CN111913603A - Force sensing module - Google Patents
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- CN111913603A CN111913603A CN201910388195.4A CN201910388195A CN111913603A CN 111913603 A CN111913603 A CN 111913603A CN 201910388195 A CN201910388195 A CN 201910388195A CN 111913603 A CN111913603 A CN 111913603A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0414—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
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- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Push-Button Switches (AREA)
- Steering Control In Accordance With Driving Conditions (AREA)
Abstract
The invention discloses a force sensing module. The force sensing module comprises a force sensing device, a flexible display device and a rigid material layer. The flexible display device is located on the force sensing device. The rigid material layer is positioned between the flexible display device and the force sensing device.
Description
Technical Field
The present invention relates to the field of sensing, and more particularly to a force sensing module.
Background
It is a trend that electronic devices are matched with force sensing devices, which include a plurality of pressure sensing units, and when the pressure sensing units sense pressure generated by touch operations of users, the pressure sensing units deform to a certain extent, so that electrical signals output by the pressure sensing units change, and then the magnitude of the electrical signals is detected to calculate and obtain the magnitude of the pressure applied to the pressure sensing units. Can design the electronic equipment function under the different pressure values of matching through the detection to pressure size, for example same touch point can match multiple functions under the different dynamics, so, can further enrich the function of electronic product, bring new experience for the user.
On the other hand, flexible devices (e.g., display devices and touch devices) have light, thin and flexible characteristics, and are also commonly used in various electronic devices. However, when the electronic device is designed by using the force sensing device and the flexible device, when the electronic device is pressed by the user, the deformation of the force sensing device is too large due to the flexibility of the flexible device, so that the generated signal value is weakened, and the linear relationship between the signal value and the pressure applied is deteriorated, which reduces the accuracy of pressure sensing. Therefore, the problems of the force sensing device due to the characteristics of the flexible device still need to be further improved.
Disclosure of Invention
The present invention is directed to a force sensing module, wherein a rigid material layer is disposed between the force sensing module and a flexible device to increase the signal strength measured by the force sensing module and improve the linearity of the relationship between the signal value and the pressure. Therefore, the actual pressure generated by the user control operation can be accurately detected. In addition, the rigid material layer can also protect the flexible device from being damaged.
To achieve the above object, the present invention provides a force sensing module. The force sensing module comprises a force sensing device, a flexible display device and a rigid material layer. The flexible display device is located on the force sensing device. The rigid material layer is positioned between the flexible display device and the force sensing device. In some embodiments, the rigid material layer has a Young's modulus of 70-250 GPa. In some embodiments, the rigid material layer has a thickness in a range from 100 microns to 300 microns. In some embodiments, the rigid material layer comprises stainless steel, glass, acrylic, or a combination thereof. In some embodiments, the flexible display device is an organic light emitting diode display device. In some embodiments, the force sensing module further includes a first adhesive layer and a second adhesive layer, wherein the force sensing device is attached to the first surface of the rigid material layer through the first adhesive layer, and the flexible display device is attached to the second surface of the rigid material layer through the second adhesive layer. In some embodiments, the force sensing module further includes a cover layer and a third adhesive layer, wherein the cover layer is attached to the flexible display device through the third adhesive layer. In some embodiments, the third adhesive layer comprises an optically clear adhesive. In some embodiments, the force sensing module further includes a touch panel, wherein the flexible display device is disposed between the touch panel and the force sensing device. In some embodiments, the force sensing module further includes a touch sensing layer for detecting a touch position, the touch sensing layer being embedded in the flexible display device. In some embodiments, the force sensing device includes a substrate and a plurality of pressure sensing units disposed on the substrate, wherein each of the pressure sensing units includes four resistors with the same resistance value, and four of the resistors form a wheatstone bridge.
The present invention provides another force sensing module. The force sensing module comprises a force sensing device, a flexible touch device and a rigid material layer. The flexible touch device is located on the force sensing device. The rigid material layer is located between the flexible touch device and the force sensing device. In some embodiments, the rigid material layer has a Young's modulus of 70-250 GPa. In some embodiments, the rigid material layer has a thickness in a range from 100 microns to 300 microns. In some embodiments, the rigid material layer comprises stainless steel, glass, acrylic, or a combination thereof. In some embodiments, the force sensing module further includes a first adhesive layer and a second adhesive layer, wherein the force sensing device is attached to the first surface of the rigid material layer through the first adhesive layer, and the flexible touch device is attached to the second surface of the rigid material layer through the second adhesive layer. In some embodiments, the flexible touch device further includes a cover layer, at least one touch sensing layer, and a third adhesive layer, wherein the touch sensing layer is attached to the cover layer through the third adhesive layer. In some embodiments, the third adhesive layer comprises an optically clear adhesive. In some embodiments, the flexible touch device further includes a cover layer and at least one touch sensing layer, and the touch sensing layer is directly formed on a surface of the cover layer. In some embodiments, the force sensing device includes a substrate and a plurality of pressure sensing units disposed on the substrate, wherein each of the pressure sensing units includes four resistors with the same resistance value, and four of the resistors form a wheatstone bridge.
The force sensing module according to the embodiments of the present invention can be applied to various force sensing fields, and in order to make the above objects, features and advantages of the present invention more comprehensible, several embodiments accompanied with the attached drawings are described in detail below.
Drawings
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various features are not drawn to scale and are merely illustrative. In fact, the dimensions of the elements may be arbitrarily expanded or reduced to clearly illustrate the features of the present invention.
FIG. 1 is a schematic cross-sectional view of a force sensing module according to some embodiments of the present invention;
FIG. 2 is a cross-sectional schematic view of a force sensing device in a force sensing module according to some embodiments of the present invention;
FIG. 3 is a schematic diagram of an equivalent circuit of a pressure sensing unit in a force sensing device according to some embodiments of the present invention;
FIG. 4 is a schematic cross-sectional view of a force sensing module according to another embodiment of the present invention;
FIG. 5 is a schematic cross-sectional view of a force sensing module according to another embodiment of the invention.
Description of the symbols
10. 20-force sensing module
100-force sensing device
101 to substrate
103-pressure sensing unit
103' -secondary pressure sensing unit
110 to the first adhesive layer
120-rigid material layer
120A to first surface
120B to the second surface
130 to the second adhesive layer
140-flexible display device
150 to third adhesive layer
160-cover layer
170-touch sensing layer
180-touch panel
240-flexible touch device
A. B, C, D-electrical connection point
R1、R2、R3、R4Resistance
VEX-power supply
U0Output voltage
Detailed Description
The following disclosure provides many different embodiments, or examples, for illustrating different components of embodiments of the invention. Specific examples of components and arrangements thereof are disclosed below to simplify the present disclosure. Of course, these specific examples are not intended to limit the present invention. For example, the following summary of the present specification describes forming a first feature over or on a second feature, i.e., embodiments in which the formed first and second features are in direct contact, as well as embodiments in which additional features may be formed between the first and second features, such that the first and second features are not in direct contact. In addition, various examples of the present disclosure may use repeated reference characters and/or words. These repeated symbols or words are provided for simplicity and clarity and are not intended to limit the relationship between the various embodiments and/or the described configurations.
Also, spatially relative terms, such as "below …", "below", "lower", "above", "upper" and the like, may be used for convenience in describing the relationship of one element or component to another element(s) or component(s) in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. When the device is turned to a different orientation (e.g., rotated 90 degrees or otherwise), the spatially relative adjectives used herein will also be interpreted in terms of the turned orientation.
As used herein, the terms "about", "approximately", "substantial" and "approximately" generally mean within 20%, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. It should be noted that the quantities provided in the specification are approximate quantities, i.e., the meanings of "about", "about" and "about" can be implied without specifying "about", "about" and "about".
Although the steps in some of the described embodiments are performed in a particular order, these steps may be performed in other logical orders. In various embodiments, some of the described steps may be replaced or omitted, and other operations may be performed before, during, and/or after the described steps in embodiments of the invention. Other features may be added to the force sensing module in embodiments of the present invention. Some features may be replaced or omitted in different embodiments.
FIG. 1 is a cross-sectional schematic diagram illustrating a force sensing module 10 according to some embodiments of the present invention. The force sensing module 10 of the present embodiment includes a force sensing device 100, a rigid material layer 120, and a flexible display device 140. The force sensing device 100 is disposed under the flexible display device 140, and the rigid material layer 120 is disposed between the force sensing device 100 and the flexible display device 140. The force sensing module 10 of the present embodiment has a display function. In the embodiment of the present invention, the rigid material layer 120 is additionally disposed between the force sensing device 100 and the flexible display device 140, so as to improve the strain of the force sensing device 100, which is affected by the deformation of the flexible display device 140 when being pressed, enhance the signal sensed by the force sensing device 100, and enable the relationship between the sensed signal value and the pressure to present a linear relationship. Therefore, the actual pressure generated by the user control operation can be accurately detected. In addition, the rigid material layer 120 can also protect the flexible display device 140 from being damaged.
In some embodiments, the rigid material layer 120 may have a Young's modulus (Young's modulus) ranging from about 70GPa to about 250GPa, for example, from about 190GPa to about 210 GPa. In some embodiments, the rigid material layer 120 may be or include stainless steel (SUS), glass, acryl, or a combination thereof. In some embodiments, the thickness of the rigid material layer 120 ranges from 100 microns to 300 microns, such as from about 150 microns to about 200 microns. It is worth mentioning that when the thickness of the rigid material layer 120 is too thin (e.g., less than about 100 microns), the rigid material layer 120 may not have a way to provide sufficient rigidity to effectively improve the linearity of the strain of the force sensing device 100, thereby reducing the sensitivity of pressure sensing. When the thickness of the rigid material layer 120 is too thick (e.g., greater than about 300 microns), the force sensing device 100 may not be effectively strained, thereby failing the pressure sensing function.
In some embodiments, the flexible display device 140 may be an organic light-emitting diode (OLED) display device.
In some embodiments, as shown in fig. 1, the rigid material layer 120 has a first surface 120A and a second surface 120B opposite to each other, wherein the force sensing device 100 is attached to the first surface 120A of the rigid material layer 120 through the first adhesive layer 110, and the flexible display device 140 is attached to the second surface 120B of the rigid material layer 120 through the second adhesive layer 130. The first and second adhesive layers 110 and 130 may include Optically Clear Adhesive (OCA), such as pressure-sensitive adhesive (psa), light-curable adhesive, or other suitable optically clear adhesive. The pressure-sensitive optical adhesive can be adhered to the desired layer by applying a suitable pressure (e.g., a roller) to generate an adhesive force. The pressure sensitive optical cement may be classified into acryl-based pressure sensitive cement, rubber-based pressure sensitive cement, and the like according to its composition. The photo-curable optical adhesive is a liquid optical adhesive, which is irradiated with light (e.g., ultraviolet light) to cure the liquid optical adhesive, such as an ultraviolet light-curable optical adhesive. In some embodiments, the light-curable optical adhesive may be used in combination with heating or providing humidity to cure a liquid optical adhesive, such as an ultraviolet heating curable optical adhesive, an ultraviolet humidifying curable optical adhesive, and the like. The first and second adhesive layers 110, 130 may be the same or different materials. In some embodiments, first adhesive layer 110 has a thickness ranging from about 25 microns to about 150 microns, for example about 125 microns; and the second adhesive layer 130 has a thickness ranging from about 20 microns to about 50 microns, such as about 40 microns.
In some embodiments, the force sensing module 10 may include a cover layer (cover layer)160 disposed on the flexible display device 140, wherein the cover layer 160 is attached to the surface of the flexible display device 140 away from the rigid material layer 120 by a third adhesive layer 150, as shown in fig. 1. The cover layer 160 can protect the flexible display device 140 or other elements of the force sensing module 10 thereunder. In some embodiments, the cap layer 160 may be or include a hard light transmissive material, such as aluminosilicate glass (soda lime glass), sapphire (sapphire), a transparent polymer, other suitable materials, or combinations thereof. In some embodiments, cap layer 160 may have a thickness ranging between about 400 microns to about 2000 microns (please identify).
In some embodiments, the third adhesive layer 150 may be an Optically Clear Adhesive (OCA), such as a pressure sensitive optical adhesive, a photo-curable optical adhesive, or other suitable optically clear adhesive. In some embodiments, a third adhesive layer 150 having a refractive index close to that of cap layer 160 may be selected. For example, if cover layer 160 is a typical glass with a refractive index approximately equal to 1.5, third adhesive layer 150 may be an optically clear adhesive with a refractive index close to 1.5. In some embodiments, third adhesive layer 150 may have a thickness ranging between about 25 microns to about 150 microns.
Referring to fig. 2, a cross-sectional view of the force sensing device 100 in the force sensing module 10 is shown according to some embodiments of the invention. The force sensing device 100 of the present embodiment includes a substrate 101 and a plurality of pressure sensing units 103 formed on a surface of the substrate 101. When the pressure sensing module 10 is pressed by a finger, the volume of the pressure sensing unit 103 changes due to the pressure, and the resistance of the pressure sensing unit 103 is affected.
In some embodiments, the substrate 101 may be a flexible substrate, such as Polyimide (PI), polypropylene (PP), Polystyrene (PS), Acrylonitrile Butadiene Styrene (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), Polycarbonate (PC), Polyethylene (PE), polymethyl methacrylate (PMMA), Polytetrafluoroethylene (PTFE), similar materials, or a combination thereof. In some embodiments where the force-sensing device 10 is applied to a non-flexible device, the substrate 101 may be a rigid substrate, such as glass, tempered glass, sapphire glass, similar materials, or a combination thereof.
Fig. 3 is an equivalent circuit diagram of the pressure sensing unit 103 in the force sensing device 100. In some embodiments, each pressure sensing unit 103 may include four sub-pressure sensing units 103', and each sub-pressure sensing unit 103' corresponds to a resistor R having the same resistance1Resistance R2Resistance R3And a resistance R4. The four resistors are electrically connected to form a bridge, wherein the resistor R1And a resistance R2Series connection, resistance R3And a resistance R4Connected in series, and the two series circuits are connected in parallel to form a Wheatstone bridge. The Wheatstone bridge has the effect of temperature compensation, and is beneficial to reducing the sensing difference of the magnitude signals of the pressing force generated by the force sensing device under the influence of the ambient temperature, thereby improving the problem of sensing distortion of the magnitude signals of the pressing force.
As shown in fig. 3, at the resistance R1And a resistor R3Electrical connection point B and resistor R4And a resistance R2A power supply VEX is loaded between the electrical connection points D, and a resistor R1And a resistor R2Electrical connection point A and resistor R of3And a resistor R4Between the electrical connection points C generates an output voltage U0Voltage U0Corresponding to the pressing pressure value.
In some embodiments, the pressure sensing unit 103 (i.e., Wheatstone bridge) may include a circuit boardTwo non-adjacent resistors (e.g., resistor R) of the same pattern shape of the first extension direction (e.g., X direction)1And a resistance R4) And two other non-adjacent resistors (e.g., resistor R) having the same pattern shape of the second extending direction (e.g., Y direction)2And a resistance R3). The first extending direction is different from the second extending direction, so that the output detection signal is larger. In a particular embodiment, the first and second directions of extension are arranged perpendicular to each other.
In some embodiments, two resistors with the same extending direction of the pattern shape may be distributed diagonally (e.g., resistor R)1And a resistance R4Distributed diagonally and having a resistance R2And a resistance R3Diagonally) to improve the accuracy of force sensing. In some embodiments, the pattern shape of the resistor with the first extending direction after being rotated by 90 ° in a plane is the same as or mirror-symmetrical to the pattern shape of the resistor with the second extending direction, which can simplify the manufacturing process steps while ensuring the stability of the wheatstone bridge.
In other embodiments of the invention, the resistor R is ensured1Resistance R2Resistance R3And a resistance R4Under the condition that the resistance values of the resistors R are the same, the resistors R1Resistance R2Resistance R3And a resistance R4May be the same or different.
Referring to fig. 4, a cross-sectional view of the force sensing module 10 according to another embodiment of the invention is shown. The present embodiment is substantially the same as the embodiment of fig. 1, except that the present embodiment further includes a touch sensing layer 170 disposed between the cover layer 160 and the flexible display device 140. The combination of the touch sensing layer 170 and the cover layer 160 together form a touch panel 180, so that the force sensing module 10 of the present embodiment has touch and display functions. The touch sensing layer 170 is used for sensing a touch position of a user.
In the present embodiment, the touch sensing layer 170 is directly formed on the upper surface of the flexible display device 140, and the cover layer 160 is attached to the touch sensing layer 170 through the third adhesive layer 150. In other embodiments, the touch sensing layer 170 may be formed directly on the lower surface of the cover layer 160, and then attached to the upper surface of the flexible display device 140 through the third adhesive layer 150. In such embodiments, the touch panel 180 is an on-cell (on-cell) structure, and the composition of the cover layer 160 and the touch sensing layer 170 may be, for example, a layer structure design including a one-glass solution (OGS) touch panel, a GFF (glass-film-film) touch panel, a GF (glass-film) touch panel, or a GF2 touch panel, in other words, the touch sensing layer 170 is not limited herein to the sense electrode layer (not shown) and the substrate (not shown). In other embodiments, the touch panel may also be an in-cell (in-cell) structure, i.e., the touch sensing layer 170 is embedded in the flexible display device 140.
Fig. 5 is a schematic cross-sectional view of force sensing module 20 according to other embodiments of the present invention. In this embodiment, the embodiment is similar to the embodiment of fig. 1, except that the flexible device in the force sensing module 20 is a flexible touch device 240. Details regarding this embodiment that are similar to previously described embodiments will not be repeated here.
In the present embodiment, the force sensing module 20 includes, in order from top to bottom, a flexible touch device 240, a rigid material layer 120, and a force sensing device 100. The force sensing device 100 of the force sensing module 20 is similar to the force sensing device 100 of the force sensing module 10 of fig. 1 and 4, and the description thereof is omitted. Similarly, the rigid material layer 120 has a first surface 120A and a second surface 120B, wherein the force sensing device 100 is attached to the first surface 120A of the rigid material layer 120 through the first adhesive layer 110, and the flexible touch device 240 is attached to the second surface 120B of the rigid material layer 120 through the second adhesive layer 130.
In the present embodiment, the flexible touch device 240 includes a cover layer 160, at least one touch sensing layer 170 and a third adhesive layer 150, wherein the touch sensing layer 170 is attached to the cover layer 160 through the third adhesive layer 150, the number of layers of the sensing electrode layer 170 is not limited herein, and if a multi-layer structure is adopted, the layers are electrically insulated by an insulating layer/film (not shown). In other embodiments, the flexible touch device 240 includes a cover layer 160 and at least one touch sensing layer 170, wherein the touch sensing layer 170 is a single-layer structure and is directly formed on the lower surface of the cover layer 160.
According to the above embodiment, the rigid material layer 120 may be additionally disposed between the force sensing device 100 and the flexible device (e.g., the flexible display device 140 and the flexible touch device 240) of the force sensing module 10 to enhance the signal detected by the force sensing device 100 and enable the relationship between the sensed signal value and the pressure to be linear. Therefore, the actual pressure generated by the user control operation can be accurately detected. In addition, the rigid material layer 120 can also protect the flexible device from being damaged.
In addition, the pressure sensing unit 103 of the force sensing device 100 may include a wheatstone bridge composed of four resistors with the same resistance value, which has the advantages of temperature compensation and voltage signal enhancement, and is helpful for reducing the difference of sensing the magnitude of the pressing force signal generated by the force sensing device 100 under the influence of the ambient temperature, thereby improving the problem of sensing distortion of the magnitude of the pressing force signal.
The force sensing module of the present invention can be applied to various electronic devices, such as mobile and portable devices (e.g., mobile phones, electronic book readers), wearable electronic devices (e.g., watches), interactive multimedia machines (kiosk), and so on.
It should be understood that, although only the force sensing module shown in fig. 1, fig. 4 and fig. 5 may be designed with a flexible display device or a flexible touch device, in other embodiments, the force sensing module of the embodiment of the invention may also be designed with other types of flexible devices to compensate for the signal detection problem caused by the characteristics of the flexible device.
The foregoing has outlined rather broadly the features of several embodiments of the present invention so that those skilled in the art may better understand the present invention. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for modifying or designing other structures or processes for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. It should also be understood by those skilled in the art that equivalent structures or fabrication processes may be employed without departing from the spirit and scope of the present invention, and that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (20)
1. A force sensing module, comprising
A force sensing device;
a flexible display device disposed on the force sensing device; and
and the rigid material layer is arranged between the flexible display device and the force sensing device.
2. The force sensing module of claim 1, wherein the rigid material layer has a young's modulus of 70-250 GPa.
3. The force sensing module of claim 1, wherein the layer of rigid material has a thickness in a range of 100 microns to 300 microns.
4. The force sensing module of claim 1, wherein the rigid material layer comprises stainless steel, glass, acrylic, or a combination thereof.
5. The force sensing module of claim 1 wherein the flexible display device is an organic light emitting diode display device.
6. The force sensing module of claim 1, further comprising a first adhesive layer and a second adhesive layer, wherein the force sensing device is attached to the first surface of the rigid material layer via the first adhesive layer, and the flexible display device is attached to the second surface of the rigid material layer via the second adhesive layer.
7. The force sensing module of claim 1, further comprising a cover layer and a third adhesive layer, wherein the cover layer is attached to the flexible display device via the third adhesive layer.
8. The force sensing module of claim 7, wherein the third adhesive layer comprises an optically clear adhesive.
9. The force sensing module of claim 1, further comprising a touch panel, wherein the flexible display device is disposed between the touch panel and the force sensing device.
10. The force sensing module of claim 1, further comprising a touch sensing layer that detects a touch location, the touch sensing layer being embedded in the flexible display device.
11. The force sensing module of claim 1, wherein the force sensing device comprises:
a substrate; and
the pressure sensing units are arranged on the substrate, each pressure sensing unit comprises four resistors with the same resistance value, and the four resistors form a Wheatstone bridge.
12. A force sensing module, comprising
A force sensing device;
a flexible touch device disposed on the force sensing device; and
and the rigid material layer is arranged between the flexible display device and the force sensing device.
13. The force sensing module of claim 12, wherein the rigid material layer has a young's modulus of 70-250 GPa.
14. The force sensing module of claim 12, wherein the layer of rigid material has a thickness in a range of 100 microns to 300 microns.
15. The force sensing module of claim 12, wherein the rigid material layer comprises stainless steel, glass, acrylic, or a combination thereof.
16. The force sensing module of claim 12, further comprising a first adhesive layer and a second adhesive layer, wherein the force sensing device is attached to the first surface of the rigid material layer via the first adhesive layer, and the flexible touch device is attached to the second surface of the rigid material layer via the second adhesive layer.
17. The force sensing module of claim 12, wherein the flexible touch device further comprises a cover layer, at least one touch sensing layer, and a third adhesive layer, wherein the touch sensing layer is attached to the cover layer through the third adhesive layer.
18. The force sensing module of claim 17, wherein the third adhesive layer comprises an optically clear adhesive.
19. The force sensing module of claim 12, wherein the flexible touch device further comprises a cover layer and at least one touch sensing layer, the touch sensing layer being formed directly on a surface of the cover layer.
20. The force sensing module of claim 12, wherein the force sensing device comprises:
a substrate; and
the pressure sensing units are positioned on the substrate, each pressure sensing unit comprises four resistors with the same resistance value, and the four resistors form a Wheatstone bridge.
Priority Applications (3)
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|---|---|---|---|
| CN201910388195.4A CN111913603A (en) | 2019-05-10 | 2019-05-10 | Force sensing module |
| TW108211391U TWM588242U (en) | 2019-05-10 | 2019-08-28 | Force sensing module |
| TW108130717A TWI798482B (en) | 2019-05-10 | 2019-08-28 | Force sensing module |
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|---|---|---|---|
| CN201910388195.4A CN111913603A (en) | 2019-05-10 | 2019-05-10 | Force sensing module |
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| CN111913603A true CN111913603A (en) | 2020-11-10 |
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|---|---|---|---|---|
| CN102667678A (en) * | 2009-11-20 | 2012-09-12 | 夏普株式会社 | Flexible display panel with touch sensor function |
| AU2015100011B4 (en) * | 2014-01-13 | 2015-07-16 | Apple Inc. | Temperature compensating transparent force sensor |
| CN106708327B (en) * | 2017-01-21 | 2023-04-11 | 宸鸿科技(厦门)有限公司 | Pressure sensor and display device |
| CN109390288B (en) * | 2017-08-14 | 2022-01-28 | 财团法人工业技术研究院 | Impact-resistant shock-absorbing structure and electronic device |
-
2019
- 2019-05-10 CN CN201910388195.4A patent/CN111913603A/en not_active Withdrawn
- 2019-08-28 TW TW108130717A patent/TWI798482B/en active
- 2019-08-28 TW TW108211391U patent/TWM588242U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202041837A (en) | 2020-11-16 |
| TWM588242U (en) | 2019-12-21 |
| TWI798482B (en) | 2023-04-11 |
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Application publication date: 20201110 |