CN110516357B - Gold belt flexible interconnection thermosensitive parameter determination method for electric performance of microwave assembly - Google Patents
Gold belt flexible interconnection thermosensitive parameter determination method for electric performance of microwave assembly Download PDFInfo
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Abstract
The invention discloses a gold belt flexible interconnection thermosensitive parameter determining method for microwave assembly electrical performance, which comprises the steps of determining gold belt flexible interconnection geometric parameters, physical property parameters and electromagnetic transmission parameters, and carrying out parametric representation on gold belt flexible interconnection forms; determining the flexible interconnection working condition of the gold belt and the environmental temperature load, and establishing a flexible interconnection structure-thermal deformation analysis model of the gold belt; determining the thermal deformation of the flexible interconnection morphological parameters of the gold belt, and establishing an electromagnetic analysis model of the flexible interconnection structure of the gold belt; designing an orthogonal test of the thermal deformation parameters and the electrical performance indexes of the flexible interconnection form of the gold belt, and calculating the thermal influence degree of the flexible interconnection form parameters of the gold belt; and determining the thermosensitive parameters and the thermosensitive sensitivity of the morphological parameters of the flexible interconnection of the gold strips. The method can guide the design and optimization of the microwave assembly in consideration of the application environment, and improve the development quality of microwave products.
Description
Technical Field
The invention belongs to the technical field of microwave radio frequency circuits, and particularly relates to a gold-band flexible interconnection thermosensitive parameter determining method for microwave component electrical performance, which can be used for guiding module interconnection design and electromagnetic transmission performance regulation in a microwave component.
Background
Modern information and electronic technology is rapidly developed, and as a core of hardware technology support, a microwave component and a microwave circuit are widely applied to high-precision fields such as deep space exploration, target tracking, interconnection communication, various space applications and the like. The development of microwave electronic equipment gradually presents the development trend of high reliability, integration, miniaturization and high speed, so that the breakthrough of the development technology of high-quality microwave components becomes the urgent requirement of the technical development of electronic equipment.
The high-frequency active microwave assembly is usually connected with a circuit and a module by adopting a flexible interconnection structure, and the structure has the effects of buffering self and environmental load while realizing accurate signal transmission, so that the reliability of the circuit is obviously improved. However, it has been found that as the signal transmission frequency increases, the influence of the interconnection configuration change in the microwave module on the signal transmission performance increases dramatically, and even the microwave module fails to function. When the microwave electronic equipment is in service in a large temperature change and extreme temperature environment, the flexible interconnection form is easily influenced by temperature load to deform, and further the signal transmission is influenced. The problem of flexible interconnection thermal deformation of the circuit in the high-frequency microwave assembly is caused to be a key factor influencing the performance of the microwave assembly and restricting the development level of microwave electronic equipment to be improved under the working condition facing the extreme temperature.
At present, theoretical technical research is rarely seen in the aspect of influence of flexible interconnection form thermal deformation on signal transmission performance in microwave circuits and microwave assemblies. In engineering, research mostly stays on artificial experience and a large amount of interconnected thermodynamic software simulation, and the method is high in working cost, low in efficiency and poor in effect. Therefore, the golden-band flexible interconnection thermal sensitive parameter determination method oriented to the electrical performance of the microwave assembly is deeply researched aiming at a typical coaxial and microstrip interconnection structure in the microwave assembly, the parameterized, quantitative and accurate characterization is carried out on the golden-band flexible interconnection form, a thermal-interconnection structure-electromagnetic analysis model based on interconnection form characteristics is established, and interconnection form thermal sensitive parameter identification and form parameter thermal sensitivity calculation are broken through. And theoretical guidance is provided for engineering designers in the aspects of interconnection optimization design and thermal environment transmission performance regulation and control in the microwave assembly. The development level of high-frequency active microwave products is improved, and the high-performance service requirement of microwave electronic equipment under the extreme temperature environment is met.
Disclosure of Invention
In order to solve the problems, the invention provides a method for determining gold belt flexible interconnection thermosensitive parameters for microwave assembly electrical performance, so that gold belt flexible interconnection form thermosensitive parameters and form parameter thermal sensitivity can be determined quickly and accurately, and theoretical guidance is provided for improving microwave assembly performance and guaranteeing electrical performance in a complex environment.
The technical solution for realizing the purpose of the invention is that a method for determining gold belt flexible interconnection thermosensitive parameters for microwave assembly electrical performance comprises the following steps:
(1) determining the flexible interconnection geometric parameters and physical parameters of the gold belt according to the specific interconnection requirements of the high-frequency microwave assembly;
(2) determining flexible interconnection electromagnetic transmission parameters of the gold strips in the microwave assembly according to the interconnection working conditions and the performance indexes of the microwave assembly;
(3) carrying out parametric characterization on the flexible interconnection form of the gold belt according to the interconnection form of the microwave assembly and the actual research of engineering;
(4) determining the flexible interconnection working condition of the gold belt of the microwave assembly and the environmental temperature load according to the working requirement and working condition of the microwave assembly;
(5) establishing a gold belt flexible interconnection structure-thermal deformation analysis model according to the determined gold belt flexible interconnection geometric parameters, thermophysical parameters, morphological parametric characterization and working environment conditions in the microwave assembly;
(6) according to the established gold belt flexible interconnection structure-thermal deformation analysis model, solving the thermal deformation quantity of the gold belt flexible interconnection form parameter by using Ansys analysis;
(7) establishing a gold belt flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation parameters according to interconnection geometric and physical parameters, morphological parametric characterization and electromagnetic transmission parameters;
(8) determining factors, levels and indexes according to the gold strip flexible interconnection form parameters and the electrical performance evaluation indexes in the microwave assembly, and designing an orthogonal test of the gold strip flexible interconnection form thermal deformation parameters and the electrical performance indexes;
(9) calculating the heat influence degree of the gold belt flexible interconnection form parameter according to the analysis of the variance of the orthogonal test result;
(10) and determining the thermal sensitivity of the gold belt flexible interconnection form parameters and calculating the thermal sensitivity of the form parameters according to the thermal influence degree of the gold belt flexible interconnection form parameters.
Further, in the step (1), determining the geometric parameters of the flexible interconnection of the gold strips in the microwave assembly comprises: width B of gold belt, thickness T of gold belt and length L of horizontal section of gold belt1Gold belt half span P, gold belt micro-strip bonding length b4The coaxial bonding angle theta of the gold strip, the distance b from the gold strip to the end of the dielectric substrate2Length L of inner conductorcInner conductor diameter d1Distance b from the end of the inner conductor to the gold strip3A step g and an insulating medium length b1Diameter d of insulating medium2Length L of conductor stripmWidth W of the conductor stripmThickness H of the conductor strip1Length L of dielectric substratesWidth W of the dielectric substratesDielectric substrate thickness h2And a module gap S;
determining the electromagnetic property parameter includes: dielectric constant of dielectric substratesDielectric substrate loss tangent thetasDielectric constant of glassgAnd glass dielectric loss tangent thetag。
Determining the thermophysical parameter includes: the thermal physical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium comprise an elastic modulus E, a thermal expansion coefficient alpha and a Poisson ratio mu.
Further, in the step (2), determining the flexible interconnection electromagnetic transmission parameters of the gold band in the microwave assembly comprises: signal transmission frequency f, return loss S11And insertion loss S21。
Further, in the step (3), performing parameterized representation on the flexible interconnection form of the gold strip is performed according to the following steps:
(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region. Because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation;
(3b) according to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment;
(3c) according to characteristic analysis of the flexible interconnection form of the gold ribbon, the flexible interconnection form of the gold ribbon is divided into 5 sections for carrying out piecewise function representation, wherein the piecewise function representation comprises an AB circular arc section representation function of coaxial bonding of the gold ribbon, a BC straight section representation function of the upper part of a non-bonding area on the left side of the gold ribbon, a parabolic section representation function on a CD of the non-bonding area on the left side of the gold ribbon, a parabolic section representation function under a DE of the non-bonding area on the left side of the gold ribbon and an EF representation function of the straight section of the.
Further, in the step (4), the flexible interconnection working condition of the gold belt and the environment temperature load are determined, and the flexible interconnection working condition of the gold belt of the microwave assembly is determined to be an extreme temperature and large temperature change environment according to the working requirement and working condition of the microwave assembly. When a thermal analysis load is applied, the thermal shock temperature change range is set to Tmin～TmaxThe temperature rise and fall rate is TcThe peak holding times of high and low temperature are tkAnd determining the temperature cycle period.
When the thermal deformation analysis of the gold-strip flexible interconnection structure is carried out, in order to traverse each temperature process, a temperature load of 2 periods is applied to the interconnection structure.
Further, in the step (5), establishing a gold ribbon flexible interconnection structure-thermal deformation analysis model according to the following steps:
(5a) establishing a gold belt flexible interconnection structure-thermal deformation analysis model in Ansys software according to the microwave assembly gold belt flexible interconnection geometric parameters and physical parameters determined in the step (1) and the parameterized representation of the gold belt flexible interconnection form in the step (3);
(5b) the established model comprises an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a medium substrate; and (4) applying an environmental load to the gold strip flexible interconnection structure according to the temperature load determined in the step (4).
Further, in the step (6), solving the thermal deformation quantity of the flexible interconnection form parameter of the gold belt by using Ansys analysis is carried out according to the following steps:
(6a) according to the actual research of engineering, 6 main parameters influencing the flexible interconnection form of the gold strip are determined as follows: drop g, distance b from gold strip to end of dielectric substrate2Distance b from the end of the inner conductor to the gold strip3Gold strip microstrip bonding length b4Module spacing S and gold band half span P;
(6b) and (4) solving a result of the thermal deformation analysis of the flexible interconnected structure of the gold belt according to Ansys, and setting the thermal deformation amount to be a positive value when the thermal deformation of the parameter dimension is increased and the thermal deformation amount to be a negative value when the thermal deformation of the parameter dimension is decreased. Determining the flexible interconnection form parameter thermal deformation of the gold belt in (6a) accordingly;
(6c) and determining the size of the interconnection morphological parameters of the gold belt after the thermal deformation based on a thermal deformation formula.
Further, in the step (7), the established gold strip flexible interconnection structure-electromagnetic analysis model comprises an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a medium substrate.
Further, in the step (8), determining factors, levels and indexes, and designing an orthogonal test of the thermal deformation parameters and the electrical performance indexes of the flexible interconnection form of the gold ribbon according to the following steps:
(8a) selecting a horizontal numerical value of 6 factors and 7 factors at equal intervals for the flexible interconnection form of the gold belt considering thermal deformation according to the thermal deformation parameters and the thermal deformation amount of the interconnection form;
(8b) determining the flexible interconnection electromagnetic transmission performance indexes of the gold strap as return loss and insertion loss according to the flexible interconnection electromagnetic transmission parameters of the gold strap of the microwave assembly determined in the step (2);
(8c) design 6-factor 7 horizontal orthography L49(78) And analyzing and designing orthogonal tests of thermal deformation parameters and electrical performance indexes of the gold band flexible interconnection form by combining three-dimensional electromagnetic full-wave simulation software.
Further, in the step (9), calculating the heat influence degree of the gold-strip flexible interconnection form parameter is performed according to the following steps:
(9a) calculating the normalized heat influence degree of the gold belt flexible interconnection form parameter according to the analysis result of the orthogonal test variance;
(9b) meanwhile, the thermal influence degree of the flexible interconnection form parameter of the gold belt is calculated by integrating electrical performance indexes of return loss S11 and insertion loss S21.
Further, in the step (10), determining the thermosensitive parameters of the flexible interconnected morphology of the gold ribbon and calculating the thermal sensitivity of the morphological parameters are carried out according to the following steps:
(10a) according to the parameter degree of freedom fjAnd degree of freedom of error feAnd determining the threshold value F by combining the F distribution and the alpha quantileα(fj,fe) Calculating the normalized critical heat influence degree of the gold belt flexible interconnection form parameters;
(10b) meanwhile, the critical heat influence degree of the gold belt flexible interconnection form parameter is calculated by integrating electrical performance indexes facing return loss S11 and insertion loss S21;
(10c) normalizing heat influence degree according to gold strip flexible interconnection form parameters
And normalized critical heat influence degree
The judgment criterion for determining the thermosensitive parameters of the gold strip flexible interconnection form is as follows:
(10d) and determining the normalized thermal sensitivity of the interconnection form parameters according to the thermal influence degree of the flexible interconnection form parameters of the gold strips and the thermal sensitive parameter judgment criterion.
Compared with the prior art, the invention has the following characteristics:
1. the invention aims at a gold belt flexible interconnection structure of a microwave assembly and establishes an electrical property-oriented gold belt flexible interconnection form parameterized representation model. Based on the characterization model, the influence relation between the temperature load and the transmission performance of the flexible interconnection signal is researched, the thermosensitive parameters of the flexible interconnection form of the gold belt are determined, and the thermal sensitivity of the parameters of the interconnection form is calculated. The problems that influence association between flexible interconnection thermal deformation parameters and transmission performance in the microwave assembly is unclear and the thermal optimization design direction is unclear under the thermal load are solved.
2. By utilizing the method for determining the gold belt flexible interconnection thermosensitive parameters for the electric performance of the microwave component, the parameterized, quantitative and accurate characterization of the flexible interconnection form can be realized in the design, manufacture and working processes of the microwave component, the thermal sensitivity of the flexible interconnection form thermosensitive parameters and the form parameters can be quickly given out, theoretical guidance is provided for engineering designers in the aspects of module interconnection design and transmission performance regulation and control in the microwave component under the consideration of the influence of thermal environment loads, the working efficiency is improved, the product development cost is reduced, and the service performance of the product is guaranteed.
Drawings
FIG. 1 is a flow chart of a gold ribbon flexible interconnection thermal sensitive parameter determination method for microwave assembly electrical performance according to the present invention;
FIG. 2 is a schematic diagram of a flexible interconnection parameterized model of gold ribbon in view of thermal deformation;
FIG. 3 is a schematic representation of a gold ribbon flexible interconnect subsection;
FIG. 4 is a temperature-varying load curve;
FIG. 5 is a thermal deformation analysis model of a gold ribbon flexible interconnect structure;
FIG. 6 is a model of a gold ribbon flexible interconnect structure after thermal deformation meshing;
FIG. 7 is the total deformation of the flexible interconnection configuration of the gold bands at the highest temperature;
FIG. 8 is the total deformation of the flexible interconnection configuration of the gold bands at the lowest temperature moment;
FIG. 9 is a gold ribbon flexible interconnection structure-electromagnetic analysis model with thermal deformation parameters as variable regulation parameters;
Detailed Description
The invention is further explained below with reference to the drawings and the embodiments.
Referring to fig. 1, the invention relates to a method for determining gold ribbon flexible interconnection thermosensitive parameters for microwave assembly electrical performance, which comprises the following specific steps:
step 1, determining geometric parameters and physical parameters of flexible interconnection of gold bands in microwave assembly
Referring to fig. 2, the gold ribbon flexible interconnection in the high frequency microwave module includes a ground plate 1, a dielectric substrate 2 connected to an upper layer of the ground plate 1, a conductor ribbon 3 connected to the dielectric substrate 2 connected to an inner conductor 5 through a gold ribbon 6, and the inner conductor 5 connected to an insulating dielectric 4. And respectively determining the geometrical parameters and physical parameters of the gold ribbon interconnection in the microwave assembly according to the specific requirements of interconnection in the high-frequency microwave assembly.
Determining the geometric parameter includes: width B of gold belt, thickness T of gold belt and length L of horizontal section of gold belt1Gold belt half span P, gold belt micro-strip bonding length b4The coaxial bonding angle theta of the gold strip, the distance b from the gold strip to the end of the dielectric substrate2Length L of inner conductorcInner conductor diameter d1Distance b from the end of the inner conductor to the gold strip3A step g and an insulating medium length b1Diameter d of insulating medium2Length L of conductor stripmWidth W of the conductor stripmThickness H of the conductor strip1Length L of dielectric substratesWidth W of the dielectric substratesDielectric substrate thickness h2And a module gap S;
determining the electromagnetic property parameter includes: dielectric constant of dielectric substratesDielectric substrate loss tangent thetasDielectric constant of glassgAnd glass dielectric loss tangent thetag；
Determining the thermophysical parameter includes: the thermal physical property parameters of the dielectric substrate, the thermal physical property parameters of the conductor strip, the thermal physical property parameters of the gold strip, the thermal physical property parameters of the inner conductor and the thermal physical property parameters of the insulating medium. The specific thermal physical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium comprise an elastic modulus E, a thermal expansion coefficient alpha and a Poisson ratio mu.
Step 2, determining the flexible interconnection electromagnetic transmission parameters of the gold belt in the microwave assembly
Determining the flexible interconnection electromagnetic transmission parameters of the gold belt in the microwave assembly, which specifically comprises the following steps: signal transmission frequency f, echo lossConsume S11And insertion loss S21。
According to the interconnection form of the microwave assembly and the actual research of engineering, the flexible interconnection form of the gold belt is parameterized and characterized in sections, and referring to FIG. 3, the method comprises the following steps:
(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region. And because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation.
(3b) According to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment; let the intermediate variable:
(3c) according to the characteristic analysis of the flexible interconnection form of the gold belt, dividing the flexible interconnection form of the gold belt into 5 sections for performing piecewise function representation, wherein the representation function of the AB arc section of the coaxial bonding of the gold belt is as follows:
the characterization function of the BC straight line segment at the upper part of the left non-bonding area of the gold strip is as follows:
the characterization function of the parabolic segment on the left non-bonding region CD of the gold band is:
the parabolic section characterization function under the left non-bonding region DE of the gold strip is:
the characterization function of the EF straight line segment of the gold-strip microstrip bonding region is as follows:
According to the working requirements and working conditions of the microwave assembly, referring to fig. 4, determining that the flexible interconnection working conditions of the gold belt of the microwave assembly are extreme temperature and large temperature change environment; when a thermal analysis load is applied, the thermal shock temperature change range is set to Tmin～TmaxThe temperature rise and fall rate is TcThe peak holding times of high and low temperature are tkThe temperature cycle period Cy is then:
when the thermal deformation analysis of the gold-strip flexible interconnection structure is carried out, in order to traverse each temperature process, a temperature load of 2 periods is applied to the interconnection structure.
Establishing a gold belt flexible interconnection structure-thermal deformation analysis model according to the determined gold belt flexible interconnection geometric parameters, thermophysical parameters, morphological parametric characterization and working environment conditions in the microwave assembly, and referring to fig. 5 and 6, according to the following steps:
(5a) establishing a gold belt flexible interconnection structure-thermal deformation analysis model in Ansys software according to the microwave assembly gold belt flexible interconnection geometric parameters and physical parameters determined in the step (1) and the parameterized representation of the gold belt flexible interconnection form in the step (3);
(5b) the established model comprises an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a medium substrate; and (4) applying an environmental load to the gold strip flexible interconnection structure according to the temperature load determined in the step (4).
According to the established gold belt flexible interconnection structure-thermal deformation analysis model, thermal deformation of gold belt flexible interconnection form parameters is solved by using Ansys analysis, and the method is carried out according to the following steps with reference to fig. 7 and 8:
(6a) according to the actual research of engineering, 6 main parameters influencing the flexible interconnection form of the gold strip are determined as follows: drop g, distance b from gold strip to end of dielectric substrate2Distance b from the end of the inner conductor to the gold strip3Gold strip microstrip bonding length b4Module spacing S and gold band half span P;
(6b) according to Ansys, the analysis and solving result of the thermal deformation of the flexible interconnected structure of the gold belt is determined, and when the thermal deformation of the parameter size is increased, the thermal deformation amount is a positive value, and when the thermal deformation of the parameter size is decreased, the thermal deformation amount is a negative value; thus, determining the flexible interconnection form parameter thermal deformation of the gold belt in (6a) as:
Part＝(gt,b2t,b3t,b4t,St,Pt)，Part∈[parmin-par0,parmax-par0]
wherein, PartRepresenting a parametric heat distortion vector; gtIs the amount of thermal deformation by the fall, b2tThe amount of thermal deformation of the gold ribbon from the end of the dielectric substrate, b3tIs terminated by an inner conductorAmount of thermal deformation of gold ribbon from distance, b4tThermal deformation of the gold strip microstrip bonding length, StAmount of thermal deformation of module gap, PtThe half span thermal deformation of the gold strip is taken as the thermal deformation;
Parmin＝(gmin,(b2)min,(b3)min,(b4)min,Smin,Pmin) Representing a vector of minimum size of the parameter after thermal deformation;
wherein, gminIs the minimum value after thermal deformation of drop height, (b)2)minThe distance from the gold strip to the end of the dielectric substrate is the minimum after thermal deformation, (b)3)minThe minimum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)4)minIs the minimum value after thermal deformation of the gold strip microstrip bonding length, SminMinimum value of module gap after thermal deformation, PminIs the minimum value after the half span thermal deformation of the gold strip;
Par0＝(g0,b20,b30,b40,S0,P0) The vector of the initial values of the parameters is represented,
wherein, g0Is the initial value of the fall, b20An initial value of the distance from the gold strip to the end of the dielectric substrate, b30The initial distance from the end of the inner conductor to the gold strip, b40Is an initial value of the gold strip microstrip bonding length, S0Is an initial value of module gap, P0The initial value of the gold belt half span is obtained;
Parmax＝(gmax,(b2)max,(b3)max,(b4)max,Smax,Pmax) Representing the vector of the maximum value of the parameter after thermal deformation;
wherein, gmaxIs the maximum value after thermal deformation of drop height, (b)2)maxMaximum distance from the gold strip to the end of the dielectric substrate after thermal deformation, (b)3)maxMaximum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)4)maxIs the maximum value after thermal deformation of the gold strip microstrip bonding length, SmaxMaximum value of module gap after thermal deformation, PmaxFor gold ribbon half span thermal deformationThe posterior maximum;
(6c) based on a thermal deformation formula, determining the size vector of the interconnection morphological parameters of the gold belt after thermal deformation as follows:
Par＝Par0+Part＝(g0+gt,b20+b2t,b30+b3t,b40+b4t,S0+St,P0+Pt)。
step 7, establishing a flexible interconnection structure-electromagnetic analysis model taking the thermal deformation parameters as variable regulation and control parameters
Establishing a gold-strip flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation parameters according to interconnection geometric and physical parameters, morphological parametric characterization and electromagnetic transmission parameters, and referring to fig. 9, wherein the gold-strip flexible interconnection structure-electromagnetic analysis model is established in three-dimensional electromagnetic full-wave simulation analysis software according to the microwave assembly gold-strip flexible interconnection geometric parameters and physical parameters determined in the step (1), the microwave assembly gold-strip flexible interconnection electromagnetic transmission parameters determined in the step (2), the parametric characterization on the gold-strip flexible interconnection form determined in the step (3) and the thermal deformation gold-strip interconnection form parameter values determined in the step (6), and the established model is composed of edge media, inner conductors, gold strips, micro-strip conductors, dielectric substrates and the like.
Determining factors, levels and indexes according to the gold strip flexible interconnection form parameters and the electrical performance evaluation indexes in the microwave assembly, designing an orthogonal test of the gold strip flexible interconnection form thermal deformation parameters and the electrical performance indexes, and performing the following steps:
(8a) selecting the 6-factor 7 equal interval horizontal numerical values for the flexible interconnection form of the gold belt considering thermal deformation according to the thermal deformation parameters and the thermal deformation amount of the interconnection form as follows:
wherein (g)0+gt)v1～(g0+gt)v7Taking a value of 7 for the fall, (b)20+b2t)v1～(b20+b2t)v7The distance from the gold strip to the end of the dielectric substrate was taken to be 7 levels, (b)30+b3t)v1～(b30+b3t)v7Taking a value of 7 for the distance from the end of the inner conductor to the gold strip, (b)40+b4t)v1～(b40+b4t)v7The gold strip microstrip bonding length is taken as 7 horizontal values, (S)0+St)v1～(S0+St)v7Taking 7 horizontal values for module clearance, (P)0+Pt)v1～(P0+Pt)v7The value of 7 levels was taken for the gold band half span.
The factor level calculation formula in the table is:
wherein m is a horizontal number;
(8b) determining the flexible interconnection electromagnetic transmission performance indexes of the gold belt as return loss and insertion loss according to the flexible interconnection electromagnetic transmission parameters of the gold belt of the microwave assembly determined in the step (2):
Ind＝[S11 S21]；
(8c) design 6-factor 7 horizontal orthography L49(78) And analyzing and designing orthogonal tests of thermal deformation parameters and electrical performance indexes of the gold band flexible interconnection form by combining three-dimensional electromagnetic full-wave simulation software.
Step 9, calculating influence degree of flexible interconnection form parameters of the gold belt
Carrying out variance analysis according to the orthogonal test result, calculating the influence degree of the gold belt flexible interconnection form parameters, and carrying out the following steps:
(9a) calculating the normalized heat influence degree Eff of the gold belt flexible interconnection form parameter according to the analysis result of the orthogonal test variancejComprises the following steps:
in the above formula, FjThe ratio of the average difference sum of indexes corresponding to the jth parameter to the average difference sum of errors is obtained;
(9b) meanwhile, the heat influence degree of the gold strip flexible interconnection form parameter is calculated by integrating electrical performance indexes of return loss S11 and insertion loss S21
Comprises the following steps:
in the formula (I), the compound is shown in the specification,
the heat influence degree, Eff, of the gold strip flexible interconnection form parameter facing the return loss index S11S21The heat influence degree, w, of the gold strip flexible interconnection form parameter facing the insertion loss index S211And w2The weights corresponding to the thermal influence degrees are respectively.
Determining the thermal sensitivity parameters of the flexible interconnection form of the gold belt and calculating the thermal sensitivity of the form parameters according to the thermal influence degree of the flexible interconnection form parameters of the gold belt, and performing the following steps of:
(10a) according to the parameter degree of freedom fjAnd degree of freedom of error feAnd determining the threshold value F by combining the F distribution and the alpha quantileα(fj,fe) Calculating the normalized critical heat influence degree Eff of the gold strip flexible interconnection form parameterjαComprises the following steps:
(10b) instant noodlesAnd (4) integrating the electrical performance indexes of return loss S11 and insertion loss S21 to calculate the critical heat influence degree of the gold strip flexible interconnection form parameter
Comprises the following steps:
in the formula (I), the compound is shown in the specification,
the critical heat influence degree of the gold strip flexible interconnection form parameter facing the return loss index S11,
the critical heat influence degree of the gold strip flexible interconnection form parameter facing the insertion loss index S21;
(10c) normalizing heat influence degree according to gold strip flexible interconnection form parameters
And normalized critical heat influence degree
The judgment criterion for determining the thermosensitive parameters of the gold strip flexible interconnection form is as follows:
(10d) according to the heat influence degree of the gold-strip flexible interconnection form parameters and a heat-sensitive parameter judgment criterion, determining the normalized heat sensitivity of the interconnection form parameters as follows:
the advantages of the present invention can be further illustrated by the following example calculations:
firstly, determining geometric parameters and physical parameters of flexible interconnection of gold strips
In the experiment, a Ku waveband active phased array antenna T/R assembly is taken as an example, the influence of interconnection form thermal deformation on the microwave transmission performance of a circuit when a flexible interconnection structure in the T/R assembly is influenced by a thermal environment load is researched, and an interconnection form thermal-sensitive parameter facing microwave electrical performance transmission and a determination method of form parameter thermal sensitivity are researched. In order to simplify analysis, a typical coaxial circuit and microstrip circuit conversion structure in the T/R assembly is selected, and a shape correlation mechanism of the gold strip flexible interconnection affected by thermal load is explored. The schematic diagram of a parameterized model of the flexible interconnection of the gold strips considering thermal deformation is shown in FIG. 2, the geometric parameters and physical parameters of the flexible interconnection of the gold strips are shown in tables 1 and 2, and the electromagnetic working center frequency of the T/R assembly is 15 GHz.
TABLE 1 geometric and physical parameters of flexible interconnection of gold bands
TABLE 2 thermophysical parameters of flexible interconnection of gold bands
Secondly, calculating and solving the thermal deformation of the flexible interconnection form parameter of the gold belt
1. Determining the flexible interconnection working condition and the environmental temperature load of the gold belt
The T/R component gold belt flexible interconnection working conditions are extreme temperature and large temperature change environment. Referring to fig. 4, when a thermal analysis load is applied, the thermal shock temperature variation range is set to be-180 ℃ to +150 ℃, the temperature rising and falling rate is 66 ℃/s, the high and low temperature peak holding time is 900s, the temperature cycle period is 1810s, and the temperature load is applied for 2 periods.
2. Establishing a thermal deformation analysis model of a gold strip flexible interconnection structure
According to the T/R component gold belt flexible interconnection geometric parameters, physical parameters and interconnection form parameterized representation, a gold belt flexible interconnection structure-thermal deformation analysis model is established in Ansys software and is shown in figures 5 and 6. The model is composed of insulating medium, inner conductor, gold band, microstrip conductor and medium substrate. The gold ribbon flexible interconnect structure was subjected to an ambient temperature load application as shown in fig. 4.
3. Analyzing and calculating the thermal deformation of the flexible interconnection form parameter of the gold belt;
and analyzing the thermal deformation of the parameters of the flexible interconnection form of the gold belt by using Ansys software, and respectively calculating the thermal deformation of each parameter of the flexible interconnection form of the gold belt by combining a parameter thermal deformation calculation formula. The thermal deformation ranges for the interconnection characterization parameters are determined as shown in table 3 below.
TABLE 3 thermal deformation of key characterization parameters of gold belt interconnection morphology when temperature load is applied at-180-150 DEG C
Thirdly, determining the thermosensitive parameters of the flexible interconnection form of the gold belt and calculating the thermal sensitivity of the morphological parameters
1. Establishing a gold belt flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation and control parameters
According to the determined geometric parameters, physical parameters, morphological parametric characterization and electromagnetic transmission parameters of the flexible interconnection of the gold bands in the T/R assembly, a gold band flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation and control parameters is established in three-dimensional electromagnetic full-wave simulation analysis software as shown in fig. 9, and the established model comprises components such as an insulating medium, an inner conductor, a gold band, a micro-strip conductor, a medium substrate and the like.
2. Orthogonal test for designing thermal deformation parameters and electrical performance indexes of gold strip flexible interconnection form
(1) Determining flexible interconnection design variables, design initial values and design space of gold belt
According to the interconnection form of the microwave assembly and the actual research of engineering, and in combination with the thermal deformation of the flexible interconnection form parameter of the gold belt, the design variables, the initial design values and the design space corresponding to 6 regulation and control factors of the flexible interconnection form of the gold belt are determined as shown in the following table 4.
Table 4 design variables and design spaces for gold ribbon flexible interconnects
(2) Selecting orthogonal test factors, levels and indexes to design orthogonal test
Selecting equal-spacing 6-factor 7 horizontal numerical values for the flexible interconnection form of the gold strips according to the design space, and designing a 6-factor 7 horizontal orthogonal table L49(78) And analyzing and designing an orthogonal test of the gold belt flexible interconnection form parameters and the electromagnetic transmission performance indexes by combining three-dimensional electromagnetic full-wave simulation software by taking return loss and insertion loss as the electromagnetic transmission performance indexes.
3. Calculating heat influence degree of gold strip flexible interconnection form parameter
According to the analysis result of the orthogonal test variance, the calculation result of the thermoinfluence degree analysis of the gold belt flexible interconnection form parameters facing the return loss index S11 is as follows:
calculating the thermoinfluence degree analysis result of the gold belt flexible interconnection form parameter oriented to the insertion loss index S21 as follows:
taking the heat influence degree weight coefficients as w1＝w2When the value is 0.5, the gold-band flexible interconnection form parameter thermal influence degree is as follows for the comprehensive electrical performance indexes of return loss S11 and insertion loss S21:
4. determining thermosensitive parameters of flexible interconnection form of gold belt and calculating thermal sensitivity of morphological parameters
According to the parameter degree of freedom fjAnd degree of freedom of error feAnd determining the threshold value F by combining the F distribution and the alpha quantileα(fj,fe) Calculating the critical heat influence degree of the gold belt flexible interconnection form parameter facing the return loss index S11 as follows:
calculating the critical heat influence degree of the gold belt flexible interconnection form parameter facing the insertion loss index S21 as follows:
therefore, for the comprehensive electrical performance indexes of return loss S11 and insertion loss S21, the critical heat influence degree of the gold-strip flexible interconnection form parameter is as follows:
calculating according to the judgment criterion of the thermosensitive parameters of the gold strip flexible interconnection form:
then, the gold ribbon flexible interconnection form thermosensitive parameters facing the comprehensive electrical property are determined as follows:
Parc＝[b2 b4 S P]
according to a gold strip flexible interconnection form parameter normalization heat sensitivity calculation formula, calculating the heat sensitivity as follows:
RSenj＝[0 0.2148 0 0.2455 0.2378 0.3019]。
the present invention is not limited to the above-mentioned embodiments, and based on the technical solutions disclosed in the present invention, those skilled in the art can make some substitutions and modifications to some technical features without creative efforts according to the disclosed technical contents, and these substitutions and modifications are all within the protection scope of the present invention.
Claims (10)
1. A method for determining gold belt flexible interconnection thermosensitive parameters for electric properties of a microwave assembly is characterized by comprising the following steps:
(1) determining the flexible interconnection geometric parameters and thermophysical parameters of the gold belt according to the specific interconnection requirements of the high-frequency microwave assembly;
(2) determining flexible interconnection electromagnetic transmission parameters of the gold strips in the microwave assembly according to the interconnection working conditions and the performance indexes of the microwave assembly;
(3) carrying out parametric characterization on the flexible interconnection form of the gold belt according to the interconnection form of the microwave assembly and the actual research of engineering;
the method comprises the following steps:
(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region; because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation;
(3b) according to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment;
(3c) according to characteristic analysis of the flexible interconnection form of the gold ribbon, dividing the flexible interconnection form of the gold ribbon into 5 sections for performing piecewise function representation, wherein the piecewise function representation comprises an AB arc section representation function of coaxial bonding of the gold ribbon, a BC straight section representation function of the upper part of a left non-bonding area of the gold ribbon, a parabolic section representation function on a CD of the left non-bonding area of the gold ribbon, a parabolic section representation function under a DE of the left non-bonding area of the gold ribbon and an EF representation function of the straight section of the micro-strip bonding area of the gold ribbon;
(4) determining the flexible interconnection working condition of the gold belt of the microwave assembly and the environmental temperature load according to the working requirement and working condition of the microwave assembly;
(5) establishing a gold belt flexible interconnection structure-thermal deformation analysis model according to the determined gold belt flexible interconnection geometric parameters, thermophysical parameters, morphological parametric characterization and working environment conditions in the microwave assembly;
(6) according to the established gold belt flexible interconnection structure-thermal deformation analysis model, solving the thermal deformation quantity of the gold belt flexible interconnection form parameter by using Ansys analysis;
(7) establishing a gold belt flexible interconnection structure-electromagnetic analysis model taking thermal deformation parameters as variable regulation parameters according to interconnection geometry and thermophysical parameters, morphological parametric characterization and electromagnetic transmission parameters;
(8) determining factors, levels and indexes according to the gold strip flexible interconnection form parameters and the electrical performance evaluation indexes in the microwave assembly, and designing an orthogonal test of the gold strip flexible interconnection form thermal deformation parameters and the electrical performance indexes;
(9) calculating the heat influence degree of the gold belt flexible interconnection form parameter according to the analysis of the variance of the orthogonal test result;
(10) and determining the thermal sensitivity of the gold belt flexible interconnection form parameters and calculating the thermal sensitivity of the form parameters according to the thermal influence degree of the gold belt flexible interconnection form parameters.
2. The method for determining gold ribbon flexible interconnection thermal sensitive parameters of microwave module electrical performance according to claim 1, wherein in the steps (1) and (2), determining the gold ribbon flexible interconnection geometric parameters comprises: width B of gold belt, thickness T of gold belt and length L of horizontal section of gold belt1Gold belt half span P, gold belt micro-strip bonding length b4The coaxial bonding angle theta of the gold strip, the distance b from the gold strip to the end of the dielectric substrate2Length L of inner conductorcInner conductor diameter d1Distance b from the end of the inner conductor to the gold strip3A step g and an insulating medium length b1Diameter d of insulating medium2Length L of conductor stripmWidth W of the conductor stripmThickness H of the conductor strip1And a mediumSubstrate length LsWidth W of the dielectric substratesDielectric substrate thickness h2And a module gap S;
determining the electromagnetic transmission parameter comprises: dielectric constant of dielectric substratesDielectric substrate loss tangent thetasDielectric constant of glassgAnd glass dielectric loss tangent thetag；
The thermophysical parameters include: the thermophysical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium; the thermophysical parameters of the dielectric substrate, the conductor strip, the gold strip, the inner conductor and the insulating medium comprise an elastic modulus E, a thermal expansion coefficient alpha and a Poisson ratio mu;
in the step (2), the flexible interconnection electromagnetic transmission parameters of the gold band in the microwave assembly include: signal transmission frequency f, return loss S11And insertion loss S21。
3. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 2, wherein the step (3) is performed as follows:
(3a) according to the characteristic analysis of the flexible interconnection form of the gold belt, the interconnection form is divided into four regions which are respectively: the gold strip coaxial bonding region, the gold strip micro-strip bonding region, the left non-bonding region and the right non-bonding region; because the flexible interconnection of the gold strips has a symmetrical structure, the left half is selected for parametric representation;
(3b) according to morphological feature analysis of the left half side of the flexible interconnection of the gold strips, a Cartesian rectangular coordinate system is established, and the flexible interconnection of the gold strips is divided into 5 sections: respectively carrying out piecewise function representation on an AB arc segment, a BC straight-line segment, a CD upper parabolic segment, a DE lower parabolic segment and an EF straight-line segment; let the intermediate variable:
(3c) according to the characteristic analysis of the flexible interconnection form of the gold belt, dividing the flexible interconnection form of the gold belt into 5 sections for performing piecewise function representation, wherein the representation function of the AB arc section of the coaxial bonding of the gold belt is as follows:
the characterization function of the BC straight line segment at the upper part of the left non-bonding area of the gold strip is as follows:
the characterization function of the parabolic segment on the left non-bonding region CD of the gold band is:
the parabolic section characterization function under the left non-bonding region DE of the gold strip is:
the characterization function of the EF straight line segment of the gold-strip microstrip bonding region is as follows:
4. the method for determining gold ribbon flexible interconnection thermosensitive parameters for microwave assembly electrical performance according to claim 1, wherein the step (4) determines the microwave assembly gold ribbon flexible interconnection working conditions to be extreme temperature and large temperature change environment according to the microwave assembly working requirements and working conditions; when a thermal analysis load is applied, the thermal shock temperature change range is set to Tmin～TmaxThe temperature rise and fall rate is TcThe peak holding times of high and low temperature are tkThe temperature cycle period Cy is then:
when the thermal deformation analysis of the gold-strip flexible interconnection structure is carried out, in order to traverse each temperature process, a temperature load of 2 periods is applied to the interconnection structure.
5. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 1, wherein the step (5) is performed as follows:
(5a) establishing a gold belt flexible interconnection structure-thermal deformation analysis model in Ansys software according to the microwave assembly gold belt flexible interconnection geometric parameters and physical parameters determined in the step (1) and the parameterized representation of the gold belt flexible interconnection form in the step (3);
(5b) the established model comprises an insulating medium, an inner conductor, a gold strip, a microstrip conductor and a medium substrate; and (4) applying an environmental load to the gold strip flexible interconnection structure according to the temperature load determined in the step (4).
6. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 2, wherein the step (6) is performed as follows:
(6a) according to the actual research of engineering, 6 main parameters influencing the flexible interconnection form of the gold strip are determined as follows: drop g, distance b from gold strip to end of dielectric substrate2Distance b from the end of the inner conductor to the gold strip3Gold strip microstrip bonding length b4Module spacing S and gold band half span P;
(6b) according to Ansys, the analysis and solving result of the thermal deformation of the flexible interconnected structure of the gold belt is determined, and when the thermal deformation of the parameter size is increased, the thermal deformation amount is a positive value, and when the thermal deformation of the parameter size is decreased, the thermal deformation amount is a negative value; thus, determining the flexible interconnection form parameter thermal deformation of the gold belt in (6a) as:
Part＝(gt,b2t,b3t,b4t,St,Pt)，Part∈[parmin-par0,parmax-par0]
wherein, PartRepresenting a parametric heat distortion vector; gtIs the amount of thermal deformation by the fall, b2tThe amount of thermal deformation of the gold ribbon from the end of the dielectric substrate, b3tThe amount of thermal deformation of the distance from the end of the inner conductor to the gold band, b4tThermal deformation of the gold strip microstrip bonding length, StAmount of thermal deformation of module gap, PtThe half span thermal deformation of the gold strip is taken as the thermal deformation;
Parmin＝(gmin,(b2)min,(b3)min,(b4)min,Smin,Pmin) Representing a vector of minimum size of the parameter after thermal deformation;
wherein, gminIs the minimum value after thermal deformation of drop height, (b)2)minThe distance from the gold strip to the end of the dielectric substrate is the minimum after thermal deformation, (b)3)minThe minimum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)4)minIs the minimum value after thermal deformation of the gold strip microstrip bonding length, SminMinimum value of module gap after thermal deformation, PminIs the minimum value after the half span thermal deformation of the gold strip;
Par0＝(g0,b20,b30,b40,S0,P0) Representing parameter initial value vector;
wherein, g0Is the initial value of the fall, b20An initial value of the distance from the gold strip to the end of the dielectric substrate, b30The initial distance from the end of the inner conductor to the gold strip, b40Is an initial value of the gold strip microstrip bonding length, S0Is an initial value of module gap, P0The initial value of the gold belt half span is obtained;
Parmax＝(gmax,(b2)max,(b3)max,(b4)max,Smax,Pmax) Representing the vector of the maximum value of the parameter after thermal deformation;
wherein, gmaxIs the maximum value after thermal deformation of drop height, (b)2)maxFor heating the distance from the gold strip to the end of the dielectric substrateMaximum after deformation, (b)3)maxMaximum distance from the end of the inner conductor to the gold strip after thermal deformation, (b)4)maxIs the maximum value after thermal deformation of the gold strip microstrip bonding length, SmaxMaximum value of module gap after thermal deformation, PmaxThe maximum value after the gold strip is subjected to half span thermal deformation;
(6c) based on a thermal deformation formula, determining the size vector of the interconnection morphological parameters of the gold belt after thermal deformation as follows:
Par＝Par0+Part＝(g0+gt,b20+b2t,b30+b3t,b40+b4t,S0+St,P0+Pt)。
7. the method for determining gold-ribbon flexible interconnection thermal sensitive parameters of electric properties of microwave assemblies according to claim 1, wherein the gold-ribbon flexible interconnection structure-electromagnetic analysis model established in step (7) comprises an insulating medium, an inner conductor, a gold ribbon, a microstrip conductor and a dielectric substrate.
8. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 6, wherein the step (8) is performed as follows:
(8a) selecting the 6-factor 7 equal interval horizontal numerical values for the flexible interconnection form of the gold belt considering thermal deformation according to the thermal deformation parameters and the thermal deformation amount of the interconnection form as follows:
wherein (g)0+gt)v1～(g0+gt)v7Taking a value of 7 for the fall, (b)20+b2t)v1～(b20+b2t)v7The distance from the gold strip to the end of the dielectric substrate was taken to be 7 levels, (b)30+b3t)v1～(b30+b3t)v7Is insideThe distance from the end of the conductor to the gold strip is 7 horizontal values, (b)40+b4t)v1～(b40+b4t)v7The gold strip microstrip bonding length is taken as 7 horizontal values, (S)0+St)v1～(S0+St)v7Taking 7 horizontal values for module clearance, (P)0+Pt)v1～(P0+Pt)v7Taking a horizontal value of 7 for the half span of the gold belt;
the factor level calculation formula in the table is:
wherein m is a horizontal number;
(8b) determining the flexible interconnection electromagnetic transmission performance indexes of the gold belt as return loss and insertion loss according to the flexible interconnection electromagnetic transmission parameters of the gold belt of the microwave assembly determined in the step (2): ind ═ S11S 21;
(8c) design 6-factor 7 horizontal orthography L49(78) And analyzing and designing orthogonal tests of thermal deformation parameters and electrical performance indexes of the gold band flexible interconnection form by combining three-dimensional electromagnetic full-wave simulation software.
9. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 1, wherein the step (9) is performed as follows:
(9a) according to the analysis result of the variance of the orthogonal test, calculating the normalized heat influence degree of the gold belt flexible interconnection form parameters as follows:
in the above formula, FjThe ratio of the average difference sum of indexes corresponding to the jth parameter to the average difference sum of errors is obtained;
(9b) meanwhile, for the comprehensive electrical performance indexes of return loss S11 and insertion loss S21, the heat influence degree of the gold strip flexible interconnection form parameter is calculated as follows:
in the formula (I), the compound is shown in the specification,
the heat influence degree, Eff, of the gold strip flexible interconnection form parameter facing the return loss index S11S21The heat influence degree, w, of the gold strip flexible interconnection form parameter facing the insertion loss index S211And w2The weights corresponding to the thermal influence degrees are respectively.
10. The method for determining gold ribbon flexible interconnection thermosensitive parameters for electric properties of microwave assemblies according to claim 9, wherein the step (10) is performed as follows:
(10a) according to the parameter degree of freedom fjAnd degree of freedom of error feAnd determining the threshold value F by combining the F distribution and the alpha quantileα(fj,fe) Calculating the normalized critical heat influence degree Eff of the gold strip flexible interconnection form parameterjαComprises the following steps:
(10b) meanwhile, the critical heat influence degree of the gold belt flexible interconnection form parameter is calculated by aiming at the comprehensive electrical performance indexes of return loss S11 and insertion loss S21
Comprises the following steps:
in the formula (I), the compound is shown in the specification,
the critical heat influence degree of the gold strip flexible interconnection form parameter facing the return loss index S11,
the critical heat influence degree of the gold strip flexible interconnection form parameter facing the insertion loss index S21;
(10c) normalizing heat influence degree according to gold strip flexible interconnection form parameters
And normalized critical heat influence degree
The judgment criterion for determining the thermosensitive parameters of the gold strip flexible interconnection form is as follows:
(10d) determining interconnection form parameter normalization thermal sensitivity RSen according to the thermal influence degree of the gold-strip flexible interconnection form parameter and combining a thermal sensitive parameter judgment criterionjComprises the following steps:
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