CN111314531B

CN111314531B - Electronic equipment and shell assembly thereof

Info

Publication number: CN111314531B
Application number: CN202010085312.2A
Authority: CN
Inventors: 代晓峰
Original assignee: Oppo Chongqing Intelligent Technology Co Ltd
Current assignee: Oppo Chongqing Intelligent Technology Co Ltd
Priority date: 2020-02-10
Filing date: 2020-02-10
Publication date: 2021-12-14
Anticipated expiration: 2040-02-10
Also published as: CN111314531A

Abstract

The application relates to an electronic equipment and a shell assembly thereof, wherein the shell assembly comprises a middle frame and a fixing frame. The middle frame is provided with an accommodating space for accommodating electronic elements of the electronic equipment. The center is equipped with in the periphery wall that deviates from accommodating space and holds gluey groove, holds gluey groove and is used for holding the binder. And the fixing frame is arranged on one side of the middle frame, which is deviated from the accommodating space, and is connected with the middle frame through a bonding agent in the glue accommodating groove. According to the electronic equipment, the middle frame is used for forming physical structure isolation between the electronic element and the fixing frame, so that the influence of the size error of the fixing frame or the volume size of the adhesive on the electronic element in the electronic equipment can be avoided, and the electronic element is particularly prevented from being extruded improperly.

Description

Electronic equipment and shell assembly thereof

Technical Field

The present application relates to the field of communications devices, and in particular, to an electronic device and a housing assembly thereof.

Background

With the continuous development of electronic technology, electronic devices such as smart phones or tablet computers have become electronic devices commonly used by users. At present, most of the housing assemblies of electronic devices adopt a structure in which a rear housing, a frame and a middle frame plate are combined, and the display screens of the electronic devices are usually stacked on the middle frame plate. Meanwhile, the electronic device defines the installation position of the display screen through the middle frame plate and the decoration ring matched with the middle frame plate, for example, the decoration ring is usually circumferentially overlapped on the surface of the middle frame plate and is bonded and combined with the middle frame plate through glue, so that the decoration ring can protect the display screen while playing a decoration role. However, such a display screen mounting structure causes a problem: when the size of decorating the circle is controlled to be inaccurate inadequately, or glue is more, decorate partial structure of circle or too much glue can be towards the direction protrusion of display screen, causes the extrusion to the display screen, can seriously influence the quality and the life-span of display screen.

Disclosure of Invention

The embodiment of the application provides electronic equipment and a shell assembly thereof, which can effectively position electronic elements of the electronic equipment and protect the electronic elements from being extruded.

The embodiment of the application provides an electronic equipment's casing subassembly, includes center and fixed frame. The middle frame is provided with an accommodating space for accommodating electronic elements of the electronic equipment. The center is equipped with in the periphery wall that deviates from accommodating space and holds gluey groove, holds gluey groove and is used for holding the binder. And the fixing frame is arranged on one side of the middle frame, which is deviated from the accommodating space, and is connected with the middle frame through a bonding agent in the glue accommodating groove.

The embodiment of the application further provides an electronic device, which comprises a display screen assembly and the shell assembly, wherein the display screen assembly is arranged in the accommodating space.

In the electronic equipment that this application embodiment provided, its casing subassembly forms the accommodating space who is used for acceping electronic component through the center, so that fix a position installation electronic component, and fixed frame then sets up in the one side that the center deviates from this accommodating space, and the binder between fixed frame and the center also is arranged in the glue containing groove who deviates from this accommodating space, so, form the physical structure isolation between electronic component and the fixed frame through utilizing the center, can avoid the dimensional error of fixed frame or the volume size of binder to influence the inside electronic component of electronic equipment, especially avoid electronic component to receive improper extrusion.

Drawings

In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present application.

Fig. 2 is a perspective exploded view of the electronic device shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of a middle frame structure of the electronic device shown in fig. 2.

Fig. 4 is an enlarged schematic view of region IV of the middle frame structure shown in fig. 3.

Fig. 5 is a partially enlarged schematic view of the middle frame structure shown in fig. 4.

Fig. 6 is a schematic perspective cross-sectional view of the mid-frame structure shown in fig. 2.

Fig. 7 is an enlarged schematic view of a region VII of the bezel structure of the electronic device shown in fig. 6.

Fig. 8 is a schematic diagram of a hardware environment of an electronic device provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

As used in embodiments herein, "electronic device" includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of electronic devices include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

Referring to fig. 1, an electronic device 200 is provided in the present embodiment, where the electronic device 200 may be, but is not limited to, an electronic device such as a mobile phone, a tablet computer, and a smart watch. The electronic device 200 of the present embodiment is described by taking a mobile phone as an example. The electronic device 200 includes a housing assembly 100 and a display screen assembly 201 disposed on the housing assembly 100.

The housing assembly 100 is used for installing the display screen assembly 201 and for accommodating electronic components of the electronic device 200, and the specific structural form of the housing assembly 100 is not limited. Referring to fig. 2 and 3, in the illustrated embodiment, the housing assembly 100 includes a rear housing 10, a middle frame 30, an outer frame 50, and a fixing frame 70. The middle frame 30 is used for bearing the display screen assembly 201, and the rear shell 10 is arranged on one side of the middle frame 30, which faces away from the display screen assembly 201, and is connected with the middle frame 30. The outer frame 50 is disposed around the outer circumference of the middle frame 30 and is used to form a frame of the electronic device 200. The fixing frame 70 is connected to the middle frame 30 and surrounds the periphery of the display screen assembly 201, and the fixing frame 70 is used for fixing the middle frame 30 and the display screen assembly 201 and can be used as a decorative ring on the periphery of the display screen assembly 201 to improve the layering of the appearance of the electronic device 200.

It should be understood that the bezel of the electronic device 200 refers to a side portion of the electronic device 200 in the thickness direction, and the bezel forms the appearance of the electronic device 200 together with the rear case (e.g., the rear case 10) and the front side surface (e.g., the display screen assembly 201) of the electronic device 200. The bezel of the electronic device 200 may be an integral structure with the front surface, an integral structure with the rear housing 10, or a separate bezel, and the specific structure thereof is not limited herein. In the illustrated embodiment, the middle frame 30, the rear case 10, and the outer frame 50 are assembled together. In other embodiments, the outer frame 50 may be omitted, and the structure of the middle frame 30 is directly used as the frame of the electronic device 200, or the outer frame 50 and the middle frame 30 may be considered to be formed by integrally molding, and the description of the structural modification of the specific housing assembly 100 is omitted here.

Further, referring to fig. 4, the middle frame 30 is provided with an accommodating space 320, and the accommodating space 320 is used for accommodating electronic components of the electronic device 200 and the display screen assembly 201. The outer peripheral wall of the middle frame 30 departing from the accommodating space 320 is provided with a glue containing groove 31, and the glue containing groove 31 is used for containing a bonding agent. The fixing frame 70 is disposed on a side of the middle frame 30 away from the accommodating space 320, and is connected to the middle frame 30 through an adhesive in the adhesive accommodating groove 31. In the embodiment of the present application, the middle frame 30 is used to form the accommodating space 320 for positioning and installing the electronic component, the fixing frame 70 is disposed away from the accommodating space 320, and the adhesive between the fixing frame 70 and the middle frame 30 is also located in the adhesive accommodating groove 31 away from the accommodating space 320, so that the middle frame 30 is used to form physical structure isolation between the electronic component and the fixing frame 70, which can prevent the dimensional error of the fixing frame 70 or the volume size of the adhesive from affecting the electronic component and the display screen assembly 201 inside the electronic device 200, and especially prevent the electronic component and the display screen assembly 201 from being improperly squeezed.

In the embodiment of the present application, the middle frame 30 includes a frame body 32 and a middle frame plate 34. The frame 32 has a substantially annular structure and forms an accommodating space 320, and the middle frame 34 is disposed in the accommodating space 320 and is fitted to the frame 32. The fitting structure between the middle frame plate 34 and the frame body 32 is not limited. For example, in the present embodiment, the frame body 32 may be provided with a fitting groove (not shown), and the middle frame plate 34 may be provided with a fitting portion (not shown), so that the fitting groove and the fitting portion are fitted into each other, thereby enhancing the bonding strength between the middle frame plate 34 and the frame body 32.

In the present embodiment, the middle frame plate 34 and the frame body 32 are made of different materials. Further, the frame 32 is made of a non-metal material, and the middle frame plate 34 is made of a metal material, which are combined through nano injection molding to form a middle frame structure of the electronic device 200. By using metal and nonmetal as the raw materials for the middle frame plate 34 and the frame body 32, the middle frame 30 can have high structural strength while ensuring light weight, and the shock and fall resistance of the electronic device 100 can be improved by the nonmetal characteristics of the frame body 32. Further, the material of the frame 32 may include, but is not limited to, any one or a combination of plastics, resins, and rubbers, and the material of the middle frame plate 34 may include, but is not limited to, any one or a combination of the following materials: iron, steel, stainless steel, copper, phosphor copper, red copper, beryllium copper, nickel copper alloy, magnesium aluminum alloy, magnesium alloy, and the like.

Further, referring to fig. 5, the frame 32 includes a covering portion 321 and a carrying portion 323, and the covering portion 321 and the carrying portion 323 are combined into an integrally formed frame-shaped structure. The covering portion 323 covers one side of the middle frame plate 34 to reinforce the connection strength between the frame body 32 and the middle frame plate 34. The bearing part 323 surrounds and forms a screen cabin 3210 for accommodating the display screen assembly 201, and the screen cabin 3210 is used for installing the display screen assembly 201. Furthermore, the bearing part 323 is connected to the covering part 323 and protrudes relative to the covering part 323, and the adjacent parts of the bearing part 323 and the covering part 323 form the glue containing groove 31 together, so that the glue containing groove 31 and the screen cabin 3210 are respectively located at two sides of the bearing part 323, which can prevent the display screen assembly 201 from being extruded after the adhesive in the glue containing groove 31 is cured.

In the embodiment of the present application, the glue containing groove 31 is a recessed structure located on the outer peripheral wall of the frame 32, and the specific structure is not limited. For example, in the embodiment shown in fig. 5, the glue-receiving groove 31 is substantially a V-groove structure. Specifically, the covering portion 321 includes a first adhesive surface 3211, and the bearing portion 323 is connected to the first adhesive surface 3211. The bearing part 323 comprises a second gluing surface 3231 departing from the screen cabin 3210, and the second gluing surface 3231 is adjacent to the first gluing surface 3211, and the two glue surfaces intersect to form a glue containing groove 31. In some embodiments, the second adhesive surface 3231 and the first adhesive surface 3211 may have a definite intersection line therebetween, or both may be smoothly overconnected. Further, in this embodiment, the second adhesive surface 3231 and the first adhesive surface 3211 are both planar surfaces, and an included angle therebetween is a right angle, and at this time, the glue containing groove 31 is a right-angled V-shaped groove, so that the middle frame 30, the outer frame 50, and the fixing frame 70 can be conveniently assembled in a matching manner. In other embodiments, the glue receiving groove 31 may have other structures, such as a groove with a curved bottom, a square groove, and the like, and correspondingly, the second gluing surface 3231 and the first gluing surface 3211 may also be curved surfaces or bent surfaces, and the description thereof is omitted.

When the adhesive needs to be coated in the adhesive accommodating groove 31, the whole middle frame 30 can be inclined, so that the opening of the groove structure of the adhesive accommodating groove 31 is approximately vertically upward, and then the adhesive is coated in the adhesive accommodating groove 31 by adopting equipment such as a dispensing mechanism. Because the glue containing groove 31 is a recessed structure formed on the outer peripheral wall of the middle frame 30, it does not depend on other frame bodies or elements to be formed together with the middle frame 30, so that the problem of size matching caused by the fact that a plurality of parts form a glue containing space together can be effectively avoided, and the manufacturing and assembling costs of the shell assembly 100 are reduced.

The outer frame 50 is circumferentially disposed on the outer circumference of the covering portion 321. In the embodiment of the present application, the outer frame 50 serves as an outer frame of the electronic device 200. The outer frame 50 includes an end surface 52 substantially flush with the first adhesive surface 3211, and the end surface 52 is used for carrying the fixing frame 70 together with the first adhesive surface 3211.

The fixing frame 70 is overlapped on the covering portion 321 and corresponds to the position of the glue containing groove 31. At least a portion of the structure of the fixing frame 70 is spaced apart from the bearing part 323 so as to receive an adhesive. Further, in the present embodiment, the fixing frame 70 is overlapped on the end surface 52 of the outer frame 50 and the first engaging surface 3211, so as to form a certain limiting and fixing function on the outer frame 50 while connecting the middle frame 30. The fixing frame 70 has a stepped structure on a side facing the glue receiving groove 31 to increase a contact area between the fixing frame 70 and the adhesive, thereby improving a connection structural strength between the fixing frame 70 and the middle frame 30. Further, the stepped structure includes at least two steps. In the embodiment shown in fig. 5, the fixing frame 70 includes a first surface 72 opposite to the first adhesive surface 3211 and a second surface 74 opposite to the second adhesive surface 3231, and a step protrusion is disposed between the first surface 72 and the second surface 74. Further, the distance between the first surface 72 and the first bonding surface 3211 is greater than the height of the bearing part 323 protruding relative to the first bonding surface 3211, so that a gap is formed between one end of the fixing frame 70 away from the first bonding surface 3211 and the bearing part 323, and the gap is used for enabling the adhesive on the bearing part 323 and the adhesive in the adhesive accommodating groove 31 to be connected together, thereby providing an adhesive overflow space on one hand and increasing the surface area of the adhesive and the object to be bonded on the other hand, so as to increase the connection strength.

In this embodiment, the display screen assembly 201 may be a touch screen. Referring to fig. 2 again, the display panel assembly 201 includes a display module 2011 and a protective cover 2013, the display module 2011 is accommodated in the panel bin 3210, the protective cover 2013 is stacked on the carrying portion 323, and the protective cover 2013 and the carrying portion 323 can be connected by an adhesive, wherein the protective cover 2013 can be a touch panel.

Further, referring to fig. 5, a bearing surface 3231 is disposed at an end of the bearing portion 323 away from the wrapping portion 321, and the protective cover 2013 is stacked on the bearing surface 3231. Because the distance between the first surface 72 of the fixing frame 70 and the first gluing surface 3211 is greater than the height of the bearing part 323 protruding relative to the first gluing surface 3211, the fixing frame 70 and the end far away from the cladding part 72 protrude relative to the bearing surface 3231, so that the fixing frame 70 forms a structure surrounding the periphery of the protective cover 2013, and the protective cover 2013 can be protected and decorated to a certain extent. In the embodiment of the present application, the surface of the fixing frame 70 may be flush with the surface of the protective cover 2013, or slightly lower than the surface of the protective cover 2013, which is not limited in the present specification.

Referring to fig. 6 and 7, the carrying surface 3231 is further provided with a glue catching groove 3233, and the glue catching groove 3233 is used for accommodating an adhesive. When the protective cover 2013 is stacked on the bearing surface 3231, the adhesive is located between the protective cover 2013 and the bearing part 323, and the adhesive overflows from the gap between the fixing frame 70 and the bearing part 323 to be adhered to the adhesive in the adhesive accommodating groove 31, so that the connection strength among the fixing frame 70, the middle frame 30 and the protective cover 2013 can be improved. Further, in some embodiments, a plurality of glue grasping protrusions 3235 may be disposed in the glue grasping groove 3233, and the plurality of glue grasping protrusions 3235 are disposed in the glue containing groove 31 at intervals. By providing the glue grasping protrusion 3235, the contact area between the bearing part 323 and the adhesive can be increased, and the strength of the connecting structure can be further improved.

Referring to fig. 8, regarding the electronic device 200 provided in the embodiment of the present application, in a practical application scenario, the electronic device 200 may be used as an intelligent electronic device, such as a smartphone terminal, in which case the electronic device 200 generally further includes one or more (only one shown in the figure) processors 102, memories 104, RF (Radio Frequency) modules 106, audio circuits 110, sensors, input modules 118, and power modules 122. It will be understood by those skilled in the art that the structure shown in fig. 8 is merely illustrative and is not intended to limit the structure of the electronic device 200. For example, electronic device 200 may also include more or fewer components than shown in FIG. 8, or have a different configuration than shown in FIG. 8.

Those skilled in the art will appreciate that all other components are peripheral devices with respect to the processor 102, and that the processor 102 is coupled to the peripheral devices via a plurality of peripheral interfaces 124. The peripheral interface 124 may be implemented based on the following criteria: universal Asynchronous Receiver/Transmitter (UART), General Purpose Input/Output (GPIO), Serial Peripheral Interface (SPI), and Inter-Integrated Circuit (I2C), but the present invention is not limited to these standards. In some examples, the peripheral interface 124 may include only a bus; in other examples, peripheral interface 124 may also include other elements, such as one or more controllers, for example, a display controller for interfacing with display panel 143 or a memory controller for interfacing with memory. In addition, these controllers may be separate from the peripherals interface 124 and integrated within the processor 102 or corresponding peripherals.

The memory 104 may be used to store software programs and modules, and the processor 102 executes various functional applications and data processing by executing the software programs and modules stored in the memory 104. The memory 104 may include high speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 104 may further include memory located remotely from the processor 102, which may be connected to the electronic device 200 via a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The RF module 106 is used for receiving and transmitting electromagnetic waves, and implementing interconversion between the electromagnetic waves and electrical signals, thereby communicating with a communication network or other devices. The RF module 106 may include various existing circuit elements for performing these functions, such as an antenna, a radio frequency transceiver, a digital signal processor, an encryption/decryption chip, a Subscriber Identity Module (SIM) card, memory, and so forth. The RF module 106 may communicate with various networks such as the internet, an intranet, a wireless network, or with other devices via a wireless network. The wireless network may comprise a cellular telephone network, a wireless local area network, or a metropolitan area network. The Wireless network may use various Communication standards, protocols, and technologies, including, but not limited to, Global System for Mobile Communication (GSM), Enhanced Mobile Communication (Enhanced Data GSM Environment, EDGE), wideband Code division multiple Access (W-CDMA), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (WiFi) (e.g., IEEE802.1 a, IEEE802.11 b, IEEE802.1 g, and/or IEEE802.11 n), Voice over internet protocol (VoIP), world wide mail Access (Microwave for Wireless communications, wimax), and any other suitable protocol for instant messaging, and may even include those protocols that have not yet been developed.

The audio circuitry 110, speaker 101, sound jack 103, microphone 105 collectively provide an audio interface between a user and the electronic device 200. Specifically, audio circuitry 110 receives sound data from processor 102, converts the sound data to an electrical signal, and transmits the electrical signal to speaker 101. The speaker 101 converts the electric signal into a sound wave that can be heard by the human ear. The audio circuitry 110 also receives electrical signals from the microphone 105, converts the electrical signals to sound data, and transmits the sound data to the processor 102 for further processing. The audio data may be retrieved from the memory 104 or through the RF module 106. In addition, audio data may also be stored in the memory 104 or transmitted through the RF module 106.

Sensors are provided within the electronic device 200, examples of which include, but are not limited to: light sensors, operational sensors, pressure sensors, gravitational acceleration sensors, and other sensors.

As one of the motion sensors, the gravity acceleration sensor can detect the magnitude of acceleration in each direction (generally, three axes), detect the magnitude and direction of gravity when the electronic device is stationary, and can be used for applications (such as horizontal and vertical screen switching, related games, magnetometer attitude calibration), vibration recognition related functions (such as pedometer, tapping), and the like, for recognizing the attitude of the electronic device 200. In addition, the electronic device 200 may also be configured with other sensors such as a gyroscope, a barometer, a hygrometer and a thermometer, which are not described herein,

in this embodiment, the input module 118 may include a touch screen display 109 disposed on the display screen assembly 201, and the touch screen display 109 may collect a touch operation of the user (for example, an operation of the user on the touch screen display 109 or near the touch screen display 109 by using any suitable object or accessory such as a finger, a stylus, etc.) and drive a corresponding connection device according to a preset program. Optionally, the touch display screen 109 may include a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor 102, and can receive and execute commands sent by the processor 102. In addition, various types such as resistive, capacitive, infrared, and surface acoustic wave can be used to implement the touch detection function of the touch display screen 109. In addition to the touch display 109, in other variations, the input module 118 may include other input devices, such as keys 107. The keys 107 may include, for example, character keys for inputting characters, and control keys for triggering control functions. Examples of control buttons include a "back to home" button, a power on/off button, and the like.

The display screen assembly 201 is used to display information input by a user, information provided to the user, and various graphical user interfaces of the electronic device 200, which may be composed of graphics, text, icons, numbers, video, and any combination thereof, and in one example, the touch display screen 109 may be disposed on the display panel 143 so as to be integral with the display panel 143.

The power module 122 is used to provide a supply of power to the processor 102 and other components. In particular, power module 122 may include a power management system, one or more power sources (e.g., batteries or ac power), a charging circuit, a power failure detection circuit, an inverter, a power status indicator light, and any other components associated with the generation, management, and distribution of power for electronic device 200.

The electronic device 200 further comprises a locator 119, the locator 119 being adapted to determine the actual location where the electronic device 200 is located. In this embodiment, the locator 119 uses a positioning service to locate the electronic device 200, and the positioning service is understood to be a technology or a service for obtaining the position information (e.g., longitude and latitude coordinates) of the electronic device 200 by using a specific positioning technology and marking the position of the located object on the electronic map.

Further, referring to fig. 1 again, in some embodiments, the electronic device 200 may be a full screen electronic device, and the full screen electronic device should be understood as an electronic device with a screen ratio greater than or equal to a preset value, that is, when the display screen assembly 201 is disposed on the front surface of the housing assembly 100, a percentage of a surface area of the display screen assembly 201 to a projected area of the front surface of the housing assembly 100 is greater than or equal to the preset value. In some embodiments, the preset value of the screen ratio may be greater than or equal to 74%, such as 74%, 75%, 76%, 78%, 79%, 80%, 81%, 83%, 85%, 87%, 89%, 90%, 91%, 93%, 95%, 97%, 99%, etc. In some embodiments, the front surface of the full-screen electronic device may be provided with three or fewer physical keys, or/and the front surface of the full-screen electronic device may be provided with two or fewer openings, so as to simplify the structure of the full-screen electronic device, which is beneficial to improving the screen occupation ratio of the full-screen electronic device.

In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not necessarily depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.

Claims

1. A housing assembly for an electronic device, comprising:

the middle frame is provided with an accommodating space which is used for accommodating electronic elements of the electronic equipment; the outer peripheral wall of the middle frame, which is far away from the accommodating space, is provided with a glue accommodating groove, and the glue accommodating groove is used for accommodating a bonding agent; and

the fixing frame is arranged on one side, away from the accommodating space, of the middle frame and is connected with the middle frame through a bonding agent in the glue accommodating groove;

the middle frame comprises a coating part and a bearing part, and the bearing part is connected with the coating part and protrudes relative to the coating part; the fixing frame is overlapped on the cladding part, and at least part of the structure of the fixing frame and the bearing part are arranged at intervals; the coating part comprises a first gluing surface, and the bearing part is connected to the first gluing surface; the bearing part comprises a second gluing surface deviating from the accommodating space, and the first gluing surface is abutted with the second gluing surface to form the glue accommodating groove; the fixed frame comprises a first surface opposite to the first gluing surface and a second surface opposite to the second gluing surface, a step bulge is arranged between the first surface and the second surface, the distance between the first surface and the first gluing surface is greater than the height of the bearing part protruding relative to the first gluing surface, and a gap is formed between one end of the fixed frame, far away from the first gluing surface, and the bearing part;

a bearing surface is arranged at one end of the bearing part, which is far away from the coating part, and the bearing surface is used for bearing a protective cover plate of the electronic equipment; one end of the fixing frame, which is far away from the cladding part, protrudes relative to the bearing surface to form a structure for surrounding the periphery of the protective cover plate.

2. The housing assembly of claim 1, wherein the side of the fixing frame facing the glue receiving groove has a step structure, and the step structure comprises at least two steps.

3. The housing assembly of claim 1, further comprising an outer frame circumferentially disposed about the outer periphery of the shroud; the outer frame comprises an end face which is parallel and level to the first gluing face, and the fixing frame is overlapped on the end face and the first gluing face.

4. The housing assembly of claim 1 wherein the bearing surface has a glue grasping groove with a glue grasping protrusion disposed therein.

5. The shell assembly as claimed in any one of claims 1 to 4, wherein the middle frame further comprises a middle frame plate, and the cladding portion and the bearing portion are combined into an integrally formed frame-shaped structure which is arranged around the periphery of the middle frame plate; the material of well deckle board is metal, the material of cladding portion and the bearing part is nonmetal, cladding portion, the bearing part with well deckle board combines together through nanometer injection moulding.

6. An electronic device comprising a display screen assembly, and further comprising the housing assembly of any one of claims 1 to 5, wherein the display screen assembly is disposed in the accommodating space.

7. The electronic device of claim 6, wherein the display screen assembly comprises a display module and a protective cover plate, the display module is accommodated in the accommodating space, and the protective cover plate is stacked on the middle frame and connected with the middle frame through an adhesive.