CN110450481B - Bionic crack protection structure and preparation method thereof - Google Patents

Bionic crack protection structure and preparation method thereof Download PDF

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CN110450481B
CN110450481B CN201910763694.7A CN201910763694A CN110450481B CN 110450481 B CN110450481 B CN 110450481B CN 201910763694 A CN201910763694 A CN 201910763694A CN 110450481 B CN110450481 B CN 110450481B
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layer
crack
protection structure
conductive layer
cracks
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CN110450481A (en
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韩志武
孟宪存
王可军
张俊秋
张昌超
李玉姣
刘林鹏
孙涛
王大凯
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Jilin University
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive

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Abstract

The invention relates to a bionic crack protection structure and a preparation method thereof. The method comprises the following steps: a base layer; a conductive layer disposed on the base layer and a protective layer disposed on the conductive layer; cracks are prefabricated on the conducting layer; the base layer is provided with cracks consistent with the cracks on the conductive layer; the hardness of the protective layer is less than that of the conductive layer, and the hardness of the conductive layer is less than that of the substrate layer. The preparation method of the bionic crack protection structure comprises the following steps: providing a glass slide; depositing a substrate layer on the glass slide, depositing a conductive layer on the substrate layer, and preparing cracks on the substrate layer and the conductive layer; and placing a mould on the conducting layer, adding a flexible material into the mould, removing the mould after film formation to obtain a protective layer, and matching the protective layer with the multistage substrate to form a bionic crack protection structure. When the crack is acted by external force, the crack can be effectively prevented from further expanding, and meanwhile, small particle foreign matters can be prevented from entering the crack, so that the crack is prevented from being damaged.

Description

Bionic crack protection structure and preparation method thereof
Technical Field
The invention relates to the technical field of crack protection, in particular to a bionic crack protection structure and a preparation method thereof.
Background
At present, flexible strain sensors are widely applied to electronic products, medical instruments and smart home devices. The flexible strain sensor with the crack structure is widely concerned due to the characteristics of simple structure, high sensitivity and the like. For a crack sensor, cracks play a crucial role, and the sensitivity of the sensor can be remarkably improved.
But the crack itself is an engineering defect and not accidental. When the device is subjected to external force, the device is easy to further expand, even the whole part is broken, and huge loss is caused.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a bionic crack protection structure and a preparation method thereof, and aims to solve the problem that the existing crack structure is easy to generate fatigue fracture. Among them, fatigue fracture has two main forms: (1) the initiation of new cracks under the action of alternating load; (2) there is already a further propagation of the crack under alternating loads.
The technical scheme adopted by the invention for solving the technical problems is as follows:
in a first aspect, an embodiment of the present invention provides a bionic crack protection structure, where the bionic crack protection structure includes: a base layer; a conductive layer disposed on the base layer and a protective layer disposed on the conductive layer; cracks are prefabricated on the conducting layer; the base layer is provided with cracks consistent with the cracks on the conductive layer; the hardness of the protective layer is less than that of the conductive layer, and the hardness of the conductive layer is less than that of the substrate layer.
Preferably, in the bionic crack protection structure, the substrate layer is formed by n layers of thin films, and the hardness of each layer of the n layers of thin films is sequentially reduced from bottom to top, wherein n is less than or equal to 15.
Preferably, in the bionic crack protection structure, the material of the protection layer is a flexible polymer, and the flexible polymer is selected from any one of epoxy resin, polydimethylsiloxane, thermoplastic polyurethane, polyacrylate, polyvinylidene fluoride, polystyrene, polyamide, polyimide and polyethylene terephthalate.
In a second aspect, an embodiment of the present invention further provides a method for preparing a biomimetic crack protection structure, where the method includes:
providing a glass slide;
depositing a substrate layer on the glass slide, depositing a conductive layer on the substrate layer, and preparing cracks on the substrate layer and the conductive layer;
and placing a mould on the conducting layer, adding a flexible material into the mould, removing the mould after film formation to obtain a protective layer, and matching the protective layer with the multistage substrate to form a bionic crack protection structure.
Preferably, in the preparation method of the bionic crack protection structure, the mold material is metal aluminum.
Preferably, in the preparation method of the bionic crack protection structure, the thickness of the mold is 0.05-0.5 mm.
Preferably, the preparation method of the biomimetic crack protection structure comprises the following steps of depositing a substrate layer on a glass slide, specifically comprising:
selecting first epoxy resin, spin-coating the first epoxy resin on the glass slide by using a spin coater, and baking to obtain a primary film;
selecting second epoxy resin, spin-coating the second epoxy resin on the primary film by using a spin coater, and baking to obtain a secondary film;
selecting polydimethylsiloxane, spin-coating the polydimethylsiloxane on the secondary film by using a spin coater, and baking to obtain a tertiary film;
the hardness of the primary film is greater than the hardness of the secondary film.
Preferably, in the preparation method of the bionic crack protection structure, the baking temperature is 30-70 ℃.
Preferably, in the preparation method of the bionic crack protection structure, the viscosity of the flexible material is 7000-10000 CST.
Preferably, in the preparation method of the bionic crack protection structure, the granularity of the flexible material is 300-600 um.
Has the advantages that: the invention prepares a crack protection structure by means of bionics, and the prepared crack protection structure comprises a layered structure with good bonding property formed on a substrate and a flexible protection layer formed on a conductive layer. When the crack is acted by external force, the crack can be effectively prevented from further expanding, and meanwhile, small particle foreign matters can be prevented from entering the crack, so that the crack is prevented from being damaged.
Drawings
FIG. 1 is an SEM image of the bending deformation of the membrane on the scorpion suture receptor.
FIG. 2 is a top SEM image of a crack in a scorpion suture receptor.
Figure 3 is a vertical cross-sectional SEM image of a structural characterization of the interior of the slot susceptor.
FIG. 4 is a SEM image of a vertical cross section of a compressed scorpion suture receptor.
FIG. 5 is a SEM image of a vertical cross-section of a scorpion suture receptor in a stretched state.
Fig. 6 is a schematic structural diagram of a biomimetic crack protection structure provided in an embodiment of the present invention.
Fig. 7 is a schematic view of a layered structure of a substrate layer of a biomimetic crack protection structure provided in an embodiment of the present invention.
FIG. 8 is a SEM image of a crack deflection vertical section of a scorpion suture receptor.
Fig. 9 is a flowchart of a method for manufacturing a biomimetic crack protection structure according to an embodiment of the present invention.
Fig. 10 is a flow chart of substrate layer preparation in the method for preparing a biomimetic crack protection structure according to the embodiment of the present invention.
Fig. 11 is a schematic structural diagram of a mold provided in an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1-5, which are SEM images of the scorpion suture receptors in different states, it can be seen that the scorpion suture receptors have a multi-stage layered structure, and cracks of the scorpions are not directly exposed to the air, but are covered by a thin film, and the thin film and the crack regions constitute a one-stage layered structure. According to the bionic scorpion crack structure, the invention discloses a bionic crack protection structure, as shown in fig. 6, comprising: a base layer 10; a conductive layer 20 disposed on the base layer 10 and a protective layer 30 disposed on the conductive layer 20; cracks are prefabricated on the conducting layer 20; the base layer 10 is provided with cracks consistent with the cracks on the conductive layer 20; the hardness of the protective layer 30 is less than that of the conductive layer 20, and the hardness of the conductive layer 20 is less than that of the base layer 10.
The flexible sensor with the crack structure is widely applied to electronic products, medical instruments and intelligent household equipment due to the characteristics of simple structure, high sensitivity and the like. However, the crack itself is an engineering defect, and is very easy to further propagate when being subjected to external force, and even leads to the fracture of the whole part. The invention provides a bionic crack protection structure by means of bionics according to the crack protection structure principle of a seam receptor of a scorpion. It is this significant difference that constitutes a protective structure for the crack.
Specifically, the protective action of the upper film (flexible protective layer) is first. When the stress is not enough to cause crack propagation, the upper film relaxes the fold following the increase and decrease of the crack gap. When the crack is subjected to larger tensile stress, the upper film deforms with smaller tensile stress, the stress field strength of the crack tip is reduced, and the stress concentrated on the crack tip is dispersed, so that the effect of inhibiting the crack from expanding is achieved. When the crack is subjected to large pressure stress, the upper film is folded in the crack to play a role in buffering, and the two sides of the harder crack are prevented from being directly contacted to cause damage. Meanwhile, the upper film can prevent fine particles from falling into cracks to damage the whole structure.
In one or more embodiments, the base layer is composed of n layers of thin films, the hardness of each layer of the n layers of thin films decreases from bottom to top, and n is less than or equal to 15.
Specifically, as shown in fig. 7, the base layer 10 includes 6 layers, and from bottom to top, a first-level base (film layer), a second-level base (film layer), a third-level base (film layer), a fourth-level base (film layer), a fifth-level base (film layer), and a sixth-level base (film layer) are sequentially provided. Since the base layer is provided as 6 layers, in the 6-layer material described above, the propagation of cracks is deflected in each layer material, as shown in fig. 8, which requires more energy than the propagation of cracks in a uniform material. Therefore, the layered structure in this embodiment can hinder further crack propagation.
Further, at a certain film thickness, the greater the number of layers of the underlayer is, the more advantageous the crack propagation is to be prevented, and the greater the number of layers of the underlayer means that the film thickness of the single-layer film is also thinner, and the higher the technical requirements for film formation are, the more the number of layers of the underlayer is set in combination with specific cases.
As shown in fig. 7, the layered structure crack resistance mechanism is explained by analyzing the excellent crack resistance of the crack using its elastic modulus distribution and calculating the complex elastic modulus of the horny layer sandwiched between two blocks.
Figure BDA0002171201940000061
Wherein EcComposite elastic modulus for crack protection structures; ebIs the modulus of elasticity of the protective layer; emOf material on both sides of the crackModulus of elasticity; gamma is gamma ═ lb0/lm0Wherein l isb0The initial width of the blocks on both sides of the crack,/m0Is the initial width of the film. (ii) a w is the width of the slot; h ismIs the film thickness; w is a0The initial width of the slot.
Composite modulus of elasticity E of layered structurecGreater than the elastic modulus E of the material on both sides of the crackm. The larger the modulus of elasticity, the smaller the deformation under a certain stress. When 0 < w < 2h mModulus of elasticity E of the protective layerbLess than Em. Therefore, when the film thickness h is thickm' A timing, EbIncrease, EcThe crack is less prone to expand; modulus of elasticity E of the protective layerbConstant, film thickness hm′The larger, EcThe larger.
W＞＞w0When E is greaterbIncrease, EcAnd also increases.
When the material cracks, the material is not a fixed value any more but is continuously changed under the action of external force and is arranged between the upper layer material and the lower layer material. Has remarkable crack-stopping effect on the crack layer.
The effect of the multi-stage composite substrate properties on crack driving force can be expressed by the following formula:
Jt＝Jf +Binh
wherein JtCan be obtained by performing J-integration on the stress field in the tip region of the crack, JfIs the crack driving force generated by an applied external load, when JfValue higher than fracture toughness JcThe crack may propagate further. B isinhIs the crack driving force variable caused by micro-delamination of the material, BinhProportional to the relative value of the elastic modulus between the soft and hard materials, B is the time when a crack propagates from a soft tissue with a low elastic modulus to a hard tissue with a high elastic modulusinhNegative values, corresponding to JtRatio JfSmall, the non-uniformity of the material at this time may function to prevent crack propagation. When a crack grows from a white matter interlayer with a lower elastic modulus to a hard tissue layer with a higher elastic modulus, JtValue less than JfValue, therefore, a greater load needs to be applied to further propagate the crack
In one or more embodiments, the material of the protective layer is a flexible polymer selected from any one of epoxy resin, polydimethylsiloxane, thermoplastic polyurethane, polyacrylate, polyvinylidene fluoride, polystyrene, polyamide, polyimide, and polyethylene terephthalate. The flexible polymer is selected as the raw material of the protective layer, so that the prepared protective layer has good flexibility, and when the crack protective structure is acted by external force, the protective layer can easily expand or contract along with the action of the external force. And the stress field strength of the crack tip is reduced by smaller strain tension deformation.
Based on the same inventive concept, the invention also provides a preparation method of the bionic crack protection structure, as shown in fig. 9, the method comprises the following steps:
s100, providing a glass slide;
s200, depositing a substrate layer on the glass slide, depositing a conductive layer on the substrate layer, and preparing cracks on the substrate layer and the conductive layer;
s300, placing a mold on the conducting layer, adding a flexible material into the mold, and removing the mold after film forming to obtain the bionic crack protection structure.
Specifically, a slide glass, which may be, for example, a glass slide cleaned, is prepared in advance, and a material constituting the base layer is coated on the slide glass by a spin coating method. And placing the glass slide coated with the base layer material into an oven for baking, peeling the base layer from the glass slide after baking, and preparing a conductive layer on the peeled base layer, wherein the conductive layer can be formed by sputtering a metal element on the base layer by a sputtering method to deposit. After the conductive layer is formed, cracks are processed in the conductive layer and the base layer. The technique for machining cracks is prior art and will not be described in detail here.
And placing the prepared mould shown in figure 11 on the conductive layer with the processed cracks, adding a flexible material into the mould, and taking down the mould after curing to form a film so as to form the rigid-flexible bionic crack protection structure.
Preferably, the die is made of a thin metal aluminum plate with the thickness of 0.05-0.5mm, and a laser marking machine is selected to prepare the die.
As shown in fig. 10, in an embodiment, the depositing a substrate layer on the glass slide in step S200 specifically includes:
s201, selecting first epoxy resin, carrying out spin coating on the first epoxy resin on the glass slide by using a spin coater, and baking to obtain a primary film;
s202, selecting second epoxy resin, carrying out spin coating on the second epoxy resin on the primary film by using a spin coater, and baking to obtain a secondary film;
s203, selecting polydimethylsiloxane, spin-coating the polydimethylsiloxane on the secondary film by using a spin coater, and baking to obtain a tertiary film; the hardness of the primary film is greater than the hardness of the secondary film.
Specifically, epoxy resin D-80 can be selected such that the ratio of epoxy resin to curing agent is 3: 1, mixing and fully stirring; vacuumizing in a vacuum box for half an hour and then taking out; spin coating on the glass slide by using a spin coater (1000r/s, 3 min); and then heating the substrate in a heating box at 80 ℃ for 2 hours, and curing to obtain a primary substrate. Selecting epoxy resin D-152 according to the weight ratio of 3: 1, mixing and fully stirring; vacuumizing in a vacuum box for half an hour and then taking out; spin coating on the glass slide (containing the primary substrate) with a spin coater (1000r/s, 3 min); and then heating the substrate in a heating box at 80 ℃ for 2 hours, and curing to obtain a secondary substrate. PDMS was selected, as 10: 1, mixing and fully stirring; vacuumizing in a vacuum box for half an hour and then taking out; spin coating on the glass slide (containing the primary and secondary substrates) with a spin coater (1000r/s, 3 min); and then heating the substrate in a heating box at 80 ℃ for 2 hours, and curing to obtain a three-stage substrate.
In one or more embodiments, the viscosity of the flexible material is 7000-10000CST, when the viscosity of the flexible material is less than 7000CST, the flexible material is easy to enter the gap when the protective film is prepared, and when the viscosity is more than 10000CST, the film is not easy to form, and the thickness of the formed film is thicker. The granularity of the flexible material is 300-600um, and preferably the granularity of the flexible material is 500 um.
In summary, the invention provides a bionic crack protection structure and a preparation method thereof, and the method comprises the following steps: a base layer; a conductive layer disposed on the base layer and a protective layer disposed on the conductive layer; cracks are prefabricated on the conducting layer; the base layer is provided with cracks consistent with the cracks on the conductive layer; the hardness of the protective layer is less than that of the conductive layer, and the hardness of the conductive layer is less than that of the substrate layer. The preparation method of the bionic crack protection structure comprises the following steps: providing a glass slide; depositing a substrate layer on the glass slide, depositing a conductive layer on the substrate layer, and preparing cracks on the substrate layer and the conductive layer; and placing a mould on the conducting layer, adding a flexible material into the mould, and removing the mould after film forming to obtain the bionic crack protection structure. According to the invention, a layer of flexible film is adhered to the crack by means of bionics, namely by means of a protection structure of a scorpion slit sensor, so that the flexible film and the crack form a protection structure, and when the stress on the crack layer is small and is not enough to cause crack propagation, the protection layer expands and folds along with the increase and reduction of crack gaps. When the crack layer is subjected to larger tensile stress, the protective layer deforms with smaller tensile stress, the stress field intensity of the tip of the crack is reduced, and the stress concentrated on the tip of the crack is dispersed, so that the effect of inhibiting the crack from expanding is achieved. When the crack layer receives great compressive stress, the protective layer is folded in the crack, plays the cushioning effect, prevents that harder crack both sides direct contact from causing the destruction. Meanwhile, the protective layer can prevent fine particles from falling into cracks to damage the structure. Therefore, the protective layer adhered on the crack layer can effectively block the crack from propagating. The method starts from the energy concentration of the crack tip, releases the concentrated energy through deformation, and reduces the damage to the material.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.

Claims (9)

1. A biomimetic crack protection structure, comprising: a base layer; a conductive layer disposed on the base layer and a protective layer disposed on the conductive layer; cracks are prefabricated on the conducting layer; the substrate layer is provided with cracks consistent with the cracks on the conductive layer; the hardness of the protective layer is less than that of the conductive layer, and the hardness of the conductive layer is less than that of the substrate layer; the material of the protective layer is flexible polymer, and the viscosity of the flexible polymer is 7000-10000 CST.
2. The biomimetic crack protection structure according to claim 1, wherein the substrate layer is composed of n layers of thin films, and the hardness of each layer of the n layers of thin films decreases in sequence from bottom to top, wherein n is less than or equal to 15.
3. The biomimetic crack protection structure according to claim 1, wherein the material of the protection layer is a flexible polymer, and the flexible polymer is selected from any one of epoxy resin, polydimethylsiloxane, thermoplastic polyurethane, polyacrylate, polyvinylidene fluoride, polystyrene, polyamide, polyimide, and polyethylene terephthalate.
4. A method of making a biomimetic crack protection structure as recited in claim 1, wherein the method comprises the steps of:
providing a glass slide;
depositing a substrate layer on the glass slide, depositing a conductive layer on the substrate layer, and preparing cracks on the substrate layer and the conductive layer;
and placing a mould on the conducting layer, adding a flexible material into the mould, and removing the mould after film forming to obtain the bionic crack protection structure.
5. The method for preparing the bionic crack protection structure according to claim 4, wherein the mold material is metallic aluminum.
6. The method for preparing a bionic crack protection structure according to claim 5, wherein the thickness of the mold is 0.05-0.5 mm.
7. The method for preparing a biomimetic crack protection structure according to claim 4, wherein the step of depositing a substrate layer on a glass slide specifically comprises:
selecting first epoxy resin, spin-coating the first epoxy resin on the glass slide by using a spin coater, and baking to obtain a primary film;
selecting second epoxy resin, spin-coating the second epoxy resin on the primary film by using a spin coater, and baking to obtain a secondary film;
selecting polydimethylsiloxane, spin-coating the polydimethylsiloxane on the secondary film by using a spin coater, and baking to obtain a tertiary film; the hardness of the primary film is greater than the hardness of the secondary film.
8. The method for preparing a biomimetic crack protection structure according to claim 7, wherein the baking temperature is 30-70 ℃.
9. The method for preparing a bionic crack protection structure as claimed in claim 4, wherein the particle size of the flexible material is 300-600 μm.
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CN105783697A (en) * 2016-05-18 2016-07-20 郑州大学 Flexible strain sensor with crack structure and preparation method thereof
CN108267078A (en) * 2018-03-18 2018-07-10 吉林大学 A kind of flexible wearable resistance strain and preparation method thereof
CN108917582A (en) * 2018-03-30 2018-11-30 华东理工大学 Strain transducer and its manufacturing method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105783697A (en) * 2016-05-18 2016-07-20 郑州大学 Flexible strain sensor with crack structure and preparation method thereof
CN108267078A (en) * 2018-03-18 2018-07-10 吉林大学 A kind of flexible wearable resistance strain and preparation method thereof
CN108917582A (en) * 2018-03-30 2018-11-30 华东理工大学 Strain transducer and its manufacturing method

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