CN111722093A - Probe card testing device - Google Patents
Probe card testing device Download PDFInfo
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- CN111722093A CN111722093A CN201910203533.2A CN201910203533A CN111722093A CN 111722093 A CN111722093 A CN 111722093A CN 201910203533 A CN201910203533 A CN 201910203533A CN 111722093 A CN111722093 A CN 111722093A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2829—Testing of circuits in sensor or actuator systems
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- Electromagnetism (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Toxicology (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe card testing device, which comprises a testing circuit board, a signal adapter plate and a probe head. The test circuit board comprises a first light-transmitting part positioned in a wafer test area and a plurality of metal pads positioned in a signal pressing area. The signal transfer board comprises a second light-transmitting part positioned in the wafer testing area. The top surface of the signal adapter plate is provided with a plurality of external connection pads which are positioned in the wafer test area and arranged along the periphery of the second light transmission part. The bottom surface of the signal adapter plate is provided with a plurality of connecting pads positioned in a signal pressing area. The positioning seat body of the probe head comprises a third light-transmitting part positioned in the wafer testing area. A plurality of conductive probes of the probe head are arranged on the positioning base body in a penetrating mode and are arranged along the periphery of the third light-transmitting portion. One end of each conductive probe penetrates through the positioning base body and is respectively abutted against the external connecting pads. Therefore, the needle implanting operation time of the conductive probe can be greatly reduced, and the maintenance difficulty of the probe card testing device can be greatly reduced.
Description
Technical Field
The present invention relates to a probe card testing apparatus, and more particularly, to a probe card testing apparatus suitable for testing peripheral chips.
Background
Because the CMOS image sensors are all peripheral chips, a Cantilever Probe Card (Cantilever Probe Card) is generally used for testing, however, the Probe Card needs to connect signals by pulling wire bonding pins manually, the wire-bonding operation time is long, and the difficulty of the wire-bonding operation and the maintenance operation is greatly increased in the case of multi-die testing. Another test method is to use a micro-electromechanical Probe Card (MEMS Probe Card) for testing, however, the limitation of this Probe Card is that a ceramic substrate is necessary, and the structure of this Probe Card is not easy to maintain, for example: when the probe is damaged, in maintenance, a new probe must be welded in addition to the probe which must be detached, and the manual operation is not easy to be completed because of the dependence on equipment.
The present inventors have considered that the above-mentioned drawbacks can be improved, and have made intensive studies and use of scientific principles, and finally have proposed the present invention which is designed reasonably and effectively to improve the above-mentioned drawbacks.
Disclosure of Invention
The present invention is directed to a probe card testing apparatus, which is provided to overcome the shortcomings of the prior art.
The embodiment of the invention discloses a probe card testing device, which is defined with a wafer testing area and a signal pressing area positioned at the periphery of the wafer testing area, and comprises: a test circuit board, a signal adapter board and a probe head. The test circuit board comprises a first light-transmitting part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area; the signal adapter plate is provided with a top surface and a bottom surface which are positioned on opposite sides, the bottom surface of the signal adapter plate faces the test circuit board, the signal adapter plate comprises a second light-transmitting part which is positioned in the wafer test area, the top surface of the signal adapter plate is provided with a plurality of external connection pads, and the bottom surface of the signal adapter plate is provided with a plurality of connection pads; the plurality of external pads are positioned in the wafer test area and arranged along the periphery of the second light transmission part, and the plurality of connecting pads are positioned in the signal pressing area and are respectively and electrically coupled with the plurality of external pads and the plurality of metal pads of the test circuit board; the probe head sets up in the top surface top of signal keysets to the probe head includes: the positioning base comprises a third light-transmitting part positioned in the wafer testing area; a plurality of conductive probes are arranged on the positioning base body in a penetrating mode and are arranged along the periphery of the third light-transmitting part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested; the probe card testing device can be used for receiving a light ray, enabling the light ray to sequentially penetrate through the first light-transmitting part, the second light-transmitting part and the third light-transmitting part and then irradiate the object to be tested so as to generate a photoelectric sensing signal.
Preferably, at least one of the conductive probes is capable of receiving the photo-sensing signal and transmitting the photo-sensing signal to the test circuit board through the corresponding external pad, the corresponding connection pad, and the corresponding metal pad.
Preferably, a length of said one end of each of said conductive probes is substantially perpendicular to said top surface of said signal patch panel.
Preferably, the middle part of the third light-transmitting part of the positioning base body of the probe head is not provided with any conductive probe.
Preferably, the signal adapting board is provided with a plurality of adapting pads and a plurality of outer layer circuits on the top surface, the plurality of adapting pads are located in the signal pressing region, the plurality of outer layer circuits are arranged across the wafer testing region and the signal pressing region, and the plurality of external pads are electrically connected to the plurality of adapting pads through the plurality of outer layer circuits respectively.
Preferably, the probe card testing apparatus further includes an electrical connection module clamped between the test circuit board and the signal adapter board, and the electrical connection module includes: the spacer plate comprises a fourth light-transmitting part positioned in the wafer test area and a plurality of through holes positioned in the signal pressing area; the plurality of vertical conductive structures are respectively arranged in the plurality of through holes of the spacing plate; the fourth light transmission part is positioned on a light transmission path formed by the first light transmission part, the second light transmission part and the third light transmission part, and the connecting pads of the signal adapter plate are electrically connected with the metal pads of the test circuit board through the vertical conductive structures respectively to form an electric transmission path.
Preferably, the probe card testing apparatus further includes a pressing structure, the pressing structure including: the pressing plate is arranged on the top surface of the signal adapter plate and comprises a screw hole positioned in the signal pressing area; the screw penetrates through the screw hole of the pressing plate so as to fix the pressing plate on the signal transfer plate.
Preferably, the screw further penetrates through the signal adapter plate, the electrical connection module and the test circuit board along a thickness direction of the signal adapter plate, so that the pressing plate presses the signal adapter plate, the electrical connection module and the test circuit board, and two ends of the plurality of vertical conductive structures respectively abut against the plurality of connection pads and the plurality of metal pads; wherein any electrical transmission path between the test circuit board and the signal patch panel is not realized with a solder material.
Preferably, the signal adapter plate is further provided with a solder mask layer on the top surface thereof, and the solder mask layer covers the plurality of adapter pads.
The embodiment of the invention also discloses a probe card testing device, which is defined with a wafer testing area and a signal pressing area positioned at the periphery of the wafer testing area, and the probe card testing device comprises: a test circuit board, a signal adapter board and a probe head. The test circuit board comprises a first blank part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area; the signal adapter plate is provided with a top surface and a bottom surface which are positioned on opposite sides, the bottom surface of the signal adapter plate faces the test circuit board, the signal adapter plate comprises a second blank part positioned in the wafer test area, the top surface of the signal adapter plate is provided with a plurality of external connection pads, and the bottom surface of the signal adapter plate is provided with a plurality of connection pads; the plurality of external pads are positioned in the wafer test area and arranged along the periphery of the second blank part, and the plurality of connection pads are positioned in the signal pressing area, electrically coupled to the plurality of external pads respectively and electrically coupled to the plurality of metal pads of the test circuit board respectively; the probe head sets up in the top surface top of signal keysets to the probe head includes: the positioning base comprises a third blank part positioned in the wafer testing area; a plurality of conductive probes are arranged on the positioning base body in a penetrating mode and are arranged along the periphery of the third blank part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested; wherein a length direction of each conductive probe is substantially perpendicular to the top surface of the signal transfer board, and a middle portion of the third hollow portion of the positioning base body of the probe head is not provided with any conductive probe.
In summary, the probe card testing device disclosed in the embodiments of the present invention can replace the conventional probe card for testing a peripheral chip that requires a manual pull wire to connect signals by designing the first light-transmitting portion of the test circuit board, the second light-transmitting portion of the signal adapter board, and the third light-transmitting portion of the probe head (or the first blank portion, the second blank portion, and the third blank portion), the plurality of external pads arranged along the periphery of the second light-transmitting portion (or the second blank portion) of the signal adapter board, and the plurality of conductive probes arranged along the periphery of the third light-transmitting portion (or the third blank portion) of the probe head, so that the plurality of conductive probes can be directly inserted into the probe card, the insertion time of the conductive probes can be greatly reduced, and the maintenance difficulty of the probe card testing device can be greatly reduced.
For a better understanding of the nature and technical content of the present invention, reference should be made to the following detailed description of the invention and the accompanying drawings, which are provided for illustration purposes only and are not intended to limit the scope of the invention in any way.
Drawings
Fig. 1 is a schematic cross-sectional view of a probe card testing apparatus according to a first embodiment of the present invention.
Fig. 2 is an exploded plan view of fig. 1.
FIG. 3 is a schematic diagram of a plurality of wafer test areas and a plurality of signal pad areas staggered and arranged in a matrix according to a first embodiment of the invention.
FIG. 4 is a schematic diagram of a plurality of wafer test areas within a central region and a plurality of signal pad areas within a peripheral region according to another variation of the present invention.
Fig. 5 is a partial schematic view of a circuit pattern on the top surface of the signal interposer according to the first embodiment of the present invention.
Fig. 6 is a partial schematic view of a circuit pattern on the bottom surface of the signal interposer according to the first embodiment of the invention.
Fig. 7 is a schematic cross-sectional view of a probe card testing apparatus according to a second embodiment of the present invention.
Detailed Description
The embodiments of the present invention disclosed herein are described below with reference to specific embodiments, and those skilled in the art will understand the advantages and effects of the present invention from the disclosure of the present specification. The invention is capable of other and different embodiments and its several details are capable of modification and various other changes, which can be made in various details within the specification and without departing from the spirit and scope of the invention. The drawings of the present invention are for illustrative purposes only and are not intended to be drawn to scale. The following embodiments will further explain the related art of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention.
It will be understood that, although the terms "first," "second," "third," etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are used primarily to distinguish one element from another element or from one signal to another signal. In addition, the term "or" as used herein should be taken to include any one or combination of more of the associated listed items as the case may be.
[ first embodiment ]
Fig. 1 to 6 show a first embodiment of the present invention. As shown in fig. 1 and 2, the present embodiment discloses a probe card testing apparatus 100, and the probe card testing apparatus 100 is particularly suitable for testing a complementary metal oxide semiconductor image sensor (CMOS image sensor), but the invention is not limited thereto. Further, the probe card testing device 100 includes a testing circuit board 1, a signal adapter board 2 disposed above the testing circuit board 1, a probe head 3 disposed above the signal adapter board 2, an electrical connection module 4 disposed between the testing circuit board 1 and the signal adapter board 2, and a pressing structure 5 disposed on the signal adapter board 2 and used for pressing the signal adapter board 2. In the present embodiment, the test circuit board 1, the electrical connection module 4, the signal adapting board 2, the pressing structure 5, and the probe head 3 are sequentially stacked along a thickness direction T, but the invention is not limited thereto.
As shown in fig. 3, in the present embodiment, the probe card testing apparatus 100 defines a plurality of wafer test regions R1 and a plurality of signal pad regions R2, and the plurality of wafer test regions R1 and the plurality of signal pad regions R2 are arranged in a matrix shape and staggered with each other, but the invention is not limited thereto. For example, as shown in fig. 4, in another variation embodiment of the present invention, a plurality of chip test regions R1 are arranged in a matrix and located within a central region RC, and a plurality of signal suppressing regions R2 are located within a peripheral region RE surrounding the central region RC.
It should be noted that, since the probe card testing apparatus 100 has substantially the same structure in the plurality of wafer test regions R1 and the signal pressing region R2 located at the periphery thereof, the following description is given by taking as an example the structure of the probe card testing apparatus 100 in one of the wafer test regions R1 and the signal pressing region R2 located at the periphery thereof, but the present invention is not limited thereto. For example, in an embodiment of the present invention, which is not shown, the probe card testing apparatus 100 may have different configurations in the wafer test region R1 and the signal pressing region R2.
As shown in fig. 1 and 2, the test circuit board 1 is substantially disc-shaped. The test circuit board 1 includes a first transparent portion 101 located in the wafer test region R1, and the test circuit board 1 includes a plurality of metal pads 11 disposed at intervals on a board surface (e.g., a top surface of the test circuit board 1 in fig. 1). The first light-transmitting portion 101 of the test circuit board 1 can be used for providing a light ray to penetrate through. More specifically, in the embodiment, the board surface of the test circuit board 1 is made of opaque insulating material, and the first transparent portion 101 of the test circuit board 1 is a through hole 12 to provide a light penetration, but the invention is not limited thereto. For example, the first transparent portion 101 of the test circuit board 1 may also be an optical lens (e.g., a concave lens or a convex lens) inserted into the through hole 12.
Further, the test circuit board 1 is electrically coupled to a test machine (not shown). That is, the metal pads 11 are electrically coupled to a testing machine, so as to analyze the signal received by the testing circuit board 1 through the testing machine. The electrical coupling between the test circuit board 1 and the test machine can be adjusted according to the design requirement. For example, in other embodiments not shown in the present invention, the test circuit board 1 may also be directly integrated into a test machine.
As shown in fig. 1, 2, 5, and 6, the signal transfer board 2 has a substantially rectangular plate shape. The signal adapting board 2 has a top surface 21 and a bottom surface 22 on opposite sides, and the bottom surface 22 of the signal adapting board 2 faces the test circuit board 1 along the thickness direction T. The signal transfer board 2 includes a second transparent portion 201 located in the wafer test area R1. The signal adapting board 2 is provided with a plurality of external pads 211, a plurality of adapting pads 212, a plurality of outer layer circuits 213 and a solder mask layer 214 on the top surface 21, and the signal adapting board 2 is provided with a plurality of connecting pads 221 on the bottom surface 22. The connecting pads 221 are located in the signal pressing region R2, and are respectively electrically coupled to the external pads 211 and the metal pads 11 of the test circuit board 1. More specifically, a plurality of external pads 211 are located in the wafer test region R1 and are disposed along the periphery of the second transparent portion 201. The plurality of landing pads 212 are located in the signal pressing region R2, the plurality of outer layer circuits 213 are disposed across the wafer test region R1 and the signal pressing region R2, and the plurality of external pads 211 are electrically connected to the plurality of landing pads 212 through the plurality of outer layer circuits 213, respectively (see fig. 1 and 5). Furthermore, the plurality of transfer pads 212 are electrically connected to the plurality of connection pads 221 through a plurality of inner layer circuits 222, respectively. The solder mask layer 214 covers the landing pad 212 to prevent short circuit caused by direct contact between the pressing plate 51 and the landing pad 212 as described below.
The arrangement of the connection pads 221 of the signal adapting board 2 is substantially equal to the arrangement of the metal pads 11 of the test circuit board 1. It should be noted that the connecting pad 221 is illustrated as a circle in the embodiment, but in practical applications, the shape of the connecting pad 221 can be adjusted and varied according to design requirements (e.g., square, rectangular, or irregular).
Furthermore, in the present embodiment, the distance between any two adjacent external pads 211 is preferably smaller than the distance between two corresponding connection pads 221. That is, the signal adapting board 2 includes a FAN-OUT (FAN-OUT) structure in the embodiment, but the invention is not limited thereto.
It should be noted that, in the present embodiment, the substrate material of the signal adapting plate 2 is preferably a transparent glass substrate, so that the second transparent portion 201 of the signal adapting plate 2 can have a transparent property by the design of the transparent glass substrate, but the invention is not limited thereto. For example, in an embodiment not shown in the present invention, the signal interposer 2 may be, for example, a non-transparent substrate, and the second transparent portion 201 of the signal interposer 2 may have a light-transmitting property, for example, by drilling.
In addition, in the present embodiment, although the signal adapting board 2 is exemplified by a circuit board having a double-layer circuit, the invention is not limited thereto. For example, in an embodiment of the present invention not shown, the signal adapting board 2 may also be designed as a multilayer circuit board having four layers of circuits or more than six layers of circuits according to design requirements.
As shown in fig. 1 and 2, the probe head 3 is disposed above the top surface 21 of the signal adapting board 2, and the probe head 3 can be electrically coupled to the test circuit board 1 through the signal adapting board 2. The probe head 3 includes a positioning base 31 and a plurality of conductive probes 32. The positioning base 31 includes a third transparent portion 301 located in the wafer testing region R1. In the present embodiment, the positioning holder 31 is made of a transparent glass substrate, and therefore the third light-transmitting portion 301 of the positioning holder 31 can have a light-transmitting property by the design of the transparent glass substrate, but the present invention is not limited thereto. For example, in an embodiment not shown in the present invention, the positioning seat 31 may be, for example, a non-light-transmitting positioning seat, and the third light-transmitting portion 301 of the positioning seat 31 may also have a light-transmitting property, for example, by digging a hole.
Further, the plurality of conductive probes 32 are disposed through the positioning base 31 and along the periphery of the third light-transmitting portion 301. One end of each of the conductive probes 32 penetrates through the positioning base 31 and abuts against the external pads 211 of the signal adapting board 2, and the other end of each of the conductive probes 32 penetrates through the positioning base 31 and abuts against an object O (e.g., a semiconductor chip) to be tested.
In the present embodiment, a length direction of the one end of each of the conductive probes 32 (e.g., the bottom end portion of the conductive probe 32) is substantially perpendicular to the top surface 21 of the signal adapting board 2. Furthermore, the middle portion of the third light-transmitting portion 301 of the positioning seat 31 of the probe head 3 is not provided with any conductive probe, and the middle portion of the second light-transmitting portion 201 of the signal adapting plate 2 is also not provided with any conductive pad or conductive circuit.
It should be noted that the conductive probe 32 is a flexible strip-shaped structure that can be conducted in the present embodiment, but the conductive probe 32 of the present invention is not limited to a rectangular conductive probe, a circular conductive probe, or other conductive probes.
According to the above configuration, the probe card testing apparatus 100 can be configured to receive a light L, and the light L sequentially penetrates through a light transmission path formed by the first light-transmitting portion 101, the second light-transmitting portion 201, and the third light-transmitting portion 301, and then irradiates the object O to be tested to generate a photoelectric sensing signal.
Then, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive the photo-sensing signal, and transmit the photo-sensing signal to the test circuit board 1 through the corresponding external pad 211, the corresponding external layer circuit 213, the corresponding adapter pad 212, the corresponding internal layer circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11 in sequence, and finally to the test machine to analyze the signal received by the test circuit board 1 through the test machine.
Referring to fig. 1 and fig. 2, the electrical connection module 4 is clamped between the test circuit board 1 and the signal adapting board 2. The electrical connection module 4 includes a spacer 41 and a plurality of vertical conductive structures 42. The spacer 41 includes a fourth transparent portion 401 located in the wafer test area R1 and a plurality of through holes 411 located in the signal pad area R2. The fourth light transmission portion 401 is located on a light transmission path formed by the first light transmission portion 101, the second light transmission portion 201, and the third light transmission portion 301 (and located between the first light transmission portion 101 and the second light transmission portion 201). In the present embodiment, the spacer 41 may be made of a transparent glass substrate, for example, and therefore the fourth transparent portion 401 of the spacer 41 may have a light-transmitting property by the design of the transparent glass substrate, but the present invention is not limited thereto. Furthermore, each of the through holes 411 in the present embodiment penetrates the partition plate 41 along the thickness direction T. The spacing plate 41 is clamped between the test circuit board 1 and the signal adapting board 2, and the plurality of metal pads 11 face the plurality of connection pads 221 through the plurality of through holes 411, respectively. That is, opposite sides of each through hole 411 (e.g., the bottom side and the top side of the through hole 411 in fig. 1) correspond to one of the metal pads 11 and one of the connection pads 221, respectively.
Furthermore, the vertical conductive structures 42 are disposed in the through holes 411 of the spacer 41, and the connecting pads 221 of the signal adapter board 2 can be electrically connected to the metal pads 11 of the test circuit board 1 through the vertical conductive structures 42, respectively, to form an electrical transmission path. In the present embodiment, the plurality of vertical conductive structures 42 may be, for example, a vertical conductive metal paste (e.g., a vertical conductive silver paste), but the invention is not limited thereto. For example, the plurality of vertical conductive structures 42 may also be elastic members such as metal elastic arms.
With reference to fig. 1 and fig. 2, the pressing structure 5 is disposed on the signal adapting board 2 and is used for pressing the signal adapting board 2. The pressing structure 5 includes a pressing plate 51 and a plurality of screws 52. The pressing plate 51 is disposed on the top surface 21 of the signal adapting plate 2. The pressing plate 51 includes a plurality of screw holes 511 located in the signal pressing region R2. The screws 52 respectively penetrate through the screw holes 511 of the pressing plate 51 to fix the pressing plate 51 to the signal adapter plate 2. The screws 52 further penetrate through the signal adapting board 2, the electrical connection module 4, and the test circuit board 1 along the thickness direction T, so that the pressing board 51 can press the signal adapting board 2, the electrical connection module 4, and the test circuit board 1, and two ends of the vertical conductive structures 42 respectively abut against the connection pads 221 and the metal pads 11, thereby improving the electrical connection characteristics between the signal adapting board 2 and the test circuit board 1, and enabling the electrical transmission path between the test circuit board 1 and the signal adapting board 2 to be realized without any soldering material. In addition, in the embodiment, when the screws 52 penetrate through the signal adapting board 2, the electrical connection module 4 and the test circuit board 1, the screws 52 only touch the insulating substrate material, but not touch any conductive pad or conductive circuit. From another perspective, the pressing plate 51 of the pressing structure 5 and the test circuit board 1 can jointly clamp the signal adapting plate 2 and the electrical connection module 4, so that two ends of the vertical conductive structures 42 respectively abut against the connecting pads 221 and the metal pads 11.
[ second embodiment ]
Please refer to fig. 7, which is a second embodiment of the present invention, the present embodiment is similar to the above embodiments, and the same parts of the two embodiments are not repeated herein, but the difference between the present embodiment and the first embodiment is that the present embodiment uses a non-light-transmissive first blank portion 101 ', a second blank portion 201 ', and a third blank portion 301 ' to replace the first light-transmissive portion 101, the second light-transmissive portion 201, and the third light-transmissive portion 301 in the above embodiment, which is described in detail below.
The present embodiment discloses a probe card testing apparatus 100, wherein the probe card testing apparatus 100 is particularly suitable for testing a liquid crystal display driver IC (LCD driver IC) or a memory. The probe card testing apparatus 100 defines a wafer testing region R1 and a signal pressing region R2 located around the wafer testing region R1, and the probe card testing apparatus 100 includes a testing circuit board 1, a signal adapting board 2, and a probe head 3. The test circuit board 1 includes a first margin 101' located in the wafer test region R1 and a plurality of metal pads 11 disposed in the signal pressing region R2.
The signal adapting board 2 has a top surface 21 and a bottom surface 22 on opposite sides. The bottom surface 22 of the signal adapting board 2 faces the test circuit board 1, the signal adapting board 2 includes a second blank portion 201' located in the wafer test region R1, the top surface 21 of the signal adapting board 2 is provided with a plurality of external connection pads 211, and the bottom surface 22 of the signal adapting board 2 is provided with a plurality of connection pads 221. The external pads 211 are located in the wafer test region R1 and are disposed along the periphery of the second blank portion 201', and the connection pads 221 are located in the signal pressing region R2 and are electrically coupled to the external pads 211 and the metal pads 11 of the test circuit board 1, respectively.
The probe head 3 is disposed above the top surface 21 of the signal adapting board 2, and the probe head 3 includes a positioning base 31 and a plurality of conductive probes 32. The positioning base 31 includes a third blank 301' located in the wafer testing region R1. A plurality of conductive probes 32 are disposed through the positioning base 31 and along the periphery of the third blank portion 301'. One end of each of the conductive probes 32 penetrates through the positioning base 31 and abuts against the external pads 211 of the signal adapting board 2, and the other end of each of the conductive probes 32 penetrates through the positioning base 31 and abuts against an object to be tested. Further, a length direction of the one end of each of the conductive probes 32 (e.g., the bottom end portion of the conductive probe 32) is substantially perpendicular to the top surface 21 of the signal transfer board 2, and a middle portion of the third hollow portion 301 'of the positioning base 31 of the probe head 3 is not provided with any conductive probe, and a middle portion of the second hollow portion 201' of the signal transfer board 2 is not provided with any conductive pad or conductive trace.
According to the above configuration, at least one of the conductive probes 32 of the plurality of conductive probes 32 can be used to receive a test signal generated by the object O to be tested, and transmit the test signal to the test circuit board 1 through the corresponding external pad 211, the corresponding external layer circuit 213, the corresponding via pad 212, the corresponding internal layer circuit 222, the corresponding connection pad 221, the corresponding vertical conductive structure 42, and the corresponding metal pad 11 in sequence, and finally transmit the test signal to the test machine to analyze the signal received by the test circuit board 1 through the test machine.
[ advantageous effects of the embodiments ]
In summary, the probe card testing apparatus 100 disclosed in the embodiment of the present invention can replace the conventional probe card for testing a peripheral chip by connecting signals in a manner of manually pulling wire bonding pins through the design of the first light-transmitting portion 101 of the test circuit board 1, the second light-transmitting portion 201 of the signal adapting board 2, and the third light-transmitting portion 301 of the probe head 3 (or the first blank portion 101 ', the second blank portion 201 ', and the third blank portion 301 '), the plurality of external pads 211 arranged along the periphery of the second light-transmitting portion 201 (or the second blank portion 201 ') of the signal adapting board 2, and the plurality of conductive probes 32 arranged along the periphery of the third light-transmitting portion 301 (or the third blank portion 301 ') of the probe head 3, so that the plurality of conductive probes 32 can be directly implanted, thereby greatly reducing the time for implanting the conductive probes 32 and greatly reducing the difficulty of maintaining the probe card testing apparatus 100.
Furthermore, the probe card testing device 100 disclosed in the embodiment of the present invention electrically connects the signal adapter board 2 and the test circuit board 1 through the plurality of vertical conductive structures 42 of the electrical connection module 4, and improves the electrical connection characteristic between the signal adapter board 2 and the test circuit board 1 through the pressing structure 5 without using a soldering method, so that the probe card testing device 100 can effectively avoid damage caused by thermal shock.
In addition, since the substrate material of the signal transfer plate 2 in the embodiment of the present invention is a transparent glass substrate, the second light-transmitting portion 201 of the signal transfer plate 2 may have a light-transmitting property by the design of the transparent glass substrate, and therefore, the signal transfer plate 2 in the embodiment of the present invention may not need a notch to perform light guiding, thereby facilitating the application of the test of the smaller-sized die and the larger area. Furthermore, the positioning base 31 of the probe head 3 according to the embodiment of the present invention may also be made of a transparent glass substrate, so that the third light-transmitting portion 301 of the positioning base 31 may have a light-transmitting property by the design of the transparent glass substrate.
The disclosure is only a preferred embodiment of the invention and should not be taken as limiting the scope of the invention, which is defined by the appended claims.
Claims (10)
1. A probe card testing apparatus, wherein the probe card testing apparatus defines a wafer testing area and a signal pressing area located at the periphery of the wafer testing area, and the probe card testing apparatus comprises:
the test circuit board comprises a first light transmission part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area;
a signal adapter plate having a top surface and a bottom surface on opposite sides, the bottom surface of the signal adapter plate facing the test circuit board, the signal adapter plate including a second light-transmitting portion located in the wafer test area, the signal adapter plate having a plurality of external pads on the top surface and a plurality of connection pads on the bottom surface; the plurality of external pads are positioned in the wafer test area and arranged along the periphery of the second light transmission part, and the plurality of connecting pads are positioned in the signal pressing area and are respectively and electrically coupled with the plurality of external pads and the plurality of metal pads of the test circuit board; and
a probe head disposed above the top surface of the signal adapter plate, the probe head comprising:
a positioning base body, which comprises a third light-transmitting part positioned in the wafer testing area; and
the plurality of conductive probes penetrate through the positioning base body and are arranged along the periphery of the third light-transmitting part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested;
the probe card testing device can be used for receiving a light ray, enabling the light ray to sequentially penetrate through the first light-transmitting part, the second light-transmitting part and the third light-transmitting part and then irradiate the object to be tested so as to generate a photoelectric sensing signal.
2. The probe card testing apparatus of claim 1, wherein at least one of the conductive probes is capable of receiving the photo sensing signal and transmitting the photo sensing signal to the test circuit board through the corresponding external pads, the corresponding connecting pads, and the corresponding metal pads.
3. The probe card testing apparatus of claim 1, wherein a length of said one end of each of said electrically conductive probes is perpendicular to said top surface of said signal interposer.
4. The probe card testing apparatus of claim 1, wherein a middle portion of the third light-transmitting portion of the positioning base body of the probe head is not provided with any conductive probe.
5. The probe card testing device of claim 1, wherein the signal interposer has a plurality of interposer pads and a plurality of outer layer traces disposed on the top surface, the interposer pads are disposed in the signal pressing region, the outer layer traces are disposed across the chip testing region and the signal pressing region, and the outer pads are electrically connected to the interposer pads through the outer layer traces, respectively.
6. The probe card testing apparatus of claim 1, further comprising an electrical connection module sandwiched between the test circuit board and the signal interposer, the electrical connection module comprising:
the spacing plate comprises a fourth light-transmitting part positioned in the wafer testing area and a plurality of through holes positioned in the signal pressing area; and
the vertical conductive structures are respectively arranged in the through holes of the spacing plate;
the fourth light transmission part is positioned on a light transmission path formed by the first light transmission part, the second light transmission part and the third light transmission part, and the connecting pads of the signal adapter plate are electrically connected with the metal pads of the test circuit board through the vertical conductive structures respectively to form an electric transmission path.
7. The probe card testing apparatus of claim 6, further comprising a hold down structure, the hold down structure comprising:
the pressing plate is arranged on the top surface of the signal adapter plate and comprises a screw hole positioned in the signal pressing area; and
and the screw penetrates through the screw hole of the pressing plate so as to fix the pressing plate on the signal adapter plate.
8. The probe card testing apparatus of claim 7, wherein the screws further penetrate the signal interposer, the electrical connection module, and the test circuit board along a thickness direction of the signal interposer, such that the pressing plate presses the signal interposer, the electrical connection module, and the test circuit board, and such that two ends of the vertical conductive structures are respectively pressed against the connection pads and the metal pads; wherein any electrical transmission path between the test circuit board and the signal patch panel is not realized with a solder material.
9. The probe card testing device of claim 1, wherein the signal interposer further has a solder mask layer on a top surface thereof, and the solder mask layer covers the plurality of bonding pads.
10. A probe card testing apparatus, wherein the probe card testing apparatus defines a wafer testing area and a signal pressing area located at the periphery of the wafer testing area, and the probe card testing apparatus comprises:
the test circuit board comprises a first blank part positioned in the wafer test area and a plurality of metal pads arranged in the signal pressing area;
the signal adapter plate is provided with a top surface and a bottom surface which are positioned on the opposite sides, the bottom surface of the signal adapter plate faces the test circuit board, the signal adapter plate comprises a second blank part positioned in the wafer test area, the top surface of the signal adapter plate is provided with a plurality of external connection pads, and the bottom surface of the signal adapter plate is provided with a plurality of connection pads; the plurality of external pads are positioned in the chip test area and arranged along the periphery of the second blank part, and the plurality of connecting pads are positioned in the signal pressing area and are respectively and electrically coupled with the plurality of external pads and the plurality of metal pads of the test circuit board; and
a probe head disposed above the top surface of the signal adapter plate, the probe head comprising:
a positioning base body, which comprises a third blank part positioned in the wafer testing area; and
a plurality of conductive probes which are arranged on the positioning base in a penetrating way and are arranged along the periphery of the third blank part; one end of each of the plurality of conductive probes penetrates through the positioning base body and is respectively abutted against the plurality of external connecting pads of the signal adapter plate, and the other end of each of the plurality of conductive probes penetrates through the positioning base body and is used for abutting against an object to be tested;
wherein a length direction of each conductive probe is perpendicular to the top surface of the signal transfer board, and no conductive probe is arranged at a middle part of the third blank part of the positioning seat body of the probe head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910203533.2A CN111722093A (en) | 2019-03-18 | 2019-03-18 | Probe card testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910203533.2A CN111722093A (en) | 2019-03-18 | 2019-03-18 | Probe card testing device |
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| Publication Number | Publication Date |
|---|---|
| CN111722093A true CN111722093A (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910203533.2A Pending CN111722093A (en) | 2019-03-18 | 2019-03-18 | Probe card testing device |
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Cited By (1)
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| CN112305394A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
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| TW200949256A (en) * | 2008-05-19 | 2009-12-01 | Probeleader Co Ltd | Probe card for testing image sensing chips |
| CN101923105A (en) * | 2009-06-16 | 2010-12-22 | 励威电子股份有限公司 | Probe card used for testing image sense chip |
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| CN112305394A (en) * | 2020-11-06 | 2021-02-02 | 法特迪精密科技（苏州）有限公司 | Probe socket piece and probe assembly |
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