CN110777407A

CN110777407A - Ultrasonic electroplating device

Info

Publication number: CN110777407A
Application number: CN201911173695.2A
Authority: CN
Inventors: 方伟宏
Original assignee: Huzhou Nooter Surface Treatment Technology Co Ltd
Current assignee: Huzhou Nooter Surface Treatment Technology Co Ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-02-11

Abstract

The invention discloses an ultrasonic electroplating device which comprises a base, wherein the base is divided into a feeding area at the bottommost part and an ultrasonic processing area arranged at the upper part of the feeding area, the upper part of the ultrasonic processing area is fixedly connected with an electroplating area, and the upper end of the electroplating area is connected with a discharging area. The application can obtain the following technical effects: 1. by utilizing the metal transmissibility of ultrasonic waves, the concentration of the solution in each water tank is kept uniform all the time, the accuracy and uniformity during electroplating are improved, the thickness of a coating is more uniform, and the step of polishing is omitted; 2, impurities such as oil stains and oxides on the surface are continuously removed by ultrasonic cleaning, the pressure of a decontamination step is reduced, and the ultrasonic used for cleaning can be used for vibrating the solution in the water tank again, so that the starting gear of the ultrasonic is reduced, and more energy is saved; 3. the invention improves the accuracy and the uniformity during electroplating, ensures better electroplating effect, reduces energy consumption and the loss of metal raw materials, ensures higher ion exchange speed during electroplating and improves the yield.

Description

Ultrasonic electroplating device

Technical Field

The application relates to an ultrasonic electroplating device.

Background

Generally, the electroplating process mainly goes through an electrolysis process, wherein after a voltage is inputted between an anode and a cathode, metal ions in the electroplating solution are attracted to the cathode and are reduced to be plated on a plated object connected with the cathode, and meanwhile, the metal connected with the anode is re-dissolved to provide more metal ions in the electroplating solution, so that the electrolysis process is continued until a sufficient plating layer is deposited on the plated object.

The bonding force of the coating and the substrate is one of important indexes for measuring the quality of the coating. At present, in a chemical plating device used in a general chemical plating process, an input mode of energy is mainly constant-temperature water bath heating or electric heating, and the following defects mainly exist: firstly, the reaction can be carried out only when the temperature required by chemical plating is above 80-85 ℃ in the traditional heating mode, the energy consumption is large, the plating solution is evaporated quickly, and the plating solution has poor stability and is easy to decompose, thereby causing the waste of the plating solution; secondly, because the required chemical plating reaction temperature is higher, the material to be plated is limited, and the material is easy to deposit on the wall of the chemical plating bath in the reaction process, thereby causing the waste of the plating solution. The above-mentioned conventional chemical plating by heating has problems that the surface of the obtained plating layer is rough and uneven, and the bonding force between the plating layer and the substrate is poor.

At present, ultrasonic waves are introduced into the existing silver plating technology as a cleaning means, but the traditional silver plating does not use ultrasonic waves except for an ultrasonic step, but certain energy is wasted for the activated ultrasonic waves.

Disclosure of Invention

In order to solve the technical problem, the application discloses ultrasonic electroplating device, including the base, the base divide into the feeding zone of bottommost and sets up in the ultrasonic treatment district on feeding zone upper portion, and the upper portion fixed connection in ultrasonic treatment district has electroplating district, and the upper end in electroplating district even has ejection of compact district.

The invention can be further optimized in that the feeding area comprises a hot water inlet and a hot water outlet for hot water circulation, an anode tube for feeding the anode, an acid-alkali liquor inlet and an acid-alkali liquor outlet for surface treatment of the plated part, wherein the hot water inlet and the hot water outlet are respectively provided with a circulating pipeline inside the feeding area, and the acid-alkali liquor inlet and the acid-alkali liquor outlet are respectively provided with a circulating pipeline inside the feeding area.

The invention can be further optimized into that the anode tube comprises a gold inlet tube, a tin inlet tube, a nickel inlet tube, a copper inlet tube and a silver inlet tube.

The invention can be further optimized to be that ultrasonic generators are fixed on two sides of the ultrasonic treatment area and are opposite.

The invention can be further optimized in that the direction of the ultrasonic vibration emitted by the ultrasonic generator is vertical to the horizontal direction of the side surface of the plated material, and the ultrasonic wave emitted by the ultrasonic generator is reflected by the bottom of the bottom ultrasonic treatment area and then emitted upwards.

The invention can be further optimized in that both sides of the electroplating area are fixed with electroplating baths, the middle part of the electroplating area is fixed with an air suction pump, the air suction pump is fixed with air blowing ports towards the electroplating baths on both sides, and a rectifier is arranged at the connecting position of the electroplating area and the discharging area.

The invention can be further optimized in that the upper part of the electroplating area is provided with a sealing cover, and the joint of the sealing cover and the base is hinged.

The invention can be further optimized to be that the bottom of the electroplating area is provided with a cathode drainage pipeline, an electroplating water supplementing pipeline and a pure water pipeline.

The invention can be further optimized in that the discharging area comprises a wiring pipe vertically fixed in the middle of the discharging area and a sealing plate fixed at the top of the wiring pipe, and a plurality of wire grooves are fixedly arranged on the upper surface of the sealing plate.

Compared with the prior art, the application can obtain the following technical effects: 1. by utilizing the metal transmissibility of ultrasonic waves, the concentration of the solution in each water tank is kept uniform all the time, the accuracy and uniformity during electroplating are improved, the thickness of a coating is more uniform, and the step of polishing is omitted; 2, impurities such as oil stains and oxides on the surface are continuously removed by ultrasonic cleaning, the pressure of a decontamination step is reduced, and the ultrasonic used for cleaning can be used for vibrating the solution in the water tank again, so that the starting gear of the ultrasonic is reduced, and more energy is saved; 3. the invention improves the accuracy and uniformity during electroplating, ensures better electroplating effect, reduces energy consumption and loss of metal raw materials, optimizes cost, ensures faster ion exchange speed during electroplating and improves yield.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic view of the general structure of the present invention.

Detailed Description

Embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

As shown in fig. 1, the ultrasonic electroplating device of the embodiment of the present application includes a base 1, the base 1 is divided into a feeding area 2 at the bottommost portion and an ultrasonic processing area 3 disposed on the upper portion of the feeding area 2, the upper portion of the ultrasonic processing area 3 is fixedly connected with an electroplating area 4, and the upper end of the electroplating area 4 is connected with a discharging area 5.

Example 1 in the present application, a feeding zone 2 comprises a hot water inlet 6 and a hot water outlet 7 for hot water circulation, and an anode tube 8 for feeding an anode, an acid-base solution inlet 9 and an acid-base solution outlet 10 for surface treatment of a plated article, the hot water inlet 6 and the hot water outlet 7 are circulation pipes inside the feeding zone 2, the acid-base solution inlet 9 and the acid-base solution outlet 10 are circulation pipes inside the feeding zone 2, the anode tube 8 comprises an gold feeding pipe 81, a tin feeding pipe 82, a nickel feeding pipe 83, a copper feeding pipe 84 and a silver feeding pipe 85, the hot water inlet 6 and the hot water outlet 7 form hot water circulation in the feeding zone 2, the plated article is cleaned with hot water before electroplating to remove impurities on the surface, the acid-base solution inlet 9 and the acid-base solution outlet 10 are used for acid and alkali cleaning of the surface of the plated article, so that some of the surface of the plated article is difficult to remove and the surface is smooth, the electroplating device is beneficial to later electroplating work, and the gold inlet pipe 81, the tin inlet pipe 82, the nickel inlet pipe 83, the copper inlet pipe 84 and the silver inlet pipe 85 are preset in one electroplating device, so that the electroplating device has the function of electroplating different plating materials, the application range of the electroplating device is greatly expanded, the equipment cost in the actual production process is greatly saved, and other types of feeding pipes can be provided according to the actual production requirement.

In embodiment 2, the ultrasonic generators 11 are fixed on two sides of the ultrasonic processing area 3, the ultrasonic generators 11 are opposite, the direction of ultrasonic vibration emitted by the ultrasonic generators 11 is perpendicular to the horizontal direction of the side surface of the plated material, and the ultrasonic waves emitted by the ultrasonic generators 11 are reflected by the bottom of the ultrasonic processing area 3 at the bottom and then emitted upwards, the opposite ultrasonic generators can emit the ultrasonic waves in opposite directions, so that the covering effect of the ultrasonic waves is better, and the gas is prevented from rising and returning to the cleaning device again by utilizing the closed chamber formed in the side plate of the ultrasonic processing area 3, so that the gas can be quickly cleaned, and the cleaning efficiency of the gas is effectively improved.

In example 3, electroplating baths 12 are fixed on both sides of the electroplating region 4, an air pump 13 is fixed in the middle of the electroplating region 4, air blowing ports 13 are fixed on the air pump 13 toward the electroplating baths 12 on both sides, and a rectifier 14 is arranged at the connection position of the electroplating region 4 and the discharge region 5. The upper part of the electroplating area 4 is provided with a sealing cover 15, and the joint of the sealing cover 15 and the base 1 is hinged. The bottom of the electroplating area 4 is provided with a cathode drainage pipeline 16, an electroplating water replenishing pipeline 17 and a pure water pipeline 18, after ultrasonic wave acts on the electroplating liquid, the cavitation action of the ultrasonic wave is equivalent to strong stirring of the electroplating liquid, the concentration of metal ions on the surface of an electrode is increased due to the action, the deposition speed is accelerated, the ultrasonic wave is favorable for expelling bubbles gathered on the surface of the electrode, the pores in the coating and the internal stress of the coating are reduced, the compactness of the coating is increased, the coating quality is improved, air blowing is carried out on the coated material by utilizing an air suction pump, the material is cooled and the waste water of the previous process is blown off, and the coated material which is cooled in time can improve the electroplating conversion rate.

The discharging area 5 comprises a wiring pipe 19 vertically fixed in the middle of the discharging area 5 and a sealing plate 20 fixed at the top of the wiring pipe 19, and a plurality of wire grooves 21 are fixedly arranged on the upper surface of the sealing plate 20.

The foregoing description shows and describes several preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides an ultrasonic electroplating device, includes base (1), its characterized in that, base (1) divide into feed zone (2) of bottommost and set up in ultrasonic treatment district (3) on feed zone (2) upper portion, the upper portion fixed connection of ultrasonic treatment district (3) has electroplating district (4), the upper end of electroplating district (4) even has ejection of compact district (5).

2. An ultrasonic plating apparatus according to claim 1, wherein: the feeding area (2) comprises a hot water inlet (6) and a hot water outlet (7) for hot water circulation, an anode pipe (8) for anode feeding, an acid-alkali liquor inlet (9) and an acid-alkali liquor outlet (10) for surface treatment of a plated part, the hot water inlet (6) and the hot water outlet (7) are arranged in the feeding area (2) through a circulation pipeline, and the acid-alkali liquor inlet (9) and the acid-alkali liquor outlet (10) are arranged in the feeding area (2) through a circulation pipeline.

3. An ultrasonic plating apparatus according to claim 2, wherein: the anode tube (8) comprises a gold inlet tube (81), a tin inlet tube (82), a nickel inlet tube (83), a copper inlet tube (84) and a silver inlet tube (85).

4. An ultrasonic plating apparatus according to claim 1, wherein: ultrasonic generators (11) are fixed on two sides of the ultrasonic processing area (3), and the ultrasonic generators (11) are opposite.

5. An ultrasonic plating apparatus according to claim 4, wherein: the direction of ultrasonic vibration sent by the ultrasonic generator (11) is perpendicular to the horizontal direction of the side surface of the plated material, and the ultrasonic wave sent by the ultrasonic generator (11) is reflected by the bottom of the bottom ultrasonic processing area (3) and then is upwards emitted.

6. An ultrasonic plating apparatus according to claim 1, wherein: electroplating baths (12) are fixed on two sides of the electroplating area (4), an air suction pump (13) is fixed in the middle of the electroplating area (4), an air blowing opening (13) is fixed on the air suction pump (13) towards the electroplating baths (12) on two sides, and a rectifier (14) is arranged at the connecting position of the electroplating area (4) and the discharging area (5).

7. An ultrasonic plating apparatus according to claim 6, wherein: the upper part of the electroplating area (4) is provided with a sealing cover (15), and the joint of the sealing cover (15) and the base (1) is hinged.

8. An ultrasonic plating apparatus according to claim 6, wherein: the bottom of the electroplating area (4) is provided with a cathode drainage pipeline (16), an electroplating water replenishing pipeline (17) and a pure water pipeline (18).

9. An ultrasonic plating apparatus according to claim 1, wherein: including vertical being fixed in ejection of compact district (5) walk spool (19) and be fixed in the middle of ejection of compact district (5) walk shrouding (20) at spool (19) top the last fixed surface of shrouding (20) sets up a plurality of wire casings (21).