CN110684643A - Temperature conduction system for nucleic acid amplification instrument - Google Patents

Temperature conduction system for nucleic acid amplification instrument Download PDF

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Publication number
CN110684643A
CN110684643A CN201911046941.8A CN201911046941A CN110684643A CN 110684643 A CN110684643 A CN 110684643A CN 201911046941 A CN201911046941 A CN 201911046941A CN 110684643 A CN110684643 A CN 110684643A
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temperature
refrigerating sheet
chip
real
heating cover
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CN110684643B (en
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沈小骞
任鲁风
隋硕
张未来
俞育德
于军
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Ningbo Xurui Biomedical Instruments Co Ltd
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Ningbo Xurui Biomedical Instruments Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L7/00Heating or cooling apparatus; Heat insulating devices
    • B01L7/52Heating or cooling apparatus; Heat insulating devices with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0887Laminated structure

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  • Health & Medical Sciences (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Hematology (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention provides a temperature conduction system for a nucleic acid amplification instrument, which comprises a fan module, a temperature detection module and a control module, wherein a fan module chip support is provided with a chip groove, a chip is arranged in the chip groove, a heating cover is covered above the chip support, and a first refrigerating sheet, a second refrigerating sheet, a radiating fin and a fan are sequentially arranged below the chip. The control module is connected with the temperature detection module and the fan module and used for receiving temperature information sent by the temperature detection module, controlling the lifting temperature of the heating cover, the first refrigerating sheet, the second refrigerating sheet and the radiating sheet and controlling the rotating speed of the fan. The temperature conduction system provided by the invention can detect the temperature change of each device in real time, analyze which device needs to be subjected to temperature adjustment in a layer-by-layer judgment mode without adjusting all devices, greatly reduce the difficulty of adjustment and control, and is favorable for realizing accurate control of the temperature of a chip, thereby improving the temperature control precision and the temperature control efficiency.

Description

Temperature conduction system for nucleic acid amplification instrument
Technical Field
The invention relates to the field of PCR temperature control, in particular to a temperature conduction system for a nucleic acid amplification instrument.
Background
The nucleic acid amplification technology, especially the digital Polymerase Chain Reaction (PCR) technology, is a molecular biological technology for amplifying specific DNA molecular fragment, which uses DNA molecule as template and uses a pair of artificially synthesized specific oligonucleotide primers to quickly amplify the specific DNA molecular fragment by means of DNA Polymerase enzymatic Reaction, and has extremely important action in biology. The basic process of PCR reaction is divided into three steps. Firstly, DNA denaturation (94 ℃) is carried out, and a double-stranded DNA template is broken by hydrogen bonds under the action of heat to form single-stranded DNA; step two, annealing (55 ℃), reducing the temperature of the system, and combining the primer and the DNA template to form a local double strand; and step three, extending (72 ℃) to synthesize a DNA chain complementary with the template by taking dNTP as a raw material to extend from the 5 end to the 3 end of the primer under the action of Taq enzyme. The PCR instrument is used for performing denaturation, annealing and polymerization treatment on the amplified DNA fragments by controlling samples to reach different temperatures so as to achieve the purpose of amplifying the quantity of the DNA fragments by times. Therefore, the accuracy of temperature control and the speed of temperature rise and fall directly affect the efficiency of DNA fragment amplification. And the final temperature control is performed on the heated chip, the temperature conduction system plays a crucial role. If the design of the temperature conduction system is not perfect, the temperature control precision of the chip can be directly influenced. In addition, the existing emerging digital PCR instrument needs to directly observe the chip from the upper part, so that the arrangement of a hot cover is often omitted, and the temperature control precision in the constant temperature process is undoubtedly not enough.
Chinese patent document (CN105573368A a temperature control method of a PCR instrument) discloses a temperature control method of a PCR instrument, comprising the following steps: the method comprises the following steps that firstly, three temperature sensors are adopted to detect the temperature of each part of the PCR instrument respectively; step two, temperature signal processing; thirdly, the PC calculates a proportional control coefficient, an integral control coefficient and a differential control coefficient by using a genetic algorithm according to the temperature deviation value and the change rate of the deviation, and sends a temperature control command to the main control chip; step four, receiving a control command and adjusting the temperature in real time; and step five, displaying the temperature control curve in real time. The invention can control the temperature of the base and the side wall of the sample base, thereby ensuring the uniformity of the temperature distribution of the sample base. However, the control process of the invention is complex, and the control precision still needs to be improved.
Disclosure of Invention
In order to solve the problems of low temperature control efficiency, insufficient temperature control precision and the like of the existing PCR instrument control system, the invention provides a brand-new temperature conduction system which can realize rapid and high-precision temperature control. The specific technical scheme of the invention is as follows:
a temperature conduction system for a nucleic acid amplification instrument comprises a fan module, a temperature detection module and a control module, and is characterized in that,
the fan module comprises a heating cover, a first refrigerating sheet, a second refrigerating sheet, a radiating fin and a fan; a chip groove is formed in the first refrigerating sheet, the chip is installed in the chip groove, the heating cover is covered above the first refrigerating sheet, a cavity is formed below the heating cover, an observation window is formed in the position, corresponding to the chip, of the heating cover, and the size of the observation window is set to be larger than the horizontal area of the chip but smaller than the horizontal area of the cavity; the second refrigerating sheet, the radiating sheet and the fan are sequentially arranged below the first refrigerating sheet;
the temperature detection module is connected with the fan module and used for detecting the temperatures of the chip, the heating cover body, the first refrigerating sheet, the second refrigerating sheet and the radiating sheet;
the control module is connected with the temperature detection module and the fan module and used for receiving temperature information sent by the temperature detection module, controlling the lifting temperature of the heating cover, the first refrigerating sheet, the second refrigerating sheet and the radiating sheet and controlling the rotating speed of the fan;
when the temperature of the control chip is increased, the temperature detection module detects the real-time temperature T1 of the chip, when the real-time temperature T1 of the chip is different from the set temperature T1 ' of the system, the real-time temperature T2 of the first refrigerating sheet is further detected, whether the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet is compared, and when the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet, the temperature T3 of the heating cover is adjusted;
when the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4', the heating cover temperature T3, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted.
Preferably, in the adjusting process, the temperature T3 of the heating cover is ensured to be not lower than the system set temperature T1 ', and if the temperature T3 of the heating cover needs to be reduced and cannot meet the requirement when the temperature is reduced to the system set temperature T1', the temperature T4 of the second cooling fin is further detected, and the subsequent steps are performed.
Preferably, when the temperature of the chip is raised, forward currents are conducted to the first refrigerating sheet and the second refrigerating sheet to heat the chip; the method for adjusting the temperature T2 of the first refrigeration piece and the temperature T4 of the second refrigeration piece comprises adjusting the magnitude of the supplied current to control the temperatures of the first refrigeration piece and the second refrigeration piece.
Preferably, when the chip is controlled to cool, reverse currents are conducted on the first refrigerating piece and the second refrigerating piece to cool the chip, the fan is turned on, the temperature detection module detects the real-time temperature T1 of the chip, when the real-time temperature T1 of the chip is different from the set temperature T1 ' of the system, the real-time temperature T2 of the first refrigerating piece is further detected, whether the real-time temperature T2 of the first refrigerating piece is the same as the set temperature T2 ' of the first refrigerating piece is compared, and when the real-time temperature T2 of the first refrigerating piece is the same as the set temperature T2 ' of the first refrigerating piece, the temperature T3 of the heating cover is adjusted;
when the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4 ', the real-time temperature T5 of the cooling fin is further detected, and when the real-time temperature T5 of the cooling fin is the same as the preset temperature T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted; when the real-time temperature T5 of the cooling fin is different from the preset temperature value T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling fin, the temperature T4 of the second cooling fin and the rotating speed n of the fan are adjusted.
Preferably, the bottom of the radiating fin is a fin-shaped radiating fin, and the fin-shaped radiating fins are connected through an elastic part;
the wing-shaped heat dissipation guide pieces on the two sides are respectively connected with the stretcher, the stretcher is sequentially connected with the motor and the control module, and the control module controls the motor to work to drive the stretcher to pull the wing-shaped heat dissipation guide pieces.
Preferably, in the process of cooling the chip, the rotating speed n of the fan is increased, and meanwhile, the control module controls the stretcher to stretch, so that the opening degree of the feather-fin heat dissipation fins at the bottoms of the heat dissipation fins is increased;
when the rotating speed n of the fan is reduced, the control module controls the stretcher to perform retraction operation, and the opening degree of the wing-shaped heat dissipation conducting piece is reduced through the elastic piece.
Preferably, the fin-shaped heat dissipation sheet on one side is connected with the stretcher, and the fin-shaped heat dissipation sheet on the other side is fixedly arranged.
Preferably, during the constant temperature phase of denaturation and/or annealing and/or extension, the temperature detection module detects the real-time air temperature T6 in the cavity below the heating cover, and adjusts the heating cover temperature T3 when the air temperature T6 is different from the set temperature T6'.
Preferably, the temperature detection module comprises at least 4 temperature detectors arranged at different positions in the cavity below the heating cover, and the average value of the temperatures measured by the temperature detectors is calculated and used as the real-time air temperature T6.
Compared with the prior art, the invention has the following beneficial effects:
(1) the temperature conduction system provided by the invention not only continues to use the traditional two-stage conduction system, but also arranges the heating cover above the chip, and the arrangement of the heating cover can ensure that the chip can realize constant temperature in each stage of denaturation, quenching and extension. The heat conduction system provided by the invention is used for a novel digital PCR instrument, so real-time observation is required, the chip cannot be completely sealed by the heating cover, otherwise, the reaction process cannot be observed in real time from the upper part, and therefore, an observation window is arranged above the heating cover, and the reaction condition in the chip can be observed in real time from the observation window.
(2) Furthermore, in order to prevent the observation window from influencing the heat preservation effect of the heating cover, the temperature of the heating cover is ensured to be not lower than the set temperature of the system, if the temperature of the heating cover is too low, other heating equipment is adjusted to control the temperature, and the chip can be further ensured to be rapidly controlled by the temperature.
(3) In addition, the bottom of the radiating fin can be provided with an elastic wing-shaped structure, the opening and closing degree of the wing-shaped structure can be adjusted through the stretcher, and when the stretcher retracts, the wing-shaped structure can be shrunk through the elastic part. Through the arrangement, the heat dissipation effect of the heat dissipation fins can be controlled more conveniently.
(4) The temperature conduction system provided by the invention can detect the temperature change of each device in real time, and analyze which device needs to be subjected to temperature adjustment in a layer-by-layer judgment mode, when the temperature detection of the next device does not find a problem, only the temperature of the previous layer of device needs to be adjusted, and all devices do not need to be adjusted, so that the adjustment control difficulty can be greatly reduced. Because only carry out temperature control to some firing equipment, more be favorable to realizing the accurate control to the chip temperature, therefore can improve the control by temperature change precision, improve control by temperature change efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a fan module provided by the present invention.
Fig. 2 is a schematic view of the structure of the heat sink provided by the present invention.
The specific meanings of the symbols in the drawings are as follows:
1: heating the cover; 2: a chip holder; 3: a first refrigeration sheet; 4: a second refrigeration sheet; 5: a heat sink; 6: a fan; 7: an observation window; 8: a fin-shaped heat dissipation sheet; 9: an elastic member; 10: a stretcher; 11: a motor; 12: and a control module.
Detailed Description
The following describes a temperature conduction system for a nucleic acid amplification apparatus according to the present invention with reference to specific embodiments. It is apparent that the implementation of the embodiments of the present invention is not limited to the specific details familiar to those skilled in the art. The following detailed description of preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to those detailed.
It should be noted that: the system set temperature T1' is the temperature set on the PCR instrument, and the PCR instrument can automatically calculate the initial temperature required to be adjusted by each device (the first refrigerating sheet 3, the second refrigerating sheet 4 and the radiating sheet 5) corresponding to each set temperature, and the temperature is the set temperature of each device. However, in the actual control process, due to the number of samples and the change of the environmental temperature, the set temperature often cannot be accurately controlled to directly reach the set temperature T1' on the PCR instrument. The temperature control system provided by the invention can solve the problems.
The embodiment provides a temperature conduction system for a nucleic acid amplification instrument, which comprises a fan module, a temperature detection module and a control module 12, wherein the fan module comprises a heating cover 1, a first refrigerating sheet 3, a second refrigerating sheet 4, a radiating fin 5, a fan 6 and a chip support 2; a chip groove is formed in the chip support 2, a chip is installed in the chip groove, the heating cover 1 is covered above the chip support 2, a cavity is arranged below the heating cover 1, an observation window 7 is formed in the position, corresponding to the chip, of the heating cover 1, and the size of the observation window 7 is set to be larger than the horizontal area of the chip but smaller than the horizontal area of the cavity; first refrigeration piece 3, second refrigeration piece 4 set gradually in the chip below, fin 5 and fan 6 set gradually in second refrigeration piece 4 below. The temperature detection module is connected with the fan module and is used for detecting the temperature of the chip, the cover body of the heating cover 1, the first refrigerating sheet 3, the second refrigerating sheet 4 and the radiating fin 5; the control module 12 is connected with the temperature detection module and the fan module, and is used for receiving the temperature information sent by the temperature detection module, controlling the lifting temperature of the heating cover 1, the first refrigeration sheet 3, the second refrigeration sheet 4 and the cooling fins 5, and controlling the rotating speed of the fan 6.
The temperature conduction system provided by the embodiment can realize temperature conduction through controlling the following three processes:
first is when control chip intensifies, temperature detection module detects chip real-time temperature T1, when chip temperature real-time temperature T1 is different with system set temperature T1 ', further detect the real-time temperature T2 of first refrigeration piece, and whether the real-time temperature T2 of contrast first refrigeration piece is the same with the temperature T2 ' of setting for of first refrigeration piece, when the real-time temperature T2 of first refrigeration piece is the same with the temperature T2 ' of setting for of first refrigeration piece, adjust the temperature T3 that heats the lid.
When the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4', the heating cover temperature T3, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted.
When the temperature of the chip is raised, forward currents are conducted to the first refrigerating sheet and the second refrigerating sheet so as to heat the chip; the method for adjusting the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate comprises adjusting the magnitude of the supplied current to control the temperatures of the first cooling plate and the second cooling plate.
It should be noted that, since the heating cover is used for heat preservation, the temperature T3 of the heating cover should be ensured not to be lower than the system set temperature T1 'in the adjusting process, and if the temperature T3 of the heating cover needs to be reduced and cannot meet the requirement when the temperature is reduced to the system set temperature T1', the temperature T4 of the second cooling plate is further detected, and the subsequent steps are performed.
Secondly, when the chip is controlled to cool, reverse currents are conducted on the first refrigerating sheet and the second refrigerating sheet to cool the chip, the fan is turned on, the temperature detection module detects the real-time temperature T1 of the chip, when the real-time temperature T1 of the chip is different from the set temperature T1 ' of the system, the real-time temperature T2 of the first refrigerating sheet is further detected, whether the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet is compared, and when the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet, the temperature T3 of the heating cover is adjusted;
when the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4 ', the real-time temperature T5 of the cooling fin is further detected, and when the real-time temperature T5 of the cooling fin is the same as the preset temperature T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted; when the real-time temperature T5 of the cooling fin is different from the preset temperature value T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling fin, the temperature T4 of the second cooling fin and the rotating speed n of the fan are adjusted.
In the embodiment, the bottom of the radiating fin is provided with the heat dissipation guide fins 8 in a shape of a wing, and the heat dissipation guide fins 8 are connected through the elastic part 9; the wing-shaped heat dissipation guide pieces 8 on the two sides are respectively connected with the stretcher 10, the stretcher 10 is sequentially connected with the motor 11 and the control module 12, and the control module 12 controls the motor 11 to work to drive the stretcher 10 to pull the wing-shaped heat dissipation guide pieces 8. In the process of cooling the chip, the rotating speed n of the fan is increased, and meanwhile, the control module 12 controls the stretcher 10 to stretch, so that the opening degree of the feather-fin heat dissipation fins 8 at the bottoms of the heat dissipation fins is increased; when the rotating speed n of the fan is reduced, the control module 12 controls the stretcher 10 to perform retraction operation, and the opening degree of the wing-shaped heat dissipation fins 8 is reduced by the elastic piece 9. The degree of opening is bigger, and then the radiating efficiency is higher. Therefore, the radiating process of the chip can be effectively controlled by arranging the radiating fin with the wing-shaped structure.
Thirdly, in the constant temperature stage of denaturation and/or annealing and/or extension, constant temperature needs to be realized through the heating cover, the temperature detection module comprises at least 4 temperature detectors which are arranged at different positions in the cavity below the heating cover, and the average value of the temperatures detected by the temperature detectors is calculated and used as the real-time air temperature T6. The temperature detection module detects real-time air temperature T6 in the cavity below the heating cover, and adjusts the temperature T3 of the heating cover when the air temperature T6 is different from the set temperature T6'. Through the arrangement, the temperature control in the constant temperature stage can be effectively realized, and the temperature can be ensured to be stabilized at the set temperature in any stage of denaturation and/or annealing and/or extension.
Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "component" and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.

Claims (9)

1. A temperature conduction system for a nucleic acid amplification instrument comprises a fan module, a temperature detection module and a control module, and is characterized in that,
the fan module comprises a heating cover, a first refrigerating sheet, a second refrigerating sheet, a radiating fin, a fan and a chip support; the chip support is provided with a chip groove, the chip is arranged in the chip groove, the heating cover is covered above the chip support, a cavity is arranged below the heating cover, the position of the heating cover corresponding to the chip is provided with an observation window, and the size of the observation window is set to be larger than the horizontal area of the chip but smaller than the horizontal area of the cavity; the first refrigerating piece and the second refrigerating piece are sequentially arranged below the chip, and the radiating fin and the fan are sequentially arranged below the second refrigerating piece;
the temperature detection module is connected with the fan module and used for detecting the temperatures of the chip, the heating cover body, the first refrigerating sheet, the second refrigerating sheet and the radiating sheet;
the control module is connected with the temperature detection module and the fan module and used for receiving temperature information sent by the temperature detection module, controlling the lifting temperature of the heating cover, the first refrigerating sheet, the second refrigerating sheet and the radiating sheet and controlling the rotating speed of the fan;
when the temperature of the control chip is increased, the temperature detection module detects the real-time temperature T1 of the chip, when the real-time temperature T1 of the chip is different from the set temperature T1 ' of the system, the real-time temperature T2 of the first refrigerating sheet is further detected, whether the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet is compared, and when the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet, the temperature T3 of the heating cover is adjusted;
when the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4', the heating cover temperature T3, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted.
2. A temperature conduction system for a nucleic acid amplification apparatus according to claim 1,
and in the adjusting process, the temperature T3 of the heating cover is ensured to be not lower than the system set temperature T1 ', if the temperature T3 of the heating cover needs to be reduced and cannot meet the requirement when the temperature is reduced to the system set temperature T1', the temperature T4 of the second refrigerating sheet is further detected, and the subsequent steps are carried out.
3. A temperature conduction system for a nucleic acid amplification apparatus according to claim 1,
when the temperature of the chip is raised, forward currents are conducted to the first refrigerating sheet and the second refrigerating sheet so as to heat the chip; the method for adjusting the temperature T2 of the first refrigeration piece and the temperature T4 of the second refrigeration piece comprises adjusting the magnitude of the supplied current to control the temperatures of the first refrigeration piece and the second refrigeration piece.
4. A temperature conduction system for a nucleic acid amplification apparatus according to claim 1,
when the chip is controlled to cool, reverse currents are conducted on the first refrigerating sheet and the second refrigerating sheet to cool the chip, the fan is turned on at the same time, the temperature detection module detects the real-time temperature T1 of the chip, when the real-time temperature T1 of the chip is different from the set temperature T1 ' of the system, the real-time temperature T2 of the first refrigerating sheet is further detected, whether the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet is compared, and when the real-time temperature T2 of the first refrigerating sheet is the same as the set temperature T2 ' of the first refrigerating sheet, the temperature T3 of the heating cover is adjusted;
when the real-time temperature T2 of the first refrigerating sheet is different from the set temperature T2 ' of the first refrigerating sheet, the temperature T4 of the second refrigerating sheet is further detected, the temperature T4 of the second refrigerating sheet is compared with the set temperature T4 ', and when the temperature T4 of the second refrigerating sheet is the same as the set temperature T4 ', the temperature T3 of the heating cover and the temperature T2 of the first refrigerating sheet are adjusted; when the temperature T4 of the second cooling plate is different from the set temperature T4 ', the real-time temperature T5 of the cooling fin is further detected, and when the real-time temperature T5 of the cooling fin is the same as the preset temperature T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling plate and the temperature T4 of the second cooling plate are adjusted; when the real-time temperature T5 of the cooling fin is different from the preset temperature value T5', the temperature T3 of the heating cover, the temperature T2 of the first cooling fin, the temperature T4 of the second cooling fin and the rotating speed n of the fan are adjusted.
5. The temperature transfer system for a nucleic acid amplification apparatus according to claim 4, wherein the bottom of the heat sink is a heat sink having a wing shape, and the heat sink having the wing shape is connected to the heat sink via an elastic member;
the wing-shaped heat dissipation guide pieces on the two sides are respectively connected with the stretcher, the stretcher is sequentially connected with the motor and the control module, and the control module controls the motor to work to drive the stretcher to pull the wing-shaped heat dissipation guide pieces.
6. The temperature transmission system for a nucleic acid amplification instrument according to claim 5, wherein in the process of cooling the chip, the rotating speed n of the fan is increased, and the control module controls the stretcher to stretch, so that the opening and closing degree of the feather-shaped heat dissipation fins at the bottom of the heat dissipation fins is increased;
when the rotating speed n of the fan is reduced, the control module controls the stretcher to perform retraction operation, and the opening degree of the wing-shaped heat dissipation conducting piece is reduced through the elastic piece.
7. The temperature transfer system for a nucleic acid amplification apparatus according to claim 5, wherein the heat-radiating fin of one side is connected to the stretcher, and the heat-radiating fin of the other side is fixedly disposed.
8. The temperature conduction system for a nucleic acid amplification apparatus according to claim 1, wherein the temperature detection module detects a real-time air temperature T6 in the cavity under the heating cover during the constant temperature stage of denaturation and/or annealing and/or extension, and adjusts the heating cover temperature T3 when the air temperature T6 is different from the set temperature T6'.
9. The temperature conduction system for a nucleic acid amplification apparatus according to claim 8, wherein the temperature detection module comprises at least 4 temperature detectors disposed at different positions in the cavity under the heating cover, and the average of the temperatures measured by the temperature detectors is calculated as the real-time air temperature T6.
CN201911046941.8A 2019-10-30 2019-10-30 Temperature conduction system for nucleic acid amplification instrument Active CN110684643B (en)

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