CN111093349A

CN111093349A - Modular three-dimensional PCB module

Info

Publication number: CN111093349A
Application number: CN202010014464.3A
Authority: CN
Inventors: 姚丽俊; 成国梁
Original assignee: Shenzhen Jiang Lin Electronic Technology Co ltd
Current assignee: Shenzhen Jiang Lin Electronic Technology Co ltd
Priority date: 2020-01-07
Filing date: 2020-01-07
Publication date: 2020-05-01

Abstract

The utility model relates to a PCB technical field especially relates to three-dimensional PCB module of modularization, including enclosing a plurality of PCB boards of establishing formation heat dissipation channel, heat dissipation channel one end be equipped with be used for with radiator fan that the air in the heat dissipation channel was taken out, the last mount pad that is equipped with of radiator fan. The application provides a three-dimensional PCB module of modularization, the heat that the PCB board during operation produced is concentrated by radiator fan and is taken away, and the radiating efficiency is higher, and encloses the PCB board of establishing and save space more than tiling.

Description

Modular three-dimensional PCB module

[ technical field ] A method for producing a semiconductor device

The application relates to the technical field of PCBs, in particular to a modular three-dimensional PCB module.

[ background of the invention ]

With the development of technology, people endow the PCB with more and more functions, and the design of the PCB is more and more complicated, and in order to standardize the design, the modular layout of one or more PCBs appears. However, the modular design still occupies a large space and has poor heat dissipation effect.

[ summary of the invention ]

An object of this application is to provide three-dimensional PCB module of modularization, the heat that the PCB board during operation produced is concentrated by radiator fan and is taken away, and the radiating efficiency is higher, and encloses the PCB board of establishing and save space more than tiling.

The application is realized by the following technical scheme:

the modularized three-dimensional PCB module comprises a plurality of PCB boards which are arranged in an enclosing mode to form a heat dissipation channel, wherein one end of the heat dissipation channel is provided with a heat dissipation fan which is used for drawing air out of the heat dissipation channel, and the heat dissipation fan is provided with a mounting seat.

According to the modularized three-dimensional PCB module, the PCB is a single-sided PCB, and the front side of the PCB faces the inside of the heat dissipation channel.

According to the modularized three-dimensional PCB module, the lower side of the mounting seat is provided with the supporting plate extending along the length direction of the heat dissipation channel.

According to the modularized three-dimensional PCB module, the reinforcing ribs are arranged between the supporting plate and the mounting seat.

According to the modularized three-dimensional PCB module, a plurality of mounting holes are formed in the peripheral side of the mounting seat.

The modularized three-dimensional PCB module further comprises a connecting wire, slots matched with the connecting wire are arranged on the PCB, and two ends of the connecting wire are respectively inserted into the slots of the two adjacent PCBs so as to electrically connect the two adjacent PCBs.

According to the modularized three-dimensional PCB module, two adjacent PCBs are connected through the plastic film, so that the included angle between the two adjacent PCBs is adjustable.

According to the modularized three-dimensional PCB module, the plastic film is a tin film or a copper film.

According to the modularized three-dimensional PCB module, two opposite side edges of the plastic film are respectively riveted on two adjacent PCB boards.

Compared with the prior art, the method has the following advantages:

the heat that the PCB board during operation of modularization three-dimensional PCB module produced is concentrated by radiator fan and is taken away, and radiating efficiency is higher, and encloses the PCB board of establishing and save space more than tiling.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a perspective view of an embodiment of the present application.

Fig. 2 is an exploded structural view of an embodiment of the present application.

[ detailed description ] embodiments

In order to make the technical problems, technical solutions and advantageous effects solved by the present application more clear and obvious, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

As shown in fig. 1 and fig. 2, an embodiment of the present application provides a modular three-dimensional PCB module, including enclosing a plurality of PCB boards 11 that form a heat dissipation channel 1, one end of the heat dissipation channel 1 is provided with a heat dissipation fan 2 for pumping out air in the heat dissipation channel 1, and the heat dissipation fan 2 is provided with a mounting base 3. Specifically, the peripheral side of the mounting seat 3 is provided with a plurality of mounting holes 31.

When the modularized three-dimensional PCB module is installed, a ventilation opening needs to be formed in the installation position in advance, for example, the ventilation opening on the side wall of a computer case, a distribution box and the like is fixed on the side wall of the case through the fixed installation seat 3, so that the heat dissipation channel 1 is communicated with the ventilation opening, heat generated when the PCB 11 works is intensively taken away by the heat dissipation fan 2, the heat dissipation efficiency is higher, and the surrounded PCB 11 saves more space than the tiled PCB.

Correspondingly, the PCB 11 is a single-sided PCB and the front side faces the inside of the heat dissipation channel 1. The structure of the modularized three-dimensional PCB module is more compact.

In order to make the enclosed PCB board 11 more stable and reliable, the lower side of the mounting seat 3 is provided with a supporting plate 4 extending along the length direction of the heat dissipation channel 1. Further, a reinforcing rib 41 is arranged between the support plate 4 and the mounting seat 3.

The modular three-dimensional PCB module further comprises a connecting wire, slots 111 matched with the connecting wire are arranged on the PCB 11, and two ends of the connecting wire are respectively inserted into the slots 111 of the two adjacent PCB 11 so as to electrically connect the two adjacent PCB 11. And signals and electric energy can be transmitted among the PCB modules.

In this embodiment, two adjacent PCB boards 11 are connected through the plastic film 6, so that an included angle between the two adjacent PCB boards 11 is adjustable. For example, there may be three PCB boards 11, and the angle between two adjacent PCB boards 11 is 60 degrees, or there may be four PCB boards 11, and the angle between two adjacent PCB boards 11 is 90 degrees. Specifically, the plastic film 6 is a tin film or a copper film. Furthermore, two opposite side edges of the plastic film 6 are respectively riveted on two adjacent PCB boards 11.

It should be understood that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like are used herein to indicate an orientation or positional relationship based on that shown in the drawings for ease of description and simplicity of description only, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be considered limiting of the present application.

The foregoing is illustrative of one or more embodiments provided in connection with the detailed description and is not intended to limit the disclosure to the particular forms disclosed. Similar or identical methods, structures, etc. as used herein, or several technical inferences or substitutions made on the concept of the present application should be considered as the scope of the present application.

Claims

1. The modularized three-dimensional PCB module is characterized by comprising a plurality of PCB boards (11) which are arranged to form a heat dissipation channel (1) in an enclosing mode, wherein one end of the heat dissipation channel (1) is provided with a heat dissipation fan (2) which is used for pumping out air in the heat dissipation channel (1), and a mounting seat (3) is arranged on the heat dissipation fan (2).

2. The PCB module according to claim 1, wherein the PCB (11) is a single-sided PCB and has a front side facing into the heat dissipation channel (1).

3. The modular stereo PCB module according to claim 1, wherein a support plate (4) extending along the length direction of the heat dissipation channel (1) is arranged at the lower side of the mounting seat (3).

4. The modular stereo PCB module according to claim 3, wherein a stiffener (41) is arranged between the support plate (4) and the mounting seat (3).

5. The modular stereo PCB module according to claim 1, wherein a plurality of mounting holes (31) are formed on the peripheral side of the mounting seat (3).

6. The PCB module according to claim 1, further comprising a connecting wire, wherein the PCB (11) has slots (111) matching with the connecting wire, and two ends of the connecting wire are respectively plugged into the slots (111) of two adjacent PCBs (11) to electrically connect the two adjacent PCBs (11).

7. The modular stereo PCB module as claimed in claim 1, wherein two adjacent PCBs (11) are connected by a plastic film (6) so that an included angle between two adjacent PCBs (11) is adjustable.

8. The modular stereo PCB module as claimed in claim 7, wherein the plastic film (6) is a tin film or a copper film.

9. The modular stereo PCB module as claimed in claim 7, wherein two opposite sides of the plastic film (6) are riveted to two adjacent PCBs (11).