CN110839120A - Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake camera module and anti-shake photosensitive assembly, and electronic equipment - Google Patents

Abstract

The invention discloses an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method of the anti-shake photosensitive assembly and electronic equipment. The anti-shake photosensitive assembly comprises a circuit board assembly, at least one driver and at least one photosensitive element. The circuit board assembly provides at least one attaching surface. Each driver is correspondingly attached to each attaching surface of the circuit board assembly. Every this photosensitive element is set up in every this driver correspondingly to this driver is located this photosensitive element and this attached face of this circuit board subassembly between, with through this driver removal corresponding this photosensitive element, thereby realize this anti-shake photosensitive assembly's anti-shake function.

Description

Anti-shake camera module, anti-shake photosensitive assembly, manufacturing method of anti-shake camera module and anti-shake photosensitive assembly, and electronic equipment

Technical Field

The invention relates to the technical field of optical imaging, in particular to an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method of the anti-shake camera module and the anti-shake photosensitive assembly, and electronic equipment.

Background

In recent years, electronic products, smart devices, and the like are increasingly being developed toward miniaturization and high performance, and this development trend of electronic products and smart devices places more stringent requirements on the size and imaging capability of a camera module, which is one of standard configurations of electronic products and smart devices. This also causes electronic product and smart machine trade to be no longer pursuing the compact and the function integration of the module of making a video recording, and the anti-shake function is exactly integrated to the module of making a video recording in this kind of development wave to the anti-shake function of the module of making a video recording is realized.

In the prior art, the offset of the camera module in the X and Y directions and the rotation in the XY plane are usually corrected using a conventional anti-shake motor to realize the anti-shake function of the camera module. However, on the one hand, the conventional anti-shake motors have poor effects of correcting the offset of the camera module in the X and Y directions and the rotation in the XY plane; on the other hand, the conventional anti-shake motor has a complex structure, high cost, low yield, large power consumption and large volume, and gradually cannot meet the increasingly severe requirements of a camera module.

Disclosure of Invention

An objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, which can use a driver to realize an anti-shake function, so as to meet increasingly stringent requirements of the camera module on anti-shake performance.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, which can provide a flat attachment surface for the driver, so as to avoid the problem of low yield caused by the substandard precision and flatness required for attaching the driver.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a manufacturing method thereof, and an electronic device, which can improve the yield, reliability, and economic benefits of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the driver is implemented as a Micro Electro Mechanical System (MEMS) to move the photosensitive element attached to the MEMS through the MEMS, so as to achieve an anti-shake function of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive device, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, an attachment substrate of the anti-shake photosensitive device provides the flat attachment surface, so that the MEMS is indirectly attached to the circuit board via the attachment substrate, so as to prevent the poor flatness of the circuit board from affecting the normal operation of the MEMS.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the attached substrate has a higher strength to prevent the attached substrate from deforming, so as to ensure that the attached surface can maintain a better flatness.

Another object of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the attachment substrate is implemented as a steel plate made of steel, so that the attachment substrate not only can provide high deformation resistance to maintain the flatness of the attachment surface, but also can enhance the heat dissipation capability of the anti-shake camera module.

Another object of the present invention is to provide an anti-shake imaging module, an anti-shake photosensitive assembly, a method for manufacturing the same, and an electronic device, wherein in an embodiment of the present invention, the attachment substrate is implemented as a plate material with high flatness made of a material with certain strength, such as ceramic, alloy, metal material, polymer material, etc., so as to ensure that the attachment substrate can provide the attachment surface with high flatness.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive device, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the attached substrate is attached to an accommodating space of the circuit board to reduce a distance between a photosensitive element of the anti-shake photosensitive device and the circuit board, so as to reduce an overall height of the anti-shake camera module.

Another objective of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive device, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the attachment substrate is provided with at least one vacuum groove, and when the MEMS is attached to the attachment substrate, the vacuum groove is used for absorbing vacuum to maintain the flatness of the MEMS, so as to prevent the MEMS from shifting or warping before the glue is cured.

Another object of the present invention is to provide an anti-shake camera module, an anti-shake photosensitive device, a method for manufacturing the same, and an electronic apparatus, wherein in an embodiment of the present invention, the anti-shake photosensitive device does not use the attached substrate, but uses an RDL process or a grinding process to process a circuit board, so that the circuit board can provide the attached surface with high flatness. In other words, the MEMS is directly attached to a circuit board with high flatness, preventing the circuit board from being uneven to affect the normal operation of the MEMS.

To achieve at least one of the above objects and other objects and advantages, the present invention provides an anti-shake photosensitive assembly, including:

a circuit board assembly, wherein the circuit board assembly provides at least one attachment surface;

at least one driver, wherein each driver is correspondingly attached to each attaching surface of the circuit board assembly; and

at least one photosensitive element, wherein each photosensitive element is correspondingly arranged on each driver, and the drivers are positioned between the photosensitive elements and the attaching surfaces of the circuit board assembly, so that the corresponding photosensitive elements are moved by the drivers.

In some embodiments of the present invention, the circuit board assembly includes a circuit board and an attached substrate, wherein a lower surface of the attached substrate is attached to the circuit board, so as to use an upper surface of the attached substrate as the attachment surface of the circuit board assembly.

In some embodiments of the present invention, the attachment substrate is a steel plate.

In some embodiments of the present invention, the attachment substrate is made of one material selected from ceramics, alloys, metals, and polymer materials.

In some embodiments of the present invention, the attached substrate has at least one vacuum groove, wherein each vacuum groove extends from the upper surface of the attached substrate to the lower surface of the attached substrate to form a through hole on the attached substrate.

In some embodiments of the present invention, the attached substrate has a plurality of vacuum grooves, wherein the plurality of vacuum grooves are uniformly distributed on the attached substrate.

In some embodiments of the present invention, the circuit board has a receiving space in which the attached substrate attached to the circuit board is received.

In some embodiments of the invention, the receiving space is a groove.

In some embodiments of the present invention, the accommodating space is a through hole.

In some embodiments of the present invention, the circuit board has a through-hole type accommodating space, wherein the attachment substrate is attached to a bottom side of the circuit board, and the driver attached to the attachment substrate is accommodated in the accommodating space.

In some embodiments of the present invention, the circuit board assembly includes a circuit board processed by a grinding process, wherein the circuit board includes a mounting area and an edge area located around the mounting area, and the mounting area of the circuit board is used as the attachment surface of the circuit board assembly.

In some embodiments of the present invention, the circuit board assembly includes a circuit board manufactured by a rewiring layer process, wherein the circuit board includes a mounting area and an edge area located around the mounting area, and the mounting area of the circuit board is used as the attachment surface of the circuit board assembly.

In some embodiments of the present invention, the circuit board assembly further comprises a reinforcing member, wherein the reinforcing member is disposed on the bottom side of the circuit board to reinforce the strength of the circuit board.

In some embodiments of the invention, the reinforcing element is a steel plate.

In some embodiments of the present invention, the flatness of the attachment face of the wiring board assembly is within 15 um.

In some embodiments of the present invention, the photosensitive element is attached to the driver by particle glue, and the driver is attached to the attaching surface of the circuit board assembly by particle glue.

In some embodiments of the present invention, the attachment substrate is attached to the circuit board by particle glue.

In some embodiments of the present invention, the driver is a micro-electromechanical system.

In some embodiments of the present invention, the actuator includes a movable portion and an immovable portion, wherein the immovable portion of the actuator is fixedly attached to the attaching surface of the circuit board assembly, and the photosensitive element is correspondingly attached to the movable portion of the actuator.

In some embodiments of the present invention, the driver further includes at least one set of first connectors, at least one set of second connectors, and at least one set of elastic wires, wherein each set of the first connectors is disposed on the movable portion of the driver, and each set of the second connectors is disposed on the immovable portion of the driver, wherein each set of the first connectors and each set of the second connectors are conductively connected through each set of the elastic wires, wherein the circuit board is conductively connected with each set of the second connectors of the driver, and the photosensitive element is conductively connected with each set of the first connectors of the driver.

In some embodiments of the present invention, the anti-shake photosensitive assembly further includes at least one filter element, wherein each filter element is directly attached to a top surface of each photosensitive element.

According to another aspect of the present invention, the present invention further provides an anti-shake camera module, including:

at least one optical lens; and

in the anti-shake photosensitive assembly, each optical lens is correspondingly arranged on each photosensitive path of each photosensitive element of the anti-shake photosensitive assembly so as to assemble the anti-shake camera module.

According to another aspect of the present invention, the present invention also provides an electronic device, comprising:

an electronic device body; and

the anti-shake camera module is assembled on the electronic equipment body to form the electronic equipment.

According to another aspect of the present invention, there is provided a method of manufacturing an anti-shake photosensitive assembly, including the steps of:

correspondingly attaching a driver on an upper surface of an attached substrate;

correspondingly attaching a photosensitive element to the driver;

attaching the attached substrate to a circuit board; and

and respectively connecting the driver and the photosensitive element with the circuit board in a conduction manner to manufacture the anti-shake photosensitive assembly.

In some embodiments of the present invention, the step of respectively connecting the driver and the photosensitive element to the circuit board in a conducting manner to manufacture the anti-shake photosensitive assembly includes the steps of:

at least one group of first connecting pieces which are conductively connected with the photosensitive element and the driver in a routing mode; and

the driver comprises at least one group of second connecting pieces and at least one group of circuit board connecting pieces, wherein the at least one group of second connecting pieces of the driver and the at least one group of circuit board connecting pieces of the circuit board are connected in a conducting mode in a routing mode, and each group of first connecting pieces and each group of second connecting pieces are connected in a conducting mode through a group of elastic wires.

According to another aspect of the present invention, there is provided a method of manufacturing an anti-shake photosensitive assembly, including the steps of:

correspondingly attaching a driver to a mounting area of a circuit board, wherein the circuit board is manufactured by a rewiring layer process;

correspondingly attaching a photosensitive element to the driver; and

and respectively connecting the driver and the photosensitive element with the circuit board in a conduction manner to manufacture the anti-shake photosensitive assembly.

In some embodiments of the present invention, the method for manufacturing an anti-shake photosensitive assembly further includes:

a reinforcing element is arranged on the bottom side of the circuit board to increase the strength of the circuit board.

According to another aspect of the present invention, the present invention further provides a method for manufacturing an anti-shake camera module, including the steps of:

according to the manufacturing method of the anti-shake photosensitive assembly, the anti-shake photosensitive assembly is manufactured; and

correspondingly, at least one optical lens is arranged on the photosensitive path of at least one photosensitive element of the anti-shake photosensitive assembly so as to manufacture an anti-shake camera module.

Further objects and advantages of the invention will be fully apparent from the ensuing description and drawings.

These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

Fig. 1 is a schematic perspective view of an anti-shake camera module according to a first preferred embodiment of the invention.

Fig. 2 is a schematic cross-sectional view of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 3 is a schematic perspective cross-sectional view of an anti-shake photosensitive assembly of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 4 is a schematic diagram of one of the manufacturing steps of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 5 is a schematic diagram of a second manufacturing step of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 6 is a schematic diagram of a third manufacturing step of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 7 is a schematic diagram of a fourth manufacturing step of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8A shows a first variant of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8B shows a second variant of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8C shows a third variant of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 8D shows a fourth variant of the anti-shake camera module according to the first preferred embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of an anti-shake camera module according to a second preferred embodiment of the invention.

Fig. 10 shows a modified embodiment of the anti-shake camera module according to the second preferred embodiment of the invention.

Fig. 11 is a schematic view of an electronic device with the anti-shake camera module according to the first or second preferred embodiment of the invention.

Fig. 12 is a schematic flow chart of the method for manufacturing the anti-shake photosensitive assembly according to the first preferred embodiment of the invention.

Fig. 13 is a flowchart illustrating a method for manufacturing an anti-shake photosensitive element of the anti-shake camera module according to the second preferred embodiment of the invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.

In the present invention, the terms "a" and "an" in the claims and the description should be understood as meaning "one or more", that is, one element may be one in number in one embodiment, and the element may be more than one in number in another embodiment. The terms "a" and "an" should not be construed as limiting the number unless the number of such elements is explicitly recited as one in the present disclosure, but rather the terms "a" and "an" should not be construed as being limited to only one of the number.

In the description of the present invention, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

With the development of science and technology, the requirements of people on miniaturization and high performance of electronic equipment and intelligent terminals are also improved. The camera module is one of the standard configurations of electronic products and intelligent devices, and the requirements on the size and the performance of the camera module are increasingly stringent, and especially, the camera module has more stringent requirements on the anti-shake function. The traditional anti-shake motor not only leads to poorer anti-shake performance because the offset of the camera module in the X and Y directions and the rotation in the XY plane cannot be better corrected, but also gradually cannot meet the increasingly severe requirements of the camera module because of complex structure, high cost, low yield, large power consumption and large volume.

However, with the advent of Micro-Electro-mechanical systems (MEMS for short), there is a new technical route for realizing the anti-shake function, i.e. after directly attaching the MEMS to the circuit board, the photo sensor chip is attached to the MEMS, so as to move the photo sensor chip through the MEMS to compensate the deviation of the photo sensor chip caused by shake, thereby realizing the anti-shake function of the camera module. However, since the flatness of the circuit board is difficult to control, and the flatness and precision required by the attachment of the MEMS are very high, so that the contradiction between the two is difficult to reconcile, the problem of low yield is usually caused by the substandard precision and flatness required by the attachment, and the mass production and economic benefit of the camera module are seriously affected.

Referring to fig. 1 to 7 of the drawings of the present specification, in order to solve the above-mentioned problem, a first preferred embodiment of the present invention provides an anti-shake camera module 1, wherein the anti-shake camera module 1 includes at least one optical lens 10 and an anti-shake photosensitive assembly 20, wherein the anti-shake photosensitive assembly 20 further includes a circuit board assembly 21, at least one driver 22 and at least one photosensitive element 23, wherein the circuit board assembly 21 provides at least one flat attachment surface 210, wherein each driver 22 is attached to each attachment surface 210 of the circuit board assembly 21, each photosensitive element 23 is correspondingly disposed on each driver 22, and the driver 22 is disposed between the photosensitive element 23 and the attachment surface 210 of the circuit board assembly 21 to move the corresponding photosensitive element 23 through each driver 22, wherein each of the optical lenses 10 is correspondingly disposed on the photosensitive path of the photosensitive element 23 to form the anti-shake camera module 1.

Preferably, the driver 22 is implemented as a micro electro mechanical system (MEMS, also called micro motor) to move the photosensitive element 23 through the MEMS, so as to compensate for the shift or rotation of the photosensitive element 23 caused by shaking, thereby implementing the anti-shake function of the anti-shake camera module 1. It should be understood that, in order to ensure the proper operation of the driver 22, the flatness of each of the attaching faces 210 of the circuit board assembly 21 is preferably controlled within 15 um.

It should be noted that although the anti-shake camera module 1 of the present invention is illustrated in fig. 1 to 7 and the following description by taking the anti-shake camera module 1 as an example including only one optical lens 10 and one driver 22, it can be understood by those skilled in the art that the anti-shake camera module 1 disclosed in fig. 1 to 7 and the following description is only an example and does not limit the content and scope of the present invention, for example, in other examples of the anti-shake camera module 1, the number of the optical lenses 10 may be more than one to form an array of anti-shake camera modules.

Specifically, as shown in fig. 2, the circuit board assembly 21 includes a circuit board 211 and an attachment substrate 212 disposed on the circuit board 211, wherein the attachment substrate 212 is made of a material with certain strength and flatness, so as to provide the attachment surface 210 with high flatness through the attachment substrate 212, so that the driver 22 is directly attached to the attachment substrate 212, and the normal operation of the driver 22 is prevented from being affected due to the unevenness of the circuit board.

Preferably, as shown in fig. 2 and 3, the attachment substrate 212 has a flat plate structure, and the attachment substrate 212 has a flat upper surface 2121 and a lower surface 2122 parallel to the upper surface 2121, wherein the upper surface 2121 of the attachment substrate 212 serves as the attachment surface 210 of the circuit board assembly 21 when the lower surface 2122 of the attachment substrate 212 is attached to the circuit board 211. It should be understood that in some other embodiments of the present invention, the upper surface 2121 of the attached substrate 212 is a flat plane, and the lower surface 2122 of the attached substrate 212 is an uneven curved surface; alternatively, the lower surface 2122 of the attachment substrate 212 may be provided with a plurality of legs, so that the attachment substrate 212 is fixedly mounted on the circuit board 211 via the legs.

More preferably, the attachment substrate 212 is fixedly disposed on the top side of the circuit board 211 by means of glue bonding. It should be understood that the glue may be implemented as, but not limited to, a particle glue, and the particle glue is uniformly distributed with particles having the largest diameter, so that the thickness of the particle glue is ensured to be consistent after the particle glue is cured. Of course, in some other embodiments of the present invention, the glue may also be a thermosetting glue or other types of glue, or the attachment substrate 212 may also be fixedly disposed on the circuit board 211 by means of embedding, soldering, or the like.

It is worth mentioning that the attachment substrate 212 is made of steel material, so that the attachment substrate 212 is implemented as a steel plate 212 having high strength and flatness, wherein the upper surface 2121 of the steel plate 212 is used as the attachment surface 210 when the lower surface 2122 of the steel plate 212 and the circuit board 211 are attached together, so as to provide the attachment surface 210 with high flatness to the driver 22. In other words, after the steel plate 212 is specially processed and treated, the upper surface 2121 of the steel plate 212 may have a high flatness to serve as the attaching surface 210 of the circuit board assembly 21, and the steel plate 212 has high strength and is not easily deformed, so that the steel plate 212 can stably provide the attaching surface 210 with a high flatness for a long time, so as to prevent the flatness of the attaching surface 210 from being affected by external force, temperature change, long-term use, and the like. In addition, because the steel material has a relatively large thermal conductivity coefficient, the steel plate 212 has good thermal conductivity and heat dissipation capability, and therefore the steel plate 212 also contributes to improving the heat dissipation performance of the anti-shake camera module 1.

It should be understood that in some other embodiments of the present invention, the attachment substrate 212 may also be made of a material with certain strength and flatness, such as a polymer material, an alloy, a metal, a ceramic, etc., to provide a stable and highly-planar attachment surface 210 through the attachment substrate 212, so as to avoid the influence of the circuit board 211 on the driver 22.

In the first preferred embodiment of the present invention, as shown in fig. 2, the circuit board 211 includes a mounting region 2111, an edge region 2112 and at least one set of circuit board connectors 2113, wherein the mounting region 2111 and the edge region 2112 are integrally formed, and the edge region 2112 is located around the mounting region 2111, that is, the mounting region 2111 is located in the middle of the circuit board 211, and the edge region 2112 is located outside the circuit board 211. Each set of the board connectors 2113 is disposed at the edge region 2112 of the board 211.

The attachment substrate 212 is attached to the attachment region 2111 of the circuit board 211, and the attachment surface 210 of the attachment substrate 212 corresponds to the attachment region 2111 of the circuit board 211, so that the driver 22 attached to the attachment surface 210 corresponds to the attachment region 2111 of the circuit board 211, and each set of the circuit board connectors 2113 is located around the driver 22, thereby facilitating conductive connection between the driver 22 and the circuit board 211.

For example, as shown in fig. 2 and 3, the driver 22 generally includes a movable portion 221 and an immovable portion 222, wherein the immovable portion 222 of the driver 22 is fixedly attached to the attachment surface 210 of the attachment substrate 212, and the photosensitive element 23 is correspondingly attached to the movable portion 221 of the driver 22, so that the movable portion 221 of the driver 22 moves the photosensitive element 23 to realize the anti-shake function of the anti-shake camera module 1. It should be understood that when the plane coordinate system XY is established with the attaching surface 210, the movable part 221 of the actuator 22 attached to the attaching surface 210 can move in the X-axis direction and the Y-axis direction and rotate in the XY plane, thereby realizing the anti-shake function of moving in the X-axis direction and the Y-axis direction and rotating in the XY plane by the actuator 22.

Specifically, as shown in fig. 3, the driver 22 further includes at least one set of first connecting members 223, at least one set of second connecting members 224, and at least one set of elastic wires 225, wherein each set of the first connecting members 223 is disposed on the movable portion 221 of the driver 22, each set of the second connecting members 224 is disposed on the immovable portion 221 of the driver 22, and each set of the first connecting members 223 and each set of the second connecting members 224 are communicably connected through each set of the elastic wires 225. It should be understood that the elastic wire 225 of the actuator 22 may be made of a conductive material having a certain elasticity, such as an aluminum wire or the like, so as to avoid the immovable portion 222 of the actuator 22 from affecting the movement of the movable portion 221 of the actuator 22 by using the elastic deformation of the elastic wire 225.

It is noted that the first and second connectors 223, 224 of the driver 22 may be connection pads, respectively, i.e. the first and second connectors 223, 224 of the driver 22 may be disc-shaped, respectively, for enabling both ends of the elastic wire 225 to be conductively connected to the first and second connectors 223, 224 of the driver 22, respectively. It should be understood that the first and second connectors 223, 224 of the driver 22 may be respectively spherical or other shapes in other embodiments of the present invention, which is not limited by the present invention.

In addition, as shown in fig. 3, each set of the second connectors 224 of the driver 22 is connected to the circuit board connectors 2113 of the circuit board 211 in a wire bonding manner through a set of leads; correspondingly, each set of the first connectors 223 of the driver 22 can also be conductively connected with the photosensitive element 23 by another set of leads in a wire bonding manner, so that the photosensitive element 23 is conductively connected with the circuit board 211 through the first connectors 223, the second connectors 224 and the elastic wires 225 of the driver 22. It should be understood that the present invention does not further limit the type of the lead, for example, the lead may be implemented as a gold wire, a silver wire, a copper wire, etc., as long as the lead is ensured to be able to conductively connect the circuit board 211 and the driver 22, or to conductively connect the driver 22 and the photosensitive element 23.

According to the first preferred embodiment of the present invention, as shown in fig. 2 and 3, the anti-shake photosensitive assembly 20 further includes a first supporting element 24, wherein the first supporting element 24 is disposed between the upper surface 2121 of the attached substrate 212 and the immovable portion 222 of the driver 22, so that the driver 22 is firmly attached to the upper surface 2121 of the attached substrate 212 through the first supporting element 24. Since the first supporting element 24 has a certain thickness, the anti-shake photosensitive assembly 20 can also form a first safety gap 25 between the upper surface 2121 of the attached substrate 212 and the movable portion 221 of the driver 22 through the first supporting element 24, so as to prevent the attached substrate 212 from affecting the normal operation of the driver 22, thereby improving the product yield of the anti-shake camera module 1.

Preferably, the first supporting element 24 is formed by curing a first glue, which not only can firmly adhere the driver 22 and the attaching substrate 212 together by using the viscosity of the first glue, but also can form the first supporting element 24 with a certain strength after curing by using the first glue, so that the first safety gap 25 between the driver 22 and the attaching substrate 212 can be kept stable to prevent the attaching substrate 212 from influencing the normal operation of the driver 22.

It is worth mentioning that the first glue used for forming the first support element 24 may be a particle glue, a thermosetting glue or another type of glue.

Accordingly, in the first preferred embodiment of the present invention, as shown in fig. 2 and 3, the anti-shake photosensitive assembly 20 further includes a second supporting element 26, wherein the second supporting element 26 is disposed between a bottom surface 232 of the photosensitive element 23 and the movable portion 221 of the driver 22, so that the photosensitive element 23 is firmly attached to the movable portion 221 of the driver 22 through the second supporting element 26. Since the second supporting element 26 has a certain thickness, the anti-shake photosensitive assembly 20 further forms a second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and the movable portion 221 of the driver 22 through the second supporting element 26, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22, thereby improving the product yield of the anti-shake camera module 1.

It should be understood that when the bottom surface 232 of the photosensitive element 23 is attached to the movable portion 221 of the driver 22, a top surface 231 of the photosensitive element 23 faces the optical lens 10, that is, the top surface 231 of the photosensitive element 23 is implemented as a photosensitive surface of the photosensitive element 23.

Preferably, the second supporting element 26 is formed by curing a second glue, which not only can firmly adhere the photosensitive element 23 and the driver 22 together by using the viscosity of the second glue, but also can form the second supporting element 26 with a certain strength after curing by using the second glue, so that the second safety gap 27 between the driver 22 and the photosensitive element 23 can be kept stable to prevent the photosensitive element 23 from influencing the normal operation of the driver 22.

It is worth mentioning that the second glue used for forming the second support element 26 may be a particle glue, a thermosetting glue or another type of glue.

Referring to fig. 1 and 2, the anti-shake camera module 1 further includes a base 30, wherein the base 30 is disposed on the edge region 2112 of the circuit board 211 of the circuit board assembly 21 of the anti-shake photosensitive assembly 20, and the optical lens 10 is mounted on the top surface of the base 30, so that the optical lens 10 is held in the photosensitive path of the photosensitive element 23 of the anti-shake photosensitive assembly 20.

In addition, in the first preferred embodiment of the present invention, as shown in fig. 2, the anti-shake photosensitive assembly 20 further includes a filter element 28, wherein the filter element 28 is assembled on the base 30, so that the filter element 28 is maintained in a photosensitive path of the photosensitive element 23, wherein the filter element 28 is located between the optical lens 10 and the photosensitive element 23, so that the light entering the anti-shake camera module 1 from the optical lens 10 can be received by the photosensitive surface of the photosensitive element 23 and photoelectrically converted after being filtered by the filter element 28, thereby improving the imaging quality of the anti-shake camera module 1, for example, the filter element 28 can filter an infrared portion of the light entering the anti-shake camera module 1 from the optical lens 10. It should be understood that in different examples of the anti-shake camera module 1, the filter element 28 can be implemented in different types, for example, the filter element 28 can be implemented as an infrared cut filter, a full-transmission spectrum filter, other filters or a combination of filters, and the like, which is not limited in the present invention.

Referring to fig. 4 to 7, which are schematic diagrams illustrating a manufacturing process of the anti-shake photosensitive assembly 20 and a manufacturing process of the anti-shake camera module 1 according to the present invention, it should be understood by those skilled in the art that the manufacturing process of the anti-shake photosensitive assembly 20 and the manufacturing process of the anti-shake camera module 1 illustrated in fig. 4 to 7 are only examples to illustrate features and advantages of the present invention, and do not limit the content and scope of the present invention.

In particular, FIG. 4 shows an example process of attaching the driver 22 to the attachment substrate 212, wherein a first glue is applied on the upper surface 2121 of the attached substrate 212, and then the drivers 22 are correspondingly disposed on the upper surface 2121 of the attached substrate 212, wherein the first glue applied to the upper surface 2121 of the attachment substrate 212 corresponds to the immovable portion 222 of the driver 22, to form the first support element 24 between the upper surface 2121 of the attachment substrate 212 and the immovable portion 222 of the actuator 22 after the first glue is cured, and the first safety gap 25 is formed between the upper surface 2121 of the attachment substrate 212 and the movable portion 221 of the actuator 22 to prevent the attachment substrate 212 from affecting the normal operation of the actuator 22.

It should be noted that in some other embodiments of the present invention, a first glue may be applied to the immovable portion 222 of the actuator 22, and then the actuator 22 is correspondingly disposed on the upper surface 2121 of the attached substrate 212, so as to form the first support element 24 between the upper surface 2121 of the attached substrate 212 and the immovable portion 222 of the actuator 22 after the first glue is cured, and form the first safety gap 25 between the upper surface 2121 of the attached substrate 212 and the movable portion 221 of the actuator 22.

It is worth mentioning that since the first glue has a certain fluidity before curing, so that the driver 22 is easily shifted or tilted on the upper surface 2121 of the attachment substrate 212, causing the first safety gap 25 to be unstable, an external force needs to be applied to stably hold the driver 22 to the attachment substrate 212.

Therefore, in the first preferred embodiment of the present invention, as shown in fig. 4, the attached substrate 212 is further provided with at least one vacuum groove 2123, wherein each vacuum groove 2123 extends from the upper surface 2121 of the attached substrate 212 to the lower surface 2122 of the attached substrate 212 to form a through hole penetrating vertically on the attached substrate 212, so that during the process of attaching the driver 22 to the attaching surface 210 of the attached substrate 212, a vacuum is drawn from the lower surface 2122 of the attached substrate 212 through the vacuum groove 2123 to form a vacuum region between the attached substrate 212 and the driver 22, thereby firmly holding the driver 22 and the attached substrate 212 together to prevent the driver 22 from shifting or falling off to ensure the flatness of the driver 22. It should be appreciated that, in the present invention, since the vacuum grooves originally formed on the circuit board are disposed on the attachment substrate 212, this avoids the procedure of re-burying the vacuum grooves on the circuit board in the later packaging process, and also avoids the risk of contaminating the module through the vacuum grooves on the circuit board.

Illustratively, as shown in fig. 4, the attachment substrate 212 is provided with five vacuum grooves 2123, one of the vacuum grooves 2123 is located at the center of the attachment substrate 212, and the remaining four vacuum grooves 2123 are uniformly distributed at the peripheral edge of the attachment substrate 212, so that when a vacuum is drawn through the vacuum grooves 2123, a uniform suction force is applied to each position of the actuator 22 to ensure that the actuator 22 has a high flatness. It should be understood that in some other embodiments of the present invention, the attachment substrate 212 may be provided with other numbers of the vacuum grooves 2123, and the vacuum grooves 2123 may be arranged on the attachment substrate 212 in any arrangement, such as a matrix arrangement, a circular arrangement, a random arrangement, and the like, which is not further limited by the present invention.

Fig. 5 shows an example process of attaching the photosensitive element 23 to the driver 22, in which a second glue is applied to a portion of the movable portion 221 of the driver 22, and then the photosensitive element 23 is correspondingly disposed on the movable portion 221 of the driver 22, so as to form the second supporting element 26 between the bottom surface 232 of the photosensitive element 23 and a portion of the movable portion 221 of the driver 22 after the second glue is cured, and form the second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and another portion of the movable portion 221 of the driver 22, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22.

Of course, in some other embodiments of the present invention, a second glue may be applied on the bottom surface 232 of the photosensitive element 23, and then the photosensitive element 23 is correspondingly disposed on the movable portion 221 of the driver 22, so as to form the second supporting element 26 between the bottom surface 232 of the photosensitive element 23 and a portion of the movable portion 221 of the driver 22 after the second glue is cured, and form the second safety gap 27 between the bottom surface 232 of the photosensitive element 23 and another portion of the movable portion 221 of the driver 22, so as to prevent the photosensitive element 23 from affecting the normal operation of the driver 22.

In fig. 6, the attachment substrate 212 is first attached to the circuit board 211, and then the circuit board connecting part 2113 of the circuit board 211 and the second connecting part 224 of the driver 22 are conductively connected by wire bonding, and the first connecting part 223 of the driver 22 and the photosensitive element 23 are conductively connected by wire bonding, so that the photosensitive element 23 and the circuit board 211 are conductively connected by the elastic wire 225 of the driver 22, and the anti-shake photosensitive assembly 20 is manufactured. In other words, after the attachment substrate 212 is attached to the circuit board 211, the driver 22 and the circuit board 211, and the driver 22 and the photosensitive element 23 are conductively connected by wire bonding, respectively.

It should be noted that, in some other embodiments of the present invention, the first connecting element 223 of the driver 22 and the photosensitive element 23 may be conductively connected by wire bonding before the attachment substrate 212 is attached to the circuit board 211; next, after the attachment substrate 212 is attached to the circuit board 211, the driver 22 and the circuit board 211 are conductively connected by wire bonding. Of course, in other embodiments of the present invention, after the attachment substrate 212 is attached to the circuit board 211, the photosensitive element 23 and the circuit board 211 may be directly connected to each other by a flexible lead.

It should be noted that although the sequence of steps for manufacturing the anti-shake photosensitive assembly 20 in the first preferred embodiment is shown in fig. 4 to 6: firstly, the driver 22 is attached to the attachment substrate 212, then the photosensitive element 23 is attached to the driver 22, and finally the attachment substrate 212 is attached to the circuit board 211, and is conductively connected with the photosensitive element 23 and the driver 22 and is conductively connected with the driver 22 and the circuit board 211. However, it will be understood by those skilled in the art that the sequence of steps for manufacturing the anti-shake photosensitive assembly 20 in fig. 4 to 6 and the first preferred embodiment is only an example to illustrate the features and advantages of the anti-shake photosensitive assembly 20 of the present invention, and it does not limit the content and scope of the present invention, for example, in other examples of manufacturing the anti-shake photosensitive assembly 20, the attachment substrate 212 may be attached to the circuit board 211, the driver 22 may be attached to the attachment substrate 212, and the photosensitive element 23 may be attached to the driver 22 to manufacture the anti-shake photosensitive assembly 20; or the photosensitive element 23 may be attached to the driver 22, the driver 22 is attached to the attachment substrate 212, and finally the attachment substrate 212 is attached to the circuit board 211, so as to manufacture the anti-shake photosensitive assembly 20.

In fig. 7, the base 30 is assembled to the edge region 2112 of the circuit board 211, and the filter element 28 and the optical lens 10 are respectively assembled to the base 30, so that the filter element 28 and the optical lens 10 are both maintained in the photosensitive path of the photosensitive element 23, thereby manufacturing the anti-shake imaging module 1. It should be understood that the base 30 may be formed, but is not limited to being formed, in a manufacturing process such as injection molding, die casting, molding, and the like.

It is noted that, in some other embodiments of the present invention, the base 30 may be formed by a molding process before the attachment substrate 212 is attached to the attachment region 2111 of the circuit board 211, so as to form a molded base (not shown) covering the edge region 2112 of the circuit board 211; next, after the attachment substrate 212 is attached to the attachment region 2111 of the circuit board 211, the filter element 28 and the optical lens 10 are assembled to the base 30, respectively. That is, the base 30 may be assembled to the circuit board 211 before the attachment substrate 212 is attached, or may be assembled to the circuit board 211 after the attachment substrate 212 is attached, which is not further limited in the present invention.

Fig. 8A shows a first variant of the anti-shake camera module 1, in which the filter element 28 of the anti-shake photosensitive assembly 20 of the anti-shake camera module 1 is directly attached to the top surface 231 of the photosensitive element 23 to reduce the distance between the filter element 28 and the photosensitive element 23, and thus the height of the base 30, so as to reduce the overall height of the anti-shake camera module 1.

Fig. 8B shows a second variant of the anti-shake camera module 1, wherein the circuit board 211 of the circuit board assembly 21 of the anti-shake photosensitive assembly 20 of the anti-shake camera module 1 has at least one accommodating space 2114, wherein the mounting area 2111 of the circuit board 211 is formed in each accommodating space 2114 of the circuit board 211, and the attached substrate 212 attached to the mounting area 2111 is accommodated in the accommodating space 2114 of the circuit board 211 to reduce the height of the anti-shake photosensitive assembly 20, thereby preventing the height of the anti-shake camera module 1 from being increased due to the addition of the attached substrate 212, so as to meet the miniaturization requirement of electronic devices and intelligent products on the camera module.

It should be noted that in the example of the anti-shake camera module 1 shown in fig. 8B, the accommodating space 2114 may be a groove, while in the third variant of the anti-shake camera module 1 shown in fig. 8C, the accommodating space 2114 may be a through hole, that is, the type of the accommodating space 2114 may not be limited, and it may be capable of accommodating the attachment substrate 212.

It should be noted that the size of the accommodating space 2114 may be larger than the size of the outer edge of the attachment substrate 212 or equal to the size of the outer edge of the attachment substrate 212, and the invention is not limited in this respect.

Fig. 8D shows a fourth modified embodiment of the anti-shake camera module 1, in which the accommodating space 2114 is implemented as a through hole, the attachment substrate 212 is attached to the bottom side of the circuit board 211, and the driver 22 attached to the upper surface 2121 of the attachment substrate 212 is accommodated in the accommodating space 2114 of the circuit board 211. It should be understood that in the example of the anti-shake camera module 1 shown in fig. 8D, the size of the accommodating space 2114 is smaller than the size of the outer edge of the attachment substrate 212, and the size of the outer edge of the driver 22 is not larger than the size of the accommodating space 2114.

Referring to fig. 9 of the drawings, an anti-shake camera module 1A according to a second preferred embodiment of the present invention is illustrated. Compared with the first preferred embodiment of the present invention, the anti-shake camera module 1A according to the second preferred embodiment of the present invention is different in that: a circuit board assembly 21A of an anti-shake photosensitive assembly 20A of the anti-shake camera module 1A includes a circuit board 211A, but does not include the attached substrate 212, wherein the circuit board 211A has a flat attached region 2111A and an edge region 2112, so as to provide a flat attached surface 210 through the attached region 2111A of the circuit board 211A, that is, the driver 22 is directly attached to the attached region 2111A of the circuit board 211A, but not to indirectly attach the driver 22 to the circuit board 211A through the attached substrate 212, so as to further reduce the height of the anti-shake photosensitive assembly 20A, thereby reducing the overall height of the anti-shake camera module 1A.

Preferably, the circuit board 211A is processed through a grinding process to provide the attachment 210 with high flatness. For example, the circuit board 211A is implemented as a ceramic substrate processed by a grinding process, so that the mounting region 2111A of the circuit board 211A can have a higher flatness to meet the strict requirement of the driver 22 on the flatness of the attachment surface 210, and the circuit board 211A is effectively prevented from affecting the normal operation of the driver 22. It is to be understood that the ceramic substrate 211A may form the mounting region 2111A having high flatness on the wiring board 211A by a grinding process such that the mounting region 2111A of the wiring board 211A serves as the attachment surface 210 of the wiring board assembly 21A. In addition, the ceramic substrate 211A can prevent the flatness of the attachment surface 210 from being affected by the deformation of the wiring board 211A, so as to prevent the attachment surface 210 from affecting the normal operation of the driver 22.

Fig. 10 shows a modified embodiment of the anti-shake imaging module 1A according to the second preferred embodiment of the present invention, wherein the circuit board 211A is formed by a redistribution layer process to provide the attachment surface 210 with high planarity. In other words, the circuit board 211A is implemented as a redistribution layer circuit board (i.e., RDL circuit board), so that the mounting region 2111A of the circuit board 211A can have a higher flatness to meet the strict requirement of the driver 22 on the flatness of the attachment surface 210, and the circuit board 211A is effectively prevented from affecting the normal operation of the driver 22.

Further, as shown in fig. 10, the circuit board assembly 21A further includes a reinforcing element 213A, wherein the reinforcing element 213 is disposed on the bottom side of the circuit board 211A to reinforce the strength of the circuit board 211A and prevent the circuit board 211A from deforming, so as to prevent the circuit board 211A from deforming to damage the flatness of the attachment surface 210, thereby ensuring the normal operation of the driver 22.

Preferably, the reinforcing element 213 is implemented as a steel plate, wherein the steel plate is attached to the bottom side of the circuit board 211A to reinforce the circuit board 211A and increase the heat dissipation of the circuit board 211A to enhance the heat dissipation performance of the anti-shake imaging module 1A.

It should be noted that, in the second preferred embodiment of the present invention, except for the above-mentioned differences, other structures of the anti-shake camera module 1A are the same as those of the anti-shake camera module 1 according to the first preferred embodiment of the present invention, and the anti-shake camera module 1A also has similar or same modified embodiments as those of the anti-shake camera module 1 according to the first preferred embodiment, and therefore, no further description is provided herein.

Referring to fig. 11, according to another aspect of the present invention, the present invention further provides an electronic apparatus, wherein the electronic apparatus includes an electronic apparatus body 500 and at least one anti-shake camera module 1, 1A, wherein each anti-shake camera module 1, 1A is respectively disposed on the electronic apparatus body 500 for obtaining an image. It should be noted that the type of the electronic device body 500 is not limited, for example, the electronic device body 500 may be any electronic device capable of being configured with the anti-shake camera module, such as a smart phone, a tablet computer, a notebook computer, an electronic book, a personal digital assistant, a camera, and the like. It will be understood by those skilled in the art that although fig. 11 illustrates the electronic device body 500 implemented as a smart phone, it does not limit the content and scope of the invention.

According to another aspect of the present invention, the present invention further provides a method of manufacturing the anti-shake photosensitive assembly 20. Specifically, as shown in fig. 12, the method of manufacturing the anti-shake photosensitive assembly 20 includes the steps of:

s1: correspondingly attaching a driver 22 to an upper surface 2121 of an attached substrate 212;

s2: correspondingly attaching a photosensitive element 23 to the driver 22;

s3: attaching the attachment substrate 212 to a circuit board 211; and

s4: the driver 22 and the photosensitive element 23 are respectively conductively connected to the circuit board 211 to manufacture the anti-shake photosensitive assembly 20.

Specifically, the step S4 includes the steps of:

s41: at least one set of first connectors 223 conductively connecting the photosensitive element 23 and the driver 22 by wire bonding; and

s42: at least one set of second connecting parts 224 of the driver 22 and at least one set of circuit board connecting parts 2113 of the circuit board 211 are conductively connected by wire bonding, wherein each set of the first connecting parts 223 and each set of the second connecting parts 224 are conductively connected by a set of elastic wires 225.

It should be noted that, in the manufacturing method of the anti-shake photosensitive assembly 20, the sequence of the step S1, the step S2 and the step S3 is only an example, and in some other embodiments of the present invention, the step S2, the step S1 and the step S3 may be performed in sequence; or the step S3, the step S1, and the step S2 may be sequentially performed; the present invention does not further limit the sequence of the step S1, the step S2 and the step S3.

According to another aspect of the present invention, the present invention further provides a method of manufacturing the anti-shake photosensitive assembly 20A. Specifically, as shown in fig. 13, the method of manufacturing the anti-shake photosensitive assembly 20A includes the steps of:

s1': correspondingly attaching a driver 22 to a mounting region 2111A of a circuit board 211A, wherein the circuit board 211A is manufactured by a rewiring layer process;

s2': correspondingly attaching a photosensitive element 23 to the driver 22; and

s3': the driver 22 and the photosensitive element 23 are respectively conductively connected to the circuit board 211A to manufacture the anti-shake photosensitive assembly 20A.

Further, the method for manufacturing the anti-shake photosensitive assembly 20A further includes the steps of:

s4': a reinforcing element 213A is disposed on the bottom side of the circuit board 211A to increase the strength of the circuit board 211A.

It should be noted that, as shown in fig. 13, in the manufacturing method of the anti-shake photosensitive assembly 20A, the step S1 'and the step S2' are similar to the step S1 and the step S2, respectively, in the manufacturing method of the anti-shake photosensitive assembly 20, and the first glue and the second glue are respectively used for bonding to complete the corresponding attaching steps.

According to another aspect of the present invention, the present invention further provides a method for manufacturing the anti-shake camera module 1, 1A, comprising the steps of:

manufacturing the anti-shake photosensitive assemblies 20 and 20A according to the manufacturing method of the anti-shake photosensitive assemblies 20 and 20A; and

an optical lens 10 is correspondingly disposed on the photosensitive path of the photosensitive element 23 of the anti-shake photosensitive assembly 20, 20A to form the anti-shake camera module 1, 1A.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (28)

1. An anti-shake photosensitive assembly, comprising:

a circuit board assembly, wherein the circuit board assembly provides at least one attachment surface;

at least one driver, wherein each driver is correspondingly attached to each attaching surface of the circuit board assembly; and

at least one photosensitive element, wherein each photosensitive element is correspondingly arranged on each driver, and the drivers are positioned between the photosensitive elements and the attaching surfaces of the circuit board assembly, so that the corresponding photosensitive elements are moved by the drivers.

2. The anti-shake photosensitive assembly according to claim 1, wherein the circuit board assembly comprises a circuit board and an attachment substrate, wherein a lower surface of the attachment substrate is attached to the circuit board such that an upper surface of the attachment substrate serves as the attachment surface of the circuit board assembly.

3. The anti-shake photosensitive assembly of claim 2, wherein the attached substrate is a steel plate.

4. The anti-shake photosensitive assembly according to claim 2, wherein the attachment substrate is made of one material selected from ceramics, alloys, metals, and polymer materials.

5. The anti-shake photosensitive assembly of claim 2, wherein the attached substrate has at least one vacuum groove, wherein each vacuum groove extends from the upper surface of the attached substrate to the lower surface of the attached substrate to form a through hole on the attached substrate.

6. The anti-shake photosensitive assembly of claim 5, wherein the attached substrate has a plurality of vacuum grooves, wherein the plurality of vacuum grooves are uniformly distributed on the attached substrate.

7. The anti-shake photosensitive assembly according to claim 2, wherein the circuit board has a housing space in which the attached substrate attached to the circuit board is housed.

8. The anti-shake photosensitive assembly of claim 7, wherein the receiving space is a recess.

9. The anti-shake photosensitive assembly of claim 7, wherein the receiving space is a through hole.

10. The anti-shake photosensitive assembly according to claim 2, wherein the circuit board has a through-hole type accommodation space, wherein the attachment substrate is attached to a bottom side of the circuit board, and the driver attached to the attachment substrate is accommodated in the accommodation space.

11. The anti-shake photosensitive assembly according to claim 1, wherein the circuit board assembly comprises a circuit board processed by a grinding process, wherein the circuit board comprises a mounting area and an edge area around the mounting area, and the mounting area of the circuit board is used as the attachment surface of the circuit board assembly.

12. The anti-shake photosensitive assembly according to claim 1, wherein said circuit board assembly comprises a circuit board manufactured by a rewiring layer process, wherein said circuit board comprises a mounting area and an edge area around said mounting area, and said mounting area of said circuit board is used as said attachment surface of said circuit board assembly.

13. The anti-shake photosensitive assembly according to claim 12, wherein the circuit board assembly further comprises a reinforcing element, wherein the reinforcing element is disposed on the bottom side of the circuit board to reinforce the strength of the circuit board.

14. The anti-shake photosensitive assembly of claim 13, wherein the reinforcing element is a steel plate.

15. An anti-shake photosensitive assembly according to any one of claims 1 to 14, wherein the flatness of the attachment face of the wiring board assembly is within 15 um.

16. An anti-shake photosensitive assembly as claimed in any one of claims 1 to 14, wherein the photosensitive element is attached to the driver by means of particle glue, and the driver is attached to the attachment surface of the circuit board assembly by means of particle glue.

17. An anti-shake photosensitive assembly according to any one of claims 2 to 10, wherein the attachment substrate is attached to the circuit board by particle glue.

18. An anti-shake photosensitive assembly according to any one of claims 2 to 14, wherein the driver is a micro-electromechanical system.

19. The anti-shake photosensitive assembly of claim 18, wherein the driver comprises a movable portion and an immovable portion, wherein the immovable portion of the driver is fixedly attached to the attaching surface of the circuit board assembly, and the photosensitive element is correspondingly attached to the movable portion of the driver.

20. An anti-shake photosensitive assembly as claimed in claim 19, wherein said driver further comprises at least one set of first connectors, at least one set of second connectors, and at least one set of elastic wires, wherein each set of said first connectors is disposed on said movable portion of said driver, each set of said second connectors is disposed on said immovable portion of said driver, wherein each set of said first connectors and each set of said second connectors are conductively connected by each set of said elastic wires, wherein said circuit board is conductively connected with each set of said second connectors of said driver, and said photosensitive element is conductively connected with each set of said first connectors of said driver.

21. An anti-shake photosensitive assembly according to any one of claims 1 to 14, further comprising at least one filter element, wherein each said filter element is directly attached to a top surface of each said photosensitive element.

22. An anti-shake camera module, a serial communication port, include:

at least one optical lens; and

an anti-shake photosensitive assembly as claimed in any one of claims 1 to 21, wherein each optical lens is correspondingly disposed on a photosensitive path of each photosensitive element of the anti-shake photosensitive assembly to assemble the anti-shake camera module.

23. An electronic device, comprising:

an electronic device body; and

the anti-shake camera module of claim 22, wherein the anti-shake camera module is mounted to the electronic device body to assemble the electronic device.

24. A manufacturing method of an anti-shake photosensitive assembly is characterized by comprising the following steps:

correspondingly attaching a driver on an upper surface of an attached substrate;

correspondingly attaching a photosensitive element to the driver;

attaching the attached substrate to a circuit board; and

and respectively connecting the driver and the photosensitive element with the circuit board in a conduction manner to manufacture the anti-shake photosensitive assembly.

25. A method for manufacturing an anti-shake photosensitive assembly according to claim 24, wherein said step of conductively connecting said driver and said photosensitive element to said circuit board, respectively, to make said anti-shake photosensitive assembly comprises the steps of:

at least one group of first connecting pieces which are conductively connected with the photosensitive element and the driver in a routing mode; and

the driver comprises at least one group of second connecting pieces and at least one group of circuit board connecting pieces, wherein the at least one group of second connecting pieces of the driver and the at least one group of circuit board connecting pieces of the circuit board are connected in a conducting mode in a routing mode, and each group of first connecting pieces and each group of second connecting pieces are connected in a conducting mode through a group of elastic wires.

26. A manufacturing method of an anti-shake photosensitive assembly is characterized by comprising the following steps:

correspondingly attaching a driver to a mounting area of a circuit board, wherein the circuit board is manufactured by a rewiring layer process;

correspondingly attaching a photosensitive element to the driver; and

and respectively connecting the driver and the photosensitive element with the circuit board in a conduction manner to manufacture the anti-shake photosensitive assembly.

27. A method of manufacturing an anti-shake photosensitive assembly according to claim 26, further comprising the steps of:

a reinforcing element is arranged on the bottom side of the circuit board to increase the strength of the circuit board.

28. A manufacturing method of an anti-shake camera module is characterized by comprising the following steps:

an anti-shake photosensitive assembly according to the method of manufacturing an anti-shake photosensitive assembly according to any one of claims 24 to 27; and

correspondingly, at least one optical lens is arranged on the photosensitive path of at least one photosensitive element of the anti-shake photosensitive assembly so as to manufacture an anti-shake camera module.

Images