CN111738392A - Metal-resistant electronic tag and manufacturing method thereof - Google Patents

Metal-resistant electronic tag and manufacturing method thereof Download PDF

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Publication number
CN111738392A
CN111738392A CN202010529848.9A CN202010529848A CN111738392A CN 111738392 A CN111738392 A CN 111738392A CN 202010529848 A CN202010529848 A CN 202010529848A CN 111738392 A CN111738392 A CN 111738392A
Authority
CN
China
Prior art keywords
metal
electronic tag
spacer
resistant
injection molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010529848.9A
Other languages
Chinese (zh)
Inventor
张贺丰
纪莲和
林杰
王文赫
庞振江
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
State Grid Information and Telecommunication Co Ltd
Beijing Smartchip Microelectronics Technology Co Ltd
Original Assignee
State Grid Information and Telecommunication Co Ltd
Beijing Smartchip Microelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by State Grid Information and Telecommunication Co Ltd, Beijing Smartchip Microelectronics Technology Co Ltd filed Critical State Grid Information and Telecommunication Co Ltd
Priority to CN202010529848.9A priority Critical patent/CN111738392A/en
Publication of CN111738392A publication Critical patent/CN111738392A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772Physical layout of the record carrier
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/52Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a metal-resistant electronic tag and a manufacturing method thereof, wherein the metal-resistant electronic tag comprises: the electronic tag comprises an electronic tag body, a control unit and a display unit, wherein the electronic tag body is suitable for being arranged on equipment; the metal spacer is connected with the electronic tag body so as to isolate the electronic tag body from the equipment. According to the anti-metal electronic tag provided by the embodiment of the invention, the metal spacer is arranged on the electronic tag body, so that the metal spacer can effectively prevent the influence of the surface of equipment on the reading distance of the electronic tag body, and the anti-metal electronic tag is ensured to have better reading performance in different installation environments; the problem that the difference of the reading distance of the anti-metal electronic tag is large due to the fact that the metal material of the surface of the equipment is different, the smoothness of the metal material of the surface of the equipment and the thickness of the metal material of the surface of the equipment are different can be solved, manufacturing is convenient and simple, and production cost is low.

Description

Metal-resistant electronic tag and manufacturing method thereof
Technical Field
The invention relates to the technical field of wireless communication, in particular to an anti-metal electronic tag and a manufacturing method thereof.
Background
The internet of things is a technology for extending and expanding a user side to any information exchange and network communication based on internet application, and is one of important components of the modern information industry. The RFID is an automatic identification technology and is also a key component of the technology of the Internet of things. It uses radio frequency signal to transmit data and energy, thus completing non-contact automatic identification. The RFID technology has a great deal of application and great development prospect in various fields such as commodity management, transportation production and the like, manufacturing industry, commerce and the like.
In order to use the metal tag in metal equipment, a metal-resistant tag is provided based on the RFID technology to meet the reading and application performance of the metal equipment, however, the metal-resistant tag has corresponding application defects after being adhered to the metal surface of the equipment, for example, different metal materials on the surface of the equipment, flatness of the metal material on the surface of the equipment and thickness of the metal material on the surface of the equipment all affect the reading performance of the metal-resistant tag, seriously hinder the application of the metal-resistant tag in the field, and there is room for improvement.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a metal-resistant electronic tag, which has a simple structure and ensures that the metal-resistant electronic tag has good reading performance in different installation environments.
The invention also provides a manufacturing method of the anti-metal electronic tag.
According to an embodiment of the first aspect of the invention, a metal-resistant electronic tag comprises: the electronic tag comprises an electronic tag body, a control unit and a display unit, wherein the electronic tag body is suitable for being arranged on equipment; the metal spacer is connected with the electronic tag body so as to isolate the electronic tag body from the equipment.
According to the anti-metal electronic tag provided by the embodiment of the invention, the metal spacer is arranged on the electronic tag body, so that the metal spacer can effectively prevent the influence of the surface of equipment on the reading distance of the electronic tag body, and the anti-metal electronic tag is ensured to have better reading performance in different installation environments; the problem that the difference of the reading distance of the anti-metal electronic tag is large due to the fact that the metal material of the surface of the equipment is different, the smoothness of the metal material of the surface of the equipment and the thickness of the metal material of the surface of the equipment are different can be solved, manufacturing is convenient and simple, and production cost is low.
According to the metal-resistant electronic tag provided by the embodiment of the invention, the surface of the device is of a metal structure.
According to the metal-resistant electronic tag, the metal spacer comprises the isolation part, the isolation part is suitable for being clamped between the electronic tag body and the equipment, and the shape of the isolation part corresponds to that of the electronic tag body.
Specifically, the isolation portion forms an isolation plate with a flat surface.
Specifically, the metal separator further includes: one end of the extension part is connected with the isolation part, and the other end of the extension part extends towards the direction far away from the electronic tag body.
Specifically, the included angle between the extension part and the isolation part ranges from 90 degrees to 180 degrees.
Specifically, the extension part comprises a plurality of extension parts which are mutually connected to form an annular extension part surrounding the electronic tag body.
According to the metal-resistant electronic tag, the thickness of the metal spacer ranges from 0.1mm to 0.5 mm.
According to the metal-resistant electronic tag provided by the embodiment of the invention, the antenna is arranged in the electronic tag body, and the projection of the metal spacer on the plane where the antenna is located covers the antenna.
According to the metal-resistant electronic tag provided by the embodiment of the invention, the metal spacer and the electronic tag body are connected into a whole through an injection molding process.
According to the metal-resistant electronic tag provided by the embodiment of the invention, the metal spacer is fixedly connected with the electronic tag body.
According to the second aspect of the invention, the method for manufacturing the metal-resistant electronic label comprises the following steps: providing an antenna, a radio frequency chip, a metal layer and an injection molding inner core; providing a metal spacer; and assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator to form the anti-metal electronic tag.
According to the manufacturing method of the anti-metal electronic tag, the influence of the surface of equipment on the reading distance of the electronic tag body can be effectively prevented, the anti-metal electronic tag with better reading performance in different installation environments is manufactured, and the manufacturing method is convenient and simple and low in production cost.
According to the manufacturing method of the metal-resistant electronic tag, the assembling of the antenna and the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator comprises the following steps: assembling the antenna, the radio frequency chip, the metal layer and the injection molding inner core into a whole by adopting an injection molding process to form the electronic tag body with an injection molding shell; and assembling the electronic tag body and the metal spacer to form the anti-metal electronic tag.
According to the manufacturing method of the metal-resistant electronic tag, the assembling of the antenna and the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator comprises the following steps: and assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator into a whole by adopting an injection molding process to form the metal-resistant electronic tag with an injection molding shell.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a metal-resistant electronic tag according to an embodiment of the invention;
FIG. 2 is a schematic structural view of a metal spacer according to one embodiment of the present invention;
FIG. 3 is a schematic view of a metal resistant electronic tag mounting and assembly apparatus according to an embodiment of the present invention;
FIG. 4 is a flow chart of a method of manufacturing a metal-resistant electronic label according to an embodiment of the invention;
FIG. 5 is a flow chart of a method of manufacturing a metal-resistant electronic label according to an embodiment of the invention;
fig. 6 is a flow chart of a method of manufacturing a metal-resistant electronic label according to another embodiment of the invention.
Reference numerals:
the metal-resistant electronic label 100 is,
the electronic tag body 10 is provided with a plurality of electronic tags,
the metal spacer 20, the spacer 21, the extension 22, the first extension 221, the second extension 222,
a device 30.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
A metal-resistant electronic tag 100 according to an embodiment of the present invention is described below with reference to fig. 1 to 6.
As shown in fig. 1 to 3, a metal-resistant electronic tag 100 according to one embodiment of the present invention includes: electronic tags body 10 and metal spacer 20, electronic tags body 10 is suitable for and establishes on equipment 30, and metal spacer 20 is connected with electronic tags body 10 to keep apart electronic tags body 10 with equipment 30, the influence of separation equipment 30 surface to electronic tags body 10 recognition distance from this.
According to the anti-metal electronic tag 100 provided by the embodiment of the invention, the metal spacer 20 is arranged on the electronic tag body 10, so that the metal spacer 20 can effectively prevent the surface of the device 30 from influencing the reading distance of the electronic tag body 10, and the anti-metal electronic tag 100 has better reading performance in different installation environments; therefore, the problem that the difference of the reading distance of the anti-metal electronic tag 100 is large due to the fact that the metal material of the surface of the device 30 is different, the smoothness of the metal material of the surface of the device 30 and the thickness of the metal material of the surface of the device 30 are different can be solved, the performance of the electronic tag body 10 is maximized, the manufacturing is convenient and simple, and the production cost is low.
The surface of the device 30 can be of a metal structure, the electronic tag body 10 comprises an injection molding inner core, an antenna, a radio frequency chip and a metal layer, the antenna and the radio frequency chip are assembled on one side of the injection molding inner core, the metal layer is assembled on the other side of the injection molding inner core, the injection molding inner core plays a role of a support, and meanwhile the distance between the antenna and the metal layer can be limited, so that the electronic tag body 10 can be arranged on the device with the surface of the metal structure and is matched with the metal surface to enhance the sensing capacity of radio frequency signals to the tag.
According to an embodiment of the present invention, the projection of the metal spacer 20 on the plane where the antenna is located covers the antenna, so as to ensure that the metal spacer 20 effectively blocks the antenna from the device 30, and prevent the material, radian or flatness of the surface of the device 30 from affecting the identification of the antenna, and further affecting the reading and application performance of the anti-metal electronic tag 100.
According to an embodiment of the present invention, if the thickness of the metal spacer 20 is too large, the difference between the reading distances of the anti-metal electronic tag 100 is easily large, and if the thickness of the metal spacer 20 is too small, the effective blocking effect cannot be achieved, and the reading distance of the anti-metal electronic tag 100 is also affected, so that the thickness range of the metal spacer 20 is limited to 0.1mm-0.5mm, that is, the thickness of the metal spacer 20 may be 0.1mm, 0.3mm, 0.5mm, and the like, and it is ensured that the anti-metal electronic tag 100 has good reading and application performance under the action of the metal spacer 20.
According to an embodiment of the present invention, the metal spacer 20 and the electronic tag body 10 are integrally connected through an injection molding process, thereby forming the metal spacer 20 and the electronic tag body 10 as a unitary piece, thereby facilitating the mounting of the metal-resistant electronic tag 100 to any device 30.
In the injection molding process of the metal-resistant electronic tag 100, the metal spacer 20 may be directly injection molded into the housing of the metal-resistant electronic tag to form an integrated injection-molded metal-resistant electronic tag with the metal spacer 20, where the thickness of the metal spacer 20 may be relatively thin, for example, 0.1 mm. The metal separator 20 may be aluminum foil, copper foil, or other metal. Of course, in the production of the injection molding process of the metal-resistant electronic tag 100, the metal spacer 20 may also be injection molded outside the housing of the electronic tag body 10, and at this time, the thickness of the metal spacer 20 may be properly increased, for example, the thickness is 0.4mm, so as to facilitate the assembly of the metal spacer 20 without affecting the reading distance of the electronic tag body 10.
According to an embodiment of the present invention, the metal spacer 20 is fastened to the electronic tag body 10, for example, the metal spacer 20 may be a steel plate, the metal spacer 20 has a slot, the electronic tag body 10 has a buckle, or the metal spacer 20 has a buckle, the electronic tag body 10 has a slot, and the buckle and the slot are engaged with each other by matching, so that the metal spacer 20 and the electronic tag body 10 are not easily separated from each other, thereby facilitating the installation of the metal-resistant electronic tag 100 on any device 30.
According to an embodiment of the present invention, the metal spacer 20 includes the spacer 21, the spacer 21 is suitable for being sandwiched between the electronic tag body 10 and the device 30, and the shape of the spacer 21 corresponds to the shape of the electronic tag body 10, and by corresponding the spacer 21 to the shape of the electronic tag body 10, the spacer 21 is convenient to be matched with the electronic tag body 10, and the spacer 21 can be ensured to have an effective blocking effect.
Wherein, the division 21 forms the division board of surfacing, and electronic tags body 10 and the cooperation of division 21 avoid division 21 surface unevenness and influence the recognition distance of electronic tags body 10, the division 21 of being convenient for simultaneously and electronic tags body 10 be assembled between/be connected between or injection moulding.
In some examples, the thickness of the isolation portion 21 is too large, which easily causes the difference between the reading distances of the anti-metal electronic tag 100 to be large, and if the thickness of the isolation portion 21 is too small, the effective blocking effect cannot be achieved, and the reading distance of the anti-metal electronic tag 100 is also affected, so that the thickness range of the isolation portion 21 is limited to 0.1mm-0.5mm, that is, the thickness of the isolation portion 21 can be 0.1mm, 0.3mm, 0.5mm, and the like, and it is ensured that the anti-metal electronic tag 100 has better reading and application performance under the effect of the isolation portion 21.
In some examples, an antenna is disposed in the electronic tag body 10, and the projection of the isolation portion 21 on the plane where the antenna is located covers the antenna, so that it is ensured that the isolation portion 21 effectively blocks the antenna from the device 30, and it is avoided that the material, the radian, or the flatness of the surface of the device 30 affects the identification of the antenna, and thus affects the reading and application performance of the anti-metal electronic tag 100.
In some examples, the isolation portion 21 and the electronic tag body 10 are integrally connected through an injection molding process, that is, in the production of the injection molding process of the metal-resistant electronic tag 100, the isolation portion 21 may be directly injection molded in the housing of the metal-resistant electronic tag to form the integrally injection molded metal-resistant electronic tag 100 with the isolation portion 21, in this case, the isolation portion 21 may be another metal such as an aluminum foil, a copper foil, or the like, and the thickness of the isolation portion 21 may be 0.1 mm. Of course, in the injection molding process of the metal-resistant electronic tag 100, the isolation portion 21 may be injection molded outside the housing of the electronic tag body 10, in this case, the isolation portion 21 may be a steel plate, and the thickness of the isolation portion 21 may be 0.4 mm.
As shown in fig. 1, according to one embodiment of the present invention, the metal separator 20 includes: the electronic tag comprises a partition part 21 and an extension part 22, wherein the partition part 21 is suitable for being clamped between the electronic tag body 10 and the device 30, the partition part 21 forms a partition plate with a flat surface, one end of the extension part 22 is connected with the partition part 21, and the other end of the extension part extends in a direction away from the electronic tag body 10. Under the action of the extension portion 22 and the isolation portion 21, the metal isolator 20 may have a certain wrapping effect on the electronic tag body 10, further maximizing the performance of the electronic tag body 10.
In some specific examples, an included angle between the extending portion 22 and the isolating portion 21 ranges from 90 ° to 180 °, that is, the extending portion 22 may extend outward along the extending direction of the isolating portion 21, the included angle between the extending portion 22 and the isolating portion 21 is 180 °, the extending portion 22 may also be arranged perpendicular to the isolating portion 21, and the included angle between the extending portion 22 and the isolating portion 21 is 90 °, of course, the included angle between the extending portion 22 and the isolating portion 21 may also be 120 °, 145 °, 150 °, and the like, and under the effect of the extending portion 22, half-wrapping is implemented on the electronic tag body 10, and performance of the electronic tag body 10 is ensured to be maximized.
The extension portion 22 may include one, or two or more, the extension portion 22 is located at any edge of the isolation portion 21, that is, the extension portion 22 may be disposed at any edge of the isolation portion 21, or the extension portion 22 may not be disposed, and an included angle between each extension portion 22 and the isolation portion 21 may be the same or different, so as to achieve the best performance of the electronic tag body 10.
As shown in fig. 2, in some examples, the extending portion 22 includes two first extending portions 221 arranged oppositely, an included angle between the first extending portion 221 and the partition 21 is 150 °, and under the action of the two first extending portions 221, the side portion of the electronic tag body 10 is wrapped, so that the performance of the electronic tag body 10 is maximized.
In some examples, the extending portion 22 includes a plurality of extending portions 22, the plurality of extending portions 22 are connected to each other to form an annular extending portion surrounding the electronic tag body 10, as shown in fig. 1, the outside of the partition 21 has two oppositely arranged first extending portions 221 and two oppositely arranged second extending portions 222, an included angle between the first extending portions 221 and the partition 21 is 150 °, an included angle between the second extending portions 222 and the partition 21 is 180 °, and the first extending portions 221 and the second extending portions 222 are connected to each other to form an annular extending portion, thereby improving a blocking effect of the metal spacer 20 on the electronic tag body 10 and ensuring that performance of the electronic tag body 10 is maximized.
In some specific examples, the spacer 21 and the extension 22 are of a plate structure with equal thickness, and the thickness ranges from 0.1mm to 0.5mm, that is, the thickness of the metal spacer 20 may be 0.1mm, 0.3mm, 0.5mm, etc., so as to ensure that the metal-resistant electronic tag 100 has better reading and application performance under the action of the metal spacer 20.
The method for manufacturing the metal-resistant electronic tag comprises the following steps:
s1, providing an antenna, a radio frequency chip, a metal layer and an injection molding inner core;
s2, providing a metal spacer;
and S3, assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolating piece to form the anti-metal electronic tag.
According to the manufacturing method of the anti-metal electronic tag, the influence of the surface of equipment on the reading distance of the electronic tag body can be effectively prevented, the anti-metal electronic tag with better reading performance in different installation environments is manufactured, and the manufacturing method is convenient and simple and low in production cost.
The injection molding inner core plays a role of a support, and meanwhile, the distance between the antenna and the metal layer can be limited, so that the anti-metal electronic tag can be arranged on equipment with a metal structure on the surface and is matched with the metal surface to enhance the sensing capacity of radio frequency signals to the tag.
According to one embodiment of the invention, assembling the antenna and the radio frequency chip, the metal layer, the injection molded inner core and the metal isolator comprises: assembling the antenna, the radio frequency chip, the metal layer and the injection molding inner core into a whole by adopting an injection molding process to form an electronic tag body with an injection molding shell; and assembling the electronic tag body and the metal spacer to form the anti-metal electronic tag. Therefore, in the production of the metal-resistant electronic tag injection molding process, the metal spacer is injected outside the shell of the electronic tag body.
A method of manufacturing a metal-resistant electronic label according to the invention is described below with reference to fig. 5.
Firstly, carrying out FPC plate making to manufacture an FPC antenna; printing or pasting; welding the radio frequency chip on the FPC antenna by SMT welding and dispensing processes; providing an injection molding inner core; meanwhile, providing a metal layer, assembling, enabling the antenna and the radio frequency chip to be located on one side of the injection molding inner core, enabling the metal layer to be located on the other side of the injection molding inner core, and then forming the electronic tag body through the injection molding outer shell; providing a manufactured metal spacer; and finally, assembling the electronic tag body and the metal spacer to form the anti-metal electronic tag.
According to another embodiment of the present invention, assembling an antenna and a radio frequency chip, a metal layer, an injection molded core, and a metal spacer comprises: and assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator into a whole by adopting an injection molding process to form the metal-resistant electronic tag with the injection molding shell. That is to say, in the production of the injection molding process of the metal-resistant electronic tag, the metal spacer can be directly injected into the shell of the metal-resistant electronic tag to form the integrated injection molding metal-resistant electronic tag with the metal spacer.
A method of manufacturing a metal-resistant electronic label according to the invention is described below with reference to fig. 6.
Firstly, carrying out FPC plate making to manufacture an FPC antenna; printing or pasting; welding the radio frequency chip on the FPC antenna by SMT welding and dispensing processes; providing an injection molding inner core; and then, providing a metal layer, providing a manufactured metal spacer at the same time, assembling, enabling the antenna and the radio frequency chip to be located on one side of the injection molding inner core, enabling the metal layer to be located on the other side of the injection molding inner core, enabling the metal spacer to be located on the other side of the injection molding inner core, and finally forming the metal-resistant electronic tag through the injection molding shell.
From this, make fashioned anti metal electronic tags can effectively obstruct the influence that the equipment surface read the distance to the electronic tags body, because every anti metal electronic tags carries only asset identity code, can the identification equipment, utilize radio frequency signal to carry out equipment code transmission simultaneously, the full life cycle management of realization equipment asset that can be convenient.
Other constructions and operations of the metal-resistant electronic tag 100 according to the embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, unless otherwise expressly specified or limited, the first feature "on" or "under" the second feature may comprise the first and second features being in direct contact, or may comprise the first and second features being in contact, not directly, but via another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (14)

1. A metal-resistant electronic tag, comprising:
the electronic tag comprises an electronic tag body, a control unit and a display unit, wherein the electronic tag body is suitable for being arranged on equipment;
the metal spacer is connected with the electronic tag body so as to isolate the electronic tag body from the equipment.
2. The metal-resistant electronic tag of claim 1, wherein the surface of the device is a metallic structure.
3. The metal-resistant electronic tag according to claim 1, wherein the metal separator comprises a separator adapted to be sandwiched between the electronic tag body and the device, and the shape of the separator corresponds to the shape of the electronic tag body.
4. The metal-resistant electronic tag according to claim 3, wherein the spacer forms a spacer having a flat surface.
5. The metal resistant electronic tag of claim 3, wherein the metal spacer further comprises:
one end of the extension part is connected with the isolation part, and the other end of the extension part extends towards the direction far away from the electronic tag body.
6. The metal-resistant electronic tag of claim 5, wherein the angle between the extension and the spacer is in the range of 90 ° -180 °.
7. The metal resistant electronic tag according to claim 5, wherein said extension comprises a plurality of said extensions, said plurality of said extensions being interconnected to form an annular extension surrounding said electronic tag body.
8. The metal resistant electronic tag according to claim 1, wherein the metal spacer has a thickness in the range of 0.1mm to 0.5 mm.
9. The metal-resistant electronic tag according to claim 1, wherein an antenna is arranged in the electronic tag body, and the projection of the metal separator on the plane of the antenna covers the antenna.
10. The metal-resistant electronic tag according to any one of claims 1-9, wherein the metal spacer is integrally connected to the electronic tag body by an injection molding process.
11. The metal resistant electronic tag according to any one of claims 1-9, wherein the metal spacer is securely attached to the electronic tag body.
12. A method of manufacturing a metal-resistant electronic label according to any one of claims 1-9, characterized in that it comprises the steps of:
providing an antenna, a radio frequency chip, a metal layer and an injection molding inner core;
providing a metal spacer;
and assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator to form the anti-metal electronic tag.
13. The method of manufacturing a metal-resistant electronic tag according to claim 12, wherein said assembling said antenna and radio frequency chip, said metal layer, said injection molded core, and said metal spacer comprises:
assembling the antenna, the radio frequency chip, the metal layer and the injection molding inner core into a whole by adopting an injection molding process to form the electronic tag body with an injection molding shell;
and assembling the electronic tag body and the metal spacer to form the anti-metal electronic tag.
14. The method of manufacturing a metal-resistant electronic tag according to claim 12, wherein said assembling said antenna and radio frequency chip, said metal layer, said injection molded core, and said metal spacer comprises:
and assembling the antenna, the radio frequency chip, the metal layer, the injection molding inner core and the metal isolator into a whole by adopting an injection molding process to form the metal-resistant electronic tag with an injection molding shell.
CN202010529848.9A 2020-06-11 2020-06-11 Metal-resistant electronic tag and manufacturing method thereof Pending CN111738392A (en)

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