CN110537263A - The solid-state switch framework of multi-mode operation for thermoelectric device - Google Patents
The solid-state switch framework of multi-mode operation for thermoelectric device Download PDFInfo
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- CN110537263A CN110537263A CN201880024438.XA CN201880024438A CN110537263A CN 110537263 A CN110537263 A CN 110537263A CN 201880024438 A CN201880024438 A CN 201880024438A CN 110537263 A CN110537263 A CN 110537263A
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- 238000000034 method Methods 0.000 claims abstract description 25
- 238000001816 cooling Methods 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000005669 field effect Effects 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 230000005619 thermoelectricity Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
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- 229910052737 gold Inorganic materials 0.000 claims 1
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- 238000004627 transmission electron microscopy Methods 0.000 description 12
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- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000005678 Seebeck effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
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- 238000010297 mechanical methods and process Methods 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
Abstract
Provided herein is a kind of solid-state switch frameworks of multi-mode operation for thermoelectric device and a kind of method for operating this device.The switch configuration includes one or more input terminals, and one or more of input terminals can be operated to receive electric power from one or more power supplys.The switch configuration further includes multiple output ends, and the multiple output end can be operated to provide electric power to the respective channel of the thermoelectric device.The switch configuration further include: multiple solid-state switches, the multiple solid-state switch can be operated so that one or more of input terminals are connected to the output end；And controller, the controller can be operated to stir the solid-state switch, to provide multiple operation modes of the thermoelectric device.By this method, the thermoelectric device can operate in a more efficient manner, while reducing the size of the switch configuration and improving the reliability of the switch configuration.In addition, this can permit using standard and less expensive power supply.This can cause cost to be substantially reduced and reliability raising.
Description
Related application
It is described to face this application claims the equity for the temporary patent application serial number 62/470,003 that on March 10th, 2017 submits
When patent application disclosure be incorporated herein in its entirety by reference.
Technical field
This disclosure relates to thermoelectric device and its operation.
Background technique
Thermoelectric device is solid-state semiconductor device, and depending on specific application, solid-state semiconductor device can be thermoelectric-cooled
Device (TECs) or thermoelectric generator (TEGs).TECs is that heat is transmitted to the other side from the side of device using Peltier effect,
Thus the solid-state semiconductor device of cooling effect is formed on the cold side of device.Because the direction of heat transmitting is by the voltage that applies
Polarity determines, so thermoelectric device usually can be used as temperature controller.Similarly, TEGs is to utilize Seebeck effect will be hot
(that is, from side of device to the temperature difference of the other side) is directly changed into the solid-state semiconductor device of electric energy.Thermoelectric device includes extremely
A few N-type leg and at least one p-type leg.N-type leg and p-type leg are by thermoelectric material (that is, half with sufficiently strong thermoelectric property
Conductor material) it is formed.In order to realize thermoelectric-cooled, thermoelectric device is applied a current to.Electric current transfer in N-type leg and p-type leg
Be oriented parallel in thermoelectric device heat transmitting direction.Therefore, it cools down and occurs at the top surface of thermoelectric device, and
Heat discharges at the bottom surface of thermoelectric device.
It is advantageous compared with non-thermal electric system using the heat and power system of thermoelectric device, this is because heat and power system lacks shifting
Dynamic mechanical part, has the long-life, and can have small size and flexible shape.It remains desirable, however, that having increased property
It can be with the thermoelectric device of more long-life.
Summary of the invention
Provided herein is a kind of solid-state switch frameworks of multi-mode operation for thermoelectric device and a kind of such device of operation
Method.In some embodiments, a kind of switch configuration of the multi-mode operation for thermoelectric device includes one or more
Input terminal, one or more of input terminals can be operated to receive electric power from one or more power supplys.The switch configuration also wraps
Multiple output ends are included, the multiple output end can be operated to provide electric power to the respective channel of the thermoelectric device.The switch
Framework further include: multiple solid-state switches, the multiple solid-state switch can be operated to be connected to one or more of input terminals
The output end；And controller, the controller can be operated to stir the solid-state switch to provide the thermoelectric device
Multiple operation modes.By this method, the thermoelectric device can operate in a more efficient manner, while reduce the switch configuration
Size and improve the reliability of the switch configuration.It so can also allow for using standard and less expensive power supply.This
Sample can cause cost to be substantially reduced and reliability raising
In some embodiments, the controller can be operated to stir the solid-state switch and in a series arrangement to described
An at least subset for output end provides electric power.In some embodiments, the controller can be operated to stir the solid-state and open
It closes and provides electric power to an at least subset for the output end with parallel way.
In some embodiments, the controller can operate with stir the solid-state switch with to the output end extremely
A few subset provides electric power, to provide the high capacity operation mode of the thermoelectric device.In some embodiments, the control
Device can be operated to mention when the temperature by the cooling region of the thermoelectric device exceeds the steady-state range including set point temperatures
For the high capacity operation mode of the thermoelectric device.
In some embodiments, the controller can operate with stir the solid-state switch with to the output end extremely
A few subset provides electric power, to provide the high efficiency manipulation mode of the thermoelectric device.In some embodiments, the control
Device can operate in the temperature by the cooling region of the thermoelectric device in the institute including the set point temperatures
The high efficiency manipulation mode of the thermoelectric device is provided when stating in steady-state range.
In some embodiments, the thermoelectric device includes multiple thermoelectric (al) coolers, and the institute of the thermoelectric device
It states channel to be placed on interconnection plate, the interconnection plate realizes the selectivity control to multiple and different subsets of the thermoelectric (al) cooler
System.
In some embodiments, tubular article includes the switch configuration and the thermoelectric device.
In some embodiments, each of described solid-state switch is transistor.In some embodiments, described
Each of solid-state switch is metal oxide semiconductcor field effect transistor (MOSFET).
In some embodiments, a kind of method of the switch configuration of multi-mode operation of operation for thermoelectric device includes
It determines the first operator scheme of the thermoelectric device, and stirs one or more solid-state switches in the solid-state switch to mention
For the first operator scheme of the thermoelectric device.
In some embodiments, the method also includes the second operator scheme of the determination thermoelectric device, described
Two operation modes are different from the first operator scheme；And stir one or more solid-state switches in the solid-state switch with
The second operator scheme of the thermoelectric device is provided.
In some embodiments, stirring one or more of solid-state switches in the solid-state switch includes stirring institute
It states one or more of solid-state switches in solid-state switch and provides electric power to an at least subset for output end in a series arrangement.
In some embodiments, stirring one or more of solid-state switches in the solid-state switch includes stirring the solid-state to open
One or more of solid-state switches in the Central Shanxi Plain and with parallel way to an at least subset for output end provide electric power.
In some embodiments, stirring one or more of solid-state switches in the solid-state switch includes stirring institute
One or more of solid-state switches in solid-state switch are stated to provide electric power to an at least subset for the output end, to provide
The high capacity operation mode of the thermoelectric device.In some embodiments, the first operator scheme or described second are determined
Operation mode include when the temperature by the cooling region of the thermoelectric device exceeds the steady-state range including set point temperatures,
Determine the high capacity operation mode of the thermoelectric device.
In some embodiments, stirring one or more of solid-state switches in the solid-state switch includes stirring institute
One or more of solid-state switches in solid-state switch are stated, to provide the high efficiency manipulation mode of the thermoelectric device.One
In a little embodiments, determines the first operator scheme or the second operator scheme includes determining cold by the thermoelectric device
The temperature in the region but is when in the steady-state range for including the set point temperatures.
Those skilled in the art by combine alterations preferred embodiments when read it is described in detail below after
Understand the scope of the present disclosure and recognizes the additional aspect of the disclosure.
Detailed description of the invention
The alterations for being incorporated in this specification and being formed a part of this specification illustrate several sides of the disclosure
Face, and together with the description for explaining the principles of this disclosure.
Fig. 1 illustrates the thermoelectric refrigerating system of some embodiments according to the disclosure, and the thermoelectric refrigerating system includes cold
But room；Heat exchanger, the heat exchanger include at least one thermoelectricity being arranged between cold side radiating piece and hot side radiating piece
Module (TEM)；And controller, the controller control TEM；
Fig. 2A to Fig. 2 C is illustrated for the framework in multiple channels of parallel way driving device；
Framework of Fig. 3 A to Fig. 3 C diagram for multiple channels of driving device in a series arrangement；
The solid-state switch of multi-mode operation of the Fig. 4 according to some embodiment diagrams disclosed herein for thermoelectric device
Framework；
Fig. 5 A is according to some embodiment diagrams disclosed herein for multiple channels of parallel way driving device
Fig. 4 solid-state switch framework configuration；
Multiple channels of Fig. 5 B according to some embodiment diagrams disclosed herein for driving device in a series arrangement
Fig. 4 solid-state switch framework configuration；
Fig. 6 is according to some embodiment diagrams disclosed herein for operating the multi-mode of the thermoelectric device for Fig. 4
The process of the solid-state switch framework of operation；And
Fig. 7 be according to some embodiments disclosed herein include in the multiple channels being placed on interconnection plate
The diagram of the device of multiple TECs, the interconnection plate realize the selectivity control to multiple and different subsets of the TECs in TECs array
System.
Specific embodiment
The embodiment being set forth below indicates the necessity for enabling those skilled in the art to practice the embodiment
Information, and illustrate the optimal mode for practicing the embodiment.It is reading according to after being described below of alterations, affiliated neck
Domain the skilled person will understand that the concept of the disclosure and will recognize that non-particular explanation herein these concepts application.It should
Understand, these concepts and applies in the range of the disclosure and appended claims.
It will be understood that although term first, second etc. can be used to describe various elements herein, these elements
It should not be limited by these terms.These terms are only used to distinguish an element and another element.For example, without departing substantially from this
In the case where scope of disclosure, first element can be referred to as second element, and similarly, and second element can be referred to as
One element.As used herein, term "and/or" includes associated listing any one of one or more of project
With whole combinations.
Can be used herein for example " in ... lower section " or " ... on " or " top " or " lower part " or " water
It is flat " or the relative terms of " vertical " describe such as an element illustrated in all figures, floor or region and another element, the area Ceng Huo
The relationship in domain.It will be understood that these terms and term discussed above intention cover other than orientation discribed in all figures
Device is differently directed.
Term used herein is only used for the purpose of description specific embodiment, without being intended to as to the disclosure
Limitation.As used herein, singular " one " and " described " intention also include plural form, bright unless the context otherwise
Really instruction.It will also be understood that term " includes " be to provide as used herein certain feature, entirety, step, operation, element and/
Or the presence of component, but it is not excluded for other one or more features, entirety, step, operation, component, assembly unit and/or its group
In the presence of or addition.
Unless specified otherwise herein, the otherwise meaning of all terms (including technical terms and scientific terms) used herein
It is identical as the meaning that the those of ordinary skill in field belonging to the disclosure is generally understood.It will also be understood that used herein
Term should be interpreted as the consistent meaning of meaning for having with the term in the background of this specification and related fields, without
Be from idealization or it is too formal in the sense that interpret, unless herein clearly so regulation.
Before specific embodiment is discussed, an example system is discussed, these embodiments can be in the example system
Middle use.Fig. 1 illustrates the thermoelectric refrigerating system 10 of some embodiments according to the disclosure, and the thermoelectric refrigerating system includes
Cooling chamber 12；Heat exchanger 14, the heat exchanger include that (odd number is claimed at least one electrothermal module (TEM) 22 herein
It is referred to as TEMs 22 for TEM 22 or plural number), at least one electrothermal module setting is radiated in cold side radiating piece 20 and hot side
Between part 18；And controller 16, the controller control TEM 22.It, sometimes can be with when TEM 22 is for when providing cooling
Referred to as thermoelectric (al) cooler (TEC) 22.
TEMs 22 is preferably film apparatus.When one or more of TEMs 22 is started by controller 16, starting
Thus the operation of TEMs 22 promotes heat transmitting with from cooling chamber 12 to heat hot side radiating piece 18 and cooling cold side radiating piece 20
Extract heat.More precisely, according to some embodiments of the disclosure, when one or more of TEMs 22 is activated, heat
Side radiating piece 18 is heated and thus creates evaporator, and cold side radiating piece 20 cools down and thus creates condenser.
When serving as condenser, what cold side radiating piece 20 promoted to couple via cold side radiating piece 20 receive circuit 24 from cold
But the heat extraction of room 12.Receive the inner wall 26 that circuit 24 is thermally coupled to thermoelectric refrigerating system 10.Inner wall 26 limits cooling chamber 12.
In one embodiment, receive circuit 24 to be integrated into inner wall 26, or be directly integrated on the surface of inner wall 26.Receive
Circuit 24 is formed by any kind of pipeline, and the pipeline allows cooling medium (for example, two-phase coolant) to flow through or by connecing
By circuit 24.Due to receiving the thermal coupling in circuit 24 Yu inner wall 26, when cooling medium, which flows through, receives circuit 24, cooling medium from
Cooling chamber 12 extracts heat.Receiving circuit 24 can be formed by such as copper pipe, plastic tube, stainless steel tube, aluminum pipe or the like.
When serving as evaporator, hot side radiating piece 18 promotes arriving via the repulsion circuit 28 for being coupled to hot side radiating piece 18
The heat extraction of environment outside cooling chamber 12.Repel outer wall 30 or external skin that circuit 28 is thermally coupled to thermoelectric refrigerating system 10.
The heat and mechanical process for removing heat from cooling chamber 12 is not discussed further.Additionally, it should be noted that shown in Fig. 1
Thermoelectric refrigerating system 10 be TEM 22 the specific embodiment for using and controlling.Whole embodiments described herein
It should be understood as any other purposes for being suitable for thermoelectric refrigerating system 10 and TEM 22.
Continue the example embodiment illustrated in Fig. 1, controller 16 is operated to control TEMs22, to maintain cooling chamber
Desired set point temperatures in 12.Generally, the operation of controller 16 is selectively to start/cancel starting TEMs 22, selection
Property control provide to TEMs22 electric power amount, and/or selectively control TEMs 22 work than being set with remaining desired
Set point temperature.In addition, in preferred embodiments, controller 16 is had the ability one that separately or independently controls TEMs 22
Or multiple and two or more subsets in some embodiments, wherein each subset includes one or more different
TEMs 22.Therefore, as an example, if there is four TEMs 22, controller 16 may have the ability dividually to control first
The group of independent TEM 22, the second independent TEM 22 and two TEMs 22.By this method, controller 16 can be according to demand
With maximal efficiency such as selectively one, two, three or four TEMs 22 of independent startup.
It should be noted that the only sample implementation, and system and method disclosed herein of thermoelectric refrigerating system 10
It can be suitable for other purposes of thermoelectric device.
It is advantageous compared with non-thermal electric system using the heat and power system of thermoelectric device, this is because heat and power system lacks shifting
Dynamic mechanical part, has the long-life, and can have small size and flexible shape.It remains desirable, however, that having increased property
It can be with the thermoelectric device of more long-life.
Fig. 2A to Fig. 2 C is illustrated for the framework in multiple channels of parallel way driving device.Exchange (AC) or direct current
(DC) electric power is output to DC to DC converter 34 by off-line power 32, and the converter then provides electric power to device 36.As institute
Show, device 36 is containing there are two the channels to be powered with parallel way.This DC to DC converter 34 can be bulky or expensive.
Fig. 2A shows DC to DC converter 34 and is capable of providing example of the variable DC voltage for powering to device 36.The variation of this type
Property can be expensive and be difficult to be adjusted for efficiency.Fig. 2 B and Fig. 2 C show the desired amount of for providing to device 36
The example of the pulsewidth modulation (PWM) of electric power.Since PWM usually switches between a certain high level and a certain low (for example, zero) value, because
The actual efficiency of this device 36 is to be determined by the high level and low value, rather than determined by the average magnitude of provided electric power.This
The lower power level of generation efficiency and heat it can return leakage during disconnection.
Framework of Fig. 3 A to Fig. 3 C diagram for multiple channels of driving device in a series arrangement.Again, AC or DC
Electric power is output to DC to DC converter 34 again by off-line power 32, and the converter then provides electric power to device 36.As institute
Show, device 36 is containing there are two the channels to power in a series arrangement.Again, this DC to DC converter 34 can be bulky
Or expensive.Fig. 3 A shows DC to DC converter 34 and is capable of providing example of the variable DC voltage for powering to device 36.This
The variability of type can be expensive and be difficult to be adjusted for efficiency.Fig. 3 B and Fig. 3 C are shown for mentioning to device 36
For the example of the PWM of the desired amount of electric power.Again, due to PWM usually a certain high level and a certain low (for example, zero) value it
Between switch, therefore the actual efficiency of device 36 is determined by the high level and low value, rather than being averaged by provided electric power
Amount determines.This lower power level of generation efficiency and heat can return leakage during disconnection.
Thermoelectric device in cooling application is operated using D/C voltage.In order to change pump heat, increase, reduce or PWM this
DC voltage level.Change voltage level and need to access the control loop of associated power governor, the control loop can be with
Potential unstability and complexity are introduced, or secondary DC to DC adjuster is added to bulk voltage.PWM does not allow thermoelectric device
Operation is (this is because the performance of device depends on applying under both the maximum performance coefficient (COP) of its operating curve and maximum Q point
It is added to the instantaneous voltage of device).
Provided herein is a kind of solid-state switch frameworks of multi-mode operation for thermoelectric device and a kind of such device of operation
Method.The solid-state of multi-mode operation of the Fig. 4 according to some embodiment diagrams disclosed herein for thermoelectric device 40 is opened
Close framework 38.It as illustrated, include one or more input terminals for the switch configuration 38 of the multi-mode operation of thermoelectric device 40,
One or more of input terminals can be operated to receive electric power from one or more power supplys 42.Switch configuration 38 further includes multiple defeated
Outlet, the multiple output end, which can be operated, provides electric power with the respective channel of thermoelectric device 40.
Switch configuration 38 further include: multiple solid-state switches 44, the multiple solid-state switch can operate with by one or
Multiple input terminals are connected to the output end；And controller 46, the controller can be operated to stir solid-state switch 44-1 and arrive
44-N (for the sake of simplicity, these solid-state switches are commonly referred to as multiple switch 44 or switch 44), to provide thermoelectric device 40
Multiple operation modes.By this method, thermoelectric device 40 can operate in a more efficient manner, while reduce the big of switch configuration 38
Reliability that is small and improving switch configuration 38.It so can also allow for using standard and less expensive power supply 42.In this way may be used
Is improved with reliability to cause cost to be substantially reduced
In some embodiments, each of described solid-state switch is transistor.In some embodiments, described
Each of solid-state switch is metal oxide semiconductcor field effect transistor (MOSFET).
In some embodiments, in conjunction with associated thermoelectric heat pumping devices (such as be described below thermoelectric heatpump dress
Set), proposed solid state electronic circuitry framework allows device to operate at both maximum COP and maximum Q mode, without changing
The bulk voltage level provided by power supply 42 is provided.
In some embodiments, controller 46 can operate to stir the solid-state switch and with parallel way to output end
An at least subset provide electric power.Fig. 5 A is according to some embodiment diagrams disclosed herein for driving heat with parallel way
The configuration of the solid-state switch framework 38 of the Fig. 4 in multiple channels of electric installation 40.In this example, switch 44-1 and 44-N are closed
It closes, so that electric current be allowed to flow through these switches.On the contrary, switch 44-2 and 44-3 are opened, opened so that electric current be forbidden to flow through these
It closes.This connects in the channel 1 of thermoelectric device 40 with channel N parallel.In this example, this can provide maximum current described
Each of channel and the high capacity operation mode that may be configured to thermoelectric device 40.In some embodiments, it controls
Device 46 processed can be operated when the temperature by the cooling region of thermoelectric device 40 exceeds the steady-state range including set point temperatures
The high capacity operation mode of thermoelectric device 40 is provided.
In some embodiments, controller 46 can be operated to stir solid-state switch 44 and in a series arrangement to output end
An at least subset provides electric power.Fig. 5 B is according to some embodiment diagrams disclosed herein for driving device in a series arrangement
Multiple channels Fig. 4 solid-state switch framework configuration.In this example, switch 44-2 and 44-3 closure, to allow
Electric current flows through these switches.On the contrary, switch 44-1 and 44-4 are opened, so that electric current be forbidden to flow through these switches.This is by thermoelectricity
The channel 1 of device 40 and channel N are connected in series.In this example, this can provide minimum current every in the channel
One and it may be configured to the high efficiency manipulation mode of thermoelectric device 40.In some embodiments, the controller can
Operation is to include the described steady of the set point temperatures in the temperature by the cooling region of the thermoelectric device
The high efficiency manipulation mode of the thermoelectric device is provided when within the scope of state.
Two channels are only shown although note that, embodiment disclosed herein is without being limited thereto.For example,
There may be any number of channels, and some channels can be connected in series, and other channels are connected in parallel.In this way may be used
To realize many different operation modes of thermoelectric device 40.
Fig. 6 is according to some embodiment diagrams disclosed herein for operating the multimode of the thermoelectric device 40 for Fig. 4
The process of the solid-state switch framework 38 of formula operation.Firstly, controller 46 determines that first (or subsequent) of thermoelectric device 40 operates mould
Formula (step 100).Then, controller 46 stirs one or more of solid-state switch 44 to provide the first of thermoelectric device 40
(or subsequent) operation mode (step 102).As shown in fig. 6, when controller 46 determines subsequent (for example, second) of thermoelectric device 40
When operation mode, this process is then able to repeat.In some embodiments, these operation modes of thermoelectric device 40 can be with
It is the U.S. Patent Publication US 2013/ of entitled " CARTRIDGE FOR MULTIPLE THERMOELECTRIC MODULES "
Any mode discussed in 0291560, during the U.S. Patent Publication is incorporated herein in its entirety by reference.
In some embodiments, thermoelectric device 40 includes multiple thermoelectric (al) coolers, and the thermoelectric device is described
Channel is placed on interconnection plate, and the interconnection plate realizes the selectivity control to multiple and different subsets of the thermoelectric (al) cooler
System.
Fig. 7 be according to some embodiments disclosed herein include in the multiple channels being placed on interconnection plate
The diagram of the device of multiple TECs, the interconnection plate realize the selectivity control to multiple and different subsets of the TECs in TECs array
System.In the embodiment of Fig. 7, tubular article 48 includes the TECs 50a to 50f (more generally, In being placed on interconnection plate 52
It is commonly referred to as TECs 50 herein and is individually referred to as TEC 50).TECs 50 is film apparatus.In entitled " METHOD
It is disclosed in United States Patent (USP) 8,216,871 of FOR THIN FILM THERMOELECTRIC MODULE FABRICATION "
Some non-limiting examples of film TEC, during the United States Patent (USP) is incorporated herein in its entirety by reference.
Interconnection plate 52 includes (more generally, the commonly referred to as channel 54 and a herein conductive channel 54a to 54d
It is not known as channel 54), the channel limits four subsets of TECs 50a to 50f.Particularly, TECs 50a and 50b via
Channel 54a is connected electrically in series with each other, and therefore forms the first subset of TECs 50.Similarly, TECs 50c and 50d warp
It is connected electrically in series with each other by channel 54b, and therefore forms the second subset of TECs 50.TEC 50e is connected to channel 54d,
And the third subset of TECs 50 is therefore formed, and TEC 50f is connected to channel 54c, and therefore form TECs's 50
4th subset.Not according to certain order, controller 46 can be applied to the electric current of channel 54a by control selectively to control
The first subset (that is, TECs 50a and 50b) of TECs 50 is applied to the electric current of channel 54b by control selectively to control
The second subset (that is, TECs 50c and 50d) of TECs 50 is applied to the electric current of channel 54d by control selectively to control
The third subset (that is, TEC 50e) of TECs 50, and the electric current of channel 54c is applied to selectively to control by control
The 4th subset (that is, TEC 50f) of TECs 50.Therefore, use TECs50a and 50b as example, controller 46 can pass through
It is opened from channel 54a removal electric current (cancelling starting) or by applying electrical current to channel 54a (starting) selectively to start/cancel
Dynamic TECs 50a and 50b, selectively increase or reduce the electric current that channel 54a is applied to when TECs 50a and 50b are activated,
And/or control is applied to the electric current of channel 54a.
In some embodiments, interconnection plate 52 includes that opening 56a and 56b (more generally, are commonly referred to as herein
Opening 56 and be individually referred to as opening 56), it is described be open exposure TECs 50a to 50f bottom surface.It is dissipated when being placed in hot side
When between warmware and cold side radiating piece, opening 56a and 56b can be such that the bottom surface of TECs 50a to 50f is thermally coupled to appropriately
Radiating piece.
According to the embodiment of the disclosure, during operation, controller 46 can be by applying voltage or from corresponding channel
54a to 54d removes electric current selectively to start or cancel any combination of the subset of starting TECs 50.In addition, control
Device 46 can control the operating point of movable TECs 50 by providing the amount of the electric current to corresponding channel 54a to 54d.Citing comes
It says, if only the first subset of TECs 50 will start and in Q during steady state operationCOPmaxLower operation, then controller 46 to
Channel 54a provides electric current ICOPmaxTo start TECs 50a and 50b whereby and make TECs 50a and 50b in QCOPmaxLower operation,
And electric current is removed from other channel 54b to 54d and starts other TECs 50c to 50f to cancel whereby.
In with reference to embodiment shown in Fig. 7, tubular article 48 includes TECs 50a to 50f.According to the implementation of the disclosure
Scheme, tubular article 48 may include any number of TECs 50.
In some embodiments, tubular article 48 includes switch configuration 38 and thermoelectric device 40 (for example, TECs 50).This
Tubular article 48 will be enabled to be used together with less complicated and less expensive reference power supply 42.In addition, due to switch frame
Structure 38 is solid, therefore includes not having too big influence to the size of tubular article 48 or durability in tubular article 48.
Those skilled in the art will realize that improvement and modification to the preferred embodiment of the disclosure.It is all these
Improvement and modification are considered as in the range of concept and following claims disclosed herein.
Claims (20)
1. a kind of switch configuration of the multi-mode operation for thermoelectric device, the switch configuration include:
One or more input terminals, one or more of input terminals can be operated to receive electric power from one or more power supplys；
Multiple output ends, the multiple output end can be operated to provide electric power to corresponding multiple channels of the thermoelectric device；
Multiple solid-state switches, the multiple solid-state can be operated so that one or more of input terminals are connected to the multiple output
End；And
Controller, the controller can be operated to stir the multiple solid-state switch, to provide multiple behaviour of the thermoelectric device
Operation mode.
2. switch configuration as described in claim 1, wherein the controller can operate to stir the multiple solid-state switch and
Electric power is provided to an at least subset for the multiple output end in a series arrangement.
3. the switch configuration as described in any one of claims 1 to 2, wherein the controller can operate it is the multiple to stir
Solid-state switch and with parallel way to an at least subset for the multiple output end provide electric power.
4. switch configuration as claimed any one in claims 1 to 3, wherein the controller can operate it is the multiple to stir
Solid-state switch is to provide electric power to an at least subset for the multiple output end, to provide the high capacity operation of the thermoelectric device
Mode.
5. switch configuration as claimed in claim 4, wherein the controller can be operated cooling by the thermoelectric device
Region temperature exceed including set point temperatures steady-state range when provide the thermoelectric device the high capacity operation mould
Formula.
6. the switch configuration as described in any one of claims 1 to 5, wherein the controller can operate it is the multiple to stir
Solid-state switch is to provide electric power to an at least subset for the multiple output end, to provide the high efficiency manipulation of the thermoelectric device
Mode.
7. switch configuration as claimed in claim 6, wherein the controller can be operated cooling by the thermoelectric device
The region the temperature include the set point temperatures the steady-state range in when the thermoelectric device is provided
The high efficiency manipulation mode.
8. the switch configuration as described in any one of claims 1 to 7, wherein the thermoelectric device includes multiple thermoelectric-cooleds
Device, and the multiple channel of the thermoelectric device is placed on interconnection plate, and the interconnection plate is realized to the multiple heat
The selectivity of multiple and different subsets of electric cooler controls.
9. wherein tubular article includes the switch configuration and the heat such as switch configuration described in any item of the claim 1 to 8
Electric installation.
10. switch configuration as claimed in any one of claims 1-9 wherein, wherein each of the multiple solid-state switch is
Transistor.
11. switch configuration as claimed in claim 10, wherein each of the multiple solid-state switch is metal oxide
Semiconductcor field effect transistor.
12. a kind of method of the switch configuration of multi-mode operation of operation for thermoelectric device, which comprises
Determine the first operator scheme of the thermoelectric device；And
One or more solid-state switches in multiple solid-state switches are stirred, to provide the first operation mould of the thermoelectric device
Formula.
13. method as claimed in claim 12, the method also includes:
Determine that the second operator scheme of the thermoelectric device, the second operator scheme are different from the first operator scheme；With
And
One or more solid-state switches in the multiple solid-state switch are stirred, to provide second behaviour of the thermoelectric device
Operation mode.
14. method described in any one of claim 12 to 13, wherein stirring described one in the multiple solid-state switch
A or multiple solid-state switches include stirring one or more of solid-state switches in the multiple solid-state switch and with series connection side
Formula provides electric power to an at least subset for multiple output ends.
15. the method as described in any one of claim 12 to 14, wherein stirring described one in the multiple solid-state switch
A or multiple solid-state switches include stirring one or more of solid-state switches in the multiple solid-state switch and with parallel connection side
Formula provides electric power to an at least subset for multiple output ends.
16. method described in any one of claim 12 to 15, wherein stirring described one in the multiple solid-state switch
A or multiple solid-state switches include stirring one or more of solid-state switches in the multiple solid-state switch with to described more
An at least subset for a output end provides electric power, to provide the high capacity operation mode of the thermoelectric device.
17. the method described in claim 16, wherein determining the first operator scheme or the second operator scheme includes
When the temperature by the cooling region of the thermoelectric device exceeds the steady-state range including set point temperatures, the thermoelectricity is determined
The high capacity operation mode of device.
18. the method as described in any one of claim 12 to 17, wherein stirring described one in the multiple solid-state switch
A or multiple solid-state switches include the one or more of solid-state switches stirred in the multiple solid-state switch, described in providing
The high efficiency manipulation mode of thermoelectric device.
19. method as claimed in claim 18, wherein determining the first operator scheme or the second operator scheme includes
It determines by the way that when the temperature in the cooling region of the thermoelectric device is including the described steady of the set point temperatures
When within the scope of state.
20. the method as described in any one of claim 12 to 19, wherein each of the multiple solid-state switch is gold
Belong to oxide semiconductor field effect transistor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762470003P | 2017-03-10 | 2017-03-10 | |
| US62/470,003 | 2017-03-10 | ||
| PCT/US2018/021524 WO2018165414A2 (en) | 2017-03-10 | 2018-03-08 | Solid-state switch architecture for multi-mode operation of a thermoelectric device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110537263A true CN110537263A (en) | 2019-12-03 |
Family
ID=61692158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880024438.XA Pending CN110537263A (en) | 2017-03-10 | 2018-03-08 | The solid-state switch framework of multi-mode operation for thermoelectric device |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180259231A1 (en) |
| EP (1) | EP3577697A2 (en) |
| JP (1) | JP2020510807A (en) |
| KR (1) | KR20190122848A (en) |
| CN (1) | CN110537263A (en) |
| WO (1) | WO2018165414A2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11152557B2 (en) | 2019-02-20 | 2021-10-19 | Gentherm Incorporated | Thermoelectric module with integrated printed circuit board |
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| JP2001330339A (en) * | 2000-05-19 | 2001-11-30 | Gac Corp | Peltier cooling unit and device |
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| CN104854414A (en) * | 2012-05-07 | 2015-08-19 | 弗诺尼克设备公司 | Systems and methods relating to thermoelectric heat exchange system |
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| JPH1132492A (en) * | 1997-05-14 | 1999-02-02 | Nissan Motor Co Ltd | Thermoelectric generation device and its drive method |
| US7002112B2 (en) * | 2002-02-04 | 2006-02-21 | Ricoh Company, Ltd. | Heating apparatus for increasing temperature in short period of time with minimum overshoot |
| US8216871B2 (en) | 2009-10-05 | 2012-07-10 | The Board Of Regents Of The University Of Oklahoma | Method for thin film thermoelectric module fabrication |
| US9999163B2 (en) * | 2012-08-22 | 2018-06-12 | International Business Machines Corporation | High-efficiency data center cooling |
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2018
- 2018-03-08 KR KR1020197029775A patent/KR20190122848A/en not_active Application Discontinuation
- 2018-03-08 US US15/915,638 patent/US20180259231A1/en not_active Abandoned
- 2018-03-08 EP EP18712403.7A patent/EP3577697A2/en not_active Withdrawn
- 2018-03-08 JP JP2019549429A patent/JP2020510807A/en active Pending
- 2018-03-08 CN CN201880024438.XA patent/CN110537263A/en active Pending
- 2018-03-08 WO PCT/US2018/021524 patent/WO2018165414A2/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001330339A (en) * | 2000-05-19 | 2001-11-30 | Gac Corp | Peltier cooling unit and device |
| CN101473175A (en) * | 2006-05-11 | 2009-07-01 | 生物辐射实验室股份有限公司 | Shared switching for multiple loads |
| WO2010088433A1 (en) * | 2009-01-28 | 2010-08-05 | Micro Q Llc | Thermo-electric heat pump systems |
| CN104854414A (en) * | 2012-05-07 | 2015-08-19 | 弗诺尼克设备公司 | Systems and methods relating to thermoelectric heat exchange system |
| CN103453688A (en) * | 2013-09-17 | 2013-12-18 | 北京鸿雁荣昌电子技术开发有限公司 | Thermoelectric refrigerating/heating system |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018165414A2 (en) | 2018-09-13 |
| KR20190122848A (en) | 2019-10-30 |
| WO2018165414A3 (en) | 2018-11-08 |
| EP3577697A2 (en) | 2019-12-11 |
| JP2020510807A (en) | 2020-04-09 |
| US20180259231A1 (en) | 2018-09-13 |
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Application publication date: 20191203 |