CN111722688A - Method, device and equipment for controlling chip power-on, medium and program product - Google Patents
Method, device and equipment for controlling chip power-on, medium and program product Download PDFInfo
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
- G06F1/266—Arrangements to supply power to external peripherals either directly from the computer or under computer control, e.g. supply of power through the communication port, computer controlled power-strips
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- G—PHYSICS
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- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
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- G06F11/3013—Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system is an embedded system, i.e. a combination of hardware and software dedicated to perform a certain function in mobile devices, printers, automotive or aircraft systems
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
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- G06F11/3058—Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
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Abstract
The application provides a method, a device and equipment for electrifying a control chip, a medium and a program product, wherein the method for electrifying the control chip comprises the following steps: the control chip is powered on for the first time; detecting the temperature of the chip, and controlling the heat dissipation module according to the temperature of the chip so as to adjust the temperature of the chip; when the temperature of the chip reaches the expected temperature, controlling the chip to be powered off; and the control chip is powered on for the second time. According to the method, the device and the equipment, the temperature of the chip can be easily adjusted to the expected temperature through preheating, so that the purpose of electrifying at the expected temperature is achieved, the stability of chip operation on the computing board of the digital certificate processing equipment is improved, an additional heating module is not required to be arranged, and the cost is low.
Description
Technical Field
The present application relates to the field of block chain device manufacturing technologies, and in particular, to a method and an apparatus for controlling chip power-on, a digital certificate processing device, a storage medium, and a computer program product.
Background
The chip of the digital certificate processing equipment can stably operate only by being powered up at a proper temperature, and the stability of subsequent work can be influenced by being powered up at a low temperature or a high temperature. In the related art, when the ambient temperature is low, the power-on temperature of the chip may be raised by heating the chip with an external heat source (e.g., a heating wire), and when the ambient temperature is high, the power-on temperature of the chip may be lowered by an external heat dissipation device (e.g., a fan).
However, when the ambient temperature is low, the chip is heated by an external heat source, an additional device is required, and additional time and energy are consumed; when the ambient temperature is high, only through the heat dissipation of external heat dissipation device, appear easily adjusting inadequately or overshoot for the chip temperature is too low or too high, is difficult to stabilize at the expectation temperature.
Disclosure of Invention
The embodiments of the present application aim to solve at least one of the technical problems in the related art to some extent.
Therefore, a first objective of the present application is to provide a method for powering up a control chip, which can improve stability of powering up the chip.
A second objective of the present application is to provide an apparatus for controlling power on of a chip.
A third object of the present application is to propose a digital voucher processing device.
A fourth object of the present application is to propose another digital voucher processing device.
A fifth object of the present application is to propose a non-transitory computer-readable storage medium.
A sixth object of the present application is to propose a computer program product.
To achieve the first object, a method for controlling power-on of a chip according to an embodiment of the first aspect of the present application includes: controlling the chip to be powered on for the first time; detecting the temperature of the chip, and controlling a heat dissipation module according to the temperature of the chip so as to adjust the temperature of the chip; controlling the chip to be powered off when the temperature of the chip reaches a desired temperature; and controlling the chip to be powered on for the second time.
According to the method for controlling the chip to be powered on, an external heat source is not needed, the cost is low, the chip is preheated by combining the self heating of the chip and the heat dissipation capacity of the heat dissipation module, compared with the heat dissipation through the external heat dissipation module, the temperature of the chip is more easily stabilized at the expected temperature, the chip is controlled to be powered off after the temperature of the chip reaches the expected temperature, the chip is controlled to be powered on for the second time at the expected temperature, the purpose of controlling the chip to be powered on at the expected temperature is achieved, and the operation of the chip is more stable.
In some embodiments, the heat dissipation module includes a heat dissipation fan, and the controlling the heat dissipation module according to the temperature of the chip includes: the temperature of the chip is higher than the expected temperature, and the rotating speed of the heat dissipation fan is increased; or, the temperature of the chip is lower than the expected temperature, and the rotating speed of the heat radiation fan is reduced.
In some embodiments, the method further comprises: when the environment temperature is lower than the expected temperature, any one calculation task is distributed to the chip in response to the first power-on signal of the chip, and the requirement of preheating can be met more easily.
In some embodiments, after said controlling said chip to power down, said method further comprises: and clearing the working state information of the chip.
In order to achieve the second object, an apparatus for controlling power on of a chip according to an embodiment of the second aspect of the present application includes: the detection module is used for detecting the temperature of the chip; a heat dissipation module; the control module is configured to control the chip to be powered on for the first time, control the heat dissipation module according to the temperature of the chip so as to adjust the temperature of the chip, control the chip to be powered off when the temperature of the chip reaches an expected temperature, and control the chip to be powered on for the second time.
The device of control chip power-on of this application embodiment, under ambient temperature, need not to use external heat source, and is with low costs, combine chip self to generate heat and control heat radiation module's heat-sinking capability, preheat the chip, compare in only dispelling the heat through heat radiation module, the chip temperature is more stable at the expectation temperature, and after the temperature of chip reached the expectation temperature, the control chip was electrified down, control chip was electrified under the expectation temperature for the second time, thereby can make the chip operation more stable.
In some embodiments, the heat dissipation module includes a heat dissipation fan, and the control module, when controlling the heat dissipation module according to the temperature of the chip, is specifically configured to increase the rotation speed of the heat dissipation fan when the temperature of the chip is higher than the desired temperature, or decrease the rotation speed of the heat dissipation fan when the temperature of the chip is lower than the desired temperature.
In some embodiments, the control module is further configured to assign any one of the computing tasks to the chip in response to a first power-up signal of the chip when the ambient temperature is lower than the desired temperature, so that the preheating requirement can be more easily met.
In some embodiments, the apparatus further comprises a clearing module configured to clear the operating state information of the chip after the chip is powered down.
To achieve the third object, a digital certificate processing apparatus according to an embodiment of the third aspect of the present application includes: a force computation board comprising a plurality of chips; and means for controlling the powering up of the chip as described in the above embodiments.
The digital certificate processing equipment of the embodiment of the application can enable the chip on the force calculation board to run more stably by adopting the device for controlling the power-on of the chip of the embodiment.
In order to achieve the fourth object, a digital certificate processing apparatus according to an embodiment of the fourth aspect of the present application includes: at least one processor; and a memory communicatively coupled to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions, when executed by the at least one processor, cause the at least one processor to perform the method for controlling power-on of a chip as described in the above embodiments.
To achieve the fifth object, a computer-readable storage medium of the fifth aspect of the present application stores computer-executable instructions configured to perform the method for controlling power-on of a chip according to the above embodiments.
To achieve the sixth object, a computer program product according to an embodiment of the sixth aspect of the present application includes a computer program stored on a computer-readable storage medium, the computer program including program instructions, which, when executed by a computer, cause the computer to execute the method for controlling power on of a chip according to the above embodiment.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flowchart of a method for controlling power-up of a chip according to an embodiment of the present application;
FIG. 2 is a block diagram of an apparatus for controlling power-up of a chip according to an embodiment of the present application;
FIG. 3 is a block diagram of an apparatus for controlling power-up of a chip according to an embodiment of the present application;
FIG. 4 is a block diagram of a digital voucher processing device according to one embodiment of the present application; and
fig. 5 is a block diagram of a digital voucher processing device according to one embodiment of the present application.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
The method for powering on the control chip according to the embodiment of the first aspect of the present application is described below with reference to the drawings.
Fig. 1 is a flowchart of a method for controlling power-on of a chip according to an embodiment of the present application.
As shown in fig. 1, the method for controlling power-on of a chip according to the embodiment of the present application includes step S1, step S2, step S3, and step S4.
In step S1, the control chip is powered on for the first time.
Specifically, at an ambient temperature, the control chip is powered on, the temperature of the chip at the time of power-on is the current ambient temperature, and the ambient temperature and the expected temperature of the chip during stable operation often have deviation, which may affect the stability of the operation of the chip.
And step S2, collecting the temperature of the chip, and controlling the heat dissipation module according to the temperature of the chip to adjust the temperature of the chip.
Specifically, after power is applied, the chip itself generates heat, and the temperature of the chip gradually increases. However, the self-heating capability of the chip is affected by many conditions and cannot be controlled precisely, and the heat dissipation capability of the heat dissipation module generally has a precise control method (for example, adjusting the rotation speed of a fan). By combining the self-heating of the chip and adjusting the heat dissipation capability of the heat dissipation module, the temperature of the chip can be more easily controlled at a stable temperature.
In some embodiments, the temperature of the chip may be detected by the detection module, the temperature of the chip may be compared with an expected temperature during stable operation, and the heat dissipation module may be controlled according to the comparison result to adjust the temperature of the chip. In an embodiment of the present application, the heat dissipation module is used for dissipating heat of the chip, for example, the heat dissipation module may include a fan, a refrigerant refrigeration system, and the like. Specifically, if the temperature of the chip is higher than the desired temperature, the heat dissipation capability of the heat dissipation module is improved to reduce the temperature of the chip; and if the temperature of the chip is lower than the expected temperature, reducing the heat dissipation capacity of the heat dissipation module to improve the temperature of the chip so that the temperature of the chip gradually approaches the expected temperature during stable operation. The control method of the heat dissipation capability of the heat dissipation module is not particularly limited, and an appropriate method may be adopted.
In some embodiments, the heat dissipation module includes a heat dissipation fan, and the temperature of the chip is higher than the desired temperature, the rotation speed of the heat dissipation fan is increased to lower the temperature of the chip; or, if the temperature of the chip is lower than the desired temperature, the rotation speed of the heat dissipation fan is reduced, for example, to a certain rotation speed value or zero, so as to reduce the heat dissipation of the chip, so that the temperature of the chip gradually approaches the desired temperature.
In other embodiments, taking the refrigerant refrigeration system as an example, if the temperature of the chip is higher than the desired temperature, the refrigeration capacity of the refrigerant refrigeration system is increased to lower the temperature of the chip, or if the temperature of the chip is lower than the desired temperature, the refrigeration capacity of the refrigerant refrigeration system is decreased to gradually raise the temperature of the chip, and then gradually approaches the desired temperature.
And step S3, controlling the chip to be powered down when the temperature of the chip reaches the expected temperature.
And step S4, the control chip is powered on for the second time.
In an embodiment, the first power-on corresponds to preheating the chip, and specifically, the chip of the digital certificate processing apparatus is a chip that completes a calculation task, and is powered on at an inappropriate ambient temperature, which is poor in stability and may cause a calculation error.
And then, the temperature of the chip reaches the expected temperature, the chip is controlled to be powered off firstly, the temperature of the chip is the expected temperature at the moment, then the chip is controlled to be powered on for the second time, and the chip keeps stable work after being powered on this time, so that the purpose of controlling the chip to be powered on at the expected temperature is achieved, and a foundation is provided for stable operation of the chip.
According to the method for controlling the chip to be powered on, an external heat source is not needed, the cost is low, the chip is preheated by combining the self heating of the chip and the heat dissipation capacity of the heat dissipation module, compared with the heat dissipation through the external heat dissipation module, the temperature of the chip is more easily stabilized at the expected temperature, the chip is controlled to be powered off after the temperature of the chip reaches the expected temperature, the chip is controlled to be powered on for the second time at the expected temperature, the purpose of controlling the chip to be powered on at the expected temperature is achieved, and the operation of the chip can be more stable.
Further, since the temperature of the chip is adjusted by the heat dissipation module, the change of the temperature of the chip may have a certain degree of hysteresis, and in some embodiments, the temperature of the chip may be periodically detected, for example, the temperature of the chip may be detected once every preset time, so that not only accurate temperature data may be detected, but also the data processing amount may be reduced.
In some embodiments of the application, because the control chip is powered on for the first time under the current environment temperature, the temperature of the chip reaches the expected temperature, which is equivalent to the preheating stage, the chip is unstable in operation, whether the calculation result is correct at this time, and collection and use are not required, the temperature of the chip reaches the expected temperature, the control chip is powered off, the working state information of the chip is cleared, the chip is recovered to the initial state, the control chip is powered on for the second time under the expected temperature, the chip is stable in operation at this time, the calculation data is more accurate, and collection and use can be relieved.
For example, the environmental temperature is 15 degrees, the expected temperature is 20 degrees, and the temperature of the chip is 15 degrees at this time, specifically, the control chip is powered on for the first time, any calculation task of the chip can be allocated, but the calculation result is not recorded, the temperature of the chip is lower than the expected temperature, and the heat dissipation module does not need to be started.
For another example, the ambient temperature is 30 degrees, the expected temperature is 20 degrees, and the temperature of the chip is 30 degrees at this time, specifically, the chip is controlled to be powered on for the first time, because the temperature of the chip is higher than the expected temperature, the heat dissipation module is controlled to be started, and the heat dissipation capability of the chip is improved, so that the temperature of the chip is gradually reduced, when the temperature of the chip reaches the expected temperature of 20 degrees, the heat dissipation module is controlled to be turned off or turned off in a delayed manner, the chip is controlled to be powered off to recover the initial state, and then the chip is controlled to be powered on for the second time at the expected temperature, at this time, the chip operates stably, and output data of the chip can be collected, so.
In summary, the method for controlling power-on of the chip in the embodiment of the present application does not use an external heat source at the ambient temperature, utilizes self-heating of the chip during operation, and combines with the heat dissipation capability of the heat dissipation device to control the power-on of the chip at the expected temperature, so that the stability of the chip working at different ambient temperatures can be improved, the accuracy of chip calculation is improved, and the calculation cost is reduced.
An apparatus for controlling power-on of a chip according to an embodiment of the second aspect of the present application is described below with reference to the drawings.
Fig. 2 is a block diagram of an apparatus for controlling power-on of a chip according to an embodiment of the present application, and as shown in fig. 2, the apparatus 100 for controlling power-on of a chip according to an embodiment of the present application includes a detection module 10, a heat dissipation module 20, and a control module 30
The detection module 10 is used for acquiring the temperature of the chip, such as a temperature sensor. The control module 30 is configured to control the chip to be powered on for the first time, control the heat dissipation module 20 according to the temperature of the chip to adjust the temperature of the chip, control the chip to be powered off when the temperature of the chip reaches a desired temperature, and control the chip to be powered on for the second time.
Specifically, after power is applied, the chip itself generates heat, and the temperature of the chip gradually increases. However, the self-heating capability of the chip is affected by many conditions and cannot be controlled precisely, and the heat dissipation capability of the heat dissipation module 20 generally has a precise control method (e.g., adjusting the rotation speed of a fan). By combining the self-heating of the chip and adjusting the heat dissipation capability of the heat dissipation module 20, the temperature of the chip can be more easily controlled at a stable temperature.
For example, the temperature of the chip may be detected by a temperature sensor, compared with an expected temperature during stable operation, and then the heat dissipation module 20 may be controlled according to the comparison result to adjust the temperature of the chip.
In the embodiment of the present application, the heat dissipation module 20 is used for dissipating heat of the chip, for example, the heat dissipation module 20 may include a fan, a refrigerant cooling system, and the like. Specifically, if the temperature of the chip is higher than the desired temperature, the heat dissipation capability of the heat dissipation module is improved to reduce the temperature of the chip; and if the temperature of the chip is lower than the expected temperature, reducing the heat dissipation capacity of the heat dissipation module to improve the temperature of the chip so that the temperature of the chip gradually approaches the expected temperature during stable operation. The control method of the heat dissipation capability of the heat dissipation module is not particularly limited, and an appropriate method may be adopted.
In some embodiments, the heat dissipation module 20 includes a heat dissipation fan, and the control module 30 is specifically configured to increase the rotation speed of the heat dissipation fan to decrease the temperature of the chip when the temperature of the chip is higher than a desired temperature, or decrease the rotation speed of the heat dissipation fan when the temperature of the chip is lower than the desired temperature, when the temperature of the chip is lower than the desired temperature. For example, to a certain rotational speed value or zero, to reduce the heat dissipation of the chip, so that the temperature of the chip gradually approaches the desired temperature.
In an embodiment, the first power-on is equivalent to preheating the chip, specifically, the chip of the digital certificate processing apparatus is a chip that completes a calculation task, and power-on at an inappropriate ambient temperature is poor in stability, which may cause a calculation error, so that, when the first power-on is performed, the control module 30 may allocate any one calculation task to the chip in response to the first power-on signal when the ambient temperature is lower than an expected temperature, so that the heat productivity of the chip is very considerable, and the requirement for preheating the chip can be completely met. And then, the temperature of the chip reaches the expected temperature, the chip is controlled to be powered off firstly, the chip is controlled to be powered on for the second time at the current environment temperature, and the chip keeps stable work after being powered on, so that the purpose of powering on at the expected temperature is achieved, and a foundation is provided for stable operation of the chip.
Further, since the temperature of the chip is adjusted by the heat dissipation module 20, there is a certain degree of hysteresis in the change of the temperature of the chip, in some embodiments, the detection module 10 may detect the temperature of the chip periodically, for example, once every preset time, so as to detect accurate temperature data and reduce the data processing amount.
In some embodiments, as shown in fig. 3, the apparatus 100 of the embodiment of the present application further includes a clearing module 40, and the clearing module 40 is configured to clear the operating state information of the chip after the chip is powered down. Specifically, because the chip is controlled to be powered on for the first time under the current environment temperature, the temperature of the chip reaches the expected temperature, which is equivalent to the preheating stage, the chip is unstable in operation, whether the calculation result is correct at this time and does not need to be collected and used, the chip is controlled to be powered off when the temperature of the chip reaches the expected temperature, the working state information of the chip is cleared by the clearing module 40, the chip is restored to the initial state, the chip is controlled to be powered on for the second time under the expected temperature, the chip is stable in operation at this time, the calculation data is accurate, and collection and use can be relieved.
In summary, the device 100 for controlling chip power-on in the embodiment of the present application does not need to use an external heat source at ambient temperature, is low in cost, combines the chip self-heating and controls the heat dissipation capability of the heat dissipation module 20 to preheat the chip, and compared with only dissipating heat through the heat dissipation module, the chip temperature is more easily stabilized at the desired temperature, and after the temperature of the chip reaches the desired temperature, the control chip powers off, and the control chip powers on for the second time at the desired temperature, so that the operation of the chip is more stable.
A digital certificate processing apparatus according to an embodiment of the third aspect of the present application is described below with reference to the drawings.
Fig. 4 is a block diagram of a digital certificate processing apparatus according to an embodiment of the present application, and as shown in fig. 4, a digital certificate processing apparatus 1000 of the embodiment of the present application includes the device 100 for powering on a control chip of the above embodiment and a computing board 200, where the computing board 200 includes a plurality of chips 201, and the device 100 for powering on a control chip of the above embodiment is used to control the chip 201 on the computing board 200 to power on, so that the computing board 200 operates more stably. The specific structure and control process of the device 100 for controlling the power-on of the chip can refer to the description of the above embodiments.
The digital certificate processing apparatus 1000 according to the embodiment of the present application may enable the chip on the computing board 200 to operate more stably by using the device 100 for controlling the chip to power on according to the above embodiment.
A digital certificate processing apparatus according to an embodiment of a fourth aspect of the present application is described below with reference to the accompanying drawings.
Fig. 5 is a block diagram of a digital voucher processing device according to an embodiment of the present application, as shown in fig. 5, a digital voucher processing device 1000 of an embodiment of the present application comprises at least one processor 300, a memory 400 communicatively coupled to the at least one processor 300; the memory 400 stores instructions executable by the at least one processor 300, and the instructions, when executed by the at least one processor 300, cause the at least one processor 300 to perform the method for controlling power-on of a chip according to the above embodiments.
In some embodiments, the digital certificate processing apparatus 1000 performs data processing related to digital certificates, and the digital certificates can be obtained through the data processing, and further, when the digital certificates are related to digital currency or are embodied as digital currency, the digital certificate processing apparatus 1000 according to the embodiments of the present application may be a digital currency mining machine, and the digital currency may be encrypted currency such as bitcoin.
The computer-readable storage medium of the fifth aspect of the embodiments of the present application stores computer-executable instructions configured to perform the method for controlling power on of a chip of the above embodiments.
The computer program product of the embodiment of the present application includes a computer program stored on a computer-readable storage medium, where the computer program includes program instructions, and when the program instructions are executed by a computer, the computer executes the method for powering on a control chip of the above embodiment.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing steps of a custom logic function or process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
The logic and/or steps represented in the flowcharts or otherwise described herein, e.g., an ordered listing of executable instructions that can be considered to implement logical functions, can be embodied in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, processor-containing system, or other system that can fetch the instructions from the instruction execution system, apparatus, or device and execute the instructions. For the purposes of this description, a "computer-readable medium" can be any means that can contain, store, communicate, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium would include the following: an electrical connection (electronic device) having one or more wires, a portable computer diskette (magnetic device), a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium could even be paper or another suitable medium upon which the program is printed, as the program can be electronically captured, via for instance optical scanning of the paper or other medium, then compiled, interpreted or otherwise processed in a suitable manner if necessary, and then stored in a computer memory.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. If implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc. Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (12)
1. A method for controlling chip power-on, the method comprising:
controlling the chip to be powered on for the first time;
detecting the temperature of the chip, and controlling a heat dissipation module according to the temperature of the chip so as to adjust the temperature of the chip;
controlling the chip to be powered off when the temperature of the chip reaches a desired temperature;
and controlling the chip to be powered on for the second time.
2. The method for controlling power-on of a chip according to claim 1, wherein the heat dissipation module comprises a heat dissipation fan, and the controlling the heat dissipation module according to the temperature of the chip comprises:
the temperature of the chip is higher than the expected temperature, and the rotating speed of the heat dissipation fan is increased;
or, the temperature of the chip is lower than the expected temperature, and the rotating speed of the heat radiation fan is reduced.
3. The method for controlling chip power-on according to claim 1, further comprising: when the ambient temperature is lower than the expected temperature, responding to a first power-on signal of the chip, and allocating any one calculation task to the chip.
4. The method of claim 1, wherein after the controlling the chip to power down, the method further comprises: and clearing the working state information of the chip.
5. An apparatus for controlling power-on of a chip, the apparatus comprising:
the detection module is used for detecting the temperature of the chip;
a heat dissipation module;
the control module is configured to control the chip to be powered on for the first time, control the heat dissipation module according to the temperature of the chip so as to adjust the temperature of the chip, control the chip to be powered off when the temperature of the chip reaches an expected temperature, and control the chip to be powered on for the second time.
6. The device for controlling chip power-on according to claim 5, wherein the heat dissipation module includes a heat dissipation fan, and the control module is specifically configured to increase the rotation speed of the heat dissipation fan when the temperature of the chip is higher than the desired temperature, or decrease the rotation speed of the heat dissipation fan when the temperature of the chip is lower than the desired temperature, when the temperature of the chip is lower than the desired temperature.
7. The device for controlling chip power-on according to claim 5, wherein the control module is further configured to assign any one of the computing tasks to the chip in response to a first power-on signal of the chip when an ambient temperature is lower than the desired temperature.
8. The device for controlling power on of a chip according to claim 5, further comprising a clearing module configured to clear the operating status information of the chip after the chip is powered off.
9. A digital credential processing device, the digital credential processing device comprising:
a force computation board comprising a plurality of chips; and
an apparatus for controlling powering on of a chip as claimed in any one of claims 5 to 8.
10. A digital credential processing device, the digital credential processing device comprising:
at least one processor; and
a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,
the memory stores instructions executable by the at least one processor, the instructions, when executed by the at least one processor, causing the at least one processor to perform the method of controlling power-up of a chip according to any one of claims 1-4.
11. A computer-readable storage medium storing computer-executable instructions configured to perform the method of powering up the control chip of any one of claims 1-4.
12. A computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform the method of controlling power-on of a chip as claimed in any one of claims 1 to 4.
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| CN201910217716.XA CN111722688A (en) | 2019-03-21 | 2019-03-21 | Method, device and equipment for controlling chip power-on, medium and program product |
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