CN111736259A - Waveguide lens module, manufacturing method thereof and AR equipment - Google Patents
Waveguide lens module, manufacturing method thereof and AR equipment Download PDFInfo
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- CN111736259A CN111736259A CN202010728512.5A CN202010728512A CN111736259A CN 111736259 A CN111736259 A CN 111736259A CN 202010728512 A CN202010728512 A CN 202010728512A CN 111736259 A CN111736259 A CN 111736259A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 239000003292 glue Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 88
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005526 G1 to G0 transition Effects 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/124—Geodesic lenses or integrated gratings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/01—Head-up displays
- G02B27/0101—Head-up displays characterised by optical features
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a waveguide lens module, a manufacturing method thereof and AR equipment, wherein the manufacturing method of the waveguide lens module comprises the following steps: superposing and fixing the multilayer wafer-level waveguide lens to obtain a wafer lens module; and dividing the wafer lens module into a plurality of waveguide lens modules. The technical scheme of the invention can improve the production efficiency of the waveguide lens module.
Description
Technical Field
The invention relates to the technical field of optical devices, in particular to a waveguide lens module, a manufacturing method thereof and AR equipment.
Background
Augmented Reality (AR) devices can superimpose and interact with a virtual world over the real world on their lenses. The lenses currently used in AR devices usually include multilayer waveguide lenses, such as waveguide lenses of three colors, red, green, and blue, which are stacked. The existing method for laminating, fixing and manufacturing the multilayer waveguide lens is complicated and time-consuming, and the production efficiency needs to be improved.
Disclosure of Invention
The invention mainly aims to provide a manufacturing method of a waveguide lens module, aiming at improving the production efficiency of the waveguide lens module.
In order to achieve the above object, the method for manufacturing a waveguide lens module according to the present invention comprises the steps of:
superposing and fixing the multilayer wafer-level waveguide lens to obtain a wafer lens module;
and dividing the wafer lens module into a plurality of waveguide lens modules.
Optionally, the wafer level waveguide lens includes at least three layers, and the step of stacking and fixing the multiple layers of wafer level waveguide lenses to obtain the wafer lens module includes:
superposing and fixing the two layers of wafer-level waveguide lenses to obtain a first sub-wafer lens module;
and superposing and fixing the other layer of the wafer-level waveguide lens to the first sub-wafer lens module.
Optionally, the step of superposing and fixing the two wafer-level waveguide lenses to obtain the first sub-wafer lens module includes:
adhering adhesive to the laminating surface of at least one layer of the wafer-level waveguide lens;
overlapping the two wafer-level waveguide lenses;
and curing the bonding glue to fix the two wafer-level waveguide lenses.
Optionally, the wafer level waveguide lens is provided with an alignment portion;
and matching the aligning parts of the two wafer-level waveguide lenses in the process of overlapping the two wafer-level waveguide lenses.
Optionally, the alignment portion is a positioning insert or an alignment mark provided on the wafer level waveguide lens.
Optionally, the bonding glue is a PSA glue, the PSA glue is cured in a pressing mode, and UV exposure or heating is selectively matched to increase the bonding force; or
The bonding glue is UV glue, and the UV glue is cured in an exposure mode; alternatively, the first and second electrodes may be,
the bonding glue is thermosetting glue, and the thermosetting glue is cured in a heating and curing mode.
Optionally, the adhesive is attached to the laminating surface of the wafer-level waveguide lens in a grid shape.
Optionally, the step of dividing the wafer lens module into a plurality of waveguide lens modules specifically includes: and cutting the wafer lens module into a plurality of waveguide lens modules by adopting a laser scribing or numerical control cutting mode.
The invention also provides a waveguide lens module which is manufactured by the manufacturing method of the waveguide lens module.
The invention also provides an AR device comprising the waveguide lens module.
According to the technical scheme, the multi-layer wafer-level waveguide lens is firstly overlapped and fixed to obtain a wafer lens module, and then the wafer lens module is divided to produce a plurality of overlapped waveguide lens modules in batches; it can be understood that when the multi-layer wafer-level waveguide lens is overlapped and fixed, the multiple groups of waveguide lenses can be overlapped and fixed at the same time, and compared with a manufacturing method in which the single groups of waveguide lenses are respectively overlapped and fixed, the manufacturing method of the technical scheme can save the times of overlapping and fixing operations and reduce the time consumption for manufacturing the waveguide lens modules in batches, thereby improving the production efficiency and increasing the capacity, and can also improve the consistency and the reproducibility of manufacturing the waveguide lens modules in batches, thereby improving the production stability and the yield of the waveguide lens modules.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a flowchart illustrating steps of a method for manufacturing a waveguide lens module according to an embodiment of the present invention;
FIG. 2 is a schematic representation of the embodiment of step S10 in FIG. 1;
fig. 3 is a schematic diagram of the object in step S20 in fig. 1.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that if the description of "first", "second", etc. is provided in the embodiment of the present invention, the description of "first", "second", etc. is only for descriptive purposes and is not to be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a manufacturing method of a waveguide lens module.
Referring to fig. 1 to 3, in an embodiment of the present invention, a method for manufacturing a waveguide lens module includes:
step S10, overlapping and fixing the multilayer wafer-level waveguide lens to obtain a wafer lens module;
step S20, the wafer mirror module is divided into a plurality of waveguide mirror modules.
In this embodiment, each wafer-level waveguide lens generally includes a plurality of waveguide lenses arranged in an array, and each waveguide lens generally has an in-grating and an out-grating. The waveguide lens module manufactured by the manufacturing method is generally applied to AR equipment. Without loss of generality, the AR device usually further includes an optical engine, the optical engine is disposed toward the incoupling grating, and emits image light to the incoupling grating, and the image light is coupled into the waveguide lens at the incoupling grating, then propagates to the outcoupling grating in the waveguide lens, is outcoupled at the outcoupling grating, and then enters the human eye, so that the human eye can see an image corresponding to the image light emitted by the optical engine. The image light emitted by the optical machine is generally composite light, and in order to solve the dispersion problem corresponding to the composite light, the AR device generally employs a waveguide lens module including a multilayer waveguide lens.
In addition, in this embodiment, the grating structure on the wafer-level waveguide lens is usually formed by a nanoimprint process, and the specific process flow includes surface cleaning, glue coating, imprinting, exposure curing, and the like. However, the design is not limited thereto, and in other embodiments, the grating structure on the wafer-level waveguide lens may also be formed by a process similar to semiconductor processing, for example, a grating material film is first deposited on the wafer-level waveguide substrate by a thin film deposition method, and then a corresponding grating structure is formed on the grating material film by lithography through a lithography forming process.
According to the technical scheme, the multi-layer wafer-level waveguide lens is firstly overlapped and fixed to obtain a wafer lens module, and then the wafer lens module is divided to produce a plurality of overlapped waveguide lens modules in batches; it can be understood that when the multi-layer wafer-level waveguide lens is overlapped and fixed, the simultaneous overlapping and fixing of a plurality of groups of waveguide lenses can be realized, compared with a manufacturing method that each layer of wafer-level waveguide lens is divided into a plurality of waveguide lenses at first and then each group of waveguide lens is overlapped and fixed respectively, the manufacturing method of the technical scheme can save the times of overlapping and fixing operations on one hand, reduce the time consumption for manufacturing waveguide lens modules in batches, thereby improving the production efficiency and the productivity, and on the other hand, can also improve the consistency and the reproducibility for manufacturing the waveguide lens modules in batches, thereby improving the production stability and the yield of the waveguide lens modules.
Further, the wafer level waveguide lens includes at least three layers, and the step S10 includes:
step S11, overlapping and fixing the two wafer-level waveguide lenses to obtain a first sub-wafer lens module;
step S12, the other layer of wafer level waveguide lens is fixed to the first sub-wafer lens module.
In this embodiment, the wafer lens module includes at least three layers of wafer level waveguide lenses, that is, the waveguide lens module prepared includes at least three layers of waveguide lenses, for example, a three-color waveguide lens module including three color waveguide lenses of red, green and blue.
Taking the fabrication of a three-color waveguide lens module as an example, a red wafer-level waveguide lens (hereinafter referred to as wafer R), a green wafer-level waveguide lens (hereinafter referred to as wafer G) and a blue wafer-level waveguide lens (hereinafter referred to as wafer B) need to be prepared (see fig. 2), then the wafer R and the wafer G are overlapped and fixed to obtain a wafer R/G module, and then the wafer B is overlapped and fixed to the wafer R/G module to obtain the wafer R/G/B module. In the process of superposing and fixing the wafer B to the wafer R/G module, because the wafer R/G module is already in a fixed state, when the wafer B is superposed with the wafer R/G module, the condition of offset and dislocation between the wafer R and the wafer G cannot be caused, so that the accurate superposition between various finally obtained wafers in the wafer R/G/B module is favorably ensured.
However, the design is not limited thereto, and in other embodiments, at least three wafer-level waveguide lenses may be stacked together after all alignment, and then fixed together (for example, heat-fixing the thermosetting adhesive between the layers at one time), so that the number of times of fixing (for example, the number of times of heating) may be reduced, and the production efficiency may be improved.
In addition, it should be noted that some waveguide lens modules may also include only two waveguide lenses, and the corresponding wafer lens module includes only two wafer-level waveguide lenses, in which case, only two wafer-level waveguide lenses need to be overlapped and fixed. In addition, the waveguide lens module may include more than four waveguide lenses, for example, a waveguide lens module including six waveguide lenses, and the corresponding wafer lens module includes more than four wafer-level waveguide lenses, in this case, after the first sub-wafer lens module is obtained by stacking and fixing, the remaining wafer-level waveguide lenses are stacked and fixed layer by layer.
Further, the step S11 includes:
step S111, adhering adhesive to the superposed surface of at least one layer of the wafer-level waveguide lens;
step S112, overlapping the two wafer-level waveguide lenses;
and S113, curing the bonding glue to fix the two wafer-level waveguide lenses.
In this embodiment, the bonding glue can be attached to the laminating surface of only one layer of wafer-level waveguide lens; of course, in other embodiments, the bonding glue may be adhered to both of the laminating surfaces of the two wafer-level waveguide lenses. Optionally, the bonding glue attached to the superposed surface of the wafer-level waveguide lens is arranged in a grid shape (see fig. 2), so that after superposition extrusion, an even thin bonding glue layer is formed between the two wafer-level waveguide lenses, and compared with a mode of directly fully coating the bonding glue on the superposed surface of the wafer-level waveguide lens, waste of the bonding glue can be reduced, and meanwhile, the influence of the bonding glue layer on a grating area can be avoided. Further optionally, the adhesive glue may be a PSA (pressure sensitive adhesive) with a grid structure, or a UV glue or a thermosetting glue obtained by dispensing along a grid line; after laminating, if the bonding glue is PSA glue, curing the PSA glue in a pressing mode, and selectively carrying out UV exposure or heating to increase the bonding force; if the bonding glue is UV glue, curing the UV glue in an exposure mode, and laminating the UV glue and the bonding glue by using a stationary phase; and if the bonding glue is thermosetting glue, curing the thermosetting glue in a heating and curing manner. In the technical scheme of the embodiment, the wafer-level waveguide lens can be fixed between two adjacent layers of the wafer-level waveguide lens in a bonding mode without any structural change or damage to the wafer-level waveguide lens.
Further, the wafer-level waveguide lens is provided with an alignment part;
in the process of step S112, the alignment portions of the two layers of wafer-level waveguide lenses are matched, so that the waveguide lenses on different wafer-level waveguide lenses are aligned, thereby avoiding offset and dislocation between the same group of waveguide lenses, and realizing accurate alignment and superposition, so as to ensure that the waveguide lens module is produced with high yield. Optionally, the alignment portion is a positioning insert or an alignment mark or a positioning receptacle or the like disposed on the wafer-level waveguide lens; of course, the positioning inserts or alignment marks or positioning receptacles, etc. are typically provided at the spaces between different waveguide lenses on the wafer level waveguide lens or at the edges of the wafer level waveguide lens; in addition, to improve the alignment effect, at least two alignment portions are usually disposed on a wafer level waveguide lens, for example, at least two alignment marks are disposed, or one alignment mark is disposed while one positioning insert is disposed, that is, the two alignment portions may be of the same type or may not be of the same type.
Further, the step 20 specifically includes: and cutting the wafer lens module into a plurality of waveguide lens modules by adopting a laser scribing or numerical control cutting mode.
According to the technical scheme of the embodiment, the wafer lens module is divided into the plurality of waveguide lens modules (as shown in fig. 3) by adopting a laser scribing or numerical control cutting mode, so that the waveguide lens modules can be automatically divided in batch, the production efficiency is improved, and the productivity is increased; in addition, laser scribing and numerical control cutting can both realize accurate segmentation usually to improve the uniformity box production yield of waveguide lens module.
The present invention further provides a waveguide lens module manufactured by the method for manufacturing a waveguide lens module, which adopts all the technical solutions of the above embodiments, so that the waveguide lens module at least has all the beneficial effects brought by the technical solutions of the above embodiments, and further description is omitted here.
The present invention further provides an AR device, which includes a waveguide lens module, and the specific manufacturing method of the waveguide lens module refers to the above embodiments, and since the AR device employs all technical solutions of all the above embodiments, the AR device at least has all beneficial effects brought by the technical solutions of the above embodiments, and details are not repeated herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for manufacturing a waveguide lens module is characterized by comprising the following steps:
superposing and fixing the multilayer wafer-level waveguide lens to obtain a wafer lens module;
and dividing the wafer lens module into a plurality of waveguide lens modules.
2. The method of claim 1, wherein the wafer level waveguide lens comprises at least three layers, and the step of stacking and fixing the plurality of layers of wafer level waveguide lenses to obtain the wafer lens module comprises:
superposing and fixing the two layers of wafer-level waveguide lenses to obtain a first sub-wafer lens module;
and superposing and fixing the other layer of the wafer-level waveguide lens to the first sub-wafer lens module.
3. The method of claim 2, wherein the step of stacking and fixing the two wafer level waveguide lenses to obtain a first sub-wafer lens module comprises:
adhering adhesive to the laminating surface of at least one layer of the wafer-level waveguide lens;
overlapping the two wafer-level waveguide lenses;
and curing the bonding glue to fix the two wafer-level waveguide lenses.
4. The method of claim 3, wherein the wafer level waveguide lens has an alignment portion;
and matching the aligning parts of the two wafer-level waveguide lenses in the process of overlapping the two wafer-level waveguide lenses.
5. The method of claim 4, wherein the alignment portion is a positioning insert or an alignment mark disposed on the wafer level waveguide lens.
6. The method for manufacturing the waveguide lens module according to claim 3, wherein the adhesive is a PSA adhesive, the PSA adhesive is cured by pressing, and UV exposure or heating is selectively matched to increase the adhesive force; alternatively, the first and second electrodes may be,
the bonding glue is UV glue, and the UV glue is cured in an exposure mode; alternatively, the first and second electrodes may be,
the bonding glue is thermosetting glue, and the thermosetting glue is cured in a heating and curing mode.
7. The method of claim 3, wherein the adhesive is attached to the lamination surface of the wafer level waveguide lens in a grid pattern.
8. The method of any one of claims 1 to 7, wherein the step of dividing the wafer lens module into a plurality of waveguide lens modules comprises: and cutting the wafer lens module into a plurality of waveguide lens modules by adopting a laser scribing or numerical control cutting mode.
9. A waveguide lens module, characterized in that the waveguide lens module is manufactured by the method for manufacturing a waveguide lens module according to any one of claims 1 to 8.
10. An AR device comprising the waveguide optic module of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010728512.5A CN111736259A (en) | 2020-07-24 | 2020-07-24 | Waveguide lens module, manufacturing method thereof and AR equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010728512.5A CN111736259A (en) | 2020-07-24 | 2020-07-24 | Waveguide lens module, manufacturing method thereof and AR equipment |
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