CN111948767A

CN111948767A - Optical module

Info

Publication number: CN111948767A
Application number: CN202010837891.1A
Authority: CN
Inventors: 刘旭霞; 邵乾; 罗成双; 郑龙; 刘璐
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2020-08-19
Filing date: 2020-08-19
Publication date: 2020-11-17

Abstract

The application provides an optical module, belongs to the optical fiber communication field. In the optical module provided by the embodiment of the application, light emitted by the light emitting chip is emitted to the reflection refraction element through the optical reflection refraction surface, is emitted to the reflection surface after being reflected by the upper surface of the reflection refraction element, and finally enters the optical fiber interface to realize the light emitting function; the light emitted by the light emitting chip is reflected to the optical power monitoring chip through the optical reflection and refraction surface and finally enters the optical power monitoring chip to realize the optical power monitoring function; the reflection and refraction element is independently arranged with the lens component, which provides the function of reflecting light, can simplify the design of the lens component, and can also realize a complex optical path by utilizing different optical characteristics arranged on the upper surface and the lower surface of the reflection and refraction element.

Description

Optical module

Technical Field

The application relates to the technical field of optical communication, in particular to an optical module.

Background

The optical module is mainly used for photoelectric and electro-optical conversion, an electric signal is converted into an optical signal by a transmitting end of the optical module and is transmitted out through an optical fiber, and a received optical signal is converted into an electric signal by a receiving end of the optical module. The current packaging form of the optical module mainly includes a TO (Transistor-out) package and a COB (Chip on Board) package.

In the optical module in the COB packaging form, a light emitting chip and a light receiving chip are respectively attached to a circuit board, an optical assembly is covered on the light emitting chip and the light receiving chip, and the optical assembly is connected with an optical fiber. Specifically, the method comprises the following steps: the optical signal emitted by the light emitting chip is transmitted to the optical fiber after the direction of the optical signal is changed through the optical component, and is transmitted to the outside of the optical module through the optical fiber; and the optical module transmits the optical signal received by the optical fiber to the optical assembly through the optical fiber, and then the optical signal is transmitted to the optical receiving chip after the direction of the optical signal is changed by the optical assembly.

In a specific use, however, the optical fiber is generally referred to as an optical fiber ribbon, and a part of the optical fiber in the optical fiber ribbon is used for transmitting the optical signal generated by the light emitting chip and a part of the optical fiber is used for receiving the optical signal transmitted to the light receiving chip. Therefore, in the optical module in the COB package form, generally, a single optical fiber is only used for transmitting an optical signal generated by the light emitting chip or an optical signal to be transmitted to the light receiving chip, that is, a single optical fiber is only used for transmitting light of a single wavelength.

Disclosure of Invention

The application provides an optical module, comprising

A circuit board;

the light emitting chip and the light power monitoring chip are respectively arranged on the surface of the circuit board;

the lower surface of the lens component is arranged on the edge surface of the circuit board, the lower surface protrudes upwards to form an accommodating cavity and a reflecting surface, and the light emitting chip and the light power monitoring chip are respectively positioned in the accommodating cavity;

the upper surface of the light emitting chip is downwards concave to form a concave cavity, and the bottom surface of the concave cavity forms an optical reflection and refraction surface which can reflect and reflect light from the light emitting chip;

one end of the optical fiber interface is provided with an optical fiber interface, the reflecting surface can reflect light to the direction of the optical fiber interface, and the light incoming direction of the optical fiber interface is different from the light outgoing direction of the light emitting chip;

the optical power monitoring chip receives reflected light from the optical reflection and refraction surface;

the catadioptric element is arranged above the concave cavity, and the lower surface of the catadioptric element can refract the light from the optical catadioptric surface into the catadioptric element; the upper surface of the reflection surface can reflect the light entering the reflection optical element to the lower surface of the reflection surface, and the lower surface of the reflection surface can refract the light to the reflection surface.

In the optical module provided by the application, light emitted by the light emitting chip is emitted to the reflection refraction element through the optical reflection refraction surface, is emitted to the reflection surface after being reflected by the upper surface of the reflection refraction element, and finally enters the optical fiber interface to realize the light emitting function; the light emitted by the light emitting chip is reflected to the optical power monitoring chip through the optical reflection and refraction surface and finally enters the optical power monitoring chip to realize the optical power monitoring function; the reflection and refraction element is independently arranged with the lens component, which provides the function of reflecting light, can simplify the design of the lens component, and can also realize a complex optical path by utilizing different optical characteristics arranged on the upper surface and the lower surface of the reflection and refraction element.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without any creative effort.

Fig. 1 is a schematic diagram of a connection relationship of an optical communication terminal;

FIG. 2 is a schematic diagram of an optical network unit;

fig. 3 is a schematic structural diagram of an optical module provided in an embodiment of the present application;

fig. 4 is an exploded structural schematic diagram of an optical module provided in an embodiment of the present application;

fig. 5 is a schematic partial structure diagram of an optical module according to an embodiment of the present application;

fig. 6 is a first partially exploded schematic view of an optical module according to an embodiment of the present disclosure;

fig. 7 is a partially exploded schematic view of a second optical module according to an embodiment of the present disclosure;

FIG. 8 is a first perspective view of a lens assembly provided in accordance with an embodiment of the present application;

FIG. 9 is a second perspective view of a lens assembly provided in an embodiment of the present application;

FIG. 10 is a perspective view of a lens assembly provided in an embodiment of the present application;

FIG. 11 is a cross-sectional view of a lens assembly provided in an embodiment of the present application;

fig. 12 is a first schematic structural diagram of a fixing cap according to an embodiment of the present disclosure;

fig. 13 is a second structural schematic view of a fixing cap according to an embodiment of the present disclosure;

FIG. 14 is a cross-sectional view of a locking cap according to an embodiment of the present application;

FIG. 15 is a cross-sectional view of a mounting cap with an anti-refraction element mounted therein according to an embodiment of the present disclosure;

FIG. 16 is a schematic cross-sectional view of an optical assembly according to an embodiment of the present application;

fig. 17 is a signal light transmission optical path diagram in an optical module according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

One of the core links of optical fiber communication is the interconversion of optical and electrical signals. The optical fiber communication uses optical signals carrying information to transmit in information transmission equipment such as optical fibers/optical waveguides, and the information transmission with low cost and low loss can be realized by using the passive transmission characteristic of light in the optical fibers/optical waveguides; meanwhile, the information processing device such as a computer uses an electric signal, and in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer, it is necessary to perform interconversion between the electric signal and the optical signal.

The optical module realizes the function of interconversion of optical signals and electrical signals in the technical field of optical fiber communication, and the interconversion of the optical signals and the electrical signals is the core function of the optical module. The optical module is electrically connected with an external upper computer through a golden finger on an internal circuit board of the optical module, and the main electrical connection comprises power supply, I2C signals, data signals, grounding and the like; the electrical connection mode realized by the gold finger has become the mainstream connection mode of the optical module industry, and on the basis of the mainstream connection mode, the definition of the pin on the gold finger forms various industry protocols/specifications.

Fig. 1 is a schematic diagram of connection relationship of an optical communication terminal. As shown in fig. 1, the connection of the optical communication terminal mainly includes interconnection among the optical network unit 100, the optical module 200, the optical fiber 101, and the network cable 103.

One end of the optical fiber 101 is connected with a remote server, one end of the network cable 103 is connected with a local information processing device, and the connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical network unit 100 having the optical module 200.

An optical port of the optical module 200 is externally accessed to the optical fiber 101, and establishes bidirectional optical signal connection with the optical fiber 101; an electrical port of the optical module 200 is externally connected to the optical network terminal 100, and establishes bidirectional electrical signal connection with the optical network terminal 100; the optical module realizes the interconversion of optical signals and electric signals, thereby realizing the establishment of information connection between the optical fiber and the optical network terminal; specifically, the optical signal from the optical fiber is converted into an electrical signal by the optical module and then input to the optical network terminal 100, and the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input to the optical fiber.

The optical network terminal is provided with an optical module interface 102, which is used for accessing an optical module 200 and establishing bidirectional electric signal connection with the optical module 200; the optical network terminal is provided with a network cable interface 104, which is used for accessing the network cable 103 and establishing bidirectional electric signal connection with the network cable 103; the optical module 200 is connected to the network cable 103 through the optical network terminal 100, specifically, the optical network terminal transmits a signal from the optical module to the network cable and transmits the signal from the network cable to the optical module, and the optical network terminal serves as an upper computer of the optical module to monitor the operation of the optical module.

To this end, the remote server establishes a bidirectional signal transmission channel with the local information processing device through the optical fiber 101, the optical module 200, the optical network unit 100, and the network cable 103.

Common information processing apparatuses include routers, switches, electronic computers, and the like; the optical network unit 100 is a host computer of the optical module 200, and provides a data signal to the optical module 200 and receives a data signal from the optical module 200, and a common host computer of the optical module 200 also includes an optical line terminal and the like.

Fig. 2 is a schematic diagram of an optical network unit structure. As shown in fig. 2, the optical network unit 100 includes a circuit board 105, and a cage 106 is disposed on a surface of the circuit board 105; an electric connector is arranged in the cage 106 and used for connecting an electric port of an optical module such as a golden finger; the cage 106 is provided with a heat sink 107, and the heat sink 107 has a convex structure such as a fin for increasing a heat radiation area.

The optical module 200 is inserted into an optical network unit, specifically, an electrical port of the optical module is inserted into an electrical connector in the cage 106, and an optical port of the optical module 200 is connected with the optical fiber 101.

The cage 106 is positioned on the circuit board, enclosing the electrical connectors on the circuit board in the cage; the optical module 200 is inserted into a cage, the optical module 200 is held by the cage, and heat generated by the optical module 200 is conducted to the cage through an optical module case and finally diffused by a heat sink 107 on the cage.

Fig. 3 is a schematic structural diagram of an optical module 200 according to an embodiment of the present disclosure, and fig. 4 is an exploded structural diagram of the optical module 200 according to the embodiment of the present disclosure. As shown in fig. 3 and 4, an optical module 200 provided in an embodiment of the present application includes an upper housing 201, a lower housing 202, an unlocking member 203, a circuit board 300, and an optical assembly 400.

The upper housing 201 is covered on the lower housing 202 to form a package cavity with two openings, and the outer contour of the package cavity is generally in a square shape. Specifically, the lower housing 202 includes a main board and two side boards located at two sides of the main board and arranged perpendicular to the main board; the upper shell 201 comprises a cover plate, and the cover plate covers two side plates of the upper shell 201 to form a wrapping cavity; the upper casing 201 may further include two side walls disposed at two sides of the cover plate and perpendicular to the cover plate, and the two side walls are combined with the two side plates to cover the upper casing 201 on the lower casing 202.

The two openings may be two ends (204, 205) in the same direction, or two openings in different directions; one of the openings is an electric port 204, a golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer such as an optical network unit, the other opening is an optical port 205 and is used for external optical fiber access to connect an optical transceiver inside the optical module 200, and photoelectric devices such as the circuit board 300 and the optical transceiver are located in a package cavity.

The upper shell 201 and the lower shell 202 are combined to facilitate the installation of devices such as the circuit board 300 and the like in the shells, and the upper shell 201 and the lower shell 202 form an outermost packaging protection shell of the optical module. The upper shell 201 and the lower shell 202 are generally made of metal materials, which is beneficial to realizing electromagnetic shielding and heat dissipation; generally, the housing of the optical module 200 is not integrated, so that when devices such as a circuit board are assembled, the positioning component, the heat dissipation structure and the electromagnetic shielding structure cannot be mounted, and the production automation is not facilitated.

The unlocking component 203 is located on the outer wall of the wrapping cavity/lower shell 202, and is used for realizing the fixed connection between the optical module and the upper computer or releasing the fixed connection between the optical module and the upper computer.

The unlocking component 203 is provided with a clamping structure matched with the upper computer cage; the end of the unlocking member 203 is pulled to make the unlocking member 203 relatively move on the surface of the outer wall; the optical module is inserted into a cage of the upper computer, and the optical module is fixed in the cage of the upper computer by a clamping structure of the unlocking component 203; by pulling the unlocking member 203, the engaging structure of the unlocking member 203 moves along with the unlocking member, and further the connection relationship between the engaging structure and the upper computer is changed, so that the engaging relationship between the optical module and the upper computer is released, and the optical module can be drawn out from the cage of the upper computer.

The circuit board 300 is provided with a light emitting chip, a driving chip of the light emitting chip, a light receiving chip, a transimpedance amplifier chip, an amplitude limiting amplifier chip, a microprocessor chip, and the like, wherein the light emitting chip and the light receiving chip are directly attached to the circuit board of the optical module, and such a configuration is referred to as COB packaging in the industry.

The circuit board 300 connects the electrical appliances in the optical module together according to the circuit design through circuit wiring to realize the electrical functions of power supply, electrical signal transmission, grounding and the like; while the circuit board 300 also functions to carry the various components, such as the circuit board carrying the optical assembly 400.

The circuit board is generally a hard circuit board, and the hard circuit board can also realize a bearing effect due to the relatively hard material of the hard circuit board, for example, the hard circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the upper computer cage, and particularly, a metal pin/golden finger is formed on the surface of the tail end of one side of the rigid circuit board and used for being connected with the electric connector.

As shown in fig. 4, the circuit board 300 is provided with an optical component 400, a light emitting chip, a laser driving chip, a light receiving chip, a limiting amplifying chip (not shown) and the like, and the optical component 400 is disposed at one end of the circuit board 300 near the light port. The optical assembly 400 is disposed above the light emitting chip and the light receiving chip in a covering manner, and the optical assembly 400 and the circuit board 300 form a cavity for covering the light emitting chip, the light receiving chip, and the like, and the light emitting chip and the light receiving chip are located in the cavity. The optical assembly 400 is used to transmit a light beam and change the direction of transmission of the light beam during transmission. Specifically, light emitted by the light emitting chip is transmitted and reflected by the optical component and enters the optical fiber, light from the optical fiber is reflected by the optical component and enters the light receiving chip, and the optical component not only plays a role in sealing the optical chip, but also establishes optical connection between the optical chip and the optical fiber. The optical module 400 is simultaneously covered above the light emitting chip and the light receiving chip, so that the propagation direction of the signal light emitted by the light emitting chip and the signal light from the outside of the optical module can be changed conveniently by using fewer devices.

Further, high-speed data transmission requires close distance arrangement between the optical chips and their driving/matching chips to shorten the connection between the chips and reduce the signal loss caused by the connection, and the optical assembly 400 is covered over the optical chips, so the optical assembly 400 generally covers the optical chips and their driving/matching chips at the same time. Therefore, the light emitting chip and the driving chip of the light emitting chip are disposed in a short distance, and the optical assembly 400 covers the light emitting chip and the driving chip of the light emitting chip; the light receiving chip and the transimpedance amplifier chip are disposed in close proximity, and the optical module 400 covers the light receiving chip and the transimpedance amplifier chip.

In the embodiment of the present application, the number of the light emitting chips and the light receiving chips may be more than one, that is, the number of the optical assemblies 400 is more than one, and the number of the light emitting chips and the light receiving chips may be one, and further, as shown in fig. 4, the number of the optical assemblies 400 includes two, but the embodiment of the present application is not limited to two, and three, four, and the like may also be used.

In an embodiment of the present application, the optical assembly includes a lens assembly that is housed on the emitter and the light receiving chip, and an invagination element that is disposed at an upper end of the lens assembly. The lens assembly and the reflection refraction element are used for transmitting the signal light emitted by the light emitting chip and the signal light from the outside of the optical module, and the lens assembly and the reflection refraction element cooperate to change the propagation directions of the signal light emitted by the light emitting chip and the signal light from the outside of the optical module. For example, the signal light emitted by the light emitting chip is transmitted into the lens assembly along the direction perpendicular to the circuit board, then enters the reflection optical element, the transmission direction is changed by the reflection optical element, and then enters the lens assembly, and the transmission direction is changed by the lens assembly, so that the signal light emitted by the light emitting chip is output along the direction parallel to the circuit board; the signal light from the outside of the optical module enters the lens assembly along the direction parallel to the circuit board, the propagation direction is changed by the lens assembly and is transmitted to the catadioptric element, the propagation direction is changed by the catadioptric element and then enters the lens assembly, and then the signal light is transmitted to the light receiving chip through the lens assembly eye in the direction perpendicular to the circuit board. In embodiments of the present application, the invaginated light element may be secured to the upper end of the lens assembly by glue or an invaginated light element holder. The reflecting refraction element fixing part can be a fixing cap and other structural parts.

Fig. 5 is a schematic partial structure diagram of an optical module according to an embodiment of the present application. As shown in fig. 5, the optical assembly 400 is disposed at one end of the circuit board 300. Optical assembly 400 includes a retaining cap 410 and a lens assembly 420. A retaining cap 410 covers the upper end of lens assembly 420. The fixing cap 410 is provided with an inverse refraction element therein, and the fixing cap 410 covers the inverse refraction element and is then fixedly connected with the lens assembly 420, so that the inverse refraction element is fixed on the lens assembly 420.

Fig. 6 is a first partially exploded schematic view of an optical module according to an embodiment of the present disclosure, and fig. 7 is a second partially exploded schematic view of an optical module according to an embodiment of the present disclosure. As shown in fig. 6 and 7, the upper portion of the lens assembly 420 supports the catadioptric element 430, and the light emitting chip 301, the optical power monitoring chip 300A and the light receiving chip 302 are housed under the lens assembly 420. In the embodiment of the present application, the optical power monitoring chip 300A, the light emitting chip 301 and the light receiving chip 302 are arranged along the length of the circuit board 300, and then the optical power monitoring chip 300A is disposed on the left of the light emitting chip 301, the light emitting chip 301 is disposed on the left of the light receiving chip 302, and the light receiving chip 302 is closer to the light port of the optical module. The top surface of the lens assembly 420 is provided with a support ramp for supporting the invagination element 430. The supporting slope supports the reflection and refraction element 430, so that the reflection and refraction element 430 is obliquely arranged on the top of the lens assembly 420, and the reflection and refraction element 430 is inclined towards the light port of the optical module.

The optical power monitoring chip and the optical receiving chip are both devices for receiving light, but the functions and technical routes of the optical power monitoring chip and the optical receiving chip in the optical module are completely different; the optical power monitoring chip receives light from the light emitting chip, and the light receiving chip receives light from the outside of the optical module; the optical power monitoring chip receives light to generate emitted optical power monitoring data, wherein the data is data required to be monitored by an optical module industry protocol, the optical receiving chip receives light to generate a received data signal, and the received data signal is a data signal transmitted by optical fiber communication.

Fig. 8 is a first perspective view of a lens assembly provided in an embodiment of the present application, fig. 9 is a second perspective view of the lens assembly provided in the embodiment of the present application, and fig. 10 is a third perspective view of the lens assembly provided in the embodiment of the present application. As shown in fig. 8-10, the top surface of the lens assembly 420 is provided with a concave cavity 421, the bottom surface of the concave cavity 421 forms the optical catadioptric surface 211, the transmissive surface 212 and the optical converging surface 213, the bottom surface of the lens assembly 420 is provided with a receiving cavity 422, and the bottom surface of the receiving cavity 422 forms the reflective surface 221.

In the embodiment of the present application, the optical reflection and refraction surface 211 is used for reflecting and transmitting the signal light emitted by the light emission chip, and further, the projection of the optical reflection and refraction surface 211 in the direction of the circuit board covers the light emission chip, and the light from the light emission chip is reflected and refracted on the optical reflection and refraction surface; the transmission surface 212 is used for transmitting signal light from the outside of the optical module and transmitting the signal light to the light receiving chip, and further the projection of the transmission surface 212 in the direction of the circuit board covers the light receiving chip; the optical converging surface 213 is used to re-inject the signal light emitted from the light emitting chip into the lens assembly 420 and to inject the signal light from the outside of the optical module out of the lens assembly 420, and the reflecting surface 221 is used to reverse the propagation direction of the signal light emitted from the light emitting chip changed by the reflection element to be parallel to the bottom of the lens assembly 420, and to emit and sum the signal light from the outside of the optical module to the optical converging surface 213.

Optionally, the optical converging surface 213 is provided with a condensing lens 214, the condensing lens 214 is configured to condense and transmit the signal light transmitted to the optical transmitting chip to the reflecting surface 221, and the condensing lens 214 is further configured to collimate and transmit the signal light transmitted to the condensing lens from outside the optical module to the catadioptric element.

Optionally, the bottom surface of the lens assembly 420 further includes a condenser lens 301A, a collimator lens 222, and a condenser lens 223. The condenser lens 301A is disposed opposite to the optical power monitoring chip 300A, and configured to condense/focus light toward the optical power monitoring chip 300A; the projection of the collimating lens 222 in the direction of the circuit board covers the light emitting chip for collimating the signal light emitted by the light emitting chip. The signal light emitted from the light emitting chip is diverging light, and the collimating lens 222 converts the diverging signal light into parallel light. The projection of the converging lens 223 in the direction of the circuit board covers the light receiving chip, the signal light from the outside of the optical module transmitted thereto is parallel light, and the converging lens 223 is used for converging the signal light from the outside of the optical module to the light receiving chip. Further, the focus of the collimator lens 222 is located on the light emitting chip, and the focus of the condensing lens 223 is located on the light receiving chip.

In some embodiments, the optical reflection and refraction surface 211 and the transmission surface 212 are coated with antireflection films, and the optical convergence surface 213 is coated with a reflection film.

In order to facilitate the installation and fixation of the reflective optical element, the support slope may optionally comprise a first support portion and a second support portion. As shown in fig. 8 and 9, a first support part 424 and a second support part 425 are provided on the top of the lens assembly 420. The first supporting portion 424 and the second supporting portion 425 are used for supporting the reflection optical element, so that the reflection optical element can be conveniently fixed, and the inclination angle of the reflection optical element can be conveniently adjusted. First supporting part 424 and second supporting part 425 may be disposed perpendicular to the length direction of lens assembly 420 or disposed parallel to the length direction of lens assembly 420. In the embodiment of the present application, it is preferable to arrange the lens assembly 420 in parallel to the length direction, which helps to increase the supporting area of the first supporting portion 424 and the second supporting portion 425 for the catadioptric element. As shown in fig. 8 and 9, the first supporting part 424 and the second supporting part 425 are respectively disposed at both sides of the concave chamber 421, and the length directions of the first supporting part 424 and the second supporting part 425 are parallel to the length direction of the concave chamber 421. The upper end surfaces of the first supporting part 424 and the second supporting part 425 are inclined surfaces, and the upper end surfaces of the first supporting part 424 and the second supporting part 425 are used for supporting the catadioptric element, so that the catadioptric element is obliquely arranged at the top of the lens assembly 420.

In addition, the top of the lens assembly 420 is also used for supporting and connecting a fixing cap, so that a groove is formed in the top of the fixing cap, where the lens assembly 420 is installed, for convenience, and the bottom end of the fixing cap is arranged in the groove in the top of the lens assembly 420. And in order to improve the installation accuracy of the fixing cap, the side edge of the returning groove is provided with a limiting bulge and the like.

To facilitate secure attachment of lens assembly 420 to a retaining cap, the lateral sides of lens assembly 420 are provided with first protrusion 426 and second protrusion 427, and first protrusion 426 and second protrusion 427 are used to attach lens assembly 420 to a retaining cap. Optionally, first protrusion 426 and second protrusion 427 are disposed on the lateral sides of lens assembly 420 in the length direction, first protrusion 426 is disposed on one lateral side of lens assembly 420 in the length direction, and second protrusion 427 is disposed on the other lateral side opposite to the lateral side.

In the embodiment of the present application, the lens assembly 420 further includes an optical fiber interface 423, and the optical fiber interface 423 is disposed at an end of the lens assembly 420 close to the reflecting surface 221. Alternatively, the optical fiber interface 423 may be molded directly during the molding process of the lens assembly 420.

The optical fiber interface 423 is provided with a through hole, and the optical fiber interface 423 can be used for connecting an optical fiber outside the optical module and outputting signal light emitted by the optical emission chip and inputting signal light from the outside of the optical module. The optical fiber interface 423 is integrally formed on the lens assembly 420, so that the optical module can be connected to an external optical fiber.

For making things convenient for optical fiber interface 423 spacing and fixed, have the draw-in groove on the casing down, have the clearance in the draw-in groove, the draw-in groove can be by the protruding formation of inferior valve surface facing upward, and then optical fiber interface 423 sets up the arch. The optical fiber interface 423 is assembled and fixed with the clamping groove in the lower shell, and the optical fiber interface 423 is fixed on the lower shell by placing the protrusion in the gap of the clamping groove.

FIG. 11 is a cross-sectional view of a lens assembly provided in an embodiment of the present application. As shown in fig. 11, an optical fiber interface 423 is disposed at the left end of the lens assembly 420, and signal light is output and input from the left end of the lens assembly 420. The optical fiber interface 423 is provided with a through hole 232 at the axial center. Further, a fiber stub 233 is provided in the through hole 232 of the fiber interface 423. The optical fiber ferrule 233 includes therein an optical fiber for transmitting signal light emitted from the light emitting chip reflected by the reflection surface or transmitting signal light from the outside of the optical module to the reflection surface. The optical fiber ferrule 233 is disposed at one end of the optical fiber interface 423 close to the reflection surface, and one end of the optical fiber interface 423 far away from the reflection surface is used for inserting an external optical fiber.

The optical fiber is flexible and is not easily fixed to the lens assembly 420 with high precision, and thus the optical fiber ferrule 233 is designed. The optical fiber ferrule 233 is wrapped with a hard material that can be processed with high precision, and the fixation of the material realizes the fixation of the optical fiber. Specifically, the optical fiber ferrule 233 may be formed by wrapping an optical fiber with a ceramic material, the optical fiber is used for guiding light, the ceramic has high processing precision, high precision position alignment may be achieved, the optical fiber and the ceramic are combined into the optical fiber ferrule, and fixation of the optical fiber is achieved by fixing the ceramic. The ceramic material limits the fixing direction of the optical fiber in the optical fiber ferrule, generally, the ceramic is processed into a cylinder, a linear through hole is arranged in the center of the ceramic cylinder, and the optical fiber is inserted into the through hole of the ceramic cylinder to realize fixing, so that the optical fiber is fixed in the ceramic body straightly; in the optical fiber ferrule, the axial direction of the optical fiber is parallel to the axial direction of the optical fiber ferrule.

To facilitate securing the fiber stub 233 in the fiber interface 423, the fiber interface 423 is provided with glue dispensing holes 234. The fiber stub 233 is loaded into the fiber interface 423 and then dispensed through the dispensing hole 234, by which the fiber stub 233 is fixed within the fiber interface 423.

In addition, in this embodiment of the application, the bottom of the optical fiber interface 423 is configured to be a flat structure, which facilitates the whole bottom of the lens assembly 420 to have a flat structure, and facilitates the fixing of the optical fiber interface 423 and the lower housing. The outer wall of the optical fiber interface 423 is sleeved with a metal sleeve 235. The metal sleeve 235 is used for electromagnetic shielding to prevent electromagnetic radiation around the metal sleeve from generating electromagnetic interference on the signal light transmitted in the fiber interface 423.

Fig. 12 is a first structural schematic view of a fixing cap provided in the embodiment of the present application, and fig. 13 is a second structural schematic view of a fixing cap provided in the embodiment of the present application. As shown in fig. 12 and 13, the locking cap 410 provided in the embodiment of the present application includes a cover body 411. The cover body 411 is fixedly connected with the lens assembly, so as to fix the reflection optical element on the top of the lens assembly.

In the present embodiment, the fixing cap 410 further includes an invaginated light element receiving cavity provided in the cover body 411. Fig. 14 is a cross-sectional view of a locking cap according to an embodiment of the present disclosure. As shown in fig. 14, the reflection optical element housing chamber 412 is provided in the cover body 411. The shape of the light reflection element accommodating cavity 412 depends on the shape of the light reflection element and the requirement of inclination.

As shown in fig. 12 to 14, the fixing cap 410 further includes a first connection portion 415 and a second connection portion 416, and the first connection portion 415 and the second connection portion 416 are respectively disposed at one side in the length direction of the cover body 411. The first connecting portion 415 is provided with a first card slot, and the second connecting portion 416 is provided with a second card slot. When the fixing cap 410 is assembled with the lens assembly, the first locking groove of the first connection portion 415 is connected with the first protrusion of the lens assembly in a matching manner, and the second locking groove of the second connection portion 416 is connected with the second protrusion of the lens assembly in a matching manner. In addition, in order to ensure the reliability of the firm connection between the first engaging groove and the first protrusion and between the second engaging groove and the second protrusion, after the fixing cap 410 and the lens assembly are assembled, the adhesive is dispensed and fixed at the positions of the first engaging groove and the first protrusion and at the positions of the second engaging groove and the second protrusion.

In the embodiment of the present application, after the fixing cap 410 and the lens assembly are assembled, in order to ensure the fixing reliability of the catadioptric element, a spring is disposed at the top end of the fixing cap 410. After the fixing cap 410 and the lens assembly are assembled, the elastic sheet extrudes the catadioptric element and is used for compressing the catadioptric element towards the direction of the lens assembly, so that the catadioptric element is fixed. The elastic sheet may be S-shaped, one end of the elastic sheet is connected to the top end of the cover body 411, and the other end of the elastic sheet may be a free end.

As shown in fig. 12-14, the elastic pieces disposed on the fixing cap 410 include a first elastic piece 413 and a second elastic piece 414. The first elastic piece 413 and the second elastic piece 414 are S-shaped. One end of the first elastic piece 413 and the second elastic piece 414 are connected to the top end of the cover body 411, and the other end can be a free end. Optionally, the first resilient tab 413 and the second resilient tab 414 are symmetrically disposed on the cover body 411. The first elastic sheet 413 and the second elastic sheet 414 which are symmetrically arranged can uniformly apply extrusion force to the reflection optical element, so as to ensure uniform stress of the reflection optical element and further ensure the firmness of fixation of the reflection optical element.

Fig. 15 is a cross-sectional view of a fixing cap with an anti-refraction element mounted therein according to an embodiment of the present application. As shown in fig. 15, the reflection optical element 430 is disposed in the reflection optical element accommodating cavity 412 of the fixing cap 410, and one side of the reflection optical element 430 abuts against the first elastic piece 413 (which is shielded) and the free end of the second elastic piece 414. When the catadioptric element 430 is fixed to the top of the lens assembly, the catadioptric element 430 is first placed in the catadioptric element receiving cavity 412 of the fixing cap 410, and then the fixing cap 410 with the catadioptric element 430 is assembled to the lens assembly. When the fixing cap 410 and the lens assembly 420 are assembled, the free ends of the first elastic sheet 413 and the second elastic sheet 414 press one side of the reflection optical element 430.

In the embodiments of the present application, the catadioptric element is generally in the shape of a sheet, such as a rectangular parallelepiped sheet. The top surface and the bottom surface of the reflection refraction element are respectively coated with films, the coated top surface forms a reflecting surface, the coated bottom surface forms a partial wave surface, and the partial wave surface is closer to the upper surface of the lens component. The projection of the refraction element on the lens component covers the optical reflection refraction surface, the transmission surface and the optical convergence surface. The reflection surface is used for totally reflecting the signal light with a certain wavelength, and the wave splitting surface is used for transmitting the signal light with a certain wavelength and reflecting the signal light with another wavelength. Let the wavelength of the signal light emitted by the light emitting chip be lambda₁The wavelength of the signal light to be received by the light receiving chip is lambda₂The reflection wavelength of the reflection surface is λ₁The transmission wavelength of the light and the partial wave surface is lambda₁Light and reflection wavelength of the partial wave surface of lambda₂Of (2) is detected.

Fig. 16 is a schematic cross-sectional view of an optical assembly according to an embodiment of the present application. As shown in fig. 16, after the fixing cap 410 and the lens assembly 420 are assembled, the free ends of the first elastic sheet and the second elastic sheet press the reflection surface of the catadioptric element 430, the partial wave surface of the catadioptric element 430 contacts the first supporting portion 424 and the second supporting portion of the lens assembly 420, that is, the first supporting portion 424 and the second supporting portion support the catadioptric element 430 by supporting the partial wave surface of the catadioptric element 430, and then the free ends of the first elastic sheet and the second elastic sheet press the catadioptric element 430 to fix the catadioptric element 430 with respect to the lens assembly 420.

Optionally, the projection of the first elastic sheet on the top of the lens assembly 420 covers the first supporting portion 424, the projection of the second elastic sheet on the top of the lens assembly 420 covers the second supporting portion, so that the direction of the pressing force of the first elastic sheet on the catadioptric element 430 points to the first supporting portion 424, and the direction of the pressing force of the second elastic sheet on the catadioptric element 430 points to the second supporting portion, and further, the direction of the pressing force of the first elastic sheet on the catadioptric element 430 is parallel to the direction of the supporting force of the first supporting portion 424 on the catadioptric element 430, and the direction of the pressing force of the second elastic sheet on the catadioptric element 430 is parallel to the direction of the supporting force of the second supporting portion on the catadioptric element 430.

Fig. 17 is a transmission optical path diagram of signal light in an optical module according to an embodiment of the present application, where the signal light includes signal light emitted by a light emitting chip and signal light from outside the optical module.

As shown in fig. 17, the light emitting chip 301 emits signal light, the optical axis of the signal light is perpendicular to the circuit board, the signal light is transmitted to the collimating lens 222 on the bottom surface of the lens assembly, since the signal light emitted by the light emitting chip is divergent light, the collimating lens 222 collimates the signal light, the signal light is converted into parallel light by the divergent light after being collimated by the collimating lens 222, the parallel light is transmitted to the optical reflection refraction surface 211, and is refracted and transmitted to the wave splitting surface of the catadioptric element 430 through the optical reflection refraction surface 211; the signal light is refracted and transmitted to the reflecting surface of the catadioptric element 430 through the wave splitting surface of the catadioptric element 430, reflected and transmitted to the wave splitting surface of the catadioptric element 430 through the reflecting surface of the catadioptric element 430, refracted and transmitted out of the catadioptric element through the wave splitting surface and then transmitted to the optical converging surface 213, converged to the reflecting surface 221 through the condensing lens 214 on the optical converging surface 213, and finally reflected through the reflecting surface 221, the optical axis direction of the signal light is parallel to the circuit board, the optical axis direction is parallel to the signal light of the circuit board, transmitted to the optical fiber end surface in the optical fiber ferrule 233, enters the optical fiber of the optical fiber ferrule 233, and then transmitted out of the lens assembly;

the parallel light from the collimating lens 222 is transmitted to the optical catadioptric surface 211, and is reflected by the optical catadioptric surface 211 to be transmitted to the condenser lens 301A; the light is collected by the condenser lens 301A and emitted to the optical power monitoring chip. The optical reflection and refraction surface reflects the light from the light emitting chip according to a preset known proportion, so that the power monitoring of the reflection surface can calculate the whole luminous power of the light emitting chip.

The optical axis of the signal light from the outside of the optical module is parallel to the circuit board, the signal light is transmitted to the reflection surface 221 through the optical fiber in the optical fiber ferrule 233, is reflected to the optical convergence surface 213 through the reflection surface 221, is collimated by the condenser lens 214 on the optical convergence surface 213, is transmitted to the wave splitting surface of the catadioptric element 430, is reflected to the transmission surface 212 through the wave splitting surface of the catadioptric element 430, the optical axis of the signal light becomes perpendicular to the circuit board, the signal light is transmitted to the condenser lens 223 on the bottom surface of the lens assembly through the transmission surface 212, and is then converged and transmitted to the light receiving chip 302 through the condenser lens 223.

In the embodiment of the present application, the tilt angles of the optical catadioptric surface 211, the transmission surface 212, the optical converging surface 213, the reflection surface 221 and the catadioptric element 430 are controlled in coordination, so that the signal light emitted from the light emitting chip 301 is converted from the optical axis perpendicular to the circuit board to the optical axis parallel to the circuit board, and the signal light from the outside of the optical module is converted from the optical axis parallel to the circuit board to the optical axis perpendicular to the circuit board. Alternatively, the transmission surface 212 is parallel to the circuit board, and when the signal light from the outside of the optical module is transmitted to the transmission surface 212 to be vertically incident, no refraction occurs.

All the embodiments in the present specification are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments, and the relevant points may be referred to the part of the description of the method embodiment. It is noted that other embodiments of the present application will become readily apparent to those skilled in the art from consideration of the specification and practice of the invention herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.

It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

Claims

1. An optical module, comprising

A circuit board;

2. The optical module of claim 1, further comprising

The light receiving chip is arranged on the surface of the circuit board and is positioned in the accommodating cavity;

the reflecting surface can reflect the light from the optical fiber interface to the reflection refraction element;

the bottom surface of the concave cavity of the lens component is also provided with a transmission surface, the lower surface of the reflection and refraction element can reflect light from the reflection surface to the transmission surface, the transmission surface can transmit the light to the light receiving chip, and the wavelength of the light emitted by the light emitting chip is different from the wavelength of the light received by the light receiving chip.

3. The optical module of claim 1, further comprising

the bottom surface of the concave cavity of the lens component is also provided with a second refraction surface, the lower surface of the reflection refraction element can reflect light from the reflection surface to the second refraction surface, the second refraction surface can refract light to the light receiving chip, and the wavelength of light emitted by the light emitting chip is different from the wavelength of light received by the light receiving chip.

4. The light module of claim 1,

the upper surface of the lens component is provided with a supporting inclined plane, and the catadioptric element is arranged on the supporting inclined plane;

the optical reflection refraction surface is an inclined surface.

5. A light module as claimed in any one of claims 1, 2 and 3, further comprising

The fixing cap is buckled on the reflection refraction element, and the bottom of the fixing cap is fixedly connected with the lens component.

6. The optical module of claim 5, wherein the top of the fixing cap has a spring plate bent toward the bottom, and the spring plate presses against the upper surface of the reflection optical element.

7. The optical module of claim 1, wherein the bottom surface of the recessed cavity further forms an optical converging surface on which a condensing lens is disposed; the condensing lens can converge the light refracted by the surface below the reflection light element and then emit the light to the reflecting surface.

8. The light module of claim 1,

the surface of the accommodating cavity is provided with a collimating lens, and the collimating lens converges light from the light emitting chip to emit to the optical reflection refraction surface;

and the surface of the accommodating cavity is provided with a condensing lens, and the condensing lens condenses the reflected light from the optical reflection and refraction surface to irradiate the optical power monitoring chip.

9. The light module of claim 2,

the surface of the accommodating cavity is provided with a converging lens, and the converging lens converges light from the transmission surface to the light receiving chip.

10. The light module of claim 3,

the surface of the accommodating cavity is provided with a converging lens, and the converging lens converges light from the second refraction surface to irradiate the light receiving chip.