CN111859599A - Design method of lamination scheme for laminating doped or composite materials - Google Patents
Design method of lamination scheme for laminating doped or composite materials Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 197
- 238000003475 lamination Methods 0.000 title claims abstract description 30
- 239000002131 composite material Substances 0.000 title claims abstract description 22
- 238000010030 laminating Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 60
- 239000000758 substrate Substances 0.000 claims description 51
- 238000009795 derivation Methods 0.000 claims description 5
- 238000000605 extraction Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
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Abstract
The invention discloses a design method of a lamination scheme for laminating doped or composite materials, which belongs to the field of doped materials and composite materials, and does not have a clear and convenient design method for the lamination scheme for laminating doped or composite materials.
Description
The invention belongs to the field of materials, relates to a doped material and a composite material, and particularly relates to a design method of a lamination scheme for laminating the doped or composite material.
The atomic layer deposition technology is a technology that precursor gas and reaction gas enter a substrate alternately at a controllable speed, physical and chemical adsorption or surface saturation reaction is carried out on the surface of the substrate, and substances are deposited on the surface of the substrate layer by layer in the form of a monatomic film. Only one monoatomic film of one material can be grown at a time. When different materials are laminated and doped by the technology similar to atomic layer deposition, the laminated scheme design needs to be carried out on the doped materials in order to achieve the material performance required by the process.
One class of composite materials is called laminated composite materials, such as magnetic multilayer film materials, and different materials are alternately laminated together to exert respective advantages, overcome the defects of a single material and expand the application range of the material. When different materials are laminated and compounded, in order to fully exert the advantages of the respective materials and eliminate the defects as much as possible, the laminated scheme design of the composite materials is needed.
The invention provides a design method of a lamination scheme of a laminated doped or composite material, so that the laminated doped material can meet the material performance required by the process, the laminated composite material can give full play to the advantages, and the defects can be eliminated as far as possible.
A new mathematical operation, named WYM operation, is first defined. The design of the layer stack scheme is designed by means of this calculation and other method steps.
(1)
(2)
The WYM operation has stretch-shrink and expansion-compression properties, designated WYM properties 1 and WYM properties 2, and derives the WYM formula. (WYM Property 1 is demonstrated in appendix 1, WYM Property 2 is demonstrated in appendix 2, and the derivation of the WYM formula is shown in appendix 3)
WYM property 1:
WYM properties 2:
WYM formula:
a method of designing a lamination scheme for laminating a doped or composite material, comprising the steps of:
(1) Assuming that n materials are designed by a lamination scheme, a marking value is made for each material, so that n materials obtain n marking values and are written into
The first material indicia value at the first row position is referred to as the primary indicia value and the second material indicia value at the second row position is referred to as the secondary indicia value …; a and B represent real numbers and represent numerical values with decimal numbers, wherein A < a < A +1 and B < B < B +1 exist; a and B represent integers. A and A +1 are called two process substrates of a first-level marking value a; b and B +1 are called two process bases of a secondary mark value B; … …
(2) The score table is established, and the score table in any range can be established.
(3)
And
is the adjacent score in the score table.
And
is the adjacent score in the score table.
Look up the score table to obtain
C, D, E, F, J, H, I, J, K, L, M, N represent integers.
(4) The values of X, Y, U and V can be calculated through a linear equation of two.
……
(5) Using the WYM formula and the WYM properties 1 (derived in appendix 4)
A and A +1 are referred to as the process substrate of a;
process coefficient referred to as a.
(6) If it is 
Is not in the simplest form and is converted into the simplest form. Then applying WYM formula
Or
(7) If it is
Or
The front coefficient is not in the simplest form and is in the simplest form. Continuing to repeatedly apply WYM formula to stretch process coefficient until
The front coefficient is controlled to be more than 0 and less than 10, and more than 0 and less than 10.
(8) Shrinking by using WYM property 1 to meet the thickness requirement of the doped material and the composite material, so as to obtain the required process coefficient of a in the corresponding form of
(9) The process coefficient was extracted for each material index value to obtain the process table fig. 2. [ () () ] is referred to as the WYM unit.
(10) A first-stage combined substrate: combining the process substrates with the n material marking values into a first-level combined substrate; first-stage process combination: the process substrate with the first-level marking value is combined into a first-level process combination by different first-level combination substrates with the same form;
secondary composite substrate (primary process): adding a process coefficient of a first-level marking value to each first-level process combination to obtain a second-level combination substrate, or a first-level process;
the second-stage process combination: the process substrate with the secondary marking value is combined into a secondary process combination by different secondary combination substrates with the same form;
three-stage composite substrate (two-stage process): adding a process coefficient of a secondary marking value before each secondary process combination to obtain a tertiary combination substrate, or called a secondary process;
…………；
And (3) n-1 level process combination: the process substrate with the n-1 grade mark value is combined into an n-1 grade process combination from other n-1 grade combined substrates with the same form;
n-grade composite substrate (n-1-grade process): adding a process coefficient of an n-1 level mark value to each n-1 level process combination to obtain an n-level combination substrate, or an n-1 level process;
and (3) n-level process combination: the process substrate with the n-level marking value is combined into an n-level process combination from different n-level combination substrates with the same form;
and (2) n-stage process: and adding the process coefficient of the n-grade marking value to obtain the n-grade process before the n-grade process combination, namely forming the complete process of the n materials.
(11) Let e, g denote that the process substrate with n-grade mark value is different from two n-grade combined substrates with the same form, and the process coefficient with n-grade mark value is added to combine into one of n-grade processes, i.e.
Get
[e，g]For example, reading is performed using WYM property 1, starting from the last WYM cell, with successive unlocking (deduced in appendix 5).
The n-level lamination scheme is
The first process comprises the following steps: the small process e is repeated for G times, the small process G is repeated for H times, and the whole process is repeated for C times;
and a second process: the small process e is repeated for I times, the small process g is repeated for J times, and the whole process is repeated for D times;
the process I and the process II are combined to form a large process I, and the large process I is repeated for A times;
And a third process: the small process E is repeated for G times, the small process G is repeated for H times, and the whole process is repeated for E times;
and a fourth process: the small process e is repeated for I times, the small process g is repeated for J times, and the whole process is repeated for F times;
and the third process and the fourth process are combined into a second large process, and the second large process is repeated for B times.
Drawings
Figure 1 is a schematic diagram of two simple stacking schemes.
Fig. 2 is a process table formed after the extraction of the process coefficients is performed for the n index values.
Fig. 3 is a table of scores ranging from 0 to 1, where denominator and numerator are integers from 1 to 10.
FIG. 4 is a drawing showing
And extracting the process coefficients of the three marked values to form a process table.
Detailed Description
Three materials are designed for a lamination scheme, and three mark values are written as
A score table is established where denominator and numerator are integers from 1 to 10, and a score table in the range of 0 to 1 is established in FIG. 3.
Look-up table to obtain
Derived by WYM operation (derivation in appendix 6)
Obtain the attached diagram of the process table 4
A first-stage combined substrate:
first-stage process combination:
secondary combined substrate/primary process:
the second-stage process combination: (e, g), (f, h)
Three-stage combined substrate/two-stage process:
three-stage process combination: (i, j)
Three-stage process/complete process:
read by backward push of WYM Property 1 (derivation see appendix 7)
First level process read
Two stage process reading
i＝5[3(3e+5g)+(e+2g)]+[4(3e+5g)+(e+2g)]
j＝5[3(3f+5h)+(f+2h)]+[4(3f+5h)+(f+2h)]
Three-level process reading
k＝3[9(5i+6j)+(9i+11j)]+19[10(5i+6j)+(9i+11j)]
And obtaining a laminated design scheme to manufacture materials.
The first-level lamination scheme e is a process I: making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 2 times, making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, and repeating the steps for 7 times according to the making method; making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 5 times, making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 3 times, and repeating the steps for 3 times according to the making mode; the first process was cycled for 6 times. And a second process: making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 2 times, making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, and repeating the steps for 9 times according to the making method; making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 5 times, making 5 layers of the material A, making 6 layers of the material B, making 4 layers of the material C, repeating the steps for 3 times, and repeating the steps for 4 times according to the making mode; and the second process is circulated for 5 times. The first-order lamination scheme f, g, h is similar to the first-order lamination scheme e.
The second-level lamination scheme i is a first process: the first-level lamination scheme e is repeated for 3 times, the first-level lamination scheme g is repeated for 5 times, and the whole is repeated for 3 times; and a second process: the first-level lamination scheme e is repeated for 1 time, and the first-level lamination scheme g is repeated for 2 times; the process I and the process II are combined into a large process I, and the large process I is repeated for 5 times. And a third process: the first-level lamination scheme e is repeated for 3 times, the first-level lamination scheme g is repeated for 5 times, and the whole process is repeated for 4 times; and a fourth process: the first-level lamination scheme e is repeated for 1 time, and the first-level lamination scheme g is repeated for 2 times; and the third process and the fourth process are combined into a second large process. The secondary stacking scheme j is similar to the secondary stacking scheme i.
The three-level lamination scheme k is a process one: the second-level lamination scheme i is repeated for 5 times, the second-level lamination scheme j is repeated for 6 times, and the whole process is repeated for 9 times; and a second process: the secondary stacking scheme i is repeated 9 times, and the secondary stacking scheme j is repeated 11 times; the process I and the process II are combined into a large process I, and the large process I is repeated for 3 times. A third process; the second-level lamination scheme i is repeated for 5 times, the second-level lamination scheme j is repeated for 6 times, and the whole process is repeated for 10 times; and a fourth process: the secondary stacking scheme i is repeated 9 times, and the small process j is repeated 11 times; and synthesizing a large process II by the process III and the process four, and repeating the large process II 19 times.
Therefore:
Therefore:
WYM formula derivation
Thus, it is possible to provide
Thus, it is possible to provide
x＝87，y＝38
x＝19，y＝6
x＝239，y＝261
Claims (4)
1. A method of designing a lamination scheme for laminating a doped or composite material, characterized by: the method comprises the steps of extracting process coefficients from material marking values by constructing a new mathematical form, then combining process bases, and finally presenting a lamination scheme through the new mathematical form.
2. The extraction process factor of claim 1, wherein: first, the WYM operation is constructed
Thereby obtaining WYM property 1 and WYM property 2 and WYM formula; and then establishing a score table, wherein the decimal part of the material mark value is between two adjacent scores in the score table, obtaining a preliminary process coefficient by operation and application of WYM property 1 and WYM formulas, continuously extending the process coefficient by using the WYM formulas, and finally contracting the extended process coefficient by using the WYM property 1 so as to meet the requirements of the thickness of the doped material and the composite material. The process coefficients of the respective materials are obtained by this method.
3. The unitized process substrate of claim 1, wherein: making a marking value for each material, so that n materials obtain n marking values, which are written as 
The first material indicia value at the first row position is referred to as the primary indicia value and the second material indicia value at the second row position is referred to as the secondary indicia value …; a and B represent real numbers and represent numerical values with decimal numbers, wherein A < a < A +1 and B < B < B +1 exist; a and B represent integers. A and A +1 are called two process substrates of a first-level marking value a; b and B +1 are called two process bases of a secondary mark value B; two process substrates … … for C and C +1 with a tertiary index value of C
A first-stage combined substrate: combining the process substrates with the n material marking values into a first-level combined substrate;
first-stage process combination: the process substrate with the first-level marking value is combined into a first-level process combination by different first-level combination substrates with the same form;
secondary composite substrate (primary process): adding a process coefficient of a first-level marking value to each first-level process combination to obtain a second-level combination substrate, or a first-level process;
the second-stage process combination: the process substrate with the secondary marking value is combined into a secondary process combination by different secondary combination substrates with the same form;
three-stage composite substrate (two-stage process): adding a process coefficient of a secondary marking value before each secondary process combination to obtain a tertiary combination substrate, or called a secondary process;
............；
And (3) n-1 level process combination: the process substrate with the n-1 grade mark value is combined into an n-1 grade process combination from other n-1 grade combined substrates with the same form;
n-grade composite substrate (n-1-grade process): adding a process coefficient of an n-1 level mark value to each n-1 level process combination to obtain an n-level combination substrate, or an n-1 level process;
and (3) n-level process combination: the process substrate with the n-level marking value is combined into an n-level process combination from different n-level combination substrates with the same form;
and (2) n-stage process: and adding the process coefficient of the n-grade marking value to obtain the n-grade process before the n-grade process combination, namely forming the complete process of the n materials.
4. The presentation stacking scheme of claim 1 wherein: unlocking is performed continuously by using WYM property 1 from the last WYM unit. Let e, g denote that the process substrate with n-grade mark value is different from two n-grade combined substrates with the same form, and the process coefficient with n-grade mark value is added to combine into one of n-grade processes, i.e.
[()()]Referred to as WYM units.
Get
For example (derivation see appendix 5), read.
The n-level lamination scheme is
The first process comprises the following steps: the small process e is repeated for G times, the small process G is repeated for H times, and the whole process is repeated for C times;
and a second process: the small process e is repeated for I times, the small process g is repeated for J times, and the whole process is repeated for D times;
The process I and the process II are combined to form a large process I, and the large process I is repeated for A times;
and a third process: the small process E is repeated for G times, the small process G is repeated for H times, and the whole process is repeated for E times;
and a fourth process: the small process e is repeated for I times, the small process g is repeated for J times, and the whole process is repeated for F times;
and the third process and the fourth process are combined into a second large process, and the second large process is repeated for B times.
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| US20080260579A1 (en) * | 2007-04-17 | 2008-10-23 | Tesa Aktiengesellschaft | Sheet-like material with hydrophilic and hydrophobic egions and their production |
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| CN104582592A (en) * | 2012-03-28 | 2015-04-29 | 伊西康内外科公司 | Tissue stapler having a thickness compensator incorporating a hydrophilic agent |
| CN106021654A (en) * | 2016-05-09 | 2016-10-12 | 北京航空航天大学 | A composite material layering scheme library establishing method taking layering compatibility into account |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080260579A1 (en) * | 2007-04-17 | 2008-10-23 | Tesa Aktiengesellschaft | Sheet-like material with hydrophilic and hydrophobic egions and their production |
| US20130240907A1 (en) * | 2010-09-13 | 2013-09-19 | Photonis France | Electron multiplier device having a nanodiamond layer |
| CN104582592A (en) * | 2012-03-28 | 2015-04-29 | 伊西康内外科公司 | Tissue stapler having a thickness compensator incorporating a hydrophilic agent |
| CN106021654A (en) * | 2016-05-09 | 2016-10-12 | 北京航空航天大学 | A composite material layering scheme library establishing method taking layering compatibility into account |
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| 吴亚茹;曹兴忠;李玉晓;张静;杨静;王胜;张鹏;于润升;王宝义;: "钐离子掺杂不同基质发光材料发光原理及性能的研究", 材料导报, no. 2, pages 229 - 233 * |
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