CN110539085A - Femtosecond optical fiber undercutting method and device - Google Patents
Femtosecond optical fiber undercutting method and device Download PDFInfo
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- CN110539085A CN110539085A CN201910857191.6A CN201910857191A CN110539085A CN 110539085 A CN110539085 A CN 110539085A CN 201910857191 A CN201910857191 A CN 201910857191A CN 110539085 A CN110539085 A CN 110539085A
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- cut
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention aims to provide a femtosecond optical filament recessive cutting method, which is characterized in that a laser generates a femtosecond pulse laser beam, the laser beam is focused on the surface of a material to be cut through a focusing element, the peak power of the laser beam is greater than the power threshold of an optical filament formed in the material to be cut, the optical filament phenomenon is initiated in the material to be cut, a dynamically balanced plasma channel is formed in the material to be cut through the self-focusing effect and the defocusing effect formed by ionizing plasma generated by the material to be cut, and a modified layer is formed through the plasma channel, so that the cutting of the material to be cut is realized. The problems of uneven cutting surface and low cutting efficiency caused by multiple times of focus scanning in the conventional laser concealed cutting can be effectively solved. The invention also discloses a femtosecond optical fiber stealth-cutting device.
Description
Technical Field
The invention relates to a laser processing technology, in particular to a femtosecond optical fiber recessing method and a femtosecond optical fiber recessing device.
Background
The laser stealth cutting technology is a technology for longitudinally constructing a plurality of focuses in a hard material body so as to form a plurality of modified layers and further realize physical segmentation of materials. Compared with the traditional cutting method, the laser stealth cutting technology gradually replaces the traditional mechanical cutting with high processing speed, simple operation and accurate processing.
With the continuous development of science and technology, people put forward requirements on material accuracy, environmental safety and working efficiency in the fields of electronic components, aviation, industrial processing and the like, such as more accurate, faster and cross-scale cutting. The existing laser hidden cutting technology has large damage to cutting materials and is easy to damage the cutting materials; meanwhile, a plurality of modified layers are longitudinally formed in the material body, the material needs to be scanned by laser for multiple times, the process consumes a large amount of time, and the longitudinal focus is easy to defocus, so that the section is uneven. Therefore, a laser stealth cutting technology with low damage, high efficiency and flat cutting surface is urgently needed at present.
Disclosure of Invention
the invention aims to provide a femtosecond optical fiber recessing method and a femtosecond optical fiber recessing device, which can effectively solve the problems of uneven cutting surface and low cutting efficiency caused by multiple times of focus scanning in the conventional laser recessing.
The femtosecond optical filament recessive cutting method provided by the invention is characterized in that a laser generates a femtosecond pulse laser beam, the laser beam is focused on the surface of a material to be cut through a focusing element, the peak power of the laser beam is greater than the power threshold of an optical filament formed in the material to be cut, the optical filament phenomenon is initiated in the material to be cut, a dynamically balanced plasma channel is formed in the material to be cut through the defocusing effect formed by self-focusing and plasma generated by ionizing the material to be cut, and a modified layer is formed through the plasma channel to realize the cutting of the material to be cut.
Further, the peak power of the femtosecond pulse laser beam is more than or equal to 1012W/cm 2.
Furthermore, the length of the plasma channel is 1-3 cm, and the diameter is 10-100 μm.
Further, the material to be cut is silicon, silicon carbide, sapphire or a semiconductor.
a femtosecond optical fiber stealth-cutting device comprises a laser light source part, a light beam control part, a workbench and a control system; the laser light source component comprises a laser and a collimator, wherein the laser is used for generating femtosecond pulse laser beams, the input end of the collimator is connected with the laser, and the output end of the collimator collimates and outputs the femtosecond pulse laser beams; the beam control component comprises a high reflector and a focusing element, the high reflector reflects the femtosecond pulse laser beam output by the collimator to the focusing element, and the focusing element adjusts the size of a light spot and the focal depth distance to focus the laser beam on the surface of a material to be cut; the workbench comprises a three-dimensional moving platform and a CCD (charge coupled device) camera, wherein the three-dimensional moving platform is used for fixing a material to be cut, and the CCD camera is arranged above the material to be cut and used for detecting the position of a focus point in real time and carrying out automatic correction; the control system is respectively connected with the laser light source component, the light beam control component and the workbench and controls the mutual communication and coordination work of the laser light source component, the light beam control component and the workbench.
further, the laser is a solid laser, a gas laser or a fiber laser, and the output wavelength is ultraviolet 200-400 nm, visible 400-700 nm or infrared 700-10000 nm.
Compared with the prior art, the invention has the following beneficial effects.
1. The laser beam is focused on the surface of a material to be cut by the focusing element, a dynamic balance plasma channel is formed in the material to be cut through the self-focusing action and the defocusing effect formed by ionizing the plasma generated by the material to be cut, namely, a light wire is formed by focusing in the material to be cut at one time, the energy density and the diameter of the light wire are almost unchanged, the position intensity of the light wire is clamped, the propagation length is greater than the Rayleigh length, a modified layer can be formed in the material to be cut within the whole light wire range, the modified layer is a brittle whole body which is loose in structure and easy to break, the cutting surface is flat, the material to be cut is not affected by thermal damage, and the hidden cutting of the light wire is completed through the cracking treatment. The plasma cutting device has the advantages that the material to be cut is cut through the plasma channel, the effective length of single cutting machining is improved, accordingly, larger and thicker rigid materials can be cut, one-knife cutting is achieved, repeated scanning is not needed, cutting efficiency is improved, damage to the materials is reduced, and the flatness of a cutting surface is increased.
2. The femtosecond pulse laser beam is focused on the surface of the material to be cut, and then compared with the existing laser hidden cutting technology, a plurality of focuses are not required to be formed in the material to be cut, the defocusing trouble caused by multi-focus cutting or multiple scanning is reduced, the cutting surface is smoother, and the yield is improved.
Drawings
Fig. 1 is a schematic structural diagram of a femtosecond optical filament undercutting device.
In the figure, 1-laser light source part, 11-laser, 12-first collimator, 13-second collimator, 14-optical fiber, 2-beam control part, 21-high reflector, 22-focusing element, 3-workbench, 31-three-dimensional moving platform, 32-CCD camera, 33-material to be cut, 4-control system.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1, the femtosecond optical filament stealth-cutting device is shown, which comprises a laser light source part 1, a light beam control part 2, a workbench 3 and a control system 4. The laser cutting machine comprises a laser light source component 1, a light beam control component 2, a workbench 3 and a control system 4, wherein the laser light source component 1 is used for providing laser beams for generating light wires, the light beam control component 2 is used for adjusting the transmission direction and the light spot size of the laser beams, the workbench 3 is used for fixing materials 33 to be cut, providing all-dimensional angle cutting, monitoring the position of a focus point in real time to realize automatic correction, and the control system 4 is used for controlling the mutual communication and.
The laser light source component 1 comprises a laser 11, a first collimator 12 and a second collimator 13, the laser is used for generating femtosecond pulse laser beams, can be a solid laser, a gas laser or a fiber laser, and outputs ultraviolet light with the wavelength of 200-400 nm, visible light with the wavelength of 400-700 nm or infrared light with the wavelength of 700-10000 nm. The input end of the first collimator 12 is connected with the laser 11, the femtosecond pulse laser beam generated by the laser 11 is collimated and coupled into the optical fiber 14 for transmission, and the optical fiber 14 is used for transmitting the laser beam, so that the flexibility and the safety of the optical path system are improved. The second collimator 13 collimates the femtosecond pulse laser beam output by the optical fiber 14 and outputs the collimated laser beam.
The beam control part 2 includes a high reflection mirror 21 and a focusing element 22, the high reflection mirror 21 is used for receiving the femtosecond pulse laser beam output by the second collimator 13 and changing the transmission direction of the laser beam, the reflected laser beam is input to the focusing element 22, and the spot size and the focal depth distance are adjusted by the focusing element 22, so that the laser beam is focused on the surface of the material 33 to be cut. The focusing element 22 is an optical element group having a focusing function, such as a lens, a mirror, an off-axis parabolic mirror, or a phase plate.
The workbench 3 comprises a three-dimensional moving platform 31 and a CCD camera 32, wherein the three-dimensional moving platform 31 is used for fixing a material 33 to be cut and can move along any direction, so that different cutting requirements are met. CCD camera 32 locates and waits to cut material 33 top, monitors the focus position through CCD camera's auto focus technique in real time, and full-automatic correction realizes full-automatic counterpoint cutting simultaneously, improves the accuracy of material cutting.
The control system 4 is respectively connected with the laser light source part 1, the light beam control part 2 and the workbench 3, controls the mutual communication and coordination work of the laser light source part 1, the light beam control part 2 and the workbench 3, and improves the cutting efficiency.
A femtosecond pulse light silk recessive cutting method is characterized in that a laser 11 generates a femtosecond pulse laser beam, the laser beam is focused on the surface of a material 33 to be cut through a focusing element 22, the peak power of the laser beam is larger than the power threshold of a light silk formed in the material 33 to be cut, a light silk phenomenon is caused in the material 33 to be cut, a dynamically balanced plasma channel is formed in the material 33 to be cut through a self-focusing effect and a defocusing effect formed by ionizing plasma generated by the material to be cut, the length of the plasma channel is 1-3 cm, the diameter of the plasma channel is 10-100 mu m, and a modified layer is formed through the plasma channel to realize cutting of the material to be cut.
The peak power of the femtosecond pulse laser beam is more than or equal to 1012W/cm2, compared with the method that the laser beam forms a light wire in the air, the peak power of the femtosecond pulse laser beam is limited to be more than or equal to 1014W/cm2, the peak power required for directly forming the light wire in the material to be cut is lower, and the cutting can be completed under the condition of lower power.
Relevant parameters of the femtosecond pulse laser beam are adjusted according to the material type of the material to be cut, so that the length and the diameter of the plasma channel are adjusted, the plasma channel can penetrate through the material to be cut once, and the 'one-knife cutting' is realized.
The laser beam is focused on the surface of a material to be cut through the focusing element, a dynamic balance plasma channel is formed in the material to be cut through the self-focusing action of the laser beam and the defocusing effect formed by ionizing the plasma generated by the material to be cut, namely, a light wire is formed through focusing in the material to be cut at one time, the energy density and the diameter of the light wire are almost unchanged, the position intensity of the light wire is clamped, the propagation length is greater than the Rayleigh length, a modified layer can be formed in the material to be cut within the whole light wire range, the modified layer is a brittle whole body which is loose in structure and easy to break, meanwhile, the cutting surface is flat, the material to be cut is not affected by thermal damage, and the light wire hidden cutting is completed through the cracking treatment. And the cutting of the material to be cut is realized through the plasma channel, the effective length of single cutting processing is improved, so that larger and thicker hard materials can be cut, and the hard materials are silicon, silicon carbide, sapphire or semiconductors and can realize 'one-knife cutting'. Compared with the traditional multilayer scanning cutting technology, the hidden cutting rate is improved by more than 5 times, the cutting efficiency is improved, the damage to materials is reduced, and the flatness of a cutting surface is increased.
Claims (6)
1. A femtosecond optical fiber undercutting method is characterized in that: the laser generates a femtosecond pulse laser beam, the laser beam is focused on the surface of a material to be cut through a focusing element, the peak power of the laser beam is greater than the power threshold value of a light filament formed in the material to be cut, the light filament phenomenon is initiated in the material to be cut, a dynamically balanced plasma channel is formed in the material to be cut through the self-focusing effect and the defocusing effect formed by ionizing the plasma generated by the material to be cut, and a modified layer is formed through the plasma channel to realize the cutting of the material to be cut.
2. The femtosecond optical filament stealth method according to claim 1, characterized in that: the peak power of the femtosecond pulse laser beam is more than or equal to 1012W/cm 2.
3. the femtosecond photofilament stealth method according to claim 1 or 2, characterized in that: the length of the plasma channel is 1-3 cm, and the diameter of the plasma channel is 10-100 mu m.
4. The femtosecond photofilament stealth method according to claim 1 or 2, characterized in that: the material to be cut is silicon, silicon carbide, sapphire or a semiconductor.
5. A femto second light silk stealthy device of cutting which characterized in that: comprises a laser light source component, a light beam control component, a workbench and a control system;
The laser light source component comprises a laser and a collimator, wherein the laser is used for generating femtosecond pulse laser beams, the input end of the collimator is connected with the laser, and the output end of the collimator collimates and outputs the femtosecond pulse laser beams;
The beam control component comprises a high reflector and a focusing element, the high reflector reflects the femtosecond pulse laser beam output by the collimator to the focusing element, and the focusing element adjusts the size of a light spot and the focal depth distance to focus the laser beam on the surface of a material to be cut;
The workbench comprises a three-dimensional moving platform and a CCD (charge coupled device) camera, wherein the three-dimensional moving platform is used for fixing a material to be cut, and the CCD camera is arranged above the material to be cut and used for detecting the position of a focus point in real time and carrying out automatic correction;
The control system is respectively connected with the laser light source component, the light beam control component and the workbench and controls the mutual communication and coordination work of the laser light source component, the light beam control component and the workbench.
6. The stealthy cutting device of second light silk of claim 5, characterized by: the laser is a solid laser, a gas laser or a fiber laser, and the output wavelength is ultraviolet 200-400 nm, visible 400-700 nm or infrared 700-10000 nm.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910857191.6A CN110539085A (en) | 2019-09-11 | 2019-09-11 | Femtosecond optical fiber undercutting method and device |
| US16/926,842 US11646228B2 (en) | 2019-09-11 | 2020-07-13 | Stealth dicing method including filamentation and apparatus thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910857191.6A CN110539085A (en) | 2019-09-11 | 2019-09-11 | Femtosecond optical fiber undercutting method and device |
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| CN110539085A true CN110539085A (en) | 2019-12-06 |
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| CN201910857191.6A Pending CN110539085A (en) | 2019-09-11 | 2019-09-11 | Femtosecond optical fiber undercutting method and device |
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| US20180161916A1 (en) * | 2015-06-17 | 2018-06-14 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
| CN109909627A (en) * | 2019-03-20 | 2019-06-21 | 大族激光科技产业集团股份有限公司 | A kind of laser process equipment of SiC boule |
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2019
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Patent Citations (8)
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| CN101391860A (en) * | 2007-09-21 | 2009-03-25 | 韩国情报通信大学校产学协力团 | A cutter for substrate using microwaves laser beam and method thereof |
| JP2011056519A (en) * | 2009-09-07 | 2011-03-24 | Osaka Univ | Joining method and manufacturing method of joined body |
| CN103079747A (en) * | 2010-07-12 | 2013-05-01 | 费拉瑟美国有限公司 | Method of material processing by laser filamentation |
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Effective date of registration: 20200416 Address after: Room 4, floor 13, building 11, No.106, west section of Jinkai Avenue, Yubei District, Chongqing Applicant after: Chongqing Research Institute of East China Normal University Applicant after: EAST CHINA NORMAL University Applicant after: University of Shanghai for Science and Technology Address before: Room 4, floor 13, building 11, No.106, west section of Jinkai Avenue, Yubei District, Chongqing Applicant before: Chongqing Research Institute of East China Normal University |
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Effective date of registration: 20210112 Address after: Room 4, 13 / F, 11 / F, 106 west section of Jinkai Avenue, Yubei District, Chongqing 401121 Applicant after: Chongqing Research Institute of East China Normal University Applicant after: SHANGHAI LANGYAN OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Applicant after: EAST CHINA NORMAL University Applicant after: University of Shanghai for Science and Technology Address before: Room 4, 13 / F, 11 / F, 106 west section of Jinkai Avenue, Yubei District, Chongqing 401123 Applicant before: Chongqing Research Institute of East China Normal University Applicant before: EAST CHINA NORMAL University Applicant before: University of Shanghai for Science and Technology |
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