CN110548949A - Wire bonding device and circuit board wire bonding machine - Google Patents
Wire bonding device and circuit board wire bonding machine Download PDFInfo
- Publication number
- CN110548949A CN110548949A CN201910779971.3A CN201910779971A CN110548949A CN 110548949 A CN110548949 A CN 110548949A CN 201910779971 A CN201910779971 A CN 201910779971A CN 110548949 A CN110548949 A CN 110548949A
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- Prior art keywords
- circuit board
- wire
- clamping
- clamp
- welding
- Prior art date
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- 230000007246 mechanism Effects 0.000 claims abstract description 133
- 238000003466 welding Methods 0.000 claims abstract description 74
- 238000005476 soldering Methods 0.000 claims abstract description 61
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 47
- 239000000155 melt Substances 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000523 sample Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 238000007747 plating Methods 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 3
- 239000010949 copper Substances 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 4
- 229910001021 Ferroalloy Inorganic materials 0.000 description 3
- 210000000078 claw Anatomy 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910002588 FeOOH Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
the invention relates to the field of electronic soldering machinery, and particularly discloses a wire welding device.A support frame and a positioning jig are arranged on a machine base, a soldering mechanism is arranged on the support frame, and the soldering mechanism is used for preheating and welding a welding position; when the circuit board is positioned in the positioning jig, the welded electric wire extends to the welding point position of the circuit board, the soldering mechanism preheats the welding point position of the circuit board and the welding position of the electric wire, and after preheating is completed, the soldering mechanism melts tin to weld the electric wire and the circuit board; the problem that the plating layers on the copper wires and the copper wires of the wires are damaged due to uneven heating caused by too fast heating temperature rise of the welding points of the wires and the circuit board due to direct welding after the tin is melted is avoided; the quality and the welding stability after welding are improved; the soldering tin mechanism is arranged on the support frame, the circuit board is positioned in the positioning jig, manual welding is replaced, and efficiency is improved.
Description
Technical Field
The invention relates to the field of wire soldering machines, in particular to a soldering device and a circuit board wire welding machine.
Background
The welding of cables and circuit boards is a common technique in the electronics industry, if the RF antenna, WIFI antenna, etc. are built-in. The traditional electric wire is welded on a circuit board, and conductor ends of the electric wire are welded on the circuit board by manual operation of operators through a ferroalloy; however, with the continuous progress of science and technology and the high labor cost, the automatic electric iron soldering machine gradually replaces manual operation, so that the production efficiency is improved, and the labor cost is reduced. But due to the current electronics field, circuit boards and soldered cables are getting smaller and smaller; when the ferroalloy welding is used for automatic welding, the ferroalloy head replacement frequency is high, incomplete soldering tin, poor tin point tip drawing and the like are easily caused, short circuit is caused, the welding quality is poor, even rework is needed, the repair welding rate is high, and the labor is delayed; at present, copper wires in many electric wires are small in diameter and are usually provided with silver plating layers; therefore, in the process of soldering tin, the FeOOH melts the tin wire to contact with the electric wire, so that the temperature of the disconnected conductor is instantly increased, and the phenomenon that part of the base material or the welding spot is unstable due to uneven heating is easy to occur.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the utility model provides a soldering tin device and circuit board bonding equipment, solve present welding equipment with the electric wire welding on the circuit board, the welding effect is poor to the uneven problem that destroys some substrate or solder joint unstability phenomenon appears being heated easily.
In order to solve the technical problems, the technical scheme of the invention is as follows: a wire bonding apparatus comprising:
A machine base;
The support frame is arranged on the base;
The positioning jig is arranged on the base and used for clamping and positioning the circuit board to be welded;
And the tin soldering mechanism is arranged on the support frame and used for preheating and welding the welding position.
Preferably, the soldering mechanism is a laser soldering head.
Circuit board wire bonder include wire bonding device, still include:
The wire clamping mechanism is arranged on one side of the soldering mechanism and used for clamping the electric wire to be welded on the circuit board; and the number of the first and second groups,
The feeding mechanical arm is arranged on the base and used for transferring the electric wire to be welded to the wire clamping mechanism;
The feeding manipulator clamps the wires to be welded to the wire clamping mechanism, and the tin soldering mechanism preheats the welding contacts of the circuit board and the ends of the wires and melts tin at the ends of the wires to weld the wires on the circuit board.
preferably, the loading manipulator includes: the first linear module is arranged on the base; the first connecting plate is arranged on the moving seat of the first linear module; the first wire clamp is arranged at the bottom of the first connecting plate, and a clamp opening is downward; the second wire clamp is arranged on the base, and a clamp opening faces upwards; the second linear module is arranged on the base and is parallel to the first linear module; the second connecting plate is arranged on the moving seat of the second linear module; the third wire clamp is arranged at the bottom of the second connecting plate; the first linear module drives the first wire clamp to clamp the wire to be placed on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to the wire clamping mechanism.
Preferably, the first wire clamp, the second wire clamp and the third wire clamp are pneumatic clamps and comprise a first finger cylinder, a first clamping jaw and a second clamping jaw, wherein the first clamping jaw and the second clamping jaw are arranged on two clamping blocks of the first finger cylinder, and the first finger cylinder drives the first clamping jaw and the second clamping jaw to clamp an electric wire.
preferably, opposite sides of the first clamping jaw and the second clamping jaw are provided with V-shaped clamping openings; the inner side wall of the V-shaped clamping opening of the first clamping jaw is provided with a plurality of clearance grooves, the V-shaped clamping opening of the second clamping jaw is provided with a plurality of clearance positions, and a clamping part is formed between every two adjacent clearance positions; when the first clamping jaw and the second clamping jaw are clamped, the clamping part is clamped in the clearance groove; the centers of the first wire clamp, the second wire clamp and the third wire clamp after clamping are on the same straight line horizontal straight line.
Preferably, the machine base is further provided with a detection probe for positioning the end of the electric wire clamped on the second wire clamp.
Preferably, the tin soldering mechanism comprises a laser tin soldering head and a tin feeder which are arranged on the support frame; and the output end of the tin feeding machine extends to the bottom end of the laser welding head.
Preferably, the wire clamping mechanism comprises an installation plate arranged on the support frame, a pneumatic sliding table arranged on the side surface of the installation plate, a second finger cylinder arranged at the bottom end of a sliding part of the pneumatic sliding table, and a third clamping jaw and a fourth clamping jaw which are arranged on the two clamping blocks; the opposite sides of the third clamping jaw and the fourth clamping jaw are provided with V-shaped clamping openings; a plurality of second clearance grooves are formed in the inner side wall of the V-shaped clamping opening of the third clamping jaw, a plurality of second clearance positions are formed in the V-shaped clamping opening of the fourth clamping jaw, and a second clamping part is formed between every two adjacent second clearance positions; when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping part is clamped in the second clearance groove.
Preferably, the side of the sliding part of pneumatic slip table still is equipped with down the air cylinder, the lift end of pushing down the air cylinder is equipped with the third connecting plate, and locates the clamp plate of third connecting plate bottom, it promotes to push down the air cylinder the clamp plate pushes down the centre gripping and is in the third clamping jaw with electric wire on the fourth clamping jaw makes the weld end and the circuit board contact of electric wire.
Furthermore, the circuit board wire welding machine further comprises a translation mechanism which is arranged on the support frame, and the soldering tin mechanism and the wire clamping mechanism are arranged on a moving seat of the translation mechanism.
furthermore, the circuit board wire bonding machine further comprises a positioning and conveying mechanism which is arranged on the machine base and used for conveying and positioning the positioning jig below the wire bonding mechanism.
preferably, the positioning and conveying mechanism is an electric linear module arranged on the machine base, and the positioning jig is arranged on a movable base of the electric linear module.
preferably, the machine base is further provided with a circuit board feeding mechanism for placing the circuit board in the positioning jig; the circuit board feeding mechanism comprises a triaxial manipulator and a positioning rack which are arranged on the base, a carrier plate arranged on a lifting part of the triaxial manipulator, and a sucker arranged at the bottom of the carrier plate.
preferably, belt conveying mechanisms are further arranged on two sides of the positioning conveying mechanism, and the two belt conveying mechanisms are fixedly connected with the base; the lifting mechanism arranged in the base drives the lifting plate to move up and down, and the positioning conveying mechanism is arranged on the lifting plate; the circuit board feeding mechanism adsorbs the circuit board on the two belt conveying mechanisms, the two belt conveying mechanisms convey the circuit board to the position above the positioning jig, the lifting mechanism pushes the positioning jig to ascend, and the positioning jig clamps the positioning circuit board.
Preferably, an auxiliary conveying mechanism is further arranged between the feeding manipulator and the belt conveying mechanism.
Compared with the prior art, the circuit board wire bonding machine has the following beneficial effects:
1. A support frame and a positioning jig are arranged on the machine base, a tin soldering mechanism is arranged on the support frame, and the tin soldering mechanism is used for preheating and welding a welding position; therefore, when the circuit board is positioned in the positioning jig, the welded electric wire extends to the welding point position of the circuit board, the soldering mechanism preheats the welding point position of the circuit board and the welding position of the electric wire, and after preheating is completed, the soldering mechanism melts tin to achieve the purpose of welding the electric wire with the circuit board; after the welding position is preheated, the problems that the heating temperature of the welding point positions of the electric wire and the circuit board is increased too fast due to direct welding after tin is melted, heating is uneven, and the plating layers on the electric wire copper wire and the copper wire are damaged are avoided; thereby improving the quality and welding stability after welding;
2. Through the setting of soldering tin mechanism at the support frame, the circuit board location has consequently replaced manual welding in positioning jig, raises the efficiency to can master the volume of soldering tin, avoid welding soldering tin and other electronic component switch on the circuit board, avoid the problem of short circuit.
Drawings
FIG. 1 is a structural view of a soldering apparatus according to the present invention;
FIG. 2 is a block diagram of the circuit board wire bonding machine of the present invention;
FIG. 3 is a structural view of the soldering mechanism of the circuit board bonding machine of the present invention disposed on the frame;
FIG. 4 is a block diagram of the soldering mechanism of the circuit board wire bonding machine of the present invention;
fig. 5 is a block diagram of a feeding robot of the circuit board wire bonding machine of the present invention;
FIG. 6 is a block diagram of a first clip of the circuit board wire bonding machine of the present invention;
FIG. 7 is a block diagram of a second clip of the circuit board wire bonding machine of the present invention;
Fig. 8 is a block diagram of a third clip of the circuit board wire bonding machine of the present invention;
FIG. 9 is a block diagram of the wire clamping mechanism of the circuit board wire bonding machine of the present invention;
Fig. 10 is a block diagram of a second finger cylinder of the circuit board wire bonding machine of the present invention;
FIG. 11 is a block diagram of the other side of the wire clamping mechanism of the circuit board wire bonding machine of the present invention;
FIG. 12 is a block diagram of the probing head of the circuit board wire bonding machine of the present invention disposed on the frame;
FIG. 13 is a view of the circuit board loading mechanism of the circuit board bonding machine of the present invention mounted on the frame;
fig. 14 is a block diagram of the circuit board loading mechanism of the circuit board wire bonding machine of the present invention;
FIG. 15 is a block diagram of the transport positioning mechanism of the circuit board wire bonding machine of the present invention;
Fig. 16 is a structural view of the auxiliary conveying mechanism arranged on the base of the circuit board wire bonding machine of the invention.
Detailed Description
The following detailed description will be further described in conjunction with the above-identified drawings.
in the following description, numerous specific details are set forth in order to provide a thorough understanding of the concepts underlying the described embodiments. It will be apparent, however, to one skilled in the art, that the described embodiments may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail.
referring to fig. 1, a wire bonding apparatus includes: the device comprises a machine base 1, a support frame 2, a positioning jig 3 and a soldering mechanism 4. Wherein: and the support frame 2 is arranged on the base 1. And the positioning jig 3 is arranged on the machine base 1 and used for clamping and positioning the circuit board to be welded. And the tin soldering mechanism 4 is arranged on the support frame 2 and used for preheating and welding the welding position. When the circuit board is positioned in the positioning jig 3, the welded electric wire extends to the welding point position of the circuit board, the soldering mechanism 4 preheats the welding point position of the circuit board and the welding position of the electric wire, and after preheating is completed, the soldering mechanism 4 melts tin to weld the electric wire and the circuit board; after the welding position is preheated, the problems that the heating temperature of the welding point positions of the electric wire and the circuit board is increased too fast due to direct welding after tin is melted, heating is uneven, and the plating layers on the electric wire copper wire and the copper wire are damaged are avoided; thereby improving the quality and welding stability after welding. And through the setting of soldering tin mechanism 4 at support frame 2, the circuit board location has consequently replaced manual welding in positioning jig 3, raises the efficiency to can master the volume of soldering tin, avoid welding soldering tin and other electronic component on the circuit board and switch on, avoid the problem of short circuit.
Preferably, the soldering mechanism 4 is a laser soldering head. The laser soldering tin head ensures that the position of a soldering point reaches the highest temperature in a focusing mode, and realizes the melting of a tin wire. The welding position is preheated and welded through the laser welding tin head, when preheating is carried out, the temperature of a reduced focus is achieved by reducing the power of the laser welding tin head, preheating is achieved, and when welding is carried out, the power of the laser welding tin head is achieved.
Referring to fig. 1 to 3, the circuit board wire bonding machine includes the wire bonding apparatus, and further includes: the wire clamping mechanism 5 is arranged on one side of the soldering mechanism 4 and is used for clamping a wire to be welded on a circuit board; the feeding manipulator 6 is arranged on the base 1 and is used for transferring the wires to be welded to the wire clamping mechanism 5; the feeding mechanical arm 6 clamps the wires to be welded to the wire clamping mechanism 5, and the soldering mechanism 4 preheats the welding contacts of the circuit board and the ends of the wires and then melts tin at the ends of the wires to weld the wires on the circuit board. Specifically, the circuit board is positioned in the positioning jig 3, the feeding manipulator 6 clamps the wire to be welded to the wire clamping mechanism 5, and the soldering mechanism 4 preheats the welding contact of the circuit board and the end of the wire, melts the tin at the end of the wire, and welds the wire to the circuit board.
preferably, referring to fig. 2 to 5, the loading robot 6 includes: the first linear module 60 is arranged on the stand 1; a first connection plate 61 provided on the movable base of the first linear module 60; a first wire clip 72, which is arranged at the bottom of the first connecting plate 61 and has a clip opening facing downwards; the second wire clamp 63 is arranged on the machine base 1, and the clamp opening faces upwards; the second linear module 64 is arranged on the machine base 1 and is parallel to the first linear module 60; a second connecting plate 65, which is provided on the moving seat of the second linear module 64; a third wire clamp 66 provided at the bottom of the second connecting plate 65; the first linear module 60 drives the first clamp 62 to clamp the wire to the second clamp 63, and the second linear module 64 drives the third clamp 66 to clamp the wire on the second clamp 63 to the wire clamping mechanism 5. Specifically, when the feeding manipulator 6 clamps the electric wire to realize feeding, the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 can clamp the electric cable, so that the electric cable can be quickly conveyed to the position of the wire clamping mechanism 5 after welding is completed.
Further, the first linear module 60 is fixed on the machine base 1 through a first bracket, and the second linear module 64 is fixed on the machine base 1 through a second bracket.
Referring to fig. 5 to 8, each of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 is a pneumatic clamp 600, and includes a finger cylinder 610 and a first clamping jaw 620 and a second clamping jaw 630 disposed on two clamping blocks of the finger cylinder, and the finger cylinder 610 drives the first clamping jaw 620 and the second clamping jaw 630 to clamp an electric wire.
Preferably, referring to fig. 6 to 8, V-shaped clamping mouths 620a and 630a are arranged on opposite sides of the first clamping jaw 620 and the second clamping jaw 630; a plurality of clearance grooves 620b are formed in the inner side wall of the V-shaped clamping opening 620a of the first clamping jaw 620; a plurality of space avoidance positions 630b are arranged at the V-shaped clamping opening 630a of the second clamping jaw 630, and a clamping part 630c is formed between every two adjacent space avoidance positions 630 b; when the first jaw 620 and the second jaw 630 are engaged, the engaging portion 630c is engaged with the clearance groove 620 b; therefore, when the cable is clamped, the traditional front-back type clamping electric wire is replaced, the phenomenon that the electric wire is bent in the clamping process is avoided, and the clamping accuracy and stability are improved. The centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same straight line and horizontal straight line. Through cable translation, then can accomplish and centre gripping one by one.
Specifically, in order to allow the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 to be spaced apart from each other during the wire clamping transmission, the first wire clamp 62 and the third wire clamp 66 are bent to form the space.
Further, in another embodiment of the third wire clamp 66, the third wire clamp 66 includes a lifting cylinder disposed on the movable base of the second linear block 65, and a pneumatic clamp 600 disposed at a lifting end of the lifting cylinder. When the lifting cylinder moves to the lowest position, the centers of the first wire clamp 62, the second wire clamp 63 and the third wire clamp 66 after clamping are on the same horizontal straight line.
Preferably, referring to fig. 12, a detection probe 200 is further provided on the housing 1 for positioning an end of the electric wire clamped on the second clamp 63. The position of the end part of the cable is detected by the detection probe 200, and when the end part of the cable is clamped with the third wire clamp 66, the original point position of the second wire clamp 63 is automatically compensated, so that when the third wire clamp 66 detects that the electric wire is conveyed to the wire clamping mechanism 5, the end part of the cable can be always ensured to be welded on a welding spot of a circuit board. In this embodiment, the detecting probe 200 is disposed on a support rod, and the support rod is fixed on the base 1. Further, the detecting probe 200 is a CCD camera.
Preferably, the soldering mechanism 4 comprises a laser soldering head 40 and a solder feeder 41 which are arranged on the support frame 2; the output end of the tin feeder 41 extends to the bottom end of the laser welding head 40. The tin wire is conveyed to the bottom end of the laser welding tin head 40 through the tin conveying machine 41, and the tin wire is melted through the laser welding head 40, so that the cable is welded on the circuit board.
Preferably, referring to fig. 2 to 4 and fig. 9 to 11, the wire clamping mechanism 5 includes a mounting plate 50 disposed on the support frame 2, a pneumatic sliding table 51 disposed on a side surface of the mounting plate 50, a second finger cylinder 52 disposed at a bottom end of a sliding portion of the pneumatic sliding table 51, and a third clamping jaw 53 and a fourth clamping jaw 54 disposed on the two clamping blocks of the second finger cylinder 52; opposite sides of the third clamping jaw 53 and the fourth clamping jaw 54 are provided with V-shaped clamping openings 53a and 54 a; a plurality of second clearance grooves 53b are formed in the inner side wall of the V-shaped clamping opening 53a of the third clamping jaw 53, a plurality of second clearance holes 54b are formed in the V-shaped clamping opening 54a of the fourth clamping jaw 54, and a second clamping portion 54c is formed between every two adjacent second clearance holes 54 b; when the third jaw 53 and the fourth jaw 54 are clamped, the second engaging portion 54c is engaged with the second clearance groove 53 b.
preferably, referring to fig. 11, a down-pressing cylinder 55 is further disposed on a side surface of the sliding portion of the pneumatic sliding table 51, a third connecting plate 56 is disposed at a lifting end of the down-pressing cylinder 55, and a pressing plate 57 is disposed at a bottom of the third connecting plate 56, the down-pressing cylinder 55 pushes the pressing plate 57 to press down the electric wire clamped between the third clamping jaw 53 and the fourth clamping jaw 54, so that an end of the electric wire is bent, and a welding end of the electric wire is in contact with the circuit board. Therefore, the condition that the cable conductor is not in contact welding with the circuit board can be effectively avoided.
Further, referring to fig. 2, fig. 3 and fig. 13, the circuit board wire bonding machine further includes a translation mechanism 7 disposed on the support frame 2, and the soldering mechanism 4 and the wire clamping mechanism 5 are disposed on a moving seat of the translation mechanism 7. In this embodiment, when a plurality of cables need to be soldered on a circuit board, the translation mechanism 7 drives the soldering mechanism 4 and the wire clamping mechanism 5 to move simultaneously, so as to realize soldering at a plurality of positions. The welding of the lead and the shielding layer in the coaxial cable and the circuit board can also be realized; specifically, when coaxial cable is welded on a circuit board, the wire clamping mechanism 5 clamps the electric wire, the soldering tin mechanism 4 welds the wire of the cable on the circuit board, the wire clamping mechanism 5 is loosened, the cable is still suspended, and the translation mechanism 7 translates to enable the soldering tin mechanism 4 to move to the welding position of the shielding layer, so that the welding of the shielding layer and the circuit board can be realized. Further, the translation mechanism is a linear module.
Further, referring to fig. 3, 13 and 15, the circuit board wire bonding machine further includes a positioning and conveying mechanism 8, which is arranged on the base 1 and used for conveying and positioning the positioning jig 3 below the wire bonding mechanism. In this embodiment, the circuit board is positioned in the positioning jig 3, and the positioning conveying mechanism 8 drives the positioning jig 3 to move to the bottom end of the soldering mechanism 4, so as to realize the soldering between the electric wire and the circuit board. In this embodiment, a plurality of electric wires can be welded on the circuit board, specifically, after welding of a first electric wire is completed, the wire clamping mechanism 5 clamps a second electric wire, and the positioning jig 3 is driven to move by the positioning conveying mechanism 8, so that a plurality of electric wires are welded on the circuit board.
Preferably, the positioning and conveying mechanism 8 is an electric linear module arranged on the machine base 1, and the positioning jig 3 is arranged on a movable base of the electric linear module.
preferably, referring to fig. 11 and 12, a circuit board feeding mechanism 9 is further disposed on the base 1 for placing a circuit board in the positioning fixture 3. The circuit board feeding mechanism 9 comprises a three-axis manipulator 90 and a positioning rack 91 arranged on the machine base 1, a carrier plate 92 arranged on a lifting part of the three-axis manipulator 90, and a sucker 93 arranged at the bottom of the carrier plate 92. The three-axis manipulator 90 drives the sucker 93 to move downwards, so that the circuit board placed on the positioning rack 91 is placed on the positioning jig 3, and the positioning jig 3 is used for positioning and clamping the circuit board; thereby realizing the automatic feeding of the circuit board.
Preferably, referring to fig. 3, 13, 15 and 16, two sides of the fixed conveying position mechanism 8 are further provided with belt conveying mechanisms 100, and the two belt conveying mechanisms 100 are fixedly connected with the machine base 1; the lifting mechanism 110 arranged in the machine base 1 drives the lifting plate 120 to move up and down, and the positioning conveying mechanism 8 is arranged on the lifting plate 120; the circuit board feeding mechanism 9 adsorbs the circuit board on the two belt conveying mechanisms 100, the two belt conveying mechanisms 100 convey the circuit board to the upper part of the positioning jig 3, the lifting mechanism 110 pushes the positioning jig 3 to ascend, and the positioning jig 3 clamps the positioning circuit board.
Preferably, referring to fig. 15 and 16, the lifting mechanism 110 includes a plurality of connecting columns 111 disposed on the top wall of the cavity of the machine base 1, a supporting plate 112 connected to the bottoms of the plurality of connecting columns 111, a guide post 113 slidably penetrating through the supporting plate 112, and a lifting cylinder 114; the upper end of the guide post 113 is connected to the lifting plate 120, the lifting cylinder 114 is disposed on the support plate 112, and the upper end of the lifting cylinder 114 is fixedly connected to the bottom of the lifting plate 150.
Preferably, referring to fig. 15, the positioning jig 3 includes a bottom plate 30 disposed on the moving seat of the positioning and conveying mechanism 8, a wide-row pneumatic claw 31 disposed on the bottom plate 30, a clamping plate 32 disposed on two moving blocks of the wide-row pneumatic claw 31, a supporting member 33 disposed on the body of the wide-type pneumatic claw 31, and a positioning plate 34 disposed on the supporting member 33; the outer end of the clamping plate 32 is provided with an upward extending clamping part 35, and the inner side of the clamping part 35 is provided with a positioning clamping groove 36; the open end of the card slot 36 has a guide orientation. The circuit board is placed on locating plate 34, and finger cylinder 31 drive splint 32 moves towards each other, the both ends of centre gripping circuit board to the location is in draw-in groove 36, reaches the centre gripping location to the circuit board.
Preferably, referring to fig. 2, 13, and 16, an auxiliary conveying mechanism 130 is further provided between the loading robot 6 and the belt conveying mechanism 100. The tail end of the wire soldered on the circuit board is placed on the auxiliary conveying mechanism 130, so that not only the auxiliary supporting function but also the conveying function for the cable can be achieved.
Further, referring to fig. 11, the motor driving the auxiliary conveying mechanism 130 drives one of the belt conveying mechanisms 100 to operate through the transmission mechanism, so that the loading and unloading of the positioning fixture 3 are performed simultaneously, the loading and unloading are performed sequentially, and a driving power can be reduced.
the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make various modifications without creative efforts from the above-described conception, and fall within the scope of the present invention.
Claims (16)
1. Wire bonding device, its characterized in that includes:
A machine base;
the support frame is arranged on the base;
The positioning jig is arranged on the base and used for clamping and positioning the circuit board to be welded;
And the tin soldering mechanism is arranged on the support frame and used for preheating and welding the welding position.
2. The wire bonding apparatus of claim 1 wherein the soldering mechanism is a laser soldering head.
3. A circuit board wire bonding machine comprising the wire bonding apparatus of any one of claims 1 or 2, further comprising:
The wire clamping mechanism is arranged on one side of the soldering mechanism and used for clamping the electric wire to be welded on the circuit board; and the number of the first and second groups,
the feeding mechanical arm is arranged on the base and used for transferring the electric wire to be welded to the wire clamping mechanism;
the feeding manipulator clamps the wires to be welded to the wire clamping mechanism, and the tin soldering mechanism preheats the welding contacts of the circuit board and the ends of the wires and melts tin at the ends of the wires to weld the wires on the circuit board.
4. the circuit board wire bonding machine of claim 3, wherein the loading robot comprises: the first linear module is arranged on the base; the first connecting plate is arranged on the moving seat of the first linear module; the first wire clamp is arranged at the bottom of the first connecting plate, and a clamp opening is downward; the second wire clamp is arranged on the base, and a clamp opening faces upwards; the second linear module is arranged on the base and is parallel to the first linear module; the second connecting plate is arranged on the moving seat of the second linear module; the third wire clamp is arranged at the bottom of the second connecting plate; the first linear module drives the first wire clamp to clamp the wire to be placed on the second wire clamp, and the second linear module drives the third wire clamp to clamp the wire on the second wire clamp to the wire clamping mechanism.
5. The circuit board bonding machine of claim 4 wherein the first clamp, the second clamp and the third clamp are each a pneumatic clamp including a first finger cylinder and first and second jaws disposed on two clamp blocks of the first finger cylinder, the first finger cylinder driving the first and second jaws to clamp the wire.
6. The circuit board wire bonding machine of claim 5 wherein opposing sides of the first jaw and the second jaw are provided with V-shaped jaws; the inner side wall of the V-shaped clamping opening of the first clamping jaw is provided with a plurality of clearance grooves, the V-shaped clamping opening of the second clamping jaw is provided with a plurality of clearance positions, and a clamping part is formed between every two adjacent clearance positions; when the first clamping jaw and the second clamping jaw are clamped, the clamping part is clamped in the clearance groove; the centers of the first wire clamp, the second wire clamp and the third wire clamp after clamping are on the same straight line horizontal straight line.
7. A circuit board bonding machine according to any one of claims 4 to 6, characterized in that the machine base is further provided with a detection probe for positioning the end of the wire clamped on the second wire clamp.
8. the circuit board bonding machine according to any one of claims 3 to 6, wherein the soldering mechanism comprises a laser soldering head and a solder feeder arranged on the supporting frame; and the output end of the tin feeding machine extends to the bottom end of the laser welding head.
9. the circuit board bonding machine according to any one of claims 3 to 6, wherein the wire clamping mechanism comprises a mounting plate arranged on the support frame, a pneumatic sliding table arranged on a side surface of the mounting plate, a second finger cylinder arranged at the bottom end of a sliding part of the pneumatic sliding table, and a third clamping jaw and a fourth clamping jaw which are arranged on two clamping blocks; the opposite sides of the third clamping jaw and the fourth clamping jaw are provided with V-shaped clamping openings; a plurality of second clearance grooves are formed in the inner side wall of the V-shaped clamping opening of the third clamping jaw, a plurality of second clearance positions are formed in the V-shaped clamping opening of the fourth clamping jaw, and a second clamping part is formed between every two adjacent second clearance positions; when the third clamping jaw and the fourth clamping jaw are clamped, the second clamping part is clamped in the second clearance groove.
10. the circuit board wire bonding machine according to claim 9, wherein a down-pressure cylinder is further disposed on a side surface of the sliding portion of the pneumatic sliding table, a third connecting plate is disposed at a lifting end of the down-pressure cylinder, and a pressing plate is disposed at a bottom of the third connecting plate, the down-pressure cylinder pushes the pressing plate to press down the electric wire clamped between the third clamping jaw and the fourth clamping jaw, so that a welding end of the electric wire contacts the circuit board.
11. the circuit board bonding machine of claim 3, further comprising a translation mechanism disposed on the support frame, wherein the soldering mechanism and the wire clamping mechanism are disposed on a movable base of the translation mechanism.
12. The circuit board wire bonding machine of claim 3, further comprising a positioning and conveying mechanism disposed on the base for conveying and positioning the positioning jig below the wire bonding mechanism.
13. The circuit board bonding machine according to claim 12, wherein the positioning and conveying mechanism is a motorized linear module disposed on the base, and the positioning fixture is disposed on a movable base of the motorized linear module.
14. The circuit board bonding machine according to any one of claims 3 and 11-13, wherein a circuit board loading mechanism is further provided on the machine base for placing the circuit board in the positioning jig; the circuit board feeding mechanism comprises a triaxial manipulator and a positioning rack which are arranged on the base, a carrier plate arranged on a lifting part of the triaxial manipulator, and a sucker arranged at the bottom of the carrier plate.
15. The circuit board bonding machine according to claim 13, wherein two sides of the positioning and conveying mechanism are further provided with belt conveying mechanisms, and the two belt conveying mechanisms are fixedly connected with the base; the lifting mechanism arranged in the base drives the lifting plate to move up and down, and the positioning conveying mechanism is arranged on the lifting plate; the circuit board feeding mechanism adsorbs the circuit board on the two belt conveying mechanisms, the two belt conveying mechanisms convey the circuit board to the position above the positioning jig, the lifting mechanism pushes the positioning jig to ascend, and the positioning jig clamps the positioning circuit board.
16. The circuit board bonding machine of claim 15 wherein an auxiliary transport mechanism is further provided between the loading robot and the belt transport mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910779971.3A CN110548949A (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910779971.3A CN110548949A (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
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| Publication Number | Publication Date |
|---|---|
| CN110548949A true CN110548949A (en) | 2019-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910779971.3A Pending CN110548949A (en) | 2019-08-22 | 2019-08-22 | Wire bonding device and circuit board wire bonding machine |
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| Country | Link |
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| CN (1) | CN110548949A (en) |
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| CN114054878A (en) * | 2021-11-03 | 2022-02-18 | 杭州中芯微电子有限公司 | Be used for RFID production antenna chip automatic welder |
| CN114473099A (en) * | 2020-10-27 | 2022-05-13 | 神讯电脑(昆山)有限公司 | Circuit board welding device |
| CN116117260A (en) * | 2022-12-28 | 2023-05-16 | 江苏暖阳半导体科技有限公司 | LED chip board welding fixture |
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