CN111739863A - Fingerprint identification chip packaging structure and preparation method thereof - Google Patents
Fingerprint identification chip packaging structure and preparation method thereof Download PDFInfo
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- CN111739863A CN111739863A CN202010860408.1A CN202010860408A CN111739863A CN 111739863 A CN111739863 A CN 111739863A CN 202010860408 A CN202010860408 A CN 202010860408A CN 111739863 A CN111739863 A CN 111739863A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85986—Specific sequence of steps, e.g. repetition of manufacturing steps, time sequence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a fingerprint identification chip packaging structure and a preparation method thereof, and belongs to the technical field of chip packaging. Fingerprint identification chip package structure includes: the redistribution layer is provided with a fingerprint identification chip, an induction area and a bonding pad of the fingerprint identification chip are located on one side far away from the redistribution layer, the bonding pad is electrically connected with a circuit of the redistribution layer through a conductive column, a plastic package body is further arranged on one side, provided with the fingerprint identification chip, of the redistribution layer, and the fingerprint identification chip and the conductive column are packaged on the redistribution layer through the plastic package body. The fingerprint identification signal penetrating effect of the fingerprint identification chip can be improved, and the fingerprint identification efficiency and accuracy are improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a fingerprint identification chip packaging structure and a preparation method thereof.
Background
With the gradual maturity of fingerprint identification technology, the application of the fingerprint identification technology in various fields is more and more popular, and particularly in the payment field, the payment verification needs to have stronger protectiveness, independence and safety, so that the accuracy of the identification rate of fingerprint chip identification is required to be higher.
However, the conventional packaging process of the fingerprint identification chip mainly adopts a routing connection to the fingerprint chip, and specifically, includes a three-layer structure of a Flexible Printed Circuit (FPC), the fingerprint identification chip and a sapphire cover plate, and the fingerprint identification chip is affected by the routing mode, and the thickness of the packaging material is relatively thick. Because the identification signal penetration ability of the fingerprint identification chip is limited, and the identification signal in the structure needs to penetrate through the sapphire and the plastic package body with thicker thickness, the penetration effect is poorer, so that the current fingerprint identification chip packaging structure is lower in fingerprint identification efficiency and lower in accuracy.
Disclosure of Invention
The invention aims to provide a fingerprint identification chip packaging structure and a preparation method thereof, which can improve the fingerprint identification signal penetration effect of a fingerprint identification chip and improve the fingerprint identification efficiency and accuracy.
The embodiment of the invention is realized by the following steps:
in one aspect of the embodiments of the present invention, a fingerprint identification chip package structure is provided, including: the redistribution layer is provided with a fingerprint identification chip, an induction area and a bonding pad of the fingerprint identification chip are located on one side far away from the redistribution layer, the bonding pad is electrically connected with a circuit of the redistribution layer through a conductive column, a plastic package body is further arranged on one side, provided with the fingerprint identification chip, of the redistribution layer, and the fingerprint identification chip and the conductive column are packaged on the redistribution layer through the plastic package body.
Optionally, a distance between a surface of the plastic package body, which is away from the redistribution layer, and a surface of the sensing area of the fingerprint identification chip is less than 10 μm.
Optionally, a solder ball electrically connected to the terminal of the circuit of the redistribution layer is formed on a side of the redistribution layer away from the fingerprint identification chip.
Optionally, the material of the plastic package body includes any one of epoxy resin and polyimide.
Optionally, the conductive pillar is made of one or more materials of copper, aluminum, nickel, gold, and silver.
In another aspect of the embodiments of the present invention, a method for manufacturing a fingerprint identification chip package structure is provided, including:
the fingerprint identification chip is carried by the carrier plate, and a plastic package body is formed so that the fingerprint identification chip is embedded in the plastic package body, wherein the induction area of the fingerprint identification chip is positioned on one side far away from the carrier plate;
forming a conductive column in the plastic package body, wherein the conductive column is connected with a bonding pad of the fingerprint identification chip, the conductive column is led out from one side of the plastic package body close to the carrier plate, and the bonding pad and the induction area are positioned on the same side of the fingerprint identification chip;
and removing the carrier plate, and forming a redistribution layer, wherein the redistribution layer is positioned on one side of the fingerprint identification chip departing from the sensing area of the fingerprint identification chip, and the circuit of the redistribution layer is electrically connected with the conductive column.
Optionally, a plastic adhesive is formed on the carrier plate, and the fingerprint identification chip and the plastic package body are respectively bonded with the carrier plate through the plastic adhesive;
removing the carrier plate and forming a rewiring layer, wherein the steps of:
softening the plastic glue and removing the carrier plate;
and forming a redistribution layer electrically connected with the conductive columns.
Optionally, forming the conductive pillar in the molding compound body includes:
forming a groove on one side of the plastic package body, which is far away from the carrier plate, so as to expose a bonding pad of the fingerprint identification chip;
forming a channel hole communicated with the groove in the plastic package body, wherein one opening of the channel hole is positioned on one side of the plastic package body close to the carrier plate;
and arranging conductive materials in the grooves and the channel holes to form the conductive columns.
Optionally, after disposing the conductive material into the groove and the via hole to form the conductive pillar, the method further includes:
and forming a buried layer on the plastic packaging body to bury the groove.
Optionally, the material of the carrier plate comprises any one of glass, silicon oxide, and metal.
The embodiment of the invention has the beneficial effects that:
the fingerprint identification chip packaging structure provided by the embodiment of the invention comprises a rewiring layer, wherein a fingerprint identification chip is arranged on the rewiring layer, and an induction area and a bonding pad of the fingerprint identification chip are both positioned on one side far away from the rewiring layer. The pad of fingerprint identification chip is connected with the circuit electricity of rewiring layer through leading electrical pillar to, still be provided with the plastic-sealed body in the one side that rewiring layer set up the fingerprint identification chip, fingerprint identification chip and lead electrical pillar through the plastic-sealed body encapsulation on rewiring layer, can play protection and fixed effect to fingerprint identification chip and lead electrical pillar through the plastic-sealed body. Through foretell fingerprint identification chip packaging structure for the encapsulation of fingerprint identification chip no longer need set up transparent cover plate such as sapphire or glass, thereby can reduce the penetrating hindrance of fingerprint identification chip's identification signal. In addition, in the packaging structure, the bonding pad of the fingerprint identification chip is connected with the rewiring layer through the conductive column, so that the phenomenon that the thickness of the plastic packaging body is increased due to the influence of a routing technology can be avoided. Therefore, the packaging structure can improve the penetrating effect of the identification signal of the fingerprint identification chip, and further improve the fingerprint identification efficiency and accuracy of the fingerprint identification chip packaging structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a fingerprint identification chip package structure according to an embodiment of the present invention;
fig. 2 is a second schematic structural diagram of a fingerprint identification chip package structure according to an embodiment of the present invention;
fig. 3 is a schematic flowchart of a method for manufacturing a fingerprint identification chip package structure according to an embodiment of the present invention;
fig. 4 is a second flowchart illustrating a manufacturing method of a fingerprint identification chip package according to an embodiment of the present invention;
fig. 5 is a third schematic flow chart illustrating a manufacturing method of a fingerprint identification chip package structure according to an embodiment of the present invention.
Icon: 110-a rewiring layer; 111-solder balls; 120-fingerprint identification chip; 121-a sensing region; 122-a pad; 130-a conductive post; 140-plastic package body.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements that are referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
An embodiment of the present invention provides a fingerprint identification chip package structure, as shown in fig. 1, including: the redistribution layer 110 is provided with a fingerprint identification chip 120, the sensing region 121 and the bonding pad 122 of the fingerprint identification chip 120 are both located on one side away from the redistribution layer 110, the bonding pad 122 is electrically connected with a circuit of the redistribution layer 110 through a conductive pillar 130, a plastic package body 140 is further arranged on one side of the redistribution layer 110 where the fingerprint identification chip 120 is located, and the fingerprint identification chip 120 and the conductive pillar 130 are packaged on the redistribution layer 110 through the plastic package body 140.
The pads 122 of the fingerprint recognition chip 120, i.e., the internal circuit of the chip, are used as electrodes for connection to an external circuit.
The redistribution layer 110 may have a dielectric layer and a circuit embedded in the dielectric layer, and the redistribution layer 110 may implement an internal circuit fan-out design of the fingerprint identification chip 120, so that the package structure may have a thinner thickness, and an identification signal of the fingerprint identification chip 120 may more easily penetrate through the package structure, thereby improving identification sensitivity and efficiency, and improving identification accuracy. And moreover, the fan-out design is adopted, the process is relatively simple and convenient, the reliability is higher, and the fingerprint identification chip packaging structure has higher performance.
In practical applications, the conductive pillars 130 of the package structure may be pillar structures made of conductive materials to connect the redistribution layer 110 and the pads 122 of the fingerprint identification chip 120. Of course, the conductive post 130 may also be a conductive plating layer formed on a blind via formed in the plastic package body 140, or a conductive adhesive filled in the blind via, so as to connect the redistribution layer 110 and the pad 122 of the fingerprint identification chip 120. Therefore, in the embodiment of the present invention, the specific arrangement manner of the conductive pillars 130 is not limited.
It should be noted that, in the embodiment of the present invention, the fingerprint identification chip 120 may be a capacitive sensor chip, an optoelectronic fingerprint sensor chip, and the like, and is not limited herein.
The fingerprint identification chip packaging structure provided by the embodiment of the invention comprises a redistribution layer 110, wherein a fingerprint identification chip 120 is arranged on the redistribution layer 110, and an induction area 121 and a bonding pad 122 of the fingerprint identification chip 120 are both positioned on one side far away from the redistribution layer 110. The bonding pad 122 of the fingerprint identification chip 120 is electrically connected to the circuit of the redistribution layer 110 through the conductive pillar 130, and a plastic package body 140 is further disposed on the side of the redistribution layer 110 where the fingerprint identification chip 120 is disposed, the fingerprint identification chip 120 and the conductive pillar 130 are packaged on the redistribution layer 110 through the plastic package body 140, and the fingerprint identification chip 120 and the conductive pillar 130 can be protected and fixed through the plastic package body 140. Through the fingerprint identification chip packaging structure, the package of the fingerprint identification chip 120 does not need to be provided with a transparent cover plate such as sapphire or glass, and the penetration barrier of the identification signal of the fingerprint identification chip 120 can be reduced. In addition, in the package structure, the pad 122 of the fingerprint identification chip 120 is connected to the redistribution layer 110 through the conductive pillar 130, so that the plastic package body 140 can be prevented from being increased in thickness due to the influence of a wire bonding technology. Therefore, the package structure can improve the penetrating effect of the identification signal of the fingerprint identification chip 120, thereby improving the fingerprint identification efficiency and accuracy of the fingerprint identification chip package structure.
Optionally, as shown in fig. 1, a distance between a surface of the plastic package body 140 facing away from the redistribution layer 110 and a surface of the sensing region 121 of the fingerprint identification chip 120 is less than 10 μm.
By setting the distance between the plastic package body 140 and the surface of the sensing area 121 of the fingerprint identification chip 120 to be less than 10 μm on the surface of the side of the plastic package body 140 away from the redistribution layer 110, that is, the thickness of the plastic package body 140 at the position corresponding to the sensing area 121 of the fingerprint identification chip 120 is less than 10 μm, the identification signal of the fingerprint identification chip 120 can better penetrate through the plastic package body 140 for fingerprint identification, so that the efficiency and accuracy of fingerprint identification can be improved.
Optionally, as shown in fig. 1, a solder ball 111 electrically connected to the terminal of the trace of the redistribution layer 110 is formed on a side of the redistribution layer 110 away from the fingerprint identification chip 120.
The solder balls 111 are arranged on the side, away from the fingerprint identification chip 120, of the redistribution layer 110, so that the fingerprint identification chip packaging structure can be more conveniently connected with external equipment or circuits through the solder balls 111, and the usability of the packaging structure is improved. Of course, in practical applications, the solder ball 111 may be replaced by a bump, a pin, or the like to achieve the above effect, which is not limited herein.
Alternatively, the molding compound 140 can be made of a material with low dielectric property. Illustratively, the material of the molding compound 140 includes any one of epoxy resin and polyimide. To provide dielectric protection as well as structural protection to the fingerprint identification chip 120.
Optionally, the conductive pillar 130 is made of one or more materials selected from copper, aluminum, nickel, gold, and silver.
Of course, in practical applications, the conductive pillar 130 may also be made of conductive adhesive, graphite, and the like, which is not limited herein.
In another aspect of the embodiments of the present invention, a method for manufacturing a fingerprint identification chip package structure is provided, by which the fingerprint identification chip package structure can be manufactured. The effects and related embodiments of the fingerprint identification chip 120, the redistribution layer 110, the conductive pillar 130, the plastic package body 140, and the like involved in the method can be described with reference to the above-mentioned embodiments of the fingerprint identification chip package structure, and the method will be described below.
As shown in fig. 3, the method for manufacturing the fingerprint identification chip package structure may include:
s201: the fingerprint identification chip 120 is carried by the carrier plate, and the plastic package body 140 is formed so that the fingerprint identification chip 120 is embedded in the plastic package body 140.
The sensing area 121 of the fingerprint identification chip 120 is located on a side away from the carrier.
S202: the conductive pillars 130 are formed in the molding compound 140.
The conductive pillar 130 is connected to the pad 122 of the fingerprint identification chip 120, the conductive pillar 130 is led out from one side of the plastic package body 140 close to the carrier, and the pad 122 and the sensing area 121 are located on the same side of the fingerprint identification chip 120.
S203: the carrier is removed and a redistribution layer 110 is formed.
The redistribution layer 110 is located on a side of the fingerprint identification chip 120 away from the sensing region 121, and the circuit of the redistribution layer 110 is electrically connected to the conductive pillar 130.
In the method, the fingerprint identification chip 120 is supported by the carrier plate, so that the plastic package body 140 can package the fingerprint identification chip 120 more conveniently. Moreover, the warping problem of the fingerprint identification chip 120 in the preparation process can be reduced, and the yield of the prepared fingerprint identification chip packaging structure is improved.
Illustratively, the material of the carrier plate includes any one of glass, silicon oxide, and metal.
In the method for manufacturing the fingerprint identification chip package structure provided by the embodiment of the invention, the fingerprint identification chip 120 is firstly carried by the carrier plate, and the plastic package body 140 is formed so that the fingerprint identification chip 120 is embedded in the plastic package body 140. The sensing area 121 of the fingerprint identification chip 120 is located on a side away from the carrier. And forming the conductive pillar 130 in the plastic package body 140, so that the conductive pillar 130 is connected to the pad 122 of the fingerprint identification chip 120, and the conductive pillar 130 is led out from one side of the plastic package body 140 close to the carrier plate, wherein the pad 122 and the sensing area 121 are located at the same side of the fingerprint identification chip 120. And then removing the carrier plate, and forming a redistribution layer 110, so that the redistribution layer 110 is located on one side of the fingerprint identification chip 120 departing from the sensing area 121, and the circuit of the redistribution layer 110 is electrically connected with the conductive pillar 130, thereby preparing and forming the fingerprint identification chip package structure. The fingerprint identification chip packaging structure prepared by the method does not need to be provided with a transparent cover plate such as sapphire or glass, so that the penetration barrier of the identification signal of the fingerprint identification chip 120 can be reduced. In addition, since the bonding pad 122 of the fingerprint identification chip 120 is connected to the redistribution layer 110 through the conductive pillar 130, the plastic package body 140 can be prevented from being increased in thickness due to the influence of the wire bonding technology. Therefore, the penetrating effect of the identification signal of the fingerprint identification chip 120 can be improved, and the fingerprint identification efficiency and accuracy of the fingerprint identification chip package structure can be further improved.
Optionally, a plastic adhesive is formed on the carrier, and the fingerprint identification chip 120 and the plastic package body 140 are respectively bonded to the carrier by the plastic adhesive;
the carrier board is removed, and a redistribution layer 110 is formed, as shown in fig. 4, including:
s301: softening the plastic glue and removing the carrier plate.
S302: a redistribution layer 110 electrically connected to the conductive pillars is formed.
The plastic glue is arranged to bond the chip and the plastic package body 140, so that the fixing stability between the plastic package body 140 and the chip and the carrier plate can be improved. In addition, the carrier can be separated from the plastic package body 140 more conveniently by softening the plastic adhesive. Thereby enabling the process of removing the carrier plate to be easily operated.
The plastic adhesive may be photo-curing adhesive, hot melt adhesive, etc., and is not limited herein. Any colloid can be used as long as it can be softened under specific conditions.
Optionally, forming the conductive pillar 130 in the molding compound 140, as shown in fig. 5, includes:
s401: a recess is formed on a side of the plastic package body 140 facing away from the carrier board to expose the bonding pad 122 (shown in fig. 2) of the fingerprint identification chip 120.
S402: a channel hole communicated with the groove is formed in the plastic package body 140, and an opening of the channel hole is located on one side of the plastic package body 140 close to the carrier plate.
S403: conductive material is disposed into the recesses and vias to form conductive pillars 130.
The grooves and the channel holes on the plastic package body 140 can be implemented by laser grooving, wet etching, dry etching, and the like, which is not limited herein. And, the depth of the groove can be set to be less than 5 μm, so that the thickness of the plastic package body 140 at the position corresponding to the sensing region 121 of the fingerprint identification chip 120 is thinner, to improve the penetrating effect of the identification signal of the fingerprint identification chip 120.
It should be noted that, the conductive material is disposed in the groove and the via hole to form the conductive post 130, which may be implemented by a process of electroplating metal into the groove and the via hole, or implemented by a process of filling conductive adhesive into the groove and the via hole, which is not limited herein.
Through the steps, the conductive post 130 is arranged in the plastic package body 140, so that the process is relatively simple, the operation is convenient, and the processing efficiency and the yield of the fingerprint identification chip packaging structure can be improved.
Optionally, after disposing the conductive material into the groove and the via hole to form the conductive pillar 130, the method further includes:
a buried layer is formed on the molding body 140 to bury the groove.
The buried layer is formed on the plastic package body 140 to fill and bury the groove, so that the part of the conductive post 130 located in the groove can be protected, and the performance stability of the finally prepared fingerprint identification chip packaging structure is improved.
The buried layer may be made of the same material as the plastic package body 140, and is implemented by a plastic package process, that is, the plastic package body 140 is subjected to a plastic package process again, so as to bury the groove.
In practical application, after the redistribution layer 110 is formed, a ball-mounting process may be performed on a side of the redistribution layer 110 away from the fingerprint identification chip 120 to form a solder ball 111 connected to a terminal of a circuit of the redistribution layer 110.
In this method, a plurality of fingerprint identification chips 120 may also be operated at the same time, which is not limited herein. Accordingly, after the redistribution layer 110 is formed, a plurality of individual fingerprint recognition chip package structures may be formed through a dicing process.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A fingerprint identification chip package structure, comprising: the redistribution layer is provided with a fingerprint identification chip, an induction area and a bonding pad of the fingerprint identification chip are both located on one side far away from the redistribution layer, the bonding pad is electrically connected with a circuit of the redistribution layer through a conductive column, one side, provided with the fingerprint identification chip, of the redistribution layer is also provided with a plastic package body, and the fingerprint identification chip and the conductive column are packaged on the redistribution layer through the plastic package body.
2. The package structure of claim 1, wherein a distance between a surface of the molding compound facing away from the redistribution layer and a surface of the sensing area of the fingerprint identification chip is less than 10 μm.
3. The package structure of claim 1, wherein a solder ball is formed on a side of the redistribution layer facing away from the fingerprint identification chip and electrically connected to a terminal of the trace of the redistribution layer.
4. The package structure of fingerprint identification chip of claim 1 wherein the material of said plastic package body comprises any one of epoxy resin and polyimide.
5. The package structure of claim 1, wherein the conductive posts are made of one or more of copper, aluminum, nickel, gold, and silver.
6. A preparation method of a fingerprint identification chip packaging structure is characterized by comprising the following steps:
the fingerprint identification chip is carried by the carrier plate, and a plastic package body is formed so that the fingerprint identification chip is embedded in the plastic package body, wherein the induction area of the fingerprint identification chip is positioned on one side far away from the carrier plate;
forming a conductive column in the plastic package body, wherein the conductive column is connected with a bonding pad of the fingerprint identification chip, the conductive column is led out from one side of the plastic package body close to the carrier plate, and the bonding pad and the induction area are located on the same side of the fingerprint identification chip;
and removing the carrier plate, and forming a redistribution layer, wherein the redistribution layer is positioned on one side of the fingerprint identification chip departing from the sensing area of the fingerprint identification chip, and the circuit of the redistribution layer is electrically connected with the conductive column.
7. The method of claim 6, wherein a plastic adhesive is formed on the carrier, and the fingerprint identification chip and the plastic package are bonded to the carrier via the plastic adhesive;
the removing the carrier plate and forming the rewiring layer comprises:
softening the plastic glue and removing the carrier plate;
forming the redistribution layer electrically connected with the conductive pillar.
8. The method for manufacturing the fingerprint identification chip package structure of claim 6, wherein the forming of the conductive pillar in the plastic package body comprises:
forming a groove on one side of the plastic package body, which is far away from the carrier plate, so as to expose a bonding pad of the fingerprint identification chip;
forming a channel hole communicated with the groove in the plastic package body, wherein an opening of the channel hole is positioned on one side of the plastic package body close to the carrier plate;
and arranging a conductive material in the groove and the channel hole to form the conductive column.
9. The method of claim 8, wherein after disposing a conductive material into the recess and the via hole to form the conductive post, the method further comprises:
and forming a buried layer on the plastic packaging body to bury the groove.
10. The method for manufacturing the fingerprint identification chip package structure of claim 6, wherein the material of the carrier comprises any one of glass, silicon oxide, and metal.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010860408.1A CN111739863A (en) | 2020-08-25 | 2020-08-25 | Fingerprint identification chip packaging structure and preparation method thereof |
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| CN202010860408.1A CN111739863A (en) | 2020-08-25 | 2020-08-25 | Fingerprint identification chip packaging structure and preparation method thereof |
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Application publication date: 20201002 |