CN111241610A - Three-dimensional modeling method, three-dimensional modeling device, computing equipment and storage medium - Google Patents
Three-dimensional modeling method, three-dimensional modeling device, computing equipment and storage medium Download PDFInfo
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Abstract
The invention discloses a three-dimensional modeling method, a three-dimensional modeling device, a computing device and a storage medium. The method comprises the following steps: acquiring first positions of one or more devices obtained on the basis of an engineering design drawing; mapping the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model; and setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model. Therefore, the equipment is positioned and modeled by using a more universal engineering design drawing, one or more pieces of equipment are modeled into the three-dimensional model with smaller workload, and the three-dimensional modeling efficiency is improved.
Description
Technical Field
The present disclosure relates to the field of three-dimensional modeling technologies, and in particular, to a three-dimensional modeling method, an apparatus, a computing device, and a storage medium.
Background
At present, three-dimensional (3D) scene display is increasingly important in the fields of smart cities, smart parks, smart buildings, and the like. Based on the 3D scene, a great number of functional designs with good user experience can be realized. For example, a user may control a device in the real physical world by operating the device in a 3D scene; when equipment in the real physical world breaks down or smoke or harmful gas is sensed and monitored, the specific position can be displayed in a 3D scene, and troubleshooting, fire rescue and the like are facilitated. Therefore, device modeling in three-dimensional scenes is also increasingly important.
The 3D scene display, while having its own advantages, brings with it some problems. For example, as the number of devices increases, modeling these devices into a 3D scene can pose a tremendous amount of effort. How to model the devices with large orders of magnitude into a 3D scene with small workload becomes a difficult problem to be solved urgently.
Disclosure of Invention
The purpose of the disclosure is to provide a more general three-dimensional modeling method and device, so as to position and model a large-order device in a three-dimensional scene display, model the device into a three-dimensional model with less workload, and improve the three-dimensional modeling efficiency.
According to a first aspect of the present disclosure, there is provided a three-dimensional modeling method including: acquiring first positions of one or more devices obtained on the basis of an engineering design drawing; mapping the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model; and setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
Optionally, the three-dimensional modeling method may further include: and according to the existing engineering design drawing and engineering information, performing layered modeling on the three-dimensional model to obtain the layers of the three-dimensional model corresponding to the engineering design drawing.
Optionally, the three-dimensional modeling method may further include: and identifying the layering of the three-dimensional model corresponding to the engineering design drawing from the engineering design drawing.
Optionally, the step of obtaining the first positions of the one or more devices obtained based on the engineering drawing includes: identifying a first location of one or more devices from an engineering drawing; or acquiring the first position from the equipment position description data which is generated by the engineering tool and corresponds to the engineering drawing.
Optionally, the step of identifying the first location of the one or more devices from the engineering drawing may include: identifying a legend for one or more devices from an engineering drawing; determining a first location of the one or more devices based on a location of the legend in the engineering drawing.
Optionally, the three-dimensional modeling method may further include: identifying device information for the one or more devices from the engineering drawing.
Optionally, the step of mapping the first position to a hierarchy in the three-dimensional model corresponding to the engineering drawing includes: setting a device tag corresponding to the one or more devices at the second location.
Optionally, the step of setting a device model corresponding to the one or more devices at the second location may comprise: and replacing the equipment marks corresponding to the one or more equipment in the hierarchy respectively by the pre-established equipment models of the one or more equipment.
Optionally, the step of setting a device model corresponding to the one or more devices at the second location further comprises: based on the device information, a device model corresponding to the one or more devices is extracted from a device model library.
Optionally, a model scale of the plant model of the one or more plants is in a predetermined ratio to a model scale of the three-dimensional model.
Optionally, the engineering design drawing is a Computer Aided Design (CAD) drawing.
Optionally, the one or more devices comprise smart devices and/or sensor devices.
According to a second aspect of the present disclosure, there is also provided a three-dimensional modeling method, including: acquiring a first position associated with one or more devices based on preset information; mapping the first location to a hierarchy in a three-dimensional model corresponding to the preset information as a second location associated with the one or more devices in the three-dimensional model; and setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
According to a third aspect of the present disclosure, there is also provided a three-dimensional modeling apparatus including: the system comprises a first position acquisition unit, a second position acquisition unit and a control unit, wherein the first position acquisition unit is used for acquiring first positions of one or more devices obtained on the basis of engineering design drawings; a mapping unit, configured to map the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model; and a device model setting unit for setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
Optionally, the three-dimensional modeling apparatus may further include: and the layered modeling unit is used for performing layered modeling on the three-dimensional model according to the existing engineering design drawing and engineering information so as to obtain the layers of the three-dimensional model corresponding to the engineering design drawing.
Optionally, the first position obtaining unit includes: a first position identification unit for identifying a first position of one or more devices from an engineering drawing; or a first position obtaining subunit, configured to, by the position obtaining unit, obtain the first position from device position description data corresponding to the engineering drawing generated by an engineering tool.
Alternatively, the first position recognition unit may include: the system comprises a legend identification unit, a legend identification unit and a control unit, wherein the legend identification unit is used for identifying legends of one or more devices from engineering design drawings; a first location identification subunit, configured to determine a first location of the one or more devices based on the location of the legend in the engineering drawing.
Optionally, the mapping unit is configured to set a device flag corresponding to the one or more devices at the second location.
Optionally, the mapping unit replaces the device labels corresponding to the one or more devices in the hierarchy with the pre-established device models of the one or more devices, respectively.
Optionally, the device model setting unit extracts a device model corresponding to the one or more devices from a device model library based on the device information.
According to a fourth aspect of the present disclosure, there is also provided a three-dimensional modeling apparatus including: a first position acquisition unit, configured to acquire a first position associated with one or more devices obtained based on preset information; a mapping unit, configured to map the first location to a hierarchy in a three-dimensional model corresponding to the preset information, as a second location associated with the one or more devices in the three-dimensional model; and a device model setting unit for setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
According to a fifth aspect of the present disclosure, there is also provided a computing device comprising: a processor; and a memory having executable code stored thereon, which when executed by the processor, causes the processor to perform the method as described above.
According to a sixth aspect of the present disclosure, there is also provided a non-transitory machine-readable storage medium having stored thereon executable code, which when executed by a processor of an electronic device, causes the processor to perform the method as described above.
Therefore, according to the technical scheme, the three-dimensional model with the built overall appearance is subjected to layered modeling and positioning and modeling of a plurality of devices by utilizing a more universal two-dimensional engineering design drawing, the devices are modeled in the three-dimensional model with smaller workload, so that the manual workload is reduced, and the three-dimensional modeling efficiency is improved.
Drawings
The above and other objects, features and advantages of the present disclosure will become more apparent by describing in greater detail exemplary embodiments thereof with reference to the attached drawings, in which like reference numerals generally represent like parts throughout.
FIG. 1 shows a schematic diagram of a three-dimensional modeling flow, according to one embodiment of the present disclosure.
FIG. 2 shows a flow diagram of a three-dimensional modeling method according to one embodiment of the present disclosure.
FIG. 3 shows a schematic flow diagram of a three-dimensional modeling method according to another embodiment of the present disclosure.
FIG. 4 shows a schematic block diagram of the structure of a three-dimensional modeling apparatus according to one embodiment of the present disclosure.
FIG. 5 shows a schematic structural diagram of a computing device according to one embodiment of the present disclosure.
Detailed Description
Preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While the preferred embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[ term interpretation ]
3D modeling: in popular terms, a model with three-dimensional data is constructed through a virtual three-dimensional space by three-dimensional manufacturing software.
CAD: computer Aided Design (Computer Aided Design) refers to the use of a Computer and its graphics equipment to assist the designer in the Design work.
BIM: namely, the Building Information Model can be translated into a Building Information Model, which is a digital expression mode for the physical and functional characteristics of a facility. The building information model is a new tool for architecture, engineering and civil engineering, is established on the basis of various relevant information data of a building engineering project serving as a model, simulates real information of a building through digital information, and has the five characteristics of visualization, coordination, simulation, optimization and graphing.
[ scheme overview ]
As mentioned above, the three-dimensional (3D) scene display not only enables the user to experience stronger immersion and substitution, but also enables the device display under many scenes (e.g., internet of things scenes) to be more vivid and specific in location, and enables the user to perceive the devices (e.g., internet of things devices) therein more clearly. Therefore, device modeling in three-dimensional scenes is also increasingly important.
Currently, the more common ways of modeling devices into 3D scenes include placement by BIM models and by manual modeling. These two modeling approaches each have their own disadvantages:
(1) and positioning the 3D equipment model based on the BIM: because of the natural building construction relevance of BIM, the BIM model has installation positions of equipment. However, since the BIM model is not a professional 3D modeling model and includes a large amount of building information and process information unrelated to 3D modeling, the model file volume of the BIM model is too large, and it is inconvenient to apply the BIM model to 3D modeling. Moreover, the BIM technology in China is still in the development stage at present, and the application is not wide enough, so that the BIM technology cannot be widely applied to 3D scene modeling.
(2) And placing based on artificial modeling: is the most primitive common means for small scene 3D modeling, and the main problems with this approach are that the workload is too large and the device positioning is not accurate enough, resulting in inefficient modeling.
In view of this, the present disclosure provides a scheme capable of performing three-dimensional modeling rapidly and accurately, which performs layered modeling on a three-dimensional model with a built overall appearance by using a more general two-dimensional engineering design drawing (e.g., a CAD drawing), and positions and models a plurality of layered devices to reduce manual workload and improve three-dimensional modeling efficiency.
The CAD drawing is a relatively common engineering design drawing, and the popularity of the CAD drawing is much higher than that of a BIM model, and as an example of the disclosure, a relatively common CAD drawing is selected as the engineering design drawing of the disclosure in the following embodiments of the disclosure to explain the three-dimensional modeling scheme of the disclosure in detail. It should be understood that the engineering drawings of the present disclosure may also be selected from other applicable relevant engineering drawings, and the present disclosure is not limited thereto.
The CAD drawing (or the file related to the drawing) comprises engineering information such as installation positions, installation standard heights and the like of various intelligent devices or sensors and the like, and two-dimensional mapping can be carried out on corresponding layers of the three-dimensional model according to the positions of the related legends of various devices in the engineering design drawing, so that the positioning and modeling of the devices in the layers of the three-dimensional model are realized, the manual workload is reduced, and the related devices can be modeled in the three-dimensional model with smaller workload. Along with the increase of the number of the equipment and when the number of the equipment reaches a certain scale, according to the technical scheme, the equipment positioning and modeling with large order of magnitude can be realized when the three-dimensional scene is built and the three-dimensional model is built, the equipment can be modeled into the three-dimensional model with small workload, the manual workload is greatly reduced, and the three-dimensional modeling efficiency is improved.
It should be understood that a hierarchy is a horizontal separation member in a three-dimensional model used to separate its three-dimensional space. For example, for a building model, a hierarchy is a floor of the building. Throughout the disclosure, reference to "layering" is a three-dimensional layered model having one or more three-dimensional layered models corresponding to one or more CAD drawings, respectively, with the layered height of the three-dimensional layered model corresponding to the engineering (e.g., construction engineering) level height. Throughout this disclosure, "layered" refers to a three-dimensional layered model.
The three-dimensional modeling scheme based on the CAD drawing of the present disclosure will be described in detail below with reference to the drawings and examples.
FIG. 1 shows a schematic diagram of an overall flow of three-dimensional modeling according to one embodiment of the present disclosure. As an example of the present disclosure, the following overall process may be implemented by a 3D modeling party, i.e., an execution subject (e.g., a design house, a constructor, a system integrator, an operator, an operation and maintenance party, etc.) having a 3D scene exhibition requirement through a predetermined 3D modeling tool, for example.
As shown in fig. 1, in step 1, the engineering design drawing is first normalized, which may include legend normalization and layer normalization, for example, so that different devices are classified and layer-divided according to the standard legend.
The engineering drawing may be any suitable engineering drawing, and particularly may be any suitable engineering drawing including a device construction drawing. As an example of the present disclosure, the engineering drawing may be a CAD drawing. The engineering design drawing can be provided by a drawing party, the drawing party can be a design institute for providing the design drawing, and the drawing party can also be a construction party for performing construction based on the design drawing.
The legend is a symbol used for representing different equipment on the drawing, is an explanation of contents and indexes represented by various symbols and colors on the drawing and is positioned at a preset position on the drawing. The legend may include dots, lines, graphics, etc., of various sizes, thicknesses, colors, etc., and may have a single layer (e.g., 0 layers). The legend can have double tasks, for example, the legend can be used as a guideline for graphically representing the drawing contents during drawing, and can be used as an indispensable reading guide during drawing, so that a user (for example, a 3D modeling party of the disclosure) can conveniently use the drawing and understand the contents of the drawing.
In the engineering design drawing used in the present disclosure, different devices may be classified according to standard legends, and the legends also have corresponding layers, and all conform to corresponding national standards and industry standards. Or, in step 1, the 3D modeling party may perform engineering drawing legend standardization and layer standardization to classify and map different devices according to a unified standard legend. The standard legend used for drawing standardization can be set and explained by a 3D modeling party in a standard way, legends with different special subjects conform to corresponding national standards and industry standards, and the method is not limited by the disclosure.
Therefore, through the standardization of the legend and the layer standardization of the engineering design drawing, the identification of the device legend, the positioning of the device in the three-dimensional model and the modeling can be quickly and accurately realized in the subsequent three-dimensional modeling process, and the three-dimensional modeling efficiency is improved.
Then, in step 2, facade modeling is performed to achieve modeling of the appearance and overall effect of the three-dimensional model.
The three-dimensional model can be a model (such as a three-dimensional building model) which is constructed by a virtual three-dimensional space and has three-dimensional data of relevant engineering (such as buildings), such as a building. The corresponding (building) engineering entity of the three-dimensional model may have a plurality of (floors). Related three-dimensional modeling tools may be employed herein to model the appearance and overall effect of the three-dimensional model, and specific facade modeling the present disclosure is not intended to be limiting.
It should be understood that the three-dimensional model described in this disclosure may be one model in a three-dimensional scene, and that the three-dimensional scene may include multiple models. For example, a 3D scene of a campus may contain multiple buildings, each of which may be a separate three-dimensional model. In addition, the three-dimensional scene may also include other relevant models required for displaying the three-dimensional scene, which is not limited by the present disclosure.
And 3, carrying out layered modeling on each layer of the three-dimensional model according to the CAD drawing and the related engineering information.
The engineering information may be, for example, information related to a certain engineering when the engineering is designed or constructed. For example, when the project is a building, the project information may include, for example, a building height, a story height of each building story, and the like. When the project such as a building relates to one or more floors, each floor corresponds to one piece of CAD drawing, and relevant information of the corresponding floor, such as floor information, equipment information (including equipment installation information) of relevant equipment and the like, is recorded in the CAD drawings.
Here, for example, a plurality of CAD drawings corresponding to a plurality of layers of the three-dimensional model and engineering information related to the three-dimensional model may be imported into the 3D modeling tool, so that the 3D modeling tool performs layered modeling on the three-dimensional model whose appearance and overall effect modeling have been completed, based on high-level engineering information of the building layer and the CAD drawing corresponding to each layer, to obtain one or more layers of the three-dimensional model corresponding to one or more CAD drawings.
In step 4, the legend and the layer of each device in the engineering design drawing can be identified, two-dimensional (2D) mapping is performed on each layer in the three-dimensional model, and the legend position (i.e., the device point position) of the device in the engineering design drawing is marked in each layer of the three-dimensional model to serve as the device model position of the device in the three-dimensional model.
Here, the layer of the engineering design drawing (e.g., layer 0 including the legend) may be read by using some library classes (e.g., expose).
As one example of the present disclosure, the horizontal position may be represented in the form of x, y coordinates. Preferably, the layered x, y coordinates of the three-dimensional model correspond to the x, y coordinates of the corresponding engineering drawing.
When two-dimensional mapping is performed based on the engineering design drawing, x and y coordinates of a legend in a single-layer CAD drawing can be mapped to a corresponding layer in the three-dimensional model to serve as a device model position of a device model of the device in the layer of the three-dimensional model. The device model location here is preferably arranged on the ground plane of the hierarchically corresponding layered space.
In addition, as mentioned above, each layer of the three-dimensional model is still a three-dimensional stereo space, i.e. a three-dimensional layer model, and the arrangement of the device in the real three-dimensional space is not limited to the floor level. Thus, device information may also be identified from the CAD drawings, which may include, for example, device installation information (e.g., installation standard height). When the two-dimensional position mapping is carried out, the equipment installation height information is used as a layering z coordinate, and the position of the equipment model is mapped in a corresponding three-dimensional layering model by combining a legend x coordinate and a legend y coordinate in a CAD drawing and the identified installation standard height of the equipment. The device model position here can preferably be presented as a floating effect.
As a preferred example, in the two-dimensional mapping process, a device mark corresponding to the device may also be set at the mapped device model position to achieve precise location of the position and to distinguish device model positions of different devices. The device mark may be model information of the device or may be a device identification having a different shape/color/symbol/pattern. Wherein the same device may use the same device label, and the device label may be set by the 3D modeling party according to a predetermined specification standard, which is not limited by the present disclosure.
As another example of the present disclosure, in step 4, an example position (i.e., an equipment point position) of the equipment in the engineering drawing may be obtained from the equipment position description data corresponding to the engineering drawing generated by the engineering tool, and the example position of the equipment is marked in each layer of the three-dimensional model to serve as an equipment model position of the equipment in the three-dimensional model.
The device location description data may be data describing the location of the associated device, which may be contained in a location description file. The location description file may be a file generated by an engineering tool having a location description file generation function and corresponding to an engineering drawing, and the location description file includes device location data of related devices in a hierarchy corresponding to the engineering drawing.
Preferably, the device location description data may be structured data, such as structured data similar to "project name-project hierarchy- (three-dimensional x, y, z) location coordinate information-device information", so that the location of the relevant device can be accurately determined according to the structured data, the location of the device model location and the setting of the relevant device model can be performed in the relevant hierarchy of the relevant three-dimensional model, and the modeling efficiency is improved.
In practical application, the related engineering design tool and the 3D modeling tool for executing the three-dimensional modeling method can be secondarily developed to have a location description file generation function and a location description file identification function respectively, and the location description file is imported into the 3D modeling tool, so that the 3D modeling tool identifies the content of the location description file, such as device location description data, and acquires the first location of the related device from the device location description data, so as to realize modeling of the related device in the three-dimensional model.
Thereafter, at step 5, based on the device model position mapped at the above step 4, a device model corresponding to the device is set at the position.
The plant model may be pre-modeled and may be stored in a predetermined plant model library.
As an example of the present disclosure, the set device model is adapted to a three-dimensional model. For example, the plant model and the three-dimensional model may be modeled using the same modeling standard/specification, the same model scale (e.g., 1:100 each). Alternatively, the model scale of the device model may be a predetermined ratio to the model scale of the three-dimensional model (e.g., a predetermined ratio of 1.5 to a model scale of 1:100 for the three-dimensional model, and a model scale of 1:150 for the device model, such that a smaller scale of the device model may be more helpful in clearly representing the relative positions of the plurality of devices in the entire three-dimensional model than for the three-dimensional model, or a predetermined ratio of 0.5 to a model scale of 1:100 for the three-dimensional model, such that a larger scale of the device model may be more helpful in clearly representing the details of the device itself than for the three-dimensional model). Or adjusting the set equipment model to be matched with the three-dimensional model.
When there is a need to set the device model, the corresponding device model may be extracted from the device model library according to device information, such as the device type, the device model, the device ID, etc., of the device that needs to be set, and the device model is set at a position of the device model corresponding to a layer of the three-dimensional model, so as to implement modeling of the device in the corresponding layer of the three-dimensional model.
When the relevant equipment model is set in the hierarchy, the extracted relevant equipment model can be directly set at the position of the equipment model mapped in the step 4, or the equipment mark set in the step 4 is directly replaced by the extracted relevant equipment model in one step, so that the relevant equipment model can be modeled in the hierarchy of the three-dimensional model.
In the above process, the device models may be set one by one, or may be set in batches.
Specifically, step 5 may be performed to set the relevant device model immediately after mapping a device model position in step 4. After mapping of all the device model positions is performed on each layer of the three-dimensional model or the whole three-dimensional model, the related device models can be set in batches according to the device information of the related devices and the device model positions, so that modeling of the large-order-magnitude devices in the three-dimensional model is achieved, and modeling efficiency is improved.
The three-dimensional modeling tool disclosed by the invention can also have an adjusting function so as to adjust the set equipment model, so that the equipment model is adaptive to the three-dimensional model, and a good presenting effect is achieved. For example, when the set device model has a difference from its ideal effect, if there is a horizontal deviation or a vertical deviation of the device model, the position, the angle, etc. of the device model are adjusted by the three-dimensional modeling tool, so that the device model and the three-dimensional model are adapted to achieve a good presentation effect.
Therefore, according to the technical scheme of the disclosure, based on engineering design drawings, an image recognition technology, a pattern matching technology and the like, the position recognition and positioning of the equipment model in the three-dimensional space are realized, so that the modeling of the relevant equipment in the three-dimensional model is realized. The three-dimensional modeling scheme is also suitable for large-order equipment positioning and modeling, the position identification and positioning of the equipment model under the three-dimensional scene are realized on the basis of the engineering design drawing, and then the corresponding equipment model is arranged at the position of the relevant equipment model, so that large-order equipment modeling is realized, the workload is greatly reduced, and the three-dimensional modeling efficiency is greatly improved.
[ three-dimensional modeling method ]
FIG. 2 shows a flow diagram of a three-dimensional modeling method according to one embodiment of the present disclosure.
As shown in fig. 2, in step S210, a first location of one or more devices based on engineering drawings is obtained.
The engineering drawing may be, for example, a Computer Aided Design (CAD) drawing, one or more devices may include an intelligent device, a sensor device, or other related devices, and the engineering drawing may include a legend for the one or more devices and a layer on which the legend is located. Before step S210, the engineering design drawing has completed drawing legend standardization and layer standardization, so that different devices are classified and layer-divided according to the relevant standard legends, and the standardization may refer to the above relevant description, which is not described herein again.
As an example of the present disclosure, the step of obtaining the first position of the one or more devices obtained based on the engineering drawing may include: identifying a first location of one or more devices from an engineering drawing; or acquiring the first position from the equipment position description data which is generated by the engineering tool and corresponds to the engineering drawing.
As an example, when the first location of the device is identified from the engineering drawing, the legends of the one or more devices may be identified from the engineering drawing, and further, the first location of the one or more devices may be determined based on the location of the identified legends in the engineering drawing.
Specifically, relevant software or tools (e.g., a 3D modeling tool) may be used to read the map layer of the engineering design drawing, and then identify, through an image recognition technique, a legend of the relevant device in the map layer, where the position of the legend in the engineering design drawing is the first position in the disclosure, that is, the corresponding legend position of the device in the engineering design drawing as described above.
As another example, device location description data is data that describes the location of the associated device, which may be contained in a location description file. The location description file may be a file generated by an engineering tool having a location description file generation function and corresponding to an engineering drawing, and the location description file includes device location data of related devices in a hierarchy corresponding to the engineering drawing.
Preferably, the device location description data may be structured data, such as structured data similar to "project name-project hierarchy- (three-dimensional x, y, z) location coordinate information-device information", so that the location of the relevant device can be accurately determined according to the structured data, the location of the device model location and the setting of the relevant device model can be performed in the relevant hierarchy of the three-dimensional model, and the modeling efficiency is improved.
In practical applications, the above-mentioned obtaining of the first position of the device from the device position description data may be achieved by performing secondary development on a related engineering tool and a 3D modeling tool that performs the above-mentioned three-dimensional modeling method.
Specifically, for example, a location description file generation function may be developed in the relevant engineering design tool, so that it is possible to derive a location description file containing device location description data recognizable by the three-dimensional modeling tool based on the relevant engineering design drawing. Accordingly, by developing a corresponding function of identifying a location description file for a 3D modeling tool executing the above-described three-dimensional modeling method, the 3D modeling tool is enabled to identify the contents of the location description file, such as device location description data, so that the location of the device model location and the setting of the relevant device model can be performed in the relevant hierarchy of the three-dimensional model from these device location description data. Thereby, modeling of the relevant device in the three-dimensional model is facilitated.
Then, in step S220, the first location is mapped to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model.
The three-dimensional model may be, for example, a corresponding three-dimensional model of an engineering, such as a three-dimensional building model (a building). Before the position mapping of step S220 is performed, modeling of the appearance and the overall effect of the three-dimensional model may be completed, and a specific modeling process may be referred to in the related art, and this disclosure is not repeated herein.
Each layer of the three-dimensional model corresponds to an engineering drawing. Before the position mapping in step S220, the three-dimensional model whose model appearance and overall effect modeling have been completed may be modeled in layers according to one or more existing engineering drawings of the relevant engineering and the engineering information, so as to obtain a layer of the three-dimensional model corresponding to each engineering drawing.
The second position is the position of the device model as described above, and is the position of the relevant device in the corresponding hierarchy of the three-dimensional model for setting the device model, which is determined after the two-dimensional position mapping. The second position may be at a ground level corresponding to a hierarchy, or may be suspended in a three-dimensional hierarchical space corresponding to a hierarchy, and may be determined according to the installation information height of the device.
As one example of the present disclosure, the horizontal positions of the first and second positions may be expressed in the form of x and y coordinates. Preferably, the layered x, y coordinates of the three-dimensional model correspond to the x, y coordinates of the corresponding engineering drawing, and the x, y coordinates of the first location correspond to the x, y coordinates of the second location.
When equipment modeling needs to be performed on each layer of the three-dimensional model, the layer of the three-dimensional model corresponding to the engineering drawing can be identified from the engineering drawing, the equipment information of one or more pieces of equipment can be identified from the engineering drawing, and the first position is mapped to the layer, corresponding to the engineering drawing, in the three-dimensional model in combination with the first position identified in step S210 and serves as a second position of the one or more pieces of equipment in the three-dimensional model.
Specifically, the x, y coordinates of the legend in the single-layer CAD drawing may be mapped to a corresponding hierarchy in the three-dimensional model as the device model location of the device model for the device in the hierarchy of the three-dimensional model. The device model location here is preferably arranged on the ground plane of the hierarchically corresponding layered space.
The device information obtained by the device may include installation height information of the device, and when the position mapping is performed, the device installation height information is used as a layered z coordinate, and the position of the device model is mapped in the three-dimensional layered model by combining legend x and y coordinates in a CAD drawing and the identified installation standard height information of the device. The device model position here can preferably be presented as a floating effect.
When equipment modeling needs to be performed on each layer of the three-dimensional model, the first position may also be obtained based on equipment position description data corresponding to the engineering drawing generated by an engineering tool, and the first position is directly mapped to the layer corresponding to the engineering drawing in the three-dimensional model as the second position of the one or more pieces of equipment in the three-dimensional model.
In the two-dimensional mapping process, as an example, a device mark corresponding to a device may be further set at the mapped device model position to achieve accurate positioning of the position and to distinguish device model positions of different devices. The device mark may be model information of the device or may be a device identification having a different shape/color/symbol/pattern. Wherein the same device may use the same device label, and the device label may be set by the 3D modeling party according to a predetermined specification standard, which is not limited by the present disclosure.
Thereafter, at step S230, a device model corresponding to the one or more devices is set at the second location to model the device model of the one or more devices in the three-dimensional model.
The device models corresponding to the one or more devices may be pre-built, and in the step S230, the pre-built device models may be respectively set at the second positions, or the device labels corresponding to the one or more devices may be respectively replaced with the pre-built device models of the one or more devices, so as to model the device models of the one or more devices in the three-dimensional model.
The pre-built equipment models of one or more pieces of equipment may also be stored in a predetermined library of equipment models. When there is a demand for device modeling, device models corresponding to one or more devices may be extracted from a device modeling library based on device information (e.g., device type, device model, device ID, etc.) of the relevant devices, and the extracted device models may be set at second locations corresponding to the relevant devices, or the extracted device models may replace device marks at the respective second locations, respectively, to model the device models of the one or more devices in the three-dimensional model.
As an example of the present disclosure, the device model described above may be adapted to a three-dimensional model. For example, the plant model and the three-dimensional model may be modeled using the same modeling standard/specification, the same model scale (e.g., 1:100 each). Alternatively, the model scale of the device model may be a predetermined ratio to the model scale of the three-dimensional model (e.g., a predetermined ratio of 1.5 to a model scale of 1:100 for the three-dimensional model, and a model scale of 1:150 for the device model, such that a smaller scale of the device model may be more helpful in clearly representing the relative positions of the plurality of devices in the entire three-dimensional model than for the three-dimensional model, or a predetermined ratio of 0.5 to a model scale of 1:100 for the three-dimensional model, such that a larger scale of the device model may be more helpful in clearly representing the details of the device itself than for the three-dimensional model). Or adjusting the set equipment model to be matched with the three-dimensional model.
In the above process, the device models may be set one by one, or may be set in batches.
Specifically, step S230 may be performed to set the relevant device model immediately after mapping a device model location in step S220. After mapping of all the device model positions is performed on each layer of the three-dimensional model or the whole three-dimensional model, the related device models can be set in batches according to the device information of the related devices and the device model positions, so that modeling of the large-order-magnitude devices in the three-dimensional model is achieved, and modeling efficiency is improved.
As an example of the present disclosure, the step S230 may further include an adjusting sub-step, to adjust the set device model, so that the device model is adapted to the three-dimensional model, so as to achieve a good rendering effect. For example, when the set device model has a difference from its ideal effect, if there is a horizontal deviation or a vertical deviation of the device model, the position, the angle, etc. of the device model are adjusted by the three-dimensional modeling tool, so that the device model and the three-dimensional model are adapted to achieve a good presentation effect.
Therefore, through the technical scheme of the present disclosure as described above, the device model position identification and positioning in the three-dimensional space are realized, so as to realize the modeling of the related device in the three-dimensional model. The three-dimensional modeling scheme is also suitable for large-order equipment positioning and modeling, the position of the equipment model is identified and positioned in a three-dimensional scene based on an engineering design drawing, and then the corresponding equipment model is arranged at the position of the relevant equipment model, so that large-order equipment modeling is realized, the workload is greatly reduced, and the three-dimensional modeling efficiency is greatly improved.
As an example of the present disclosure, fig. 3 shows a flow diagram of a three-dimensional modeling method according to another embodiment of the present disclosure.
As shown in fig. 3, in step S310, a first location of one or more device associations obtained based on preset information is obtained.
The preset information may be the engineering design drawing as described above, or may be a location description file including device location description data, or other information that can obtain a first location associated with one or more devices, so as to obtain the first location.
Then, in step S320, the first location is mapped to a hierarchy corresponding to the preset information in the three-dimensional model as a second location associated with the one or more devices in the three-dimensional model. And at step S330, a device model corresponding to the one or more devices is set at the second location to model the device model of the one or more devices in the three-dimensional model.
The specific implementation of the three-dimensional modeling method shown in fig. 3 can be referred to the related description above in conjunction with fig. 2, and the detailed description of the disclosure is omitted here.
[ THREE-DIMENSIONAL MODELING DEVICE ]
FIG. 4 shows a schematic block diagram of the structure of a three-dimensional modeling apparatus according to one embodiment of the present disclosure. Wherein the functional blocks of the three-dimensional modeling apparatus may be implemented by hardware, software, or a combination of hardware and software that implement the principles of the present disclosure. It will be appreciated by those skilled in the art that the functional blocks described in fig. 4 may be combined or divided into sub-blocks to implement the principles of the invention described above. Thus, the description herein may support any possible combination, or division, or further definition of the functional modules described herein.
In the following, functional modules that the three-dimensional modeling apparatus can have and operations that each functional module can perform are briefly described, and details related thereto may be referred to the above description, and are not repeated here.
As shown in fig. 4, the three-dimensional modeling apparatus 400 of the present disclosure may include: a first location acquisition unit 410, a mapping unit 420, and a device model setting unit 430.
The first location acquisition unit 410 may be configured to acquire a first location of one or more devices based on engineering drawings.
The engineering drawing may be, for example, a Computer Aided Design (CAD) drawing. One or more devices may include smart devices and/or sensor devices, as well as other devices (e.g., internet of things devices).
As one example of the present disclosure, the first position acquisition unit 410 may include a first position identification unit and a first position acquisition sub-unit (not shown in the drawings). The first location identification unit may be configured to identify a first location of one or more devices from the engineering drawings. Alternatively, the first location obtaining subunit may obtain the first location from device location description data corresponding to the engineering drawing generated by the engineering tool.
As one example of the present disclosure, the first location identification unit may include a legend identification unit and a first location identification subunit (not shown in the drawings). The legend identification element may be used to identify a legend for one or more devices from an engineering drawing. The first location identification subunit may be configured to determine a first location of the one or more devices based on a location of the legend in the engineering drawing.
As another example of the present disclosure, the first location acquiring subunit may have a function of recognizing a location description file to acquire device location description data by recognizing the content of the location description file, so that the three-dimensional model can perform positioning and modeling of the device model of the relevant device in its corresponding hierarchy according to the acquired device location description data.
The location description file may be a file that is generated by an engineering design tool having a location description file generation function and corresponds to an engineering design drawing, and the location description file includes device location description data of related devices in a layer corresponding to the engineering design drawing.
The device location description data is data for describing the location of the relevant device. Preferably, the device location description data may be structured data, such as structured data similar to "project name-project hierarchy-location coordinates-device information", so that the location of the relevant device can be accurately determined according to the structured data, the location of the device model location and the setting of the relevant device model can be performed in the relevant hierarchy of the three-dimensional model, and the modeling efficiency is improved.
In a specific application, the related engineering design tool and the three-dimensional modeling device may be developed for the second time, so that the engineering design tool and the three-dimensional modeling device have the corresponding functions described above, which may be referred to the above description, and are not described herein again.
The mapping unit 420 may be configured to map the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model.
The device model setting unit 430 may be configured to set a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
As an example of the present disclosure, the three-dimensional modeling apparatus described above may further include a layered modeling unit (not shown in the drawings). The layered modeling unit can be used for performing layered modeling on the three-dimensional model according to the existing engineering design drawing and engineering information so as to obtain the layers of the three-dimensional model corresponding to the engineering design drawing.
Further, as a preferred example of the present disclosure, the three-dimensional modeling apparatus may further include a hierarchy recognition unit and a device information recognition unit (not shown in the drawings). The layering identification unit can identify the layering of the three-dimensional model corresponding to the engineering design drawing from the engineering design drawing. The device information identification unit may identify the device information of the one or more devices from the engineering drawing.
As a preferred example of the present disclosure, the mapping unit 420 may set a device flag corresponding to the one or more devices at the second position. The device model setting unit 430 may replace the device labels corresponding to the one or more devices in the hierarchy with the pre-established device models of the one or more devices, respectively.
As a preferred example of the present disclosure, the device model may be pre-built and may be stored in a device model library. The device model setting unit 430 may extract a device model corresponding to the one or more devices from a device model library based on the device information, and model the extracted device model of the one or more devices in the three-dimensional model.
As a preferred example of the present disclosure, the above-described device model is adapted to a three-dimensional model. For example, the plant model and the three-dimensional model may be modeled using the same modeling standard/specification, the same model scale (e.g., 1:100 each). Alternatively, the model scale of the device model may be a predetermined ratio to the model scale of the three-dimensional model (e.g., a predetermined ratio of 1.5 to a model scale of 1:100 for the three-dimensional model, and a model scale of 1:150 for the device model, such that a smaller scale of the device model may be more helpful in clearly representing the relative positions of the plurality of devices in the entire three-dimensional model than for the three-dimensional model, or a predetermined ratio of 0.5 to a model scale of 1:100 for the three-dimensional model, such that a larger scale of the device model may be more helpful in clearly representing the details of the device itself than for the three-dimensional model). Or adjusting the set equipment model to be matched with the three-dimensional model.
As an example of the present disclosure, the respective unit modules in the three-dimensional modeling apparatus shown in fig. 4 may also implement three-dimensional modeling in the following manner.
For example, the first location acquisition unit 410 may acquire a first location associated with one or more devices obtained based on preset information. The preset information may be the engineering design drawing as described above, or may be a location description file including device location description data, or other information that can obtain a first location associated with one or more devices, so as to obtain the first location.
The mapping unit 420 may map the first location to a hierarchy in a three-dimensional model corresponding to the preset information as a second location associated with the one or more devices in the three-dimensional model. The device model setting unit 430 may set a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
Operations performed by the analysis of each unit/module of the three-dimensional modeling apparatus according to the present disclosure may be referred to the above description, and are not described herein again.
[ calculating device ]
FIG. 5 shows a schematic structural diagram of a computing device that can be used to implement the above-described three-dimensional modeling method according to one embodiment of the present disclosure.
Referring to fig. 5, computing device 500 includes memory 510 and processor 520.
The processor 520 may be a multi-core processor or may include a plurality of processors. In some embodiments, processor 520 may include a general-purpose host processor and one or more special coprocessors such as a Graphics Processor (GPU), a Digital Signal Processor (DSP), or the like. In some embodiments, processor 520 may be implemented using custom circuitry, such as an Application Specific Integrated Circuit (ASIC) or a Field Programmable Gate Array (FPGA).
The memory 510 may include various types of storage units, such as system memory, Read Only Memory (ROM), and permanent storage. Wherein the ROM may store static data or instructions for the processor 520 or other modules of the computer. The persistent storage device may be a read-write storage device. The persistent storage may be a non-volatile storage device that does not lose stored instructions and data even after the computer is powered off. In some embodiments, the persistent storage device employs a mass storage device (e.g., magnetic or optical disk, flash memory) as the persistent storage device. In other embodiments, the permanent storage may be a removable storage device (e.g., floppy disk, optical drive). The system memory may be a read-write memory device or a volatile read-write memory device, such as a dynamic random access memory. The system memory may store instructions and data that some or all of the processors require at runtime. Further, the memory 510 may include any combination of computer-readable storage media, including various types of semiconductor memory chips (DRAM, SRAM, SDRAM, flash memory, programmable read-only memory), magnetic and/or optical disks, may also be employed. In some embodiments, memory 510 may include a removable storage device that is readable and/or writable, such as a Compact Disc (CD), a digital versatile disc read only (e.g., DVD-ROM, dual layer DVD-ROM), a Blu-ray disc read only, an ultra-dense disc, a flash memory card (e.g., SD card, min SD card, Micro-SD card, etc.), a magnetic floppy disk, or the like. Computer-readable storage media do not contain carrier waves or transitory electronic signals transmitted by wireless or wired means.
The memory 510 has stored thereon executable code that, when processed by the processor 520, causes the processor 520 to perform the three-dimensional modeling methods described above.
The three-dimensional modeling method and apparatus according to the present disclosure have been described in detail above with reference to the accompanying drawings.
Furthermore, the method according to the present disclosure may also be implemented as a computer program or computer program product comprising computer program code instructions for performing the above-mentioned steps defined in the above-mentioned method of the present disclosure.
Alternatively, the present disclosure may also be embodied as a non-transitory machine-readable storage medium (or computer-readable storage medium, or machine-readable storage medium) having stored thereon executable code (or a computer program, or computer instruction code) which, when executed by a processor of an electronic device (or computing device, server, etc.), causes the processor to perform the various steps of the above-described method according to the present disclosure.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the disclosure herein may be implemented as electronic hardware, computer software, or combinations of both.
The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems and methods according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen in order to best explain the principles of the embodiments, the practical application, or improvements made to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (23)
1. A three-dimensional modeling method, comprising:
acquiring first positions of one or more devices obtained on the basis of an engineering design drawing;
mapping the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model; and
setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
2. The method of claim 1, further comprising:
and according to the existing engineering design drawing and engineering information, performing layered modeling on the three-dimensional model to obtain the layers of the three-dimensional model corresponding to the engineering design drawing.
3. The method of claim 1, further comprising:
and identifying the layering of the three-dimensional model corresponding to the engineering design drawing from the engineering design drawing.
4. The method of claim 1, the step of obtaining a first location of one or more devices based on engineering drawings comprising:
identifying a first location of one or more devices from an engineering drawing; or
And acquiring the first position from the equipment position description data which is generated by the engineering tool and corresponds to the engineering drawing.
5. The method of claim 4, wherein the step of identifying a first location of one or more devices from an engineering drawing comprises:
identifying a legend for one or more devices from an engineering drawing;
determining a first location of the one or more devices based on a location of the legend in the engineering drawing.
6. The method of claim 5, further comprising:
identifying device information for the one or more devices from the engineering drawing.
7. The method of claim 6, wherein mapping the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing comprises:
setting a device tag corresponding to the one or more devices at the second location.
8. The method of claim 7, wherein the step of setting a device model corresponding to the one or more devices at the second location comprises:
and replacing the equipment marks corresponding to the one or more equipment in the hierarchy respectively by the pre-established equipment models of the one or more equipment.
9. The method of claim 8, wherein the step of providing a device model corresponding to the one or more devices at the second location further comprises:
based on the device information, a device model corresponding to the one or more devices is extracted from a device model library.
10. The method of any one of claims 1-9,
the model scale of the plant model of the one or more plants is in a predetermined ratio to the model scale of the three-dimensional model.
11. The method of any one of claims 1-9,
the engineering design drawing is a Computer Aided Design (CAD) drawing.
12. The method of any one of claims 1-9,
the one or more devices include smart devices and/or sensor devices.
13. A three-dimensional modeling method, comprising:
acquiring a first position associated with one or more devices based on preset information;
mapping the first location to a hierarchy in a three-dimensional model corresponding to the preset information as a second location associated with the one or more devices in the three-dimensional model; and
setting a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
14. A three-dimensional modeling apparatus, comprising:
the system comprises a first position acquisition unit, a second position acquisition unit and a control unit, wherein the first position acquisition unit is used for acquiring first positions of one or more devices obtained on the basis of engineering design drawings;
a mapping unit, configured to map the first location to a hierarchy in a three-dimensional model corresponding to the engineering drawing as a second location of the one or more devices in the three-dimensional model; and
a device model setting unit to set a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
15. The apparatus of claim 14, further comprising:
and the layered modeling unit is used for performing layered modeling on the three-dimensional model according to the existing engineering design drawing and engineering information so as to obtain the layers of the three-dimensional model corresponding to the engineering design drawing.
16. The apparatus of claim 14, wherein the first position acquisition unit comprises:
a first position identification unit for identifying a first position of one or more devices from an engineering drawing; or
And the first position acquisition subunit is used for acquiring the first position from the equipment position description data which is generated by the engineering tool and corresponds to the engineering drawing.
17. The apparatus of claim 16, wherein the first location identifying unit comprises:
the system comprises a legend identification unit, a legend identification unit and a control unit, wherein the legend identification unit is used for identifying legends of one or more devices from engineering design drawings;
a first location identification subunit, configured to determine a first location of the one or more devices based on the location of the legend in the engineering drawing.
18. The apparatus of claim 17, wherein,
the mapping unit is configured to set a device flag corresponding to the one or more devices at the second location.
19. The apparatus of claim 18, wherein,
and the mapping unit respectively replaces the equipment marks corresponding to the one or more equipment in the hierarchy with the pre-established equipment models of the one or more equipment.
20. The apparatus of claim 19, wherein,
the device model setting unit extracts a device model corresponding to the one or more devices from a device model library based on the device information.
21. A three-dimensional modeling apparatus, comprising:
a first position acquisition unit, configured to acquire a first position associated with one or more devices obtained based on preset information;
a mapping unit, configured to map the first location to a hierarchy in a three-dimensional model corresponding to the preset information, as a second location associated with the one or more devices in the three-dimensional model; and
a device model setting unit to set a device model corresponding to the one or more devices at the second location to model the device model of the one or more devices in the three-dimensional model.
22. A computing device, comprising:
a processor; and
a memory having executable code stored thereon, which when executed by the processor, causes the processor to perform the method of any of claims 1-13.
23. A non-transitory machine-readable storage medium having stored thereon executable code, which when executed by a processor of an electronic device, causes the processor to perform the method of any of claims 1-13.
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