CN110911435A - Display device, manufacturing method of display device and substrate of display device - Google Patents
Display device, manufacturing method of display device and substrate of display device Download PDFInfo
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- CN110911435A CN110911435A CN201811071809.8A CN201811071809A CN110911435A CN 110911435 A CN110911435 A CN 110911435A CN 201811071809 A CN201811071809 A CN 201811071809A CN 110911435 A CN110911435 A CN 110911435A
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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Abstract
The invention discloses a manufacturing method of a display device. A substrate is provided having a base layer including a top surface having a plurality of metal contacts. An insulating layer is disposed on the top surface of the base layer, wherein the insulating layer has a device mounting surface and a bottom surface. The element mounting surface faces away from the base layer, and the bottom surface faces toward the base layer. And forming a plurality of clamping grooves on the insulating layer, wherein the clamping grooves penetrate from the element arrangement surface to the bottom surface, and the clamping grooves are aligned respectively and expose the metal contacts. An electromagnetic force is provided from the base layer toward the insulating layer. And providing a liquid drop comprising a plurality of micro-elements on the element arrangement surface, wherein each micro-element is provided with an electrode, and the structure of the electrode corresponds to the structure of one of the clamping grooves. The attracting electrodes are configured on the corresponding clamping grooves through electromagnetic force so as to contact the metal contacts exposed by the clamping grooves. The invention also discloses a display device and a substrate of the display device.
Description
Technical Field
The present invention relates to a display device, and more particularly, to a display device including a micro-device, a method of manufacturing the display device, and a substrate of the display device.
Background
Light emitting diodes have the advantages of high energy conversion efficiency, small size, and long service life, and thus have been widely used in various electronic products, such as indication, illumination, or display for providing images. Briefly, a light emitting diode has a light emitting layer and at least two semiconductor layers, and manufacturers can manufacture light emitting diodes with different colors by adjusting the materials used for the light emitting layer and the semiconductor layers.
Miniaturization of light emitting diodes is a promising next-generation semiconductor technology. With current technology, the size of light emitting diodes has been able to be miniaturized to micron scale dimensions. In some display panel processes, a Mass transfer (Mass transfer) of micro-leds is performed onto a substrate on which driving circuits are fabricated. However, since the size of the light emitting diode is more minute with the development of technology, it is difficult and costly to classify the micro light emitting diodes according to the light emitting colors in the mass transfer process.
Disclosure of Invention
In view of the above problems, the present invention discloses a display device, a method for manufacturing the display device, and a substrate of the display device, which facilitate mass transfer of micro-devices to the substrate in a simple, fast, and low-cost manner.
The manufacturing method of the display device disclosed by the invention comprises the following steps: providing a substrate having a base layer including a top surface with a plurality of metal contacts; disposing an insulating layer on the top surface of the substrate layer, wherein the insulating layer has an element disposing surface and a bottom surface, and the element disposing surface faces away from the substrate layer and the bottom surface faces the substrate layer; forming a plurality of clamping grooves on the insulating layer, wherein each clamping groove penetrates from the element arrangement surface to the bottom surface, and the clamping grooves are respectively aligned and expose the metal contacts; providing at least one electromagnetic force from the base layer toward the insulating layer; providing at least one liquid drop comprising a plurality of micro-elements on an element arrangement surface, wherein each micro-element is provided with an electrode, and the structure of the electrode corresponds to the structure of one of the clamping grooves; and attracting electrodes configured on the corresponding slots through electromagnetic force to contact the metal contacts exposed by the slots.
The substrate disclosed in the invention comprises a base layer and an insulating layer. The base layer has a top surface and a plurality of metal contacts, and the metal contacts are located on the top surface. The insulating layer is disposed on the top surface of the substrate layer and has a plurality of slots and opposite device mounting surfaces and bottom surfaces. The element mounting surface faces away from the base layer, and the bottom surface faces toward the base layer. Each card slot penetrates from the element setting surface to the bottom surface. The clamping grooves are respectively aligned and expose the metal contacts, and each clamping groove is used for being configured on an electrode of a micro-component so that the electrode contacts the exposed metal contacts.
The invention also discloses a display device comprising a substrate layer, an insulating layer and a plurality of micro-elements. The base layer has a top surface and a plurality of metal contacts, and the metal contacts are located on the top surface. The insulating layer is disposed on the top surface of the substrate layer and has a plurality of slots and opposite device mounting surfaces and bottom surfaces. Each card slot penetrates from the element setting surface to the bottom surface. The slots are aligned with and expose the metal contacts, respectively. Each of the microelements includes an electrode. The electrode is configured on one of the clamping grooves and is electrically connected with the metal contact exposed by the clamping groove.
According to the display device and the substrate of the display device disclosed by the invention, the insulating layer is provided with a plurality of clamping grooves, and each clamping groove is aligned to expose the metal contact. In addition, according to the manufacturing method of the display device disclosed by the invention, the liquid drops of the plurality of micro-elements are provided on the element arrangement surface of the insulating layer, and the electrodes of the micro-elements are attracted to the corresponding clamping grooves by the electromagnetic force provided to the clamping grooves so as to be arranged in contact with the metal contacts. Therefore, the micro-element can be simply and quickly transferred to the substrate, and the electromagnetic force is helpful to help the electrodes to be arranged in the clamping grooves, so that the transfer yield can be improved.
The above description of the present invention and the following description of the embodiments are provided to illustrate and explain the spirit and principles of the present invention and to provide further explanation of the invention as claimed in the appended claims.
Drawings
Fig. 1 is an exploded view of a display device according to an embodiment of the invention.
Fig. 2 is a sectional view of the display device of fig. 1.
FIG. 3 is a flowchart illustrating a method of fabricating the display device of FIG. 2 according to a first embodiment of the present invention.
Fig. 4 to 7 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a first embodiment of the present invention.
Fig. 8 and 9 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a second embodiment of the present invention.
Fig. 10 and 11 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a third embodiment of the present invention.
Fig. 12 and 13 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a fourth embodiment of the present invention.
Fig. 14 is an exploded view of a display device according to another embodiment of the invention.
Fig. 15 is a cross-sectional view of the display device of fig. 14.
Fig. 16 to 19 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a fifth embodiment of the present invention.
Fig. 20 and 21 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a sixth embodiment of the present invention.
Fig. 22 and 23 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a seventh embodiment of the present invention.
Fig. 24 and 25 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to an eighth embodiment of the present invention.
FIG. 26 is a schematic diagram illustrating the removal of abnormal micro-devices according to an embodiment of the present invention.
Wherein, the reference numbers:
1a, 1b display device
2a conductive layer
10a, 10b substrate
110a, 110b base layer
111a, 111b top surface
112a, 112b bottom surface
113a, 113b metal contact
1130b sub-contact
120a, 120b insulating layer
121a card slot
121b first card slot
1210b daughter card slot
122b second card slot
1220b daughter card slot
122a, 123b element mounting surface
123a, 124b bottom surface
130a, 130b electromagnetic force supply element
131b first coil
132b second coil
20a micro-element
210a electrode
20b first microelement
210b electrode
30b second microelements
310b electrode
40a nozzle
50 abnormal micro-element
S11-S16
Detailed Description
The detailed features and advantages of the present invention are described in detail in the embodiments below, which are sufficient for anyone skilled in the art to understand the technical contents of the present invention and to implement the present invention, and the related objects and advantages of the present invention can be easily understood by anyone skilled in the art according to the disclosure of the present specification, the protection scope of the claims and the attached drawings. The following examples further illustrate aspects of the present invention in detail, but are not intended to limit the scope of the invention in any way.
Embodiments of the present invention describe the construction of Micro components, such as Micro light emitting diodes (Micro LEDs) and Micro chips, that are ready for pick-up and transfer to a wiring substrate. For example, the receiving substrate may be a display substrate, a light emitting substrate, a substrate having a functional element such as a transistor or an Integrated Circuit (IC), or a substrate having a metal redistribution line, but is not limited thereto. While some embodiments of the invention are specific to describing miniature light emitting diodes including p-n diodes, it is to be understood that embodiments of the invention are not so limited and that certain embodiments may also be applied to other miniature semiconductor components designed in such a way as to control the performance of a predetermined electronic function (e.g., diode, transistor, integrated circuit) or photonic function (LED, laser).
The micro device described in the embodiments of the present invention is, for example, a micro light emitting diode, and a maximum size of the micro device is not larger than 100 μm, and the micro device can be subsequently integrated and assembled into a heterogeneous integrated system, including a micro display to a substrate of any size such as a large area display. In other embodiments, the micro device can be a micro integrated circuit (micro IC), a micro laser diode (micro LD), a micro sensor (micro sensor), and the like, which is not limited herein.
The substrate described in the embodiments of the present invention may be a Printed Circuit Board (PCB), a Flexible Printed Circuit Board (FPCB), a Thin Film Transistor (TFT) glass backplane, a glass backplane with a conductive trace, a Circuit Board with an Integrated Circuit (IC), or other driving substrate with a working Circuit.
Please refer to fig. 1 and fig. 2. Fig. 1 is an exploded view of a display device according to an embodiment of the invention.
Fig. 2 is a sectional view of the display device of fig. 1. In the present embodiment, the display device 1a includes a substrate 10a and a plurality of micro-devices 20 a. The number of microelements 20a is not intended to limit the present invention.
The substrate 10a includes a base layer 110a, an insulating layer 120a and an electromagnetic force providing element 130 a. The base layer 110a has a top surface 111a, a bottom surface 112a and a plurality of metal contacts 113a disposed on the top surface 111a, and the top surface 111a and the bottom surface 112a are two opposite surfaces of the base layer 110 a. The metal contact 113a is, for example, a metal conductive contact pad, which protrudes from the top surface 111 a.
The insulating layer 120a is, for example, alumina (Al)2O3) Silicon oxide (SiO)2) Aluminum nitride (AlN), silicon nitride (SiN) or other non-conductive polymer, which is disposed on the top surface 111a of the substrate layer 110a, has a thickness of 1-3 μm. The too thick insulating layer 120a affects the yield of the bonding, and the too thin insulating layer 120a has a problem of poor yield of the insulation. The insulating layer 120a has a plurality of slots 121a, an opposite device mounting surface 122a, and a bottom surface 123 a. The element mounting surface 122a faces away from the base layer 110a, and the bottom surface 123a faces toward the base layer 110 a. Each card slot 121a penetrates from the device mounting surface 122a to the bottom surface 123a of the insulating layer 120 a. The metal contacts 113a of the base layer 110a are aligned and exposed by the slots 121a, respectively. In the embodiment, the slot 121a is a single rectangular recess, but the invention is not limited thereto. In other embodiments, the card slot includes two or more spaced sub-card slots, the metal contact includes two or more spaced sub-contacts, and the sub-card slots expose the sub-contacts.
The electromagnetic force supplying element 130a is disposed on the bottom surface 112a of the substrate layer 110a, and the electromagnetic force supplying element 130a is disposed on the slots 121a to provide the electromagnetic force from the substrate layer 110a toward the insulating layer 120 a. In one embodiment, the electromagnetic force providing element 130a is a conductive wire electrically connected to the metal contact 113 a. In another embodiment, the electromagnetic force supplying element 130a is a coil spaced apart from the metal contact 113 a. In yet another embodiment, the electromagnetic force supplying element 130a includes a plurality of coils, which are respectively aligned at different metal contacts 113 a.
The micro-device 20a is, for example, a red light emitting diode, and includes an electrode 210 a. The electrode 210a of each micro-device 20a is disposed in one of the slots 121a, and the electrode 210a is electrically connected to the metal contact 113a exposed by the corresponding slot 121 a.
FIG. 3 is a flowchart illustrating a method of fabricating the display device of FIG. 2 according to a first embodiment of the present invention. Fig. 4 to 7 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a first embodiment of the present invention. In the present embodiment, the method for manufacturing a display device includes steps S11 to S16.
In step S11, a substrate layer 110a including a plurality of metal contacts 113a is provided.
In step S12, an insulating layer 120a is disposed on the top surface 111a of the substrate layer 110 a. The base layer 110a and the insulating layer 120a together form a substrate 10a of the display device.
In step S13, a plurality of card slots 121a are formed in the insulating layer 120a, wherein each card slot 121a penetrates from the device mounting surface 122a to the bottom surface 123a of the insulating layer 120 a. The slots 121a are aligned with and expose the metal contacts 113a of the base layer 110 a. As shown in fig. 4 and 5, in the present embodiment, the locking groove 121a is formed by removing a portion of the insulating layer 120a by, for example, a photolithography process and an etching process.
In step S14, at least one droplet including a plurality of microelements 20a is provided on the element mounting surface 122a of the insulating layer 120 a. As shown in fig. 6, in the present embodiment, a nozzle 40a is used to spray a droplet on the device mounting surface 122a, and the droplet includes a plurality of micro devices 20 a. The structure of the electrode 210a of the microelement 20a corresponds to the structure of the card slot 121 a. The droplets may be sprayed continuously along the extending direction of the substrate 10a or intermittently at selected positions on the substrate 10 a.
In step S15, an electromagnetic force is provided from the base layer 110a of the substrate 10a toward the insulating layer 120 a. As shown in fig. 6 and 7, in the present embodiment, the electromagnetic force supplying element 130a is a conductive wire electrically connected to the metal contact 113 a. In the embodiment where the electromagnetic force providing element 130a is a conductive line, a voltage is applied to the metal contacts 113a through the electromagnetic force providing element 130a to provide an electrostatic force as an electromagnetic force to the card slot 121a exposing the metal contacts 113 a.
In the present embodiment, the diameter of the liquid drop is larger than the maximum size of any of the microelements 20a, and is larger than the sub-pixel area of the display device 1 a. Thereby, it helps to ensure that the droplet size is sufficient to accommodate at least one of the microelements 20a, and that the transfer of at least one sub-pixel block can be performed simultaneously. In other embodiments, not shown, the diameter of the droplet is larger than the maximum size of any of the micro-devices and is smaller than or equal to the sub-pixel area of the display device, so as to prevent the droplet from overflowing to the area outside the sub-pixel area of the display device and affecting the image quality.
In step S16, the attracting electrodes 210a are disposed on the corresponding slots 121a by electromagnetic force to contact the metal contacts 113a exposed by the slots 121 a. As shown in fig. 7, the rubbing electrode 210a is charged electrostatically when it is ejected from the nozzle 40 a. Then, a voltage is applied to the metal contacts 113a by the electromagnetic force supplying element 130a to provide an electrostatic force of opposite polarity to the card slot 121a exposing the metal contacts 113 a. For example, when the electrode 210a of the micro-device 20a carries negative static electricity, the electromagnetic force supplying device 130a generates positive static electricity on the metal contact 113a, so that the metal contact 113a and the electrode 210a attract each other, thereby completing the transfer of the micro-device 20a to the substrate 10 a. Therefore, the metal contact 113a and the electrode 210a with electrostatic force can provide good directivity during the process of transferring the micro-device 20a to the substrate 10a, which is helpful to improve the transfer efficiency.
After step S16 is completed, the substrate 10a is heated to remove the liquid droplets remained on the micro-devices 20a and the substrate 10a, and the electromagnetic force supplying device 130a stops applying the voltage to the metal contacts 113a to remove the electrostatic force, thereby obtaining the display device of the present embodiment.
Fig. 8 and 9 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a second embodiment of the present invention. Since the second embodiment is similar to the first embodiment, differences will be described below.
In the present embodiment, when providing a droplet including the microelement 20a, the nozzle 40a is energized to generate a droplet with electrostatic force. For example, the nozzle 40a is energized to negatively charge the ejected droplets. The liquid droplet capable of having an electrostatic force may be a liquid droplet having conductivity, for example, an aqueous solution containing an Anisotropic Conductive substance (Anisotropic Conductive) or a nano metal particle.
Next, when the electrodes 210a are disposed in the corresponding card slots 121a by the electromagnetic force, the electromagnetic force supplying element 130a applies a voltage to the metal contacts 113a to provide electrostatic force of opposite electric polarity as the electromagnetic force to the card slots 121a exposing the metal contacts 113 a. For example, when the droplet is charged with negative static electricity, the electromagnetic force supplying element 130a generates positive static electricity for the metal contact 113a, so that the metal contact 113a and the droplet are attracted to each other, and the micro-device 20a in the droplet is carried into the card slot 121 a. Thereby contributing to the improvement of the transfer efficiency of the micro-device 20a to the substrate 10 a.
Fig. 10 and 11 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a third embodiment of the present invention. Since the third embodiment is similar to the first embodiment, differences will be described below. In the present embodiment, the electromagnetic force providing element 130a is a coil, and is disposed on the bottom surface 112a (opposite to the top surface 111 a) of the base layer 110a of the substrate 10a, and the coil pair is located on the slots 121 a.
In the present embodiment, the metal contact 113a and the electrode 210a are made of a material having a high magnetic permeability, such as nickel or iron, but not limited thereto. When an electromagnetic force is applied from the base layer 110a toward the insulating layer 120a, a voltage is applied to the coil so that the coil generates a magnetic force as the electromagnetic force when receiving the voltage. Specifically, when the coil is energized, the metal contact 113a is magnetized by electromagnetic induction to generate magnetic polarity. The metal contact 113a and the electrode 210a of the micro-device 20a are attracted by the magnetic force, so that the attracting electrode 210a is disposed in the card slot 121 a.
Fig. 12 and 13 are schematic views illustrating a method of manufacturing the display device of fig. 2 according to a fourth embodiment of the present invention. Since the fourth embodiment is similar to the first embodiment, differences will be described below. In the present embodiment, the microelements 20a are included in droplets that do not have electrical conductivity. The droplets having no conductivity are, for example, a flowable resin.
Before providing the droplet including the micro-device 20a, a conductive layer 2a is disposed on the electrode 210a of the micro-device 20a and the metal contact 113a of the base layer 110 a. The conductive layer 2a is, for example, a conductive paste. Next, the nozzle 40a is used to spray droplets having no conductivity and the microelements 20a included in the droplets. Thus, the conductive layer 2a can be used for bonding conduction, and the ohmic contact between the electrode 210a and the metal contact 113a can be better. As shown in fig. 13, the electrode 210a is inserted into the slot 121a, and the conductive layer 2a on the metal contact 113a is electrically contacted with the conductive layer 2a on the electrode 210 a.
In the present embodiment, the electrode 210a and the metal contact 113a are both configured with the conductive layer 2a, but the invention is not limited thereto. In other embodiments, one of the electrode 210a and the metal contact 113a is configured with the conductive layer 2 a.
In fig. 1, all the card slots 121a of the base layer 110a of the display device 1a have a uniform structure, and the substrate 10a of the display device 1a is used for transferring the single-sized micro-device 20a, but the invention is not limited thereto. Fig. 14 is an exploded view of a display device according to another embodiment of the invention. Fig. 15 is a cross-sectional view of the display device of fig. 14. In the present embodiment, the display device 1b includes a substrate 10b, a plurality of first microelements 20b and a plurality of second microelements 30 b. The number of the first microelements 20b and the second microelements 30b is not intended to limit the present invention.
The substrate 10b includes a base layer 110b, an insulating layer 120b and an electromagnetic force providing element 130 b. The base layer 110b has a top surface 111b, a bottom surface 112b and a plurality of metal contacts 113b on the top surface 111b, and the top surface 111b and the bottom surface 112b are two opposite surfaces of the base layer 110 b. Each metal contact 113b has two sub-contacts 1130 b.
The insulating layer 120b is, for example, alumina (Al)2O3) Silicon oxide (SiO)2) Aluminum nitride (AlN), silicon nitride (SiN), or other non-conductive polymer, disposed on the top surface 111b of the base layer 110 b. The insulating layer 120b has a plurality of first card slots 121b, a plurality of second card slots 122b, a device mounting surface 123b and a bottom surface 124 b. The element mounting surface 123b is opposed to the bottom surface 124 b. The element mounting surface 123b faces away from the base layer 110b, and the bottom surface 124b faces toward the base layer 110 b. The first card slot 121b and the second card slot 122b penetrate from the device mounting surface 123b to the bottom surface 124b of the insulating layer 120 b. The first slots 121b are aligned and connected respectivelyA portion of the metal contact 113b of the base layer 110b is exposed, and the second card slots 122b are respectively aligned and expose another portion of the metal contact 113b of the base layer 110 b.
The first card slot 121b includes two sub-card slots 1210 b. For one of the first card slots 121b and the corresponding one of the metal contacts 113b, the two daughter card slots 1210b expose two of the sub-contacts 1130b, respectively. In addition, second card slot 122b includes two daughter card slots 1220 b. For one of the second card slots 122b and the corresponding one of the metal contacts 113b, the two daughter card slots 1220b expose two of the sub-contacts 1130b, respectively.
The structure of the second card slot 122b is different from that of the first card slot 121 b. In detail, the first card slot 121b and the second card slot 122b have different sizes or shapes. In this embodiment, the two daughter card slots 1210b of the first card slot 121b are respectively rectangular recesses and strip-shaped recesses, and the two daughter card slots 1220b of the second card slot 122b are respectively square recesses and rectangular recesses.
The electromagnetic force supplying element 130b is disposed on the bottom surface 112b of the substrate layer 110b, and the electromagnetic force supplying element 130b is aligned with the first engaging slots 121b and the second engaging slots 122b to provide an electromagnetic force from the substrate layer 110b toward the insulating layer 120 b. In one embodiment, the electromagnetic force providing element 130b is a conductive wire electrically connected to the metal contact 113 b. In another embodiment, the electromagnetic force supplying member 130b is a coil spaced apart from the metal contact 113 b. In yet another embodiment, the electromagnetic force supplying element 130b includes a plurality of coils, which are respectively aligned at different metal contacts 113 b.
The first microelement 20b is, for example, a red light-emitting diode, and comprises an electrode 210 b. The structure of the electrodes 210b of the first microelements 20b corresponds to the structure of the first card slots 121b, and the electrode 210b of each first microelement 20b is configured to one of the first card slots 121 b. The electrode 210b is electrically connected to the metal contact 113b exposed by the first card slot 121 b.
The second micro-device 30b is, for example, a green light emitting diode, and includes an electrode 310 b. The structure of the electrodes 310b of the second microelements 30b corresponds to the structure of the second card slots 122b, and the electrode 310b of each second microelement 30b is configured to one of the second card slots 122 b. The electrode 310b is electrically connected to the metal contact 113b exposed by the second card slot 122 b.
Fig. 16 to 19 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a fifth embodiment of the present invention. First, a base layer 110b including a plurality of metal contacts 113b is provided. Next, an insulating layer 120b is disposed on the top surface 111b of the base layer 110 b. The base layer 110b and the insulating layer 120b together form a substrate 10b of the display device.
A plurality of first card slots 121b and a plurality of second card slots 122b are formed in the insulating layer 120 b. The first and second card slots 121b and 122b are aligned and expose the metal contacts 113b of the substrate layer 110b, respectively. In the present embodiment, the slot is formed by removing a portion of the insulating layer 120b by photolithography and etching.
Next, a droplet including a plurality of first micro-devices 20b and second micro-devices 30b is provided on the device mounting surface 123b of the insulating layer 120 b. The droplets may be sprayed continuously along the extending direction of the substrate 10b or intermittently at selected positions on the substrate 10 b.
Then, an electromagnetic force is provided from the base layer 110b of the substrate 10b toward the insulating layer 120 b. As shown in fig. 18 and 19, in the present embodiment, the electromagnetic force supplying element 130b includes a plurality of conductive lines electrically connected to the sub-contacts 1130b of the metal contacts 113 b. In the present embodiment where the electromagnetic force supplying element 130b is a conductive line, a voltage is applied to the sub-contact 1130b of the metal contact 113b corresponding to the first card slot 121b through the electromagnetic force supplying element 130b to provide a first electrostatic force as an electromagnetic force toward the first card slot 121b exposing the metal contact 113 b. In addition, a voltage is applied to the sub-contact 1130b of the metal contact 113b corresponding to the second card slot 122b through the electromagnetic force supplying element 130b to provide a second electrostatic force as an electromagnetic force toward the second card slot 122b exposing the metal contact 113 b. The electrostatic force may be generated by applying a voltage to all the metal contacts 113b simultaneously, or by applying a voltage to the exposed metal contact 113b of the first card slot 121b and the exposed metal contact 113b of the second card slot 122b in a time-sharing manner. The first electrostatic force and the second electrostatic force may be opposite electrostatic forces or the same electrostatic force but different in strength.
Then, the electrode 210b of the first micro-device 20b is attracted by electromagnetic force to be disposed in the corresponding first card slot 121b to contact the metal contact 113b exposed by the first card slot 121 b. As shown in fig. 19, the electrode 210b is affected by the electric field generated by the first electrostatic force and has an opposite electrical property to the first electrostatic force. Due to the interaction of the electrostatic force, the electrode 210b and the metal contact 113b exposed by the first card slot 121b attract each other, so that the electrode 210b is embedded in the first card slot 121b, thereby completing the transfer of the first microelement 20b to the substrate 10 b. Since the first card slot 121b and the second card slot 122b have different structures, the first microelement 20b will not be embedded in the second card slot 122 b.
In addition, the electrode 310b of the second micro-device 30b is also attracted by the electromagnetic force to be disposed in the corresponding second card slot 122b to contact the metal contact 113b exposed by the second card slot 122 b. The electrode 310b is affected by the electric field generated by the second electrostatic force and has an opposite electrical property to the second electrostatic force. Due to the interaction of the electrostatic force, the electrode 310b and the exposed metal contact 113b of the second card slot 122b attract each other, so that the electrode 310b is embedded into the second card slot 122b, thereby completing the transfer of the second micro-device 30b to the substrate 10 b. Similarly, since the first card slot 121b and the second card slot 122b have different structures, the second microelement 30b will not be embedded in the first card slot 121 b.
In the present embodiment, the first electrostatic force of the metal contact 113b exposed by the first card slot 121b includes a positive electrostatic force applied to the two sub-contacts 1130b, and the second electrostatic force of the metal contact 113b exposed by the second card slot 122b includes a negative electrostatic force applied to the two sub-contacts 1130b, but the invention is not limited thereto.
Finally, the substrate 10b is heated to remove the droplets remaining on the first micro-device 20b, the second micro-device 30b and the substrate 10b, thereby obtaining the display device of the present embodiment.
Fig. 20 and 21 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a sixth embodiment of the present invention. Since the sixth embodiment is similar to the fifth embodiment, differences will be described below. In the present embodiment, when providing the liquid droplet including the first microelement 20b and the second microelement 30b, the nozzle is energized to generate the liquid droplet with electrostatic force. Further, the nozzle first sprays a first droplet with positive electrostatic force, and the first microelement 20b is included in the first droplet. Then, the nozzle sprays a second droplet with negative electrostatic force, and the second microelement 30b is included in the second droplet.
When the electrodes 210b are disposed in the corresponding first slots 121b by electromagnetic force, the electromagnetic force providing element 130b applies a voltage to the metal contacts 113b to provide electrostatic force as electromagnetic force opposite to the first droplet including the first microelement 20b towards the first slots 121b exposing the metal contacts 113 b. Further, in the case where the first droplet has a positive electrostatic force, the electromagnetic force supply element 130b applies a voltage to the metal contact 113b exposed by the first card slot 121b to generate a negative electrostatic force. Therefore, the second droplet with negative electrostatic force repels the exposed metal contact 113b of the first card slot 121b, so as to prevent the second micro-component 30b from being too close to the first card slot 121b to obstruct the transfer of the first micro-component 20b to the substrate 10 b.
Similarly, when the electrodes 310b are disposed in the corresponding second card slots 122b by electromagnetic force, the voltage is applied to the metal contacts 113b by the electromagnetic force supplying element 130b to provide electrostatic force as electromagnetic force opposite to the second droplet including the second micro-device 30b to the second card slot 122b exposing the metal contacts 113 b. Further, in the case of the second droplet with negative electrostatic force, the electromagnetic force supply element 130b applies a voltage to the metal contact 113b exposed by the second slot 122b to generate a positive electrostatic force, thereby preventing the first microelement 20b from being excessively close to the second slot 122b and obstructing the transfer of the second microelement 30b to the substrate 10 b.
Fig. 22 and 23 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to a seventh embodiment of the present invention. Since the seventh embodiment is similar to the fifth embodiment, differences will be described below. In the present embodiment, the electromagnetic force providing element 130b is a coil, and is disposed on the bottom surface 112b (the corresponding surface of the top surface 111 b) of the base layer 110b of the substrate 10b, and the pair of coils is located in the first card slots 121b and the second card slots 122 b.
In the present embodiment, when the electromagnetic force is provided from the base layer 110b toward the insulating layer 120b, a voltage is applied to the coil, so that the coil generates a magnetic force as the electromagnetic force when receiving the voltage. The electrodes 210b, 310b and the metal contact 113b are made of a material having a high magnetic permeability, such as nickel or iron. In detail, when the coil is energized, the metal contacts 113b exposed by the first card slot 121b and the second card slot 122b are magnetized by electromagnetic induction to generate magnetic polarity. The electrodes 210b and 310b are respectively disposed in the first slot 121b and the second slot 122b by the magnetic attraction between the metal contact 113b and the electrodes 210b and 310 b.
Fig. 24 and 25 are schematic views illustrating a method of manufacturing the display device of fig. 15 according to an eighth embodiment of the present invention. Since the eighth embodiment is similar to the fifth embodiment, differences will be described below. In the present embodiment, the electromagnetic force supply element 130b includes a plurality of first coils 131b and a plurality of second coils 132 b. The first coil 131b and the second coil 132b are disposed on the bottom surface 112b of the base layer 110b of the substrate 10 b. The first coils 131b are respectively aligned with the first slots 121b, and the second coils 132b are respectively aligned with the second slots 122 b.
The first coil 131b is used for generating a first magnetic force when receiving a voltage. In detail, when the electromagnetic force is provided from the base layer 110b of the substrate 10b toward the insulating layer 120b, the first coil 131b is energized to provide a first magnetic force toward the first card slot 121b, so that the metal contact 113b exposed by the first card slot 121b is magnetized to generate magnetic polarity. Similarly, the second coil 132b is used for generating a second magnetic force when receiving the voltage. When an electromagnetic force is applied from the base layer 110b of the substrate 10b toward the insulating layer 120b, the second coil 132b is energized to apply a second magnetic force toward the second card slot 122b, so that the exposed metal contact 113b of the second card slot 122b is magnetized to generate magnetic polarity.
The first magnetic force and the second magnetic force may be opposite magnetic forces. For example, the first magnetic force may be an N-pole, and the second magnetic force may be an S-pole. Further, a voltage may be simultaneously applied to the first coil 131b and the second coil 132b to magnetize all the metal contacts 113b simultaneously. Alternatively, a voltage is applied to the first coil 131b to magnetize a part of the metal contacts 113b, and after the voltage application to the first coil 131b is stopped, a voltage is applied to the second coil 132b to magnetize another part of the metal contacts 113 b.
When the electrode 210b is disposed in the corresponding first slot 121b by electromagnetic force, the electrode 210b is attracted by the magnetic force between the metal contact 113b and the electrode 210b, so as to be disposed in the first slot 121 b. In the present embodiment, since the second coil 132b is turned off to make only the metal contact 113b exposed by the first card slot 121b generate magnetism, it is helpful to avoid the electrode 210b not being embedded into the first card slot 121b because the first micro-device 20b is close to the second card slot 122 b.
When the electrode 310b is disposed in the corresponding second slot 122b by electromagnetic force, the electrode 310b is attracted by the magnetic force between the metal contact 113b and the electrode 310b, so as to be disposed in the second slot 122 b. In the present embodiment, since the metal contact 113b exposed by the second card slot 122b can be magnetized by turning off the first coil 131b, it is helpful to avoid the electrode 310b from being embedded into the second card slot 122b because the second micro-device 30b is close to the first card slot 121 b.
In the manufacturing process of the display device 1b in fig. 14, since there may be defects in the first micro-device 20b or the second micro-device 30b, there may be a case where the electrodes of the micro-devices are not embedded in the correct card slots. For example, if the structure of the electrode 310b of the second micro-device 30b is abnormal, the electrode 310b may be inadvertently inserted into the first card slot 121b when the electrode 310b is disposed in the second card slot 122b, resulting in the second micro-device 30b being located at the wrong position. To solve the above problems, the present invention provides a method for removing abnormal micro-devices after the micro-devices are configured. Fig. 26 is a schematic diagram of removing abnormal micro-devices according to an embodiment of the invention, wherein an electrode of an abnormal micro-device 50 is disposed in one of the first card slots 121 b.
After the electrode 210b of the first micro-device 20b and the electrode 310b of the second micro-device 30b are respectively disposed in the first card slot 121b and the second card slot 122b, an inspection apparatus such as an optical apparatus or an electrical inspection apparatus is used to inspect whether the working state of the micro-device disposed in the card slot is abnormal. In fig. 26, when the operation state of the micro-components disposed in the first card slot 121b is checked, it is found that an abnormal micro-component 50 is disposed in one of the first card slot 121 b. In the present embodiment, the abnormal micro-device 50 is, for example, a micro-device with a different light emitting color from the first micro-device 20b, or a first micro-device with a poor light emitting intensity.
When a part of the microdevice disposed with the card slot has an abnormal microdevice, the supply of the electromagnetic force to the card slot disposed with the abnormal microdevice is stopped. In fig. 26, the electromagnetic force supply unit 130b is caused to stop supplying the electromagnetic force to the first card slot 121b where the abnormal microelement 50 is located.
After the abnormal micro-device 50 is confirmed, the abnormal micro-device is removed from the device mounting surface 123b of the substrate 10 b. In the present embodiment, a droplet not including any micro-element is provided on the element mounting surface 123 b. The liquid droplets are then sucked by a suction nozzle (not shown). By the surface tension between the droplet and the device mounting surface 123b, the abnormal micro-device 50 disposed in the first slot 121b is removed from the device mounting surface 123b when the droplet is removed. The present embodiment uses the droplet to remove the abnormal micro-device 50, but the invention is not limited thereto. In other embodiments, the abnormal micro-device 50 may be picked up by an adhesive material to remove the abnormal micro-device 50 from the device mounting surface 123 b. In another embodiment, a droplet not including any micro-device may be provided on the device mounting surface. Then, a suction nozzle (not shown) is used to suck the liquid drops, so that the abnormal micro-device not disposed in the card slot is driven to be removed from the device mounting surface when the liquid drops are removed.
In summary, in the display device and the substrate of the display device disclosed in the present invention, the insulating layer has a plurality of slots, and each slot is aligned to expose the metal contact. In addition, in the method for manufacturing a display device according to the present invention, the droplet including the plurality of micro-elements is provided on the element mounting surface of the insulating layer, and the electrodes of the micro-elements are attracted to the corresponding card slots by the electromagnetic force provided to the card slots to be disposed in contact with the metal contacts. Therefore, the transfer of the micro-element to the substrate can be simply and quickly completed, and the electromagnetic force is helpful for helping the electrode to be configured in the clamping groove so as to improve the transfer qualified rate.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (20)
1. A method for manufacturing a display device, comprising:
providing a substrate having a base layer including a top surface with a plurality of metal contacts;
disposing an insulating layer on the top surface of the substrate layer, wherein the insulating layer has an element disposing surface and a bottom surface, and the element disposing surface faces away from the substrate layer and the bottom surface faces the substrate layer;
forming a plurality of slots in the insulating layer, wherein each slot penetrates from the element mounting surface to the bottom surface, and the slots are aligned with and expose the metal contacts;
providing at least one electromagnetic force from the base layer toward the insulating layer;
providing at least one droplet including a plurality of micro-elements on the element arrangement surface, wherein each micro-element has an electrode, and the structure of the electrode corresponds to the structure of one of the clamping grooves; and
the electrode is attracted to the corresponding clamping groove through the at least one electromagnetic force so as to be in contact with the metal contact exposed by the clamping groove.
2. The method of claim 1, wherein the plurality of card slots include a plurality of first card slots and a plurality of second card slots, the micro-devices include a plurality of first micro-devices and a plurality of second micro-devices, the electrode of each of the first micro-devices has a structure corresponding to the structure of each of the first card slots, the electrode of each of the second micro-devices has a structure corresponding to the structure of each of the second card slots, and the structure of each of the first card slots is different from the structure of each of the second card slots.
3. The method of claim 2, wherein the at least one electromagnetic force comprises a first electrostatic force and a second electrostatic force, and the step of providing the at least one electromagnetic force from the base layer toward the insulating layer comprises:
applying a voltage to the exposed metal contacts of the first card slots to provide a first electrostatic force to the first card slots; and
applying a voltage to the exposed portions of the metal contacts of the second card slots to provide a second electrostatic force towards the second card slots, wherein the electrode of each of the first micro-devices has an opposite electrical property to the first electrostatic force, and the electrode of each of the second micro-devices has an opposite electrical property to the second electrostatic force.
4. The method of claim 1, wherein providing the at least one electromagnetic force from the base layer toward the insulating layer comprises:
applying a voltage to at least one of the metal contacts to provide an electrostatic force to the card slot exposing the at least one of the metal contacts as the at least one electromagnetic force, wherein the electrode of each of the micro-components is opposite to the electrostatic force.
5. The method as claimed in claim 2, wherein the at least one electromagnetic force comprises a first magnetic force and a second magnetic force, and the step of providing the at least one electromagnetic force from the base layer towards the insulating layer comprises:
arranging a plurality of first coils and a plurality of second coils on the corresponding surface of the top surface of the substrate layer, wherein the first coils are respectively aligned with the first clamping grooves, and the second coils are respectively aligned with the second clamping grooves;
applying a voltage to the first coils to provide the first magnetic force towards the first card slots; and
and applying voltage to the second coils to provide the second magnetic force towards the second clamping grooves.
6. The method of claim 1, wherein providing the at least one electromagnetic force from the base layer toward the insulating layer comprises:
disposing a coil on a corresponding surface of the top surface of the substrate layer, wherein the coil is aligned with the slots; and
applying a voltage to the coil to provide a magnetic force to the slots as the at least one electromagnetic force.
7. The method of claim 1, wherein the at least one electromagnetic force is greater than a sum of a weight of one of the micro-elements and a connecting force between the one of the micro-elements and the droplet.
8. The method of claim 1, wherein a diameter of the at least one droplet is greater than or equal to a maximum dimension of one of the micro-devices.
9. The method of claim 1, wherein the at least one droplet is formed from a solution having no conductivity, and further comprising, prior to providing the at least one droplet including the microelements:
disposing a conductive layer on the electrode and/or each metal contact of each of the micro-devices.
10. The method of claim 1, further comprising:
providing another liquid drop on the device mounting surface; and
removing the other droplet and removing the micro-devices disposed in the slots from the device mounting surface.
11. The method of claim 10, wherein the another droplet and the at least one droplet are formed from solutions of different materials.
12. The method of claim 1, wherein providing the at least one electromagnetic force from the base layer toward the device mounting surface comprises:
providing the at least one electromagnetic force to each of the slots;
the manufacturing method comprises the following steps:
checking whether the working states of the micro-components configured with the card slots are abnormal or not;
stopping providing the at least one electromagnetic force to the card slot configured with the abnormal micro-device when a part of the micro-devices configured with the card slot have the abnormal micro-device; and
the abnormal micro-device is removed from the device mounting surface.
13. A substrate for a display device, comprising:
a base layer having a top surface and a plurality of metal contacts, the metal contacts being located on the top surface; and
an insulating layer disposed on the top surface of the substrate layer and having a plurality of slots and opposing device mounting surfaces and bottom surfaces, wherein the device mounting surfaces face away from the substrate layer and the bottom surfaces face toward the substrate layer, each of the slots penetrates from the device mounting surfaces to the bottom surfaces, the slots are aligned and expose the metal contacts, and each of the slots is configured on an electrode of a micro device to contact the exposed metal contact.
14. The substrate for a display device according to claim 13, further comprising:
and a coil disposed on a bottom surface of the substrate layer and aligned with the plurality of slots for generating a magnetic force to attract the electrode to be disposed in one of the plurality of slots when receiving a voltage, wherein the bottom surface and the top surface of the substrate layer are two opposite surfaces of the substrate layer.
15. The substrate of claim 13, wherein the plurality of card slots comprise a plurality of first card slots and a plurality of second card slots, and each of the second card slots has a structure different from that of each of the first card slots.
16. The substrate for a display device according to claim 15, further comprising:
and a coil disposed on a bottom surface of the substrate layer and aligned with the first and second slots for generating a magnetic force to attract the electrode to be disposed in one of the first and second slots when receiving a voltage, wherein the bottom surface and the top surface of the substrate layer are two opposite surfaces of the substrate layer.
17. The substrate for a display device according to claim 15, further comprising:
a plurality of first coils disposed on a bottom surface of the substrate layer, respectively aligned with the first slots, and configured to generate a first magnetic force when receiving a voltage; and
a plurality of second coils, disposed on the bottom surface of the substrate layer, respectively aligned with the second slots, and configured to generate a second magnetic force when receiving a voltage;
wherein the bottom surface and the top surface of the base layer are two opposing surfaces of the base layer.
18. A display device, comprising:
a base layer having a top surface and a plurality of metal contacts, the metal contacts being located on the top surface;
an insulating layer disposed on the top surface of the substrate layer and having a plurality of slots and opposing device mounting surfaces and bottom surfaces, wherein the device mounting surfaces face away from the substrate layer and the bottom surfaces face toward the substrate layer, each of the slots penetrates from the device mounting surfaces to the bottom surfaces, and the slots are aligned with and expose the metal contacts, respectively; and
and each micro element comprises an electrode which is arranged in one of the clamping grooves and is electrically connected with the metal contact exposed by the clamping groove.
19. The display device according to claim 18, further comprising:
and the coil is arranged on a bottom surface of the substrate layer and is aligned to the clamping grooves to generate magnetic force when receiving voltage, wherein the bottom surface and the top surface of the substrate layer are two opposite surfaces of the substrate layer.
20. The display device according to claim 18, wherein the micro-devices have different emission colors, and the electrode of the micro-devices of each of the different emission colors has different structures of the plurality of slots.
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| WO2023127585A1 (en) * | 2021-12-28 | 2023-07-06 | 株式会社東海理化電機製作所 | Display device manufacturing jig, display device manufacturing method, display device manufactured using display device manufacturing jig, and display device manufactured using display device manufacturing method |
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