CN111014946A - Water-guided laser processing device and processing system - Google Patents
Water-guided laser processing device and processing system Download PDFInfo
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- CN111014946A CN111014946A CN202010060421.9A CN202010060421A CN111014946A CN 111014946 A CN111014946 A CN 111014946A CN 202010060421 A CN202010060421 A CN 202010060421A CN 111014946 A CN111014946 A CN 111014946A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0734—Shaping the laser spot into an annular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention discloses a water-guided laser processing device and a processing system, wherein the device comprises a table-shaped reflector and a coupling water cavity; the table-shaped reflector and the coupling water cavity are sequentially and coaxially arranged along the transmission direction of the laser; the table-shaped reflector is used for inputting the central beam of the laser into the coupling water cavity after total reflection and light guide; the laser beam transmission device is used for transmitting the laser beam after total reflection and light guide along the water column emitted by the coupling water cavity and cutting a workpiece by using the laser beam in the water column. The invention also discloses a water-guided laser processing system comprising the device. The invention utilizes the table-shaped reflector to convert the central beam of the laser into the edge beam, so that the power distribution of the laser finally emitted from the coupling water cavity is more uniform, the taper effect when the water-guided laser cuts the workpiece is improved, and the deep processing capability is expanded.
Description
Technical Field
The application relates to a water-guiding laser processing device and a processing system, and belongs to the technical field of laser processing.
Background
With the rapid development of medical, aviation, aerospace and semiconductor fields, the performance requirements for key parts are higher and higher, which promotes the improvement and improvement of part processing methods and equipment. In the field of cutting and processing of parts, the traditional cutting and processing method mainly comprises mechanical cutting and processing and high-pressure water cutting and processing. However, the above-described machining method has problems of low machining efficiency and low machining accuracy. In order to solve the above problems, those skilled in the art have developed a laser cutting apparatus which is superior to the conventional cutting method in terms of processing efficiency, processing accuracy and environmental protection. However, laser cutting process can cause a certain degree of thermal damage to the material, and in order to solve the problem of thermal damage to the material, the water-guided laser processing device is produced.
The water-guided laser processing device is a composite processing technology for cutting a workpiece to be processed by guiding laser beams through water jet. Because the refractive indexes of water and air are different, when a laser beam irradiates on a boundary surface of the water and the air at a certain angle, if the incident angle is smaller than the critical angle of total reflection, the laser can be totally reflected and can not be transmitted out, so that the laser energy is always limited in the water beam, and the laser can be transmitted along the direction of the water beam.
The water-guided laser processing device in the prior art can realize high-quality cutting processing of a thin plate within 5mm, but the water-guided laser also has a certain processing taper effect along with the increase of the processing depth. The main reason is that the distribution of light in the radial section of the water column conforms to the Gaussian distribution rule, namely the power density of the light is higher near the axis of the water column and is lower near the surface of the water column. This results in a stronger removal energy of material near the axis of the water column and a weaker removal energy of material near the surface of the water column, limiting the thickness of the water-guided laser cut workpiece.
Disclosure of Invention
An object of the application is to provide a laser beam machining device and system are led to water to among the solution prior art, laser power density distributes uneven technical problem in the water column.
The invention relates to a water-guided laser processing device, which comprises a table-shaped reflector and a coupling water cavity;
the table-shaped reflector and the coupling water cavity are sequentially and coaxially arranged along the transmission direction of the laser;
the table-shaped reflector is used for inputting the central beam of the laser into the coupling water cavity after total reflection and light guide;
and the coupling water cavity is used for transmitting the laser after total reflection and light guide along a water column emitted by the coupling water cavity and cutting a workpiece by using the laser in the water column.
Preferably, the table-shaped reflector comprises a first total reflection surface positioned on the axis of the table-shaped reflector and a second total reflection surface positioned on the side surface of the table-shaped reflector;
the first total reflection surface is used for totally reflecting the central beam of the laser to the second total reflection surface;
the second total reflection surface is used for carrying out secondary total reflection on the laser reflected by the first total reflection surface, and the laser emitted by the second total reflection surface is converted into an edge beam and then is emitted into the coupling water cavity.
Preferably, a tapered hole is formed in the axis of the table-shaped reflector, the tapered hole is formed along the direction from the lower bottom surface to the upper bottom surface of the table-shaped reflector, and a total reflection coating is coated on the side surface of the tapered hole to form the first total reflection surface;
the upper bottom surface of the table-shaped reflector receives the laser, and the side surface of the table-shaped reflector is coated with a total reflection coating to form the second total reflection surface.
Preferably, the water-cooling device further comprises a focusing lens, wherein the focusing lens is arranged between the table-shaped reflecting mirror and the coupling water cavity;
and the focusing lens is used for focusing the laser after total reflection and light guide and then injecting the laser into the coupling water cavity.
Preferably, the laser device further comprises a focusing lens, and the focusing lens and the table-shaped reflecting mirror are sequentially and coaxially arranged along the transmission direction of the laser;
and the focusing lens is used for focusing the laser and then injecting the laser into the table-shaped reflecting mirror.
Preferably, the coupling water cavity comprises a cavity body, a window lens and a water outlet;
the window lens is arranged on the outer wall of the cavity and used for receiving the laser after total reflection and light guide, the laser receiving surface of the window lens is a plane, and the laser emitting surface of the window lens is a convex surface;
the water outlet is arranged at the focus of the focusing lens, and the water column of the water outlet guides laser to cut the workpiece.
Preferably, a gas chamber is also included;
the gas cavity is provided with a water vapor outlet, and the water vapor outlet and the water outlet of the coupling water cavity are coaxially arranged.
Preferably, the moisture outlet extends outwards along the outer wall of the gas chamber, and the moisture outlet is connected with the outer wall of the gas chamber in an arc.
The invention also discloses a water-guided laser processing system, which comprises a control device, a laser generator, a fluid supply device and the water-guided laser processing device;
the control device is used for controlling the opening and closing of the laser generator and the fluid supply device;
the laser generator is used for generating laser, and the generated laser is input into the water-jet guided laser processing device;
the fluid supply device is used for generating high-pressure fluid, and the generated high-pressure fluid is input into the water-jet guided laser processing device;
the water guide laser processing device cuts a workpiece by using laser generated by the laser generator;
preferably, the water-jet laser processing device further comprises a gas supply device, wherein the gas supply device is used for generating high-pressure gas, and the generated high-pressure gas is input into the water-jet laser processing device.
Preferably, the device also comprises a moving device and a feedback sensor;
the moving device is used for adjusting the position of the workpiece according to the control information of the control device to realize accurate cutting;
the feedback sensor is used for transmitting the collected real-time position information of the workpiece to the control device, and the control device sends control information to the mobile device according to the received real-time position information of the workpiece.
Compared with the prior art, the water-guide laser processing device and the processing system have the following beneficial effects:
according to the water-guided laser processing device, the central beam of the laser is converted into the edge beam by using the table-shaped reflector, so that the power distribution of the laser finally emitted from the coupling water cavity is more uniform, the taper effect of the water-guided laser when the workpiece is cut is improved, the deep processing capability is expanded, and the water-guided laser processing device has important significance for high-precision processing of materials in the fields of aerospace and civil use.
In this application, if the energy of laser is adjusted in the water column, can adjust through the diameter of control table form speculum, the cone angle of bell mouth and the side inclination of table form speculum, change the circular beam of laser into ring form light beam, realize the regulation to laser beam energy distribution.
This application has set up focusing lens, adopts two kinds of modes to set up, one kind for setting up focusing lens between platform form speculum and coupling water cavity, another kind is for setting up focusing lens in the incident light side of platform form speculum, and laser beam's focus can all be realized to two kinds of modes.
This application sets up the laser emergent face of the window lens in the coupling water cavity into the convex surface, and its convex surface can be circular arc convex surface or round platform form convex surface, and the purpose prevents that the microbubble from influencing laser emergent face position adhesion or stop in the coupling water cavity, influences laser transmission.
For avoiding the influence of sputtering to the water column among the cutting process, this application has still set up gas cavity, under the protection of gas and compression effect, realizes the stability and the maintenance of rivers, and this application has improved laminar flow quality through gas auxiliary mode.
This application sets up the outer wall of aqueous vapor export along gas chamber and outwards extends for increasing the stability that the air current flows, sets up the aqueous vapor export simultaneously and is connected with the outer wall circular arc of gas chamber's cavity.
The water guide laser processing system utilizes the water guide laser processing device, can reduce processing taper, realizes deep cutting, effectively reduces heat accumulation effect, further improves processing efficiency, and has the advantages of being simple in operation, low in cost, high-efficient and reliable and the like.
The water-guided laser processing system is provided with the feedback sensor, and can acquire the position information of the workpiece in real time, so that the cutting precision is determined, and accurate cutting is guaranteed.
Drawings
FIG. 1 is a schematic structural diagram of a water-guided laser processing apparatus according to the present invention;
FIG. 2 is a schematic radial cross-sectional view of the power density of the laser within the water column of the water-guided laser processing apparatus according to the present invention;
FIG. 3 is a diagram of the laser power distribution within the radius area 1/2 of the water column surface of the water jet guided laser processing device according to the present invention;
FIG. 4 is a diagram of the laser power distribution within a radius area 1/2 inside the water column of the water jet guided laser processing device according to the present invention;
FIG. 5 is a schematic structural diagram of a water-guided laser machining system according to the present invention.
List of parts and reference numerals:
1. laser; 2. a table-shaped reflecting mirror; 3. a coupling water cavity; 3-1, a cavity; 3-2, a window lens; 3-3, a water outlet; 3-4, a water inlet; 4. a frame; 5. a water column; 6. a tapered hole; 7. a condenser lens; 8. a gas chamber; 8-1, a water-gas outlet, 8-2, a gas inlet, 9 and a workpiece; 10. a control device; 11. a laser; 12. an optical element; 13. a fluid supply device; 14. a gas supply device; 15. a water-guided laser processing device; 16. a mobile device; 17. a feedback sensor.
Detailed Description
The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.
Fig. 1 is a schematic structural diagram of a water-guided laser processing apparatus according to the present invention.
The invention relates to a water-guided laser processing device, which comprises a table-shaped reflector 2 and a coupling water cavity 3; the table-shaped reflecting mirror and the coupling water cavity are sequentially and coaxially arranged along the transmission direction of the laser. The platform-shaped reflector 2 can be in a circular truncated cone shape or a multi-edge (not less than 3) frustum shape, and is used for inputting a central light beam of the laser 1 into the coupling water cavity after being guided by total reflection, specifically, the central light beam of the laser 1 is converted into an edge light beam by total reflection, and the edge light beam and an original edge light beam of the laser 1 are input into the coupling water cavity 3 together; the coupling water cavity 3 is used for transmitting the laser after total reflection and light guide along a water column 5 emitted by the coupling water cavity 3, and a workpiece 9 is cut by the laser in the water column 5; the invention improves the taper effect when the water-guide laser cuts the workpiece 9 and expands the deep cutting capability.
In order to ensure the stability of the water-guiding laser processing device, a frame 4 is arranged; the table-shaped reflecting mirror 2 and the coupling water cavity 3 are fixedly arranged in the frame 4.
The table-shaped reflecting mirror 2 comprises a first total reflection surface positioned on the axis of the table-shaped reflecting mirror 2 and a second total reflection surface positioned on the side surface of the table-shaped reflecting mirror 2; the first total reflection surface is used for totally reflecting the central beam of the laser to the second total reflection surface; and the second total reflection surface is used for carrying out secondary total reflection on the laser reflected by the first total reflection surface, and the laser emitted by the second total reflection surface is converted into an edge beam and then enters the coupling water cavity 3.
In order to construct the first total reflection surface and the second total reflection surface on the stage-shaped mirror 2, the present application explains the stage-shaped mirror having both structures. One structure is a truncated cone-shaped reflector, and the other structure is a prismoid-shaped reflector. When the reflecting mirror is a circular truncated cone-shaped reflecting mirror, a tapered hole 6 is formed in the axis of the circular truncated cone-shaped reflecting mirror, the tapered hole 6 is formed along the direction from the lower bottom surface to the upper bottom surface of the circular truncated cone-shaped reflecting mirror, namely, the cone tip of the tapered hole 6 is close to the laser incident surface of the circular truncated cone-shaped reflecting mirror. In order to realize the total reflection function of the conical hole 6, a total reflection coating is coated on the side surface of the conical hole 6 to form a first total reflection surface; meanwhile, the upper bottom surface of the round table-shaped reflecting mirror receives laser, and the side surface of the round table-shaped reflecting mirror is coated with a total reflection coating to form a second total reflection surface. When the reflecting mirror is a frustum pyramid-shaped reflecting mirror, a pyramid hole is formed in the axis of the frustum pyramid-shaped reflecting mirror, and the pyramid hole is formed along the direction from the lower bottom surface to the upper bottom surface of the frustum pyramid-shaped reflecting mirror, namely the cone tip of the pyramid hole is close to the laser incidence surface of the frustum pyramid-shaped reflecting mirror. In order to realize the total reflection function of the pyramid-shaped hole, a total reflection coating is coated on the side surface of the pyramid-shaped hole to form a first total reflection surface; meanwhile, the upper bottom surface of the prismoid reflector receives laser, and the side surface of the prismoid reflector is coated with a total reflection coating to form a second total reflection surface. This structure can ensure that the central beam of the laser 1 is reflected by the first total reflection surface to the second total reflection surface and is converted into an edge beam.
In the using process, if the edge power density and the center power density of the laser in the water column 5 are to be adjusted, the circular beam of the laser can be converted into the circular beam by controlling the diameter of the table-shaped reflecting mirror 2, the taper angle of the tapered hole 6 and the side surface inclination angle of the table-shaped reflecting mirror 2.
The focusing lens 7 is further arranged, and the focusing lens 7 can be arranged in two modes, namely the focusing lens 7 is arranged between the table-shaped reflecting mirror 2 and the coupling water cavity 3; the focusing lens 7 in the device is used for focusing the laser after total reflection and light guide and then emitting the laser into the coupling water cavity 3. Another way of arranging the focusing lens 7 is to arrange the focusing lens 7 and the stage-shaped reflecting mirror 2 in sequence along the transmission direction of the laser 1; in this case, the focusing lens 7 is for focusing the laser beam 1 and then irradiating the laser beam onto the stage mirror 2. The focusing lens 7 and the frame can be connected through the fine tuning lens seat, and can also be directly fixedly connected with the frame, the fine tuning lens seat used in the application can use the existing lens seat, and the three-dimensional small-amount movement of the focusing lens 7 can be realized as long as the focusing lens 7 can be three-dimensionally adjusted (the axial direction is Z direction, and the radial direction is vertically provided with X, Y direction). The use of the focusing lens 7 ensures that the laser light is focused within the coupling water chamber 3.
The coupling water cavity 3 comprises a cavity body 3-1, a window lens 3-2, a water outlet 3-3 and a water inlet 3-4 arranged on the side wall of the coupling water cavity 3; the window lens 3-2 is arranged on the outer wall of the cavity 3-1, so that the laser after total reflection and light guide can enter the cavity 3-1 through the window lens 3-2. The laser receiving surface of the window lens 3-2 is a plane, and the laser emitting surface of the window lens 3-2 is a convex surface; the convex surface can be an arc-shaped convex surface or a truncated cone-shaped convex surface, and the purpose is to prevent micro-bubbles in the coupling water cavity 3 from adhering or staying at the laser emergent surface of the window lens 3-2 to influence laser transmission. The water outlet 3-3 is arranged at the focus of the focusing lens 7, and the water column 5 of the water outlet 3-3 guides the laser to cut the workpiece 9. The coupling water chamber 3 of the present application supplies high pressure water into the coupling water chamber 3 through the water inlets 3-4. The high-pressure water can be common drinking water or ultrapure water.
In order to avoid the influence of sputtering on the water column 5 in the cutting process, the gas chamber 8 is further arranged, the gas chamber 8 is provided with a water vapor outlet 8-1, and the water vapor outlet 8-1 and the water outlet 3-3 of the coupling water chamber 3 are coaxially arranged, so that the water column 5 flowing out of the water outlet 3-3 directly flows out of the water vapor outlet 8-1, and the transmission direction of the water column 5 cannot be changed. The side wall of the gas chamber 8 is provided with a gas inlet 8-2. The gas in the gas chamber 8 is helium, nitrogen or argon. Under the protection and the compression effect of gas, realize the stability and the maintenance of rivers, the laminar flow quality has been improved through gas-assisted mode to this application.
In order to increase the stability of airflow flowing, the moisture outlet 8-1 is arranged to extend outwards along the outer wall of the gas chamber 8, and the moisture outlet 8-1 is connected with the outer wall of the gas chamber in an arc mode. The caliber of the water-gas outlet 8-1 is more than or equal to the caliber of the water outlet 3-3. Preferably, the caliber of the water gas outlet 8-1 is equal to the caliber of the water outlet 3-3.
In order to verify the laser density in the output water column 5 of the water jet guided laser processing device of the present application, the present application obtains the power density radial cross section of the laser in the water column 5, see fig. 2. In fig. 2, the central point of the abscissa is the radial center of the water column 5, the ordinate is the power density, a is an ideal laser power density distribution line in the water column 5, b is a laser power density distribution line in the water column 5 of the existing water-guided laser processing device, and c is a laser power density distribution line in the water column 5 of the water-guided laser processing device of the present application. As can be seen from fig. 2, in the conventional water-guided laser processing apparatus without the mesa-shaped reflector 2, the laser power density in the water column 5 is mainly concentrated at the radial center of the circle, and in the water-guided laser processing apparatus of the present application, the laser power density distribution of the water column 5 is relatively more uniform. For further verifying the effectiveness of the machining device, a simulation analysis model is built by utilizing ZEMAX optical simulation software, and the distribution condition simulation of the laser beams in the water column 5 is carried out by using the circular truncated cone-shaped reflector. The diameter of the upper bottom surface of the circular truncated cone-shaped reflector is 10mm, the diameter of the lower bottom surface of the circular truncated cone-shaped reflector is 20mm, the cone angle of the conical hole is 90 degrees, the cone angle of the outer side surface of the conical hole is 90 degrees, and the diameter of the bottom surface of the conical hole is 10 mm. The cone angle is defined as: the angle between two generatrices of the axial cross-section of the conical hole (the cross-section of the shaft passing through the conical hole) is also obtained by extending the side surface of the truncated cone-shaped reflector upward, i.e. the angle of taper of the outer side surface. The detector is used for detecting laser in the water column 5, energy of the laser is evenly distributed to 1000 light rays, the laser light reaches the detector after being totally reflected for multiple times on the surface of the water column, the 1/2-diameter detector and the full water column-diameter detector are coaxially arranged, the detector receives one light ray with energy, the radius of the inner part 1/2 refers to the inner power, and the rest power is in the outer part 1/2. Simulation results are shown in fig. 3 and 4, where fig. 3 shows the laser power in the region of radius 1/2 outside the water column 5 and fig. 4 shows the laser power in the region of radius 1/2 inside the water column 5. The simulation results of fig. 3 and 4 show that the laser power in the 1/2 radius area outside the water column 5 can be greatly increased by about 15-30% by using the table-shaped reflector, which achieves the purpose of improving the gaussian distribution characteristics of the laser beam.
Fig. 5 is a schematic structural diagram of a water-guided laser processing system according to the present invention.
The invention discloses a water-guided laser processing system, which comprises a control device 10, a laser generator, a fluid supply device 13 and a water-guided laser processing device 15; wherein the control device 10 is used for controlling the opening and closing of the laser generator and the fluid supply device 13; a laser generator for generating laser 1, the generated laser 1 being input into the water guide laser processing device 15; the laser generator consists of a laser 11 and an optical element 12, the laser 11 generates laser, and the optical element 12 conducts the laser generated by the laser 11 to a water-conducting laser processing device 15; a fluid supply device 13 for generating a high-pressure fluid, the generated high-pressure fluid being input to the water guided laser machining device 15; and a water guide laser processing device 15 for cutting the workpiece 9 by the laser generated by the laser generator. Preferably, the water-guided laser machining system of the present application further includes a gas supply device 14, wherein the gas supply device 14 is configured to generate high-pressure gas, and the generated high-pressure gas is input into the water-guided laser machining device 15. The water-guided laser processing system utilizes the water-guided laser processing device 15, can realize deep cutting, and is low in technical cost and relatively small in technical difficulty.
To ensure accurate cutting, the machining system of the present application further includes a moving device 16 and a feedback sensor 17; the moving device 16 is used for adjusting the position of the workpiece 9 according to the control information of the control device 10 to realize accurate cutting; the feedback sensor 17 is used for transmitting the acquired real-time position information of the workpiece 9 to the control device 10, and the control device 10 sends control information to the moving device 16 according to the received real-time position information of the workpiece 9. The water-guided laser processing system is provided with the feedback sensor 17, and can acquire the position information of the workpiece 9 in real time, so that the cutting precision is determined, and the accurate cutting is guaranteed.
The working process of the water-guided laser processing system is as follows:
step 1, a control device 10 controls a laser generator to be started to generate laser 1, and the laser 1 is incident into a water-guided laser processing device 15; the laser generator comprises a laser 11 and an optical element 12, the laser 11 generates laser, and the optical element 12 realizes the transmission of laser beams and transmits the laser beams to the water-guided laser processing device 15;
step 2, after the laser 1 enters the water-guided laser processing device 15, the circular beam is processed into a circular beam through the total reflection light-guiding action of the table-shaped reflector 2 in the water-guided laser processing device 15 and the focusing action of the focusing lens 7 (or through the focusing action of the focusing lens 7, the total reflection light-guiding action of the table-shaped reflector 2 is performed), so that the adjustment of the energy distribution of the beam is realized;
step 3, the laser after focusing/energy distribution adjustment enters the cavity 3-1 through a window lens 3-2 on the coupling water cavity 3;
step 4, the control device 10 controls the fluid supply device 13 to be started, and ultrapure water is introduced into the cavity 3-1 through the water inlet 3-4; meanwhile, the control device 10 controls the gas supply device 14 to be opened, so that gas is introduced into the gas chamber 8;
step 5, the water column 5 flows out from a water outlet 3-3 on the lower end surface of the coupling water cavity 3 and is discharged from a water outlet 8-1 on the lower end surface of the gas cavity 8 under the protection and compression effects of the gas in the gas cavity 8;
step 6, conducting the laser through the water column 5 by total reflection to reach the surface of the workpiece 9, and finishing the cutting processing of the material;
and 7, acquiring real-time position information of the workpiece 9 by the feedback sensor 17 and transmitting the real-time position information to the control device 10, judging the cutting state and the cutting position of the workpiece 9 by the control device 10 according to the received real-time position information of the workpiece 9, if the workpiece 9 deviates from a preset position, sending control information to the mobile device 16 by the control device 10, and adjusting the position of the workpiece 9 by the mobile device 16 according to the received information to realize accurate cutting.
The water guide laser processing system utilizes the water guide laser processing device, can reduce processing taper, realizes deep cutting, effectively reduces heat accumulation effect, further improves processing efficiency, and has the advantages of being simple in operation, low in cost, high-efficient and reliable and the like. Meanwhile, the feedback sensor is arranged, so that the position information of the workpiece can be acquired in real time, the cutting precision is determined, and accurate cutting is guaranteed.
Although the present application has been described with reference to a few embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application as defined by the appended claims.
Claims (10)
1. A water-guided laser processing device is characterized by comprising a table-shaped reflector and a coupling water cavity;
the table-shaped reflector and the coupling water cavity are sequentially and coaxially arranged along the transmission direction of the laser;
the table-shaped reflector is used for inputting the central beam of the laser into the coupling water cavity after total reflection and light guide;
and the coupling water cavity is used for transmitting the laser after total reflection and light guide along a water column emitted by the coupling water cavity and cutting a workpiece by using the laser in the water column.
2. The water guided laser processing apparatus according to claim 1, wherein the stage-like reflector includes a first total reflection surface located on an axis of the stage-like reflector and a second total reflection surface located on a side surface of the stage-like reflector;
the first total reflection surface is used for totally reflecting the central beam of the laser to the second total reflection surface;
the second total reflection surface is used for carrying out secondary total reflection on the laser reflected by the first total reflection surface, and the laser emitted by the second total reflection surface is converted into an edge beam and then is emitted into the coupling water cavity.
3. The water-guided laser processing device of claim 2, wherein a tapered hole is formed in an axis of the mesa reflector, the tapered hole is formed along a direction from a lower bottom surface to an upper bottom surface of the mesa reflector, and a side surface of the tapered hole is coated with a total reflection coating to form the first total reflection surface;
the upper bottom surface of the table-shaped reflector receives the laser, and the side surface of the table-shaped reflector is coated with a total reflection coating to form the second total reflection surface.
4. The water guided laser machining apparatus according to claim 1, further comprising a focusing lens disposed between the stage reflector and the coupling water cavity;
and the focusing lens is used for focusing the laser after total reflection and light guide and then injecting the laser into the coupling water cavity.
5. The water-guided laser processing device of claim 1, further comprising a focusing lens, wherein the focusing lens and the stage-shaped reflecting mirror are coaxially arranged in sequence along a transmission direction of the laser light;
and the focusing lens is used for focusing the laser and then injecting the laser into the table-shaped reflecting mirror.
6. The water guided laser machining apparatus according to claim 4 or 5, wherein the coupling water chamber includes a cavity, a window lens, and a water outlet;
the window lens is arranged on the outer wall of the cavity and used for receiving the laser after total reflection and light guide; the laser receiving surface of the window lens is a plane, and the laser emitting surface of the window lens is a convex surface;
the water outlet is arranged at the focus of the focusing lens, and water columns emitted from the water outlet guide laser to cut the workpiece.
7. The water guided laser machining apparatus according to claim 6, further comprising a gas chamber;
the gas cavity is provided with a water vapor outlet, and the water vapor outlet and the water outlet of the coupling water cavity are coaxially arranged.
8. The water guided laser machining apparatus according to claim 7, wherein the moisture outlet extends outwardly along an outer wall of the gas chamber, and the moisture outlet is connected to the outer wall of the gas chamber in a circular arc.
9. A water guided laser machining system comprising a control device, a laser generator, a fluid supply device and a water guided laser machining device according to any one of claims 1 to 8;
the control device is used for controlling the opening and closing of the laser generator and the fluid supply device;
the laser generator is used for generating laser, and the generated laser is input into the water-jet guided laser processing device;
the fluid supply device is used for generating high-pressure fluid, and the generated high-pressure fluid is input into the water-jet guided laser processing device;
the water guide laser processing device is used for cutting a workpiece by using laser generated by the laser generator;
preferably, the water-jet laser processing device further comprises a gas supply device, wherein the gas supply device is used for generating high-pressure gas, and the generated high-pressure gas is input into the water-jet laser processing device.
10. The water guided laser machining system of claim 9, further comprising a moving device and a feedback sensor;
the moving device is used for adjusting the position of the workpiece according to the control information of the control device to realize accurate cutting;
the feedback sensor is used for transmitting the collected real-time position information of the workpiece to the control device, and the control device sends control information to the mobile device according to the received real-time position information of the workpiece.
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| CN113210894A (en) * | 2021-05-21 | 2021-08-06 | 上海大学 | Electric field assisted water-conducting laser cutting device |
| CN113618232A (en) * | 2021-07-28 | 2021-11-09 | 中国科学院宁波材料技术与工程研究所 | Double-beam coupling water guide machining head device and machining method |
| CN113634874A (en) * | 2021-09-23 | 2021-11-12 | 山东理工大学 | High-power water-conducting laser water optical coupling device with multi-focus lens |
| CN113751900A (en) * | 2021-09-28 | 2021-12-07 | 武汉大学 | Water-guide laser drilling system and method |
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