CN111085782A - Processing method of polycarbonate plastic - Google Patents

Processing method of polycarbonate plastic Download PDF

Info

Publication number
CN111085782A
CN111085782A CN201911221426.9A CN201911221426A CN111085782A CN 111085782 A CN111085782 A CN 111085782A CN 201911221426 A CN201911221426 A CN 201911221426A CN 111085782 A CN111085782 A CN 111085782A
Authority
CN
China
Prior art keywords
laser
polycarbonate plastic
wire drawing
processing method
polycarbonate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911221426.9A
Other languages
Chinese (zh)
Inventor
夏岩
李向悦
胡述旭
曹洪涛
吕启涛
高云峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Han s Laser Technology Industry Group Co Ltd
Original Assignee
Han s Laser Technology Industry Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Han s Laser Technology Industry Group Co Ltd filed Critical Han s Laser Technology Industry Group Co Ltd
Priority to CN201911221426.9A priority Critical patent/CN111085782A/en
Publication of CN111085782A publication Critical patent/CN111085782A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment

Abstract

The invention provides a method for processing polycarbonate plastics, which specifically comprises the following steps: placing polycarbonate plastic at a processing station; obtaining a wire drawing pattern; setting laser etching parameters for a laser; obtaining a laser path according to the wire drawing pattern; and according to the laser path, performing laser wire drawing treatment on the polycarbonate plastic by using the laser. After the wire drawing pattern is obtained and the laser number is set, virtual calculation is carried out in a program to obtain a better laser path carving parameter diameter, and then wire drawing treatment is carried out on polycarbonate plastic, so that the surface of the polycarbonate plastic is more exquisite, each fine wire mark is clearly shown, and fine hair gloss is developed. So as to play the roles of beauty and erosion resistance. Meanwhile, the product has elements of fashion and science and technology.

Description

Processing method of polycarbonate plastic
Technical Field
The invention relates to a plastic processing method, in particular to a processing method of polycarbonate plastic.
Background
The application scenes of the plastic are very rich, and the plastic can be applied to the fields of daily life, electronic devices, medical appliances, aerospace and the like. The polycarbonate plastic has high strength, fatigue resistance, stable size and small creep deformation, and is an ideal material for manufacturing electronic and electric parts; however, the melt has high viscosity, poor fluidity and high molding processing difficulty, but has good colorability.
The laser etching is used as a non-contact treatment mode of polycarbonate plastics, does not need other auxiliary materials basically, and has the advantages of high-precision processing, high efficiency, saving, environmental protection and the like. However, the plastic surface processed by laser etching is very rough, and the plastic surface is easily abraded when moving, and the plastic surface may cause damage to human users.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provides a processing method of polycarbonate plastic, which enables the wire drawing effect of the surface of the polycarbonate plastic to be more exquisite.
In order to solve the technical problems, the invention adopts the technical scheme that: the method for processing the polycarbonate plastic is characterized by comprising the following steps:
s100, placing polycarbonate plastic at a processing station;
step S200, obtaining a wire drawing pattern;
s300, setting laser etching parameters for the laser;
s400, obtaining a laser path according to the wire drawing pattern;
and S500, according to the laser path, performing laser wire drawing on the polycarbonate plastic by using the laser.
Furthermore, laser etching parameters of the laser comprise marking speed, skip speed, Q frequency, filling space and focus position.
Furthermore, the Q frequency is 20-60 KHZ.
Further, the marking speed is 1000 mm/s-1500 mm/s; the skip speed is 1000-3000 mm/s.
Furthermore, the filling space is 0.03-0.05 mm.
Further, the focus position is positive defocus.
Further, before the step of obtaining the wiredrawing pattern, the method further comprises the following steps:
carrying out ultrasonic cleaning on the polycarbonate plastic;
and (3) carrying out degreasing treatment on the polycarbonate plastic.
Further, after the laser drawing processing is performed on the polycarbonate plastic by applying the laser according to the laser path, the method further includes the following steps: and carrying out ultrasonic cleaning on the polycarbonate plastic.
Further, the laser is an ultraviolet nanosecond laser and is used for emitting ultraviolet nanosecond laser with the wavelength of 355nm to perform laser drawing treatment.
Further, the drawing pattern is a vector diagram.
According to the invention, after the wire drawing pattern is obtained and the laser number is set, virtual calculation is carried out in a program to obtain a better laser path carving parameter diameter, and then the polycarbonate plastic is subjected to wire drawing treatment, so that the surface of the polycarbonate plastic is more exquisite, each fine wire mark is clearly displayed, and thus fine hair gloss is developed. So as to play the roles of beauty and erosion resistance. Meanwhile, the product has elements of fashion and science and technology.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is a basic flow diagram of a polycarbonate plastic processing method according to a first embodiment of the present invention;
FIG. 2 is a flow chart illustrating the operation of a polycarbonate plastic processing method according to a second embodiment of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1, fig. 1 is a basic flow chart of a polycarbonate plastic processing method according to a first embodiment of the present invention.
A processing method of polycarbonate plastic specifically comprises the following steps:
s100, placing polycarbonate plastic at a processing station;
step S200, obtaining a wire drawing pattern;
s300, setting laser etching parameters for the laser;
s400, obtaining a laser path according to the wire drawing pattern;
and S500, according to the laser path, performing laser wire drawing on the polycarbonate plastic by using the laser.
In this embodiment, after obtaining the wire drawing pattern and setting the laser number, virtual calculation is performed in the program to obtain a better laser path carving parameter, and then the wire drawing processing is performed on the polycarbonate plastic, so that the surface of the polycarbonate plastic is more delicate, each fine wire mark is clearly displayed, and thus fine and dense hair gloss is developed. So as to play the roles of beauty and erosion resistance. Meanwhile, the product has elements of fashion and science and technology.
In the above, when laser with sufficiently high energy density is irradiated on the surface of the material, a shallow melting effect occurs on the surface, a molten layer is formed, and a designed wiredrawing pattern is formed on the surface of the material under the action of surface tension of different scanning lines.
Furthermore, laser etching parameters of the laser comprise marking speed, skip speed, Q frequency, filling space and focus position.
In this embodiment, the specific marking effect may be determined by the marking speed, the skip speed, the Q frequency, the filling distance, and the focus position.
In the technical scheme, the marking speed refers to the scanning galvanometer speed of laser, and the effect is that under the condition that other conditions are constant, the higher the speed is, the higher the marking speed is. The higher the speed, the less times the same place is hit by laser. The speed is slow, so that the drilling depth is more favorable.
In the technical scheme, the larger the backlash speed is, the less the whole processing time is. The skip speed comprises a null vector step length, an inter-step delay and a laser on-delay, and the three are related to the finger-empty stroke. The blank-pointing stroke is the time for the laser head to be blank.
The null vector step size is the length of the null stroke divided into a number of equal portions.
The space vector inter-step delay is the time required to walk each empty stroke step.
Laser on-delay is the time after one stroke ends and to the beginning of another stroke, the starting point becomes the key point because of the all-pulse problem. And (5) enabling the galvanometer to move forward for a certain distance, and then opening the laser transmitter for processing.
In the technical scheme, the Q frequency refers to the frequency of laser emission, the higher the Q frequency is, the more the number of laser pulses emitted per second is, and meanwhile, the period of the laser pulses is shortened, the stronger the discontinuity of the laser is, the more the processing is discontinuous, the lower the material removal rate is, but the finer the processing boundary is.
In the above technical solution, the filling space is a space superposition of laser line scanning. Because the laser marking is a line scanning mode, namely, laser pulses are used for forming lines, and the lines are overlapped one by one in a certain distance along one direction, the effect of completely covering and marking by laser is achieved, the filling density is enough, and the processing efficiency is influenced on the contrary if the filling density is too dense.
In the above technical solution, the focal position, i.e. the position of the focal point of the light beam relative to the surface of the material, is a positive focus at the lower part and a negative focus at the upper part, and the focal position affects the size of the slit.
In the technical scheme, the Q frequency is 20-60 KHZ.
The higher the Q frequency is, the weaker the energy is, the shallower the pit is, but the easier the geometric accuracy is to ensure; in the case of setting the Q frequency at 21KHZ, the energy intensity is enough to ensure the processing on the surface of the polycarbonate plastic, and the fineness is optimal in the embodiment; set up Q frequently for under the condition of 59KHZ, can guarantee that the degree of depth of its processing is darker, and the fineness influence is little, and changes frequently through predetermined Q, can change the processing effect to this different positions of guaranteeing the wire drawing possess different effects.
In the technical scheme, the marking speed is 1000-1500 mm/s; the skip speed is 1000-3000 mm/s.
The faster the marking speed is, the fewer times of laser striking on the same place is; the speed is slow, so that the depth of the laser is better, but the marking speed is too slow, and substances formed by laser can be accumulated on the surface of the material, so that the deeper laser is formed.
In the embodiment, the marking speed is set to 1000mm/s, and the marking depth is the maximum; the marking speed is set to be 1500mm/s, and the marking efficiency is highest; the marking efficiency can be guaranteed by setting the marking speed to 1100mm/s, and the marking depth can be enough by setting the marking speed to 1400 mm/s.
When the speed of the skip speed exceeds 2000mm/s, the change of the processing time consumption is little, and the change of the skip speed has little influence on the whole size of the pattern and tends to be stable.
In the technical scheme, the filling distance is 0.03-0.05 mm.
The filling distance is set to be 0.05mm, so that the effect of completely covering and marking by laser can be achieved, and the processing efficiency is highest in the embodiment; setting the fill pitch to 0.03mm can ensure that the marking effect is finest and its efficiency is acceptable.
In the above technical scheme, the focus position is positive defocus.
The positive defocused light spot is smaller, and a more detailed wire drawing effect can be obtained.
Referring to fig. 2, fig. 2 is a flowchart illustrating the operation of a polycarbonate plastic processing method according to a second embodiment of the present invention;
in the above technical solution, before obtaining the drawing pattern, the method further comprises the following steps:
step S10, carrying out ultrasonic cleaning on the polycarbonate plastic;
and step S20, performing degreasing treatment on the polycarbonate plastic.
Steps S10 and S20 are required when the polycarbonate plastic to be processed is stored in a warehouse and then directly taken out for use or when a customer hands the polycarbonate plastic to be processed to a worker, and if clean polycarbonate plastic is directly used, steps S10 and S20 may be omitted.
The ultrasonic cleaning is to utilize the cavitation, acceleration and direct current action of ultrasonic waves in liquid to directly and indirectly act on liquid and dirt, so that a dirt layer is dispersed, emulsified and stripped to achieve the purpose of cleaning.
By ultrasonic cleaning, floating dust can be removed, and secondary pollution can not be generated. The degreasing treatment can be performed by using substances such as alcohol or gasoline.
Step S500, according to the laser path, after the laser drawing processing is carried out on the polycarbonate plastic by using the laser, the method further comprises the step S600 of carrying out ultrasonic cleaning on the polycarbonate plastic.
Particularly, the polycarbonate plastic subjected to the main process of wire drawing treatment is subjected to ultrasonic cleaning, so that scraps generated after the wire drawing treatment can be removed, and the effect is excellent.
The processing method of the polycarbonate plastic comprises the following specific steps:
step S10, carrying out ultrasonic cleaning on the polycarbonate plastic;
step S20, degreasing the polycarbonate plastic;
s100, placing polycarbonate plastic at a processing station;
step S200, obtaining a wire drawing pattern;
s300, setting laser etching parameters for the laser;
s400, obtaining a laser path according to the wire drawing pattern;
and S500, according to the laser path, performing laser wire drawing on the polycarbonate plastic by using the laser.
And step S600, carrying out ultrasonic cleaning on the polycarbonate plastic.
Further, the laser is an ultraviolet nanosecond laser and is used for emitting ultraviolet nanosecond laser with the wavelength of 355nm to perform laser drawing treatment. An ultraviolet nanosecond laser with a wavelength of 355nm is used, and the maximum power of the laser is 5W. The plastic sample is sensitive to the focus and the power of laser, and the plastic sample is required to be in a positive focus position during laser etching, and the focus error range is controlled within 0.2 mm.
The ultraviolet nanosecond laser sends ultraviolet nanosecond laser with the wavelength of 355nm, so that the drawn wire is finer and smoother. The ultraviolet nanosecond laser is properly acted on the surface of the polycarbonate plastic for a proper time, the influence on the surface of the material is optimal, and the processing effect is better.
In the above technical scheme, the drawing pattern is a vector diagram.
Specifically, a vector diagram is drawn in marking software or graphic processing software according to the designed drawing pattern. If the vector graph is carried out in the graphic processing software, marking software needs to be introduced. The vector image files need to be amplified and stored in the conversion process to prevent distortion. The invention can finish the wire drawing effect treatment on the surface of the polycarbonate material only by pattern design and laser, and has fine and smooth effect.
Compared with mechanical grinding or sand blasting, the laser processing has high precision and efficiency, can reduce the abrasion of equipment and greatly shortens the production period; compared with a chemical corrosion process, the method can reduce the use and discharge of chemical substances and is environment-friendly; compared with the traditional numerical control center machining, the use of tools and cooling liquid is reduced, and the machining efficiency is higher.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (10)

1. The processing method of the polycarbonate plastic is characterized by comprising the following steps:
placing polycarbonate plastic at a processing station;
obtaining a wire drawing pattern;
setting laser etching parameters for a laser;
obtaining a laser path according to the wire drawing pattern;
and according to the laser path, performing laser wire drawing treatment on the polycarbonate plastic by using the laser.
2. A polycarbonate plastic processing method as defined in claim 1, wherein: the laser etching parameters of the laser comprise marking speed, skip speed, Q frequency, filling space and focus position.
3. A polycarbonate plastic processing method as defined in claim 2, wherein: the Q frequency is 20-60 KHZ.
4. A polycarbonate plastic processing method as defined in claim 3, wherein: the marking speed is 1000 mm/s-1500 mm/s; the skip speed is 1000-3000 mm/s.
5. The polycarbonate plastic processing method of claim 4, wherein: the filling space is 0.03-0.05 mm.
6. A polycarbonate plastic processing method as defined in claim 5, wherein: the focus position is positive defocus.
7. The method for processing polycarbonate plastic according to any one of claims 1 to 6, wherein: before the step of obtaining the wiredrawing pattern, the method further comprises the following steps:
carrying out ultrasonic cleaning on the polycarbonate plastic;
and (3) carrying out degreasing treatment on the polycarbonate plastic.
8. A polycarbonate plastic processing method as defined in claim 7, wherein: after the laser drawing processing is performed on the polycarbonate plastic by applying the laser according to the laser path, the method further comprises the following steps: and carrying out ultrasonic cleaning on the polycarbonate plastic.
9. The method of claim 1, wherein: the laser is an ultraviolet nanosecond laser and is used for emitting ultraviolet nanosecond laser with the wavelength of 355nm to perform laser drawing treatment.
10. The method of claim 1, wherein: the drawing pattern is a vector diagram.
CN201911221426.9A 2019-12-03 2019-12-03 Processing method of polycarbonate plastic Pending CN111085782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911221426.9A CN111085782A (en) 2019-12-03 2019-12-03 Processing method of polycarbonate plastic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911221426.9A CN111085782A (en) 2019-12-03 2019-12-03 Processing method of polycarbonate plastic

Publications (1)

Publication Number Publication Date
CN111085782A true CN111085782A (en) 2020-05-01

Family

ID=70393237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911221426.9A Pending CN111085782A (en) 2019-12-03 2019-12-03 Processing method of polycarbonate plastic

Country Status (1)

Country Link
CN (1) CN111085782A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378445A (en) * 2022-02-25 2022-04-22 蓝思科技(长沙)有限公司 Laser processing technology of colorful product, colorful product and electronic product

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2131500A1 (en) * 1993-09-07 1995-03-08 Hans Wyssen Method and apparatus for engraving a mark on plane of curved surfaces
CN1165753A (en) * 1996-01-30 1997-11-26 奥蒂斯电梯公司 Method of laser imprinting
DE10304371A1 (en) * 2003-02-04 2004-08-12 Magna Naturstein Gmbh Processing surfaces of transparent materials, especially glass, involves bringing surface into contact with material that absorbs laser beams, processing with laser beam, removing absorbent material
CN101166635A (en) * 2005-04-26 2008-04-23 长岛工艺株式会社 False inlay decorator and method for producing the same
CN101623915A (en) * 2008-07-10 2010-01-13 深圳富泰宏精密工业有限公司 Shell preparation method
CN108406119A (en) * 2018-01-26 2018-08-17 大族激光科技产业集团股份有限公司 A kind of laser drawing method and device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2131500A1 (en) * 1993-09-07 1995-03-08 Hans Wyssen Method and apparatus for engraving a mark on plane of curved surfaces
CN1165753A (en) * 1996-01-30 1997-11-26 奥蒂斯电梯公司 Method of laser imprinting
DE10304371A1 (en) * 2003-02-04 2004-08-12 Magna Naturstein Gmbh Processing surfaces of transparent materials, especially glass, involves bringing surface into contact with material that absorbs laser beams, processing with laser beam, removing absorbent material
CN101166635A (en) * 2005-04-26 2008-04-23 长岛工艺株式会社 False inlay decorator and method for producing the same
CN101623915A (en) * 2008-07-10 2010-01-13 深圳富泰宏精密工业有限公司 Shell preparation method
CN108406119A (en) * 2018-01-26 2018-08-17 大族激光科技产业集团股份有限公司 A kind of laser drawing method and device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
董振: "《机械CAD/CAM及CNC技术实验教程》", 30 June 2014, 华中科技大学出版社 *
邓勇: "《工业装备学》", 31 July 2017, 重庆大学出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378445A (en) * 2022-02-25 2022-04-22 蓝思科技(长沙)有限公司 Laser processing technology of colorful product, colorful product and electronic product

Similar Documents

Publication Publication Date Title
Ahmed et al. Laser ablation and laser-hybrid ablation processes: a review
KR101606426B1 (en) Production method for three-dimensionally shaped molded object
Zhu et al. A review of hybrid manufacturing processes–state of the art and future perspectives
CN105618936B (en) One kind uses laser grooving and scribing glass processing method
JPH09207384A (en) Laser imprinting method
CN110369727A (en) A kind of method of the selective laser melting processing without the horizontal hanging structure of longitudinal bracing
CN107531564A (en) By laser damage and it is etched in the product that the method for passage is manufactured in glassware and is thus manufactured
CN109926584A (en) A kind of increasing material manufacturing and surface polishing synchronous processing method and device
CN108274123A (en) A kind of increasing material-polishing integral processing method for laser gain material component inner wall
CN109158762A (en) A kind of recombination laser removal metal oxide layer re-polishing method
KR20180099788A (en) Method for manufacturing three-dimensional sculpture
CN105057892A (en) Pulse laser three-dimensional engraving method
CN101204758A (en) Producing method of leather pattern mould
CN111842594B (en) Process for manufacturing mirror LOGO on metal sand blasting surface
CN107848203B (en) Method for manufacturing three-dimensional shaped object
CN111438443B (en) Method for processing controllable micro-groove on surface of workpiece through laser multiple scanning ablation
CN111085782A (en) Processing method of polycarbonate plastic
CN110744205B (en) Laser depth marking method for titanium-based multilayer composite material
US20190366484A1 (en) A method of high-precision laser processing sapphire with submicron cutting surface
CN113649707B (en) Processing method for rounding SiC crystal and forming reference surface at one time
CN109967741A (en) A kind of 3D printing technique optimization method based on enhancing study
CN112059406B (en) Laser interference induced electrolytic machining method and device for micro-nano structure on friction surface
Lim et al. Evaluation of surface characteristics with pre-treatment polishing process in pulsed laser polishing AISI 4140 mold steel
CN105834588A (en) Device for machining metal mirror by laser ablation
CN106271108A (en) A kind of laser cutting method of non-crystaline amorphous metal part

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20200501

RJ01 Rejection of invention patent application after publication