CN111151898A - Spiral-direction-rising amplitude-coiling punching method and punching system - Google Patents
Spiral-direction-rising amplitude-coiling punching method and punching system Download PDFInfo
- Publication number
- CN111151898A CN111151898A CN202010016304.2A CN202010016304A CN111151898A CN 111151898 A CN111151898 A CN 111151898A CN 202010016304 A CN202010016304 A CN 202010016304A CN 111151898 A CN111151898 A CN 111151898A
- Authority
- CN
- China
- Prior art keywords
- laser
- spiral line
- galvanometer
- axis
- amplitude
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a drilling method which rises in a spiral direction and is coiled in amplitude, and belongs to the technical field of laser drilling. The invention comprises the following steps: arranging a spiral line, wherein the spiral line is coiled and ascended along a central shaft from bottom to top, and the height of the spiral line is the same as the thickness of a product to be processed; setting a laser walking path, wherein the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion with the spiral line as a central line; setting laser drilling parameters; adjusting the starting point position of a 3D galvanometer of a laser, and focusing the laser on the lower surface of a material to be processed; and the Z axis of the 3D galvanometer is linked with the XY axis, and laser spirally rises along the laser walking path line and is coiled and punched in an amplitude manner until the spiral line is walked. The invention has the beneficial effects that: the control time is reduced, and the processing efficiency is improved.
Description
Technical Field
The invention relates to the technical field of laser drilling, in particular to a drilling method and a drilling system which rise in a spiral direction and are coiled in an amplitude mode.
Background
The prior art mainly has the following three modes:
1. and (3) mechanical drilling mode: the motor drives the high-quality diamond drill, and the drill rotates at a high speed to grind the surface of the glass, so that the glass generates a circular hole site. The technology is only suitable for drilling the glass with the thickness of more than 2mm, and for the glass with the thickness of less than 2mm, the rate of finished products of the drilling technology is very low, and the efficiency is low; the bore diameter of the drill is determined by the size of the drill bit and cannot be changed randomly; the drill bit is worn greatly, needs to be replaced regularly, and has high shutdown rate and cost.
2. Drilling mode of laser and mechanical z-axis matched 2D galvanometer (drilling path is shown in figure 1): keeping the position of the glass under the field lens still, adjusting the rising or falling of a mechanical z-axis, focusing the laser focus on the lower surface of the material to be processed, and processing layer by layer from bottom to top by matching the mechanical z-axis with a 2D galvanometer.
The concrete mode is as follows: the center of the vibrating mirror is located above the axis of the hole, when the z axis is located at the lowest layer, after an instruction is sent to the 2D vibrating mirror, the vibrating mirror runs from the axis position 1 to the starting point of a spiral line, at the moment, the laser sends out laser, the vibrating mirror moves along the spiral line, each layer of spiral line is an independent spiral line and is composed of a fixed inner diameter, a line interval of 0.03-0.05mm and 4-6 lines. And after the layer of spiral line is finished, the laser is turned off, the vibrating mirror returns to the axis position, the mechanical z axis moves upwards at a constant speed by a layer height d, and the steps are circulated in such a way, so that the layer number N is finished finally.
The disadvantages of this technique are:
(1) because each layer of laser has the processes of switching on and switching off, the entrance of the spiral line can be left with residue or cracks which are not completely cut, so that white stripes or large broken edges appear in the hole, stress concentration points are easily formed, the hole wall is cracked from the position, and meanwhile, the hole wall is rough and not smooth;
(2) the synchronization and coordination of the mechanical z axis and the XY axis cannot be ensured, repeated processing may occur, and the processing efficiency cannot be maximized.
3. The laser and the 3D galvanometer are combined with a conventional software control punching mode (the punching path is the same as that in the figure 1): keeping the glass position under the field lens still, adjusting the 3D galvanometer, focusing the laser focus on the lower surface of the material to be processed, and adjusting the focus position by the 3D galvanometer so as to realize layer-by-layer processing from bottom to top. The concrete mode is as follows: the center of the vibrating mirror is positioned above the axis of the hole, the z axis is static, after a processing instruction is given, the vibrating mirror runs from the axis to the starting point of the spiral line, at the moment, the laser emits laser, the vibrating mirror moves along the spiral line, each layer of spiral line is an independent spiral line and consists of a fixed inner diameter, a line interval of 0.03-0.05mm and 4-6 lines. After the layer of spiral line is moved, the laser is turned off, the galvanometer returns to the axis position, the focus controlled by the 3D galvanometer is raised by one layer for continuous processing, and the process is circulated in such a way, and finally the layer number is moved.
The disadvantages of this technique are:
(1) similarly, each layer of laser has the processes of turning on and off, so that slag or cracks remained in the entrance of the spiral line due to incomplete cutting can be left, and the hole wall is rough and not smooth;
(2) due to the adoption of the 3D galvanometer, the motion efficiency and the processing mode are faster than those of the prior art 1 and the prior art 2, but the galvanometer z axis is not linked with the XY axes, so that the processing efficiency cannot be maximized.
Disclosure of Invention
In order to solve the problems of rough processing and low processing efficiency in the prior art, the invention provides a spiral-direction-rising amplitude-coiling punching method and a punching system for realizing the spiral-direction-rising amplitude-coiling punching method.
The invention comprises the following steps:
s1: arranging a spiral line, wherein the spiral line is coiled and ascended along a central shaft from bottom to top, and the height of the spiral line is the same as the thickness of a product to be processed;
s2: setting a laser walking path, wherein the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion with the spiral line as a central line;
s3: setting laser drilling parameters;
s4: adjusting the starting point position of a 3D galvanometer of a laser, and focusing the laser on the lower surface of a material to be processed;
s5: and the Z axis of the 3D galvanometer is linked with the XY axis, and laser spirally rises along the laser walking path line and is coiled and punched in an amplitude manner until the spiral line is walked.
The invention is further improved, and the method also comprises the step S6: the laser is turned off, and the Z axis and the XY axis of the 3D galvanometer return to the initial positions.
In a further improvement of the present invention, in step S1, the spiral line includes n layers, the pitch H between adjacent spiral lines is 0.02mm-0.04mm, which is determined according to the size of the laser explosion point, and n is an integer no less than 1.
In a further development of the invention, in step S2, the sinusoidal movement function is
Wherein A is amplitude, and is determined according to the width of a cutting slit; omega is determined according to the size of a laser explosion point; x is 0-n.pi.D, depending on the glass thickness, n is the number of layers, D is the diameter of the drilled hole circle,
the position of the laser cutting opening is set according to the requirement.
The invention is further improved, the value range of the amplitude A is 0.2mm-0.4mm, the value range of omega is 25 pi-50 pi, and the amplitude A is
The value range is 0-2 pi.
In step S5, the Z axis of the 3D galvanometer is raised at a constant speed and a height of the Z axis is increased
After the Z axis passes through a layer of spiral line, the laser focus controlled by a galvanometer of the laser is raised by H.
The invention also provides a punching system for realizing the punching method which ascends in the spiral direction and winds in the amplitude, which comprises a controller and a laser, wherein,
the controller includes: helix setting module: the spiral line is arranged and is coiled and ascended along the central shaft from bottom to top, and the height of the spiral line is the same as the thickness of a product to be processed; laser walking path sets up the module: the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion by taking the spiral line as a central line; laser drilling parameter setting module: the laser drilling device is used for setting laser drilling parameters; a laser control module: and the laser device is used for adjusting the starting point position of the 3D galvanometer of the laser device, focusing laser on the lower surface of the material to be processed and controlling the laser device to punch holes along the laser walking path.
The laser is controlled by the controller, and the laser comprises a 3D galvanometer, wherein the 3D galvanometer is linked by a Z axis and an XY axis and carries out laser drilling along a laser walking path.
In a further improvement of the present invention, the controller further comprises a zeroing module: the device is used for controlling the 3D galvanometer to determine the initial position before punching and controlling the 3D galvanometer to return to the initial position after punching.
Compared with the prior art, the invention has the beneficial effects that: in the whole laser processing process, laser moves sinusoidally along the spiral direction to generate amplitude to form a seam width, and the driving path is shorter than that of a single-layer spiral line. Meanwhile, the laser is only turned on and off once for the laser, and the galvanometer only has two idle strokes of the idle stroke before the laser is turned on and the idle stroke returning to the initial state after the laser is turned off, so that the actions of the idle stroke before the laser is turned on, the laser is turned off, the axis returning after the laser is turned off and the like for each layer in the prior art are greatly reduced, the control time is reduced, and the processing efficiency is improved; 2. each layer of spiral line has no laser opening and closing entrance, only has one laser opening and closing, has very smooth cutting section, does not have cracks or hang slag, and can be applied to the field of precision machining.
Drawings
FIG. 1 is a schematic illustration of a laser processing path of prior art 2, 3;
FIG. 2 is a schematic top view of a laser walking path according to the present invention;
fig. 3 is a schematic diagram of a laser movement track.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Hardware basis of the invention:
(1) the processing object of the invention is mainly the laser processing of transparent brittle materials such as glass, sapphire and the like, and the focused energy of the laser can directly gasify the materials near the focus;
(2) the invention adopts a 3D galvanometer as a scanning tool.
The specific implementation method of the invention is as follows:
1. setting parameters by a controller
The method mainly comprises the following steps:
(1) setting the distance H between adjacent spiral lines of the spiral lines, the diameter of the spiral lines, the height of the spiral lines and the like, wherein the spiral lines are coiled and ascend along a central shaft from bottom to top, and the height of the spiral lines is the same as the thickness of a product to be processed;
(2) and controlling the laser walking path through software programming to form a laser path which rises along the spiral line direction and is coiled with amplitude along the spiral line. Specifically, the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion with the spiral line as a central line.
(3) And setting laser drilling parameters, wherein the drilling parameters comprise laser power, frequency, drilling speed and the like.
2. Laser drilling
As shown in fig. 2 and fig. 3, the specific implementation method of the present invention is:
(1) and adjusting the starting point position of the focus of the 3D galvanometer, and focusing the laser on the lower surface of the material to be processed.
(2) The center of the 3D vibrating mirror is located above the axis 1 of the hole of the material to be processed, the Z axis of the 3D vibrating mirror is static, after the system receives a processing starting instruction, the XY axis of the 3D vibrating mirror runs from the axis to the starting point of the spiral line, at the moment, the laser emits laser, and the laser focus controlled by the 3D vibrating mirror rises along the spiral direction of the spiral line 2 to perform sinusoidal motion.
The sinusoidal motion function of this example is
Wherein A is amplitude, the value range is 0.2mm-0.4mm, and the amplitude is determined according to the width of a cutting seam; the value range of omega is 25 pi-50 pi, which is determined according to the size of a laser explosion point; x is 0-n.pi.D (n is the number of layers; D is the diameter of a drilling circle) and is determined according to the thickness of the glass;
the value range is 0-2 pi, the position of the laser cutting inlet is set according to requirements, the edge breakage amount is reduced, and cracks and slag adhering are avoided; the distance H between adjacent spirals is 0.02mm-0.04mm and is determined according to the size of a laser explosion point; along the spiral direction, the Z axis rises at a constant speed and the rising height
After the second layer of spiral line is walked, the laser focus controlled by the galvanometer is raised by 2H. And circulating in this way, the Z axis and the XY axis are linked until the whole laser walking path 3 is completed, the laser is turned off, and the Z axis and the XY axis of the 3D galvanometer return to the initial positions.
The invention has the following innovation points:
(1) in the whole laser processing process, laser moves sinusoidally along the spiral direction to generate amplitude to form a seam width, and the driving path is shorter than that of a single-layer spiral line. Meanwhile, the laser is only turned on and off once for the laser, and the galvanometer only has two idle strokes of the idle stroke before the laser is turned on and the idle stroke after the laser is turned off and returns to the initial state, so that the actions of the idle stroke before the laser is turned on, the laser is turned off, the laser returns to the axis after the laser is turned off and the like for each layer in the prior art are greatly reduced, the control time is reduced, and the processing efficiency is improved.
(2) Each layer of spiral line has no laser opening and closing entrance, only has one laser opening and closing, has very smooth cutting section, does not have cracks or hang slag, and can be applied to the field of precision machining.
The above-described embodiments are intended to be illustrative, and not restrictive, of the invention, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (8)
1. A punching method which ascends in a spiral direction and is coiled in amplitude is characterized by comprising the following steps:
s1: arranging a spiral line, wherein the spiral line is coiled and ascended along a central shaft from bottom to top, and the height of the spiral line is the same as the thickness of a product to be processed;
s2: setting a laser walking path, wherein the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion with the spiral line as a central line;
s3: setting laser drilling parameters;
s4: adjusting the starting point position of a 3D galvanometer of a laser, and focusing the laser on the lower surface of a material to be processed;
s5: and the Z axis of the 3D galvanometer is linked with the XY axis, and laser spirally rises along the laser walking path line and is coiled and punched in an amplitude manner until the spiral line is walked.
2. The helically ascending amplitude coiled perforating method of claim 1, wherein: further comprising step S6: the laser is turned off, and the Z axis and the XY axis of the 3D galvanometer return to the initial positions.
3. The spirally rising amplitude coiled perforating method as claimed in claim 1 or 2, characterized in that: in step S1, the spiral line includes n layers, the pitch H between adjacent spiral lines is 0.02mm-0.04mm, depending on the size of the laser explosion point, and n is an integer no less than 1.
4. The spiral direction rising and amplitude of claim 3The coiled perforating method is characterized in that: in step S2, the sinusoidal motion function is
Wherein A is amplitude, and is determined according to the width of a cutting slit; omega is determined according to the size of a laser explosion point; x is 0-n.pi.D, depending on the glass thickness, n is the number of layers, D is the diameter of the drilled hole circle,
the position of the laser cutting opening is set according to the requirement.
5. The helically ascending amplitude coiled perforating method of claim 4, wherein: the amplitude A ranges from 0.2mm to 0.4mm, the omega ranges from 25 pi to 50 pi, and the amplitude A and the omega have the same value
The value range is 0-2 pi.
6. The helically ascending amplitude coiled perforating method of claim 4, wherein: in step S5, the Z-axis of the 3D galvanometer is raised at a constant speed and the height of the Z-axis is increased
After the Z axis passes through a layer of spiral line, the laser focus controlled by a galvanometer of the laser is raised by H.
7. A punching system for realizing the spirally-ascending amplitude-coiling punching method according to claim 4, wherein: comprises a controller and a laser, wherein,
the controller includes:
helix setting module: the spiral line is arranged and is coiled and ascended along the central shaft from bottom to top, and the height of the spiral line is the same as the thickness of a product to be processed;
laser walking path sets up the module: the laser walking path is a sine curve which rises along the spiral line direction and is formed by sine motion by taking the spiral line as a central line;
laser drilling parameter setting module: the laser drilling device is used for setting laser drilling parameters;
a laser control module: the laser processing device is used for adjusting the starting point position of a 3D galvanometer of the laser, focusing laser on the lower surface of a material to be processed, and controlling the laser to drill along the laser walking path;
the laser is controlled by the controller, and the laser comprises a 3D galvanometer, wherein the 3D galvanometer is linked by a Z axis and an XY axis and carries out laser drilling along a laser walking path.
8. The perforating system of claim 7 wherein: the controller further comprises a zeroing module: the device is used for controlling the 3D galvanometer to determine the initial position before punching and controlling the 3D galvanometer to return to the initial position after punching.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010016304.2A CN111151898A (en) | 2020-01-07 | 2020-01-07 | Spiral-direction-rising amplitude-coiling punching method and punching system |
| CN202010313295.3A CN111421253B (en) | 2020-01-07 | 2020-04-20 | Spiral-direction-rising amplitude-coiling punching method and punching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010016304.2A CN111151898A (en) | 2020-01-07 | 2020-01-07 | Spiral-direction-rising amplitude-coiling punching method and punching system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111151898A true CN111151898A (en) | 2020-05-15 |
Family
ID=70561788
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010016304.2A Pending CN111151898A (en) | 2020-01-07 | 2020-01-07 | Spiral-direction-rising amplitude-coiling punching method and punching system |
| CN202010313295.3A Active CN111421253B (en) | 2020-01-07 | 2020-04-20 | Spiral-direction-rising amplitude-coiling punching method and punching system |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010313295.3A Active CN111421253B (en) | 2020-01-07 | 2020-04-20 | Spiral-direction-rising amplitude-coiling punching method and punching system |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN111151898A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
| CN116441765A (en) * | 2023-03-24 | 2023-07-18 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113523545B (en) * | 2021-06-25 | 2022-10-21 | 上海工程技术大学 | Laser welding method for galvanized steel |
| CN114167019B (en) * | 2021-12-02 | 2023-07-07 | 长春工程学院 | Monitoring method and cleaning device of water quality monitor capable of being automatically cleaned |
| CN117444429A (en) * | 2023-12-25 | 2024-01-26 | 西安晟光硅研半导体科技有限公司 | Process method for spiral machining of holes based on micro-jet technology |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002113587A (en) * | 2000-10-10 | 2002-04-16 | Ricoh Microelectronics Co Ltd | Method and device for laser beam machining |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| JP2007268576A (en) * | 2006-03-31 | 2007-10-18 | Hitachi Via Mechanics Ltd | Laser beam machining method |
| JP2010024064A (en) * | 2008-07-15 | 2010-02-04 | Seiko Epson Corp | Method for manufacturing structure and droplet ejection head |
| CN101610643B (en) * | 2009-07-14 | 2010-12-01 | 华中科技大学 | Method for processing blind hole by laser |
| CN107175409A (en) * | 2017-05-26 | 2017-09-19 | 苏州菲镭泰克激光技术有限公司 | The three-dimensional laser fine machining system and method for crisp and hard material |
| CN109352190B (en) * | 2018-11-20 | 2022-01-11 | 深圳市吉祥云科技有限公司 | Laser drilling control method |
| CN110091078A (en) * | 2019-05-31 | 2019-08-06 | 华中科技大学 | A kind of three-dimensional column hole laser cutting method for glass |
-
2020
- 2020-01-07 CN CN202010016304.2A patent/CN111151898A/en active Pending
- 2020-04-20 CN CN202010313295.3A patent/CN111421253B/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112157357A (en) * | 2020-08-20 | 2021-01-01 | 深圳市吉祥云科技有限公司 | Laser processing control method for glass special-shaped hole |
| CN116441765A (en) * | 2023-03-24 | 2023-07-18 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
| CN116441765B (en) * | 2023-03-24 | 2024-04-05 | 中国科学院西安光学精密机械研究所 | Straight round hole laser processing spiral line track planning method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111421253A (en) | 2020-07-17 |
| CN111421253B (en) | 2022-01-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111151898A (en) | Spiral-direction-rising amplitude-coiling punching method and punching system | |
| CN109352190B (en) | Laser drilling control method | |
| CN104162741B (en) | Laser processing device and method thereof | |
| CN105057893B (en) | Laser boring diced system for semi-conducting material | |
| CN102248307B (en) | Ultraviolet laser fine processing device and method with double optical heads for different limiting apertures | |
| EP2221132A1 (en) | Production device and production method of metal powder sintered component | |
| CN100396424C (en) | Laser processing device, processing method, and method of producing circuit substrate using the method | |
| CN105983786B (en) | A method of glass processing is realized using laser | |
| US20140147328A1 (en) | Method for producing three-dimensional shaped object | |
| CN103394805B (en) | Cut perforating device and cutting and boring method | |
| CN113441852B (en) | Laser spiral scanning blind hole manufacturing method | |
| CN105463452B (en) | A kind of manufacturing process of laser fast forming part | |
| CN204122927U (en) | Laser processing device | |
| CN204818451U (en) | Laser beam perforating cuts all -in -one | |
| CN204843275U (en) | A laser beam perforating cutting system for semi conducting material | |
| KR20180099788A (en) | Method for manufacturing three-dimensional sculpture | |
| CN109702326A (en) | A kind of devices and methods therefor improving laser boring depth | |
| JP2009108350A (en) | Method of manufacturing metal powder sintered component | |
| JP2008111151A (en) | Shaping method with light | |
| KR102621458B1 (en) | Laser processing device, laser processing system, rotator unit device, laser processing method and production method of probe card | |
| CN111250878B (en) | Four-axis laser cutting and punching machine for machining wire-drawing die and punching method | |
| CN1546272A (en) | Laser cladding method for stick milling cutter | |
| CN103183470A (en) | Light-saw glass laser cutting system and method | |
| CN1363440A (en) | Selective laser evaporating-sintering technology and system for quickly shaping thin wall with powder material | |
| CN1088640C (en) | Fast prototype method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200515 |
|
| WD01 | Invention patent application deemed withdrawn after publication |