CN111865433A - Photoelectric receiver and manufacturing method thereof - Google Patents
Photoelectric receiver and manufacturing method thereof Download PDFInfo
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- CN111865433A CN111865433A CN201910366846.XA CN201910366846A CN111865433A CN 111865433 A CN111865433 A CN 111865433A CN 201910366846 A CN201910366846 A CN 201910366846A CN 111865433 A CN111865433 A CN 111865433A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
- H04B10/66—Non-coherent receivers, e.g. using direct detection
- H04B10/69—Electrical arrangements in the receiver
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
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Abstract
The application discloses photoelectric receiver and photoelectric receiver's manufacturing method, photoelectric receiver includes tube socket, pin, first electronic component and second electronic component, the tube socket is equipped with the mounting surface, the mounting surface is equipped with the recess, the pin by the recess bottom is passed the tube socket, the tip of pin sinks in the recess, first electronic component pile up in on the mounting surface, first electronic component is laminating mounting surface one side be equipped with accept in the recess and with the pad that the pin switched on, second electronic component with first electronic component side by side, and with first electronic component warp cable switches on. The first electronic element can be stacked on the pin, so that the overall size of the photoelectric receiver is effectively reduced, and the use space is saved.
Description
Technical Field
The present disclosure relates to the field of optoelectronic communication devices, and more particularly, to an optoelectronic receiver and a method for manufacturing the optoelectronic receiver.
Background
With the rapid development of the communication industry and the continuous improvement of the living standard of people, people have higher and higher requirements on the network transmission rate, and therefore, the requirements on the transmission rate of optical devices are also higher and higher. At present, the upgrading and upgrading of optical devices with network transmission rate are faster and faster, the production scale of the optical devices is larger and larger, and the production input cost of the network optical devices is also increased. However, the development of network technology is required to move towards high performance and low cost. In network technology, the cost of optical devices is high, and the development and manufacture of optical devices are important to consider when upgrading the network technology.
With the increase of the requirement on the transmission rate of the optical device, the requirement on the product chip is higher and higher, the internal structure of the chip is more and more complex, and with the complexity of the circuit function of the chip and the anti-interference processing for dealing with high-frequency signals, the size of the trans-impedance amplifier (TIA) has to be larger.
The current optical device industry chain of E/GPON and 10G-PON is mature, and for the next generation PON after 10G-PON, the industry has more recently researched single wavelength 25G-PON. A single wavelength 25G-PON would use an increasingly bulky trans-impedance signal amplifier. But the transimpedance signal amplifier with larger volume occupies more use space of the photoelectric receiver.
Under the condition that the volume of the transimpedance amplifier becomes larger and larger, the rear end of the transimpedance amplifier is applied to the situation that the size of a tube seat of an optical device is required to be kept as the original shape, and as the chip accommodating space of the tube seat is not enlarged, the transimpedance signal amplifier is larger, so that the tube seat space cannot be used for placing related chips such as the transimpedance amplifier, a photoelectric detection chip, a capacitor, a resistor and the like, and therefore, greater requirements are put on arrangement among the chips and related improvement of the tube seat.
In the present situation, in addition to arranging the transimpedance signal amplifier with a large volume on the socket of the optical-electrical receiver, a pin penetrating through the socket needs to be arranged to conduct with the transimpedance signal amplifier by using the pin. Under the structure that the pin is arranged side by side with the transimpedance signal amplifier, the whole volume of the tube seat of the photoelectric receiver is increased along with the increase of the volume of the transimpedance signal amplifier.
In the prior art, a pluggable multi-transverse-mode light receiving component (publication number: CN 207181762U) is provided, which includes a conversion component, the conversion component includes a base and a tube cap disposed at the left end of the base, the tube cap and the base are assembled to form a cavity, a photoelectric detector chip and a transimpedance amplifier are disposed in the cavity, the photoelectric detector chip is disposed at the upper end of the transimpedance amplifier, and the photoelectric detector chip is connected to the transimpedance amplifier through conductive silver paste. The photoelectric detector chip is stacked on the transimpedance amplifier, and the technical problem that the arrangement space of the transimpedance amplifier and the photoelectric detector is large is solved. Under this kind of structure, can guarantee the effective electric connection of photoelectric detector chip and the pin that passes the base, make full use of the structure of pin and transimpedance signal amplifier and arrange the space, nevertheless pile up the photoelectric detector chip on transimpedance amplifier, the cost of manufacture is higher, and the positioning accuracy of photoelectric detector chip is difficult to control, and the conductivity of photoelectric detector chip and transimpedance amplifier can also reduce to some extent moreover. In other words, in such a structure, although the overall size of the light receiving module can be effectively reduced, the cost of the light receiving module still increases, the positioning accuracy of the photoelectric detection chip is low, the photoelectric conversion efficiency of the light receiving module is reduced, and the development requirements of low cost and high performance cannot be met.
Therefore, how to arrange the structure of the photoelectric detector chip, the transimpedance signal amplifier and the pin on the tube seat of the optical device becomes a very important problem for the structure optimization of the optical device. The structural arrangement of the photoelectric detector chip is often required to be higher, and the accuracy is difficult to control. Therefore, how to arrange the structure of the transimpedance signal amplifier and the pin becomes an important problem in the development and manufacturing processes of the light receiving component.
Disclosure of Invention
The application provides a photoelectric receiver and a manufacturing method of the photoelectric receiver.
The application provides a photoelectric receiver, wherein, photoelectric receiver includes tube socket, pin, first electronic component and second electronic component, the tube socket is equipped with the mounting surface, the mounting surface is equipped with the recess, the pin by the recess bottom is passed the tube socket, the tip of pin sinks in the recess, first electronic component pile up in on the mounting surface, first electronic component is laminating mounting surface one side be equipped with accept in the recess and with the pad that the pin switched on, second electronic component with first electronic component electric connection.
The end face of the pin is provided with a conductive layer, and the pin is electrically connected with the bonding pad through the conductive layer.
The photoelectric receiver is provided with at least one pin and at least one groove, and the end part of the pin is contained in the groove.
The photoelectric receiver further comprises a signal output pin and a signal input pin, the signal output pin and the signal input pin penetrate through the tube seat, and the end parts of the signal output pin and the signal input pin are exposed out of the mounting end face and are connected to the first electronic element through a conductive cable.
The application also provides a manufacturing method of the photoelectric receiver, wherein the manufacturing method of the photoelectric receiver comprises the following steps:
providing a tube seat, wherein the tube seat is provided with a mounting end face, and a groove is formed in the mounting end face;
the pin penetrates through the tube seat through the groove, and the end part of the pin is exposed out of the groove;
cutting off the end part of the pin exposed out of the groove;
providing a first electronic element, wherein one side of the first electronic element is provided with a bonding pad;
attaching one surface of the first electronic element, which is provided with a bonding pad, to the mounting end surface, and accommodating the bonding pad in the groove, wherein the bonding pad is electrically connected with the pin;
and providing a second electronic element, attaching the second electronic element to the mounting end face, and connecting the second electronic element with the first electronic element through a conductive cable.
The manufacturing method of the photoelectric receiver further comprises the following steps:
plating a conductive layer on the cut surface of the pin; the bonding pad is electrically connected with the pin through the conducting layer.
Wherein the groove penetrates through the tube seat.
The manufacturing method of the photoelectric receiver further comprises the following steps:
and filling insulating cement into the groove, wherein the insulating cement is solidified in the groove through a sintering process, and the distance from the upper surface of the insulating cement to the mounting end surface is 0.28-0.32 mm.
And the cut end surface of the pin sinks in the groove.
The distance from the cut end face of the pin to the mounting end face is 0.02mm, and the thickness of the bonding pad is 0.02 mm.
According to the photoelectric receiver and the manufacturing method of the photoelectric receiver, the groove is formed in the mounting end face of the tube seat, the end portion of the pin is contained in the groove, the mounting area of the first electronic element can be increased through arrangement of the mounting end face, the first electronic element can be stacked on the pin, the overall size of the photoelectric receiver is effectively reduced, and the using space is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a photoelectric receiver provided in an embodiment of the present application;
fig. 2 is a schematic perspective exploded view of a photoelectric receiver provided in an embodiment of the present application;
FIG. 3 is another schematic diagram of a photoelectric receiver provided in an embodiment of the present application;
FIG. 4 is another schematic diagram of a photoelectric receiver provided in an embodiment of the present application;
fig. 5 is another exploded perspective view of a photoelectric receiver provided in an embodiment of the present application;
FIG. 6 is a schematic exploded perspective view of a photoelectric receiver according to another embodiment of the present application;
FIG. 7 is another schematic diagram of a photoelectric receiver provided in an embodiment of the present application;
fig. 8 is a schematic flowchart of a method for manufacturing a photoelectric receiver according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present disclosure.
In the description of the embodiments of the present application, it should be understood that the terms "thickness" and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, and do not imply or indicate that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
Referring to fig. 1 and fig. 2, the present application provides a photoelectric receiver 100, where the photoelectric receiver 100 includes a socket 10, a pin 20, a first electronic component 30, and a second electronic component 40. In the present embodiment, the first electronic component 30 is preferably an electronic component having a function of amplifying a signal, such as a transimpedance signal amplifier, and the second electronic component 40 is preferably a photoelectric conversion chip.
The tube seat 10 is provided with a mounting end surface 11, and the mounting end surface 11 is provided with a groove 12. The pin 20 passes through the socket 10 from the bottom of the groove 12. The ends of the pins 20 sink into the recesses 12. The first electronic component 30 is stacked on the mounting end surface 11. The first electronic element 30 is provided with a pad 31 which is accommodated in the groove 12 and is communicated with the pin 20 at one side of the mounting end surface 11, and the second electronic element 40 is arranged side by side with the first electronic element 30 and is communicated with the first electronic element 30 through a cable.
It is understood that the optical receiver 100 is applied to a 25G/100GPON optical fiber network communication technology. The first electronic component 30 is larger in size than a conventional first electronic component 30.
The groove 12 is formed in the mounting end face 11 of the tube seat 10, and the end portion of the pin 20 is accommodated in the groove 12, so that one side of the tube seat 10 is flatly arranged, that is, the mounting area of the tube seat 10 where the first electronic elements 30 can be arranged is increased, the first electronic elements 30 can be stacked on the pin 20, the overall size of the photoelectric receiver 100 is effectively reduced, and the use space is saved.
In the present embodiment, the stem 10 is further provided with a bottom surface 13 provided opposite to the mounting end surface 11. The tube holder 10 is provided with a mounting flange 14 on the circumferential side. The mounting flange is adjacent the bottom surface 13. The mounting flange is adapted to mate with an edge of the pip cap 50. An optical lens 51 is disposed in the center of the cap 50, the optical lens 51 faces the second electronic element 40, the optical lens 51 is used for receiving an optical signal and transmitting the optical signal to the second electronic element 40, and the optical lens 51 has an effect of collecting an optical signal. The groove 12 extends from the mounting pack end face 11 towards the bottom face 13. The groove 12 is located near the edge of the mounting end face 11. The socket 10 is substantially cylindrical. Of course, in other embodiments, the socket 10 may have a square cylindrical shape.
In this embodiment, the pins 20 pass through the bottom of the groove 12 and through the bottom surface 13. The pins 20 are substantially perpendicular to the mounting end face 11. The end of the pin 20 sunk into the groove 12 can be electrically connected with the first electronic element 30 to receive the electric signal of the first electronic element 30. The end of the pin 20 sunk into the recess 12 can be soldered to a pad 31 of the first electronic component 30. Of course, in other embodiments, the end of the pin 20 sinking into the groove 12 may also be electrically connected to the pad 31 of the first electronic component 30 via conductive silver paste.
In order to increase the accommodation space of the socket 10 and to ensure the sinking of the pins 20, the structure of the first electronic component 30 also needs to be optimized to ensure the normal wire bonding.
Because the first electronic component 30 is directly attached to the sunken pin 20, the pin 20 cannot be connected with the pad on the side of the first electronic component 30 far away from the tube seat 10 through the routing, so that the front pad of the first electronic component 30 needs to be designed as a back pad, the back pad of the first electronic component 30 can be electrically connected with the pin 20 through the conductive adhesive, the routing is not needed, and the remaining front pads can be still reserved for routing.
In the present embodiment, the first electronic component 30 includes an upper surface 32 and a lower surface 33 disposed opposite to the upper surface 32. The lower surface 33 is attached to the mounting end surface 11. The lower surface 33 of the first electronic component 30 can be adhered to the mounting end surface 11 by glue. The pad 31 is disposed on the lower surface 33, and the pad 31 exposes the adhesive on the lower surface 33. The pad 31 is accommodated in the groove 12, so that the pad 31 is conveniently conducted with the pin 20, and the first electronic component 30 is conveniently and smoothly attached to the mounting end surface 11. The first electronic component 30 is provided with a plurality of conductive pins 321 on the upper surface 32, and the plurality of conductive pins 321 can be electrically connected to the second electronic component 40 through a cable.
In this embodiment, the second electronic component 40 is located at the geometric center of the mounting end surface 11 to receive an optical signal conveniently. The second electronic component 40 can be adhered to the mounting end surface 11 through an insulating adhesive. The side wall of the second electronic component 40 is tightly abutted against the first electronic component 30, so that the structure of the photoelectric receiver 100 is compact, the overall volume is reduced, and the use space is saved.
In the embodiment of the present application, the structures of the tube seat 10 and the tube pins 20 are optimized to achieve the increase in the volume of the first electronic component 30, and the overall volume of the photoelectric receiver 100 can be maintained as it is. The pin of conventional tube socket is convenient for the routing, and the space is also enough simultaneously, and the pin generally can be higher than the tube socket plane, exposes partial pin, because the pin exposes the tube socket plane, leads to the chip can't place at the pin and exposes the part, has reduced the space of base holding chip. In order to increase the chip accommodating space without changing the size of the socket 10, the pins 20 are sunk into the socket 10, that is, the grooves 12 are arranged in the socket 10, the ends of the pins 20 are sunk into the grooves 12, so that the end surfaces of partial pins 20 are flush with the plane of the socket 10 or slightly lower than the plane of the socket 10, and the chip can be placed in the parts, and the chip accommodating space is increased invisibly. Further, referring to fig. 3, an end surface of the pin 20 is provided with a conductive layer 21, and the pin 20 is electrically connected to the pad 31 through the conductive layer 21.
In this embodiment, the conductive layer 21 is a gold plating layer. The conductive layer 21 is plated on the end surface of the pin 20 sinking into the groove 12 through an electroplating process. By utilizing the oxidation resistance of the conductive layer 21, the conductivity between the conductive layer 21 and the bonding pad 31 is improved, so as to ensure the conductivity between the pin 20 and the first electronic component 30. Of course, in other embodiments, the conductive layer 21 may be a silver plating layer or a copper plating layer.
Further, referring to fig. 4, the groove 12 is filled with an insulating adhesive 121, and the conductive layer 21 is exposed out of the insulating adhesive 121.
In this embodiment, after the pin 20 passes through the bottom of the groove 12 and the end of the pin 20 sinks into the groove 12, the insulating glue 121 is filled into the groove 12. The insulating glue 121 may be filled in the groove 12 through a casting process. By controlling the filling amount of the insulating adhesive 121, the insulating adhesive 121 is coated on the peripheral side of the pin 20, and the end surface of the pin 20 is exposed out of the insulating adhesive 121, so that the conductive layer 21 and the pad 31 are conveniently conducted. The insulating glue 121 stabilizes the pins 20 to increase the structural stability of the photovoltaic receiver 100. The distance from the upper surface of the insulating rubber 121 to the mounting end surface 11 of the tube seat 10 is 0.28mm to 0.32 mm. The distance from the end face of the pin 20 to the mounting end face 11 is 0.02 mm. The thickness of the bonding pad 31 is 0.02mm, so that the bonding pad 31 abuts against the end face of the pin 20. Of course, in other embodiments, a molded insulating ring may be assembled into the groove 12, and the peripheral side of the pin 20 may be sleeved with the insulating ring to stabilize the pin 20.
In one embodiment, referring to fig. 5, the pin 20 is a ground pin. The photo-receiver 100 further includes a dummy pin 22, a signal pin 23, and a voltage pin 24. The dummy pin 22, the signal pin 23 and the voltage pin 24 all penetrate through the mounting end surface 11 and the bottom surface 13. The signal pin 23 and the voltage pin 24 are electrically connected to the first electronic component 30 via a conductive cable. The end of the dummy pin 22, the signal pin 23, and the voltage pin 24 passing through the mounting end face 11 is located on the side of the first electronic component 30.
In another embodiment, referring to fig. 2, the photoelectric receiver 100 is provided with a plurality of pins 20, the mounting end surface 121 is provided with a plurality of grooves 12, and an end portion of each pin 20 is correspondingly received in each groove 12. A plurality of said grooves 12 are mutually isolated. The plurality of pins 20 may be a ground pin, a dummy pin, a signal pin, and a voltage pin, respectively. The ends of the pins 20 are sunk into the grooves 12, so that the mounting area of the mounting end surface 11 is further increased, and the first electronic element 30 is convenient to mount.
In another embodiment, referring to fig. 6, the photoelectric receiver 100 is provided with a plurality of pins 20, and the end portions of the plurality of pins 20 are all received in one of the grooves 12. The plurality of pins 20 are accommodated in one groove 12, so that the structure of the tube seat 10 is simplified, and the manufacturing cost of the tube seat 10 is reduced.
Further, with reference to fig. 2, the optoelectronic receiver 100 further includes a signal output pin 60 and a signal input pin 70, the signal output pin 60 and the signal input pin 70 penetrate through the socket 10, and an end of the signal output pin 60 and an end of the signal input pin 70 are exposed out of the mounting end surface 11 and connected to a pad of the first electronic component 30 disposed on the front surface through a conductive cable.
Referring to fig. 1 and 8, a method for fabricating a photoelectric receiver is also provided, which is used to fabricate the photoelectric receiver 100. In the present embodiment, the first electronic component 30 is preferably an electronic component having a function of amplifying a signal, such as a transimpedance signal amplifier, and the second electronic component 40 is preferably a photoelectric conversion chip.
The manufacturing method of the photoelectric receiver comprises the following steps:
101: providing a tube seat 10, wherein the tube seat 10 is provided with a mounting end surface 11, and the mounting end surface 11 is provided with a groove 12.
In this embodiment, the stem 10 may be made of metal. The socket 10 may be formed through a stamping process. The recess 12 may be formed in the mounting end face 11 by a milling process. The bottom of the groove 12 may be formed with a through hole 122 by a wire cutting process to facilitate the pin 20 to pass through the socket 10 through the through hole 122. After the through hole 122 is formed, an insulating adhesive may be formed in the through hole 122, so as to facilitate insulation between the tube seat 10 and the tube pin 20.
In one embodiment, as shown in FIG. 7, the groove 12 may also be in the form of a wire-cutting process or a milling process, with the groove 12 extending completely through the header 10. After the groove 12 is formed, the peripheral side wall of the groove 12 is polished to remove burrs, so that the pin 20 can be conveniently installed in the groove 12 in a subsequent step. The machining precision of the groove is plus or minus 50um (no negative tolerance is left). The groove 12 may be a circular groove.
102: the pin 20 is inserted through the socket 10 via the groove 12, and the end of the pin 20 is exposed out of the groove 12.
In this embodiment, the end of the pin 20 is exposed out of the groove 12, so that the end of the pin 20 can be cut conveniently, the end of the pin 20 can be sunk into the groove 12 conveniently, and the end of the pin 20 can be prevented from being sunk into the groove 12 too much.
103: the portion of the pin 20 exposed from the recess 12 is cut away.
In this embodiment, the portion of the pin 20 exposed out of the groove 12 may be removed by a milling process, so that the end surface of the pin 20 after being cut off may slightly sink into the groove 12. The end face of the pin 20 after being cut off is 0.02mm from the mounting end face 11 to facilitate the subsequent contact of the pad 31 with the pin 20 and to prevent the pin 20 from lifting the first electronic component 30. After the end of the pin 20 is milled and cut, the end surface of the pin 20 is polished, and the end surface of the pin 20 is polished to increase the smoothness of the end surface of the pin 20, so as to increase the contact performance of the pin 20 and the pad 31.
104: and plating a conductive layer 21 on the cut surface of the pin 20.
In this embodiment, the conductive layer 21 is a gold plating layer. And after the end surface of the pin 20 is ground and polished to increase the flatness of the pin 20, plating a conductive layer 21 on the end surface of the pin 20. The conductive layer 21 is a gold plating layer. Of course, in other embodiments, the conductive layer 21 may be a silver plated layer, or a copper plated layer.
105: and filling the groove 12 with an insulating glue 121, wherein the conductive layer 21 is exposed out of the insulating glue 121.
In this embodiment, the insulating glue 121 may be formed in the groove 12 through a casting process. After the insulating glue 121 is filled in the groove 12, the insulating glue 121 is cured through a sintering process to stabilize the pin 20 and the socket 10. The distance from the upper surface of the insulating glue 121 to the mounting end surface 11 is 0.28mm to 0.32 mm. Of course, in other embodiments, the insulating glue 121 may also be formed in the groove 12 by a dispensing process.
106: a first electronic component 30 is provided, said first electronic component 30 being provided with a pad 31 on one side.
In the present embodiment, the pad 21 is provided on one surface of the first electronic component 30. The pad 21 can be electrically connected to the circuit of the first electronic component 30 via a conductor.
107: the first electronic component 30 is attached to the mounting end surface 11 with a pad 31, and the pad 31 is accommodated in the groove 20, and the pad 31 can be electrically connected to the pin 20 through a conductive adhesive.
In this embodiment, the pad 31 may closely abut against the conductive layer 21, and the pad 31 is electrically connected to the pin 20 through the conductive layer 21.
108: providing a second electronic element 40, attaching the second electronic element 40 to the mounting end surface 11, and connecting the first electronic element 30 through a conductive cable.
In this embodiment, the second electronic component 40 may be adhered to the mounting end surface 11 by an adhesive and located at the geometric center of the socket 10, so as to increase the structural stability and accuracy of the optoelectronic receiver 100.
The groove is formed in the mounting end face of the tube seat, the end portion of the tube pin is contained in the groove, the mounting area of the first electronic elements which can be arranged on the mounting end face is enlarged, the first electronic elements can be stacked on the tube pin, the whole size of the photoelectric receiver is effectively reduced, and the using space is saved.
The foregoing is an implementation of the embodiments of the present application, and it should be noted that, for those skilled in the art, several modifications and decorations can be made without departing from the principle of the embodiments of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.
Claims (10)
1. The photoelectric receiver is characterized by comprising a tube seat, a pin, a first electronic element and a second electronic element, wherein the tube seat is provided with an installation end face, the installation end face is provided with a groove, the pin penetrates through the bottom of the groove and sinks into the tube seat, the end part of the pin is sunk into the groove, the first electronic element is stacked on the installation end face, the first electronic element is attached to one side of the installation end face and is provided with a bonding pad which is contained in the groove and conducted with the pin, and the second electronic element is electrically connected with the first electronic element.
2. A photoreceptor according to claim 1, wherein the pin end face is provided with a conductive layer, the pin being electrically connected to the pad via the conductive layer.
3. The photoreceptor according to claim 1, wherein the photoreceptor is provided with at least one pin and at least one groove, the end of the pin being received in the groove.
4. The photoreceiver of claim 1, further comprising a signal output pin and a signal input pin that pass through the stem, an end of the signal output pin and an end of the signal input pin being exposed at the mounting end face and connected to the first electronic component via a conductive cable.
5. A method for manufacturing a photoelectric receiver is characterized by comprising the following steps:
providing a tube seat, wherein the tube seat is provided with a mounting end face, and a groove is formed in the mounting end face;
the pin penetrates through the tube seat through the groove, and the end part of the pin is exposed out of the groove;
cutting off the end part of the pin exposed out of the groove;
providing a first electronic element, wherein one side of the first electronic element is provided with a bonding pad;
attaching one surface of the first electronic element, which is provided with a bonding pad, to the mounting end surface, and accommodating the bonding pad in the groove, wherein the bonding pad is electrically connected with the pin;
and providing a second electronic element, attaching the second electronic element to the mounting end face, and connecting the second electronic element with the first electronic element through a conductive cable.
6. The method of fabricating a photoelectric receiver according to claim 5, further comprising:
plating a conductive layer on the cut surface of the pin; the bonding pad is electrically connected with the pin through the conducting layer.
7. The method of claim 5, wherein the recess extends through the stem.
8. The method of fabricating a photoelectric receiver according to claim 5, further comprising:
and filling insulating cement into the groove, wherein the insulating cement is solidified in the groove through a sintering process, and the distance from the upper surface of the insulating cement to the mounting end surface is 0.28-0.32 mm.
9. The method of claim 5, wherein the cut end surface of the pin is recessed in the groove.
10. A method for manufacturing a photoelectric receiver according to claim 9, wherein the distance from the end surface of the pin after cutting to the mounting end surface is 0.02mm, and the thickness of the pad is 0.02 mm.
Priority Applications (1)
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| CN201910366846.XA CN111865433A (en) | 2019-04-30 | 2019-04-30 | Photoelectric receiver and manufacturing method thereof |
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| CN201910366846.XA CN111865433A (en) | 2019-04-30 | 2019-04-30 | Photoelectric receiver and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109725391A (en) * | 2017-10-27 | 2019-05-07 | 住友电工光电子器件创新株式会社 | Receiver optical module and its assemble method |
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Application publication date: 20201030 |