CN111349400A - Double-layer adhesive film for electronic element manufacturing process, multilayer pressure-sensitive adhesive composite film and preparation method thereof - Google Patents
Double-layer adhesive film for electronic element manufacturing process, multilayer pressure-sensitive adhesive composite film and preparation method thereof Download PDFInfo
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- CN111349400A CN111349400A CN201811573234.XA CN201811573234A CN111349400A CN 111349400 A CN111349400 A CN 111349400A CN 201811573234 A CN201811573234 A CN 201811573234A CN 111349400 A CN111349400 A CN 111349400A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention relates to a double-layer adhesive film for manufacturing an electronic element, which is characterized in that the double-layer adhesive film can be adhered to a supporting carrier and a base material for placing the electronic element; the double-layer adhesive film comprises a first adhesive layer and a second adhesive layer, wherein the adhesive force A of the first adhesive layer to the base material is 30-100 gf/inch, and the ratio of the adhesive force B to the adhesive force A of the second adhesive layer to the supporting carrier is greater than 3.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to a multi-layer pressure-sensitive adhesive composite film for electronic element manufacture process
In particular, it relates to an innovative composite film which can effectively reduce the manufacturing cost for the electronic device manufacturing process
This and can provide production efficiency.
[ background of the invention ]
With the rapid advance of semiconductor technology, electronic devices are becoming smaller and faster, and Flexible Electronics (Flexible Electronics) technology, which can maintain high performance and provide flexibility to electronic devices, is the most attractive new technology in the next generation. Flexible electronics has a great potential for development, not only being expected to create entirely new products, but also potentially bringing new applications that were previously considered impractical or impossible to achieve.
For example, the current flat panel display uses a thick and fragile glass substrate, and the use of a flexible plastic substrate instead of glass has become the best solution due to the thin and flexible considerations. In addition, the flexible plastic substrate has the potential of roll-to-roll selection in the manufacturing process, so that the production efficiency can be greatly improved, and the cost can be effectively reduced. However, due to the limitations of the existing process capability and equipment, the flexible display is still manufactured in a sheet-to-sheet manner. That is, the flexible plastic substrate is fixed on a support carrier (e.g., glass) and then subjected to a back-end process, and after the process is completed, the device is removed from the support carrier, thereby obtaining the plastic flexible substrate display.
For example, in the conventional high-end semiconductor IC package, especially the IC stacking package technology, the IC is first mounted on a carrier (e.g. steel plate or glass) and then a series of processes such as packaging, polishing, cleaning, wiring and stacking chips are performed. Finally, the packaged IC is then removed from the carrier.
A method for separating a flexible substrate or an IC from a supporting carrier is known, which employs a laser to peel off, however, the laser peeling method will cause the flexible substrate and the integrated circuit thereon to be damaged due to thermal expansion caused by thermal effect, and the cost of the laser equipment is high, which causes a considerable burden to the cost expenditure of the practitioner.
[ summary of the invention ]
The invention provides a double-layer adhesive film for electronic element manufacturing process, which is characterized in that the double-layer adhesive film can be adhered to a supporting carrier and a base material for placing electronic elements;
wherein the content of the first and second substances,
the double-layer adhesive film is provided with a first adhesive layer and a second adhesive layer,
the first adhesive layer has an adhesive force A of 30 to 100gf/inch to the substrate,
the ratio of the adhesive force B and the adhesive force A of the second adhesive layer to the supporting carrier is more than 3.
Further, the adhesion A of the first adhesive layer to the substrate is 58 to 85 gf/inch; the ratio of B to A is preferably 3.1-7.4.
Specifically, the double-layer adhesive film is prepared by adding an isocyanate crosslinking agent into acrylic adhesive.
Furthermore, the thickness of the first adhesion layer and the thickness of the second adhesion layer are both 20-50 micrometers, preferably 35-45 micrometers, and more preferably 40 micrometers.
The invention also provides an adhesive film for manufacturing electronic components, which is characterized by comprising any one of the double-layer adhesive films and coating films distributed on two sides of the double-layer adhesive film, wherein the coating films are preferably PET release films.
The present invention also provides a multilayer pressure-sensitive composite film, characterized in that it comprises: the electronic component comprises a supporting carrier, a base material for placing the electronic component, and any one of the double-layer adhesive films adhered to the base material and the supporting carrier.
Preferably, the substrate is selected from polyimide films; the support carrier is selected from glass.
The invention also provides a preparation method of the adhesive film, which is characterized by comprising the following steps:
coating a first adhesive layer having an adhesive force A of 30 to 100gf/inch to a substrate on a coating film;
coating a second adhesive layer with the adhesive force B to the support carrier on another coating film, wherein the ratio of B to A is more than 3;
and attaching the first adhesive layer and the second adhesive layer on the two coating films.
The invention also provides a preparation method of the multilayer pressure-sensitive composite film, which is characterized by comprising the following steps:
coating a first adhesive layer having an adhesive force A of 30 to 100gf/inch to a substrate on a coating film;
coating a second adhesive layer with the adhesive force B to the support carrier on another coating film, wherein the ratio of B to A is more than 3;
the first adhesion layer and the second adhesion layer on the two coating films are attached to each other to obtain an adhesion film;
tearing off the coating film of the first adhesion layer on the adhesive film, and then attaching the coating film to a substrate with an electronic element to obtain a substrate composite film with the electronic element;
and tearing off the coating film of the first adhesion layer of the base material composite film with the electronic element, and then attaching the coating film to a support carrier.
The invention also provides a substrate separation method for electronic element manufacturing process by using the adhesive film, which is characterized by comprising the following steps:
tearing off the coating film of the first adhesion layer on the adhesive film, and then attaching the coating film to a substrate with an electronic element to obtain a substrate composite film with the electronic element;
tearing off the coating film of the first adhesion layer of the base material composite film with the electronic element, and then attaching the coating film to a support carrier to obtain a multilayer pressure-sensitive composite film;
and baking the multilayer pressure-sensitive composite film, cooling and placing at room temperature, and then taking down the substrate with the electronic element from the first adhesion layer.
After the electronic device is cooled to room temperature after completing the high temperature process, the substrate can be separated from the supporting carrier.
[ description of the drawings ]
FIG. 1 is a first schematic view of a multi-layer PSA composite film for electronic device fabrication according to the present invention.
FIG. 2 is a second schematic view of a multi-layer PSA composite film for electronic device fabrication according to the present invention.
FIG. 3 is a third schematic view of a multi-layer PSA composite film for electronic device fabrication according to the present invention.
FIG. 4 is a fourth schematic view of a multi-layer PSA composite film for electronic device fabrication according to the present invention.
FIG. 5 is a fifth schematic view of a multi-layer PSA composite film for electronic device fabrication according to the present invention.
In fig. 1 to 5, the symbols are illustrated as follows:
[ detailed description ] embodiments
Referring to fig. 1, a first schematic view of a multi-layer glue-sensing composite film for electronic device manufacturing process according to the present invention includes: a substrate 10, which may be a polyimide film or other electronic device packaging carrier, for placing an electronic device 12; and a double-layered pressure sensitive adhesive sheet 14 having a first adhesive layer 141 and a second adhesive layer 142, wherein the first adhesive layer 141 is adhered to the substrate 10, and the adhesive force A is 30 to 100gf/inch after the substrate is returned to room temperature by the high temperature process; and a supporting carrier 16, which can be glass, adhered on the second adhesive layer 141 and having an adhesive force B, wherein the ratio of the adhesive force B to A is greater than 3.
Referring to fig. 2, after the electronic device 12 is placed on the substrate 10 and the high temperature process is returned to room temperature, the substrate 10 can be peeled off from the first adhesive layer 141, so that the electronic device 12 is formed on the substrate 10.
Further, referring to fig. 3, in the present embodiment, the first adhesive layer 141 is formed by coating an acrylic glue on a PET release film 18 by a doctor blade coating method, baking at 60 ℃, and finally drying to obtain a first adhesive layer 141 with a thickness of 40 μm; in the embodiment, the second adhesive layer 142 is formed by coating the acrylic glue on another PET release film 20 by a doctor blade in the same manner, and then drying the coated acrylic glue, thereby obtaining a second adhesive layer 142 with a thickness of about 40 μm; finally, the first adhesive layer 141 and the second adhesive layer 142 on the PET release films 18 and 20 are attached to each other to obtain the double-layered adhesive sheet 14. The adhesion force of the adhesive sheet can be controlled by the glass transition temperature and the reaction crosslinking density of the acrylic adhesive.
Referring to fig. 4, after the PET release film on the first adhesive layer 141 is peeled off, the PET release film is attached to the substrate 10 having the electronic element 12, so as to obtain the substrate composite film having the electronic element 12.
Referring to fig. 5, the PET release film on the second adhesive layer 142 of the substrate composite film with electronic components 12 is peeled off and attached to the supporting carrier 16, and finally the size of the sample is about 20 × 20 cm.
And then, placing the sample in an oven at 180 ℃ for baking for 4 hours, taking out the sample, cooling the sample to room temperature, and then taking down the substrate 10 with the electronic element 12 from the first adhesion layer 141. The magnitude of the adhesion was measured by measuring the 180 degree peel force according to the ASTM-D3330 method.
< example 1>
Preparing a first adhesive layer 141 by adding about 3.0% isocyanate cross-linking agent into an acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is prepared into a second adhesive layer 142 by adding about 0.5% of isocyanate cross-linking agent; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-mentioned implementation method was 100gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 142 to the support carrier 16 was 320 gf/inch. The ratio of the adhesive force B to A (B/A) was 3.1.
< example 2>
Preparing a first adhesive layer 141 by adding about 4.0% of isocyanate cross-linking agent into acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is prepared into a second adhesive layer 142 by adding about 0.3% of isocyanate cross-linking agent; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-described method was 58gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 142 to the support carrier 16 was 430 gf/inch. The ratio (B/A) of the two release forces was 7.4.
< example 3>
Preparing a first adhesive layer 141 by adding about 3.5% isocyanate cross-linking agent into an acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is prepared into a second adhesive layer 142 by adding about 0.5% of isocyanate cross-linking agent; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-mentioned implementation method was 85gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 142 to the support carrier 16 was 320 gf/inch. The ratio (B/A) of the two release forces was 3.8.
< comparative example 1>
Preparing a first adhesive layer 141 by adding 3.2% isocyanate cross-linking agent into an acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is prepared into a second adhesive layer 142 by adding about 1.0% of isocyanate cross-linking agent; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-mentioned implementation method was 95gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 141 to the support carrier 16 was 200 gf/inch. The ratio (B/A) of the two release forces was 2.1.
< comparative example 2>
Preparing a first adhesive layer 141 by adding about 6.0% isocyanate cross-linking agent into an acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is prepared into a second adhesive layer 142 by adding about 0.5% of isocyanate cross-linking agent; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-mentioned implementation method was 20gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 142 to the support carrier 16 was 310 gf/inch. The ratio (B/A) of the two release forces was 15.5.
< comparative example 3>
Preparing a first adhesive layer 141 by adding about 2.5% isocyanate cross-linking agent into an acrylic adhesive with a glass transition temperature of-40 ℃; the acrylic adhesive is added with about 0.3% isocyanate cross-linking agent to prepare a second adhesive layer 142; further, the adhesion force (A) of the first adhesive layer 141 to the substrate 10 measured after the above-described implementation method was 130gf/inch, and the adhesion force (B) (gf/inch) of the second adhesive layer 142 to the support carrier 16 was 430 gf/inch. The ratio (B/A) of the two release forces was 3.3.
Test results
The foregoing description of specific embodiments is provided for the purpose of illustrating the invention in detail, however, these embodiments are for the purpose of illustration only and are not intended to be limiting of the invention. It will be appreciated by those skilled in the art that the present invention may be practiced without departing from the scope of the appended claims. Various changes or modifications may be made which are intended to be part of this disclosure.
Claims (10)
1. A double-layer adhesive film for electronic element process is characterized in that the double-layer adhesive film can be adhered to a supporting carrier and a base material for placing electronic elements; wherein the content of the first and second substances,
the double-layer adhesive film is provided with a first adhesive layer and a second adhesive layer,
the first adhesive layer has an adhesive force A of 30 to 100gf/inch to the substrate,
the ratio of the adhesive force B and the adhesive force A of the second adhesive layer to the supporting carrier is more than 3.
2. The double-layered adhesive sheet according to claim 1, wherein the first adhesive layer has an adhesive force A of 58 to 85gf/inch to the substrate; the ratio of B to A is 3.1-7.4.
3. The double-layered adhesive sheet according to claim 2, wherein the double-layered adhesive sheet is prepared by adding an isocyanate crosslinking agent to an acryl adhesive.
4. The double-layered adhesive sheet according to any one of claims 1 to 3, wherein the first and second adhesive layers each have a thickness of 20 to 50 micrometers, preferably 35 to 45 micrometers, and more preferably 40 micrometers.
5. An adhesive sheet for electronic component manufacturing process, characterized in that the adhesive sheet comprises the double-layer adhesive sheet according to any one of claims 1 to 4, and a coating film disposed on both sides of the double-layer adhesive sheet, wherein the coating film is preferably a PET release film.
6. A multilayer pressure sensitive composite film, comprising: a support carrier, a substrate for placing the electronic component, and the double-layered adhesive sheet according to any one of claims 1 to 4 adhered to the substrate and the support carrier.
7. The multilayer pressure sensitive composite film of claim 6, wherein the substrate is selected from the group consisting of polyimide films; the support carrier is selected from glass.
8. The method for preparing an adhesive sheet according to claim 5, which comprises:
coating a first adhesive layer having an adhesive force A of 30 to 100gf/inch to a substrate on a coating film;
coating a second adhesive layer with the adhesive force B to the support carrier on another coating film, wherein the ratio of B to A is more than 3;
and attaching the first adhesive layer and the second adhesive layer on the two coating films.
9. A method of making a multilayer pressure sensitive composite film according to claim 6 or 7, comprising the steps of:
coating a first adhesive layer having an adhesive force A of 30 to 100gf/inch to a substrate on a coating film;
coating a second adhesive layer with the adhesive force B to the support carrier on another coating film, wherein the ratio of B to A is more than 3;
the first adhesion layer and the second adhesion layer on the two coating films are attached to each other to obtain an adhesion film;
tearing off the coating film of the first adhesion layer on the adhesive film, and then attaching the coating film to a substrate with an electronic element to obtain a substrate composite film with the electronic element;
and tearing off the coating film of the first adhesion layer of the base material composite film with the electronic element, and then attaching the coating film to a support carrier.
10. A method for separating a substrate in an electronic device manufacturing process using the adhesive sheet according to claim 5, comprising the steps of:
tearing off the coating film of the first adhesion layer on the adhesive film, and then attaching the coating film to a substrate with an electronic element to obtain a substrate composite film with the electronic element;
tearing off the coating film of the first adhesion layer of the base material composite film with the electronic element, and then attaching the coating film to a support carrier to obtain a multilayer pressure-sensitive composite film;
and baking the multilayer pressure-sensitive composite film, cooling and placing at room temperature, and then taking down the substrate with the electronic element from the first adhesion layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811573234.XA CN111349400A (en) | 2018-12-21 | 2018-12-21 | Double-layer adhesive film for electronic element manufacturing process, multilayer pressure-sensitive adhesive composite film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811573234.XA CN111349400A (en) | 2018-12-21 | 2018-12-21 | Double-layer adhesive film for electronic element manufacturing process, multilayer pressure-sensitive adhesive composite film and preparation method thereof |
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| CN111349400A true CN111349400A (en) | 2020-06-30 |
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| CN201811573234.XA Pending CN111349400A (en) | 2018-12-21 | 2018-12-21 | Double-layer adhesive film for electronic element manufacturing process, multilayer pressure-sensitive adhesive composite film and preparation method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM525356U (en) * | 2015-12-01 | 2016-07-11 | Chien-Lin Wu | Double-sided tape structure improvement |
| US20170062380A1 (en) * | 2014-05-13 | 2017-03-02 | Arizona Board of Regents, a body Corporate of the State of Arizona, Acting for and on Behalf of Ariz | Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
| CN207458891U (en) * | 2017-09-21 | 2018-06-05 | 达迈科技股份有限公司 | For the clear polyimides composite membrane of flexible display |
-
2018
- 2018-12-21 CN CN201811573234.XA patent/CN111349400A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170062380A1 (en) * | 2014-05-13 | 2017-03-02 | Arizona Board of Regents, a body Corporate of the State of Arizona, Acting for and on Behalf of Ariz | Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
| TWM525356U (en) * | 2015-12-01 | 2016-07-11 | Chien-Lin Wu | Double-sided tape structure improvement |
| CN207458891U (en) * | 2017-09-21 | 2018-06-05 | 达迈科技股份有限公司 | For the clear polyimides composite membrane of flexible display |
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Application publication date: 20200630 |
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