CN111538178A - Display panel mother board, display module, preparation method of display module and display device - Google Patents
Display panel mother board, display module, preparation method of display module and display device Download PDFInfo
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- CN111538178A CN111538178A CN202010245885.7A CN202010245885A CN111538178A CN 111538178 A CN111538178 A CN 111538178A CN 202010245885 A CN202010245885 A CN 202010245885A CN 111538178 A CN111538178 A CN 111538178A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/36—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Optics & Photonics (AREA)
- Mathematical Physics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract
The invention discloses a display panel mother board, a display panel module, a preparation method of the display panel module and a display device, wherein the display panel mother board is used for being cut to obtain the display panel module with n rows and m columns of sub display panels, the display panel mother board comprises p × q sub display panels arranged in a matrix, and a central sub display panel positioned from a 2 nd row to a p-1 th row comprises a first display area, a first binding area, a second binding area and a first circuit area; the first binding area and the second binding area are arranged on two opposite sides of the first display area; the first circuit area is arranged on any side of the first display area; the first binding region and the second binding region are used for binding a data driving chip and/or a flexible printed circuit board, and the first circuit region is used for arranging a grid driving circuit. Through setting up the two district structures of binding that central sub display panel binds for including first binding area and second, can realize guaranteeing to obtain the display panel module of multiple different structures to the cutting mode of multiple difference of display panel mother board.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a display panel mother board, a display module, a preparation method of the display module and a display device.
Background
In the prior art, a display panel is generally manufactured on a larger display panel mother board, and various display panel modules in different forms are obtained by cutting after the manufacturing is completed, and the display panel modules in different forms can comprise display panels in different quantities and different arrangement modes.
However, in the prior art, the cutting method of the display panel motherboard is fixed, and the setting positions of the binding regions in the corresponding display panels are fixed, so that for one display panel module, after one of the display panels fails to be cut, the whole display panel module needs to be discarded, and the utilization efficiency of the display panel motherboard is reduced.
Disclosure of Invention
In view of this, embodiments of the present invention provide a display panel motherboard, a display panel module, a manufacturing method thereof, and a display device, so as to solve the technical problem of low utilization efficiency of the display panel motherboard in the prior art.
In a first aspect, an embodiment of the present invention provides a display panel mother board, where the display panel mother board is used to be cut to obtain a display panel module having n rows and m columns of sub-display panels, where n is 1 or 2, m is greater than or equal to 1, and m is a positive integer;
the display panel mother board comprises a plurality of sub display panels arranged in a matrix, the matrix comprises p rows and q columns, p is not less than n, q is not less than m, and both p and q are positive integers; the sub-display panel comprises an array substrate, the array substrate comprises a substrate, and the substrate substrates of the sub-display panels are of an integrated structure;
the plurality of sub-display panels positioned in the 2 nd row to the p-1 th row are central sub-display panels, each central sub-display panel comprises a first display area and a first non-display area arranged around the first display area, and each first non-display area comprises a first binding area, a second binding area and a first circuit area; the first binding region and the second binding region are arranged on two opposite sides of the first display region along the column direction of the matrix; the first circuit area is arranged on any side of the first display area along the row direction of the matrix;
the first display area comprises a plurality of first data lines, a plurality of first scanning lines and a plurality of first pixels, and the plurality of first data lines and the plurality of first scanning lines are crossed to define the plurality of first pixels; the first binding area and the second binding area are used for binding a data driving chip and/or a flexible printed circuit board which provide data driving signals for the first data line, and the first circuit area is used for setting a grid driving circuit which provides grid driving signals for the first scanning line.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a display panel module, including:
preparing the display panel mother board according to the first aspect;
and cutting the display panel mother board to obtain the display panel module meeting the preset requirement, wherein the display panel module comprises n rows and m columns of the sub-display panels, n is 1 or 2, m is more than or equal to 1, and m is a positive integer.
In a third aspect, an embodiment of the present invention further provides a display panel module, which is formed by using the preparation method of the display panel module according to the second aspect.
In a fourth aspect, an embodiment of the present invention further provides a display device, including the display panel module according to the third aspect, and a backlight module disposed away from the light exit surface of the display panel module.
According to the display panel mother board, the display panel module, the preparation method of the display panel module and the display device, the plurality of central sub-display panels positioned in the 2 nd row to the p-1 th row of the display panel mother board are arranged to comprise the first binding area, the second binding area and the first circuit area; the first binding area and the second binding area are arranged on two opposite sides of the first display area along the column direction of the matrix; along the row direction of the matrix, the first circuit area is arranged on any side of the first display area. The data driving chip and/or the flexible printed circuit board are/is arranged in the first binding area or the second binding area, so that when the display panel mother board is cut to obtain the display panel module, the display panel module can be cut from one side of the first binding area or one side of the second binding area, the flexible cutting mode of the display panel mother board is ensured, and the display panel modules with different quantities or different arrangement modes can be obtained; moreover, when a certain display panel is damaged, the display panel in the whole display panel module can be prevented from being discarded completely by modifying the cutting position, the utilization efficiency of a mother board of the display panel is improved, and the preparation cost of the display panel module is reduced; furthermore, the display panel mother board provided by the embodiment of the invention can be cut to obtain a plurality of display panel modules, each display panel module comprises one or two rows of sub-display panels, so that it can be ensured that for each display panel module, each sub-display panel in the display panel module has a first binding region or a second binding region which is located at the edge of the display panel module, and thus, a data driving chip and/or a flexible printed circuit board can be bound in the first binding region or the second binding region in the subsequent process, and the sub-display panels can work normally and display normally.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
FIG. 1 is a schematic diagram of a display panel mother board in the prior art;
fig. 2 is a schematic structural diagram of a display panel motherboard according to an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of a region a of the motherboard of the display panel provided in FIG. 2;
FIG. 4 is a cross-sectional view of the mother substrate of the display panel shown in FIG. 2 along the section line A-A';
FIG. 5 is an enlarged schematic view of a region b of the motherboard of the display panel provided in FIG. 2;
FIG. 6 is an enlarged schematic view of a region c of the motherboard of the display panel provided in FIG. 2;
FIG. 7 is a schematic cross-sectional view of the mother substrate of the display panel shown in FIG. 2 along the section line A-A';
fig. 8 is a schematic structural diagram of another display panel motherboard according to an embodiment of the present invention;
FIG. 9 is an enlarged schematic view of a region d of the motherboard of the display panel provided in FIG. 8;
fig. 10 is a schematic flowchart illustrating a method for manufacturing a display panel module according to an embodiment of the invention;
fig. 11 is a schematic flow chart illustrating a manufacturing method of another display panel module according to an embodiment of the invention;
fig. 12 is a schematic structural diagram of a display panel module according to an embodiment of the present invention;
fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be fully described below by way of specific embodiments in conjunction with the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are a part of the embodiments of the present invention, not all embodiments, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without inventive efforts fall within the scope of the present invention.
Fig. 1 is a schematic structural diagram of a display panel mother board in the prior art, and as shown in fig. 1, a display panel mother board 10 in the prior art includes a plurality of display panels 11 arranged in a matrix, in fig. 1, the display panel mother board 10 includes 3 × 3 display panels, which are respectively 11-1, 11-2, 11-3, 11-4, 11-5, 11-6, 11-7, 11-8, and 11-9 for illustration, and each display panel 11 includes a data driving unit setting region 111. The display panel mother board 10 including the 3 × 3 display panels is configured to be cut into four display panel modules as shown, i.e., display panel modules 12-1, 12-2, 12-3, and 12-4, respectively. Since the data driving unit is prepared at the edge of the display panel module after the cutting is completed, the data driving unit setting region 111 needs to be set at the edge position of the display panel module. Therefore, for the scheme of determining the cutting mode to obtain the determined display panel module, when a certain display panel in a certain display panel module is damaged and is a defective display panel, other display panels located in the same display panel module with the defective display panel are limited by the setting position of the data driving unit setting area 111, and there is no way to form a new display panel module with other display panels, so that all the display panels corresponding to the whole display panel module are discarded, waste of the display panels is caused, and the use efficiency of the display panel motherboard is affected. For example, when the display panel 11-5 is a defective display panel, due to the limitation of the setting positions of the data driving unit setting regions 111 in the display panel 11-1, the display panel 11-2 and the display panel 11-4, the display panel 11-1 cannot form a 2 × 2 arrangement display panel module with other adjacent display panels, so as to ensure that the data driving unit setting regions 111 in each display panel in the newly obtained display panel module are all set at the edge positions of the display panel module, which results in that the data driving unit cannot be set; the display panel 11-2 and the display panel 11-4 have the same problem, which causes waste of the display panel and affects the utilization efficiency of the display panel mother board.
Based on the above technical problem, an embodiment of the present invention provides a display panel mother board, where the display panel mother board is used to be cut to obtain a display panel module having n rows and m columns of sub-display panels, where n is 1 or 2, m is greater than or equal to 1, and m is a positive integer; the display panel mother board comprises a plurality of sub-display panels arranged in a matrix, the matrix comprises p rows and q columns, p is larger than or equal to n, q is larger than or equal to m, and both p and q are positive integers; the sub-display panel comprises an array substrate, the array substrate comprises a substrate base plate, and the substrate base plates of the plurality of sub-display panels are of an integrated structure; the plurality of sub-display panels positioned in the 2 nd row to the p-1 th row are central sub-display panels, each central sub-display panel comprises a first display area and a first non-display area arranged around the first display area, and each first non-display area comprises a first binding area, a second binding area and a first circuit area; the first binding area and the second binding area are arranged on two opposite sides of the first display area along the column direction of the matrix; along the row direction of the matrix, the first circuit area is arranged on any side of the first display area; the first display area comprises a plurality of first data lines, a plurality of first scanning lines and a plurality of first pixels, wherein the plurality of first data lines and the plurality of first scanning lines cross to define the plurality of first pixels; the first binding area and the second binding area are used for binding a data driving chip and/or a flexible printed circuit board which provides data driving signals for the first data line, and the first circuit area is used for setting a grid driving circuit which provides grid driving signals for the first scanning line. By adopting the technical scheme, the plurality of central sub-display panels positioned in the 2 nd row to the p-1 th row in the display panel mother board comprise a first binding area, a second binding area and a first circuit area; the first binding area and the second binding area are arranged on two opposite sides of the first display area along the column direction of the matrix; along the row direction of the matrix, the first circuit area is arranged on any side of the first display area. The data driving chip and/or the flexible printed circuit board are/is arranged in the first binding area or the second binding area, so that when the display panel mother board is cut to obtain the display panel module, the display panel module can be cut from one side of the first binding area or one side of the second binding area, the display panel mother board is cut flexibly, and a plurality of display panel modules with different quantities or different arrangement modes can be obtained; moreover, when a certain display panel is damaged, the display panel in the whole display panel module can be prevented from being discarded completely by modifying the cutting position, the utilization efficiency of a mother board of the display panel is improved, and the preparation cost of the display panel module is reduced; furthermore, the display panel mother board provided by the embodiment of the invention can be cut to obtain a plurality of display panel modules, each display panel module comprises one or two rows of sub-display panels, so that it can be ensured that for each display panel module, a first binding region or a second binding region exists in each sub-display panel in the display panel module and is positioned at the edge of the display panel module, a data driving chip and/or a flexible printed circuit board can be bound in the first binding region or the second binding region in a subsequent process, and the sub-display panels can work normally and display normally.
The above is the core idea of the present invention, and the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without any creative effort are within the protection scope of the present invention.
Fig. 2 is a schematic structural diagram of a display panel mother board according to an embodiment of the present invention, fig. 3 is an enlarged structural diagram of a region a in the display panel mother board provided in fig. 2, fig. 4 is a schematic sectional structure of the display panel mother board provided in fig. 2 along a section line a-a', and referring to fig. 2 to fig. 4, a display panel mother board 20 according to an embodiment of the present invention is used to be cut to obtain a display panel module having n rows and m columns of sub-display panels, where n is 1 or 2, m is greater than or equal to 1 and m is a positive integer; the display panel mother board 20 comprises a plurality of sub-display panels 21 arranged in a matrix, wherein the matrix comprises p rows and q columns, p is not less than n, q is not less than m, and both p and q are positive integers; the sub-display panel 21 comprises an array substrate 201, the array substrate 201 comprises a substrate 2011, and the substrate substrates 2011 of the plurality of sub-display panels 21 are of an integral structure; the plurality of sub display panels located in the 2 nd row to the p-1 th row are the central sub display panel 21a, the central sub display panel 21a includes a first display area 211a and a first non-display area 212a disposed around the first display area, the first non-display area 212a includes a first binding area 2121a, a second binding area 2122a and a first circuit area 2123 a; along the column direction of the matrix (X direction as shown in the figure), a first binding region 2121a and a second binding region 2122a are disposed at opposite sides of the first display region 211 a; along the row direction of the matrix (Y direction as shown in the drawing), the first circuit region 2123a is disposed on either side of the first display region; the first display region 211a includes a plurality of first data lines 2111a, a plurality of first scan lines 2112a, and a plurality of first pixels, the plurality of first data lines 2111a and the plurality of first scan lines 2112a crossing to define a plurality of first pixels 2113 a; the first and second strapping regions 2121a and 2122a are used to strap a data driving chip and/or a flexible printed circuit (not shown) for providing a data driving signal to the first data line 2111a, and the first circuit region 2123a is used to provide a gate driving circuit (not shown) for providing a gate driving signal to the first scan line 2112 a.
For example, as shown in fig. 2, the display panel mother board 20 provided in the embodiment of the present invention may be cut to obtain a plurality of display panel modules, and fig. 2 only exemplarily shows a display panel module 22-1, each display panel module includes n rows and m columns of sub-display panels, where n is 1 or 2, m is greater than or equal to 1 and m is a positive integer, that is, each display panel module includes one row or two rows of sub-display panels.
Further, the display panel mother board 20 includes a plurality of sub-display panels 21 arranged in a matrix, where the matrix includes p rows and q columns, p is equal to or greater than n, q is equal to or greater than m, and p and q are positive integers, and fig. 2 illustrates that p is equal to 4 and q is equal to 4. In the plurality of center sub-display panels 21a positioned at rows 2 to p-1, each of the center sub-display panels 21a includes a first display region 211a and a first non-display region 212a disposed around the first display region, the embodiment of the present invention inventively provides that the first non-display region 212a includes a first binding region 2121a and a second binding region 2122a, that is, two bonding regions are disposed in each center sub-display panel 21a, and along a column direction (Y direction shown in the figure) of the matrix, a first bonding region 2121a and a second bonding region 2122a are disposed at two opposite sides of the first display region 211a, the first bonding region 2121a and the second bonding region 2122a are used to dispose a data driving chip and/or a flexible printed circuit board, and the data driving chip and/or the flexible printed circuit board are used to provide a data signal for a plurality of data lines 2111a disposed in the first display region 211 a. That is, for each center sub-display panel 21a, data signals can be provided to the plurality of data lines 2111a disposed in the first display area 211a through the data driving chip and/or the flexible printed circuit board disposed in the first binding area 2121a, or data signals can be provided to the plurality of data lines 2111a disposed in the first display area 211a through the data driving chip and/or the flexible printed circuit board disposed in the second binding area 2122a, so that when the display panel mother board 20 is cut to obtain a display panel module, cutting can be performed from one side of the first binding area 2121a, or from one side of the second binding area 2122a, so as to ensure that the display panel mother board 20 is cut flexibly, and a plurality of display panel modules with different numbers or different arrangement modes can be obtained. Moreover, since each display panel module includes only one row or two rows of sub-display panels 21, it can be ensured that for each display panel module, each sub-display panel in the display panel module has the first binding region 2121a or the second binding region 2122a at the edge of the display panel module, so as to facilitate the subsequent binding of the data driver chip and/or the flexible printed circuit board in the first binding region 2121a or the second binding region 2122a, and ensure that the sub-display panels 21 can normally work and normally display.
Further, because every center sub-display panel 21a all includes first binding area 2121a and second binding area 2122a, when a certain center sub-display panel 21a takes place to damage and is abandonment sub-display panel, can be through the mode of revising the cutting position, guarantee to be located with abandonment sub-display panel and can form new display panel module again with other sub-display panels in being the same as the display panel module with other sub-display panels, guarantee to avoid the whole abandonment of display panel in the whole display panel module, the utilization efficiency of the display panel motherboard has been promoted, the preparation cost of display panel module is reduced. Illustratively, as shown in fig. 2, in the display panel module 22-1, for the center sub-display panel 21-7, the first binding region 2121a of the center sub-display panel 21-7 is used as a binding region for setting the data driving chip and/or the flexible printed circuit board, for the center sub-display panel 21-11, the second binding region 2122a of the center sub-display panel 21-11 is used as a binding region for setting the data driving chip and/or the flexible printed circuit board, but when the center sub-display panel 21-11 is damaged to be a waste sub-display panel, the center sub-display panel 21-7 and the center sub-display panel 21-3 may be set to re-form a new display panel module 22-1 ', and in the new display panel module 22-1', the second binding region 2122a of the center sub-display panel 21-7 is used as a setting data driving chip and | Or the binding region of the flexible printed circuit board, and ensures that each sub-display panel in the display panel module 22-1 ' has the binding region arranged at the edge of the display panel module 22-1 ', so as to ensure that the data driving chip and/or the flexible printed circuit board can be normally bound in the binding region, and ensure that the new display panel module 22-1 ' can be normally used and normally displayed.
Further, with reference to fig. 2, in the center sub-display panel 21a according to the embodiment of the invention, the first non-display area 212a further includes a first circuit area 2123a, and the first circuit area 2123a is used for a gate driving circuit (not shown) configured to provide a gate driving signal to the first scan line 2112a, and the first circuit area 2123a is disposed on any side of the first display area 211a along a row direction (e.g., an X direction) of the matrix. Optionally, the Gate driving circuit may be a Gate On Array (GOA) circuit On the substrate, the GOA is directly fabricated On the Array substrate 201, and is not fabricated by a bonding process after the display panel module is cut, so that the location of the Gate driving circuit in the GOA form is not limited, even in the display panel module, the Gate driving circuits of some sub-display panels are not located at the edge of the display panel module, but because the Gate driving circuit is directly fabricated On the Array substrate, and is not required to be bonded, the Gate driving circuit is not affected to provide the Gate driving signal for the first scan line 2112a, and it is ensured that the sub-display panels are normally driven and normally displayed.
Optionally, as shown in fig. 4, the sub-display panel 21 includes an array substrate 201, the array substrate 201 includes a substrate 2011, and the substrate substrates 2011 of the plurality of sub-display panels 21 are integrated, so as to ensure that the display panel mother board 20 has a simple structure.
It should be noted that, in the display panel mother board, a dummy area is disposed between two adjacent sub-display panels to cut a predetermined space for the display panel mother board. According to the display panel mother board provided by the embodiment of the invention, the two binding regions in the central sub-display panel 21a can be arranged in the dummy region, so that the distance between two adjacent central sub-display panels 21a or the distance between the central sub-display panel 21a and other sub-display panels is not increased, and the utilization rate of the display panel mother board is not reduced. Furthermore, when the display panel mother board is cut, for the binding area which is not bound with the data drive chip and/or the flexible printed circuit board, the cutting line can directly cut the metal terminal in the binding area, and the cutting position cannot be influenced by the setting of the binding area.
To sum up, the display panel motherboard provided by the embodiment of the present invention, by setting a plurality of central sub-display panels located in the 2 nd row to the p-1 th row of the display panel motherboard to include a first binding region and a second binding region, and by setting a data driving chip and/or a flexible printed circuit board in the first binding region or the second binding region, it is ensured that when the display panel motherboard is cut to obtain a display panel module, the display panel module can be cut from one side of the first binding region, and also can be cut from one side of the second binding region, so as to ensure that the display panel module is cut flexibly, and display panel modules of various numbers or different arrangement modes can be obtained; moreover, when a certain display panel is damaged, the display panel in the whole display panel module can be prevented from being discarded completely by modifying the cutting position, the utilization efficiency of a mother board of the display panel is improved, and the preparation cost of the display panel module is reduced; furthermore, the display panel mother board provided by the embodiment of the invention can be cut to obtain a plurality of display panel modules, each display panel module comprises one or two rows of sub-display panels, so that it can be ensured that for each display panel module, a first binding region or a second binding region exists in each sub-display panel in the display panel module and is positioned at the edge of the display panel module, a data driving chip and/or a flexible printed circuit board can be bound in the first binding region or the second binding region in a follow-up manner, and the sub-display panels can work normally and display normally. Furthermore, the central sub-display panel can further comprise a first circuit area, the first circuit area is provided with a gate driver on array (GOA) circuit for providing a gate driving signal for the first scanning line, and the GOA gate driver is directly prepared on the array substrate without binding, so that the gate driver is not influenced to provide the gate driving signal for the first scanning line, and normal driving and normal display of the sub-display panel are ensured.
Optionally, fig. 5 is an enlarged schematic structural diagram of a region b in the display panel motherboard provided in fig. 2, and as shown in fig. 2 and fig. 5, the sub display panel located in the 1 st row, the 2 nd column to the 1 st row, the q-1 th column, and the sub display panel located in the p nd row, the 2 nd column to the p th row, the q-1 th column are an edge sub display panel 21b, the edge sub display panel 21b includes a second display area 211b, a fifth binding area 2121b, and a second circuit area 2122b, the second display area 211b includes a plurality of second data lines 2111b, a plurality of second scan lines 2112b, and a plurality of second pixels 2113b, and the plurality of second data lines 2111b and the plurality of second scan lines 2112b intersect to define a plurality of second pixels 2113 b; the fifth bonding region 2121b is used to bond a data driving chip and/or a flexible printed circuit board (not shown) for providing a data driving signal to the second data line 2111b, and the second circuit region 2122b is used to provide a gate driving circuit (not shown) for providing a gate driving signal to the second scanning line 2112 b; in the column direction of the matrix (Y direction as shown in the figure), the fifth binding region 2121b is located at a side of the corresponding second display region 211b away from the adjacent center sub-display panel 21 a.
Illustratively, the sub-display panels located in the 1 st row, the 2 nd column to the 1 st row, the q-1 th column and the sub-display panels located in the p nd row, the 2 nd column to the p th row, the q-1 th column are edge sub-display panels 21b, and since the edge sub-display panels 21b are located at the edge of the display panel mother board 20, no matter which display panel module the edge sub-display panels 21b are cut into, the edge sub-display panels 21b are located at the edge of the display panel module. Therefore, for the edge sub-display panel 21b, only the fifth binding region 2121b needs to be arranged on the side far away from the center sub-display panel 21a, and the data driving chip and/or the flexible printed circuit board for providing the data driving signal to the second data line 2111b is arranged through the fifth binding region 2121b, so that the edge sub-display panel 21b can normally display and normally operate.
Further, with continued reference to fig. 2 and fig. 5, the edge sub-display panel 21b provided in the embodiment of the invention further includes a second circuit region 2122b, where the second circuit region 2122b is used for a gate driving circuit (not shown) configured to provide a gate driving signal to the second scan line 2112b, and the second circuit region 2122b is disposed on any side of the second display region 211b along a row direction (X direction in the drawing) of the matrix. Optionally, the Gate driving circuit may be a Gate On Array (GOA) circuit On the substrate, and the GOA is directly fabricated On the Array substrate 201, rather than being fabricated by a bonding process after the display panel module is cut, so that the location of the Gate driving circuit in the GOA form is not limited, and even in the display panel module, the Gate driving circuits of some sub-display panels are not located at the edge of the display panel module, but because the Gate driving circuits are directly fabricated On the Array substrate, and do not need to be bonded, the Gate driving circuit is not affected to provide the Gate driving signal for the second scan line 2112b, thereby ensuring normal driving and normal display of the edge sub-display panel.
Optionally, fig. 6 is an enlarged schematic structural diagram of a region c in the display panel motherboard provided in fig. 2, and as shown in fig. 2 and fig. 6, in the display panel motherboard 20 provided in the embodiment of the present invention, four sub-display panels located in a row 1, a column 1, a row 1, a column q, a row p, a column 1, and a row p, a column q are taken as a target sub-display panel 21c, the target sub-display panel 21c includes a third display area 211c, a sixth binding area 2121c, and a third circuit area 2122c, the third display area 211c includes a plurality of third data lines 2111c, a plurality of third scan lines 2112c, and a plurality of third pixels 2113c, and the plurality of third data lines 2111c and the plurality of third scan lines 2112c intersect to define a plurality of third pixels 2113 c; the sixth bonding region 2121c is used for bonding a data driving chip and/or a flexible printed circuit board which provides a data driving signal for the third data line 2111c, and the third circuit region 2122c is used for setting a gate driving circuit which provides a gate driving signal for the third scan line 2112 c; in the column direction of the matrix (Y direction as shown in the figure), the sixth binding region 2121c is located at a side of the corresponding third display region 211c away from the adjacent center sub-display panel 21 a; alternatively, the sixth binding region 2121c is located at a side of the third display region 211c away from the adjacent edge sub-display panel 21b in the row direction of the matrix (X direction as shown in the figure).
Illustratively, the four sub-display panels located in the 1 st row and the 1 st column, the 1 st row and the q th column, the p th row and the 1 st column, and the p th row and the q th column are the target sub-display panels 21c, and since the target sub-display panels 21c are located at the edge of the display panel mother board 20 when viewed from the row direction (X direction shown in the figure) or the column direction (Y direction shown in the figure), the edge sub-display panels 21b are located at the edge of the display panel module no matter which display panel module the edge sub-display panels 21b are cut into. Therefore, for the target sub-display panel 21c, the sixth binding region 2121c may be disposed at a side far from the center sub-display panel 21a, or the sixth binding region 2121c may be disposed at a side far from the adjacent edge sub-display panel 21b, and the data driving chip and/or the flexible printed circuit board for providing the data driving signal to the third data line 2111c is disposed through the sixth binding region 2121c, so as to ensure that the target sub-display panel 21c can normally display and normally operate.
Further, as shown in fig. 2 and fig. 6, the target sub-display panel 21c provided in the embodiment of the present invention further includes a third circuit region 2122c, where the third circuit region 2122c is used to provide a gate driving circuit (not shown in the figure) for providing a gate driving signal to the third scanning line 2112c, and similarly, for the target sub-display panel 21c, the third circuit region 2122c may be provided on a side away from the center sub-display panel 21a, or the third circuit region 2122c may be provided on a side away from the adjacent edge sub-display panel 21b, and the third circuit region 2122c is used to provide the gate driving circuit for providing the gate driving signal to the third scanning line 2112c, so as to ensure that the target sub-display panel 21c can be normally driven and normally displays. Optionally, the Gate driving circuit may be a Gate On Array (GOA) circuit On the substrate, the GOA is directly fabricated On the Array substrate 201, and is not fabricated through a binding process after the display panel module is cut, so that the location of the Gate driving circuit in the GOA form is not limited, even in the display panel module, the Gate driving circuits of some sub-display panels are not located at the edge of the display panel module, but because the Gate driving circuits are directly fabricated On the Array substrate, and do not need to be bound, the Gate driving circuit is not affected to provide the Gate driving signal for the second scanning line 2112b, and it is ensured that the edge sub-display panel is normally driven and normally displays.
On the basis of the foregoing embodiment, as a feasible implementation manner, as shown in fig. 4, the sub-display panel 21 provided in the embodiment of the present invention further includes a color filter substrate 202, where the color filter substrate 202 is disposed opposite to the array substrate 201; the color filter substrate 202 of each sub display panel 21 is provided separately.
For example, for the liquid crystal display panel, a polarizer 203 is further attached to a side of the color film substrate 202 away from the array substrate 201 to ensure normal display of the liquid crystal display panel. For the whole display panel mother board 20, which includes a plurality of sub-display surfaces 21 corresponding to the plurality of array substrates 201 and the plurality of color film substrates 202, in order to ensure the attaching accuracy of the polarizer 203, the color film substrates 202 of the sub-display panels 21 may be set to be separately arranged, and then the polarizers 203 with smaller size are independently attached to one side of each separately arranged color film substrate 202, so that the attaching accuracy of the polarizer is improved, and the display effect of each sub-display panel 21 is improved.
On the basis of the foregoing embodiment, as a feasible implementation manner, fig. 7 is another schematic cross-sectional structure view of the display panel mother board provided in fig. 2 along a section line a-a', and as shown in fig. 7, the sub-display panel 21 further includes a color filter substrate 202, where the color filter substrate 202 is disposed opposite to the array substrate 201; the color filter substrate 202 of each sub display panel 21 is integrally provided.
For example, for the whole display panel mother board 20, which includes a plurality of sub-display surfaces 21 corresponding to the plurality of array substrates 201 and the plurality of color film substrates 202, in order to reduce the difficulty of attaching the polarizer 203 and ensure the simplicity of the attaching process of the polarizer 203, the color film substrates 202 of the sub-display panels 21 may be integrally arranged, and then the polarizer 203 with a larger size is attached to one side of the integrally arranged color film substrate 202 through a one-time attaching process, so as to simplify the attaching process of the polarizer 203 and improve the attaching efficiency of the polarizer 203.
On the basis of the foregoing embodiment, as a possible implementation manner, fig. 8 is a schematic structural diagram of another display panel mother board provided in the embodiment of the present invention, fig. 9 is an enlarged structural diagram of a region d in the display panel mother board provided in fig. 7, and in combination with fig. 8 and fig. 9, in the display panel mother board 20 provided in the embodiment of the present invention, the center sub-display panel 21a further includes a third binding region 2124a and a fourth binding region 2125a, and the third binding region 2124a and the fourth binding region 2125a are used for binding a data driving chip and/or a flexible printed circuit board (not shown in the figure) that provides a data driving signal for the first data line 2111 a; along the row direction of the matrix (X direction as illustrated in the figure), a third binding region 2124a and a fourth binding region 2125a are disposed at opposite sides of the first display region 211a, respectively.
For example, in the display panel mother board 20 provided in the embodiment of the present invention, the center sub-display panel 21a further includes a third binding region 2124a and a fourth binding region 2125a, and the third binding region 2124a and the fourth binding region 2125a may be used as a spare binding region in the center sub-display panel 21a, and when the first binding region 2121a and the second binding region 2122a fail and cannot be bound, a data driver chip and/or a flexible printed circuit board may be bound in the third binding region 2124a and the fourth binding region 2125a to provide a data driver signal for the first data line 2111 a. Further, along the row direction of the matrix (e.g., the X direction shown in the figure), the third bonding area 2124a and the fourth bonding area 2125a are respectively disposed on two opposite sides of the first display area 211a, and in the embodiment of the present invention, the relative position relationship between the third bonding area 2124a and the fourth bonding area 2125a and the first circuit area 2123a is not limited, as shown in fig. 8 and 9, the first circuit area 2123a is disposed on one side of the fourth bonding area 2125a close to the first display area 211a, the first circuit area 2123a is disposed on one side of the third bonding area 2124a close to the first display area 211a, or along the column direction of the matrix (e.g., the Y direction shown in the figure), and the first circuit area 2123a and the third bonding area 2124a or the fourth bonding area 2125a are sequentially disposed on the same side of the first display area 211 a. The third binding area 2124a and the fourth binding area 2125a can be used as a standby binding area in the central sub-display panel 21a, so that the risk that the sub-display panel fails and cannot be bound is reduced, and the reliability of the sub-display panel is improved.
On the basis of the above embodiment, with continued reference to fig. 3, the sub-display panel 21 may include a first edge and a second edge extending along the row direction of the matrix, the first edge being an edge of the first binding region 2121a at the same time, and the second edge being an edge of the second binding region 2122a at the same time; the sub display panel 21 further includes third and fourth sides extending in the column direction of the matrix; the length of the first side and the second side is A, the length of the third side and the fourth side is B, and A is larger than or equal to B.
For example, the sub-display panel 21 may be rectangular, and the edges of the first binding region 2121a and the second binding region 2122a may be disposed on one side of the long edge of the rectangular sub-display panel, so as to reduce the requirement on the driving power of the data driving chip, ensure that the driving of the entire sub-display panel can be completed without using a data driving chip with a larger driving power, and reduce the manufacturing cost of the sub-display panel.
Based on the same inventive concept, the embodiment of the invention also provides a preparation method of the display panel module. Specifically, fig. 10 is a flow chart illustrating a method for manufacturing a display panel module according to an embodiment of the present invention, and as shown in fig. 10, the method for manufacturing a display panel module according to an embodiment of the present invention includes:
and S110, preparing a display panel mother board.
And S120, cutting the display panel mother board to obtain the display panel module meeting the preset requirement, wherein the display panel module comprises n rows and m columns of the sub-display panels, n is 1 or 2, m is more than or equal to 1, and m is a positive integer.
For example, the display panel mother board may include the display panel mother board provided in the above embodiment of the present invention, each display panel module obtained by cutting the display panel mother board includes one row or two rows of sub-display panels, and the central sub-display panel located at the central position of the display panel mother board includes two binding regions, a first binding region and a second binding region. The data driving chip and/or the flexible printed circuit board arranged in the first binding area can provide data signals for the data lines, and the data driving chip and/or the flexible printed circuit board arranged in the second binding area can provide data signals for the data lines, so that the flexible cutting mode of the display panel motherboard is ensured. And, because every display panel module only includes one or two lines of sub-display panel, consequently can guarantee to every display panel module, every sub-display panel in the display panel module all has first binding district or the edge that the second binding district lies in the display panel module, be convenient for follow-up binding data driver chip and/or flexible printed wiring board in first binding district or the second binding district, guarantee that sub-display panel can normally work, normal demonstration.
On the basis of the foregoing embodiments, fig. 11 is a schematic flow chart of another manufacturing method of a display panel module according to an embodiment of the present invention, and how to manufacture a display panel module including a defective sub-display panel is added to the manufacturing method of the display panel module illustrated in fig. 11. Specifically, as shown in fig. 11, the method for manufacturing a display panel module according to an embodiment of the present invention includes:
s210, preparing a display panel mother board.
S220, detecting whether each sub-display panel in the display panel mother board is a defect sub-display panel or not, and marking the defect sub-display panel.
And S230, avoiding the defect sub-display panel to cut the display panel mother board so as to obtain the display panel module meeting the preset requirement.
The display panel mother board can comprise the display panel mother board provided by the embodiment of the invention, the defective sub-display panel can be a sub-display panel which cannot normally emit light for display, and the central sub-display panel positioned at the central position of the display panel mother board comprises two binding areas, so that the cutting can be carried out from one side of the first binding area and one side of the second binding area in the cutting process, the flexible cutting mode of the display panel mother board is ensured, and a plurality of display panel modules with different quantities or different arrangement modes can be obtained. And, when a certain central sub-display panel is damaged and is a discarded sub-display panel, a new display panel module can be formed again with other sub-display panels by modifying the cutting position of the central sub-display panel, so that the display panel in the whole display panel module is prevented from being discarded completely, the utilization efficiency of a mother board of the display panel is improved, and the preparation cost of the display panel module is reduced.
On the basis of the above embodiments, preparing a display panel mother board may include:
providing a bottom plate, wherein the bottom plate comprises a plurality of partitions which are arranged in a matrix manner, the matrix comprises p rows and q columns, p is not less than n, q is not less than m, and both p and q are positive integers;
forming an array substrate by taking the partitions as corresponding substrate substrates to obtain the array substrate of each sub-display panel, wherein the array substrate comprises a first binding area, a second binding area and a first circuit area;
forming a plurality of discrete color film substrates, wherein the color film substrates correspond to the array substrates one to one;
attaching each color film substrate to a corresponding array substrate, and arranging a liquid crystal layer between each color film substrate and the corresponding array substrate;
attaching a plurality of polaroids to one side of the color film substrate, which is far away from the substrate array, wherein the polaroids correspond to the color film substrate one to one.
Exemplarily, the display panel mother board may be a liquid crystal display panel mother board, and include an array substrate, a color film substrate, and a liquid crystal layer located between the array substrate and the color film substrate, where the color film substrate may be a plurality of color film substrates arranged in a discrete manner, and then, a polarizer with a smaller size is respectively attached to one side of the color film substrate arranged in a discrete manner, which is far away from one side of the substrate, so as to ensure high alignment precision between the polarizer and the color film substrate, and small attachment deviation, thereby improving the attachment precision of the polarizer, and improving the display effect of each sub-display panel.
Optionally, a color film substrate with an integrated structure may be formed, and then a polarizer with a larger front size is attached to one side of the color film substrate with the integrated structure, so that the polarizer attaching process is simplified, and the polarizer attaching efficiency is improved.
The above embodiments only take two possible manufacturing methods of the display panel mother board as examples for illustration, and the specific manufacturing method of the display panel mother board is not limited in the embodiments of the present invention.
Fig. 12 is a schematic structural diagram of a display panel module according to an embodiment of the present invention, and based on the same inventive concept, an embodiment of the present invention further provides a display panel module, as shown in fig. 12, the display panel module according to the embodiment of the present invention is prepared by using the preparation method of the display panel module according to the embodiment, each display panel module includes one row or two rows of sub-display panels 21, and the embodiment of the present invention does not limit the number of columns of the sub-display panels included in the display panel module. Because each display panel module only comprises one row or two rows of sub-display panels, it can be ensured that for each display panel module, each sub-display panel 21 in the display panel module has the first binding region 2121a or the second binding region 2122a at the edge of the display panel module 22, so as to facilitate the subsequent binding of the data driving chip and/or the flexible printed circuit board in the first binding region 2121a or the second binding region 2122a, and ensure that the sub-display panel 21 can normally work and normally display.
Fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present invention, and based on the same inventive concept, an embodiment of the present invention further provides a display device, and as shown in fig. 13, a display device 100 according to an embodiment of the present invention includes a display panel module 22 according to any embodiment of the present invention, and a backlight module (not shown in the figure) disposed away from a light exit surface of the display panel module. Optionally, the display device provided in the embodiment of the present invention may be a mobile phone shown in fig. 13, or may also be a computer, a television, an intelligent wearable display device, or a vehicle-mounted display device, and the like, which is not particularly limited in this embodiment of the present invention.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that the features of the various embodiments of the invention may be partially or fully coupled or combined with each other and may be coordinated with each other and technically driven in various ways. Numerous variations, rearrangements, combinations, and substitutions will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (11)
1. A display panel mother board is used for being cut to obtain a display panel module with n rows and m columns of sub-display panels, wherein n is 1 or 2, m is more than or equal to 1, and m is a positive integer, and the display panel mother board is characterized in that:
the display panel mother board comprises a plurality of sub display panels arranged in a matrix, the matrix comprises p rows and q columns, p is not less than n, q is not less than m, and both p and q are positive integers; the sub-display panel comprises an array substrate, the array substrate comprises a substrate, and the substrate substrates of the sub-display panels are of an integrated structure;
the plurality of sub-display panels positioned in the 2 nd row to the p-1 th row are central sub-display panels, each central sub-display panel comprises a first display area and a first non-display area arranged around the first display area, and each first non-display area comprises a first binding area, a second binding area and a first circuit area; the first binding area and the second binding area are arranged on two opposite sides of the first display area along the column direction of the matrix; the first circuit area is arranged on any side of the first display area along the row direction of the matrix;
the first display area comprises a plurality of first data lines, a plurality of first scanning lines and a plurality of first pixels, and the plurality of first data lines and the plurality of first scanning lines are crossed to define the plurality of first pixels; the first binding area and the second binding area are used for binding a data driving chip and/or a flexible printed circuit board which provide data driving signals for the first data line, and the first circuit area is used for setting a grid driving circuit which provides grid driving signals for the first scanning line.
2. The display panel mother board according to claim 1, wherein the sub-display panel further comprises a color film substrate, and the color film substrate is disposed opposite to the array substrate;
the color film substrates of the sub-display panels are arranged in a separated mode.
3. The display panel mother board according to claim 1, wherein the central sub-display panel further comprises a third bonding area and a fourth bonding area, the third bonding area and the fourth bonding area are used for bonding a data driving chip and/or a flexible printed wiring board which provide a data driving signal for the first data line;
and the third binding region and the fourth binding region are respectively arranged on two opposite sides of the first display region along the row direction of the matrix.
4. The display panel mother board according to claim 1, wherein the sub display panel includes a first edge and a second edge extending in a row direction of the matrix, the first edge being an edge of the first bonding region at the same time, the second edge being an edge of the second bonding region at the same time; the sub-display panel further includes third and fourth sides extending in a column direction of the matrix;
the length of the first edge and the second edge is A, the length of the third edge and the fourth edge is B, and A is larger than or equal to B.
5. The display panel mother board according to claim 1, wherein the sub-display panels located in row 1, column 2 to column 1, row q-1, and the sub-display panels located in row p, column 2 to column p, row q-1 are edge sub-display panels, the edge sub-display panels include a second display area, a fifth bonding area, and a second circuit area, the second display area includes a plurality of second data lines, a plurality of second scan lines, and a plurality of second pixels, and the plurality of second data lines and the plurality of second scan lines intersect to define the plurality of second pixels; the fifth binding region is used for binding a data driving chip and/or a flexible printed circuit board which provides a data driving signal for the second data line, and the second circuit region is used for setting a grid driving circuit which provides a grid driving signal for the second scanning line;
and along the column direction of the matrix, the fifth binding region is positioned at one side of the second display region far away from the adjacent central sub-display panel.
6. The display panel mother board according to claim 5, wherein four of the sub-display panels located in row 1, column 1, row 1, column q, row 1, and column p are target sub-display panels, the target sub-display panel includes a third display area, a sixth bonding area, and a third circuit area, the third display area includes a plurality of third data lines, a plurality of third scan lines, and a plurality of third pixels, and the plurality of third data lines and the plurality of third scan lines intersect to define the plurality of third pixels; the sixth binding region is used for binding a data driving chip and/or a flexible printed circuit board which provides a data driving signal for the third data line, and the third circuit region is used for setting a grid driving circuit which provides a grid driving signal for the third scanning line;
along the column direction of the matrix, the sixth binding region is positioned at one side, far away from the adjacent central sub-display panel, of the corresponding third display region; or, along the row direction of the matrix, the sixth binding region is located on one side of the third display region, which is far away from the adjacent edge sub-display panel.
7. A preparation method of a display panel module is characterized by comprising the following steps:
preparing a display panel mother board according to any one of claims 1 to 6;
and cutting the display panel mother board to obtain the display panel module meeting the preset requirement, wherein the display panel module comprises n rows and m columns of the sub-display panels, n is 1 or 2, m is more than or equal to 1, and m is a positive integer.
8. The method for manufacturing a display panel according to claim 7, wherein before cutting the display panel mother substrate, further comprising:
detecting whether each sub-display panel in the display panel mother board is a defective sub-display panel or not, and marking the defective sub-display panel;
correspondingly, cut the display panel motherboard to obtain and satisfy and predetermine the requirement the display panel module includes:
and cutting the display panel mother board by avoiding the defective sub-display panel so as to obtain the display panel module meeting the preset requirement.
9. The method of manufacturing according to claim 7, wherein manufacturing the display panel mother substrate according to any one of claims 1 to 6 includes:
providing a bottom plate, wherein the bottom plate comprises a plurality of partitions which are arranged in a matrix manner, the matrix comprises p rows and q columns, p is not less than n, q is not less than m, and both p and q are positive integers;
forming an array substrate by taking the subareas as corresponding to the substrate substrates to obtain the array substrate of each sub-display panel, wherein the array substrate comprises the first binding area, the second binding area and the first circuit area;
forming a plurality of discrete color film substrates, wherein the color film substrates correspond to the array substrates one to one;
and adhering the color film substrates to the corresponding array substrates, and arranging a liquid crystal layer between the color film substrates and the corresponding array substrates.
10. A display panel module formed by the method for manufacturing a display panel module according to any one of claims 6 to 9.
11. A display device, comprising the display panel module of claim 10 and a backlight module disposed away from the light-emitting surface of the display panel module.
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| CN113009741A (en) * | 2021-03-09 | 2021-06-22 | 北海惠科光电技术有限公司 | Array substrate, display panel and manufacturing method thereof |
| CN113763896A (en) * | 2021-08-13 | 2021-12-07 | 北海惠科光电技术有限公司 | Drive circuit, display panel and device |
| CN114049843A (en) * | 2021-11-17 | 2022-02-15 | 合肥维信诺科技有限公司 | Display module and display device |
| CN115016186A (en) * | 2022-06-30 | 2022-09-06 | 苏州华星光电技术有限公司 | Display mother board and display panel |
| WO2023070427A1 (en) * | 2021-10-28 | 2023-05-04 | 京东方科技集团股份有限公司 | Display panel and display device |
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| GB2621953A (en) * | 2021-10-28 | 2024-02-28 | Boe Technology Group Co Ltd | Display panel and display device |
| CN114049843A (en) * | 2021-11-17 | 2022-02-15 | 合肥维信诺科技有限公司 | Display module and display device |
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