CN111486949A - Transient M2Factor measuring instrument - Google Patents
Transient M2Factor measuring instrument Download PDFInfo
- Publication number
- CN111486949A CN111486949A CN202010285150.7A CN202010285150A CN111486949A CN 111486949 A CN111486949 A CN 111486949A CN 202010285150 A CN202010285150 A CN 202010285150A CN 111486949 A CN111486949 A CN 111486949A
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- imaging device
- object plane
- splitting element
- light splitting
- laser beam
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- 230000001052 transient effect Effects 0.000 title claims abstract description 9
- 238000003384 imaging method Methods 0.000 claims abstract description 77
- 230000003287 optical effect Effects 0.000 claims description 7
- 238000012545 processing Methods 0.000 claims description 5
- 238000005259 measurement Methods 0.000 abstract description 11
- 238000004364 calculation method Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000012544 monitoring process Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0418—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using attenuators
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
To solve the conventional M2The invention provides a transient M, and aims to solve the technical problem of poor measurement real-time performance of a factor measuring instrument2The factor measuring instrument combines an imaging system, an attenuation sheet, a first light splitting element, a second light splitting element, three imaging devices and a signal generator, and adopts M to measure the width of a laser beam collected by the three imaging devices at the positions corresponding to a monitored object surface2Factor calculation method for realizing single pulse, repetition frequency or continuous laser pulse M2Real-time measurement of factors, improving laser M2The measurement accuracy and the measurement efficiency of the factor.
Description
Technical Field
The invention belongs to the technical field of laser, and relates to a laser M2Factor measuring instrument, especially for transient M2A factor measuring instrument.
Background
The evaluation indexes of the quality of laser beams comprise a plurality of indexes such as focused spot size, far-field divergence angle or β value, Steckel ratio, beam parameter product and M2Factors, and the like. Wherein M is2The factor simultaneously considers the influence of the beam width of the laser beam and the change of the far-field divergence angle on the quality of the laser beam, and is used as an important parameter for evaluating the quality of the laser beam.
Conventional M2The factor measuring instrument is provided with a moving mechanism with a length measuring function and an imaging device, measures more than two beam widths on a vertical section of a measured laser beam, records the distance between sections, and measures the beam widths by a three-point method, a two-point method, a hyperbolic curve fitting method and other M2Factor calculating method gives M of measured laser beam2A factor. The method has the defect of poor real-time performance and is only suitable for measuring the repetition frequency or continuous laser beams with better stability. When the single pulse laser beam is measured, the measurement sample is non-homologous light pulse, and the measurement repeatability is poor.
Disclosure of Invention
To solve the conventional M2The invention provides a transient M, and aims to solve the technical problem of poor measurement real-time performance of a factor measuring instrument2The factor measuring instrument realizes the single pulse, the repetition frequency or the continuous laser pulse M by monitoring the beam width information of the measured laser beam at three positions2Real-time measurement of factors, improving laser M2The measurement accuracy and the measurement efficiency of the factor.
The technical scheme of the invention is as follows:
transient M2The factor measuring instrument is characterized in that: the device comprises an imaging system, an attenuation sheet, a first light splitting element, a second light splitting element, a first imaging device, a second imaging device, a third imaging device, a signal generator and a processing unit;
the imaging system, the attenuation sheet, the first light splitting element, the second light splitting element and the third imaging device are sequentially arranged along the same optical path;
the first imaging device is arranged on a reflection light path of the first light splitting element;
the second imaging device is arranged on the reflected light path of the second light splitting element;
the imaging system is used for imaging a first object plane, a second object plane and a third object plane on the first imaging device, the second imaging device and the third imaging device respectively;
the first imaging device, the second imaging device and the third imaging device work synchronously through the trigger signal provided by the signal generator and respectively collect the light field distribution of the laser beam to be measured on the first object surface, the second object surface and the third object surface;
the processing unit is used for acquiring laser beam widths at the first object plane, the second object plane and the third object plane according to the distribution of the measured optical field, and calculating M of the measured laser beam based on the laser beam widths2A factor.
Furthermore, the attenuation multiplying power of the attenuation sheet is configured according to the light intensity of the laser beam to be detected.
Further, the magnification of the first imaging device, the second imaging device and the third imaging device and the distance between the first object plane, the second object plane and the third object plane to be monitored are determined according to calibration.
The invention has the advantages that:
1. the invention utilizes the combination of an imaging system, an attenuation sheet, a first light splitting element, a second light splitting element, three imaging devices and a signal generator to acquire the laser beam width of the three imaging devices at the positions corresponding to the monitored object surface, and adopts M2Factor calculation method for realizing laser beam M2And (4) measuring the factor.
2. The system has simple structure and stable performance.
3. The invention adopts static measurement, and can realize the real-time single pulse, repeated frequency or continuous laser M2And (4) measuring the factor.
4. The invention has the advantages of no need of a movement mechanism in the measuring process and higher efficiency.
Drawings
Fig. 1 is a schematic diagram of the principle of the present invention.
Description of reference numerals:
1-a laser; 2-a first object plane; 3-second object surface; 4-third material surface; 5-an imaging system; 6-attenuation sheet; 7-a first light splitting element; 8-a second light splitting element; 9-a first imaging device; 10-a second imaging device; 11-a third imaging device; 12-signal generator.
Detailed Description
The technical solution adopted by the invention is as follows:
as shown in fig. 1, the present invention includes an imaging system 5, an attenuation sheet 6, a first light splitting element 7, a second light splitting element 8, a first imaging device 9, a second imaging device 10, a third imaging device 11, and a signal generator 12.
The imaging system 5 is used for imaging the three monitoring surfaces on a first imaging device 9, a second imaging device 10 and a third imaging device 11 respectively.
When the laser device works, a laser beam to be detected emitted by the laser device 1 is injected into the imaging system 5 and passes through the attenuation sheet 6, the first light splitting element 7 splits the light beam into two paths, a reflected light beam enters the first imaging device 9, and a transmitted light beam is injected into the second light splitting element 8; the reflected beam split by the second light splitting element 8 enters the second imaging device 10, and the transmitted beam enters the third imaging device 11.
The monitoring surface of the first imaging device 9 is the first object surface 2, the monitoring surface of the second imaging device 10 is the second object surface 3, and the monitoring surface of the third imaging device 11 is the third object surface 4. After the first-third imaging devices are fixed on the imaging system 5 according to the optical path shown in fig. 1, the positions of the first-third object planes of the conjugate planes of the first-third imaging devices can be determined according to the positions of the first-third imaging devices.
The first imaging device 9, the second imaging device 10 and the third imaging device 11 work synchronously through the trigger signal provided by the signal generator 12, and acquire the light field distribution of the corresponding monitored object plane.
The laser beam widths of the first object plane 2, the second object plane 3 and the third object plane 4 are obtained by processing the images acquired by the first imaging device 9, the second imaging device 10 and the third imaging device 11, and M is calculated by a three-point method2Factor of measuring M of the measured laser beam2A factor.
The attenuation multiplying power of the attenuation sheet 6 can be flexibly configured according to the light intensity of the laser to be detected, and the optical signal is ensured to be transmitted to the imaging device to be detected and be unsaturated. The magnifications of the three imaging devices and the distances between the three object planes to be monitored can be calibrated in advance.
Claims (3)
1. Transient M2Factor measuring apparatu, its characterized in that: the device comprises an imaging system (5), an attenuation sheet (6), a first light splitting element (7), a second light splitting element (8), a first imaging device (9), a second imaging device (10), a third imaging device (11), a signal generator (12) and a processing unit;
the imaging system (5), the attenuation sheet (6), the first light splitting element (7), the second light splitting element (8) and the third imaging device (11) are sequentially arranged along the same optical path;
a first imaging device (9) is disposed on a reflected light path of the first light splitting element (7);
the second imaging device (10) is arranged on a reflection optical path of the second light splitting element (8);
the imaging system (5) is used for imaging a first object plane (2), a second object plane (3) and a third object plane (4) on the first imaging device (9), the second imaging device (10) and the third imaging device (11) respectively;
the first imaging device (9), the second imaging device (10) and the third imaging device (11) work synchronously through the trigger signal provided by the signal generator (12) and respectively collect the light field distribution of the laser beam to be measured at the first object plane (2), the second object plane (3) and the third object plane (4);
the processing unit is used for acquiring laser beam widths at the first object plane (2), the second object plane (3) and the third object plane (4) according to the measured optical field distribution, and calculating M of the measured laser beam based on the laser beam widths2A factor.
2. Transient M according to claim 12Factor measuring apparatu, its characterized in that: the attenuation multiplying power of the attenuation sheet (6) is configured according to the light intensity of the laser beam to be detected.
3. Transient M according to claim 1 or 22Factor measuring apparatu, its characterized in that: the magnification of the first imaging device (9), the second imaging device (10) and the third imaging device (11) and the distance between the first object plane (2), the second object plane (3) and the third object plane (4) to be monitored are determined according to calibration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010285150.7A CN111486949B (en) | 2020-04-13 | 2020-04-13 | Transient M2Factor measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010285150.7A CN111486949B (en) | 2020-04-13 | 2020-04-13 | Transient M2Factor measuring instrument |
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| Publication Number | Publication Date |
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| CN111486949A true CN111486949A (en) | 2020-08-04 |
| CN111486949B CN111486949B (en) | 2021-06-22 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008115287A2 (en) * | 2006-10-18 | 2008-09-25 | Efthimion Enterprises, Inc. | Laser assisted microwave plasma spectroscopy |
| CN101393050A (en) * | 2008-11-07 | 2009-03-25 | 四川大学 | Laser beam M* factor matrix measuring method and measuring instrument |
| CN201285324Y (en) * | 2008-11-07 | 2009-08-05 | 四川大学 | Light beam quality factor matrixing instrument |
| WO2014064636A2 (en) * | 2012-10-24 | 2014-05-01 | Csir | Modal decomposition of a laser beam |
| CN103869237A (en) * | 2012-12-12 | 2014-06-18 | 中国科学院空间科学与应用研究中心 | Pulse laser number optimizing method and single-particle overturn cross section testing method |
-
2020
- 2020-04-13 CN CN202010285150.7A patent/CN111486949B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008115287A2 (en) * | 2006-10-18 | 2008-09-25 | Efthimion Enterprises, Inc. | Laser assisted microwave plasma spectroscopy |
| CN101393050A (en) * | 2008-11-07 | 2009-03-25 | 四川大学 | Laser beam M* factor matrix measuring method and measuring instrument |
| CN201285324Y (en) * | 2008-11-07 | 2009-08-05 | 四川大学 | Light beam quality factor matrixing instrument |
| WO2014064636A2 (en) * | 2012-10-24 | 2014-05-01 | Csir | Modal decomposition of a laser beam |
| CN103869237A (en) * | 2012-12-12 | 2014-06-18 | 中国科学院空间科学与应用研究中心 | Pulse laser number optimizing method and single-particle overturn cross section testing method |
Non-Patent Citations (1)
| Title |
|---|
| 刘晓丽 等: "像散椭圆高斯光束的M2因子矩阵的理论与实验研究", 《物理学报》 * |
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| CN111486949B (en) | 2021-06-22 |
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