CN110501812A - A kind of MEMS scanning mirror - Google Patents

A kind of MEMS scanning mirror Download PDF

Info

Publication number
CN110501812A
CN110501812A CN201910839155.7A CN201910839155A CN110501812A CN 110501812 A CN110501812 A CN 110501812A CN 201910839155 A CN201910839155 A CN 201910839155A CN 110501812 A CN110501812 A CN 110501812A
Authority
CN
China
Prior art keywords
stress
bent beam
mems scanning
scanning mirror
movable comb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910839155.7A
Other languages
Chinese (zh)
Inventor
沙华露
汪为民
冯奇
王强
宁文果
王锦
楚延鹏
李加鑫
高咏
王帅
李智星
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Optics and Electronics of CAS
SAIC Motor Corp Ltd
Original Assignee
Institute of Optics and Electronics of CAS
SAIC Motor Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Optics and Electronics of CAS, SAIC Motor Corp Ltd filed Critical Institute of Optics and Electronics of CAS
Priority to CN201910839155.7A priority Critical patent/CN110501812A/en
Publication of CN110501812A publication Critical patent/CN110501812A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10Scanning systems

Abstract

The invention discloses a kind of MEMS scanning mirrors, comprising: mirror body;The two sides of the mirror body are respectively connected with flexible stress bent beam, and the stress bent beam through-thickness residual stress is reduced from top layer to bottom;Movable comb, the movable comb are mounted on the side of the stress bent beam;Fixed broach, described fixed broach one end fixed and arranged, the other end and the stress bent beam arranged for interval;Torsion beam, described torsion beam one end are connected with the stress bent beam other end, and the torsion beam other end is connected with fixing piece.It is mismatched using the residual stress bring stress in processing technology, makes the buckling deformation of stress bent beam and drive movable comb spontaneous and generate difference in height with fixed broach.Residual stress is difficult to avoid that always more or less exist in micro-nano technology technique, therefore, realizes that vertical comb teeth does not need additional manufacturing process based on residual stress, reduces costs, and have the advantages such as self assembly, autoregistration.

Description

A kind of MEMS scanning mirror
Technical field
The present invention relates to the technical field of micro-opto-electromechanical system, in particular to a kind of MEMS scanning mirror.
Background technique
MEMS (Micro-Electro-Mechanical System) scanning mirror based on micro-opto-electromechanical system technology can be real Now to the accurate control and positioning of (laser) beam direction, while also having many advantages, such as that small in size, speed is fast, at low cost, thus It is had broad application prospects in all various aspects such as Projection Display, laser radar, laser processing, free space optical communication.
For scanning mode, MEMS scanning mirror can be divided into resonant mode scanning and Quasi-static scan.It is quasi-static compared to humorous Vibration formula has the advantages such as frequency requirement is low, have a wide range of application, control algolithm is simple.
Wherein, MEMS vertical comb drive is a kind of mainstream driving method for realizing Quasi-static scan, and conventional comb teeth drives The fixed broach and movable comb of dynamic device are located in the same plane, and the fixed broach of vertical comb drive and movable comb Be not located in the same plane, there are a differences in height, thus make after power-up driving movable comb to fixed broach it is mobile or Quasi-static scan is realized in inclination.
Existing vertical comb teeth structure, it is at high cost when obtaining comb teeth difference in height, it is unfavorable for producing in enormous quantities.
Therefore, how a kind of MEMS scanning mirror is provided, cost is reduced, is that those skilled in the art's technology urgently to be resolved is asked Topic.
Summary of the invention
In view of this, reducing cost the purpose of the present invention is to provide a kind of MEMS scanning mirror.
To achieve the above object, the invention provides the following technical scheme:
A kind of MEMS scanning mirror comprising:
Mirror body;
The two sides of the mirror body are respectively connected with flexible stress bent beam, and the stress bent beam through-thickness is residual Residue stress is reduced from top layer to bottom;
Movable comb, the movable comb are mounted on the side of the stress bent beam;
Fixed broach, described fixed broach one end fixed and arranged, the other end and the stress bent beam arranged for interval;
Torsion beam, described torsion beam one end are connected with the stress bent beam other end, the torsion beam other end and solid Determine part to be connected.
Preferably, in above-mentioned MEMS scanning mirror, the stress bent beam is double-layer structure, and the remnants of primer are answered Power is less than the residual stress of the quilting material, and the movable comb is connected with the top layer of the stress bent beam.
Preferably, in above-mentioned MEMS scanning mirror, the primer of the stress bent beam is monocrystalline silicon or polysilicon, institute The quilting material for stating stress bent beam is silica.
Preferably, in above-mentioned MEMS scanning mirror, one end that the fixing piece is used to be connected with the torsion beam has narrow Seam.
Preferably, in above-mentioned MEMS scanning mirror, the surface of the mirror body is round, ellipse or rectangle.
Preferably, in above-mentioned MEMS scanning mirror, the surface of the mirror body is deposited with for improving the thin of wave band reflectivity Film.
Preferably, in above-mentioned MEMS scanning mirror, the stress bent beam and the torsion beam are corresponded, and about The mirror body is arranged symmetrically.
Preferably, in above-mentioned MEMS scanning mirror, the movable comb is distributed in the two sides of the stress bent beam, and closes It is arranged symmetrically in the stress bent beam.
As can be seen from the above technical solutions, a kind of MEMS scanning mirror disclosed in this invention, using in processing technology Residual stress bring stress mismatches, and makes the buckling deformation of stress bent beam and drives movable comb spontaneous and generate with fixed broach Difference in height.Residual stress is difficult to avoid that always more or less exist, therefore, answer based on remnants in micro-nano technology technique Power realizes that vertical comb teeth does not need additional manufacturing process, reduces costs, and has the advantages such as self assembly, autoregistration.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, below to embodiment or existing Attached drawing needed in technical description is briefly described, it is clear that, the accompanying drawings in the following description is only this hair Bright embodiment for those of ordinary skill in the art without creative efforts, can also be according to mentioning The attached drawing of confession obtains other attached drawings.
Fig. 1 is the structural schematic diagram of MEMS scanning mirror disclosed in the embodiment of the present invention;
Fig. 2 is the comparison diagram of the bending of MEMS scanning mirror disclosed in embodiment of the present invention front and back;
Fig. 3 is the comparison diagram of the inclination of MEMS scanning mirror disclosed in embodiment of the present invention front and back.
Specific embodiment
In view of this, core of the invention is to provide a kind of MEMS scanning mirror, cost is reduced.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description The present invention is described in further detail.
As shown in Figure 1-Figure 3, the invention discloses a kind of MEMS scanning mirrors comprising: mirror body 1, stress bent beam 2, can Dynamic comb teeth 5, fixed broach 6 and torsion beam 3.Wherein, stress bent beam 2 can be bent, and one end connection 1 other end of mirror body connects Connect torsion beam 3, the 2 through-thickness residual stress of stress bent beam from top layer to bottom reduce, with realize stress bent beam 2 by Warpage occurs when power;The two sides of mirror body 1 are provided with stress bent beam 2, and the side of stress bent beam 2 is equipped with movable comb 5, fixed broach 6 and 5 arranged for interval of movable comb, and 6 one end of fixed broach is fixed;Above-mentioned 3 one end of torsion beam with answer Power bent beam 2 is connected, and the other end is connected with fixing piece 4.When work, not using the residual stress bring stress in processing technology Matching makes 2 buckling deformation of stress bent beam and drives movable comb 5 spontaneous and generate difference in height with fixed broach 6.Residual stress exists It is difficult to avoid that always more or less exist in micro-nano technology technique, therefore, realizes that vertical comb teeth is not required to based on residual stress Additional manufacturing process is wanted, is reduced costs, and there are the advantages such as self assembly, autoregistration.
In further embodiment, above-mentioned stress bent beam 2 is double-layer structure, and the residual stress that primer is Less than the residual stress of quilting material.Specifically, stress bent beam 2 can be by bottom zero stress material and top compression material Expect the double-layer structure of composition, equally there is stress gradient, and meets the condition that top has bigger residual stress than bottom.For The position change for realizing movable comb 5, movable comb 5 is connected with the top layer of stress bent beam 2.It in practice can also basis Different needs to set multilayered structure for stress bent beam 2, as long as guaranteeing the residual stress along short transverse from top layer the bottom of to Layer reduces.
In preferred embodiment, the primer of above-mentioned stress bent beam 2 is the monocrystalline silicon that vertical pulling method is prepared and is sliced Or polysilicon, residual stress can be considered zero;And quilting material is the silica of deposition, has biggish residual stress.It is above-mentioned Material may be implemented under the action of residual stress, be bent stress bent beam 2.Other materials can also be used in practice, as long as Guarantee that the residual stress of primer is less than the residual stress of quilting material.
Specifically, after the above-mentioned MEMS scanning mirror of processing is completed and discharged, due to the remnants of 2 double layer material of stress bent beam Stress is different, so that total is bent upwards, i.e., shown in Fig. 2, and the more long then bending amplitude of stress bent beam 2 is bigger, Gu Determine to form vertical comb teeth structure between comb teeth 6 and movable comb 5.Change the length of stress bent beam 2, so that it may convenient to change vertically The vertical drop of comb structure.
In further embodiment, there is slit 7 in one end that fixing piece 4 is used to be connected with torsion beam 3.Due to slit 7 presence, so that the constraint that torsion beam 3 is subject to is smaller, structure is easier to reverse, thus there are scanning angle when slit 7 is bigger. Due to the presence of slit 7, the freely-supported approximate with 7 junction of slit of torsion beam 3, thus the upturned height of stress bent beam 2 is more Greatly, so that vertical comb teeth difference in height is bigger.
In one embodiment, the surface of the mirror body 1 in the application is round, ellipse or rectangle.For 1 table of mirror body The shape in face, the i.e. shape of mirror body 1 can be configured according to different needs, in practice can in order to guarantee 1 two sides of mirror body Dynamic 5 vertical angle of comb teeth is always, it is preferred that sets whole left and right symmetrical structure for mirror body 1, and has been arranged symmetrically in two sides Stress bent beam 2 and torsion beam 3, torsion beam 3 and stress bent beam 2 correspond arrangement, keep entirety symmetrical about mirror body 1, with Guarantee to guarantee 1 surfacing of mirror body in 2 stress of the stress bent beam deformation of two sides.It is answered specifically, movable comb 5 is located at The side of power bent beam 2 shares 4 groups, and fixed broach 6 is placed corresponding thereto, equally there is 4 groups.
In order to improve the working effect of the MEMS scanning mirror in the application, it is deposited on the surface of mirror body 1 for improving wave The film of section reflectivity.The film for being correspondingly improved the wave band reflectivity can be deposited according to applied optical band.
When work, by applying potential difference between fixed broach 6 and movable comb 5, so that it may comb movable comb 5 to fixed Tooth 6 tilts, and drives mirror body 1 to tilt to the direction, torsion beam 3 twists at this time.Different potential differences, which can be realized, different to incline Rake angle.After removing potential difference, due to the elastic force of torsion beam 3, structure will be returned to the original state being not powered on, that is, scheme 3。
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other The difference of embodiment, the same or similar parts in each embodiment may refer to each other.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one The widest scope of cause.

Claims (8)

1. a kind of MEMS scanning mirror characterized by comprising
Mirror body (1);
The two sides of the mirror body (1) are respectively connected with flexible stress bent beam (2), and the stress bent beam (2) is along thickness Direction residual stress is reduced from top layer to bottom;
Movable comb (5), the movable comb (5) are mounted on the side of the stress bent beam (2);
Fixed broach (6), described fixed broach (6) one end fixed and arranged, the other end and the stress bent beam (2) are spaced cloth It sets;
Torsion beam (3), described torsion beam (3) one end are connected with stress bent beam (2) other end, and the torsion beam (3) is another One end is connected with fixing piece (4).
2. MEMS scanning mirror according to claim 1, which is characterized in that the stress bent beam (2) is double-layer structure, and The residual stress of primer is less than the residual stress of the quilting material, the movable comb (5) and the stress bent beam (2) top layer is connected.
3. MEMS scanning mirror according to claim 2, which is characterized in that the primer of the stress bent beam (2) is Monocrystalline silicon or polysilicon, the quilting material of the stress bent beam (2) are silica.
4. MEMS scanning mirror according to claim 1, which is characterized in that the fixing piece (4) is used for and the torsion beam (3) connected one end has slit (7).
5. MEMS scanning mirror according to claim 1, which is characterized in that the surface of the mirror body (1) is round, ellipse Or rectangle.
6. MEMS scanning mirror according to claim 1, which is characterized in that the surface of the mirror body (1) is deposited with for mentioning The film of high band reflectivity.
7. MEMS scanning mirror according to claim 1-6, which is characterized in that the stress bent beam (2) and institute Torsion beam (3) one-to-one correspondence is stated, and is arranged symmetrically about the mirror body (1).
8. MEMS scanning mirror according to claim 1-6, which is characterized in that the movable comb (5) is distributed in The two sides of the stress bent beam (2), and be arranged symmetrically about the stress bent beam (2).
CN201910839155.7A 2019-09-05 2019-09-05 A kind of MEMS scanning mirror Pending CN110501812A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910839155.7A CN110501812A (en) 2019-09-05 2019-09-05 A kind of MEMS scanning mirror

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910839155.7A CN110501812A (en) 2019-09-05 2019-09-05 A kind of MEMS scanning mirror

Publications (1)

Publication Number Publication Date
CN110501812A true CN110501812A (en) 2019-11-26

Family

ID=68591278

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910839155.7A Pending CN110501812A (en) 2019-09-05 2019-09-05 A kind of MEMS scanning mirror

Country Status (1)

Country Link
CN (1) CN110501812A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110879466A (en) * 2019-12-04 2020-03-13 中国科学院光电技术研究所 Device for realizing low-frequency large-angle MEMS scanning mirror
CN113135547A (en) * 2021-03-10 2021-07-20 苏州深水渔半导体有限公司 Optical chip and method for producing the same
CN113900250A (en) * 2021-10-19 2022-01-07 中国科学院光电技术研究所 Self-adaptive optical system deformable mirror and Hartmann wavefront sensor alignment method

Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209562A (en) * 1997-08-26 1999-03-03 三星电子株式会社 Regulator for changing light path having unsymmetrical rigid structure and driving method therefor
US6123985A (en) * 1998-10-28 2000-09-26 Solus Micro Technologies, Inc. Method of fabricating a membrane-actuated charge controlled mirror (CCM)
JP2001264650A (en) * 2000-03-14 2001-09-26 Japan Aviation Electronics Industry Ltd Minute movable device and its manufacturing method
US20050254149A1 (en) * 2004-05-11 2005-11-17 Orcutt John W Bracket for supporting a torsional hinge mirror with reduced hinge stress
CN1731236A (en) * 2005-07-15 2006-02-08 清华大学 Sheet type two-dimensional piezoelectric light reflection structure
CN1739053A (en) * 2002-11-22 2006-02-22 先进奈米系统公司 MEMS scanning mirror having tunable natural frequency
CN1756061A (en) * 2004-09-29 2006-04-05 朗迅科技公司 Monolithic MEMS device having a balanced cantilever plate
JP2006201519A (en) * 2005-01-20 2006-08-03 Ricoh Co Ltd Optical scanner and image forming apparatus
JP2008164827A (en) * 2006-12-27 2008-07-17 Brother Ind Ltd Optical scanning element, optical scanner, optical scanning type display device, retina scanning type display device, and method of forming through hole in optical scanning element
CN101618848A (en) * 2008-07-04 2010-01-06 探微科技股份有限公司 Torsion-type MEMS element
CN101718906A (en) * 2009-11-12 2010-06-02 中国电子科技集团公司第十三研究所 Micro reflector array manufacturing method
CN101881880A (en) * 2010-06-02 2010-11-10 中山市张家边企业集团有限公司企业技术中心 Micro-mirror structure and manufacturing method thereof
CN101907769A (en) * 2010-07-01 2010-12-08 西北工业大学 Silicon on insulator (SOI) wafer double-mask etching-based vertical comb teeth driven torsional micro-mirror and manufacturing method thereof
CN102067009A (en) * 2008-06-25 2011-05-18 松下电工株式会社 Movable structure and micro-mirror element using the same
CN103149684A (en) * 2013-02-07 2013-06-12 东南大学 Two-way twistable staggered-comb teeth electrostatic driving variable optical attenuator and manufacture method thereof
CN103901609A (en) * 2014-03-26 2014-07-02 重庆大学 Movable MEMS large turning angle blazed grating light modulator based on double-layer comb drive
CN104737051A (en) * 2012-06-01 2015-06-24 巴尔科股份有限公司 Method and apparatus for constructing a thin film mirror
CN104765144A (en) * 2015-03-20 2015-07-08 西北工业大学 Electromagnetism-static electricity hybrid driven two-dimensional micro scanning mirror and manufacturing method
CN105549200A (en) * 2011-10-03 2016-05-04 三美电机株式会社 Optical scanning device
CN107490857A (en) * 2017-08-08 2017-12-19 西安知微传感技术有限公司 A kind of galvanometer of static broach driving
CN109725414A (en) * 2017-10-30 2019-05-07 英飞凌科技股份有限公司 The mirror device for having the leaf spring with opening
CN208872943U (en) * 2018-09-30 2019-05-17 上海芯惠科技有限公司 A kind of New Two Dimensional scanning micro-mirror

Patent Citations (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1209562A (en) * 1997-08-26 1999-03-03 三星电子株式会社 Regulator for changing light path having unsymmetrical rigid structure and driving method therefor
US6123985A (en) * 1998-10-28 2000-09-26 Solus Micro Technologies, Inc. Method of fabricating a membrane-actuated charge controlled mirror (CCM)
JP2001264650A (en) * 2000-03-14 2001-09-26 Japan Aviation Electronics Industry Ltd Minute movable device and its manufacturing method
CN1739053A (en) * 2002-11-22 2006-02-22 先进奈米系统公司 MEMS scanning mirror having tunable natural frequency
US20050254149A1 (en) * 2004-05-11 2005-11-17 Orcutt John W Bracket for supporting a torsional hinge mirror with reduced hinge stress
CN1756061A (en) * 2004-09-29 2006-04-05 朗迅科技公司 Monolithic MEMS device having a balanced cantilever plate
JP2006201519A (en) * 2005-01-20 2006-08-03 Ricoh Co Ltd Optical scanner and image forming apparatus
CN1731236A (en) * 2005-07-15 2006-02-08 清华大学 Sheet type two-dimensional piezoelectric light reflection structure
JP2008164827A (en) * 2006-12-27 2008-07-17 Brother Ind Ltd Optical scanning element, optical scanner, optical scanning type display device, retina scanning type display device, and method of forming through hole in optical scanning element
CN102067009A (en) * 2008-06-25 2011-05-18 松下电工株式会社 Movable structure and micro-mirror element using the same
CN101618848A (en) * 2008-07-04 2010-01-06 探微科技股份有限公司 Torsion-type MEMS element
CN101718906A (en) * 2009-11-12 2010-06-02 中国电子科技集团公司第十三研究所 Micro reflector array manufacturing method
CN101881880A (en) * 2010-06-02 2010-11-10 中山市张家边企业集团有限公司企业技术中心 Micro-mirror structure and manufacturing method thereof
CN101907769A (en) * 2010-07-01 2010-12-08 西北工业大学 Silicon on insulator (SOI) wafer double-mask etching-based vertical comb teeth driven torsional micro-mirror and manufacturing method thereof
CN105549200A (en) * 2011-10-03 2016-05-04 三美电机株式会社 Optical scanning device
CN104737051A (en) * 2012-06-01 2015-06-24 巴尔科股份有限公司 Method and apparatus for constructing a thin film mirror
CN103149684A (en) * 2013-02-07 2013-06-12 东南大学 Two-way twistable staggered-comb teeth electrostatic driving variable optical attenuator and manufacture method thereof
CN103901609A (en) * 2014-03-26 2014-07-02 重庆大学 Movable MEMS large turning angle blazed grating light modulator based on double-layer comb drive
CN104765144A (en) * 2015-03-20 2015-07-08 西北工业大学 Electromagnetism-static electricity hybrid driven two-dimensional micro scanning mirror and manufacturing method
CN107490857A (en) * 2017-08-08 2017-12-19 西安知微传感技术有限公司 A kind of galvanometer of static broach driving
CN109725414A (en) * 2017-10-30 2019-05-07 英飞凌科技股份有限公司 The mirror device for having the leaf spring with opening
CN208872943U (en) * 2018-09-30 2019-05-17 上海芯惠科技有限公司 A kind of New Two Dimensional scanning micro-mirror

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JIN-CHERN CHIOU ET,AL: "A Micromirror With Large Static Rotation and Vertical Actuation", 《IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS》 *
JUNWEI CHUNG ET,AL: "Fabrication of a polymer-based torsional vertical comb drive using a double-side partial exposure method", 《JOURNAL OF MICROMECHANICS AND MICROENGINEERING》 *
ZEWDU HAILU ET,AL: "A novel vertical comb-drive electrostatic actuator using a one layer process", 《JOURNAL OF MICROMECHANICS AND MICROENGINEERING》 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110879466A (en) * 2019-12-04 2020-03-13 中国科学院光电技术研究所 Device for realizing low-frequency large-angle MEMS scanning mirror
CN113135547A (en) * 2021-03-10 2021-07-20 苏州深水渔半导体有限公司 Optical chip and method for producing the same
CN113135547B (en) * 2021-03-10 2024-04-19 苏州深水渔半导体有限公司 Method for producing optical chip
CN113900250A (en) * 2021-10-19 2022-01-07 中国科学院光电技术研究所 Self-adaptive optical system deformable mirror and Hartmann wavefront sensor alignment method
CN113900250B (en) * 2021-10-19 2023-07-18 中国科学院光电技术研究所 Alignment method of adaptive optical system deformable mirror and Hartmann wavefront sensor

Similar Documents

Publication Publication Date Title
CN110501812A (en) A kind of MEMS scanning mirror
CA2487819C (en) Bulk silicon mirrors with hinges underneath
JP5157857B2 (en) Vibration mirror element
EP2749526A1 (en) Scanning mirror device
US20030019832A1 (en) Staggered torsional electrostatic combdrive and method of forming same
JP5292880B2 (en) Image display device
CN1580862A (en) Micro-oscillating element
CN106707415B (en) Adjustable optical device
JP6451078B2 (en) Optical scanning device
JP2007006587A (en) Actuator
TWI287393B (en) Scanning device and fabrication method thereof
JP5853933B2 (en) Optical scanning apparatus and manufacturing method
JP2013097139A (en) Micro-scanner
EP3543768B1 (en) Image projection apparatus and movable body
US20210325671A1 (en) Image projection device and mobile body
JP2009093105A (en) Micromirror device, and mirror part forming method
JP2012058662A (en) Optical scanner and image projection device
US11933967B2 (en) Distally actuated scanning mirror
JP2014142517A (en) Oscillation mirror element and electronic apparatus having projector function
JP2008086067A (en) Movable structural body and optical element equipped with the same
CN219320572U (en) Piezoelectric MEMS mirror
CN219179704U (en) Piezoelectric MEMS reflector
CN219179703U (en) Piezoelectric driving MEMS reflector
JP5381751B2 (en) Optical scanner and image display apparatus using optical scanner
KR100706319B1 (en) Method for manufacturing scanning micromirror

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20191126

RJ01 Rejection of invention patent application after publication