CN111771304A - False antenna structure and millimeter wave antenna array - Google Patents
False antenna structure and millimeter wave antenna array Download PDFInfo
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- CN111771304A CN111771304A CN201980010375.7A CN201980010375A CN111771304A CN 111771304 A CN111771304 A CN 111771304A CN 201980010375 A CN201980010375 A CN 201980010375A CN 111771304 A CN111771304 A CN 111771304A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
Abstract
The invention provides a false antenna structure and a millimeter wave antenna array. The dummy antenna structure includes: the multilayer dielectric plates are sequentially arranged from bottom to top; the radiation unit is arranged on the dielectric plate on the top layer and used for radiating antenna signals; a power feeding unit (20) arranged in the multilayer dielectric plate; and the load structure (30) is arranged on at least one layer of the dielectric plate at the bottom and is in matched connection with the feed port of the feed unit (20), and the load structure (30) is a microstrip-to-SIW transmission structure. The improvement ensures that the false antenna structure and the millimeter wave antenna array have good matching effect in frequency band, and the radiation is small, the radiation pattern of the antenna unit is not influenced in the coplanar feed structure, the multiple reflection in the back cavity is not caused in the back feed structure, and the influence on the amplitude-phase consistency is small.
Description
Technical Field
The present invention generally relates to the field of antenna structures, and more particularly, to a dummy antenna structure and a millimeter wave antenna array.
Background
With the development of millimeter wave devices, the millimeter wave radar can realize miniaturization and integration, can obtain narrower antenna beams and higher antenna gain under the condition of the same antenna caliber, can improve the angle measurement resolution and angle measurement precision of the radar, and is favorable for resisting electronic interference, clutter interference and multipath reflection interference.
In a millimeter wave radar system, the better the amplitude phase consistency of each unit in the array antenna is, the higher the angle measurement precision is, and the better the angle measurement resolution is. The problem that the respective directional patterns of the antenna units are different due to different electromagnetic environments in the array is common in the design of the array. In order to improve the amplitude phase consistency of the antenna array, a dummy antenna design is often required. The dummy antenna is not connected with the excitation port and is only used for providing a uniform electromagnetic environment for the radiation antenna, so that the directional diagram of the dummy antenna has small distortion in an array environment, the quality of the design of the dummy antenna directly influences the amplitude-phase consistency characteristic of the antenna array, and the design of the high-quality dummy antenna is particularly important in a millimeter wave radar system. At present, many false antennas have the problem of narrow bandwidth and cannot meet the requirement of large bandwidth.
Therefore, there is a need for an improved structure of a dummy antenna to solve the above problems of the present dummy antenna.
Disclosure of Invention
The present invention has been made to solve at least one of the above problems. The present invention provides a dummy antenna structure, comprising:
the multilayer dielectric plates are sequentially arranged from bottom to top;
the radiation unit is arranged on the dielectric plate on the top layer and used for radiating antenna signals;
the feed unit is arranged in the multilayer dielectric plate;
and the load structure is arranged on at least one layer of the dielectric plate at the bottom and is in matched connection with the feed port of the feed unit, and the load structure is a microstrip-to-SIW transmission structure.
The invention also provides a millimeter wave antenna array which comprises the pseudo antenna structure.
The invention provides a false antenna structure and a millimeter wave antenna array, wherein a load structure which is connected with a feed port of a feed unit in a matching way is arranged in the false antenna structure, the load structure is a microstrip-to-SIW transmission structure, the false antenna structure and the millimeter wave antenna array have good matching effect in a frequency band through improvement, the radiation is small, the coverage frequency band is wide, and the requirement of large bandwidth can be met.
Drawings
FIG. 1 is a top view of a top layer of a dummy antenna structure according to one embodiment of the present invention;
FIG. 2 is a top view of the bottom most layer of a dummy antenna structure according to one embodiment of the present invention;
FIGS. 3A-3C are schematic cross-sectional views of different layers of a loading structure in a pseudo-antenna structure according to an embodiment of the invention;
fig. 4A is an illustration of return loss at an antenna body port in a pseudo antenna configuration, in accordance with an embodiment of the present invention;
FIG. 4B is a diagram illustrating port return loss of a load structure for a feed port in a pseudo-antenna structure, in accordance with one embodiment of the present invention;
fig. 5 is a schematic layout of an array of millimeter wave antennas according to an embodiment of the present invention;
fig. 6 is a schematic layout of a millimeter wave antenna array according to another embodiment of the present invention;
fig. 7 is a schematic diagram of the effect of the dummy antenna feed port load on the amplitude-phase consistency in the cavity-backed environment of the backfeed antenna.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. It is to be understood that the described embodiments are merely a subset of embodiments of the invention and not all embodiments of the invention, with the understanding that the invention is not limited to the example embodiments described herein. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the invention described herein without inventive step, shall fall within the scope of protection of the invention.
In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.
It is to be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.
In order to provide a thorough understanding of the present invention, detailed steps and detailed structures will be set forth in the following description in order to explain the present invention. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
In order to solve the existing problems, an embodiment of the present invention provides a dummy antenna structure, which is described in detail below with reference to the accompanying drawings, wherein fig. 1 is a top view of a top layer of the dummy antenna structure according to an embodiment of the present invention; FIG. 2 is a top view of the bottom most layer of a dummy antenna structure according to one embodiment of the present invention; fig. 3A-3C are schematic cross-sectional views of different layers of a loading structure in a pseudo antenna structure according to an embodiment of the invention.
In an embodiment of the present invention, the dummy antenna structure includes:
the multilayer dielectric plates are sequentially arranged from bottom to top;
the radiation unit is arranged on the dielectric plate on the top layer and used for radiating antenna signals;
the feed unit is arranged in the multilayer dielectric plate;
and the load structure is arranged on the multilayer dielectric plate at the bottom layer and is in matched connection with the feed port of the feed unit, and the load structure is a microstrip-to-SIW transmission structure.
In an embodiment of the present invention, the pseudo antenna structure further includes a plurality of metal layers, and the dielectric plate is disposed between adjacent metal layers.
In a specific embodiment, the dummy antenna structure includes 8 metal layers, although the number of the metal layers is not limited to this value, and may be set according to actual needs, for example, in another embodiment, the dummy antenna structure includes 6 metal layers. In the following embodiments, the pseudo antenna structure includes 8 metal layers as an example for detailed description, it should be noted that when the metal layers are changed, other structures may be set with reference to the example of the 8 metal layers when no conflict occurs, and modifications and changes may be made.
The following description will be given by taking an example in which the dummy antenna structure includes 8 metal layers. The 8 metal layers are sequentially arranged, and a dielectric plate is arranged between the adjacent metal layers, namely 7 dielectric plates are arranged between the 8 metal layers, wherein the bottommost layer and the topmost layer are both metal layers, so that the frame structure of the false antenna structure is formed.
In a specific embodiment, the dielectric plates include printed dielectric plates and adhesive dielectric plates, wherein the metal layers are formed on two opposite surfaces of the printed dielectric plates by printing, the adhesive dielectric plates are disposed between adjacent printed dielectric plates, and the adhesive dielectric plates and the printed dielectric plates are alternately disposed and then pressed together to form the frame structure of the pseudo antenna structure.
The metal layer is formed on the printed dielectric plate through printing, and various functional circuits or elements are formed in the metal layer, so that various functional circuits or elements required in the false antenna structure are integrated on the dielectric plate, the connection of various functional circuits or elements of the false antenna structure is realized, and specific functions are realized.
An antenna body 10 is provided, for example, in the uppermost metal layer, as shown in fig. 1, for radiating an antenna signal. And a feeding unit 20 is further provided in the uppermost metal layer for port matching with a load structure. The dummy antenna body in the uppermost metal layer is in the form of a series-fed microstrip array antenna, and is suitable for a millimeter wave frequency band, wherein the lowermost layer is a feeding unit 20 and a feeding section load structure 30 of the dummy antenna body, and the load structure is a microstrip-to-SIW transmission load structure, as shown in fig. 2.
It should be noted that the feeding unit 20 is not formed only in the topmost metal layer, and fig. 1 only shows the structure of the topmost dielectric plate, where the feeding unit 20 may be formed in all the metal layers and the dielectric plates, and may be arranged according to actual needs.
The dielectric Board may be a Printed Circuit Board (PCB) substrate, a ceramic substrate, a Pre-injection molded (Pre-mold) substrate, or the like.
The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and different hierarchical structures have different manufacturing modes.
Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.
Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and specific structures thereof are as follows:
(1) single-layer board: i.e. a circuit board with only one side copper-clad and the other side not copper-clad. Typically, the components are placed on the side that is not copper-clad, the copper-clad side being used primarily for wiring and soldering.
(2) Double-layer plate: i.e., a circuit board with both sides copper-clad, is commonly referred to as a Top Layer (Top Layer) on one side and a Bottom Layer (Bottom Layer) on the other side. The top layer is generally used as the surface for placing components, and the bottom layer is used as the surface for welding components.
(3) Multilayer board: that is, a circuit board including a plurality of working layers includes a plurality of intermediate layers in addition to a top layer and a bottom layer, and the intermediate layers can be used as a conductive layer, a signal layer, a power layer, a ground layer, etc. The layers are insulated from each other and the connections between the layers are usually made by vias.
The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.
In addition, the substrate in the present application may be a ceramic substrate, in which the copper foil is directly bonded to alumina (Al) at a high temperature2O3) Or a special process plate on the surface (single or double side) of an aluminum nitride (AlN) ceramic substrate. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity.
In another embodiment, 7 dielectric plates are disposed between 8 metal layers at intervals, wherein the top dielectric plate and the bottom dielectric plate are low-loss high-frequency plates (such as RogersRO3003, Taonic NF-30, etc.), and the middle 5 layers are low-cost FR4 material.
The metal layer may be any metal material commonly used in the art, but is not limited to one, and in this embodiment, the metal layer is made of copper, which is a more mature and commonly used metal in a printing process.
In the embodiment of the invention, in order to meet the requirement of a point cloud radar system on large bandwidth, the point cloud radar system can work in a frequency range of 77.75 GHz-80.25 GHz and 2.5GHz, a microstrip-to-SIW transmission load structure is selected as the load structure, and SIW (substrate integrated waveguide) is used as a substrate integrated waveguide, wherein SIW is in a microwave transmission line form, and a field propagation mode of the waveguide is realized on a dielectric plate by utilizing metal via holes.
Referring to fig. 3A-3C, the following is a schematic cross-sectional structure diagram of different layers of a load structure in a pseudo antenna structure according to an embodiment of the present invention, in which the load structure 30 is a multilayer structure, and includes 4 copper layers and three dielectric plates, and slots are formed in the two copper layers in the middle, so that energy can be transmitted between the layers, and a transmission loss path is increased.
Specifically, the dummy antenna structure comprises 8 metal layers arranged from bottom to top in sequence, and the load structure is arranged in the 1 st to 3 rd metal layers at least from the bottom, namely the 6 th to 8 th layers from the top. In another embodiment, the load structure is provided in the 1 st to 4 th metal layers from the bottom, i.e. in the 5 th to 8 th layers from the top.
The following description will be given taking as an example the arrangement of the load structure from the 5 th layer to the 8 th layer from the top.
The load structure comprises metal through holes or metal through holes and gaps which are arranged on the dielectric plate and the metal layer, and energy coupled by the load structure is transmitted through the metal through holes and/or the gaps and is completely consumed in the transmission process, so that the power ratio and the phase difference of the false antenna structure are improved.
As shown in fig. 3A, the bottom layer, the 8 th metal layer 301 from the top, wherein a port connected to the feeding unit is provided in the load structure in the 8 th metal layer. Fig. 3B shows a penultimate metal layer, a 7 th metal layer 302 counted from the top, and a plurality of metal vias arranged in the 8 th metal layer 301 and the 7 th metal layer 302, wherein two rows of metal vias 3012 arranged at equal intervals are added in a double-sided copper-clad dielectric plate to form a substrate integrated waveguide.
For example, in a specific embodiment, as shown in fig. 3A, two rows of metal vias 3012 are disposed in the 8 th metal layer 301 and the 7 th metal layer 302, a pitch of the two rows of metal vias 3012 is 2-8mm, and a pitch of adjacent vias is 0.2-1 mm.
The structures of the 7 th metal layer 302 and the 6 th metal layer counted from the top are both as shown in fig. 3B, besides the metal via holes are arranged in the 7 th metal layer 302 and the 6 th metal layer, a gap 3011 is also arranged in the 7 th metal layer 302 and the 6 th metal layer, wherein the gap 3011 is a coupling gap, and the shape thereof may be rectangular, and of course, may also be arranged into other shapes according to actual needs.
Fig. 3C shows the 5 th metal layer 303 with the top, a plurality of metal via holes are formed in the 5 th metal layer 303, and two rows of metal via holes 3012 arranged at equal intervals are added to a double-sided copper-clad dielectric plate to form the substrate integrated waveguide.
Specifically, a row of metal via holes arranged at equal intervals are arranged in the vertical direction of one end of each of the two rows of metal via holes to form a short-circuit end of the substrate integrated waveguide. The gap is formed by etching a copper-clad layer of the double-sided copper-clad dielectric plate, the coupling gap is positioned at the bottom of the short-circuit end of the substrate integrated waveguide, and the length and the width of the coupling gap 2 are respectively 10mm and 0.8 mm.
The metal via holes are arranged in the metal layer and the dielectric plate, and the slots are formed in the two copper layers in the middle, so that energy can be transmitted between the layers, a transmission loss path is increased, the energy at a load end is completely consumed after being transmitted through the metal via holes and the slots, and the influence on a radiation unit is avoided; the feed port load structure has small return loss and good matching at 77.75 GHz-80.25 GHz.
In another embodiment of the present invention, a millimeter-wave antenna array is provided, which at least includes the dummy antenna structure. By arranging the false antenna structure in the millimeter wave antenna array, the bandwidth of the millimeter wave antenna array can be increased by 2.5GHz, for example, the millimeter wave antenna array can work in the frequency range of 77.75 GHz-80.25 GHz and 2.5GHz, and the requirement of a point cloud radar system on large bandwidth is met. The antenna array element pattern amplitude consistency can be improved.
In an example of the present invention, the millimeter wave antenna array includes:
a transmit antenna array, wherein the transmit antenna array comprises a transmit antenna and the dummy antenna structure;
a receive antenna array, wherein the transmit antenna array comprises a receive antenna and the dummy antenna structure.
The transmitting antenna and the receiving antenna may be any transmitting antenna and receiving antenna that are conventional in the art, as long as the functions of transmitting and receiving can be achieved, and are not further limited herein.
In an embodiment of the present invention, as shown in fig. 5, the left side portion is a transmitting antenna and a dummy antenna, the right side portion is a receiving antenna and a dummy antenna, and the whole is a triple-transmit-quadruple-receive structure, the transmitting antenna array includes 3 transmitting antennas and 3 dummy antenna structures disposed between any two transmitting antennas, the receiving antenna array includes 6 receiving antennas and 4 dummy antenna structures disposed at the center of the 6 receiving antennas, where labels R1 to R4 correspond to 4 dummy antennas, and labels T1 to T3 correspond to three dummy antennas.
In another embodiment, as shown in fig. 6, a plurality of antenna arrays are formed on the dielectric plate, and in the antenna arrays, the dummy antenna structure is connected to the feeding port to form a load structure, and the working antenna, such as the transmitting antenna or the receiving antenna, is connected to the functional chip, such as the functional chip through a connection wire. The load structure in the false antenna structure can improve the antenna array unit pattern amplitude and phase consistency.
Further, as shown in fig. 7, the dummy antenna structure further includes an antenna adapting structure 40, a cavity is formed between a first surface of the antenna adapting structure and the metal shell of the element on which the dummy antenna structure is mounted, and a second surface disposed opposite to the first surface of the antenna adapting structure is used for mounting the dummy antenna structure on the movable platform.
As shown in fig. 7, to illustrate the effect of the back cavity on the amplitude-phase consistency, in the case of the back feed having the back cavity, when the antenna No. 1 is excited, energy will be coupled to an adjacent antenna, such as the antenna No. 4, the energy is transmitted to its port load through the antenna array No. 4, multiple reflections are formed in the cavity through feeder radiation or port load radiation, the reflected energy excites other antennas, so that a radiation pattern is formed by overlapping multiple antenna radiations, different antenna couplings and reflection paths are different, the formed pattern is also different, and the amplitude-phase consistency is poor, when a dummy antenna structure is provided, the metal via and slot of the load structure enable energy to be transmitted between layers, and a transmission loss path is increased, so that the energy at the load end is completely consumed after being transmitted through the metal via and slot, thereby avoiding the effect caused by the adjacent antennas, and enabling the working environment of each antenna to be consistent, thereby improving the antenna array element pattern amplitude consistency.
Optionally, the movable platform may be an unmanned aerial vehicle, a drone, an autonomous automobile, or a ground-based remotely controlled robot.
The movable platform comprises a machine body and a microwave rotary radar, wherein the microwave rotary radar is installed on the machine body. The microwave rotary radar comprises the millimeter wave antenna array.
Although the illustrative embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the foregoing illustrative embodiments are merely exemplary and are not intended to limit the scope of the invention thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the scope or spirit of the present invention. All such changes and modifications are intended to be included within the scope of the present invention as set forth in the appended claims.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the units is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another device, or some features may be omitted, or not executed.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the invention and aiding in the understanding of one or more of the various inventive aspects. However, the method of the present invention should not be construed to reflect the intent: that the invention as claimed requires more features than are expressly recited in each claim. Rather, as the following claims reflect, inventive aspects lie in less than all features of a single disclosed embodiment. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
It will be understood by those skilled in the art that all of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where such features are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.
The various component embodiments of the invention may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art will appreciate that a microprocessor or Digital Signal Processor (DSP) may be used in practice to implement some or all of the functionality of some of the modules according to embodiments of the present invention. The present invention may also be embodied as apparatus programs (e.g., computer programs and computer program products) for performing a portion or all of the methods described herein. Such programs implementing the present invention may be stored on computer-readable media or may be in the form of one or more signals. Such a signal may be downloaded from an internet website or provided on a carrier signal or in any other form.
It should be noted that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.
The above description is only for the specific embodiment of the present invention or the description thereof, and the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (17)
1. A dummy antenna structure, comprising:
the multilayer dielectric plates are sequentially arranged from bottom to top;
the radiation unit is arranged on the dielectric plate on the top layer and used for radiating antenna signals;
the feed unit is arranged in the multilayer dielectric plate;
and the load structure is arranged on at least one layer of the dielectric plate at the bottom and is in matched connection with the feed port of the feed unit, and the load structure is a microstrip-to-SIW transmission structure.
2. The dummy antenna structure of claim 1, wherein the radiating element comprises an antenna body for radiating an antenna signal.
3. The dummy antenna structure of claim 2, wherein the antenna body is a series fed microstrip array antenna.
4. The dummy antenna structure of claim 1, further comprising:
and the dielectric plate is arranged between the adjacent metal layers.
5. The pseudo-antenna structure of claim 4, wherein the dielectric plates comprise printed dielectric plates and adhesive dielectric plates, wherein the metal layers are formed on two opposite surfaces of the printed dielectric plates by printing, and the adhesive dielectric plates are disposed between the adjacent printed dielectric plates.
6. The dummy antenna structure of claim 5, wherein the dummy antenna structure comprises 8 metal layers sequentially arranged from bottom to top, and the loading structure is arranged in at least the 1 st to 3 rd metal layers from the bottom.
7. The dummy antenna structure of claim 6, wherein the loading structure is disposed in the 1 st to 4 th metal layers from the bottom.
8. The dummy antenna structure according to claim 6, wherein the load structure comprises a metal via or a metal via and a slot disposed on the dielectric plate and the metal layer, and the energy coupled by the load structure is transmitted through the metal via and/or the slot and completely consumed during the transmission process, so as to improve the power ratio and the phase difference of the dummy antenna structure.
9. The dummy antenna structure according to claim 8, characterized in that slots are provided at least in the 2 nd and 3 rd metal layers from the bottom and/or metal vias are provided at least in the 1 st to 3 rd metal layers from the bottom.
10. The dummy antenna structure of claim 1, further comprising an antenna adapter structure, wherein a first surface of the antenna adapter structure forms a cavity with the metal housing of the element to which the dummy antenna structure is mounted, and a second surface disposed opposite the first surface of the antenna adapter structure is used to mount the dummy antenna structure on a movable platform.
11. A millimeter-wave antenna array comprising a pseudo-antenna structure according to any of claims 1 to 10.
12. The mmwave antenna array of claim 11, comprising:
a transmit antenna array, wherein the transmit antenna array comprises a transmit antenna and the dummy antenna structure.
13. The mmwave antenna array of claim 12, wherein the mmwave antenna array comprises:
a receive antenna array, wherein the transmit antenna array comprises a receive antenna and the dummy antenna structure.
14. The mmwave antenna array of claim 13, wherein the transmit antenna array comprises 3 transmit antennas and 3 dummy antenna structures are disposed between any two transmit antennas.
15. The mmwave antenna array of claim 13, wherein the receive antenna array comprises 6 receive antennas and 4 of the dummy antenna structures are disposed at a middle position of the 6 receive antennas.
16. The mmwave antenna array of claim 13, wherein the ends of the feed elements of the transmit antenna and the receive antenna are electrically connected to a functional chip.
17. The mmwave antenna array of claim 11, wherein the operating frequency of the mmwave antenna array is between 77.75GHz and 80.25 GHz.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/080565 WO2020198992A1 (en) | 2019-03-29 | 2019-03-29 | Dummy antenna structure and millimetre wave antenna array |
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| CN111771304A true CN111771304A (en) | 2020-10-13 |
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| CN201980010375.7A Pending CN111771304A (en) | 2019-03-29 | 2019-03-29 | False antenna structure and millimeter wave antenna array |
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| WO (1) | WO2020198992A1 (en) |
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| CN113571900A (en) * | 2021-07-30 | 2021-10-29 | 海信集团控股股份有限公司 | Feed structure, millimeter wave antenna and car |
| WO2024007323A1 (en) * | 2022-07-08 | 2024-01-11 | 华为技术有限公司 | Array antenna and communication device |
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| CN113571900A (en) * | 2021-07-30 | 2021-10-29 | 海信集团控股股份有限公司 | Feed structure, millimeter wave antenna and car |
| CN113571900B (en) * | 2021-07-30 | 2024-04-12 | 海信集团控股股份有限公司 | Feed structure, millimeter wave antenna and car |
| WO2024007323A1 (en) * | 2022-07-08 | 2024-01-11 | 华为技术有限公司 | Array antenna and communication device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020198992A1 (en) | 2020-10-08 |
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