CN111190255B - Heat dissipation type single/double fiber pluggable optical module, assembly method thereof and external clamping fastener - Google Patents

Heat dissipation type single/double fiber pluggable optical module, assembly method thereof and external clamping fastener Download PDF

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Publication number
CN111190255B
CN111190255B CN202010064886.1A CN202010064886A CN111190255B CN 111190255 B CN111190255 B CN 111190255B CN 202010064886 A CN202010064886 A CN 202010064886A CN 111190255 B CN111190255 B CN 111190255B
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Prior art keywords
base
circuit board
module circuit
heat
housing cover
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CN111190255A (en
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刘萍
刘平
刘松
彭彦辉
刘斌
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Shenzhen Optic King Technology Co ltd
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Shenzhen Optic King Technology Co ltd
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Priority to CN202010064886.1A priority Critical patent/CN111190255B/en
Priority to CN202011202998.5A priority patent/CN112285848B/en
Publication of CN111190255A publication Critical patent/CN111190255A/en
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/426Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4267Reduction of thermal stress, e.g. by selecting thermal coefficient of materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to a heat dissipation type single/double fiber pluggable optical module, an assembling method thereof and an external clamping fastener, wherein the optical module comprises a shell cover, a module circuit board, a base and the external clamping fastener, wherein the side edge of the module circuit board is clamped and fixed between the shell cover and the base so as to form two heat convection channels above and below the module circuit board, a heat conduction boss in the shell cover and the external clamping fastener with a specific structure are utilized to thermally couple a chip to a heat-generating body, the external clamping fastener is attached to the shell cover in a heat conduction way and is buckled with the base in the heat conduction way, a heat conduction path from the heat conduction boss to the base through the external clamping fastener is established, and the heat conduction path is a bad path surrounding the two heat convection channels, so that the air cooling type heat dissipation efficiency of a single/double.

Description

Heat dissipation type single/double fiber pluggable optical module, assembly method thereof and external clamping fastener
Technical Field
The invention relates to the technical field of single/double-fiber pluggable optical modules, in particular to a heat-dissipation single/double-fiber pluggable optical module, an assembling method thereof and an external clamping fastener.
Background
The single/double fiber pluggable optical module is a small pluggable transceiver device containing a source chip and an optical receiving transmitter, which is applied to high-speed telecommunication and data communication, the data volume needing to be transmitted is larger and larger to match the lower limit time of 4G, 5G, 6G or more advanced wireless communication protocols, along with the improvement of the transmission rate, such as 622Mb/s, 2.5Gb/s, 5Gb/s, even 10G/s or higher, the heat productivity of internal chips is more and more, the damage influence on the optical communication performance or/and the assembly structure is larger and larger, such as communication signal distortion, chip operation rate slowing, assembly structure cracking or deformation of a module circuit board or circuit open circuit …, and the like, so the air cooling mode assembly structure of the traditional optical module is not met with expectations, and the use of a water cooling mode or an oil cooling mode to increase the heat dissipation effect of the optical module is proposed, however, the assembly cost is too high and is not favorable for plug and unplug replacement, and how to increase the heat dissipation capability of the pluggable optical module in an air-cooled environment is a problem to be solved urgently.
With respect to one pluggable optical module code board design of the prior art, U.S. patent publication No. US20110191632a1 discloses a small capacity pluggable (SFP) check device for reading and determining the type of plug-in SFP transceiver module or other optical device. The SFP inspection apparatus is connected to the SFP transceiver and the PC or notebook computer through a USB cable. Pluggable optical modules are small, hot-pluggable transceivers used for telecommunication and data communication applications. The SFP transceiver module connects a network device motherboard (e.g., for a switch, router, media converter, or similar device) to a fiber optic or copper network cable. SFP transceiver modules are designed to support SONET, gigabit ethernet, fibre channel, and other communication standards. The SFP module is designed after the GBIC interface. This patent discloses that the SFP transceiver module has a bar structure, but does not specifically disclose an assembly structure and an assembly method inside the SFP transceiver module.
Regarding a structure design of an optical module in the prior art, chinese patent publication No. CN101535860A discloses an insertable shielding clip for controlling electromagnetic interference in an optical transceiver module. The optical transceiver module may include a housing that houses the first and second optical subassemblies and an enclosure that cooperates with the housing to define a cover for the optical transceiver module. The shield clip may include a body constructed of a conductive material. The body may include first and second vertical side members. The body may also include first and second shield members, each configured to receive a respective nozzle of one of the first and second optical assemblies. The body may further include a bottom member interconnecting the first and second vertical side members and the first and second shield members. This patent discloses an internal shield clip for use inside the optical module structure.
Regarding to a structural design of an optical module in the prior art, chinese patent publication No. CN106772834A discloses an SFP module with a wavelength division/multiplexing function, which includes a main SFP module, and an auxiliary SFP module with an adjustable position relative to the main SFP module; the main SFP module comprises a wave splitting/combining device, and the wave splitting/combining device comprises an input optical fiber, a wave splitting plate, an optical path support inserting core, an output optical fiber I and an output optical fiber II; the side surface of the optical path support insert core is provided with a notch, the partial wave plate is arranged in the notch, the input optical fiber is arranged in an input end inner hole of the optical path support insert core and is communicated with the partial wave plate through space optical coupling, the first output optical fiber is arranged in an output end inner hole of the optical path support insert core, the first output optical fiber is communicated with a main BOSA device of the main SFP module through optical coupling, and the second output optical fiber is communicated with an auxiliary BOSA device of the auxiliary SFP module. This patent discloses locking from a cover plate to a bottom case through a PCB using a plurality of bolt fasteners.
Regarding an optical transceiver inside an optical module in the prior art, chinese patent publication No. CN103048745A discloses a bidirectional fiber subassembly and an SFP optical transceiver module using the same, where the bidirectional fiber subassembly includes a laser generating laser light, a photodetector receiving light, an optical fiber adapter connecting optical fibers, a square base fixing the laser, the photodetector and the optical fiber adapter together, and an optical filter fixed in the square base. The single-fiber bidirectional component is applied to an SFP optical transceiver module. This patent does not specifically disclose the assembly structure and the assembly method inside the SFP optical transceiver module, except for the single-fiber bidirectional component.
Disclosure of Invention
The invention mainly aims to provide a heat dissipation type single/double fiber pluggable optical module, which is used for solving the problems that an internal chip device of the optical module is damaged by excessive heating or the performance of the optical module is degraded and disabled under the receiving and transmitting operation processing of a high-speed optical signal of the optical module.
The main objective of the present invention is to provide a method for assembling a heat-dissipating single/dual fiber pluggable optical module, which is used to effectively establish a top-to-bottom heat conduction mechanism at the periphery of an internal upper and lower heat convection space of the single/dual fiber pluggable optical module, thereby avoiding loosening or cracking of a connection point of a module circuit board caused by the temperature difference between a base and a housing cover.
The main purpose of the invention is realized by the following technical scheme:
a heat dissipation type single/double fiber pluggable optical module is provided, which comprises a shell cover, a module circuit board, a base and an external clamping fastener;
the shell cover is internally formed into a strip-shaped device accommodating groove, one end of the device accommodating groove is an optical fiber interface, the other end of the device accommodating groove is a plugging port, the device accommodating groove is provided with a first positioning concave ring adjacent to the optical fiber interface, a limiting notch is arranged adjacent to the plugging port, and a heat conducting boss is formed in the device accommodating groove;
the module circuit board is arranged in the device accommodating groove and is electrically connected with the single/double-fiber optical transceiving component, a chip heating body is arranged on the module circuit board, the single/double-fiber optical transceiving component is provided with a positioning ring, a board limiting part is arranged on the side edge of the module circuit board, the module circuit board is limited in the limiting notch through the board limiting part, and the heat-conducting boss is thermally coupled with the chip heating body corresponding to the position;
the base is combined on the shell cover, a second positioning concave ring is arranged at the position, facing the optical fiber interface, of the base, the single/double-fiber optical transceiver component is fixed on the first positioning concave ring and the second positioning concave ring through the positioning ring, the side edge of the module circuit board is clamped and fixed between the shell cover and the base, a first heat convection channel bypassing the heat conduction boss is formed between the module circuit board and the shell cover, a second heat convection channel is formed between the module circuit board and the base, and the first heat convection channel and the second heat convection channel are both communicated with the plugging port;
outer clamp fastener sets up the cap corresponds the outer peripheral edge position of first location notch ring, outer clamp fastener have middle laminating portion, by the side that middle laminating portion both sides were buckled and are extended presss from both sides laminating portion and by the side presss from both sides the buckling parts that laminating portion buckled and extend again, middle laminating portion with the side presss from both sides laminating portion heat conduction ground and attaches the cap, buckling parts heat conduction ground lock joint the base, in order to establish heat conduction boss via outer clamp fastener extremely the heat-conduction path of base.
By adopting the basic technical scheme, the side edge of the module circuit board is clamped and fixed between the shell cover and the base so as to form two heat convection channels communicated with the plug port above and below the module circuit board, the heat conduction boss in the shell cover and the external clamping fastener with a specific structure are utilized, the heat conduction boss is thermally coupled with the chip heating body, the middle attaching part and the side clamping attaching part are attached to the shell cover in a heat conduction way, the fastening part is fastened with the base in a heat conduction way so as to establish a heat conduction path from the heat conduction boss to the base through the external clamping fastener, thereby forming two heat convection channels in the single/double-fiber pluggable optical module and a bad heat conduction path from the chip upper part to the heat conduction boss around the two heat convection channels, and from the main body of the shell cover to the base through the external clamping fastener, the air-cooled heat dissipation efficiency of the single/double fiber pluggable optical module product is improved, and the single/double fiber pluggable optical module is suitable for data transmission of high-speed communication.
The present invention in a preferred example may be further configured to: the chip heating body comprises at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly and an information storage chip assembly, and the heat conduction bosses are multiple and slightly larger in area than the chip heating body.
By adopting the preferable technical scheme, the heat conduction bosses are multiple and slightly large in area, and the chip heating body is effectively connected in a heat conduction mode under the condition that the first heat convection channel is not closed.
The present invention in a preferred example may be further configured to: the outer clamping fastener is provided with an elastic sheet protruding outwards at the middle attaching part, a plurality of spring claws with middle sections bent outwards are formed on one sides of the middle attaching part and the side clamping attaching parts facing the optical fiber interface, preferably, the elastic sheet is located in an opening of the middle attaching part and integrally connected to one side of the opening, which is relatively adjacent to the plugging port, and preferably, the outer clamping fastener is provided with a first inner buckling salient point at the side clamping attaching part and a second inner buckling salient point at the buckling part and is buckled and positioned to the side wall of the shell cover and the bottom of the base respectively.
Through adopting above-mentioned preferred technical scheme, utilize the flexure strip of middle laminating portion with the spring claw of side clamp laminating portion one side makes but the pluggable mode of heat dissipation type list/double fiber plug optical module is installed in the slot of the telecommunication equipment such as switch, but the external clamping mechanism of heat dissipation type list/double fiber plug optical module does not directly influence or oppress the cap with the combination of base. Preferably, the sliding-in and plugging of the heat dissipation type single/double-fiber pluggable optical module are facilitated by utilizing the specific connection orientation of the elastic sheet. Preferably, the first inner buckling salient point of the side clamping and attaching part and the second inner buckling salient point of the buckling part are utilized by the outer clamping fastener, so that the antiskid positioning and heat conduction attachment of the outer clamping fastener to the shell cover and the base are enhanced.
The present invention in a preferred example may be further configured to: the shell cover and the base are provided with grooves for embedding the external clamping fasteners.
By adopting the preferred technical scheme, the outer clamping fastener is embedded by the groove, the heat dissipation type single/double fiber pluggable optical module with the outer clamping fastener has more integrity, and the outer clamping fastener is prevented from directly scratching the slot of the telecommunication equipment.
The present invention in a preferred example may be further configured to: the shell cover is longer than the base, a clamping notch is formed in the bottom edge of the side wall of the shell cover, a clamping flange corresponding to the plugging port in shape is arranged on the base in the direction facing the plugging port, and the locking point of the shell cover and the base is adjacent to the optical fiber interface.
By adopting the preferred technical scheme, the positioning strip of the shell cover is utilized to correspond to the half-hole-shaped positioning notch of the module circuit board, the module circuit board is fixed in the shell cover and can not slide, and the thermal coupling relation between the chip heating body and the heat conduction boss on the module circuit board is stabilized. Preferably, the buckling notch of the housing cover on the bottom edge of the side wall is buckled with the buckling flange of the base, so that the housing cover and the base are combined near the plugging port without a locking point or a locking piece, and the housing cover and the base can be quickly combined under the condition of less locking points only by installing the locking point near the optical fiber interface.
The present invention in a preferred example may be further configured to: the base has thickened side wall clips for clipping against the board side edges of the module circuit board and the side wall edges of the cover surrounding the board side edges.
By adopting the above preferred technical scheme, utilize the side wall clamp of base bodiness is fixed in inside clamping during the module circuit board, the side wall clamp touches as pressing from both sides the module circuit board with the support at cap side wall edge can realize the base is to the clamping power of cap is greater than the base is to the clamping power of module circuit board, it is right to reduce the circuit destruction inside the module circuit board.
The present invention in a preferred example may be further configured to: the module circuit board is provided with a first finger-shaped contact pad facing the shell cover and a second finger-shaped contact pad exposed out of the base at the plugging port, the module circuit board is limited and fixed in the shell cover, and the module circuit board is in slidable contact with the base.
By adopting the preferred technical scheme, the module circuit board is limited and fixed in the shell cover and is in slidable contact with the module circuit board and the base, so that stress damage to a circuit structure in the module circuit board can not be caused even if the base is not matched with the base in heating during high-speed operation of the optical module.
The main purpose of the invention is realized by the following technical scheme:
the outer clamping fastener of the heat dissipation type single/double-fiber pluggable optical module is provided with a middle attaching portion, side clamping attaching portions and buckling portions, wherein the side clamping attaching portions are bent and extended from two sides of the middle attaching portion, the buckling portions are bent and extended from the side clamping attaching portions, the middle attaching portion and the side clamping attaching portions are used for attaching a shell cover of the heat dissipation type single/double-fiber pluggable optical module in a heat conduction mode, the buckling portions are used for buckling a base of the heat dissipation type single/double-fiber pluggable optical module in a heat conduction mode, preferably, the outer clamping fastener is provided with an outward protruding elastic sheet at the middle attaching portion, a plurality of spring claws with middle sections bent outwards are formed on one sides, facing an optical fiber interface, of the middle attaching portion and the side clamping attaching portions, preferably, the elastic sheet is located in an opening of the middle attaching portion, the elastic sheet is integrally connected to one side, relatively adjacent to a plugging port, of the opening is preferably, the outer clamping fastener is arranged on the side clamping pasting part and is provided with a first inner buckling salient point, the buckling part is provided with a second inner buckling salient point, and the outer clamping fastener is used for being buckled and positioned to the side wall of the shell cover and the bottom of the base respectively.
By adopting the technical scheme, the whole heat conduction connection of the pluggable optical module is achieved by utilizing the specific structure of the buckling part, the phenomenon that the heated temperature difference between the base and the shell cover is too large is avoided, and the external heat conduction effect of the pluggable optical module is accelerated.
The main purpose of the invention is realized by the following technical scheme:
the method for assembling the heat dissipation type single/double fiber pluggable optical module comprises the following steps:
providing a shell cover, wherein a strip-shaped device accommodating groove is formed in the shell cover, one end of the device accommodating groove is an optical fiber interface, the other end of the device accommodating groove is a plugging port, the device accommodating groove is provided with a first positioning concave ring adjacent to the optical fiber interface, a limiting notch is arranged adjacent to the plugging port, and a heat conducting boss is formed in the device accommodating groove;
after the module circuit board and the single/double fiber optical transceiving component are installed, the single/double fiber optical transceiving component is fixed on the first positioning concave ring through a part of the positioning ring, the module circuit board is limited on the limiting notch through the plate limiting part, and the heat conduction boss is thermally coupled with the chip heating element corresponding to the position;
a base is combined on the shell cover, a second positioning concave ring is arranged at the position, facing the optical fiber interface, of the base, the single/double-fiber optical transceiver component is fixed to the second positioning concave ring through the rest part of the positioning ring, the side edge of the module circuit board is clamped and fixed between the shell cover and the base, a first heat convection channel bypassing the heat conduction boss is formed between the module circuit board and the shell cover, a second heat convection channel is formed between the module circuit board and the base, and the first heat convection channel and the second heat convection channel are both communicated with the plug port;
the cap corresponds the outer peripheral edge position of first location notch ring sets up outer fastener that presss from both sides, outer fastener that presss from both sides have middle laminating portion, by the side that middle laminating portion both sides were buckled and are extended presss from both sides laminating portion and by the buckling parts that the side pressed from both sides laminating portion and buckle and extend again, middle laminating portion with the side presss from both sides laminating portion heat conduction ground and attaches the cap, buckling parts heat conduction ground lock joint the base, in order to establish heat conduction boss via outer fastener extremely the heat-conduction route of base.
By adopting the technical scheme, the module circuit board and the single/double-fiber optical transceiver component are reversely mounted, the module circuit board is arranged in the shell cover in a pre-positioned mode, the module circuit board is clamped between the shell cover and the base and does not directly generate a mechanical combination relation with the base, two heat convection channels which are vertically communicated with the module circuit board and an annular heat conduction path which surrounds the two heat convection channels are provided, and the pluggable optical module has a more excellent outward heat conduction effect in an air cooling mode, so that the pluggable optical module is suitable for manufacturing a new-generation more advanced optical module product.
The present invention in a preferred example may be further configured to: in the step of mounting the module circuit board, the chip heating element comprises at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly and an information storage chip assembly, and the heat conduction bosses are multiple and have an area slightly larger than that of the chip heating element;
or in the step of arranging the external clamping fastener, the external clamping fastener is provided with an elastic sheet protruding outwards at the middle attaching part, and a plurality of spring claws with middle sections bending outwards are formed at one sides of the middle attaching part and the side clamping attaching parts facing the optical fiber interface;
or in the step of combining the base and the shell cover, the shell cover and the base are provided with grooves for embedding the external clamping fasteners;
preferably, in the step of combining the base and the shell cover, the shell cover is longer than the base, the shell cover is provided with a buckling notch at the bottom edge of the side wall, the base is provided with a buckling flange with a corresponding shape towards the plugging port, and the locking point of the shell cover and the base is adjacent to the optical fiber interface;
or, in the step of joining the base and the cover, the base has a thickened side wall clip for clipping a side edge of the board of the module circuit board and a side wall edge of the cover surrounding the side edge of the board;
after the step of arranging the external clamping fastener, the module circuit board is limited and fixed in the shell cover, and the module circuit board is in slidable contact with the base.
In summary, the invention includes at least one of the following beneficial technical effects:
1. the heat dissipation solution of the single/double-fiber pluggable optical module under high-speed communication is provided, a communicated heat convection channel is formed above and below a module circuit board, an annular heat conduction path is formed around the heat convection channel so as to enhance the heat conduction effect of the pluggable optical module in a suspension base, the base and a cover have more consistent heating temperature, and the cracking or the loosening of a joint point of an upper clamping and lower clamping combination structure is avoided;
2. the module circuit board in the pluggable optical module is limited and fixed on the cover cap and clamped between the cover cap and the base, the module circuit board does not need to be provided with a screwed and locked joint point relative to the cover cap and the base, in the occasions of high-temperature operation and sudden temperature rise and fall, the cover cap and the base cannot apply enough thermal stress for deformation to the module circuit board, and the joint point of an internal circuit structure of the module circuit board and a chip heating body is not easy to break and damage. In a preferred example, the contact surface of the module circuit board and the base is slidable, and the influence of the thermal stress of the base on the module circuit board approaches zero;
3. the assembly scheme is characterized in that the assembly scheme is labor-saving and convenient to combine the cover and the base in the manufacturing process of the pluggable optical module, the number of the combination points of the cover and the base can be obviously reduced and is relatively far away from a module circuit board (or a chip heating body), the cover and the base can be fixed by an external clamping fastener, the heat conduction between the cover and the base is increased, and the combination interface of the cover and the base is prevented from cracking under the condition of reducing the number of the combination points;
4. when the pluggable optical module is plugged in telecommunication equipment such as a switchboard, the spring claw and the elastic sheet form an external clamping fastener, so that stress oppression on the cover or/and the base is reduced.
Drawings
Fig. 1 is a perspective view illustrating a heat-dissipating single/dual fiber pluggable optical module according to a first preferred embodiment of the present invention with a housing cover facing upward;
fig. 2 is a schematic perspective view illustrating the heat-dissipating single/dual fiber pluggable optical module with its base facing upward;
FIG. 3 is an exploded view of the heat-dissipating single/dual fiber pluggable optical module;
fig. 4 is a schematic perspective view illustrating an outer clip of the heat-dissipating single/dual fiber pluggable optical module with a clip opening facing upward;
fig. 5 is a schematic perspective view illustrating a housing cover of the heat dissipation type single/dual fiber pluggable optical module with a device accommodating slot facing upward;
fig. 6 is a schematic perspective view illustrating a base of the heat-dissipating single/dual fiber pluggable optical module, where (a) is an inner surface and (B) is a bottom surface;
fig. 7 is a schematic cross-sectional view illustrating the heat dissipation type single/dual fiber pluggable optical module being cut from the optical fiber interface to the plug port;
fig. 8 is a block diagram illustrating a flow chart of a method for assembling a heat-dissipating single/dual fiber pluggable optical module according to a second preferred embodiment of the present invention;
FIG. 9 is a schematic view of a housing cover provided in the assembly method;
FIG. 10 is a schematic view of the assembly method in which the modular circuit board and the single/dual fiber optical transceiver module are mounted in the housing cover in a reversed orientation;
FIG. 11 is a schematic view of the assembly method in which the base is coupled to the housing cover;
FIG. 12 is a schematic view showing an outer clip for fastening the base to the housing cover in the assembling method.
The reference numbers of 10, a shell cover, 11, a device accommodating groove, 12, an optical fiber interface, 13, a plug port, 14, a first positioning concave ring, 15, a limiting notch, 16, a heat conducting boss, 17, a groove, 18, a positioning strip, 19, a buckling notch, 20, a module circuit board, 21, a first finger-shaped contact pad, 22, a second finger-shaped contact pad, 25, a board limiting part, 26, a chip heating body, 28, a positioning notch, 30, a base, 31, a side wall clamp, 34, a second positioning concave ring, 37, a groove, 39, a buckling flange, 40, an outer clamping fastener, 41, a middle joint part, 42, a side clamping part, 43, a buckling part, 44, an elastic sheet, 45, a spring claw, 46, an opening, 47, a first inner buckling salient point, 48, a second inner buckling salient point, 50, a single/double-fiber optical transceiver component, 54, B, the positioning ring, the first heat convection channel, the second heat convection channel, the positioning ring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of embodiments for understanding the inventive concept of the present invention, and do not represent all embodiments, nor do they explain only embodiments. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention under the understanding of the inventive concept of the present invention are within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In order to facilitate understanding of the technical solution of the present invention, the heat dissipation type single/dual fiber pluggable optical module, the assembling method thereof, and the external clip of the present invention will be described and explained in further detail below, but are not to be construed as the scope of protection defined by the present invention.
Fig. 1 is a schematic perspective view of a heat-dissipating single/dual fiber pluggable optical module with a housing cover facing upward, fig. 2 is a schematic perspective view of the heat-dissipating single/dual fiber pluggable optical module with a base facing upward, and fig. 3 is an exploded schematic view of the heat-dissipating single/dual fiber pluggable optical module. Referring to fig. 1 to 3, a first embodiment of the invention discloses a heat dissipation type single/double fiber pluggable optical module, which includes a housing cover 10, a module circuit board 20, a base 30, and an external clip 40. FIG. 4 is a perspective view of the outer clip 40 with the clip opening facing upward; fig. 5 is a schematic perspective view of the housing cover 10 facing upward in the device accommodating groove 11; FIG. 6 is a perspective view of the base 30, wherein (A) is facing inward and (B) is facing upward; fig. 7 is a schematic cross-sectional view of the heat dissipation type single/dual fiber pluggable optical module cut from the optical fiber interface 12 to the plug port 13.
Referring to fig. 5, an elongated device receiving groove 11 (shown in fig. 5 and 7) is formed inside the housing cover 10, one end of the device receiving groove 11 is an optical fiber interface 12, the other end is a plug port 13, the device receiving groove 11 is provided with a first positioning concave ring 14 (shown in fig. 5) adjacent to the optical fiber interface 12, a limiting notch 15 is provided adjacent to the plug port 13, and a heat conducting boss 16 is formed in the device receiving groove 11. The number and location of the thermally conductive bosses 16 may correspond to the number and location of the chip heaters 26 disposed on the module circuit board 20. The optical fiber interface 12 is a connector for connecting an optical fiber or other high-speed data transmission lines, the plug port 13 is for plugging into a communication device such as a switch, and the heat conduction efficiency of the heat conduction boss 16 is not lower than the heat conduction efficiency of the body of the case cover 10, and is preferably an extension block formed by integrally forming the heat conduction boss 16 with the case cover 10. The housing cover 10 is not limited to positioning the module circuit board 20 during assembly and in a product, clamping the side half part of the module circuit board 20 in the product, and providing a first heat-conducting carrier for a heating element on the module circuit board 20.
Referring to fig. 3 and 7, the module circuit board 20 is installed in the device accommodating groove 11, the module circuit board 20 is electrically connected to the single/dual fiber optical transceiver assembly 50, the module circuit board 20 is provided with a chip heating element 26, the single/dual fiber optical transceiver assembly 50 is provided with a positioning ring 54, the side of the module circuit board 20 is provided with a board limiting portion 25, the module circuit board 20 is limited in the limiting notch 15 by the board limiting portion 25, and the heat conducting boss 16 is thermally coupled to the chip heating element 26 at a position corresponding to the thermal coupling position. In a specific example, the module circuit board 20 is a small-sized multilayer printed circuit board, but may be, without limitation, a packaged module, a ceramic circuit board, or other strip-shaped circuit structure. One of the functions of the module board 20 is circuit integration of the active devices within the module. The single/dual fiber optical transceiver component 50 may be a single fiber optical transceiver component having both optical receiving and optical emitting functions, or may be a dual fiber structure including an optical receiver and an optical transmitter. The electrical connection between the single/dual fiber optical transceiver module 50 and the module circuit board 20 may be a flexible board connection or a lead connection. The preferred specific pattern of electrical connections is primarily to achieve a retractable electrical connection between the single/dual fiber optical transceiver component 50 and the module circuit board 20. The thermally conductive bumps 16 and the chip heaters 26 may be thermally coupled by using a low viscosity thermally conductive paste, a high thermal conductivity adhesive metal paste or/and a metal gasket. In this example, the positioning ring 54 is a circular concave ring structure and the first positioning concave ring 14 is a semicircular convex ring structure extending in a concave arc.
Referring to fig. 6, the base 30 is combined on the housing cover 10, a second positioning concave ring 34 is disposed on the base 30 facing the optical fiber interface 12, the single/dual fiber optical transceiver component 50 is fixed to the first positioning concave ring 14 and the second positioning concave ring 34 through the positioning ring 54, a side edge of the module circuit board 20 is clamped and fixed between the housing cover 10 and the base 30, a first thermal convection channel 61 (as shown in fig. 7) bypassing the heat conducting boss 16 is formed between the module circuit board 20 and the housing cover 10, a second thermal convection channel 62 (as shown in fig. 7) is formed between the module circuit board 20 and the base 30, and both the first thermal convection channel 61 and the second thermal convection channel 62 are communicated to the plug port 13. The setting function of the base 30 includes, but is not limited to, a third heat conducting carrier for clamping the lower half part of the side edge of the module circuit board 20 and for conducting heat to the heating element on the module circuit board 20. In this example, the second positioning female ring 34 is a semi-circular male ring structure with a female arc extending. In this example, the first convective heat channel 61 and the second convective heat channel 62 are also in communicative relationship at the fiber optic interface 12.
Referring to fig. 4, the outer clip 40 is disposed at an outer peripheral portion of the housing cover 10 corresponding to the first positioning concave ring 14, the outer clip 40 has a middle attaching portion 41, a side clip attaching portion 42 bent and extended from two sides of the middle attaching portion 41, and a buckling portion 43 bent and extended from the side clip attaching portion 42, the middle attaching portion 41 and the side clip attaching portion 42 are attached to the housing cover 10 in a heat-conducting manner, and the buckling portion 43 is fastened to the base 30 in a heat-conducting manner, so as to establish a heat-conducting path from the heat-conducting boss 16 to the base 30 via the outer clip 40. The base 30 is configured to stabilize the clamping between the cover 10 and the base 30, enhance the heat conduction from the cover 10 to the base 30, and share the thermal stress of the locking point 70.
The implementation principle of the embodiment is as follows: the side edges of the module circuit board 20 are clamped and fixed between the housing cover 10 and the base 30 to form two heat convection channels communicated with the plug port 13 above and below the module circuit board 20, and the heat conduction boss 16 and the external clamping fastener 40 with a specific structure in the housing cover 10 are utilized, the heat conduction boss 16 is thermally coupled with the chip heater 26, the middle attaching part 41 and the side clamping attaching part 42 are attached to the housing cover 10 in a heat conduction way, the buckling part 43 is fastened to the base 30 in a heat conduction way to establish a heat conduction path from the heat conduction boss 16 to the base 30 through the external clamping fastener 40, so that two heat convection channels and a bad heat conduction path from the upper part of the chip to the heat conduction boss 16 around the two heat convection channels, the main body of the housing cover 10 to the base 30 through the external clamping fastener 40 are formed in the single/double fiber pluggable optical module, the air-cooled heat dissipation efficiency of the single/double fiber pluggable optical module product is improved, and the single/double fiber pluggable optical module is suitable for data transmission of high-speed communication. In a specific application, the heat dissipation type single/double fiber pluggable optical module is a BIDI SFP + optical module with a transmission rate of 10G/s or higher.
Regarding the chip heating element 26 and the thermal coupling configuration thereof using the heat conductive bump 16, in a preferred example, the chip heating element 26 includes at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly and an information storage chip assembly, and the heat conductive bumps 16 are plural and have a slightly larger area than the chip heating element 26. The information storage chip component is used for storing data required by the driving control chip component, such as temperature data or adjustment parameters, the driving control chip component is used for controlling the operation of the optical signal receiving/transmitting driving chip component, and the optical signal receiving/transmitting driving chip component is used for driving the single/double-fiber optical transceiver component 50 to actuate so as to transmit or receive laser signals. Therefore, the heat conduction bosses 16 are multiple and slightly large in area, so that the chip heating element 26 is effectively connected in a heat conduction mode without closing the first heat convection channel 61. Generally, the chip assembly is in various suitable semiconductor package forms, such as BGA, TSOP, QFP, SON, QFN, C4 or CSP package, or a DOC chip directly on the module circuit board 20 package, and the information storage chip assembly may be a separate package, or an SOC product or an SIP product integrated with the driving control chip assembly.
Regarding a specific but non-limiting structure of the external clamping member 40, in a preferred example, the external clamping member 40 is provided with an outwardly protruding elastic piece 44 at the middle attaching portion 41, a plurality of spring claws 45 with middle sections bent outward are formed at the sides of the middle attaching portion 41 and the side clamping portions 42 facing the optical fiber interface 12, preferably, the elastic piece 44 is located in an opening 46 of the middle attaching portion 41, the elastic piece 44 is integrally connected to a side of the opening 46 opposite to the insertion/extraction port 13, and preferably, the external clamping member 40 is provided with a first inner protruding point 47 at the side clamping portion 42 and a second inner protruding point 48 at the engaging portion 43, and is respectively engaged and positioned to the side wall of the housing cover 10 and the bottom of the base 30. Therefore, the elastic sheet 44 of the middle attaching portion 41, the middle attaching portion 41 and the spring claw 45 on one side of the side clamping portion 42 are utilized to enable the heat-dissipation type single/double-fiber pluggable optical module to be installed in a slot of telecommunication equipment such as a switch in a pluggable manner, and the external clamping mechanism of the heat-dissipation type single/double-fiber pluggable optical module does not directly influence or press the combination of the housing cover 10 and the base 30. Preferably, the specific connection orientation of the elastic sheet 44 is utilized to facilitate the slide-in and plug-in of the heat dissipation type single/dual-fiber pluggable optical module. Preferably, the first inner fastening protrusions 47 of the outer fastening member 40 at the side fastening portion 42 and the second inner fastening protrusions 48 at the fastening portion 43 are used to enhance the anti-slip positioning and heat conduction attachment of the outer fastening member 40 to the housing cover 10 and the base 30.
With regard to a specific but non-limiting coupling between the cover 10 and the base 30, in a preferred example, the cover 10 and the base 30 have grooves 17,37 for receiving the external clips 40. Therefore, the external clip 40 is embedded in the grooves 17 and 37, so that the heat dissipation type single/dual fiber pluggable optical module with the external clip 40 has more integrity, and the external clip 40 is prevented from directly scratching the slot of the telecommunication equipment.
With regard to a specific but non-limiting securing of the module circuit board 20 in the housing cover 10, in a preferred example, the housing cover 10 is provided with a positioning bar 18 on the inner side of the side wall, and the side edge of the module circuit board 20 is formed with a corresponding half-hole shaped positioning notch 28. preferably, the housing cover 10 is longer than the base 30, the housing cover 10 is provided with a snap notch 19 on the bottom edge of the side wall, the base 30 is provided with a correspondingly shaped snap flange 39 towards the plug port 13, and the locking point 70 of the housing cover 10 and the base 30 is adjacent to the fiber interface 12. Therefore, the module circuit board 20 is fixed in the housing cover 10 to be non-slidable by the positioning bar 18 of the housing cover 10 corresponding to the half-hole-shaped positioning notch 28 of the module circuit board 20, and the thermal coupling relationship between the chip heating element 26 and the heat-conducting boss 16 on the module circuit board 20 is stabilized. Preferably, the snap notches 19 on the bottom edges of the side walls of the housing cover 10 are engaged with the snap flanges 39 of the base 30, so that no locking points 70 or locking elements are needed for combining the housing cover 10 with the base 30 in the vicinity of the insertion/extraction port 13, and the quick combination of the housing cover 10 with the base 30 can be realized with a small number of locking points 70 by only installing the locking points 70 in the vicinity of the optical fiber interface 12. In this example, the positioning bar 18 is a multi-segmented structure that tapers from segment to segment, as shown in FIG. 5. In this example, the locking point 70 is a through hole structure at the base 30, the locking point 70 is a locking hole structure at the cover 10, and the locking point 70 further includes a fastener such as a screw rod coupled to the cover 10 through the base 30.
In a specific but non-limiting manner for the base 30 to achieve clamping of the module circuit board 20, in a preferred example, the base 30 has thickened side wall clips 31 (as shown in fig. 6 (a)) for clipping the board side edges of the module circuit board 20 and the side wall edges of the case cover 10 around the board side edges. Therefore, by using the sidewall clips 31 with the increased thickness of the base 30, when the module circuit board 20 is clamped and fixed inside, the sidewall clips 31 serve as supports for clamping and contacting the module circuit board 20 and the sidewall edges of the case cover 10, so that the clamping force of the base 30 on the case cover 10 can be greater than the clamping force of the base 30 on the module circuit board 20, and the circuit damage inside the module circuit board 20 can be reduced.
With respect to a preferred clamping relationship between the module circuit board 20 and the base 30, in a preferred example, the module circuit board 20 is provided with a first finger contact pad 21 (shown in fig. 3) facing the housing cover 10 and a second finger contact pad 22 (shown in fig. 2) exposed from the base 30 at the plug port 13, the module circuit board 20 is fixed in the housing cover 10 in a limited manner, and the module circuit board 20 is in slidable contact with the base 30. Therefore, by utilizing the fact that the module circuit board 20 is fixed in the housing cover 10 in a limited manner and is in slidable contact with the module circuit board 20 and the base 30, even if the base 30 is not matched with heat during high-speed operation of the optical module, stress damage to a circuit structure in the module circuit board 20 cannot be caused.
Referring to fig. 4, the present invention further provides an outer clamping buckle 40 of a heat dissipation type single/dual fiber pluggable optical module, which has a middle attaching portion 41, side clamping attaching portions 42 bent and extended from two sides of the middle attaching portion 41, and buckling portions 43 bent and extended from the side clamping attaching portions 42, wherein the middle attaching portion 41 and the side clamping attaching portions 42 are used for attaching the housing cover 10 of the heat dissipation type single/dual fiber pluggable optical module in a heat conducting manner, the buckling portions 43 are used for buckling the base 30 of the heat dissipation type single/dual fiber pluggable optical module in a heat conducting manner, preferably, the outer clamping buckle 40 is provided with an outwardly protruding elastic sheet 44 at the middle attaching portion 41, a plurality of spring claws 45 with middle sections bent outward are formed at one sides of the middle attaching portion 41 and the side clamping attaching portions 42 facing the optical fiber interface 12, preferably, the elastic sheet 44 is located in an opening 46 of the middle attaching portion 41, the elastic piece 44 is integrally connected to one side of the opening 46, which is relatively adjacent to the plug port 13, and preferably, the outer clip 40 is provided with a first inner snap bump 47 at the side clip attaching portion 42 and a second inner snap bump 48 at the snap portion 43, for being respectively snapped and positioned to the side wall of the case cover 10 and the bottom of the base 30. By utilizing the specific structure of the fastening portion 43, the overall heat conduction connection of the pluggable optical module is achieved, the excessive heated temperature difference between the base 30 and the housing cover 10 is avoided, and the external heat conduction effect of the pluggable optical module is accelerated.
Fig. 8 is a block diagram illustrating a flow chart of a method for assembling a heat-dissipating single/dual fiber pluggable optical module according to a second preferred embodiment of the present invention, fig. 9 is a schematic diagram illustrating a housing cover 10 provided in the method for assembling the heat-dissipating single/dual fiber pluggable optical module; fig. 10 is a schematic view illustrating reverse installation of the module circuit board 20 and the single/dual fiber optical transceiver module 50 in the housing cover 10 in the assembling method; FIG. 11 is a schematic view illustrating the assembly method of the base 30 on the housing cover 10; fig. 12 is a schematic view showing that the outer clamping unit 40 is provided at the outer periphery of the housing cover 10 to fasten the base 30 in the assembling method. The assembly method comprises the following main steps.
In step S1 of fig. 8, which can be compared to fig. 9, a housing cover 10 is provided. The shell cover 10 is internally formed into a strip-shaped device accommodating groove 11, one end of the device accommodating groove 11 is an optical fiber interface 12, the other end of the device accommodating groove 11 is a plug port 13, the device accommodating groove 11 is provided with a first positioning concave ring 14 adjacent to the optical fiber interface 12, a limiting notch 15 is arranged adjacent to the plug port 13, and a heat conducting boss 16 is formed in the device accommodating groove 11.
Referring to fig. 10, in step S2 of fig. 8, the module circuit board 20 and the single/dual fiber optical transceiver module 50 are mounted in the housing cover 10 in a reversed manner. The module circuit board 20 and the single/dual fiber optical transceiver component 50 are reversely mounted in the device accommodating groove 11, the module circuit board 20 is electrically connected with the single/dual fiber optical transceiver component 50, a chip heating element 26 is arranged on the module circuit board 20, the single/dual fiber optical transceiver component 50 is provided with a positioning ring 54, a plate limiting portion 25 is arranged on the side edge of the module circuit board 20, after the module circuit board 20 and the single/dual fiber optical transceiver component 50 are mounted, the single/dual fiber optical transceiver component 50 is fixed on the first positioning concave ring 14 through a part of the positioning ring 54, the module circuit board 20 is limited in the limiting notch 15 through the plate limiting portion 25, and the heat conducting boss 16 is thermally coupled with the chip heating element 26 corresponding to the position.
Fig. 11 can be compared with fig. 8 in step S3, and the base 30 is coupled to the cover 10. The base 30 orientation fiber interface 12 department is equipped with second location scrobicular ring 34, single/double fiber optical transceiver subassembly 50 warp the rest of holding ring 54 is fixed in second location scrobicular ring 34, and the side clamp of module circuit board 20 is fixed in the cap 10 with between the base 30, module circuit board 20 with form between the cap 10 and walk around heat conduction boss 16's first heat convection channel 61, module circuit board 20 with form second heat convection channel 62 between the base 30, first heat convection channel 61 with second heat convection channel 62 all communicates to plug port 13.
In step S4 of fig. 8, which can be compared with fig. 12, an external clip 40 is provided on the outer periphery of the cover 10 to fasten the base 30. The shell cover 10 corresponds the outer peripheral edge position of first location notch ring 14 sets up outer fastener 40 that presss from both sides, outer fastener 40 has middle laminating portion 41, by the side that middle laminating portion 41 both sides were buckled and are extended presss from both sides laminating portion 42 and by the buckling parts 43 that side presss from both sides laminating portion 42 and buckle and extend again, middle laminating portion 41 with side presss from both sides laminating portion 42 and attaches with heat conduction the shell cover 10, buckling parts 43 heat conduction ground lock joint base 30, in order to establish heat conduction boss 16 via outer fastener 40 extremely the heat conduction path of base 30. In this example, the pull ring 80 at the fiber optic interface 12 may also be assembled together.
The implementation principle of the embodiment is as follows: the module circuit board 20 and the single/double fiber optical transceiver component 50 are reversely mounted, the module circuit board 20 is pre-positioned and arranged in the case cover 10, the module circuit board 20 is clamped between the case cover 10 and the base 30 and does not directly generate a mechanical combination relation with the base 30, two heat convection channels which are vertically communicated with the module circuit board 20 and an annular heat conduction path which surrounds the two heat convection channels are provided, and the pluggable optical module has a more excellent outward heat conduction effect in an air cooling mode, and is suitable for manufacturing a new generation of more advanced optical module products.
In a preferred example, in the step of mounting the module circuit board 20, the chip heating element 26 includes at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly and an information storage chip assembly, and the heat conducting bosses 16 are plural and have an area slightly larger than that of the chip heating element 26.
Or, in the step of providing the external clip 40, the external clip 40 is provided with an outward-protruding elastic piece 44 at the middle attaching portion 41, a plurality of spring claws 45 with middle sections bent outward are formed at one sides of the middle attaching portion 41 and the side clip attaching portions 42 facing the optical fiber interface 12, preferably, the elastic piece 44 is located in an opening 46 of the middle attaching portion 41, the elastic piece 44 is integrally connected to one side of the opening 46 relatively adjacent to the plug port 13, preferably, the external clip 40 is provided with a first inner snap convex point 47 at the side clip attaching portion 42 and a second inner snap convex point 48 at the snap portion 43, and the first inner snap convex point and the second inner snap convex point are respectively snapped and positioned to the side wall of the housing cover 10 and the bottom of the base 30.
In a preferred example, in the step of combining the base 30 and the cover 10, the cover 10 and the base 30 have grooves 17,37 for embedding the external clamping fasteners 40.
In a preferred example, the housing cover 10 is provided with positioning bars 18 on the inner surfaces of the side walls in the step of providing the housing cover 10, the module circuit board 20 is provided with corresponding half-hole-shaped positioning notches 28 on the side edges in the step of mounting the module circuit board 20, preferably, the housing cover 10 is longer than the base 30 in the step of combining the base 30 and the housing cover 10, the housing cover 10 is provided with snap notches 19 on the bottom edges of the side walls, the base 30 is provided with corresponding snap flanges 39 in a shape facing the plug port 13, and the locking points 70 of the housing cover 10 and the base 30 are adjacent to the optical fiber interface 12.
In a preferred example, in the step of combining the base 30 and the cover 10, the base 30 has a thickened side wall clip 31 for clipping the board-side edge of the module circuit board 20 and the side wall edge of the cover 10 around the board-side edge.
In a preferred example, the module circuit board 20 is provided with a first finger-shaped contact pad 21 facing the housing cover 10 and a second finger-shaped contact pad 22 exposed from the base 30 at the plug port 13, and after the step of providing the external clamping member 40, the module circuit board 20 is fixed in the housing cover 10 in a limited manner, and the module circuit board 20 is in slidable contact with the base 30.
The embodiments of the present invention are merely preferred embodiments for easy understanding or implementing of the technical solutions of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes in structure, shape and principle of the present invention should be covered by the claims of the present invention.

Claims (12)

1. A heat dissipation type single/double fiber pluggable optical module is characterized by comprising:
the optical fiber connector comprises a shell cover (10), wherein a strip-shaped device accommodating groove (11) is formed in the shell cover (10), one end of the device accommodating groove (11) is an optical fiber interface (12), the other end of the device accommodating groove is a plug port (13), the device accommodating groove (11) is provided with a first positioning concave ring (14) adjacent to the optical fiber interface (12), a limiting notch (15) is arranged adjacent to the plug port (13), and a heat conduction boss (16) is formed in the device accommodating groove (11);
the module circuit board (20) is installed in the device accommodating groove (11), the module circuit board (20) is electrically connected with the single/double-fiber optical transceiver component (50), a chip heating element (26) is arranged on the module circuit board (20), the single/double-fiber optical transceiver component (50) is provided with a positioning ring (54), the side edge of the module circuit board (20) is provided with a board limiting part (25), the module circuit board (20) is limited in the limiting notch (15) through the board limiting part (25), and the heat-conducting boss (16) is thermally coupled with the chip heating element (26) corresponding to the position;
a base (30) combined on the shell cover (10), wherein a second positioning concave ring (34) is arranged on the base (30) facing the optical fiber interface (12), the single/dual fiber optical transceiver component (50) is fixed to the first positioning concave ring (14) and the second positioning concave ring (34) via the positioning ring (54), and the side edge of the module circuit board (20) is clamped and fixed between the shell cover (10) and the base (30), a first heat convection channel (61) bypassing the heat conduction boss (16) is formed between the module circuit board (20) and the shell cover (10), a second heat convection channel (62) is formed between the module circuit board (20) and the base (30), the first heat convection channel (61) and the second heat convection channel (62) are both communicated with the plugging port (13);
the outer clamping fastener (40) is arranged at the outer peripheral part of the shell cover (10) corresponding to the first positioning concave ring (14), the outer clamping fastener (40) is provided with a middle attaching part (41), side clamping attaching parts (42) extending from two sides of the middle attaching part (41) in a bending mode and buckling parts (43) extending from the side clamping attaching parts (42) in a bending mode, the middle attaching part (41) and the side clamping attaching parts (42) are attached to the shell cover (10) in a heat conduction mode, the buckling parts (43) are fastened to the base (30) in a heat conduction mode, and a heat conduction path from the heat conduction boss (16) to the base (30) through the outer clamping fastener (40) is established;
the outer clamping fastener (40) is provided with an elastic sheet (44) protruding outwards at the middle attaching portion (41), a plurality of spring claws (45) with middle sections bending outwards are formed on one sides, facing the optical fiber interface (12), of the middle attaching portion (41) and the side clamping attaching portions (42), the elastic sheet (44) is located in an opening (46) of the middle attaching portion (41), the elastic sheet (44) is integrally connected to one side, relatively close to the plugging port (13), of the opening (46), the outer clamping fastener (40) is provided with a first inner buckling salient point (47) at the side clamping attaching portion (42), and a second inner buckling salient point (48) at the buckling portion (43) is buckled and positioned to the side wall of the shell cover (10) and the bottom of the base (30) respectively.
2. The pluggable optical module with single/dual optical fiber for dissipating heat of claim 1, wherein the chip heater (26) comprises at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly, and an information storage chip assembly, and the heat conducting bumps (16) are multiple and have a slightly larger area than the chip heater (26).
3. The pluggable optical module with single/double fiber for dissipating heat according to claim 1, wherein the housing cover (10) and the base (30) have grooves (17,37) for embedding the external clip (40).
4. The heat dissipation type single/double fiber pluggable optical module of claim 1, wherein the housing cover (10) is provided with a positioning bar (18) on an inner surface of a sidewall, a corresponding half-hole-shaped positioning notch (28) is formed on a side edge of the module circuit board (20), the housing cover (10) is longer than the base (30), the housing cover (10) is provided with a fastening notch (19) on a bottom edge of the sidewall, the base (30) is provided with a fastening flange (39) facing the plug port (13) and having a corresponding shape, and a locking point (70) of the housing cover (10) and the base (30) is adjacent to the optical fiber interface (12).
5. The thermal add-on single/dual fiber pluggable optical module of claim 1, wherein the base (30) has thickened sidewall clips (31) for clipping against the board side edges of the module circuit board (20) and the sidewall edges of the cover (10) around the board side edges.
6. The pluggable optical module with single/double optical fiber for heat dissipation according to any of claims 1-5, wherein the module circuit board (20) has a first finger-shaped contact pad (21) facing the housing cover (10) and a second finger-shaped contact pad (22) exposed from the base (30) at the plug port (13), the module circuit board (20) is fixed in the housing cover (10) in a limited manner, and the module circuit board (20) is in slidable contact with the base (30).
7. A method for assembling a heat dissipation type single/double fiber pluggable optical module is characterized by comprising the following steps:
providing a shell cover (10), wherein a strip-shaped device accommodating groove (11) is formed in the shell cover (10), one end of the device accommodating groove (11) is an optical fiber interface (12), the other end of the device accommodating groove is a plug port (13), the device accommodating groove (11) is provided with a first positioning concave ring (14) adjacent to the optical fiber interface (12), a limiting notch (15) is arranged adjacent to the plug port (13), and a heat conducting boss (16) is formed in the device accommodating groove (11);
a module circuit board (20) and a single/double fiber optical transceiver component (50) are reversely arranged in the device accommodating groove (11), the module circuit board (20) is electrically connected with the single/double fiber optical transceiver component (50), a chip heating element (26) is arranged on the module circuit board (20), the single/double-fiber optical transceiver component (50) is provided with a positioning ring (54), the side edge of the module circuit board (20) is provided with a board limiting part (25); after mounting the module circuit board (20) and the single/dual fiber optical transceiver component (50), the single/dual fiber optical transceiver component (50) is secured to the first retaining ring (14) via a portion of the retaining ring (54), the module circuit board (20) is limited in the limiting notch (15) through the board limiting part (25), the heat conduction boss (16) is thermally coupled with the chip heating body (26) corresponding to the position;
a base (30) is combined on the housing cover (10), a second positioning concave ring (34) is arranged on the base (30) facing the optical fiber interface (12), the single/dual fiber optical transceiver component (50) is fixed to the second positioning concave ring (34) through the rest of the positioning ring (54), a side edge of the module circuit board (20) is clamped and fixed between the housing cover (10) and the base (30), a first heat convection channel (61) bypassing the heat conduction boss (16) is formed between the module circuit board (20) and the housing cover (10), a second heat convection channel (62) is formed between the module circuit board (20) and the base (30), and the first heat convection channel (61) and the second heat convection channel (62) are both communicated with the plug port (13);
an outer clamping fastener (40) is arranged at the outer peripheral edge part of the shell cover (10) corresponding to the first positioning concave ring (14), the outer clamping fastener (40) is provided with a middle attaching part (41), side clamping attaching parts (42) bent and extended from two sides of the middle attaching part (41) and buckling parts (43) bent and extended from the side clamping attaching parts (42), the middle attaching part (41) and the side clamping attaching parts (42) are attached to the shell cover (10) in a heat conduction mode, and the buckling parts (43) are buckled to the base (30) in a heat conduction mode to establish a heat conduction path from the heat conduction boss (16) to the base (30) through the outer clamping fastener (40);
in the step of arranging the outer clamping fastener (40), the outer clamping fastener (40) is provided with an elastic sheet (44) protruding outwards at the middle attaching part (41), a plurality of spring claws (45) with middle sections bending outwards are formed on one sides of the middle attaching part (41) and the side clamping attaching part (42) facing the optical fiber interface (12), the elastic sheet (44) is located in an opening (46) of the middle attaching part (41), the elastic sheet (44) is integrally connected to one side of the opening (46) relatively adjacent to the plugging port (13), the outer clamping fastener (40) is provided with a first inner buckling salient point (47) at the side clamping attaching part (42), and a second inner buckling salient point (48) at the buckling part (43) and is buckled and positioned to the side wall of the shell cover (10) and the bottom of the base (30) respectively.
8. The method of claim 7, wherein in the step of mounting the module circuit board (20), the chip heater (26) comprises at least two of an optical signal receiving/transmitting driving chip assembly, a driving control chip assembly and an information storage chip assembly, and the plurality of heat-conducting bosses (16) are slightly larger than the chip heater (26).
9. The method of claim 7, wherein in the step of combining the housing cover (10) with the base (30), the housing cover (10) and the base (30) have grooves (17,37) for embedding the external clip (40).
10. The method for assembling the heat dissipation type single/double fiber pluggable optical module of claim 7, wherein the housing cover (10) is provided with a positioning bar (18) on an inner surface of a sidewall in the step of providing the housing cover (10), the module circuit board (20) is provided with a corresponding half-hole-shaped positioning notch (28) on a side edge thereof in the step of installing the module circuit board (20), the housing cover (10) is longer than the base (30) in the step of combining the base (30) and the housing cover (10), the housing cover (10) is provided with a fastening notch (19) on a bottom edge of the sidewall, the base (30) is provided with a fastening flange (39) with a corresponding shape facing the plug port (13), and a fastening point (70) of the housing cover (10) and the base (30) is adjacent to the optical fiber interface (12).
11. The method of claim 7, wherein in the step of coupling the base (30) and the housing cover (10), the base (30) has thickened sidewall clips (31) for clipping the board-side edges of the module circuit board (20) and the sidewall edges of the housing cover (10) around the board-side edges.
12. The method of claim 7, wherein the module circuit board (20) has a first finger-shaped contact pad (21) facing the housing cover (10) and a second finger-shaped contact pad (22) exposed from the base (30) at the plug port (13), and after the step of disposing the external clamping device (40), the module circuit board (20) is fixed in the housing cover (10) in a limited manner, and the module circuit board (20) is in slidable contact with the base (30).
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