CN111044521A - Combined light source device and method for chip detection - Google Patents
Combined light source device and method for chip detection Download PDFInfo
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- CN111044521A CN111044521A CN201911284278.5A CN201911284278A CN111044521A CN 111044521 A CN111044521 A CN 111044521A CN 201911284278 A CN201911284278 A CN 201911284278A CN 111044521 A CN111044521 A CN 111044521A
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- planar lens
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
Abstract
The invention discloses a combined light source device and a method for chip detection, wherein the combined light source device comprises an industrial camera, a first part for generating red annular light and a second part for generating white coaxial light, the industrial camera, the second part, the first part and a chip are sequentially arranged from bottom to top, wherein an included angle between the axis of a lens of the industrial camera and the vertical line of the chip is an acute angle, so that light rays of a detected object placed on the chip can enter the lens of the industrial camera. The invention can detect whether the PIN diode and the substrate of the chip are damaged or not by adjusting the brightness and the lighting time of the red annular light and the white coaxial light, thereby being beneficial to improving the yield of the outgoing chip and reducing the labor intensity of a technician.
Description
Technical Field
The invention relates to the field of chip testing, in particular to a combined light source device and a method for chip detection.
Background
As the chip manufacturing process gets smaller and smaller, the process difficulty also increases exponentially. Taking a 10nm process as an example, the number of the whole process steps exceeds 1300, and the number of the 7nm process steps exceeds 1500, wherein any process error may cause unqualified integrated circuits and lower the yield. In order to find out the unstable factors in time and improve the production yield, the testing link runs through the production flow of the integrated circuit, and the testing equipment is the key.
The testing process of the integrated circuit mainly comprises design verification in chip design, wafer test (CP test) in wafer manufacturing and finished product test (FT test) after packaging is finished. The testing machine is used in all testing links, and the testing machine needs to be matched with a sorting machine or a probe station in different links. In the finished product testing stage, the sorting machine is matched with the testing machine to test the electrical parameter performance of each chip.
However, in the finished product testing stage, the tester cannot detect whether the PIN diode and the substrate of the chip packaged by PIN grid array packaging technology (PGA packaging) are damaged, and the dedicated PGA testing equipment has high cost and large volume, cannot be combined with the existing sorter or tester, and only depends on the experience of a technician for judgment, so that the yield of the outgoing chip is reduced, the productivity is affected, and the labor intensity of the technician is high.
Disclosure of Invention
In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide a combined light source device and method for chip inspection to solve the above-mentioned problems in the background art.
In a first aspect, the invention provides a combined light source device for chip detection, which comprises an industrial camera, a first part for generating red annular light and a second part for generating white coaxial light,
the industrial camera, the second part, the first part and the chip are arranged in sequence from bottom to top,
the industrial camera is obliquely arranged, so that light rays of the detected object placed on the chip can enter a lens of the industrial camera.
The device can detect whether the PIN diode and the substrate of the chip are damaged or not by adjusting the brightness and the lighting time of the red annular light and the white coaxial light, thereby being beneficial to improving the yield of the outgoing chip and reducing the labor intensity of a technician.
Preferably, the distance between the second part and the first part is a, and a is more than or equal to 5mm and less than or equal to 20 mm;
an included angle between the axis of the industrial camera lens and the vertical line of the chip is b, and b is more than or equal to 25 degrees and less than or equal to 28 degrees.
Preferably, the first part comprises an annular light source assembly, a first planar lens, a second planar lens and a first sealing cover;
the annular light source component, the first planar lens and the second planar lens are all arranged in the first sealing cover,
the upper surface of the first sealing cover is provided with a first mounting hole for arranging the first planar lens, and the lower surface of the first sealing cover is provided with a second mounting hole for arranging the second planar lens;
the annular light source assembly is annular, is arranged on the side wall of the first sealing cover and is positioned between the first planar lens and the second planar lens.
Preferably, the annular light source component comprises a plurality of first LEDs, each first LED is uniformly distributed at equal angles,
the first LED is obliquely arranged relative to the chip, so that an included angle between the first LED light and a vertical line of the chip is c, and c is more than or equal to 40 degrees and less than or equal to 50 degrees.
Preferably, the second part comprises a coaxial light source component, a spectroscope, a third planar lens, a fourth planar lens, a fifth planar lens and a second sealing cover,
the spectroscope, the third planar lens, the fourth planar lens, the fifth planar lens and the coaxial light source component are all arranged in the second sealing cover,
a third mounting hole is formed in the upper surface of the second sealing cover and used for arranging the third planar lens, and a fourth mounting hole is formed in the lower surface of the second sealing cover and used for arranging the fourth planar lens;
the fifth planar lens is perpendicular to the third planar lens and the fourth planar lens and is located between the third planar lens and the fourth planar lens;
the spectroscope is arranged between the third planar lens and the fourth planar lens, an included angle between the spectroscope and the fifth planar lens is d, and d is more than or equal to 35 degrees and less than or equal to 40 degrees;
the coaxial light source assembly is arranged between the side wall of the second sealing cover and the fifth plane lens;
preferably, the coaxial light source assembly comprises a plurality of second LEDs, and the second LEDs are uniformly distributed on the side wall of the second sealing cover at equal intervals.
In a second aspect, the invention provides a method for detecting a chip, where the chip includes a substrate and a PIN diode, and the method includes:
turning on red annular light, adjusting the brightness of the red annular light to a first brightness and lasting for t1 to obtain a substrate outline graph of the chip, wherein the white coaxial light is turned off;
turning on white coaxial light, adjusting the brightness of the white coaxial light to a second brightness and lasting for t2 to obtain a connection part graph of the PIN diode of the chip and the substrate, wherein the red annular light is turned off;
turning on the white coaxial light, and adjusting the brightness of the white coaxial light to a third brightness for a duration t2 to obtain a PIN diode end graph of the chip, wherein the red annular light is turned off;
and turning on the red annular light to adjust the brightness of the red annular light to the third brightness for a time period of t1, and simultaneously turning on the white coaxial light to adjust the brightness of the white coaxial light to the third brightness for a time period of t1 so as to obtain a substrate graph of the chip.
The method can detect whether the PIN diode and the substrate of the chip are damaged or not by adjusting the brightness and the lighting time of the red annular light and the white coaxial light, is favorable for improving the yield of the outgoing chip and reduces the labor intensity of technicians.
Preferably, the first brightness is 80% brightness, and t1 is 50 milliseconds.
Preferably, the second luminance is 30% luminance, and t2 is 100 msec.
Preferably, the third luminance is 100% luminance.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
FIG. 1 is a first schematic view of the apparatus of the present invention;
FIG. 2 is a second schematic illustration of the apparatus of the present invention;
FIG. 3 is a schematic view of a combined light source of the present invention;
FIG. 4 is a schematic structural view of a first part of the present invention;
FIG. 5 is a schematic structural view of a second part of the present invention;
in FIGS. 1-5:
1. a chip 2, a first part 21, a first planar lens 22, a second planar lens 23, an annular light source assembly 231, a first LED 24, a first sealing cover 241, a first mounting hole 242, a second mounting hole;
3. a second portion, 31, a third planar lens, 32, a fourth planar lens, 33, a fifth planar lens, 34, a beam splitter, 35, a coaxial light source assembly, 351, a second LED, 36, a second sealing cover, 361, a third mounting hole, 362 and a fourth mounting hole;
4. an industrial camera.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
In a first aspect:
referring to fig. 1-3, a combined light source device for chip inspection includes an industrial camera 4, a first portion 2 generating red ring light, and a second portion 3 generating white coaxial light.
The industrial camera 4, the second part 3, the first part 2 and the chip 1 are fixedly connected by the relevant mechanical structure, as shown in fig. 2. The chip is formed by combining various parts, and each part is processed by different materials. The distance a between the first part 2 and the second part 3 is reasonably arranged, so that red annular light and white coaxial light can be projected to the chip 1, and the observation of the target is facilitated. By adjusting the brightness and the lighting time of the red annular light, the substrate outline graph of the chip 1 can be acquired by the industrial camera 4; by adjusting the brightness and the lighting time of the white coaxial light, the PIN diode graph of the chip 1 or the connection graph of the substrate and the PIN diode can be obtained by the industrial camera 4; by adjusting the brightness and the lighting time of the red ring light and the white coaxial light, the substrate pattern of the chip 1 can be acquired by the industrial camera 4.
The device can detect whether the PIN diode and the substrate of the chip are damaged or not by adjusting the brightness and the lighting time of the red annular light and the white coaxial light, thereby being beneficial to improving the yield of the outgoing chip and reducing the labor intensity of a technician.
Referring to FIG. 1, in one embodiment of the present invention, the second portion 3 is a distance a from the first portion 2, 5mm ≦ a ≦ 20 mm; the included angle between the axis of the lens of the industrial camera 4 and the vertical line of the chip 1 is b, and b is more than or equal to 25 degrees and less than or equal to 28 degrees.
Above-mentioned structural design is reasonable, is favorable to realizing that red annular light and white coaxial light project the same position and coincidence, is convenient for carry out the observation of target, helps detecting better whether PIN diode, the base plate of chip have the damage.
Referring to fig. 4, in an embodiment of the present invention, the first portion 2 includes an annular light source assembly 23, a first planar lens 21, a second planar lens 22 and a first sealing cover 24, and the annular light source assembly 23, the first planar lens 21 and the second planar lens 22 are disposed in the first sealing cover 24.
The first sealing cover 24 is a cylindrical cavity structure, and a first mounting hole 241 is arranged on the upper surface of the first sealing cover 24 and used for mounting the first planar lens 21; a second mounting hole 242 is provided in the lower surface of the first sealing cap 24 for mounting the second planar lens 22.
The annular light source assembly 23 is annular, is disposed on the inner sidewall of the first sealing cover 24, and is located between the first planar lens 21 and the second planar lens 22. The annular light source assembly 23 comprises a plurality of first LEDs 231, and the first LEDs 231 are uniformly distributed at equal angles relative to the annular light source assembly 23. Wherein, each first LED231 is obliquely arranged relative to the chip 1, so that the included angle between the light of the first LED231 and the vertical line of the chip is c, and c is more than or equal to 40 degrees and less than or equal to 50 degrees. The first LED231 emits red light, and the annular light source assembly 23 projects red annular light onto the chip.
The first section 2 is simple in construction and is capable of producing red ring light. Whether PIN diode, the base plate of the detection chip have the damage of being convenient for.
Referring to fig. 5, in an embodiment of the present invention, the second portion 3 includes a coaxial light source assembly 35, a beam splitter 34, a third planar lens 31, a fourth planar lens 32, a fifth planar lens 33 and a second sealing cover 36, wherein the beam splitter 34, the third planar lens 31, the fourth planar lens 32, the fifth planar lens 33 and the coaxial light source assembly 35 are disposed in the second sealing cover 36.
The second sealing cover 36 has a rectangular cavity structure, and a third mounting hole 361 is formed in the upper surface of the second sealing cover 36 for mounting the third planar lens 31; a fourth mounting hole 362 is provided in a lower surface of the second sealing cap 36 for mounting the fourth planar lens 32. The fifth planar lens 33 is perpendicular to the third planar lens 31 and the fourth planar lens 32 and is located between the third planar lens 31 and the fourth planar lens 32; the beam splitter 34 is disposed between the third planar lens 31 and the fourth planar lens 32, and an included angle between the beam splitter 34 and the fifth planar lens 33 is d, wherein d is greater than or equal to 35 degrees and less than or equal to 40 degrees.
The coaxial light source assembly 35 is disposed between one sidewall of the second sealing cap 36 and the fifth planar lens 33, and is fixed to the sidewall of the second sealing cap 36. The coaxial light source assembly 35 includes a plurality of second LEDs 351, and the second LEDs 351 are uniformly spaced in the height direction of the second sealing cover 36. The second LED351 can emit white light, and more light beams are split by the beam splitter 34, so that the light emitting efficiency is improved, glare and light spots are eliminated, and good light color consistency is ensured.
The second section 3 is simple in construction and is capable of producing white on-axis light. Whether PIN diode, the base plate of the detection chip have the damage of being convenient for.
In a second aspect:
referring to fig. 1 and 3, a chip includes a substrate and a PIN diode, and a method for chip inspection includes: turning on the red annular light, adjusting the brightness of the red annular light to a first brightness and lasting for t1 to obtain a substrate outline graph of the chip, wherein the white coaxial light is turned off;
turning on white coaxial light, adjusting the brightness of the white coaxial light to a second brightness for a time t2 to obtain a connection part graph of the PIN diode of the chip and the substrate, wherein the red annular light is turned off;
turning on white coaxial light, adjusting the brightness of the white coaxial light to a third brightness for a duration t2 to obtain a PIN diode end graph of the chip, wherein the red annular light is turned off;
and turning on the red annular light to adjust the brightness of the red annular light to the third brightness for a duration t1, and simultaneously turning on the white coaxial light to adjust the brightness of the red annular light to the third brightness for a duration t1 so as to obtain a substrate graph of the chip.
In order to further optimize the scheme design: the first brightness is 80% brightness, t1 is 50 milliseconds; the second luminance is 30% luminance, t2 is 100 milliseconds; the third luminance is 100% luminance.
Controlling the red LED ring light source to be lighted at 80% brightness for 50 milliseconds; white on-axis light was controlled to light at 30% brightness and last 100 milliseconds; controlling white on-axis light to light at 100% brightness for 100 milliseconds; controlling the red LED ring light to light at 100% brightness for 50 milliseconds; while controlling the white on-axis light to light at 100% brightness for 50 milliseconds.
The method can detect whether the PIN diode and the substrate of the chip are damaged or not by adjusting the brightness and the lighting time of the red annular light and the white coaxial light, is favorable for improving the yield of the outgoing chip and reduces the labor intensity of technicians.
The above examples are only illustrative of the technical solutions of the present invention and not restrictive, and although the present invention is described in detail with reference to the examples, those of ordinary skill in the art should understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A combined light source device for chip detection comprises an industrial camera and is characterized by further comprising a first part for generating red annular light and a second part for generating white coaxial light,
the industrial camera, the second part, the first part and the chip are arranged in sequence from bottom to top,
the included angle between the axis of the industrial camera lens and the vertical line of the chip is an acute angle, so that light rays of a detected object placed on the chip can enter the lens of the industrial camera.
2. The combined light source device of claim 1, wherein the second portion is a distance a from the first portion, 5mm ≦ a ≦ 20 mm;
an included angle between the axis of the industrial camera lens and the vertical line of the chip is b, and b is more than or equal to 25 degrees and less than or equal to 28 degrees.
3. The combination light source device of claim 1, wherein the first portion comprises an annular light source assembly, a first planar lens, a second planar lens, and a first sealing cap;
the annular light source component, the first planar lens and the second planar lens are all arranged in the first sealing cover,
the upper surface of the first sealing cover is provided with a first mounting hole for arranging the first planar lens, and the lower surface of the first sealing cover is provided with a second mounting hole for arranging the second planar lens;
the annular light source assembly is annular, is arranged on the side wall of the first sealing cover and is positioned between the first planar lens and the second planar lens.
4. The combined light source device of claim 3, wherein the annular light source assembly comprises a plurality of first LEDs, each of the first LEDs is equiangularly distributed,
the first LED is obliquely arranged relative to the chip, so that an included angle between the first LED light and a vertical line of the chip is c, and c is more than or equal to 40 degrees and less than or equal to 50 degrees.
5. The combined light source device of claim 1, wherein the second portion comprises a coaxial light source module, a beam splitter, a third planar lens, a fourth planar lens, a fifth planar lens, and a second sealing cover,
the spectroscope, the third planar lens, the fourth planar lens, the fifth planar lens and the coaxial light source component are all arranged in the second sealing cover,
a third mounting hole is formed in the upper surface of the second sealing cover and used for arranging the third planar lens, and a fourth mounting hole is formed in the lower surface of the second sealing cover and used for arranging the fourth planar lens;
the fifth planar lens is perpendicular to the third planar lens and the fourth planar lens and is located between the third planar lens and the fourth planar lens;
the spectroscope is arranged between the third planar lens and the fourth planar lens, an included angle between the spectroscope and the fifth planar lens is d, and d is more than or equal to 35 degrees and less than or equal to 40 degrees;
the coaxial light source assembly is arranged between the side wall of the second sealing cover and the fifth plane lens.
6. The combined light source device of claim 5, wherein the coaxial light source assembly comprises a plurality of second LEDs, and the second LEDs are uniformly distributed on the side wall of the second sealing cover at equal intervals.
7. A method for chip inspection, the chip including a substrate and a PIN diode, comprising:
turning on red annular light, adjusting the brightness of the red annular light to a first brightness and lasting for t1 to obtain a substrate outline graph of the chip, wherein the white coaxial light is turned off;
turning on white coaxial light, adjusting the brightness of the white coaxial light to a second brightness and lasting for t2 to obtain a connection part graph of the PIN diode of the chip and the substrate, wherein the red annular light is turned off;
turning on the white coaxial light, and adjusting the brightness of the white coaxial light to a third brightness for a duration t2 to obtain a PIN diode end graph of the chip, wherein the red annular light is turned off;
and turning on the red annular light to adjust the brightness of the red annular light to the third brightness for a time period of t1, and simultaneously turning on the white coaxial light to adjust the brightness of the white coaxial light to the third brightness for a time period of t1 so as to obtain a substrate graph of the chip.
8. The method of claim 7, wherein the first luminance is 80% luminance and t1 is 50 milliseconds.
9. The method of claim 7, wherein the second luminance is 30% luminance and t2 is 100 milliseconds.
10. The method of claim 7, wherein the third luminance is 100% luminance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911284278.5A CN111044521A (en) | 2019-12-13 | 2019-12-13 | Combined light source device and method for chip detection |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911284278.5A CN111044521A (en) | 2019-12-13 | 2019-12-13 | Combined light source device and method for chip detection |
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| JP2000258354A (en) * | 1999-03-05 | 2000-09-22 | Dainippon Printing Co Ltd | Inspection method and device of projection part |
| CN202563223U (en) * | 2012-03-14 | 2012-11-28 | 廖怀宝 | Optical detection device and color mapping light source device thereof |
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Application publication date: 20200421 |
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