CN111595315B - T-shaped push-pull flow micromechanical double-shaft film gyroscope - Google Patents
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/58—Turn-sensitive devices without moving masses
Abstract
The invention discloses a T-shaped push-pull flow micromechanical double-shaft film gyroscope, which comprises a sensitive layer and a cover plate, wherein the upper surface of the sensitive layer is provided with three pairs of heaters and two pairs of thermistors which are in a T-shaped structure, and the lower surface of the sensitive layer is etched with a T-shaped groove; the three pairs of heaters are electrified in a periodic push-pull type; the cover plate is etched with a groove and is connected with the upper surface of the sensitive layer in a sealing way. The invention inherits the advantages of no solid sensitive mass block, vibration resistance, impact resistance and the like of the miniature heat flow gyroscope. The process adopted by the invention is compatible with the integrated circuit process, so that the driving circuit and the extracting circuit can be easily manufactured on the same chip, and the potential of high integration level is realized. As the sensitive mass does not contain solid mass blocks, compared with the miniature inertial sensor of other working principles, the sensor has the advantages of large impact resistance, simple structure, extremely low cost and high reliability.
Description
Technical Field
The invention relates to the technical field of detecting angular velocity attitude parameters of a moving body by utilizing a Golgi force deflection heat flow sensitive body, in particular to a T-shaped push-pull flow micromechanical double-shaft film gyroscope.
Background
The Micro inertial sensor manufactured by Micro-Electro-Mechanical-System (MEMS) technology has the advantages of mass production, low cost, small volume, low power consumption and the like, and is an ideal product of the Micro inertial sensor with medium and low precision in the future. The gyroscope and the accelerometer are core inertial sensors for measuring and controlling the motion gesture of the carrier, and the gyroscope is a sensor for sensing angular velocity, angular acceleration and other parameters. The traditional miniature gyroscope (micromechanical gyroscope) is a miniature rate gyroscope combining microelectronics and micromechanics based on the Golgi effect principle existing when a high-frequency vibration mass is driven to rotate by a base. The solid mass in the gyro sensitive element needs to be suspended and vibrated by a mechanical elastomer, is easy to damage under a slightly high acceleration impact, needs to be vacuum packaged for damping reduction, has complex process, and can generate fatigue damage and vibration noise during long-time working. The miniature fluid inertial device is a novel device for measuring input acceleration and angular velocity by detecting the flow field offset of fluid in a closed cavity. Since it has no movable parts and suspension system in the conventional micro gyroscope, it can resist high overload; because the sensitive mass is gas and the mass is almost zero, the response time is short and the service life is long; the structure is simple, and the application requirement of low cost can be met. The micro fluid gyroscope is an angular velocity sensor which uses an airflow sensitive body in a closed cavity to deflect under the action of a coriolis force, and uses a thermistor (hot wire) to sense angular velocity to cause deflection. At present, the requirements of the market on the capability of the miniature inertial gyroscope to adapt to severe and harsh environments are higher and higher, and compared with the traditional micromechanical vibration gyroscope, the miniature fluid gyroscope has the advantages of extremely high vibration resistance, impact property, low cost and the like, has higher market competitiveness and has very wide application prospect.
Micro-fluidic gyroscopes currently based on MEMS technology can be broadly divided into four general categories, namely micro-fluidic gyroscopes, ECF (electro-fluidic fluid) fluidic gyroscopes, micro-thermal convective gyroscopes and micro-thermal fluidic gyroscopes. Chinese patent: a miniature four-channel circulation flow type triaxial silicon jet gyro (patent application number: 201510385582.4) belongs to a miniature jet gyro, and piezoelectric sheets in sensitive elements of the miniature jet gyro increase processing difficulty and cost, and the volume of the miniature four-channel circulation flow type triaxial silicon jet gyro is difficult to further reduce on the premise of keeping flow velocity. The ECF fluid gyroscope has a large volume (40 mm×60mm×7 mm), and the liquid needs to be sprayed up to a voltage of kilovolts, so that the ECF gyroscope is difficult to realize commercialization in a large scale at low cost. The micro heat convection gyro cannot work without a gravity field, and has low sensitivity. The above described microfluidic gyroscopes have made them a difficult choice for low cost commercial micro gyroscopes due to their inherent shortcomings. The micro heat flow gyroscope (also called thermal expansion gyroscope) is a relatively new micro fluid gyroscope which is proposed in recent years, a piezoelectric plate is not needed in a sensitive element, the micro heat flow gyroscope can be used in a gravity-free environment without high voltage, the sensitivity is moderate, and the micro heat flow gyroscope is between the micro jet gyroscope and the micro heat convection gyroscope, and meanwhile, the micro heat flow gyroscope has the advantages of very simple structure and processing technology, extremely low cost, high reliability and excellent vibration and impact resistance.
The sensitive working principle of the miniature heat flow gyroscope is that a heater is used for electrifying to generate Joule heat, gas around the heater is heated to form gas heat diffusion, a gas flow sensitive body moving along a certain direction is generated, when angular velocity is input, the gas flow sensitive body deflects under the action of Golgi force to cause the change of bridge arm resistance (generally composed of thermistors) of a Wheatstone bridge, and thus bridge unbalanced voltage proportional to the input angular velocity is output. In the Chinese patent 201410140298.6 and 201210130318.2, the main components in the sensor sensitive element, namely the heater and the thermistor, are of suspended cantilever structures, and the heater and the thermistor are suspended above the cavity, so that after the cavity is etched to release the structure, the stress can cause the heater and the thermistor to deform or even fracture, the yield is low, and the warp deformation can generate an asymmetric gas flow field under the condition of no angular velocity input, so that an angular velocity detection error is caused. How to overcome the above problems is a technical problem to be solved by those skilled in the art.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a T-shaped push-pull flow micromechanical double-shaft film gyroscope, which aims to solve the technical problems in the prior art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the invention provides a T-shaped push-pull flow micro mechanical double-shaft film gyroscope, which comprises a sensitive layer and a cover plate, wherein,
three pairs of heaters and two pairs of thermistors which are in a T-shaped structure are arranged on the upper surface of the sensitive layer, and a T-shaped groove is etched on the lower surface of the sensitive layer;
defining the directions of two arms of the T-shaped groove as X and Y directions respectively, and the height direction of the sensitive layer as Z direction; the placement directions of the heater and the thermistor are parallel or perpendicular to the X or Y direction; the thermistors are arranged in pairs and are respectively used for detecting the angular speeds of an X axis and a Y axis;
a pair of thermistors for detecting the X axis are arranged on the left side of the T-shaped structure and are parallel to the X direction and perpendicular to the Y direction; a pair of thermistors for detecting the Y axis are arranged on the right side of the T-shaped structure and are parallel to the Y direction and perpendicular to the X direction;
a pair of heaters are respectively arranged on two sides of the two thermistors for detecting the X axis; the heaters are respectively arranged on two sides of a pair of thermistors for detecting the Y axis;
the three pairs of heaters are electrified in a periodical push-pull type, namely one working period of the heaters comprises pulse voltage excitation time and power-off interval time;
the cover plate is etched with a groove and is connected with the upper surface of the sensitive layer in a sealing way.
As a further technical scheme, each pair of heaters is driven by two square wave signals with the same frequency, the phase difference is 90 degrees, and the pulse duty ratio is 50%.
As a further technical scheme, the outer edge of the T-shaped groove is larger than the outer contours of the upper surface heater and the thermistor.
As a further technical scheme, the height of the T-shaped groove is 2/3 to 3/4 of the height of the whole sensitive layer.
As a further technical scheme, the distance from the upper surface of the sensitive layer to the top of the groove on the cover plate is the height of the working cavity of the gas medium, and the height is 200-1000 mu m.
As a further technical solution, the heater and the thermistor on the upper surface of the sensitive layer have a height of 15 μm to 20 μm.
As a further technical scheme, the lengths of the heater and the thermistor are consistent, and are 1/6 to 1/5 of the width of the whole sensitive layer.
As a further technical scheme, the heaters are all made of TaN material resistance wires with high temperature coefficients.
As a further technical scheme, the thermistors are all composed of n-type heavily doped GaAs material resistor wires.
By adopting the technical scheme, the invention has the following beneficial effects:
1. the gyro sensitive element has the advantages of no cantilever structure, simple process, high yield of sensitive elements, mass production and low cost.
2. The gas is used as sensitive quality, and has high impact resistance and long service life.
3. The structure of the piezoelectric pump is not used, and the gyro structure is smaller in size, simple in structure and low in implementation difficulty.
4. The novel T-shaped groove is added on the lower surface of the sensitive layer, so that the thickness of the sensitive layer main body is very thin, and the sensitive layer is of a silicon film structure, thereby being beneficial to heat diffusion of working heat flow in a sealed cavity.
5. The heater and the thermistor are realized on one chip, and the same structure ensures that the resistance of the resistance wire has small discrete degree, and temperature drift caused by different temperature coefficients can not be caused in one temperature field.
6. The simultaneous detection of the angular velocity of the shaft of the space X, Y can be realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will briefly explain the drawings needed in the embodiments or the prior art, and it is obvious that the drawings in the following description are some embodiments of the present invention and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic three-dimensional structure of a sensitive layer according to an embodiment of the present invention;
FIG. 2 is a schematic three-dimensional structure of a cover plate according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a T-shaped groove structure on the lower surface of a sensitive layer according to an embodiment of the present invention;
FIG. 4 is a top view of a sensitive layer provided by an embodiment of the present invention;
FIG. 5 is a cross-sectional view taken along A-A of FIG. 4;
FIG. 6 is a schematic diagram of a heater according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a thermistor according to an embodiment of the present invention;
FIG. 8 is a flow chart of a preparation process of the T-shaped push-pull flow micro-mechanical double-shaft film gyroscope provided by the embodiment of the invention;
icon: the high-temperature-resistant high-voltage power supply comprises a 1-sensitive layer, a 2-cover plate, a 3-T-shaped groove, a 4-heater, a 5-heater, a 6-heater, a 7-heater, an 8-heater, a 9-heater, a 10-thermistor, an 11-thermistor, a 12-thermistor, a 13-thermistor, a 14-TaN material resistor block, a 15-TaN material resistor block, a 16-n type heavily doped GaAs material resistor block and a 17-n type heavily doped GaAs material resistor block.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
Referring to fig. 1-5, the embodiment provides a T-shaped push-pull flow micromechanical biaxial film gyroscope, comprising a sensitive layer 1 and a cover plate 2, wherein,
three pairs of heaters and two pairs of thermistors which are in a T-shaped structure are arranged on the upper surface of the sensitive layer 1, and a T-shaped groove 3 is etched on the lower surface of the sensitive layer 1;
defining the directions of two arms of the T-shaped groove as X and Y directions respectively, and the height direction of the sensitive layer as Z direction; the placement directions of the heater and the thermistor are parallel or perpendicular to the X or Y direction; the thermistors are arranged in pairs and are respectively used for detecting the angular speeds of an X axis and a Y axis;
the thermistor 10 and the thermistor 11 for detecting the X axis are arranged on the left side of the T-shaped structure and are parallel to the X direction and perpendicular to the Y direction; the thermistor 12 and the thermistor 13 for detecting the Y axis are arranged on the right side of the T-shaped structure and are parallel to the Y direction and perpendicular to the X direction;
a pair of heaters, namely a heater 4, a heater 5, a heater 6 and a heater 7 are respectively arranged on two sides of the two thermistors for detecting the X axis; the two sides of a pair of thermistors for detecting the Y axis are respectively provided with a heater, namely a heater 8 and a heater 9;
the three pairs of heaters are electrified in a periodical push-pull type, namely one working period of the heaters comprises pulse voltage excitation time and power-off interval time;
the energizing mode of the thermistor is constant current;
the cover plate 2 is etched with a groove and is connected with the upper surface of the sensitive layer 1 in a sealing way.
In this embodiment, as a further technical solution, each pair of heaters is driven by two square wave signals with the same frequency, the phase difference is 90 degrees, and the pulse duty ratio is 50%. The heater is alternately electrified to generate Joule heat, release heat to surrounding gas, and perform heat diffusion to form heat flow. The square wave signal acting on the heaters heats alternately, thus creating a push-pull heat flow between each pair of heaters. The push-pull type heat flow has the advantages of high flow speed, stable air flow state, high gyro sensitivity and good stability. The square wave signal drives the heater to work in two stages, and in the first stage, the heaters 4, 6 and 8 heat, and the heaters 5, 7 and 9 are not electrified, so that three hot air flows in the directions orthogonal to the heaters 4, 6 and 8 are generated. In the second stage, the heaters 5, 7, 9 are energized and heated, and the heaters 4, 6, 8 are not energized, producing three hot gas streams in a direction orthogonal to the direction of the heaters 5, 7, 9 and opposite to the direction of the first stage. The continuous operation of the heater in both stages will constitute a push-pull hot gas flow. The working principle of the two-axis heat flow gyroscope is described by taking the first stage as an example. If the angular velocity Ω X is input in the X-axis direction, the heat flow between the heaters 4, 5 and the heat flow between the heaters 6, 7 reach the two opposite parallel thermistors 10 and 11 in opposite directions in the ZOY plane due to the coriolis force principle, and opposite heating effects are formed on the planes formed by the thermistors, and a temperature difference proportional to the input angular velocity Ω X is generated in the two opposite parallel thermistors 10 and 11. If the sensitive angular velocity qy is input in the Y-axis direction, the heat flow between the heaters 8, 9 is deflected in the ZOX plane due to the coriolis force principle, and the thermistors 12 and 13 arranged in the front-to-back order at different positions between the heaters 8, 9 are heated in opposite directions, and the temperature difference proportional to the input angular velocity qy is generated between the two parallel thermistors 12 and 13. The two pairs of thermistors 10 and 11, 12 and 13 are respectively connected into two equal arms of a Wheatstone bridge, the heating of the heater changes the thermistor value, and the change of the resistance value is converted into three voltages Vx and Vy output in direct proportion to the angular velocities omega x and omega y through the Wheatstone bridge, so that the angular velocities in two orthogonal directions (X, Y) are sensitive.
In this embodiment, as a further technical solution, the outer edge of the T-shaped groove 3 is larger than the outer contours of the upper surface heater and the thermistor to form a thin film structure, so as to increase the thermal diffusion of the gas medium in the sealed cavity.
In this embodiment, as a further technical solution, the height of the T-shaped groove 3 is 2/3 to 3/4 of the height of the whole sensitive layer 1.
In this embodiment, as a further technical solution, the distance from the upper surface of the sensitive layer 1 to the top of the groove on the cover plate 2 is the height of the working cavity of the gas medium, and the height is 200 μm to 1000 μm.
In this embodiment, as a further technical solution, the heater and thermistor on the upper surface of the sensitive layer 1 have a height of 15 μm to 20 μm.
In this embodiment, as a further technical solution, the lengths of the heater and the thermistor are consistent, and are 1/6 to 1/5 of the width of the whole sensitive layer.
In this embodiment, as a further technical scheme, the distance between the heater and the thermistor for detecting the angular velocity in the axial direction of X, Y is 1/4 to 1/3 of the length of the heater.
In this embodiment, as a further technical solution, the heaters are all made of resistive wires of TaN material with a high temperature coefficient, as shown in connection with fig. 6-7. The thermistor is composed of n-type heavily doped GaAs material resistor wires. Wherein the heater comprises 2 symmetrical resistive blocks 14, 15 of TaN material. Wherein the resistive block 14 of TaN material consists of 4 series "resistors" each embodied as 4 parallel resistive lines of TaN material with a high temperature coefficient. Through the design of the TaN material resistance wire, the heater can generate more heat, so that the sensitivity of gyro detection is improved. The thermistor comprises 2 symmetrical n-type heavily doped GaAs material resistor blocks 16, 17. The n-type heavily doped GaAs material resistor block 16 is composed of 4 series "resistors" each embodied as 4 parallel n-type heavily doped GaAs material resistor lines. Through the GaAs material resistance wire, the thermistor can obtain larger voltage signal output, so that the sensitivity of gyro detection is improved.
Referring to fig. 8, the disclosed T-shaped push-pull flow micromechanical biaxial film gyroscope can be prepared by GaAs-MMIC technology, and the specific process flow is as follows:
step (a): preparation of doping Density 10 on GaAs wafer 18 cm -3 N of (2) + And (5) etching the GaAs epitaxial layer to form the thermistor.
Step (b): a TaN (tantalum nitride) layer is sputtered as a heater (heating resistor).
Step (c): respectively sputtering Ti/Au/Ti, and photoetching to formThick pads and bond wires.
Step (d): preparation by Plasma Enhanced Chemical Vapor Deposition (PECVD) technologyThick Si 3 N 4 As a separation layer.
Step (e): a gold layer 2 μm thick was electroplated on the second layer.
Step (f): and etching the back surface to form a substrate MEMS film, wherein the thickness of the MEMS film is approximately 20 mu m.
In summary, the invention inherits the advantages of no solid sensitive mass block, vibration resistance, impact resistance and the like of the miniature heat flow gyroscope, and the gyroscope sensitive element has no cantilever structure, simple process, high yield of sensitive elements, mass production and low cost. The novel T-shaped groove is added on the lower surface of the sensitive layer, so that the thickness of the sensitive layer main body is very thin, and the sensitive layer is of a silicon film structure, thereby being beneficial to heat diffusion of working heat flow in a sealed cavity. The process adopted by the invention is compatible with the integrated circuit process, so that the driving circuit and the extracting circuit can be easily manufactured on the same chip, and the potential of high integration level is realized. As the sensitive mass does not contain solid mass blocks, compared with the miniature inertial sensor of other working principles, the sensor has the advantages of large impact resistance, simple structure, extremely low cost and high reliability.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the invention.
Claims (7)
1. A T-shaped push-pull flow micromechanical double-shaft film gyroscope is characterized by comprising a sensitive layer and a cover plate, wherein,
three pairs of heaters and two pairs of thermistors which are in a T-shaped structure are arranged on the upper surface of the sensitive layer, and a T-shaped groove is etched on the lower surface of the sensitive layer;
defining the directions of two arms of the T-shaped groove as X and Y directions respectively, and the height direction of the sensitive layer as Z direction; the placement directions of the heater and the thermistor are parallel or perpendicular to the X or Y direction; the thermistors are arranged in pairs and are respectively used for detecting the angular speeds of an X axis and a Y axis;
a pair of thermistors for detecting the X axis are arranged on the left side of the T-shaped structure and are parallel to the X direction and perpendicular to the Y direction; a pair of thermistors for detecting the Y axis are arranged on the right side of the T-shaped structure and are parallel to the Y direction and perpendicular to the X direction;
a pair of heaters are respectively arranged on two sides of the two thermistors for detecting the X axis; the heaters are respectively arranged on two sides of a pair of thermistors for detecting the Y axis;
the three pairs of heaters are electrified in a periodical push-pull type, namely one working period of the heaters comprises pulse voltage excitation time and power-off interval time;
the cover plate is etched with a groove and is connected with the upper surface of the sensitive layer in a sealing way;
each pair of heaters is driven by two square wave signals with the same frequency, the phase difference is 90 degrees, and the pulse duty ratio is 50%;
the outer edge of the T-shaped groove is larger than the outer contours of the upper surface heater and the thermistor.
2. The T-shaped push-pull stream micromechanical biaxial film gyroscope according to claim 1, characterized in that the height of the T-shaped grooves is 2/3 to 3/4 of the height of the whole sensitive layer.
3. The T-shaped push-pull flow micromechanical biaxial film gyroscope according to claim 1, characterized in that the distance from the upper surface of the sensitive layer to the top of the groove on the cover plate is the height of the working cavity of the gaseous medium, and the height is 200 μm to 1000 μm.
4. The T-shaped push-pull flow micromechanical biaxial film gyroscope according to claim 1, characterized in that the height of the heater and thermistor of the upper surface of the sensitive layer is 15-20 μm.
5. The T-shaped push-pull stream micromechanical biaxial film gyroscope according to claim 1, characterized in that the heater and the thermistor are identical in length, which is 1/6 to 1/5 of the width of the whole sensitive layer.
6. The T-shaped push-pull flow micromechanical biaxial film gyroscope according to claim 1, characterized in that the heaters are each constituted by resistive wires of TaN material with a high temperature coefficient.
7. The T-shaped push-pull flow micromechanical biaxial film gyroscope according to claim 1, characterized in that the thermistors are each composed of an n-type heavily doped GaAs material resistance wire.
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