CN110839320A - Processing method of countersunk PCB - Google Patents
Processing method of countersunk PCB Download PDFInfo
- Publication number
- CN110839320A CN110839320A CN201911146760.2A CN201911146760A CN110839320A CN 110839320 A CN110839320 A CN 110839320A CN 201911146760 A CN201911146760 A CN 201911146760A CN 110839320 A CN110839320 A CN 110839320A
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- pcb
- drilling
- processing
- copper
- countersunk
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
A processing method of a countersunk PCB relates to the technical field of electronic processing, and comprises the following steps: thickening copper, namely thickening copper treatment is carried out on the PCB, and the thickness of copper foil on the PCB is increased; drilling a hole on the PCB subjected to thickened copper treatment by using a circular drill bit, and processing a via hole and a positioning hole; drilling for the second time, wherein a conical drill bit is adopted for secondary processing to process a countersunk hole; etching, namely etching the front and back surfaces of the PCB after drilling by adopting a fractional etching method; and (4) solder resist, wherein a Line Mask film contraposition exposure method is adopted to perform double solder resist screen printing on the etched PCB. Firstly, thickening copper treatment is carried out on a PCB, and then a counter sink is formed by drilling twice. The counter sink design of the PCB board ensures that the whole electronic product has small assembly volume and is smoother during installation.
Description
Technical Field
The invention relates to the technical field of electronic processing, in particular to a processing method of a countersunk hole type PCB.
Background
With the development of light, thin, short and small electronic products, the size, appearance and installation smoothness of the assembled complete machine must be considered in the process of assembling electronic components and designing the complete machine by the client of the printed circuit board, which forces the printed circuit board to develop towards higher precision wiring, lamination and special process design.
In the design and manufacturing process of the conventional printed circuit board, in order to reach and match the whole volume of a client, the overall thickness of the circuit board is generally reduced as much as possible by improving the laminated structure and the wiring density of the product, but the thickness reduction is limited in the design and manufacturing process due to the line width and line distance of wiring and the processing capacity of the layer number process.
Generally, the printed circuit board is shipped to a client side and then is assembled with electronic components, and the electronic components are generally attached to the outer surface of the circuit board, so that a bulge is formed, the assembly volume of the whole machine is increased, and therefore, how to improve the structure of the circuit board and enable the circuit board to be more smooth becomes a technical problem to be solved urgently in the field of processing of the PCB.
Disclosure of Invention
The technical problem solved by the invention is that the surface of the PCB produced by the PCB processing technology in the prior art is uneven.
In order to solve the above technical problem, an embodiment of the present invention provides a method for processing a countersunk hole type PCB, including:
thickening copper, namely thickening copper treatment is carried out on the PCB, and the thickness of copper foil on the PCB is increased;
drilling a hole on the PCB subjected to thickened copper treatment by using a circular drill bit, and processing a via hole and a positioning hole;
drilling for the second time, wherein a conical drill bit is adopted for secondary processing to process a countersunk hole;
etching, namely etching the front and back surfaces of the PCB after drilling by adopting a fractional etching method;
and (4) solder resist, wherein a Line Mask film contraposition exposure method is adopted to perform double solder resist screen printing on the etched PCB.
In the above technical solution, further, the thickened copper is plated with copper.
In the technical scheme, furthermore, during copper electroplating, the clamping plates are clamped for multiple times, and the clamping plates are clamped at different positions of the PCB every time so as to ensure that the copper foil at each position of the PCB is uniform in thickness.
In the above technical solution, further, the second drilling and the first drilling use the same set of positioning coordinates; and directly drilling the PCB for the second time without discharging the PCB after the first drilling is finished.
In the above technical solution, further, the drilling rotation speed and the feed speed of the second drilling are 30% less than those of the first drilling.
In the above technical solution, further, the solder resist includes:
filling solder resist ink in a substrate position; after the ink filling of the base material position is finished, surface oil is printed through silk screen; and (4) after printing ink on the position of the base material by silk printing, standing until bubbles are eliminated, and then, silk printing secondary solder mask oil on the baking plate.
In the above technical solution, further, the method for processing a countersunk hole type PCB board sequentially includes the following steps:
cutting, thickening copper, grinding a plate, drilling for the first time, drilling for the second time, burring and grinding the plate, depositing copper, plating a circuit, manufacturing an outer layer circuit, patterning copper and tin, etching and welding resistance.
In the above technical solution, further, the method further includes: printing characters, V + gong board, electric test, OSP, FQC/FQA and packaging.
Compared with the prior art, the technical scheme of the embodiment of the invention has the following beneficial effects:
the embodiment of the invention provides a method for processing a countersunk hole type PCB, which comprises the steps of firstly, thickening copper on the PCB to increase the thickness of copper foil on the PCB; then, a via hole and a positioning hole are processed by the first drilling, a counter bore is processed by the second drilling, and the counter bore is formed by drilling twice. The counter sink design of the PCB board ensures that the whole electronic product has small assembly volume and is smoother during installation. In addition, after the thick copper treatment, large current can effectively pass through.
Drawings
Fig. 1 is a schematic flow chart of a method for processing a countersunk hole type PCB according to an embodiment of the present invention.
Detailed Description
As will be understood by those skilled in the art, as mentioned in the background, when the PCB of the prior art is used to assemble electronic components, the formation of the protrusions increases the assembly volume of the whole PCB, and therefore, it is necessary to improve the structure of the PCB to make it flat.
Therefore, the embodiment of the invention provides a method for processing a countersunk hole type PCB, which comprises the following steps:
thickening copper, namely thickening copper treatment is carried out on the PCB, and the thickness of copper foil on the PCB is increased;
drilling a hole on the PCB subjected to thickened copper treatment by using a circular drill bit, and processing a via hole and a positioning hole;
drilling for the second time, wherein a conical drill bit is adopted for secondary processing to process a countersunk hole;
etching, namely etching the front and back surfaces of the PCB after drilling by adopting a fractional etching method;
and (4) solder resist, wherein a Line Mask film contraposition exposure method is adopted to perform double solder resist screen printing on the etched PCB.
The embodiment of the invention provides a method for processing a countersunk hole type PCB, which comprises the steps of firstly, thickening copper on the PCB to increase the thickness of copper foil on the PCB; then, a via hole and a positioning hole are processed by the first drilling, a counter bore is processed by the second drilling, and the counter bore is formed by drilling twice. The counter sink design of the PCB board ensures that the whole electronic product has small assembly volume and is smoother during installation. In addition, after the thick copper treatment, not only the drilling is finished in times, but also the etching and the solder Mask are finished in times, wherein the etching is to process the front surface and the back surface of the PCB in sequence, the etched PCB is subjected to double solder Mask silk-screen printing by adopting a Line Mask film contraposition exposure method, and the thick copper treatment enables large current to pass effectively.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Fig. 1 is a schematic flow chart of a method for processing a countersunk hole type PCB according to an embodiment of the present invention.
As shown in fig. 1, a method for processing a countersunk hole type PCB according to an embodiment of the present invention includes the following steps.
And S101, cutting.
And cutting the PCB into the required shape and size by using a cutting machine.
And S102, thickening the copper.
And carrying out thickening copper treatment on the PCB to increase the thickness of copper foil on the PCB.
In some embodiments, the thickened copper is electroplated, so that the thickened part can be stably connected without a connection point.
Furthermore, in order to ensure the uniform thickness of the copper foil at each position of the PCB, a plurality of times of splint electroplating can be adopted. For example, when the PCB is rectangular, four times of electroplating are performed, four sides of the rectangle are respectively used as clamping plate positions, and the electroplating anode is used for electroplating the PCB from four directions, so that the electroplating quality is ensured.
S103, grinding the plate.
And polishing the PCB subjected to thickened copper treatment to ensure that each position is smooth.
And S104, drilling for the first time.
And drilling the PCB subjected to thickened copper treatment by using a circular drill bit, and processing a via hole and a positioning hole.
The round drill is a conventional PCB drill, the drill tip is an ST or UC-shaped drill, and the drill angles comprise 135 degrees, 165 degrees, 150 degrees and the like, and are used for completing the via hole of the PCB. The drilling process mainly utilizes the high-speed rotation of a main shaft of a drilling machine to drive a drill bit to cut so as to form a hole, and the hole made by a common drill bit is a vertical hole.
And S105, drilling for the second time.
And (4) performing secondary processing by adopting a conical drill bit to process a countersunk hole.
The conical drill bit is a special drill bit for special-shaped holes, and belongs to special types of drill bits, wherein the angles of the drill bit comprise 82 degrees, 90 degrees, 100 degrees, 120 degrees, 140 degrees and the like, the angles can be selected according to different shapes of counter bores, the angle inclined plane cutting edge of the drill rod of the drill bit tool of the drill bit is longer, the effective cutting edge of the inclined plane is mainly used for drilling, and the shape of the machined hole is the same as that of the drill bit, namely, the inclined plane hole.
It should be noted that, in order to achieve the perpendicularity of the countersunk hole and the conducting hole, the same set of positioning hole coordinates is adopted for the second drilling and the first drilling to process the countersunk hole, all plates are stacked one by one, the plate is not removed after the first drilling is completed, the second drilling is directly performed, and the depth control of the countersunk hole is calculated by a drilling machine program according to the table top of the drilling machine as the reference of the initial table top. The drilling speed and the feed speed are reduced by 30 percent on the basis of the original conventional parameters.
And S106, sharpening the board.
The burr is the projections such as flash, burr, flash, etc., and the burr grinding plate is used for polishing the foreign body projections.
And S107, depositing copper.
A thin layer of chemical copper is deposited chemically on a non-conductive hole wall substrate to serve as a substrate for board electronics.
And S108, conducting plate electricity.
And S109, manufacturing an outer layer circuit.
And S110, patterning copper and tin.
And S111, etching.
And etching the front surface of the PCB and then etching the back surface of the PCB by adopting a fractional etching method.
And S112, solder resisting.
And performing double-time solder Mask silk-screen printing on the etched PCB by adopting a Line Mask film contraposition exposure method.
Filling solder resist ink in a substrate position; after the ink filling of the base material position is finished, surface oil is printed through silk screen; and after printing ink on the position of the base material by silk printing, standing for about 1.5-2H, baking the board after bubbles are eliminated, and silk printing secondary solder mask oil.
As shown in fig. 1, the method for processing a countersunk hole type PCB further includes step S113 of printing characters; s114, routing the board by V +; s115, electrically testing; s116, OSP; s117, FQC/FQA and S118, and packaging. The steps are conventional steps for processing the PCB, and are not described herein again.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A processing method of a countersunk PCB is characterized by comprising the following steps:
thickening copper, namely thickening copper treatment is carried out on the PCB, and the thickness of copper foil on the PCB is increased;
drilling a hole on the PCB subjected to thickened copper treatment by using a circular drill bit, and processing a via hole and a positioning hole;
drilling for the second time, wherein a conical drill bit is adopted for secondary processing to process a countersunk hole;
etching, namely etching the front and back surfaces of the PCB after drilling by adopting a fractional etching method;
and (4) solder resist, wherein a Line Mask film contraposition exposure method is adopted to perform double solder resist screen printing on the etched PCB.
2. The method for processing the countersunk PCB as claimed in claim 1, wherein the thickened copper is electroplated with copper.
3. The method for processing a countersunk hole type PCB as claimed in claim 2, wherein the clamping plate is clamped at different positions of the PCB each time to ensure uniform thickness of the copper foil at each position of the PCB during the copper electroplating.
4. The method for processing the countersunk hole type PCB as claimed in claim 1, wherein the second drilling and the first drilling adopt the same set of positioning coordinates; and directly drilling the PCB for the second time without discharging the PCB after the first drilling is finished.
5. The method for processing the countersunk PCB as claimed in claim 4, wherein the drilling speed and the feed speed of the second drilling are 30% less than those of the first drilling.
6. The method for processing the countersunk PCB as claimed in claim 1, wherein the solder resist comprises:
filling solder resist ink in a substrate position; after the ink filling of the base material position is finished, surface oil is printed through silk screen; and (4) after printing ink on the position of the base material by silk printing, standing until bubbles are eliminated, and then, silk printing secondary solder mask oil on the baking plate.
7. The method for processing the countersunk hole type PCB as claimed in any one of claims 1 to 6, which comprises the following steps in sequence:
cutting, thickening copper, grinding a plate, drilling for the first time, drilling for the second time, burring and grinding the plate, depositing copper, plating a circuit, manufacturing an outer layer circuit, patterning copper and tin, etching and welding resistance.
8. The method for processing the countersunk hole type PCB as recited in claim 7, further comprising: printing characters, V + gong board, electric test, OSP, FQC/FQA and packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911146760.2A CN110839320A (en) | 2019-11-21 | 2019-11-21 | Processing method of countersunk PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911146760.2A CN110839320A (en) | 2019-11-21 | 2019-11-21 | Processing method of countersunk PCB |
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| Publication Number | Publication Date |
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| CN110839320A true CN110839320A (en) | 2020-02-25 |
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| CN201911146760.2A Pending CN110839320A (en) | 2019-11-21 | 2019-11-21 | Processing method of countersunk PCB |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770504A (en) * | 2020-11-26 | 2021-05-07 | 景德镇市恒耀电子科技有限公司 | Method for processing countersunk hole of multilayer circuit board |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
| CN114364150A (en) * | 2021-11-19 | 2022-04-15 | 清远市富盈电子有限公司 | Processing technology of solder resist ink for thick copper surface |
| CN116456602A (en) * | 2023-05-09 | 2023-07-18 | 江门全合精密电子有限公司 | Manufacturing method of wafer packaging test PCB motherboard |
| CN116456602B (en) * | 2023-05-09 | 2024-05-14 | 江门全合精密电子有限公司 | Manufacturing method of wafer packaging test PCB motherboard |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112770504A (en) * | 2020-11-26 | 2021-05-07 | 景德镇市恒耀电子科技有限公司 | Method for processing countersunk hole of multilayer circuit board |
| CN113710000A (en) * | 2021-08-30 | 2021-11-26 | 江西志浩电子科技有限公司 | Linemask processing technology of thick copper plate |
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| CN116456602B (en) * | 2023-05-09 | 2024-05-14 | 江门全合精密电子有限公司 | Manufacturing method of wafer packaging test PCB motherboard |
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Application publication date: 20200225 |