CN110708921A - Lower air supply data center micro-module structure - Google Patents
Lower air supply data center micro-module structure Download PDFInfo
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- CN110708921A CN110708921A CN201810751130.7A CN201810751130A CN110708921A CN 110708921 A CN110708921 A CN 110708921A CN 201810751130 A CN201810751130 A CN 201810751130A CN 110708921 A CN110708921 A CN 110708921A
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- 238000001816 cooling Methods 0.000 claims abstract description 34
- 230000003068 static effect Effects 0.000 claims abstract description 18
- 238000009423 ventilation Methods 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000012423 maintenance Methods 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000005265 energy consumption Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 6
- 238000005057 refrigeration Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
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- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a lower air supply data center micro-module structure, which comprises: at least one group of cabinet group, inside static pressure case, a plurality of passageway formula back door structure, raised floor and a plurality of cooling backplate. The invention can meet the requirement that a plurality of high-heat-density servers are additionally arranged in the common under-floor fan sending room, and cools the hot air exhausted by the cabinet by introducing the cooling back plate, thereby saving the energy consumption of the fan at the tail end of the air conditioner, improving the heat dissipation efficiency of the cabinet and saving the space of the machine room.
Description
Technical Field
The invention relates to the technical field of data centers, in particular to a micro-module structure of a lower air supply data center.
Background
With the rise of new generation information technologies represented by artificial intelligence, big data and cloud computing, the development of the data center industry is facing unprecedented challenges. The increasingly rich variety and quantity of network applications brings massive data, and simultaneously, more and higher requirements are put forward for an internet infrastructure, namely a data center. The rise of the AI concept and the falling of AI applications have led to an increasing demand for high-speed computing in the industry, and the deployment scale of the GPU accelerated computing server, which is superior to the conventional CPU, in the data center will continue to increase, while the heat energy generated by the GPU accelerated computing server is several times that of the conventional CPU, and in order to adapt to the development of future AI, the heat dissipation technology of the data center must be changed.
However, a large number of original low-heat-density server cabinets are still deployed in the current data center, and conventional machine room air conditioners are used for heat dissipation. The heat discharged by the newly deployed high-heat-density server cabinet is far greater than that of the original low-heat-density server cabinet, and the heat cannot be continuously dissipated by low-cold-quantity heat dissipation equipment such as a machine room air conditioner. In addition, the high heat discharged by the newly deployed high-heat-density server cabinet can also damage the original airflow circulation loop of the data center, so that the overall heat dissipation effect of the data center is influenced.
Therefore, in order to meet the application requirements of a data center integrated with a high-heat-density server cabinet, a new micro-module structure of a downdraft data center needs to be provided to solve the above problems.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a new micro-module structure of a downdraft data center, which is used to solve the problem that the existing data center cannot solve the heat dissipation problem of a high-heat-density server cabinet.
To achieve the above and other related objects, the present invention provides a lower blowing data center micro-module structure, comprising:
the air outlet surface and the air inlet surface are respectively arranged on two sides of the cabinet group pair; the air inlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of cabinets and is connected with the air inlet surface of the cabinet;
the channel type rear door structures are respectively arranged at the outer sides of the air outlet surfaces of the cabinets; the channel type rear door structure is hollow in the interior, the bottom of the channel type rear door structure is provided with a first air outlet communicated with the interior of the channel type rear door structure, and the side surface of the channel type rear door structure is provided with a first air inlet communicated with the interior of the cabinet;
the overhead floor is arranged above the substrate in an overhead mode, and an overhead space is formed between the overhead floor and the substrate; the raised floor is positioned below the cabinet set, the internal plenum box and the channel-type rear door structure; the overhead floor is provided with a second air inlet and a second air outlet which are communicated with the overhead space, the second air outlet is positioned below the internal static pressure box, and the second air inlet is positioned below the first air outlet and is communicated with the first air outlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
As a preferable scheme of the present invention, the lower air supply data center micro-module structure further includes an air outlet temperature sensor, and the air outlet temperature sensor is located in the channel-type rear door structure.
As a preferable aspect of the present invention, the air outlet temperature sensor is located at the first air outlet.
As a preferable scheme of the present invention, the lower air supply data center micro-module structure further includes an air inlet temperature sensor, and the air inlet temperature sensor is located in the internal static pressure box.
As a preferred scheme of the present invention, the raised floor includes a through-hole floor having a surface provided with a plurality of through-holes arranged at intervals, the through-hole located between the air inlet surfaces of two cabinets in the cabinet group serves as the second air outlet, and the through-hole located below the first air outlet serves as the second air inlet.
As a preferred scheme of the invention, the raised floor comprises a through hole floor with a plurality of through holes and a plurality of ventilation openings on the surface; the plurality of ventilation openings are respectively positioned between the air inlet surfaces of the two cabinets in the cabinet group and below the first air outlet, the ventilation opening positioned between the air inlet surfaces of the two cabinets in the cabinet group is used as the second air outlet, and the ventilation opening positioned below the first air outlet is used as the second air inlet; the through holes are positioned at the periphery of the plurality of ventilation openings.
As a preferable scheme of the present invention, the cooling back plate is a water-cooling back plate or an air-cooling back plate.
As a preferable scheme of the invention, a freezing water coil is arranged inside the water-cooling back plate.
As a preferable aspect of the present invention, the width of the tunnel-type rear door structure is equal to the width of the cabinet.
As a preferable scheme of the present invention, the channel-type back door structure is detachably connected to the cabinet.
As a preferable scheme of the present invention, a rubber cushion is disposed between the channel-type rear door structure and the cabinet.
As a preferable scheme of the invention, the top of the channel type rear door structure is an arc-shaped guide surface.
As a preferable aspect of the present invention, the width of the cooling back plate is equal to the width of the cabinet air outlet surface, and the height of the cooling back plate is equal to the height of the cabinet air outlet surface.
As a preferable aspect of the present invention, the width of the cabinet air outlet surface is the same as the width of the internal plenum box.
As a preferred aspect of the present invention, the depth of the internal plenum box is not less than twice the depth of the cabinet; the height of the internal static pressure box is not less than the height of the machine cabinet; the internal plenum box is of a cuboid structure.
As a preferable scheme of the invention, the return air channel is provided with a maintenance door communicated with the inside of the return air channel.
As described above, the present invention provides a lower air supply data center micro-module structure, which has the following beneficial effects:
the invention can meet the requirement that a plurality of high-heat-density servers are additionally arranged in a common under-floor air supply fan room by introducing a lower air supply data center micro-module structure. The cooling back plate is used for cooling hot air exhausted from the cabinet, so that the energy consumption of a fan at the tail end of an air conditioner is saved, the heat dissipation efficiency of the cabinet is improved, and the space of a machine room is saved.
Drawings
Fig. 1 is a top view of a group of cabinets according to a first embodiment of the present invention.
Fig. 2 is a top view of a data center micromodule consisting of a plurality of rack assemblies according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a lower air supply data center micro-module structure according to a first embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of a lower supply air data center micro-module structure according to an embodiment of the present invention.
Fig. 5 is a plan view showing a through-hole floor provided with through-holes in the first embodiment of the present invention.
Fig. 6 is a top view of a through-hole floor with vents and through-holes provided in a first embodiment of the present invention.
Fig. 7 is a schematic structural diagram illustrating a lower air supply data center micro-module structure according to a second embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a lower air supply data center micro-module structure according to a third embodiment of the present invention.
Fig. 9 is a schematic cross-sectional view illustrating a structure of a lower supply air data center micro-module according to a third embodiment of the present invention.
Description of the element reference numerals
11 machine cabinet
12 air inlet surface
13 air outlet surface
14 raised floor
140 through hole floor
141 through hole
142 air vent
15 base
16 internal plenum box
17 passageway formula back door structure
18 cooled backing plate
19 maintenance door
Width of D1 cooling back plate
Width of D2 tunnel type rear door structure
Height of H1 cabinet air outlet surface
Height of H2 internal plenum box
Depth of hydrostatic box inside W1
Depth of W2 cabinet
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
Please refer to fig. 1 to 9. It should be noted that the drawings provided in the present embodiment are only schematic and illustrate the basic idea of the present invention, and although the drawings only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of the components in actual implementation may be changed arbitrarily, and the layout of the components may be more complicated.
Example one
As shown in fig. 1 to 6, the present invention provides a lower air supply data center micro-module structure, including:
the air conditioner comprises at least one cabinet group 10, wherein one cabinet group 10 comprises two rows of cabinets 11 which are arranged at intervals, an air inlet surface 12 and an air outlet surface 13 which are communicated with the interiors of the cabinets 11 are arranged on the cabinets 11, and the air inlet surface 12 and the air outlet surface 13 are respectively arranged on two opposite sides of the cabinets 11; the air inlet surfaces 12 of the two cabinets 11 in the cabinet group 10 are adjacent;
the internal static pressure box 16 is arranged between the two rows of the cabinets 11 and is connected with the air inlet surface of the cabinet 11;
the channel type rear door structures 17 are respectively arranged on the outer sides of the air outlet surfaces 13 of the cabinets 11; the channel type rear door structure 17 is hollow, the bottom of the channel type rear door structure is provided with a first air outlet communicated with the interior of the channel type rear door structure, and the side surface of the channel type rear door structure is provided with a first air inlet communicated with the interior of the cabinet 11;
a raised floor 14 which is arranged above a substrate 15 in an overhead manner and forms an overhead space with the substrate 15; the raised floor 14 is located below the cabinet assembly 10, the interior plenum box 16, and the tunnel-type rear door structure 17; a second air inlet and a second air outlet which are communicated with the overhead space are arranged on the overhead floor 14, the second air outlet is positioned below the internal static pressure box 16, and the second air inlet is positioned below the first air outlet and is communicated with the first air outlet;
and the cooling back plates 18 are respectively arranged on the air inlet surfaces 12 of the cabinets 11.
As shown in fig. 1, the top view of a set of cabinet group 10 is shown, one set of the cabinet group 10 is formed by a pair of cabinets 11 arranged at intervals, an air inlet surface 12 and an air outlet surface 13 communicated with the internal space of the cabinets 11 are arranged on the cabinets 11, wherein the air inlet surface 12 is located on one adjacent surface between the pair of cabinets 11, and the air outlet surface 13 is located on the other side opposite to the air inlet surface 12. The proximity of the air inlet surfaces 12 of the two cabinets 11 in the cabinet group 10 means that the air inlet surfaces 12 of the two cabinets 11 are located on two opposite sides of the internal static pressure box 16 between the two cabinets 11. Each cabinet 11 is provided with a corresponding channel type rear door structure 17, and the channel type rear door structure 17 is located on the outer side of the air outlet surface 13 of the cabinet 11. Each cabinet 11 is further provided with a corresponding cooling back plate 18, which is located on the air inlet surface 12 of the cabinet 11. An internal plenum box 16 is provided between the air intake surfaces 12 of the two cabinets 11.
As shown in fig. 2, it is a top view of a data center micro-module formed by several groups of cabinet groups 10, and five groups of cabinet groups 10 are arranged along the direction a shown by the arrow. Each cabinet 11 is provided with a corresponding channel type rear door structure 17, and the channel type rear door structure 17 is located on the outer side of the air outlet surface 13 of the cabinet 11. Each cabinet 11 in each row is provided with a corresponding cooling back plate 18, which is located on the air outlet surface 13 of each cabinet 11. An internal plenum box 16 is disposed between the air intake surfaces 12 of the two rows of cabinets 11. The width D1 of the cooling back panel 18 is equal to the width of the cabinet outlet face 13. The width D2 of the tunnel-type rear door structure 17 is equal to the width of the cabinet 11.
Fig. 3 is a schematic structural diagram of the structure of the downdraft data center micro-module in this embodiment, and it should be noted that the cabinet 11, the internal plenum box 16, and the tunnel-type rear door structure 17 are partially transparent in order to facilitate the illustration of the details in the figure. As shown in fig. 3, several groups of cabinet groups 10 are disposed on a raised floor 14, the raised floor 14 is disposed above a base 15, and an elevated space is formed between the base 15, and air flow in the elevated space can freely circulate. Preferably, the channel-type rear door structure 17 is detachably connected to the cabinet 11 so as to be detached during maintenance; and a rubber gasket is arranged at the joint to ensure the tightness of the system. The internal plenum box 16 is of rectangular parallelepiped configuration. A maintenance door 19 is provided on the side of the inner plenum box 16 not connected to the cabinet 11 for maintenance personnel to access the inner plenum box 16 for maintenance, and when the maintenance door 19 is closed, the inner plenum box 16 is completely sealed so that the air inside the micromodule does not exchange heat with the outside air. In this example, the shape of the tunnel-type rear door structure 17 may be rectangular, that is, the top of the tunnel-type rear door structure 17 is a planar guide surface, and the top of the tunnel-type rear door structure 17 is vertically connected with the side wall of the tunnel-type rear door structure 17.
Fig. 4 is a cross-sectional view of the structure of the lower supply air data center micromodule provided in the present embodiment, in which arrows indicate the flowing direction of air. When the hot air in the cabinet 11 is exhausted through the air outlet surface 13, the hot air is cooled to be cold air by the cooling back plate 18 and enters the channel type rear door structure 17; the cold air enters the internal plenum box 16 through the tunnel-type rear door structure 17 and the overhead space, enters the cabinet 11 through the air inlet surface 12, and carries away heat from the cabinet 11. Preferably, the height H1 of the cabinet outlet 12 is equal to the height of the cooling back panel 18, the height H2 of the internal plenum box 16 is not less than the height of the cabinet 11, and the depth W1 of the internal plenum box 16 is not less than twice the depth W2 of the cabinet 11. In this embodiment, the height H2 of the internal plenum box 16 is greater than the height of the cabinet 11, which allows the internal plenum box 16 to have more space for better plenum and airflow in the lower feed data center micro-module structure.
As an example, the lower air supply data center micro-module structure further includes an air outlet temperature sensor, and the air outlet temperature sensor is located in the channel type rear door structure 17. In order to monitor the outlet air temperature of the air entering the channel type rear door structure 17 from the outlet air surface 13, the outlet air temperature sensor is arranged in the channel type rear door structure 17, so as to accurately grasp the cooling effect of the cooling back plate 18, adjust the refrigeration efficiency of the cooling back plate 18 in real time, and maintain the temperature in the whole system within a set range.
As an example, the outlet air temperature sensor is located at the first outlet air. As a preferable aspect of the present invention, the air outlet temperature sensor is directly disposed at the first air outlet, so that the temperature of the air entering the raised floor from the tunnel-type rear door structure 17 can be monitored more accurately. This air-out temperature not only reflects the air temperature that enters the channel-type back door structure 17, but also enables the relevant technical personnel to more accurately derive the air temperature under the raised floor, and then grasps the air circulation of the entire data center micromodule.
Illustratively, the underfloor air supply data center micromodule also includes an air supply temperature sensor located within the internal plenum box 16. By monitoring the temperature of the supply air entering the interior plenum 16, the temperature of the supply air from below the floor can be accurately monitored. When the air supply temperature sensor detects that the air supply temperature deviates from a set standard value, an alarm can be sent out in time, and the problem that the temperature in the cabinet 11 is too high to cause the shutdown of the server is avoided.
As an example, the raised floor 14 includes a through-hole floor 140 having a plurality of through holes 141 arranged at intervals on a surface thereof, and the through holes 141 are used as a second air inlet or a second air outlet. As shown in fig. 5, the raised floor 14 is composed of a plurality of modular movable through-hole floors 140 with through-holes 141 on their surfaces. The through-hole floor 140 is laid on a metal bracket that is erected above the substrate 15. The through holes 141 may communicate with upper and lower surfaces of the through hole floor to allow air to freely flow therethrough. The plurality of through holes 141 may collectively serve as the second air inlet or the second air outlet. Preferably, in order to increase the ventilation amount, a plurality of ventilation openings 142 with larger openings may be provided on the through hole floor 14 to increase the opening area of the second intake vent or the second outtake vent. The ventilation opening 142 may coexist with the through holes 141, and the through holes 141 are distributed around the ventilation opening 142 to function as the second air inlet or the second air outlet, as shown in fig. 6. It should be noted that the oval shapes of the through hole 141 and the ventilation opening 142 are only used as an example, and any other reasonable geometric shapes of the through hole 141 and the ventilation opening 142 can be adopted in the present invention.
The cooling back plate 18 is, for example, a water-cooled back plate or an air-cooled back plate. As a preferable scheme of the invention, the water-cooling back plate is used as a means for cooling hot air, so that the heat generated by the server with high heat density can be eliminated to the maximum extent, and the invention has the advantages of high efficiency and low energy consumption. Of course, other cooling means such as an air-cooled back plate may be used in other embodiments.
As an example, the water-cooling back plate is internally provided with a chilled water coil. The refrigeration water coil pipe cools air passing through the surface of the refrigeration water coil pipe through heat exchange of low-temperature circulating water flow in the refrigeration water coil pipe, and is a high-efficiency and low-energy-consumption refrigeration means.
Example two
As shown in fig. 7, the present invention further provides a lower air supply data center micro-module structure, the specific structure of the lower air supply data center micro-module structure described in this embodiment is substantially the same as the specific structure of the lower air supply data center micro-module structure described in the first embodiment, and the difference between them is that: in the first embodiment, the top of the tunnel-type rear door structure 17 in the lower air supply data center micro-module structure is a planar guide surface, while in the present embodiment, the top of the tunnel-type rear door structure 17 is an arc-shaped guide surface. The arrangement of the arc-shaped guide surface fully considers the hydrodynamics inside the lower air supply data center micro-module structure, so that the air flow inside the channel type rear door structure 17 is smooth to circulate, and the heat dissipation efficiency of the lower air supply data center micro-module structure is improved. It should be noted that in this embodiment, the height H2 of the inner plenum 16 is equal to the height H1 of the cabinet outlet 12.
The other structures of the lower air supply data center module described in this embodiment are the same as those of the lower air supply data center module described in the first embodiment, and specific reference is made to the first embodiment, which will not be repeated herein.
EXAMPLE III
Referring to fig. 8 and 9, the present invention further provides a lower air supply data center micro-module structure. As shown in fig. 8, the specific structure of the lower air supply data center micro-module structure described in this embodiment is substantially the same as the specific structure of the lower air supply data center micro-module structure described in the second embodiment, and the difference between them is that: this embodiment further increases the height of the internal plenum 16. This makes it possible to increase the volume of the internal plenum box 16 not only when the depth W1 of the internal plenum box 16 is constant; when the volume of the internal static pressure box 16 is not changed, the occupied area of the internal static pressure box 16 can be reduced as much as possible, a certain static pressure effect is ensured, and meanwhile, the occupied area of the whole lower air supply data center micromodule structure is smaller, and the occupied space is saved. Fig. 9 is a schematic cross-sectional view of the structure of the lower supply air data center micro-module according to the present embodiment. Wherein the height of the inner static pressure box 16 is increased compared with the second embodiment, thereby improving the static pressure effect; the top of passageway formula back door structure 17 has set up the arc spigot surface, has increased the circulation efficiency of inside air current, has further promoted the cooling effect. Arrows in the figure indicate the airflow direction in the lower supply air data center micro-module structure, and when the hot air in the cabinet 11 is exhausted through the air outlet surface 13, the hot air is cooled to be cold air by the cooling back plate 18 and enters the channel type rear door structure 17; the cold air enters the internal static pressure box 16 through the channel type rear door structure 17 and the overhead space, enters the cabinet 11 through the air inlet surface 12, and takes away heat of the cabinet 11, and the existence of the arc-shaped guide surface enables the cold air to smoothly circulate in the channel type rear door structure 17.
In summary, the present invention provides a lower air supply data center micro-module structure, including: at least one group of cabinet group, inside static pressure case, a plurality of passageway formula back door structure, raised floor and a plurality of cooling backplate. The invention can meet the requirement that a plurality of high-heat-density servers are additionally arranged in the common under-floor fan sending room, and cools the hot air exhausted by the cabinet by introducing the cooling back plate, thereby saving the energy consumption of the fan at the tail end of the air conditioner, improving the heat dissipation efficiency of the cabinet and saving the space of the machine room.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (16)
1. The utility model provides a lower air supply data center micromodule structure which characterized in that includes:
the air outlet surface and the air inlet surface are respectively arranged on two sides of the cabinet group pair; the air inlet surfaces of the two cabinets in the cabinet group are adjacent;
the internal static pressure box is arranged between the two rows of cabinets and is connected with the air inlet surface of the cabinet;
the channel type rear door structures are respectively arranged at the outer sides of the air outlet surfaces of the cabinets; the channel type rear door structure is hollow in the interior, the bottom of the channel type rear door structure is provided with a first air outlet communicated with the interior of the channel type rear door structure, and the side surface of the channel type rear door structure is provided with a first air inlet communicated with the interior of the cabinet;
the overhead floor is arranged above the substrate in an overhead mode, and an overhead space is formed between the overhead floor and the substrate; the raised floor is positioned below the cabinet set, the internal plenum box and the channel-type rear door structure; the overhead floor is provided with a second air inlet and a second air outlet which are communicated with the overhead space, the second air outlet is positioned below the internal static pressure box, and the second air inlet is positioned below the first air outlet and is communicated with the first air outlet;
and the cooling back plates are respectively arranged on the air outlet surfaces of the cabinets.
2. The lower supply air data center micro-module structure of claim 1, further comprising an outlet air temperature sensor located within the tunnel back door structure.
3. The lower supply air data center micro-module structure of claim 2, wherein the outlet air temperature sensor is located at the first outlet air.
4. The lower supply air data center micro-module structure of claim 1, further comprising an inlet air temperature sensor located within the interior plenum box.
5. The lower plenum data center micro-module structure of claim 1, wherein the raised floor comprises a through hole floor having a plurality of through holes arranged at intervals on a surface thereof, the through holes located between the air inlet surfaces of two cabinets in the cabinet group serve as the second air outlet, and the through holes located below the first air outlet serve as the second air inlet.
6. The lower plenum data center micro-module structure of claim 1, wherein the raised floor comprises a through-hole floor having a surface with a plurality of through-holes and a plurality of vents; the plurality of ventilation openings are respectively positioned between the air inlet surfaces of the two cabinets in the cabinet group and below the first air outlet, the ventilation opening positioned between the air inlet surfaces of the two cabinets in the cabinet group is used as the second air outlet, and the ventilation opening positioned below the first air outlet is used as the second air inlet; the through holes are positioned at the periphery of the plurality of ventilation openings.
7. The lower plenum data center micro-module structure of claim 1, wherein the cooling backplane is a water cooled backplane or an air cooled backplane.
8. The lower supply air data center micro-module structure of claim 6, wherein a chilled water coil is mounted inside the water cooled backplane.
9. The lower plenum data center micro-module structure of claim 1, wherein a width of the channeled back door structure is equal to a width of the cabinet.
10. The lower plenum data center micro-module structure of claim 1, wherein the channeled back door structure is removably connected to the cabinet.
11. The lower plenum data center micro-module structure of claim 1, wherein a rubber gasket is disposed between the tunnel back door structure and the cabinet.
12. The lower plenum data center micro-module structure as recited in claim 1, wherein a top of the tunnel back door structure is an arcuate guide surface.
13. The lower plenum data center micro-module structure of claim 1, wherein a width of the cooling backplane is equal to a width of the cabinet outlet face, and a height of the cooling backplane is equal to a height of the cabinet outlet face.
14. The lower plenum data center micro-module structure of claim 1, wherein a width of the cabinet outlet face is the same as a width of the internal plenum box.
15. The downdraft data center micro-module structure of claim 1, wherein a depth of the internal plenum box is no less than twice a depth of the cabinet; the height of the internal static pressure box is not less than the height of the machine cabinet; the internal plenum box is of a cuboid structure.
16. The lower supply air data center micro-module structure of claim 1, wherein the return air channel is provided with a maintenance door communicating with the inside thereof.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100317278A1 (en) * | 2009-06-10 | 2010-12-16 | Blackrock, Inc. | Cooling System for a Computer Server Cabinet in a Data Center |
| JP2014191811A (en) * | 2013-03-28 | 2014-10-06 | Sanki Eng Co Ltd | Air conditioning system |
| CN105864883A (en) * | 2015-01-23 | 2016-08-17 | 上海宽带技术及应用工程研究中心 | Data center air supply system |
| CN106961817A (en) * | 2016-01-11 | 2017-07-18 | 上海宽带技术及应用工程研究中心 | The lower air-supply data center refrigeration system of one kind |
| CN208609318U (en) * | 2018-07-10 | 2019-03-15 | 上海宽带技术及应用工程研究中心 | Lower air-supply data center micromodule structure |
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2018
- 2018-07-10 CN CN201810751130.7A patent/CN110708921A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100317278A1 (en) * | 2009-06-10 | 2010-12-16 | Blackrock, Inc. | Cooling System for a Computer Server Cabinet in a Data Center |
| JP2014191811A (en) * | 2013-03-28 | 2014-10-06 | Sanki Eng Co Ltd | Air conditioning system |
| CN105864883A (en) * | 2015-01-23 | 2016-08-17 | 上海宽带技术及应用工程研究中心 | Data center air supply system |
| CN106961817A (en) * | 2016-01-11 | 2017-07-18 | 上海宽带技术及应用工程研究中心 | The lower air-supply data center refrigeration system of one kind |
| CN208609318U (en) * | 2018-07-10 | 2019-03-15 | 上海宽带技术及应用工程研究中心 | Lower air-supply data center micromodule structure |
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