-enhanced whole installation image and the preset normal installation image includes:
searching image areas of all main board components in the overall installation image;
and matching the image area of each mainboard component with the image area of the corresponding mainboard component in the preset normal installation image to obtain the matching result of all mainboard installation characteristics of each mainboard component in the server mainboard.
Preferably, the step of checking the mounting process of the server motherboard according to the matching result of the motherboard mounting characteristics includes:
if the integral installation image is matched with the mainboard installation characteristics of the preset normal installation image, determining that the installation of the server mainboard is correct, and outputting an installation matching correct signal;
and if the integral installation image is not matched with the mainboard installation characteristics of the preset normal installation image, determining that the installation error occurs in the server mainboard, and outputting an installation error alarm signal.
According to a second aspect of the present invention, there is provided an inspection system for a server motherboard mounting process, comprising:
the image acquisition module is used for acquiring images of the installed server mainboard to obtain an integral installation image of the server mainboard;
the image segmentation module is used for carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages;
the image processing module is used for respectively carrying out image enhancement processing on each main board segmentation sub-image;
the image splicing module is used for splicing a plurality of main board segmentation sub-images after image enhancement processing to obtain an integral installation image after the image enhancement processing;
the characteristic matching module is used for carrying out mainboard mounting characteristic matching on the integral mounting image subjected to the image enhancement processing and a preset normal mounting image;
and the process inspection module is used for inspecting the installation process of the server mainboard according to the matching result of the mainboard installation characteristics.
Preferably, the image segmentation module comprises:
the first image segmentation submodule is used for carrying out super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images;
the first image dividing submodule is used for dividing each first main board divided image into a plurality of image areas according to the position relation of each main board component in the first main board divided image;
the image feature extraction submodule is used for extracting image features of all adjacent image regions in the plurality of image regions to obtain region edge gradient difference features of any adjacent image region;
the image enhancement submodule is used for carrying out image enhancement processing on the first main board segmentation image by using the regional edge gradient difference characteristic to obtain second main board segmentation images corresponding to the number of the first main board segmentation images;
and the second image segmentation submodule is used for carrying out image segmentation on each second segmentation image according to the image characteristics of the main board component to obtain a plurality of main board segmentation sub-images of the integral installation image.
Preferably, the image processing module includes:
the second image dividing submodule is used for dividing the main board segmentation sub-image into a plurality of image layers with different brightness according to the pixel brightness value of the main board segmentation sub-image;
the image processing submodule is used for respectively carrying out denoising processing and histogram equalization processing on the layers with different brightness to obtain a plurality of processed layers;
and the layer splicing submodule is used for splicing a plurality of processed layers contained in the same main board segmentation subimage to obtain the main board segmentation subimage after the image enhancement processing.
Preferably, the feature matching module includes:
the image area searching submodule is used for searching the image area of each main board component in the whole installation image;
and the installation characteristic matching submodule is used for carrying out mainboard installation characteristic matching on the image area of each mainboard component and the image area of the corresponding mainboard component in the preset normal installation image to obtain the matching result of all mainboard installation characteristics of each mainboard component in the server mainboard.
Preferably, the process inspection module includes:
the first signal output submodule is used for determining that the server mainboard is correctly installed and outputting a signal with correct installation matching when the characteristic matching module judges that the integral installation image is matched with the mainboard installation characteristic of the preset normal installation image;
and the second signal output submodule is used for determining that the server mainboard has a mounting error and outputting a mounting error alarm signal when the characteristic matching module judges that the integral mounting image is not matched with the mainboard mounting characteristic of the preset normal mounting image.
According to the technical scheme, the inspection scheme of the server mainboard installation process can acquire the integral installation image of the server mainboard by acquiring the image of the installed server mainboard, and then perform image segmentation on the integral installation image to acquire a plurality of mainboard segmentation sub-images; then, image enhancement processing is carried out on each main board segmentation subimage, so that the light-dark contrast of different main board components of the server main board in the image is stronger, and then the integral installation image after the image enhancement processing can be obtained by splicing; the contrast of light and shade of different mainboard parts in the integral installation image after the image enhancement processing is stronger, therefore through carrying out mainboard installation characteristic matching with this integral installation image and predetermineeing normal installation image, just can confirm whether the mainboard mounting process is correct according to the mainboard installation characteristic of each mainboard part on the server mainboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic flowchart of a first method for inspecting a server motherboard installation process according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating an image segmentation method provided by the embodiment shown in FIG. 1;
FIG. 3 is a flow chart of a method for image enhancement according to the embodiment shown in FIG. 1;
FIG. 4 is a flowchart illustrating a motherboard installation feature matching method according to the embodiment shown in FIG. 1;
FIG. 5 is a schematic flow chart of a mounting process inspection method provided by the embodiment shown in FIG. 1;
fig. 6 is a schematic flowchart of a second method for inspecting a server motherboard installation process according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of an inspection system for a first server motherboard installation process according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of an image segmentation module provided in the embodiment shown in FIG. 7;
FIG. 9 is a schematic diagram of an image processing module provided in the embodiment of FIG. 7;
FIG. 10 is a schematic diagram of a feature matching module provided in the embodiment of FIG. 7;
FIG. 11 is a schematic diagram of a process inspection module according to the embodiment of FIG. 7;
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The main technical problems of the embodiment of the invention are as follows:
the installation process of the server mainboard is manual operation, and devices on the server mainboard are numerous, so that the installation steps are complicated; therefore, the assembly correctness of the server mainboard needs to be checked after the assembly of the server mainboard is finished. For optimum system performance, the installation process needs to be checked after the server motherboard is installed, for example: the number of CPUs, the number of memories, and the mounting order of each device are checked. However, in the prior art, the installation process of the server motherboard usually uses manual inspection, which results in low inspection efficiency and low inspection precision.
To solve the above problem, referring to fig. 1, fig. 1 is a schematic flow chart of an inspection method of a server motherboard installation process according to an embodiment of the present invention. As shown in fig. 1, the method for inspecting the server motherboard installation process includes the following steps:
s110: and acquiring an image of the installed server mainboard to obtain an integral installation image of the server mainboard. After the server mainboard is assembled to form a whole, the high-definition camera arranged above the server mainboard can be used for collecting images of the server mainboard, so that the integrally-installed images after the server mainboard is installed can be obtained.
S120: and carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages. Generally, when the whole installation image is subjected to image segmentation, the whole installation image needs to be segmented into a fixed number of blocks, and meanwhile, each main board segmentation sub-image needs to be numbered, so that the subsequent processing and restoration of the whole installation image of the server main board are facilitated.
As a preferred embodiment, as shown in fig. 2, the step of performing image segmentation on the entire installation image to obtain a plurality of main board segmentation sub-images specifically includes:
s121: and carrying out super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images. In the field of computer vision, image segmentation refers to the process of subdividing a digital image into a plurality of image sub-regions (i.e. sets of pixels, also called superpixels). In the super-segmentation technology, super-pixel segmentation is a small area formed by a series of pixel points which are adjacent in position and similar in characteristics such as color, brightness, texture and the like. Most of these small regions retain effective information for further image segmentation, and generally do not destroy the boundary information of objects in the image. The result of image segmentation is a set of sub-regions on the image, or a set of contour lines extracted from the image.
S122: and dividing each first main board split image into a plurality of image areas according to the position relation of each main board component in the first main board split image. The first main board segmentation image needs to be divided into a plurality of image areas, the image areas are divided by the positions of all main board components in the main board of the server, and the mounting positions of the main board components on the main board of the server are generally fixed relatively.
S123: and extracting image features of all adjacent image areas in the plurality of image areas to obtain the edge gradient difference feature of any adjacent image area. The edges of the graphic areas are the connecting positions between the adjacent graphic areas and the positions for distinguishing different main board components, and the image enhancement of different image areas can be realized by extracting the edge gradient difference characteristics of the image areas, so that the light and shade contrast effect is improved.
S124: and performing image enhancement processing on the first main board segmentation image by using the regional edge gradient difference characteristic to obtain a second main board segmentation image with the corresponding number. Because the regional edge gradient difference characteristic is obtained by extracting the image characteristics of the adjacent image regions, the bright and dark effects and the contrast of different image regions can be improved by using the regional edge gradient difference characteristic, so that the image enhancement processing is carried out on the first main board segmentation image to obtain the second main board segmentation image, and then different main board components can be clearly distinguished.
S125: and carrying out image segmentation on each second segmentation image according to the image characteristics of the main board component to obtain a plurality of main board segmentation sub-images of the integral installation image. By including the images of the plurality of main board components on the second divided image and each main board component includes a plurality of structural features, image division is performed on each second divided image, image enhancement and individual comparison can be performed on the plurality of structural features, and therefore the mounting process of the main board components can be detected more quickly and accurately.
S130: and respectively carrying out image enhancement processing on each main board segmentation sub-image. According to the embodiment of the application, the image enhancement processing can be performed by using the modes of brightness value adjustment, noise reduction, histogram equalization processing and the like, so that a clear main board segmentation sub-image is obtained.
Specifically, referring to fig. 3, the step of performing image enhancement processing on each of the main board divided sub-images includes:
s131: and dividing the main board segmentation sub-image into a plurality of image layers with different brightness according to the pixel brightness value of the main board segmentation sub-image. The pixel brightness values of different main board segmentation sub-images are different, so that the main board segmentation sub-images can be divided into a plurality of image layers with different brightness through the pixel brightness values, and the image layers with different brightness are respectively processed to obtain the main board segmentation sub-images after image enhancement processing. Specifically, because the brightness of each layer is different, the layers are arranged from high to low according to the brightness value so as to facilitate subsequent image enhancement processing. The image boundary in each layer is formed by a closed curve, so that the image in each layer forms a whole.
S132: and respectively carrying out denoising processing and histogram equalization processing on the layers with different brightness to obtain a plurality of processed layers. Specifically, for the image layer with the lowest brightness and the image layer with the highest brightness, histogram equalization processing is performed separately, then background noise is removed, and finally noise point removal is performed; and for the image layer between the lowest brightness and the highest brightness, firstly removing noise points, then removing background noise, and finally performing histogram equalization processing.
S133: and splicing a plurality of processed image layers contained in the same main board segmentation sub-image to obtain the main board segmentation sub-image after image enhancement processing. And finally, merging all the processed image layers to obtain the main board segmentation subimage after the image enhancement processing.
S140: and splicing the plurality of main boards subjected to the image enhancement processing to divide the sub-images to obtain an integral installation image subjected to the image enhancement processing. The integral installation image of the server main board is divided into a plurality of main board division sub-images according to a certain number before the image enhancement processing, so that after the image enhancement processing is carried out on the main board division sub-images, the sub-images are spliced according to the original number, the integral installation image after the image enhancement processing can be obtained, and then the integral installation image is compared with the normal installation image of the server main board.
S150: and matching the installation characteristics of the main board of the overall installation image subjected to the image enhancement processing with the preset normal installation image.
Specifically, referring to fig. 4, the step of performing motherboard installation feature matching on the image-enhanced whole installation image and the preset normal installation image specifically includes:
s151: searching image areas of all main board components in the overall installation image; because the position of the camera is relatively fixed when the camera collects the integral installation image of the main board of the server, the image areas of all the main board components in the integral installation image are relatively fixed, and the image areas of all the main board components can be found out by the preset installation sequence.
S152: and matching the image area of each mainboard component with the image area of the corresponding mainboard component in the preset normal installation image to obtain the matching result of all mainboard installation characteristics of each mainboard component in the server mainboard. When the image areas of the main board components in the whole installation image and the preset normal installation image are matched, the main board installation characteristics, such as installation positions, installation directions, installation sizes, models and the like, can be found, and therefore matching results of all the main board installation characteristics of the main board components are obtained. When all mainboard mounting characteristics of all mainboard components on the server mainboard are successfully matched, the server mainboard is correctly mounted; if the mainboard installation characteristics of the mainboard components are not matched, the installation of the server mainboard is wrong.
In the embodiment of the application, because the integral installation image is subjected to image enhancement processing, operators and related equipment can clearly determine the position and the connection relation of each mainboard component in the integral installation image, the integral installation image is matched with the preset normal installation image in the mainboard installation characteristic, if the installation position, the installation direction, the size and the model of the mainboard component and other characteristics of the mainboard component are matched, the matching result of the mainboard installation characteristic of all the mainboard components on the server mainboard can be obtained, and whether the server mainboard is installed correctly is determined.
S160: and checking the installation process of the server mainboard according to the matching result of the mainboard installation characteristics. When the mainboard mounting characteristics are all matched, the server mainboard is correctly mounted, and at the moment, the mounting process of the server mainboard is normal. If the installation characteristics of the mainboard are not matched, the problem of the installation process of the server mainboard is shown, and at the moment, alarm inspection and maintenance are required.
Referring specifically to fig. 5, the step S160: the step of checking the installation process of the server motherboard according to the matching result of the motherboard installation characteristics includes:
s161: if the integral installation image is matched with the mainboard installation characteristics of the preset normal installation image, determining that the installation of the server mainboard is correct, and outputting an installation matching correct signal;
s162: and if the integral installation image is not matched with the mainboard installation characteristics of the preset normal installation image, determining that the installation error occurs in the server mainboard, and outputting an installation error alarm signal.
In the technical scheme provided by the embodiment of the application, because the mainboard installation characteristics of the image areas of all the mainboard components in the whole installation image need to be matched, when the mainboard installation characteristics of all the mainboard components are matched, the installation of the server mainboard can be determined to be correct, so that the correct signal for installation and matching can be accurately and quickly output, and the server mainboard can be conveniently subjected to next process operation. When the mainboard installation characteristics of the mainboard components are not matched with the mainboard installation characteristics of the preset normal installation images, the installation of the server mainboard is wrong, and an installation error alarm signal is output at the moment, so that related operators can be informed to maintain the server mainboard in time.
As a preferred embodiment, please refer to fig. 6, and fig. 6 is a flowchart illustrating an inspection method of a server motherboard installation process according to an embodiment of the present invention. As shown in fig. 6, the method for inspecting the server motherboard mounting process includes the following steps:
s210: the server mainboard is assembled to form a whole.
S220: the high-definition camera arranged above the server mainboard collects the integral installation image.
S230: the collected installation image is divided to form a plurality of divided images, and each divided image is numbered. The segmentation operation is specifically as follows:
acquiring a first segmentation image corresponding to an installation image to be segmented, wherein the first segmentation image is formed after the image to be segmented is subjected to super-segmentation, and the first segmentation image comprises a plurality of areas; extracting features of two adjacent regions of the first segmentation image, and acquiring region edge gradient difference features of every two adjacent regions in the current first segmentation image according to a preset algorithm; enhancing the first segmentation image according to the region edge gradient difference characteristic to obtain a second segmentation image; and inputting the second segmentation image into an image segmentation network to obtain a segmentation result, and completing the segmentation of the installation image. By adopting the image segmentation method, the embodiment of the application can reduce the occurrence of image segmentation errors, improve the accuracy of image segmentation and further improve the inspection precision.
S240: and transmitting the numbered segmentation images to a central processing unit for processing after image enhancement. The image enhancement steps are specifically as follows: dividing pixels of the collected image into a plurality of layers according to the brightness values, wherein the brightness of each layer is different, and arranging each layer from high to low according to the brightness values, and the boundary of the image in each layer is formed by a closed curve; for the image layer with the lowest brightness and the image layer with the largest brightness, histogram equalization processing is carried out independently, then background noise is removed, and finally noise point removal is carried out; removing noise points of the image layers between the lowest brightness and the highest brightness, removing background noise, and finally performing histogram equalization processing; and finally merging all the processed image layers into an image after image enhancement. The image enhancement method adopted in the step reduces the global brightness difference of the image, enhances the image contrast, effectively inhibits noise and further improves the image definition.
S250: the central processing unit transmits the processed image to the comparison module to be matched with a preset normal image;
s260: if the images are matched, an installation matching signal is output, and if the images are not matched, an alarm prompt signal is output.
In summary, according to the inspection method for the server motherboard installation process provided by the embodiment of the application, the image acquisition is performed on the installed server motherboard, so that the overall installation image of the server motherboard can be obtained, and then the image segmentation is performed on the overall installation image, so that a plurality of motherboard segmentation sub-images can be obtained; then, image enhancement processing is carried out on each main board segmentation subimage, so that the light-dark contrast of different main board components of the server main board in the image is stronger, and then the integral installation image after the image enhancement processing can be obtained by splicing; the contrast of light and shade of different mainboard parts in the integral installation image after the image enhancement processing is stronger, therefore through carrying out mainboard installation characteristic matching with this integral installation image and predetermineeing normal installation image, just can confirm whether the mainboard mounting process is correct according to the mainboard installation characteristic of each mainboard part on the server mainboard.
In addition, in order to implement the method, the following embodiments of the present application further provide an inspection system for a server motherboard installation process, and the functions of the method can be implemented by the following inspection system for a server motherboard installation process, and since the method is already mentioned in specific operation steps, repeated descriptions are omitted.
Referring specifically to fig. 7, the present invention provides an inspection system for a server motherboard installation process, including:
the image acquisition module 110 is configured to acquire an image of the installed server motherboard to obtain an overall installation image of the server motherboard;
the image segmentation module 120 is configured to perform image segmentation on the overall installation image to obtain a plurality of main board segmentation sub-images;
the image processing module 130 is configured to perform image enhancement processing on each of the main board divided sub-images;
the image splicing module 140 is used for splicing a plurality of main board segmentation sub-images after image enhancement processing to obtain an integral installation image after the image enhancement processing;
the feature matching module 150 is used for matching the mainboard installation features of the overall installation image subjected to the image enhancement processing with the preset normal installation image;
and a process checking module 160 for checking the installation process of the server motherboard according to the matching result of the motherboard installation characteristics.
According to the inspection system for the server mainboard installation process, the server mainboard after installation is subjected to image acquisition, so that an overall installation image of the server mainboard can be obtained, and then the overall installation image is subjected to image segmentation, so that a plurality of mainboard segmentation sub-images can be obtained; then, image enhancement processing is carried out on each main board segmentation subimage, so that the light-dark contrast of different main board components of the server main board in the image is stronger, and then the integral installation image after the image enhancement processing can be obtained by splicing; the contrast of light and shade of different mainboard parts in the integral installation image after the image enhancement processing is stronger, therefore through carrying out mainboard installation characteristic matching with this integral installation image and predetermineeing normal installation image, just can confirm whether the mainboard mounting process is correct according to the mainboard installation characteristic of each mainboard part on the server mainboard.
As a preferred embodiment, as shown in fig. 8, the image segmentation module 120 specifically includes:
the first image segmentation submodule 121 is configured to perform super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images;
a first image dividing sub-module 122, configured to divide each first motherboard segmented image into a plurality of image areas according to a positional relationship of each motherboard component in the first motherboard segmented image;
the image feature extraction submodule 123 is configured to perform image feature extraction on all adjacent image regions in the multiple image regions to obtain a region edge gradient difference feature of any adjacent image region;
the image enhancement module 124 is configured to perform image enhancement processing on the first main board segmented image by using the regional edge gradient difference feature, so as to obtain a second main board segmented image corresponding to the number of the first main board segmented image;
and a second image segmentation submodule 125, configured to perform image segmentation on each second segmentation image according to the image features of the main board component, so as to obtain a plurality of main board segmentation sub-images of the overall installation image.
As a preferred embodiment, as shown in fig. 9, the image processing module 130 specifically includes:
the second image dividing submodule 131 is configured to divide the main board divided sub-image into a plurality of image layers with different brightness according to the pixel brightness value of the main board divided sub-image;
the image processing submodule 132 is configured to perform denoising processing and histogram equalization processing on the multiple image layers with different brightness, respectively, to obtain multiple processed image layers;
the layer splicing submodule 133 is configured to splice multiple processed layers included in the same main board segmentation sub-image, so as to obtain a main board segmentation sub-image after the image enhancement processing.
As a preferred embodiment, as shown in fig. 10, the feature matching module 150 specifically includes:
an image area search sub-module 151 for searching an image area of each main board component in the overall installation image;
and the installation feature matching submodule 152 is configured to perform mainboard installation feature matching on the image area of each mainboard component and the image area of the corresponding mainboard component in the preset normal installation image, so as to obtain a matching result of all mainboard installation features of each mainboard component in the server mainboard.
As a preferred embodiment, as shown in fig. 11, the process inspection module 160 specifically includes:
a first signal output sub-module 161, configured to determine that the server motherboard is correctly installed and output an installation matching correct signal when the feature matching module determines that the overall installation image matches the motherboard installation feature of the preset normal installation image;
and a second signal output sub-module 162, configured to determine that a mounting error occurs in the server motherboard and output a mounting error alarm signal when the feature matching module determines that the overall mounting image is not matched with the motherboard mounting feature of the preset normal mounting image.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
It should be noted that in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method for checking a server mainboard mounting process is characterized by comprising the following steps:
acquiring an image of the installed server mainboard to obtain an integral installation image of the server mainboard;
carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages;
respectively carrying out image enhancement processing on each main board segmentation subimage;
splicing a plurality of the main boards subjected to image enhancement processing to divide sub-images to obtain the integral installation image subjected to image enhancement processing;
matching the integral installation image subjected to image enhancement processing with a preset normal installation image by using mainboard installation characteristics;
and checking the installation process of the server mainboard according to the matching result of the mainboard installation characteristics.
2. The method for inspecting a server motherboard mounting process according to claim 1, wherein said step of performing image segmentation on the entire mounting image to obtain a plurality of motherboard segmentation subimages comprises:
performing super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images;
dividing each first main board segmentation image into a plurality of image areas according to the position relation of each main board component in the first main board segmentation image;
extracting image features of all adjacent image areas in the plurality of image areas to obtain the edge gradient difference value features of any adjacent image area;
performing image enhancement processing on the first main board segmentation image by using the region edge gradient difference characteristic to obtain a second main board segmentation image with a corresponding number;
and carrying out image segmentation on each second segmentation image according to the image characteristics of the main board component to obtain a plurality of main board segmentation sub-images of the integral installation image.
3. The method for inspecting a mounting process of a server motherboard according to claim 1, wherein said step of performing image enhancement processing on each of the motherboard segment sub-images comprises:
dividing the main board segmentation sub-image into a plurality of image layers with different brightness according to the pixel brightness value of the main board segmentation sub-image;
respectively carrying out denoising processing and histogram equalization processing on the layers with different brightness to obtain a plurality of processed layers;
and splicing the processed layers contained in the same main board segmentation subimage to obtain the main board segmentation subimage after image enhancement processing.
4. The method for inspecting a server motherboard installation process according to claim 1, wherein said step of performing motherboard installation feature matching on the image-enhanced whole installation image and the preset normal installation image comprises:
searching image areas of all main board components in the integral installation image;
and matching the image area of each mainboard component with the image area of the corresponding mainboard component in the preset normal installation image to obtain the matching result of all the mainboard installation characteristics of each mainboard component in the server mainboard.
5. The method for inspecting a mounting process of a server motherboard according to claim 1, wherein said step of inspecting a mounting process of a server motherboard according to a matching result of a motherboard mounting characteristic includes:
if the integral installation image is matched with the mainboard installation characteristics of a preset normal installation image, determining that the server mainboard is correctly installed, and outputting an installation matching correct signal;
and if the integral installation image is not matched with the mainboard installation characteristics of the preset normal installation image, determining that the installation error of the server mainboard occurs, and outputting an installation error alarm signal.
6. An inspection system for a server motherboard mounting process, comprising:
the image acquisition module is used for acquiring images of the installed server mainboard to obtain an integral installation image of the server mainboard;
the image segmentation module is used for carrying out image segmentation on the integral installation image to obtain a plurality of main board segmentation subimages;
the image processing module is used for respectively carrying out image enhancement processing on each main board segmentation sub-image;
the image splicing module is used for splicing a plurality of the main board segmentation sub-images after image enhancement processing to obtain the integral installation image after the image enhancement processing;
the characteristic matching module is used for carrying out mainboard mounting characteristic matching on the integral mounting image subjected to the image enhancement processing and a preset normal mounting image;
and the process inspection module is used for inspecting the installation process of the server mainboard according to the matching result of the mainboard installation characteristics.
7. The system for inspecting a mounting process of a server motherboard according to claim 6, wherein said image segmentation module comprises:
the first image segmentation submodule is used for carrying out super-segmentation processing on the whole main board segmentation subimage to obtain a plurality of first main board segmentation images;
the first image dividing submodule is used for dividing each first main board divided image into a plurality of image areas according to the position relation of each main board component in the first main board divided image;
the image feature extraction submodule is used for extracting image features of all adjacent image regions in the plurality of image regions to obtain region edge gradient difference features of any adjacent image region;
the image enhancement submodule is used for carrying out image enhancement processing on the first main board segmentation image by using the regional edge gradient difference characteristic to obtain second main board segmentation images corresponding to the number of the first main board segmentation images;
and the second image segmentation submodule is used for carrying out image segmentation on each second segmentation image according to the image characteristics of the main board component to obtain a plurality of main board segmentation sub-images of the integral installation image.
8. The system for inspecting a mounting process of a server motherboard according to claim 6, wherein said image processing module comprises:
the second image dividing submodule is used for dividing the main board segmentation subimage into a plurality of image layers with different brightness according to the pixel brightness value of the main board segmentation subimage;
the image processing submodule is used for respectively carrying out denoising processing and histogram equalization processing on the layers with different brightness to obtain a plurality of processed layers;
and the layer splicing submodule is used for splicing the plurality of processed layers contained in the same main board segmentation subimage to obtain the main board segmentation subimage after the image enhancement processing.
9. The system of claim 6, wherein the feature matching module comprises:
the image area searching submodule is used for searching the image area of each main board component in the integral installation image;
and the installation characteristic matching submodule is used for carrying out mainboard installation characteristic matching on the image area of each mainboard component and the image area of the corresponding mainboard component in the preset normal installation image to obtain the matching result of all mainboard installation characteristics of each mainboard component in the server mainboard.
10. The system for inspecting a server motherboard installation process according to claim 6, wherein said process inspection module comprises:
the first signal output submodule is used for determining that the server mainboard is correctly installed and outputting an installation matching correct signal when the feature matching module judges that the integral installation image is matched with the mainboard installation feature of a preset normal installation image;
and the second signal output submodule is used for determining that the server mainboard has a mounting error when the characteristic matching module judges that the integral mounting image is not matched with the mainboard mounting characteristic of the preset normal mounting image, and outputting a mounting error alarm signal.
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| CN202010955428.7A CN111968116A (en) | 2020-09-11 | 2020-09-11 | Method and system for checking server mainboard mounting process |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965862A (en) * | 2021-02-09 | 2021-06-15 | 山东英信计算机技术有限公司 | Server visual inspection method, system, terminal and storage medium |
| CN113450356A (en) * | 2021-09-01 | 2021-09-28 | 蘑菇物联技术（深圳）有限公司 | Method, apparatus, and storage medium for recognizing mounting state of target component |
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2020
- 2020-09-11 CN CN202010955428.7A patent/CN111968116A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965862A (en) * | 2021-02-09 | 2021-06-15 | 山东英信计算机技术有限公司 | Server visual inspection method, system, terminal and storage medium |
| CN113450356A (en) * | 2021-09-01 | 2021-09-28 | 蘑菇物联技术（深圳）有限公司 | Method, apparatus, and storage medium for recognizing mounting state of target component |
| CN113450356B (en) * | 2021-09-01 | 2021-12-03 | 蘑菇物联技术（深圳）有限公司 | Method, apparatus, and storage medium for recognizing mounting state of target component |
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