CN111954393A - Positioning fixture for welding - Google Patents
Positioning fixture for welding Download PDFInfo
- Publication number
- CN111954393A CN111954393A CN202010393122.7A CN202010393122A CN111954393A CN 111954393 A CN111954393 A CN 111954393A CN 202010393122 A CN202010393122 A CN 202010393122A CN 111954393 A CN111954393 A CN 111954393A
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- China
- Prior art keywords
- plate
- insulating substrate
- positioning jig
- soldering
- electronic component
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- 238000003466 welding Methods 0.000 title claims description 37
- 239000000758 substrate Substances 0.000 claims abstract description 79
- 238000005476 soldering Methods 0.000 claims abstract description 49
- 230000002093 peripheral effect Effects 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 description 11
- 238000000034 method Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Provided is a positioning jig for soldering, which can reduce the amount of positional fluctuation of an electronic component even when the size of an insulating substrate varies due to manufacturing fluctuation of the insulating substrate. A positioning jig (1) for soldering has a plate-like member (2), and the plate-like member (2) is assembled to an insulating substrate (11) in a state of being in contact with the upper surfaces of circuit patterns (14a, 14b, 14c, 14 d). The plate-like member (2) has: an opening (4) formed in the plate-like member (2) so that the electronic component (15) can be exposed; and a pair of projections (5) which are formed on the peripheral edge of the opening (4) of the plate-like member (2), project toward the insulating substrate (11), and can be inserted into a groove (16) formed between the circuit patterns (14a, 14b) of the insulating substrate (11).
Description
Technical Field
The invention relates to a positioning clamp for welding.
Background
In assembling a power module, a solder material is generally used as a bonding material for electronic components such as chip resistors and capacitors that bridge a plurality of circuit patterns formed on an insulating substrate. Currently, solder paste obtained by kneading flux and spherical solder is used as a solder material. In this case, cream solder is applied to a part of the circuit pattern by printing, and then an electronic component is mounted and reflowed to melt the solder, and then the solder is cleaned to remove the flux.
In recent years, a soldering process using a solder paste instead of a solder paste has been widely used, and since no flux is used, cleaning is not required, and manufacturing cost can be reduced.
However, since the ability to hold the electronic component is reduced by changing from cream solder to board solder, a positioning jig for soldering is required for aligning the electronic component at the time of soldering. The positioning jig for soldering performs positioning by the outer shape of the circuit pattern or the base plate, but due to manufacturing variations thereof, the electronic component is displaced and the electronic component is tilted. Therefore, the bonding between the electronic component and the circuit pattern may be incomplete, and in order to solve such a problem, it is considered to perform positioning around the circuit pattern on which the electronic component is mounted.
For example, patent document 1 discloses a method of mounting a small-sized electronic component by providing a frame for fixing to a circuit board and a recess for fixing the small-sized electronic component in a fixture and preventing positional displacement between a terminal of the small-sized electronic component and an electrode on the board at the time of soldering.
For example, patent document 2 discloses a structure in which a positioning jig is used as a positioning portion for positioning, and a recess portion to be fitted to a lower portion of the positioning jig is provided in a substrate.
Patent document 1: japanese laid-open patent publication No. 62-250687
Patent document 2: japanese patent laid-open publication No. 2009-231379
However, the technique described in patent document 1 has a problem that, when the size of the circuit board varies due to manufacturing variations of the circuit board, the position of the fixture is displaced, and thus the amount of positional variations of the electronic component increases.
In addition, in the technique described in patent document 2, since the substrate is positioned at a plurality of positions from the end portion to the end portion, a gap between the substrate and the positioning jig is required in consideration of thermal expansion of the substrate at the time of soldering. Therefore, there is a problem that the amount of positional fluctuation of the electronic component becomes large.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a positioning jig for soldering capable of reducing the amount of positional fluctuation of an electronic component even when the size of an insulating substrate varies due to manufacturing fluctuation of the insulating substrate.
The positioning jig for soldering according to the present invention is a positioning jig for soldering which is assembled to an insulating substrate in a step of soldering an electronic component bridging between a plurality of circuit patterns formed on the insulating substrate, the positioning jig for soldering having a plate-like member assembled to the insulating substrate in a state of being in contact with an upper surface of the circuit patterns, the plate-like member having: an opening portion formed in the plate-like member so that the electronic component can be exposed; and a pair of projections formed at a peripheral edge portion of the opening portion of the plate-like member and projecting toward the insulating substrate side so as to be insertable into a groove formed between the plurality of circuit patterns of the insulating substrate.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, even when the size of the insulating substrate varies due to manufacturing variations of the insulating substrate, the amount of positional variations of the electronic component can be reduced.
Drawings
Fig. 1 is a rear oblique view of a welding positioning jig according to embodiment 1.
Fig. 2 is a cross-sectional view showing a state in which the positioning jig for soldering is assembled to the insulating substrate.
Fig. 3 is a cross-sectional view showing a state in which the positioning jig for soldering is assembled to the insulating substrate.
Fig. 4 is a perspective view showing a state where an electronic component is mounted on an insulating substrate.
Fig. 5 is a cross-sectional view showing a state in which the positioning jig for soldering according to embodiment 2 is assembled to an insulating substrate.
Fig. 6 is a cross-sectional view showing a state in which the positioning jig for soldering according to embodiment 3 is assembled to an insulating substrate.
Fig. 7 is a cross-sectional view showing a state in which the positioning jig for soldering according to embodiment 4 is assembled to an insulating substrate.
Fig. 8 is a cross-sectional view showing a state in which the positioning jig for soldering according to the modification of embodiment 4 is assembled to an insulating substrate.
Fig. 9 is a cross-sectional view showing a state in which the positioning jig for soldering according to embodiment 5 is assembled to an insulating substrate.
Fig. 10 is a sectional view of a welding positioning jig according to embodiment 6.
Fig. 11 is a cross-sectional view showing a state where a positioning jig for soldering, which is not provided with a boss, is assembled to an insulating substrate.
Description of the reference numerals
1. 1A, 1B, 1C, 1D, 1E, 1F soldering positioning jig, 2 plate-like member, 4 opening, 5 protrusion, 6 detachable member, 7 circumferential groove (circumferential groove), 8a protrusion, 8B mounting portion, 9 holding hole, 11 insulating substrate, 14a, 14B, 14C, 14D, 14E circuit pattern, 15 electronic member, 16 groove.
Detailed Description
< embodiment 1>
As shown in fig. 1 to 3, the positioning jig for soldering 1 is a jig which is assembled to the insulating substrate 11 in a step of soldering the electronic component 15.
First, the insulating substrate 11 and the electronic component 15 will be described with reference to fig. 4. Fig. 4 is a perspective view showing a state where the electronic component 15 is mounted on the insulating substrate 11. The insulating substrate 11 includes a base plate 12 and an insulating layer 13 formed on an upper surface of the base plate 12. Circuit patterns 14a, 14b, 14c, and 14d are formed on the upper surface of the insulating substrate 11. The electronic component 15 is, for example, a chip resistor, a capacitor, or the like, and has a rectangular shape in a plan view. The electronic component 15 is disposed in a state of being bridged between the circuit patterns 14a, 14b, and is bonded to the circuit patterns 14a, 14b by soldering in this state.
The description returns to the welding positioning jig 1. As shown in fig. 1 to 3, the welding positioning jig 1 includes a plate-like member 2 having a rectangular shape in a plan view. The plate-like member 2 is assembled to the insulating substrate 11 in a state of being in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, and 14d, and includes a frame portion 3, an opening portion 4, and a pair of protrusions 5.
The frame 3 is formed over the entire periphery of the peripheral edge of the plate-like member 2. The frame 3 projects downward from the lower surface of the peripheral edge of the plate-like member 2, and abuts against the upper surface of the insulating substrate 11 in a state where the positioning jig for soldering 1 is assembled to the insulating substrate 11. The opening 4 is rectangular in plan view and is formed in the center of the plate-like member 2. The outline of the opening 4 in plan view is larger than the outline of the electronic component 15 in plan view, and the electronic component 15 can be exposed from the opening 4.
The pair of projections 5 are formed at positions facing each other, that is, positions in the front-rear direction of the paper surface of fig. 1, at the peripheral edge portions of the opening 4 of the plate-like member 2. The pair of projections 5 project from this position toward the insulating substrate 11, i.e., downward, and can be inserted into the grooves 16 formed between the circuit patterns 14a and 14 b. The front-back direction on the paper surface of fig. 1 is referred to as a front-back direction, and the left-right direction on the paper surface of fig. 1 is referred to as a left-right direction.
Next, a method of positioning the welding positioning jig 1 with respect to the insulating substrate 11 will be described. As shown in fig. 2, the end portions of the plate-like member 2 in the left-right direction are located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14a and 14b, and a gap is formed between the inner wall of the frame 3 and the outer peripheral ends of the circuit patterns 14a and 14 b. The pair of projections 5 are inserted into the grooves 16 formed between the circuit patterns 14a and 14b, whereby the welding positioning jig 1 is positioned in the lateral direction.
As shown in fig. 3, the front-rear direction end of the plate-like member 2 is located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14c and 14d, and the inner wall of the frame 3 abuts the outer peripheral ends of the circuit patterns 14c and 14 d. The welding positioning jig 1 is positioned in the front-rear direction by bringing the inner wall of the frame 3 of the plate-like member 2 into contact with the outer peripheral ends of the circuit patterns 14c and 14 d.
In this way, in a state where the positioning jig 1 for soldering is positioned with respect to the insulating substrate 11, the electronic component 15 is inserted through the opening 4, is disposed so as to bridge between the circuit patterns 14a and 14b, and is bonded to the circuit patterns 14a and 14b by soldering. Here, since the electronic component 15 is mounted so as to bridge between the circuit patterns 14a and 14b, the positioning in the left-right direction is more important than the positioning in the front-rear direction.
Next, the effects of the positioning jig for soldering 1 according to embodiment 1 will be described in comparison with the case where the positioning jig for soldering 101 not provided with the boss portion 5 is assembled to the insulating substrate 11. Fig. 11 is a cross-sectional view showing a state where the positioning jig 101 for soldering, which is not provided with the boss portion 5, is assembled to the insulating substrate 11.
As shown in fig. 11, since the positioning jig 101 for soldering, which is not provided with the boss portion 5, is assembled to the insulating substrate 11 with reference to the outer peripheral ends of the circuit patterns 14a and 14b on which the electronic component 15 is mounted, when the size of the insulating substrate 11 changes due to manufacturing variations of the insulating substrate 11, the positioning jig 101 for soldering is displaced, so that the electronic component 15 is displaced, the electronic component 15 is tilted, and the bonding between the electronic component 15 and the circuit patterns 14a and 14b is incomplete.
In contrast, the positioning jig 1 for soldering according to embodiment 1 includes the plate-like member 2 assembled to the insulating substrate 11 in a state of being in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, and 14d, and the plate-like member 2 includes: an opening 4 formed in the plate-like member 2 so that the electronic component 15 can be exposed; and a pair of projections 5 formed on the peripheral edge of the opening 4 of the plate-like member 2 and projecting toward the insulating substrate 11 so as to be inserted into a groove 16 formed between the circuit patterns 14a, 14b of the insulating substrate 11.
Therefore, since the positioning jig 1 for soldering is positioned with respect to the insulating substrate 11 by inserting the pair of bosses 5 into the grooves 16 formed between the circuit patterns 14a and 14b of the insulating substrate 11, the amount of positional fluctuation of the electronic component 15 is reduced and the position of the electronic component 15 is stabilized without being affected by manufacturing fluctuation of the insulating substrate 11. This allows the electronic component 15 and the circuit patterns 14a and 14b to be bonded in a stable state, and thus improves the yield of the product in which the electronic component 15 is mounted on the circuit patterns 14a and 14b of the insulating substrate 11.
Further, since the soldering positioning jig 1 performs positioning at 2 positions near the central portion of the insulating substrate 11 on which the electronic component 15 is mounted, the soldering positioning jig 1 does not require high dimensional accuracy. This can suppress an increase in the manufacturing cost of the positioning jig for welding 1. In addition, since this positioning method is less susceptible to the influence of thermal expansion of the insulating substrate 11, the gap between the insulating substrate 11 and the welding positioning jig 1 can be reduced. This also reduces the amount of positional fluctuation of the electronic component 15, and stabilizes the position of the electronic component 15.
< embodiment 2>
Next, the welding positioning jig 1A according to embodiment 2 will be described. Fig. 5 is a cross-sectional view showing a state in which the positioning jig for soldering 1A according to embodiment 2 is assembled to the insulating substrate 11. In embodiment 2, the same components as those described in embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.
As shown in fig. 5, in embodiment 2, 2 electronic components 15 are mounted, and in accordance therewith, the plate-like member 2 has 2 openings 4 and 2 pairs of projections 5. One electronic component 15 is arranged in a state of bridging between the circuit patterns 14a, 14e, and the other electronic component 15 is arranged in a state of bridging between the circuit patterns 14e, 14 b. In addition, when 3 or more electronic components 15 are mounted, the number of the opening 4 and the pair of bosses 5 may be adjusted in accordance therewith.
As described above, in the welding positioning jig 1A according to embodiment 2, the plate-like member 2 has a plurality of openings 4 and a plurality of pairs of projections 5. Therefore, even when 2 or more electronic components 15 are mounted, the position fluctuation amount of the electronic components 15 is reduced and the position of the electronic components 15 is stabilized without being affected by the manufacturing fluctuation of the insulating substrate 11.
< embodiment 3>
Next, the welding positioning jig 1B according to embodiment 3 will be described. Fig. 6 is a cross-sectional view showing a state in which the positioning jig for soldering 1B according to embodiment 3 is assembled to the insulating substrate 11. In embodiment 3, the same components as those described in embodiments 1 and 2 are denoted by the same reference numerals, and description thereof is omitted.
When the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d are warped into a convex shape due to the influence of heat, if the center portion of the soldering positioning jig 1 is raised from the circuit patterns 14a, 14b, 14c, and 14d, the electronic component 15 may be displaced when the electronic component 15 to be mounted is located at the center portion, and the product may be defective in appearance.
To solve such a problem, in embodiment 3, as shown in fig. 6, a portion of the plate-like member 2 including a part of the peripheral edge of the opening 4 is detachably attached.
The welding positioning jig 1B further includes a detachable member 6 detachable from the plate-like member 2. The detachable member 6 constitutes a portion of the plate-like member 2 including a part of the peripheral edge of the opening 4 in a state attached to the plate-like member 2. Specifically, the detachable member 6 constitutes a peripheral edge portion of the opening 4 on the side where the boss portion 5 is not formed. The attachment/detachment member 6 includes: a contact portion 6a which, in a state of being mounted on the plate-like member 2, projects toward the insulating substrate 11 and contacts the circuit patterns 14a and 14 b; and an attachment portion 6b attached to the plate-like member 2. In addition, the abutting portion 6a and the mounting portion 6b are integrally formed.
The plate-like member 2 further has a circumferential groove 7 for holding the outer circumferential portion of the detachable member 6. The circumferential groove 7 is formed in the plate-like member 2 at a position corresponding to the mounting portion 6b of the detachable member 6. Since the width of the circumferential groove 7 in the vertical direction is larger than the thickness of the mounting portion 6b, the detachable member 6 can move in the vertical direction in a state of being mounted on the plate-like member 2. Thus, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d are warped in a downwardly convex shape, the contact portion 6a of the detachable member 6 can be brought into contact with the upper surfaces of the circuit patterns 14a and 14b of the insulating substrate 11.
As described above, the positioning jig for welding 1B according to embodiment 3 further includes the detachable member 6 detachable from the plate-like member 2, the detachable member 6 includes the abutting portion 6a that includes a part of the peripheral edge portion of the opening 4 of the plate-like member 2 and protrudes toward the insulating substrate 11 side to abut against the circuit patterns 14a and 14B in a state in which the detachable member 6 is attached to the plate-like member 2, and the plate-like member 2 further includes the circumferential groove 7 that holds the outer peripheral portion of the detachable member 6.
Therefore, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d are warped into a convex shape due to the influence of heat, the position of the electronic component 15 can be stabilized and the product can be prevented from being a defective product by bringing the contact portion 6a of the detachable component 6 into contact with the upper surfaces of the circuit patterns 14a and 14b of the insulating substrate 11.
Further, since the abutting portion 6a is formed integrally with the mounting portion 6B in the detachable member 6, the abutting portion 6a and the mounting portion 6B do not come loose, which contributes to improvement in workability in assembling and disassembling the positioning jig for soldering 1B to the insulating substrate 11.
< embodiment 4>
Next, a welding positioning jig 1C according to embodiment 4 and a welding positioning jig 1D according to a modification of embodiment 4 will be described. Fig. 7 is a cross-sectional view showing a state in which the positioning jig for soldering 1C according to embodiment 4 is assembled to the insulating substrate 11. Fig. 8 is a cross-sectional view showing a state in which the positioning jig for soldering 1D according to the modification of embodiment 4 is assembled to the insulating substrate 11. In embodiment 4, the same components as those described in embodiments 1 to 3 are denoted by the same reference numerals, and description thereof is omitted.
The circuit patterns 14a, 14b, 14c, and 14d are usually formed by etching, but depending on the etching conditions during manufacturing, the cross-sectional shapes of the circuit patterns 14a, 14b, 14c, and 14d may be trapezoidal with the upper base wider than the lower base, or trapezoidal with the lower base wider than the upper base. In this case, if the boss portion 5 has a rectangular sectional shape, the engagement with the groove 16 formed between the circuit patterns 14a, 14b becomes poor, and therefore, the electronic component 15 is displaced, the electronic component 15 is tilted, and the joining of the electronic component 15 and the circuit patterns 14a, 14b becomes incomplete.
To solve such a problem, in embodiment 4, the tip end surface of the boss portion 5 is formed into a curved surface. Specifically, as shown in fig. 7, the tip end surface of the boss 5 has a semi-conical shape. Alternatively, as shown in fig. 8, the tip surface of the boss 5 may be hemispherical. This makes the engagement between the boss 5 and the groove 16 formed between the circuit patterns 14a and 14b good. In fig. 7 and 8, the cross-sectional shapes of the circuit patterns 14a and 14b are shown as trapezoids having a lower base wider than an upper base, but the same effect can be obtained also in the case of a trapezoid having a lower base wider than a lower base.
As described above, the welding positioning jig 1C according to embodiment 4 and the welding positioning jig 1D according to the modification of embodiment 4 have the curved distal end surface of the boss portion 5. Therefore, by making the convex portion 5 evenly contact the inner walls of both sides of the groove 16 formed between the circuit patterns 14a and 14b, the movement of moving the convex portion 5 to the center of the groove 16, that is, centering is facilitated, and the position of the electronic component 15 is stabilized.
< embodiment 5>
Next, the welding positioning jig 1E according to embodiment 5 will be described. Fig. 9 is a cross-sectional view showing a state in which the positioning jig for soldering 1E according to embodiment 5 is assembled to the insulating substrate 11. In embodiment 5, the same components as those described in embodiments 1 to 4 are denoted by the same reference numerals, and description thereof is omitted.
When the etching accuracy in manufacturing the circuit patterns 14a, 14b, 14c, and 14d is poor, the gap between the bump 5 and the circuit patterns 14a and 14b becomes large, the electronic component 15 is displaced, the electronic component 15 is tilted, and the bonding between the electronic component 15 and the circuit patterns 14a and 14b is incomplete.
To solve such a problem, in embodiment 5, as shown in fig. 9, each of the projections 5 is formed into a pair of hook shapes so as to be capable of fitting into the groove 16 formed between the circuit patterns 14a and 14 b.
Each of the protrusions 5 is formed in a pair of hook shapes that elastically bends the tip side inward. Each of the projections 5 is opened in a state where the pair of hook-like shapes is wider than the width of the groove 16 in the lateral direction in a state where the projection is not inserted into the groove 16, and is closed in a state where the pair of hook-like shapes is narrower than the width of the groove 16 in the lateral direction in a state where the projection is inserted into the groove 16. Thereby, each boss 5 can be fitted into the groove 16.
As described above, in the positioning jig for welding 1E according to embodiment 5, each of the projections 5 is formed into a pair of hook shapes so as to be able to fit into the groove 16 formed between the circuit patterns 14a and 14 b. Therefore, the gap between the bump 5 and the circuit patterns 14a and 14b becomes small, and the position of the electronic component 15 is stabilized.
< embodiment 6>
Next, the welding positioning jig 1F according to embodiment 6 will be described. Fig. 10 is a sectional view of a welding positioning jig 1F according to embodiment 6. In embodiment 6, the same components as those described in embodiments 1 to 5 are denoted by the same reference numerals, and description thereof is omitted.
In embodiment 5, since the boss portion 5 is formed integrally with the plate-like member 2, when the boss portion 5 is worn or damaged, it is necessary to replace the entire welding positioning jig 1E, and the operating cost of the welding positioning jig 1E increases.
To solve such a problem, as shown in fig. 10, boss 8a and mounting portion 8b on the trailing end side thereof are provided as separate members and can be attached to and detached from plate-like member 2.
The welding positioning jig 1F has a detachable member 8 detachable from the plate-like member 2, instead of the boss portion 5. The detachable member 8 has a pair of hook-shaped projections 8a that can be fitted into the grooves 16 formed between the circuit patterns 14a and 14b, and a mounting portion 8b that is formed at the trailing end side of the projections 8a and is mounted to the plate-like member 2. The plate-like member 2 further has a holding hole 9 for holding the mounting portion 8b of the detachable member 8. The holding holes 9 are formed at the peripheral edge portions of the openings 4 of the plate-like member 2 at positions facing each other in the front-rear direction, and the detachable members 8 are attached to the holding holes 9.
As described above, in positioning jig for welding 1F according to embodiment 6, boss portion 8a and mounting portion 8b on the trailing end side thereof are detachable from plate-like member 2, and plate-like member 2 further includes holding hole 9 for holding mounting portion 8 b.
Therefore, when the boss portion 8a is worn or damaged, only the detachable member 8 including the boss portion 8a and the attachment portion 8b on the trailing end side thereof needs to be replaced, and therefore, an increase in the operating cost of the positioning jig for welding 1F can be suppressed.
In the present invention, the embodiments may be freely combined within the scope of the invention, and the embodiments may be appropriately modified or omitted.
Claims (6)
1. A positioning jig for soldering, which is assembled to an insulating substrate in a step of soldering an electronic component bridging between a plurality of circuit patterns formed on the insulating substrate,
the positioning jig for soldering includes a plate-like member assembled to the insulating substrate in a state of being in contact with an upper surface of the circuit pattern,
the plate-like member has:
an opening portion formed in the plate-like member so that the electronic component can be exposed; and
and a pair of projections formed on a peripheral edge portion of the opening portion of the plate-like member and projecting toward the insulating substrate side so as to be insertable into a groove formed between the plurality of circuit patterns of the insulating substrate.
2. The positioning jig for welding according to claim 1,
the plate-like member has a plurality of the openings and a plurality of pairs of the projections.
3. The positioning jig for welding according to claim 1 or 2,
the welding positioning jig further comprises a detachable member detachable from the plate-like member,
the detachable member has an abutting portion which includes a part of a peripheral edge portion of the opening portion of the plate-like member in a state of being attached to the plate-like member, and which protrudes toward the insulating substrate side to abut against the circuit pattern,
the plate-like member further includes a circumferential groove for holding an outer circumferential portion of the detachable member.
4. The positioning jig for welding according to claim 1 or 2,
the front end face of the protruding portion is a curved surface.
5. The positioning jig for welding according to claim 1 or 2,
each of the projections is formed into a pair of hook shapes so as to be capable of fitting into the groove.
6. The positioning jig for welding according to claim 5,
the boss and the mounting portion at the trailing end side thereof are detachable from the plate-like member,
the plate-like member further has a holding hole for holding the mounting portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019093006A JP7050718B2 (en) | 2019-05-16 | 2019-05-16 | Positioning jig for soldering |
| JP2019-093006 | 2019-05-16 |
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| Publication Number | Publication Date |
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| CN111954393A true CN111954393A (en) | 2020-11-17 |
| CN111954393B CN111954393B (en) | 2024-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010393122.7A Active CN111954393B (en) | 2019-05-16 | 2020-05-11 | Positioning fixture for welding |
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| JP (1) | JP7050718B2 (en) |
| CN (1) | CN111954393B (en) |
| DE (1) | DE102020112058A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0927438A (en) * | 1995-07-10 | 1997-01-28 | Matsushita Electric Ind Co Ltd | Laminated component and electronic component using it |
| JPH09321407A (en) * | 1996-05-30 | 1997-12-12 | Mitsumi Electric Co Ltd | Semiconductor package |
| CN1186410A (en) * | 1996-12-25 | 1998-07-01 | 阿尔卑斯电气株式会社 | Arrangement for installation of unit members |
| CN1499590A (en) * | 2002-11-05 | 2004-05-26 | �¹������ҵ��ʽ���� | Semiconductor device and its mfg. method |
| CN2713777Y (en) * | 2004-03-23 | 2005-07-27 | 萧荣福 | Improved arrangement for quick-dismantling cover for screw bolts in automation assembly |
| JP2008004859A (en) * | 2006-06-26 | 2008-01-10 | Matsushita Electric Ind Co Ltd | Jig for securing flexible substrate |
| CN103000559A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Positioning clamp for semiconductor chip and manufacture method for semiconductor device |
| CN103633058A (en) * | 2013-12-12 | 2014-03-12 | 矽力杰半导体技术(杭州)有限公司 | Packaging assembly and manufacturing method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01289128A (en) * | 1988-05-16 | 1989-11-21 | Minolta Camera Co Ltd | Ic chip mounting jig |
| JPH10107425A (en) * | 1996-09-30 | 1998-04-24 | Taiyo Yuden Co Ltd | Circuit part mounting jig and mounting method |
| JP2002361410A (en) | 2001-05-31 | 2002-12-18 | Toyota Motor Corp | Jig for reflow soldering |
| JP2009076592A (en) * | 2007-09-19 | 2009-04-09 | Toyota Motor Corp | Method of crimping electrode of semiconductor device and heat slinger |
| JP5838559B2 (en) | 2011-02-08 | 2016-01-06 | 富士電機株式会社 | Semiconductor device assembly jig and semiconductor device assembly method |
| JP5811648B2 (en) * | 2011-07-12 | 2015-11-11 | 富士電機株式会社 | Semiconductor device assembly jig and semiconductor device manufacturing method using the same |
-
2019
- 2019-05-16 JP JP2019093006A patent/JP7050718B2/en active Active
-
2020
- 2020-05-05 DE DE102020112058.3A patent/DE102020112058A1/en active Pending
- 2020-05-11 CN CN202010393122.7A patent/CN111954393B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0927438A (en) * | 1995-07-10 | 1997-01-28 | Matsushita Electric Ind Co Ltd | Laminated component and electronic component using it |
| JPH09321407A (en) * | 1996-05-30 | 1997-12-12 | Mitsumi Electric Co Ltd | Semiconductor package |
| CN1186410A (en) * | 1996-12-25 | 1998-07-01 | 阿尔卑斯电气株式会社 | Arrangement for installation of unit members |
| CN1499590A (en) * | 2002-11-05 | 2004-05-26 | �¹������ҵ��ʽ���� | Semiconductor device and its mfg. method |
| CN2713777Y (en) * | 2004-03-23 | 2005-07-27 | 萧荣福 | Improved arrangement for quick-dismantling cover for screw bolts in automation assembly |
| JP2008004859A (en) * | 2006-06-26 | 2008-01-10 | Matsushita Electric Ind Co Ltd | Jig for securing flexible substrate |
| CN103000559A (en) * | 2011-09-16 | 2013-03-27 | 富士电机株式会社 | Positioning clamp for semiconductor chip and manufacture method for semiconductor device |
| CN103633058A (en) * | 2013-12-12 | 2014-03-12 | 矽力杰半导体技术(杭州)有限公司 | Packaging assembly and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111954393B (en) | 2024-01-09 |
| JP2020188203A (en) | 2020-11-19 |
| JP7050718B2 (en) | 2022-04-08 |
| DE102020112058A1 (en) | 2020-11-19 |
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