CN110645689A - Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner - Google Patents
Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005338 heat storage Methods 0.000 claims abstract description 170
- 230000017525 heat dissipation Effects 0.000 claims abstract description 28
- 238000005057 refrigeration Methods 0.000 claims abstract description 22
- 238000012546 transfer Methods 0.000 claims description 25
- 239000003507 refrigerant Substances 0.000 claims description 11
- 238000004590 computer program Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 abstract description 6
- 239000002826 coolant Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000013459 approach Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F12/00—Use of energy recovery systems in air conditioning, ventilation or screening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/50—Control or safety arrangements characterised by user interfaces or communication
- F24F11/61—Control or safety arrangements characterised by user interfaces or communication using timers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/64—Electronic processing using pre-stored data
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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Abstract
The invention discloses a heat collecting and utilizing device and method for improving energy utilization rate and a semiconductor air conditioner. Wherein, the device includes: a semiconductor refrigeration module; the heat dissipation module is contacted with the hot end of the semiconductor refrigeration module and is used for dissipating heat generated by the hot end of the semiconductor refrigeration module; the heat storage module is connected with the heat dissipation module through a heat exchange tube and used for absorbing and storing heat dissipated by the heat dissipation module, and an inlet end and an outlet end are arranged on the heat storage module, so that a heat conducting medium enters the heat storage module through the inlet end and is discharged through the outlet end after exchanging heat with the heat storage module. The invention can reasonably and effectively utilize the heat generated by the semiconductor air conditioner during refrigeration, improve the energy utilization rate, and simultaneously discharge the heat in time, avoid heat accumulation and ensure the normal operation of the semiconductor air conditioner.
Description
Technical Field
The invention relates to the technical field of air conditioners, in particular to a heat collecting and utilizing device and method for improving energy utilization rate and a semiconductor air conditioner.
Background
In recent years, with the development of materials and the development of air conditioners, a new semiconductor is now being developed on the market, and a power supply is connected to the semiconductor, so that one side of the semiconductor can be used for cooling and the other side can be used for heating. By utilizing the characteristics of the semiconductor, a semiconductor air conditioner is developed. In the patent application CN201611061502.0, an energy-saving air conditioning device is disclosed, in which the heat of a heat dissipation module is used for thermoelectric generation to convert heat energy into electric energy to supply power to semiconductor refrigeration sheets, but in the process of converting heat energy into electric energy, because the energy conversion efficiency is limited, a part of energy still can be lost, and the heat energy cannot be effectively and reasonably utilized.
Aiming at the problem that the heat generated by refrigerating by using a semiconductor is not reasonably and effectively utilized in the prior art, an effective solution is not provided at present.
Disclosure of Invention
The embodiment of the invention provides a heat collecting and utilizing device and method for improving energy utilization rate and a semiconductor air conditioner, and aims to solve the problem that heat generated by refrigerating a semiconductor is not reasonably and effectively utilized in the prior art.
In order to solve the above technical problem, the present invention provides a heat collecting and utilizing device, wherein the device comprises:
a semiconductor refrigeration module;
the heat dissipation module is contacted with the hot end of the semiconductor refrigeration module and is used for dissipating heat generated by the hot end of the semiconductor refrigeration module;
the heat storage module is connected with the heat dissipation module through a heat exchange tube and used for absorbing and storing heat dissipated by the heat dissipation module, and the heat storage module is also provided with an inlet end and an outlet end, so that a heat-conducting medium enters the heat storage module through the inlet end and is discharged through the outlet end after heat exchange is carried out on the heat storage module.
Further, the heat exchange pipe includes: the heat exchange tube includes: the heat storage module comprises a heat exchange inlet pipe and a heat exchange outlet pipe, heat is transferred to the heat storage module through secondary refrigerant flowing in the heat exchange inlet pipe, and the secondary refrigerant flows back to the heat dissipation module through the heat exchange outlet pipe.
Furthermore, a first temperature sensor is arranged in the heat exchange inlet pipe and used for detecting the internal temperature of the heat exchange inlet pipe, and a second temperature sensor is arranged in the heat exchange outlet pipe and used for detecting the internal temperature of the heat exchange outlet pipe.
Further, the heat storage module internally comprises a heat storage medium, and the heat storage medium absorbs and stores the heat emitted by the heat dissipation module.
Further, a third temperature sensor is arranged inside the heat storage module and used for detecting the temperature of the heat storage medium inside the heat storage module.
Furthermore, the inlet end of the heat storage module is connected with the inlet pipeline of the heat conducting medium, the outlet end of the heat storage module is connected with the outlet pipeline of the heat conducting medium, and a valve is arranged on the inlet pipeline of the heat conducting medium and used for controlling whether the heat conducting medium enters the heat storage module or not through conduction and closing.
Further, the heat transfer medium includes: a liquid heat transfer medium and a gaseous heat transfer medium.
The invention also provides a semiconductor air conditioner which comprises the heat collecting and utilizing device.
The invention also provides a heat collection and utilization method for improving the energy utilization rate, wherein the method comprises the following steps:
acquiring the temperature of the heat exchange tube and the temperature of the heat storage medium; the temperature of the heat exchange pipe comprises the internal temperature of a heat exchange inlet pipe and the internal temperature of a heat exchange outlet pipe, and the heat storage medium is arranged inside the heat storage module;
and if the internal temperature of the heat exchange inlet pipe, the internal temperature of the heat exchange outlet pipe and the temperature of the heat storage medium meet any one of a first preset condition, a second preset condition or a third preset condition, controlling the conduction of an inlet pipeline of a heat conduction medium so that the heat conduction medium enters the heat storage module and exchanges heat with the heat storage module.
Further, the first preset condition is that: a first difference value between the internal temperature of the heat exchange inlet pipe and the internal temperature of the heat exchange outlet pipe is smaller than a first preset difference value;
the second preset condition is as follows: a second difference value between the internal temperature of the heat exchange inlet pipe and the temperature of the heat storage medium is smaller than a second preset difference value;
the third preset condition is as follows: the ratio of the third difference value to the preset time is greater than a preset threshold value;
the third difference is the difference between the temperatures of the heat storage medium obtained twice in succession, and the preset time is the time interval between the temperatures of the heat storage medium obtained twice in succession.
Further, the control of the conduction of the inlet pipeline of the heat-conducting medium comprises the following steps:
controlling the valve to be conducted; wherein, the valve is arranged on an inlet pipeline of the heat-conducting medium.
The invention also provides a computer-readable storage medium, on which a computer program is stored, which program, when being executed by a processor, carries out the above-mentioned method.
By applying the technical scheme of the invention, the heat storage module is arranged to absorb and store the heat generated during the refrigeration of the semiconductor, the inlet end and the outlet end are arranged on the heat storage module and used for enabling the heat-conducting medium to enter the heat storage module and to be discharged after heat exchange with the heat storage module, the heat is discharged through the heat-conducting medium and used for heating other objects, and the heat generated during the refrigeration of the semiconductor air conditioner is reasonably and effectively utilized through the heat exchange mode, so that the energy utilization rate is improved, meanwhile, the heat can be timely discharged, the heat accumulation is avoided, and the normal operation of the semiconductor air conditioner is ensured.
Drawings
Fig. 1 is a structural view of a heat collection utilization device according to an embodiment of the present invention;
fig. 2 is a structural view of a heat storage module of the heat collection and utilization device according to the embodiment of the present invention;
FIG. 3 is a block diagram of a heat collection and utilization device according to another embodiment of the present invention;
fig. 4 is a structural view of a heat storage module of a heat collection utilization apparatus according to another embodiment of the present invention;
fig. 5 is a flow chart of a heat collection and utilization method according to an embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the examples of the present invention and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, and "a plurality" typically includes at least two.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be understood that although the terms first, second, third, etc. may be used to describe the preset difference values in the embodiments of the present invention, the preset difference values should not be limited to these terms. These terms are only used to distinguish between different preset difference values. For example, the first preset difference may also be referred to as a second preset difference, and similarly, the second preset difference may also be referred to as a first preset difference without departing from the scope of the embodiments of the present invention.
The words "if", as used herein, may be interpreted as "at … …" or "at … …" or "in response to a determination" or "in response to a detection", depending on the context. Similarly, the phrases "if determined" or "if detected (a stated condition or event)" may be interpreted as "when determined" or "in response to a determination" or "when detected (a stated condition or event)" or "in response to a detection (a stated condition or event)", depending on the context.
It is also noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in the article or device in which the element is included.
Alternative embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Example 1
Fig. 1 is a structural view of a heat collecting and utilizing device according to an embodiment of the present invention, and as shown in fig. 1, the device includes:
a semiconductor refrigeration module 1; the heat dissipation module 2 is in contact with the hot end 11 of the semiconductor refrigeration module 1 and is used for dissipating heat generated by the hot end 11 of the semiconductor refrigeration module 1; the heat storage module 3 is connected with the heat dissipation module 2 through the heat exchange tube 4 and used for absorbing and storing heat dissipated by the heat dissipation module 2, during specific implementation, secondary refrigerant is contained in the heat exchange tube, the heat dissipated by the heat dissipation module 2 is transmitted to the heat storage module 3 through the circulation flow of the secondary refrigerant, the heat storage module 3 is provided with an inlet end 31 and an outlet end 32, so that a heat-conducting medium enters the heat storage module 3 and is discharged after heat exchange with the heat storage module 3, and the discharged heat-conducting medium can be used for heating objects.
Fig. 2 is a structural diagram of a heat storage module of a heat collection and utilization apparatus according to an embodiment of the present invention, as shown in fig. 2, the heat storage module 3 includes an inlet end 31 and an outlet end 32 of a heat transfer medium, a pipeline 33 for flowing the heat transfer medium, a coolant inlet 34 and a coolant outlet 35, and a coolant flow pipeline 36, the pipeline 33 for flowing the heat transfer medium exchanges heat with the coolant flow pipeline 36, the coolant enters the coolant flow pipeline 36 through the coolant inlet 34 and is discharged through the coolant outlet 35, the heat transfer medium enters the pipeline 33 for flowing the heat transfer medium through the inlet end 31 and is discharged through the outlet end 32 after exchanging heat with the coolant flow pipeline 36.
Through the mode of heat transfer, the heat that produces when making semiconductor air conditioner refrigeration obtains reasonable effective utilization, can make the heat discharge in time simultaneously, avoids the heat accumulation, guarantees semiconductor air conditioner normal operating.
Example 2
In this embodiment, another heat collecting and utilizing device for improving energy utilization ratio is provided, and fig. 3 is a structural diagram of the heat collecting and utilizing device according to the embodiment of the present invention, as shown in fig. 3, in the semiconductor air conditioner, the semiconductor refrigeration module further includes: the thermoelectric couple 12, cold junction 13 to produce cold quantity, the said semiconductor system module utilizes P-N junction made of semiconductor material, refrigerate through direct current that both ends apply, turn the electric energy into the heat energy directly, a P-type semiconductor component and a N-type semiconductor component connect into the thermoelectric couple 12, after connecting with the direct current power supply, will produce temperature difference and heat transfer at the joint, when the current is from N → P direction, the joint will absorb heat, form the cold junction 13; when the current is in the direction of P → N, heat is released to form a hot end 11, and when the semiconductor module is applied to an air conditioner, as shown in FIG. 3, a fan 14 is arranged at the cold end 13 of the semiconductor refrigeration module 1 of the semiconductor air conditioner, and the fan 14 rotates to enable the cold end 13 of the semiconductor refrigeration module 1 to exchange heat with return air, absorb heat, produce cold air and blow out the cold air from an air outlet; the hot end 11 of the semiconductor refrigeration module 1 transfers heat to the heat storage module 3 through the heat exchange tube connected with the heat storage module, stores the heat through the heat storage medium, and opens the inlet pipeline of the heat conducting medium of the heat storage module when the stored heat is needed, so that the heat conducting medium absorbs the heat stored in the heat storage module through the pipeline.
In order to make the heat-transferring coolant capable of being circulated, in some embodiments, the heat exchange tubes further include: the heat exchange inlet pipe 41 is communicated with the secondary refrigerant inlet 34 in the embodiment 1, the heat exchange outlet pipe 42 is communicated with the secondary refrigerant outlet 35 in the embodiment 1, heat is transferred to the heat storage module 3 through the secondary refrigerant flowing in the heat exchange inlet pipe 41, the secondary refrigerant flows back to the heat dissipation module 2 through the heat exchange outlet pipe 42, the heat generated by the semiconductor refrigeration module 1 can be timely discharged through the heat exchange inlet pipe 41, the secondary refrigerant with the reduced temperature flows back to the heat dissipation module 2 through the heat exchange outlet pipe 42, the heat of the heat dissipation module 2 is continuously absorbed, and then the heat is transferred to the heat storage module 3, so that the cyclic utilization is realized.
In order to obtain the temperature inside the heat exchange inlet pipe 41 and the heat exchange outlet pipe 42 and further obtain the heat storage condition inside the heat storage module 3, in some embodiments, based on the above heat collecting and utilizing device, a first temperature sensor is further disposed in the heat exchange inlet pipe 41 and is used for detecting the internal temperature of the heat exchange inlet pipe 41, a second temperature sensor is disposed in the heat exchange outlet pipe 42 and is used for detecting the internal temperature of the heat exchange outlet pipe 42, the first temperature sensor and the second temperature sensor are disposed to obtain the internal temperature of the heat exchange inlet pipe 41 and the heat exchange outlet pipe 42, so as to control whether the heat transfer medium enters the heat storage module 3 and exchanges heat with the heat storage module 3 according to the internal temperature of the heat exchange inlet pipe 41 and the heat exchange outlet pipe 42, specifically, when a first difference between the internal temperature of the heat exchange inlet pipe 41 and the internal temperature of the heat exchange outlet pipe 42 is smaller than a first, that is, the temperature difference between the inside of the heat exchange inlet pipe 41 and the inside of the heat exchange outlet pipe 42 has been reduced to a value below a certain value, which indicates that the heat energy stored in the heat storage module 3 is close to or reaches the upper limit, and no more heat energy can be stored, at this time, the heat transfer medium is controlled to enter the heat storage module 3, and heat exchange is performed with the heat storage module 3, so that the heat stored in the heat storage module 3 is controlled to enter the heat storage module 3 in time, so as to exchange heat with the heat storage module 3, and take away the heat stored in the heat storage module 3 in time, thereby improving the utilization efficiency of heat, and simultaneously, the heat stored in the heat storage module 3 can be consumed in time, so as to continue to absorb the heat emitted by the heat dissipation module 2, and ensure the normal operation.
Fig. 4 is a structural view of a heat storage module of a heat collection and utilization apparatus according to another embodiment of the present invention, in order to obtain better heat storage effect and ensure that the heat absorbed by the heat storage module 3 is not released to the surrounding environment, as shown in fig. 4, in some embodiments, the heat storage module 3 includes a heat storage medium 37 inside, and the heat storage medium 37 fills the space formed between the pipe 33 through which the thermal medium flows and the flow pipe 36 of the coolant in embodiment 1, in other embodiments of the present invention, the heat storage medium 37 may also be disposed in other ways, for example, outside the flow pipe 36 of the coolant, and the present invention is not particularly limited, and the heat emitted by the heat dissipation module 2 is absorbed and stored by the heat storage medium, and the heat emitted by the heat dissipation module 2 can be absorbed and stored by the heat storage medium 37, this ensures that the heat is stored in the heat storage medium 37 in a concentrated manner and is not released into the surroundings.
In order to obtain the temperature of the heat storage medium 37 inside the heat storage module 3 and further obtain the heat storage condition inside the heat storage module 3, in some embodiments, a third temperature sensor is disposed inside the heat storage module 3 and is used for detecting the temperature of the heat storage medium 37 inside the heat storage module 3, and by providing the third temperature sensor, whether a heat conducting medium enters the heat storage module 3 or not can be controlled according to the temperature of the heat storage medium 37 to exchange heat with the heat storage module 3, specifically, when a second difference between the internal temperature of the heat exchange inlet pipe 41 and the temperature of the heat storage medium 37 is smaller than a second preset difference, or a ratio of a third difference between the temperature of the heat storage medium 37 obtained twice and a time interval between the temperature of the heat storage medium 37 obtained twice continuously is larger than a preset threshold, that is, the temperature difference between the inside of the heat exchange inlet pipe 41 and the heat storage medium 37 is reduced to be below a certain value, or the temperature rise rate of the heat storage medium Reduce below a certain definite value, show that the heat energy that thermal storage module 3 stored is close or reach the upper limit, can not continue to store more heat energy, at this moment, control heat-conducting medium and get into thermal storage module 3 gets into thermal storage module 3, with thermal storage module 3 carries out the heat transfer, has realized that the heat energy of storing at thermal storage module 3 is close or when reaching the upper limit, control heat-conducting medium in time gets into thermal storage module 3, carries out the heat transfer with thermal storage module 3, in time takes away the heat that thermal storage module 3 stored, improves thermal utilization efficiency, simultaneously, can make the heat that thermal storage module 3 stored in time consumed to in order to continue to absorb the heat that radiating module 2 gived off, guarantee semiconductor air conditioner normal operating.
In order to enable an external heat-conducting medium to enter the pipeline and be discharged out of the heat storage module 3, so as to form a heat exchange cycle, and control the time when the heat-conducting medium enters, so as to ensure the normal operation of the semiconductor air conditioner, in some embodiments, the inlet end of the heat storage module 3 is connected with the heat-conducting medium entering pipeline, the outlet end of the heat storage module 3 is connected with the heat-conducting medium discharging pipeline, a valve 5 is further arranged on the heat-conducting medium entering pipeline, so as to control whether the heat-conducting medium enters the heat storage module 3 through conduction and closing, and the controllability whether the heat-conducting medium enters the heat storage module 3 is realized by arranging the valve 5 on the heat-conducting medium entering pipeline.
In order to improve the efficiency of utilizing the heat stored in the thermal storage module 3, in some embodiments, the heat transfer medium includes: the heat conducting medium may be water, water with a low external temperature enters the heat storage module 3, the temperature of the water is raised after the water exchanges heat with the heat storage medium 37 storing heat, the water with the raised temperature can be directly used as hot water for family life, washing articles and the like, or the water with the raised temperature can be connected into another circulation pipeline to exchange heat with other cold sources so as to raise the temperature of other cold sources, for example, the heat conducting medium may be air, a wind field is established, a fan is used for driving the air to flow, the heat storage module 3 is positioned in the wind field, the flowing air absorbs the heat of the heat storage module 3 after flowing into the heat storage module 3 and becomes flowing hot air, and the flowing hot air can be used for household life, such as drying clothes, or guiding the flowing hot air into a room for heating and the like.
Example 3
The embodiment provides a semiconductor air conditioner, including above-mentioned heat collection utilization equipment who improves energy utilization rate for promote conductor air conditioner's energy utilization efficiency, and guarantee semiconductor air conditioner normal operating.
Example 4
Fig. 5 is a flowchart of a heat collection and utilization method according to an embodiment of the present invention, and as shown in fig. 5, the method includes:
s501, acquiring the temperature of a heat exchange tube and the temperature of a heat storage medium; the temperature of the heat exchange pipe comprises the internal temperature of a heat exchange inlet pipe and the internal temperature of a heat exchange outlet pipe, and the heat storage medium is arranged inside the heat storage module;
during specific implementation, the internal temperature of the heat exchange inlet pipe is obtained through the first temperature sensor, the internal temperature of the heat exchange outlet pipe is obtained through the second temperature sensor, and the temperature of the heat storage medium is obtained through the third temperature sensor, wherein the first temperature sensor is arranged inside the heat exchange inlet pipe, the second temperature sensor is arranged inside the heat exchange outlet pipe, and the third temperature sensor is arranged inside the heat storage module and can be in contact with the heat storage medium.
S502, if the internal temperature of the heat exchange inlet pipe, the internal temperature of the heat exchange outlet pipe and the temperature of the heat storage medium meet any one of a first preset condition, a second preset condition or a third preset condition, controlling the conduction of an inlet pipeline of a heat conduction medium so that the heat conduction medium enters the heat storage module to exchange heat with the heat storage module.
In specific implementation, the first preset condition is as follows: when the first difference value between the internal temperature of the heat exchange inlet pipe and the internal temperature of the heat exchange outlet pipe is smaller than the first preset difference value, namely the temperature difference between the inside of the heat exchange inlet pipe and the inside of the heat exchange outlet pipe is reduced to be below a certain value, the fact that the heat energy stored by the heat storage module approaches or reaches the upper limit and cannot be stored continuously is shown, at the moment, the heat-conducting medium is controlled to enter the heat storage module to exchange heat with the heat storage module, the heat-conducting medium is controlled to enter the heat storage module in time to exchange heat with the heat storage module when the heat energy stored by the heat storage module approaches or reaches the upper limit, the heat-conducting medium is controlled to enter the heat storage module in time to exchange heat with the heat storage module, the heat stored by the heat storage module is taken away in time, the utilization efficiency of the heat is improved, and, the heat stored in the heat storage module can be consumed in time so as to continuously absorb the heat emitted by the heat dissipation module and ensure the normal operation of the semiconductor air conditioner.
The second preset condition is as follows: when the second difference value between the internal temperature of the heat exchange inlet pipe and the temperature of the heat storage medium is smaller than the second preset difference value, namely the temperature difference between the internal temperature of the heat exchange inlet pipe and the temperature of the heat storage medium is reduced to be below a certain value, the fact that the heat energy stored by the heat storage module approaches or reaches the upper limit and cannot be stored continuously is shown, at the moment, the heat conduction medium is controlled to enter the heat storage module to exchange heat with the heat storage module, the heat conduction medium is controlled to enter the heat storage module in time to exchange heat with the heat storage module when the heat energy stored by the heat storage module approaches or reaches the upper limit, the heat conduction medium is controlled to enter the heat storage module in time to exchange heat with the heat storage module, the heat stored by the heat storage module is taken away in time, the utilization efficiency of the heat is improved, and meanwhile, the heat stored by the heat storage module can be, so as to continuously absorb the heat emitted by the heat dissipation module and ensure the normal operation of the semiconductor air conditioner.
The third preset condition is as follows: the ratio of the third difference value to the preset time is greater than a preset threshold value;
when the ratio of the third difference value of the temperature difference between the two continuous heat storage media to the time interval between the two continuous heat storage media is greater than a preset threshold value, the temperature rise rate of the heat storage media is reduced to be below a certain value, which indicates that the heat energy stored in the heat storage module approaches or reaches an upper limit and further heat energy cannot be stored, at this time, the heat conducting medium is controlled to enter the heat storage module to exchange heat with the heat storage module, so that when the heat energy stored in the heat storage module approaches or reaches the upper limit, the heat conducting medium is controlled to enter the heat storage module in time to exchange heat with the heat storage module, and the heat energy stored in the heat storage module is taken away in time, the heat utilization efficiency is improved, and meanwhile, the heat stored in the heat storage module can be consumed in time so as to continuously absorb the heat emitted by the heat dissipation module and ensure the normal operation of the semiconductor air conditioner.
In specific implementation, a temperature sensor is respectively arranged inside the heat exchange outlet pipe, the heat exchange outlet pipe and the heat storage module, the temperature sensor can be a temperature sensing bag, the internal temperature of the heat exchange inlet pipe is T1, the internal temperature of the heat exchange outlet pipe is T2, the temperature of the heat storage medium is T0, the temperature of the heat storage medium is obtained and stored once every preset time delta T, the difference delta T0 between the current temperature T0 of the heat storage medium and the temperature T0 'of the heat storage medium read last time is calculated, the difference between the internal temperature T1 of the heat exchange and the internal temperature T2 of the heat exchange inlet pipe is calculated, the difference between the internal temperature T1 of the heat exchange inlet pipe and the temperature T0 of the heat storage medium is calculated, and the ratio between the difference delta T0 between the current temperature T0 of the heat storage medium and the temperature T0' of the heat storage medium read last time and the preset time delta T is calculated, namely the temperature rise rate of the heat storage, if:
T1-T2 is more than C1, T1-T0 is more than C2, and Delta T0/[ Delta ] T is more than C3, wherein C1, C2 and C3 are preset constants, and when any one of the conditions is met, the heat storage medium is basically close to a state incapable of continuously storing heat energy, and the heat storage module cannot exchange heat with a heat dissipation module of the semiconductor air conditioner at the moment, so that the semiconductor air conditioner cannot normally run in a cooling mode, and therefore the conduction of an inlet pipeline of the heat conduction medium is automatically controlled at the moment, the heat conduction medium enters the heat storage module and exchanges heat with the heat storage module, and the normal running of the semiconductor air conditioner is guaranteed.
When the specific implementation, control heat-conducting medium's entering pipeline and lead to, include: the valve that the control set up on the entering pipeline of heat-conducting medium switches on, and then makes the entering pipeline of heat-conducting medium switch on, and the heat-conducting medium gets into the heat accumulation module, carries out the heat transfer with the heat accumulation module to take away the heat that the heat accumulation module stored.
The heat collection and utilization method of the embodiment controls the on and off of the valve by acquiring the internal temperature of the heat exchange inlet pipe, the internal temperature of the heat exchange outlet pipe and the temperature of the heat storage medium, and controlling the heat conduction medium to enter the heat storage module and exchange heat with the heat storage module according to the difference value between the internal temperature of the heat exchange inlet pipe and the internal temperature of the heat exchange outlet pipe, the difference value between the internal temperature of the heat exchange inlet pipe and the temperature of the heat storage medium and the heating rate of the heat storage medium.
Example 5
The present embodiments provide a computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the above-described method.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Through the above description of the embodiments, those skilled in the art will clearly understand that each embodiment can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware. With this understanding in mind, the above-described technical solutions may be embodied in the form of a software product, which can be stored in a computer-readable storage medium such as ROM/RAM, magnetic disk, optical disk, etc., and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the methods described in the embodiments or some parts of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (12)
1. A heat collection and utilization device, comprising:
a semiconductor refrigeration module;
the heat dissipation module is contacted with the hot end of the semiconductor refrigeration module and is used for dissipating heat generated by the hot end of the semiconductor refrigeration module;
the heat storage module is connected with the heat dissipation module through a heat exchange tube and used for absorbing and storing heat dissipated by the heat dissipation module, and the heat storage module is also provided with an inlet end and an outlet end, so that a heat-conducting medium enters the heat storage module through the inlet end and is discharged through the outlet end after heat exchange is carried out on the heat storage module.
2. The apparatus of claim 1, wherein the heat exchange tube comprises: the heat storage module comprises a heat exchange inlet pipe and a heat exchange outlet pipe, heat is transferred to the heat storage module through secondary refrigerant flowing in the heat exchange inlet pipe, and the secondary refrigerant flows back to the heat dissipation module through the heat exchange outlet pipe.
3. The apparatus of claim 2, wherein a first temperature sensor is disposed in the heat exchange inlet pipe for detecting an internal temperature of the heat exchange inlet pipe, and a second temperature sensor is disposed in the heat exchange outlet pipe for detecting an internal temperature of the heat exchange outlet pipe.
4. The apparatus of claim 1, wherein the thermal storage module internally includes a thermal storage medium by which heat emitted from the heat dissipation module is absorbed and stored.
5. An arrangement according to claim 4, characterised in that a third temperature sensor is arranged inside the thermal storage module for sensing the temperature of the thermal storage medium inside the thermal storage module.
6. The apparatus according to claim 1, wherein the inlet end of the thermal storage module is connected to the inlet line of the heat transfer medium, the outlet end of the thermal storage module is connected to the outlet line of the heat transfer medium, and a valve is disposed on the inlet line of the heat transfer medium for controlling whether the heat transfer medium enters the thermal storage module by opening and closing.
7. The apparatus of claim 1, wherein the heat transfer medium comprises: a liquid heat transfer medium or a gaseous heat transfer medium.
8. A semiconductor air conditioner characterized by comprising the heat collecting and utilizing device as recited in any one of claims 1 to 7.
9. A heat collection and utilization method applied to the heat collection and utilization device according to any one of claims 1 to 7, the method comprising:
acquiring the temperature of the heat exchange tube and the temperature of the heat storage medium; the temperature of the heat exchange pipe comprises the internal temperature of a heat exchange inlet pipe and the internal temperature of a heat exchange outlet pipe, and the heat storage medium is arranged inside the heat storage module;
and if the internal temperature of the heat exchange inlet pipe, the internal temperature of the heat exchange outlet pipe and the temperature of the heat storage medium meet any one of a first preset condition, a second preset condition or a third preset condition, controlling the conduction of an inlet pipeline of a heat conduction medium so that the heat conduction medium enters the heat storage module and exchanges heat with the heat storage module.
10. The method according to claim 9, wherein the first preset condition is: a first difference value between the internal temperature of the heat exchange inlet pipe and the internal temperature of the heat exchange outlet pipe is smaller than a first preset difference value;
the second preset condition is as follows: a second difference value between the internal temperature of the heat exchange inlet pipe and the temperature of the heat storage medium is smaller than a second preset difference value;
the third preset condition is as follows: the ratio of the third difference value to the preset time is greater than a preset threshold value;
the third difference is the difference between the temperatures of the heat storage medium obtained twice in succession, and the preset time is the time interval between the temperatures of the heat storage medium obtained twice in succession.
11. The method of claim 9, controlling the conduction of the inlet line of the heat transfer medium, comprising:
controlling the valve to be conducted; wherein, the valve is arranged on an inlet pipeline of the heat-conducting medium.
12. A computer-readable storage medium, on which a computer program is stored, which program, when being executed by a processor, carries out the method according to any one of claims 9 to 11.
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