CN111415879A - Automatic operation method of semiconductor process - Google Patents

Automatic operation method of semiconductor process Download PDF

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Publication number
CN111415879A
CN111415879A CN201910016452.1A CN201910016452A CN111415879A CN 111415879 A CN111415879 A CN 111415879A CN 201910016452 A CN201910016452 A CN 201910016452A CN 111415879 A CN111415879 A CN 111415879A
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China
Prior art keywords
substrate
tested
transporting
process equipment
signal
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Pending
Application number
CN201910016452.1A
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Chinese (zh)
Inventor
陈赞仁
郭中一
吴至钦
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Contrel Technology Co Ltd
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Contrel Technology Co Ltd
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Priority to CN201910016452.1A priority Critical patent/CN111415879A/en
Publication of CN111415879A publication Critical patent/CN111415879A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67276Production flow monitoring, e.g. for increasing throughput
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses an automatic operation method of a semiconductor process, which comprises the following steps that firstly, a plurality of pieces of process equipment are provided, and the plurality of pieces of process equipment carry out the same process operation; then, obtaining a substrate to be tested from a feeding position according to idle signals of a plurality of pieces of process equipment; then, conveying the substrate to be tested to a plurality of process devices which generate idle signals, and executing process operation after the process devices receive the substrate to be tested; and then, according to the completion signals of the plurality of process equipment, the substrate to be tested is conveyed to the discharging position from the process equipment generating the completion signals, so that the process equipment generates idle signals again, namely, a new substrate to be tested is received again.

Description

Automatic operation method of semiconductor process
Technical Field
The present invention relates to semiconductor process operation, and more particularly, to an automated semiconductor process operation method
Background
With the development of the internet, various machine devices can transmit signals to each other through a wired or wireless network to achieve an automation industry. However, the current semiconductor or panel industry still adopts substation type planning when performing relevant process operation, and the planning mode is not beneficial to automation of the whole factory.
Furthermore, there is no communication between the devices, so that the substrate to be tested usually stays at the feeding position, the waiting position or the discharging position for some time to wait for being transported to the next process operation, but the waiting time increases the chance of contamination of the substrate to be tested exposed to the air, and the process efficiency is also poor, so that the process quality can be improved by effectively transporting the substrate to be tested to reduce the waiting time, which is also an urgent problem to be solved.
Disclosure of Invention
In view of the above-mentioned shortcomings, an object of the present invention is to provide an automated operation method for semiconductor process, which can improve the manufacturing efficiency and quality by the communication between the process equipment and the transportation system.
The automatic operation method of the semiconductor process comprises the following steps of firstly, providing a plurality of process devices, wherein the process devices carry out the same process operation; then, obtaining a substrate to be tested from a feeding position according to idle signals of a plurality of pieces of process equipment; then, conveying the substrate to be tested to a plurality of process devices which generate idle signals, and executing process operation after the process devices receive the substrate to be tested; and then, according to the completion signals of the plurality of process equipment, conveying the substrate to be tested to a discharge position from the process equipment generating the completion signals, so that the process equipment generates idle signals again, namely, receives a new substrate to be tested again.
Therefore, the automatic operation method of the semiconductor process can generate idle signals or completion signals through a plurality of process equipment respectively, so that the conveying system can effectively convey the substrate to be detected, the process efficiency is improved, and the possibility of polluting the substrate to be detected can be reduced.
The construction, features, and manner of assembling or using the automated method of operating a semiconductor process of the present invention are described in detail in the following detailed description of the preferred embodiments. However, those of ordinary skill in the art should understand that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
FIG. 1 is a flow chart illustrating the steps of a method for automating the operation of a semiconductor process according to the present invention;
FIG. 2 is a functional block diagram of the process equipment depicted in FIG. 1;
FIGS. 3 and 4 are front and top schematic views, respectively, of an embodiment of an in-line handling system performing the steps of FIG. 1;
fig. 5 and 6 are front and top schematic views, respectively, of another embodiment of an in-line conveying system for performing the steps of fig. 1.
Wherein the reference numerals
10 automated operation method S11-S17 steps
30 process equipment 31 signal processing device 32 communication device
40 substrate to be tested
50 tandem type conveying system 51 feeding and discharging conveying device 511 track group
513 transfer station 515 stage 53 workstation
531 framework 533 branch track group 55 system processing device
Linear slide table of 70 tandem type conveying system 71 feeding and discharging conveying device 711
713 stage 73 workstation 731 frame
733 branch rail set 735 transfer table 75 system handling device
P1 feed position P2, P3 waiting position P4 discharge position
Detailed Description
The constituent elements and the resulting effects of the method for automatically operating a semiconductor process according to the present invention will be described with reference to the accompanying drawings. However, the components, dimensions and appearance of the automated semiconductor process operations illustrated in the figures are merely illustrative of the features of the present invention and are not intended to limit the scope of the invention.
The appearance inspection can confirm whether the appearance of the substrate to be tested is complete through optical inspection, the functional test can test various electrical performances of the substrate to be tested through power supply and test signals, and the repair can repair abnormal circuits on the substrate to be tested through corresponding equipment.
As shown in fig. 1, the method 10 for automating a semiconductor process according to the present invention comprises the following steps: first, step S11 is executed to provide a plurality of process tools, which perform the same process operation. The plurality of cells means two or more cells. Then, step S13 is executed to obtain the substrate to be tested from the feeding position according to the idle signals of the plurality of processing tools. Then, step S15 is executed to transmit the substrate to be tested to the process equipment generating the idle signal, and the process equipment receives the substrate to be tested and then executes the process operation, so that each process equipment receives the substrate to be tested and executes the process operation. Then, step S17 is executed to transport the substrate to be tested from the process equipment generating the completion signal to the discharging position according to the completion signals of the plurality of process equipments, so that the process equipment generates an idle signal again to receive the substrate to be tested again. The completion signal is a signal generated by the process equipment after the process operation is completed. The idle signal is generated again to re-receive the substrate to be tested, and the process returns to step S13.
Thus, by repeating the steps S11-S17, the semiconductor process can be efficiently completed and the automation can be achieved.
As shown in fig. 2, each processing device 30 in step S11 includes a signal processing device 31 and a communication device 32. The signal processing device 31 is connected to the communication device 32. The signal processing device 31 processes and generates an idle signal and a completion signal. The idle signal is generated after the substrate to be tested is removed, so that one skilled in the art can understand that the signal processing device 31 includes a sensor for sensing whether the substrate to be tested is received. The completion signal is generated by the signal processing device 31 after the completion of the process operation, and may be generated by the process operation time course and may include a process result, such as whether the substrate to be tested is good or bad. The communication device 32 receives and transmits idle and completion signals, which may be transmitted or broadcast by wire or wirelessly.
As shown in fig. 3 and 4, the acquisition, conveyance, and conveyance in steps S13-S17 are performed by the tandem conveyance system 50. The tandem transfer system 50 includes a feeding and discharging transfer device 51, a plurality of work stations 53, and a system processing device 55.
The feeding and discharging conveying device 51 is connected in series with two work stations 53, the feeding position P1 and the discharging position P4 are respectively located at the front end and the rear end of the feeding and discharging conveying device 51, the front end and the rear end are not both ends of the feeding and discharging conveying device 51, but are opposite positions, in this embodiment, the feeding position P1 can be defined at the front end of the work station 53, and the discharging position P4 can be defined at the rear end of the work station 53. The in-out transport device 51 may include a track set 511, a transport table 513, and a stage 515. The conveying table 513 is connected to the rail set 511 and is movable along the rail set 511, the conveying table 513 is used for conveying and conveying the substrate 40 to be tested, the conveying table 513 can perform lifting and rotating motions, and in other embodiments, the conveying table 513 can also be combined with a multi-axis robot or other moving mechanism to convey and convey the substrate 40 to be tested.
In step S11, a plurality of process equipments 30 are installed in a plurality of workstations 53, and the workstations 53 include a frame 531 and a branch rail set 533. Track set 511 is fixedly connected to frame 531, and branch track set 533 is fixedly connected to frame 531. The process equipment 30 is connected to the branch rail set 533 and can move along the branch rail set 533 to the waiting positions P2, P3. In this embodiment, two process equipments 30 are disposed at each work station 53 and located at two opposite sides of the feeding and discharging conveyor 51, in other embodiments, the number of the process equipments 30 in the work station 53 may be smaller or larger, and the disposed position is not limited to the opposite side.
The system processing device 55 receives and processes the idle signal and the completion signal, and controls the operations of the feeding and discharging conveyor 51 and the plurality of work stations 53, and the system processing device 55 can control the operations of the feeding and discharging conveyor 51 and the plurality of work stations 53 in a wired or wireless manner.
When a plurality of idle signals are generated, the delivering in step S15 sequentially delivers the substrates 40 to be tested to the processing tools 30 according to the sequence of the idle signals, i.e. the system processing device 55 controls the feeding and discharging conveyor 51 to convey the substrates 40 to be tested to the corresponding processing tools 30 according to the sequence of the idle signals, thereby completing the efficient feeding operation. Similarly, when a plurality of completion signals are generated, the substrate 40 to be tested on the processing equipment 30 is sequentially moved according to the sequence of the generation of the completion signals in the step S17, i.e. the system processing device 55 can control the in-out conveying device 51 to move the substrate 40 to be tested on the processing equipment 30 according to the sequence of the generation of the received completion signals, thereby completing the efficient discharging operation. In the embodiment, the system processing device 55 determines the order of transporting and carrying the substrates 40 according to the time sequence of idle signals or completion signals generated by the process equipment 30, but in other embodiments, the system processing device 55 may arrange the transporting and carrying order according to other methods, such as the order of actually receiving signals or the priority of the process equipment.
Further, in the present invention, the transportation in step S15 is divided into two operations, the first operation is to send the substrate 40 to be tested from the feeding position P1 to the waiting positions P2 and P3, and the second operation is to move the processing equipment 30 to the waiting positions P2 and P3 to receive the substrate 40 to be tested, and the sequence of these two operations can be changed. Similarly, the transportation in step S17 is also divided into two operations, the first operation is to move the process equipment 30 back to the waiting positions P2 and P3 along the branch rail group 533, and the second operation is to transfer the substrate 40 to be tested on the process equipment 30 to the discharging position P4.
As shown in fig. 5 and 6, the conveying in step S15 and the conveying in step S17 are different from the above-described embodiments, and this difference is mainly due to the difference in the arrangement of the feeding and discharging conveying device and the station mechanism, and therefore, those skilled in the art can understand that the difference in the arrangement of the mechanism changes the conveying and conveying operation. In this embodiment, the in-line conveyor system 70 includes a feeding and discharging conveyor 71, two stations 73, and a system handling device 75. The in-and-out transfer device 71 is connected in series with the two work stations 73, and the process equipment 30 is provided in the two work stations 73. The system processing device 75 receives and processes the idle signal and the completion signal, and controls the operations of the incoming and outgoing transport device 71 and the work station.
The in-out transfer device 71 includes a linear slide 711 and two loading stages 713. The two loading platforms 713 are connected to the linear slide 711 and are movable along the linear slide 711. The stage 731 may fix the substrate 40 to be tested by air floating, clamping or other mechanical fixing methods to safely transport the substrate 40 to be tested.
The workstation 73 includes a frame 731, a branch rail set 733, and a transfer stage 735. The linear slide 711 passes through the frame 731. A set of spur rails 733 connects to the frame 731. The transfer table 735 is connected to the branch rail group 733, and is capable of vertical (Z-axis) and horizontal (Y-axis) movement along the arrangement of the branch rail group 733. In other embodiments, the branch rail set 733 may be a multi-axis robot or other moving mechanism, and is coupled to the transfer stage 735 for transferring and transferring the substrate 40 to be tested.
In this embodiment, the transportation in step S15 is performed by the loading stage 713 by transporting the substrate 40 to be tested from the feeding position P1 to the waiting positions P2 and P3, and then by the transporting stage 735 by transporting the substrate 40 to be tested to the corresponding processing equipment 30. The conveyance in step S17 is to carry the substrate 40 to be tested on the process equipment 30 back to the waiting positions P2 and P3 and to convey the substrate 40 to be tested from the waiting positions P2 and P3 to the unloading position P4, which means that the conveyance stage 735 can return the substrate 40 to be tested on the process equipment 30 to the stage 713 in the waiting positions P2 and P3, and then the stage 713 carries the substrate 40 to be tested to the unloading position P4.
Further, the conveyance in step S15 and the conveyance in step S17 further include rotating the substrate 40 to be tested horizontally (XY axis) to turn the substrate 40 to be tested.
In other embodiments, the transportation in step S15 and the transportation in step S17 can be performed by fewer or more operations, such as transportation and transportation of the substrate 40 by a multi-axis robot, and transportation of the substrate 40 by other arrangements of the stroke directions.
Therefore, the acquisition, transportation and transportation in the automatic operation method of the present invention are not limited to the two tandem type transportation systems described in this embodiment, and in other embodiments, the acquisition, transportation and transportation may be configured by other mechanisms to achieve various operations.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims (10)

1. An automated operation method of a semiconductor process, comprising the steps of:
providing a plurality of process devices, wherein the plurality of process devices carry out the same process operation;
obtaining a substrate to be tested from a feeding position according to idle signals of the plurality of process equipment;
conveying the substrate to be tested to the process equipment which generates the idle signal in the plurality of process equipment, and executing the process operation after the process equipment receives the substrate to be tested; and
according to the completion signals of the plurality of process equipment, the substrate to be tested is conveyed to a discharging position from the process equipment generating the completion signals, so that the process equipment generates the idle signals again.
2. The method of claim 1, wherein the delivering sequentially delivers the substrates to be tested to the plurality of processing tools according to a sequence in which the idle signals are generated.
3. The method of claim 1, wherein the moving step moves the target substrates sequentially according to the order of the completion signals.
4. The method of claim 1, wherein transporting comprises transporting the substrate to be tested from the loading position to at least one waiting position, and the plurality of processing tools are moved to the at least one waiting position to receive the substrate to be tested.
5. The method of claim 4, wherein the transporting comprises moving the processing tool back to the at least one waiting position and transporting the substrate to be tested on the processing tool to the outfeed position.
6. The method of claim 1, wherein transporting comprises transporting the substrate to be tested from the loading position to at least one waiting position, and then transporting the substrate to be tested to the corresponding processing tool.
7. The method of claim 6, wherein the transporting comprises returning the target substrate to the at least one waiting position and transferring the target substrate from the at least one waiting position to the unloading position.
8. The method of claim 1, wherein the obtaining, transporting and removing comprises rotating the substrate horizontally.
9. The method of claim 1 or 8, wherein the obtaining, transporting and transporting are performed by a serial transporting system, the serial transporting system comprises a feeding and discharging transporting device, a plurality of work stations and a system processing device, the feeding and discharging transporting device is connected in series with the work stations, the plurality of processing devices are disposed in the work stations, the system processing device receives and processes the idle signal and the completion signal, and controls the operation of the feeding and discharging transporting device and the work stations.
10. The method of claim 1, wherein each processing tool comprises a signal processing device and a communication device, the signal processing device is connected to the communication device and configured to process and generate the idle signal and the done signal, and the communication device receives and transmits the idle signal and the done signal.
CN201910016452.1A 2019-01-08 2019-01-08 Automatic operation method of semiconductor process Pending CN111415879A (en)

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Application Number Priority Date Filing Date Title
CN201910016452.1A CN111415879A (en) 2019-01-08 2019-01-08 Automatic operation method of semiconductor process

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Application Number Priority Date Filing Date Title
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07227743A (en) * 1994-02-18 1995-08-29 Hitachi Ltd Production management system
JPH11284053A (en) * 1998-03-13 1999-10-15 Samsung Electronics Co Ltd System and method for wafer cassette carrying
CN100436292C (en) * 2004-11-04 2008-11-26 台湾积体电路制造股份有限公司 Wafer carrier transport management method and system thereof
JP2009283980A (en) * 2009-08-27 2009-12-03 Dainippon Screen Mfg Co Ltd Substrate processor
JP2010152577A (en) * 2008-12-25 2010-07-08 Kanto Auto Works Ltd Production system
TW201133689A (en) * 2009-12-24 2011-10-01 Ulvac Inc Method of operating vacuum apparatus
TW201209952A (en) * 2010-08-20 2012-03-01 Chroma Ate Inc Inspection machine for semiconductor component with single penetrating transport shuttle
KR101469194B1 (en) * 2013-07-12 2014-12-09 피에스케이 주식회사 Apparatus and method for self diagnosis of semiconductor manufacturing equipment
US20160370797A1 (en) * 2015-06-16 2016-12-22 Kla-Tencor Corporation System and Method for Monitoring Parameters of a Semiconductor Factory Automation System
TWM568494U (en) * 2018-07-20 2018-10-11 東捷科技股份有限公司 Workstation for transferring semiconductor substrates

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07227743A (en) * 1994-02-18 1995-08-29 Hitachi Ltd Production management system
JPH11284053A (en) * 1998-03-13 1999-10-15 Samsung Electronics Co Ltd System and method for wafer cassette carrying
CN100436292C (en) * 2004-11-04 2008-11-26 台湾积体电路制造股份有限公司 Wafer carrier transport management method and system thereof
JP2010152577A (en) * 2008-12-25 2010-07-08 Kanto Auto Works Ltd Production system
JP2009283980A (en) * 2009-08-27 2009-12-03 Dainippon Screen Mfg Co Ltd Substrate processor
TW201133689A (en) * 2009-12-24 2011-10-01 Ulvac Inc Method of operating vacuum apparatus
TW201209952A (en) * 2010-08-20 2012-03-01 Chroma Ate Inc Inspection machine for semiconductor component with single penetrating transport shuttle
KR101469194B1 (en) * 2013-07-12 2014-12-09 피에스케이 주식회사 Apparatus and method for self diagnosis of semiconductor manufacturing equipment
US20160370797A1 (en) * 2015-06-16 2016-12-22 Kla-Tencor Corporation System and Method for Monitoring Parameters of a Semiconductor Factory Automation System
TWM568494U (en) * 2018-07-20 2018-10-11 東捷科技股份有限公司 Workstation for transferring semiconductor substrates

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Application publication date: 20200714