CN110441993B - Marking method for front and back imaging alignment of laser direct imaging equipment - Google Patents
Marking method for front and back imaging alignment of laser direct imaging equipment Download PDFInfo
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- CN110441993B CN110441993B CN201910686270.5A CN201910686270A CN110441993B CN 110441993 B CN110441993 B CN 110441993B CN 201910686270 A CN201910686270 A CN 201910686270A CN 110441993 B CN110441993 B CN 110441993B
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- substrate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/2032—Simultaneous exposure of the front side and the backside
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
Abstract
The invention discloses a marking method for front and back imaging alignment of laser direct imaging equipment, belonging to the technical field of pattern transfer of printed circuit boards, comprising the steps of covering a first photosensitive developing material on the front and back surfaces of a substrate; drying the substrate coated with the photosensitive wet film; a second photosensitive color developing material is covered on the position, which needs to be aligned with the target, on the reverse side of the substrate; and after the substrate is installed and debugged, exposing and imaging the front surface and the back surface of the substrate. The invention combines the dry film and the wet film to use in the front and back imaging alignment process of the laser direct imaging equipment, thereby realizing accurate alignment and reducing the use cost.
Description
Technical Field
The invention relates to the technical field of pattern transfer of printed circuit boards, in particular to a marking method for front and back imaging alignment of laser direct imaging equipment.
Background
For the field of printed circuit board processing, particularly the manufacture of high-precision HDI boards and package substrates, the image transfer apparatus is undoubtedly the most central part thereof.
There are two main categories of Printed Circuit Board (PCB) image transfer devices today: conventional projection exposure apparatuses and laser direct imaging apparatuses (LDIs). The traditional projection type exposure equipment pattern is printed on a film negative film, the film negative film is irradiated by ultraviolet rays to transfer the pattern to a PCB (printed Circuit Board) with the surface covered with a photosensitive material, the unexposed part of the photosensitive material is dissolved away by chemical solution after the exposure is finished, and the remained exposed photosensitive material is the pattern to be made; in the laser direct imaging device, an exposure pattern is directly scanned and imaged on a photosensitive material through a spatial light modulator by ultraviolet light emitted by a laser beam, and the photosensitive material which is photosensitive is left on a Printed Circuit Board (PCB) through the same chemical development, namely, a pattern to be manufactured.
The front-back side graphic imaging alignment needs to expose the side A, and simultaneously, a fixed light source on the table surface of the laser direct imaging equipment is used for aligning the MARK on the side B of the substrate, so that the photosensitive material coated on the substrate needs to have good developing property. The existing coated photosensitive material is a dry film with good imaging performance, high price and a relatively cheap wet film, because the imaging performance is poor or even the imaging is not carried out, the color is not obviously changed after the light source irradiates, and after the left plate and the right plate are turned over, a CCD camera cannot grab the alignment MARK, so the cheap photosensitive material of the wet film cannot be used.
Disclosure of Invention
The invention aims to overcome the defects in the background technology and transfer the patterns of the printed circuit board by using a wet film.
In order to achieve the above object, in one aspect, a marking method for front and back imaging alignment of a laser direct imaging device is adopted, which includes the following steps:
s1, covering a first light-sensitive color-developing material on the front surface and the back surface of the substrate;
s2, drying the substrate coated with the photosensitive wet film;
s3, covering a second light-sensitive color-developing material at the position where the alignment target needs to be printed on the reverse side of the substrate;
and S4, after the substrate is installed and debugged, exposing and imaging the front surface and the back surface of the substrate.
Further, the first photo-sensitive chromogenic material comprises a photo-sensitive wet film.
Further, the second photo-sensitive developing material includes a developing dry film or a developing material.
Further, the first light source and the second light source are fixedly arranged on the table top of the laser imaging device, and after the substrate is mounted and debugged in step S4, exposure imaging is performed on the front and back surfaces of the substrate, including:
opening an ultraviolet light source to expose the back surface of the substrate while exposing and imaging the front surface of the substrate so as to print a position of alignment MARK on the back surface of the substrate;
and turning the back surface of the substrate upwards, and positioning the exposure position of the back surface graph of the substrate according to the alignment MARK position to finish exposure imaging of the back surface of the substrate.
Further, the shape formed by coating the second photosensitive and color developing material on the reverse side of the substrate is a rectangle or a circle with the size larger than the para-position MARK.
Further, the first light source and the second light source are both circular light sources.
On the other hand, the marking system for front and back imaging alignment of the laser direct imaging device comprises a light source, an exposure workbench, a CCD image sensor and a substrate, wherein the light source is installed on the surface of the exposure workbench, the substrate is arranged on the exposure workbench, the CCD image sensor is used for grabbing central coordinates of an MARK on the substrate, first photosensitive developing materials are covered on the front and back surfaces of the substrate, and second photosensitive developing materials are covered on the positions, needing to be aligned, of the back surface of the substrate.
Further, the first photo-sensitive chromogenic material comprises a photo-sensitive wet film.
Further, the second photo-sensitive developing material includes a developing dry film or a developing material.
Further, the shape formed by coating the second photosensitive and color developing material on the reverse side of the substrate is a rectangle or a circle with the size larger than the para-position MARK.
Compared with the prior art, the invention has the following technical effects: the front side and the back side of the substrate are coated with the first photosensitive color developing material and dried, then the position of the back side of the substrate, where the alignment target needs to be printed, is coated with the second photosensitive color developing material, wherein the developing performance of the second photosensitive color developing material is superior to that of the first photosensitive color developing material, and finally the front side and the back side of the substrate are exposed and imaged. The photosensitive color developing material with low cost and poor developing effect is coated on the basic front and back surfaces, and the photosensitive color developing material with good developing performance and high cost is coated on the position of the back surface of the substrate where the alignment target needs to be printed, so that the cost is reduced, and the transfer of the graph of the printed circuit board can be guaranteed.
Drawings
The following detailed description of embodiments of the invention refers to the accompanying drawings in which:
FIG. 1 is a schematic flow chart of a marking method for front and back imaging alignment of a laser direct imaging device;
FIG. 2 is a flowchart illustrating the subdivision process of step S4;
FIG. 3 is a schematic view of a light source mounted on a table of a laser imaging apparatus;
FIG. 4 is a schematic diagram of a second photosensitive and chromogenic material arranged at a position where a position target needs to be printed on the reverse side of a substrate;
FIG. 5 is a schematic view of the position of the front exposure pattern of the substrate;
FIG. 6 is a schematic view of a substrate pattern after completion of a substantially reverse exposure;
fig. 7 is a schematic structural diagram of a marking system for front-back imaging alignment of a laser direct imaging device.
Detailed Description
To further illustrate the features of the present invention, refer to the following detailed description of the invention and the accompanying drawings. The drawings are for reference and illustration purposes only and are not intended to limit the scope of the present disclosure.
As shown in fig. 1, the embodiment discloses a marking method for front-back imaging alignment of a laser direct imaging device, which includes the following steps S1 to S4:
s1, covering a first light-sensitive color-developing material on the front surface and the back surface of the substrate;
s2, drying the substrate coated with the photosensitive wet film;
s3, covering a second light-sensitive color-developing material at the position where the alignment target needs to be printed on the reverse side of the substrate;
and S4, after the substrate is installed and debugged, exposing and imaging the front surface and the back surface of the substrate.
In this embodiment, the first photosensitive developing material has a developing property inferior to that of the second photosensitive developing material, and by coating the photosensitive developing material having a low cost and a poor developing effect on the front and back sides, the photosensitive color developing material with good developing performance and high cost is coated on the position of the back surface of the substrate where the alignment target needs to be printed, when the front surface of the substrate is exposed and imaged, the back surface of the substrate is exposed by utilizing an ultraviolet light source fixed on the table top of the laser direct imaging equipment, because the position of the reverse side of the substrate, which needs to be printed with the alignment target, is covered with the second photosensitive developing material, after exposure, the color of the exposed area is obviously changed, and aligning MARK points are punched on the reverse side of the substrate, and the CCD image sensor can accurately position the exposure position of the back side graph of the substrate according to the MARK point positions, so that the accurate alignment of the front side and the back side imaging of the laser direct imaging equipment is realized, and the cost can be reduced.
Further, the first photosensitive color developing material comprises a photosensitive wet film
Further, the second photo-developable material includes a dry developing film or a developing material.
In practical application, the front and back imaging alignment of the laser imaging device must be accurate, the MARK profile must be clear, and the material cannot be used due to poor or even no imaging of a wet film, so a dry film with good imaging performance is generally used, but the cost is high. In the embodiment, the photosensitive color developing material with poor developing performance and low price and the photosensitive color developing material with good developing performance and high cost are combined for use, the photosensitive color developing material with good developing performance and high cost is covered at the position of the reverse side of the substrate, which needs to be aligned with the target, and the color of an exposure area is obviously changed when the substrate is exposed on the emitting surface, so that the exposure position of the reverse side graph of the substrate is accurately positioned.
As shown in fig. 2-3, a first light source and a second light source are fixedly arranged on the table top of the laser imaging device, and in the step S4, exposure imaging is performed on the front and back surfaces of the substrate, including the following subdivided steps S41 to S43:
s41, opening an ultraviolet light source to expose the back surface of the substrate while exposing and imaging the front surface of the substrate, so as to print an alignment MARK position on the back surface of the substrate;
s42, basically turning the substrate left and right, and turning the reverse side of the substrate upwards;
and S43, positioning the exposure position of the back side graph of the substrate according to the alignment MARK position, and completing exposure imaging of the back side of the substrate.
And the laser imaging equipment table board is fixedly provided with a plurality of light sources which are used for selectively opening two or three light sources according to the size of the substrate when the alignment MARK is shot to emit ultraviolet light so as to enable the second photosensitive material to develop color.
Further, the shape formed by coating the second photosensitive color-developing material on the reverse side of the substrate is a rectangle or a circle or other shapes with the size larger than the para-position MARK, and the requirement that the area is slightly larger than the marked MARK is met. And the reverse side of the substrate is provided with at least two pasting positions for arranging a second photosensitive color-developing material so as to determine the position of the graph, and the pasting positions are determined according to the positions of the first light source and the second light source fixed on the table board of the equipment.
The following steps of the method for imaging, aligning and marking the front and the back of the substrate by a specific case are described as follows, wherein the front of the substrate is represented by a surface A, and the back of the substrate is represented by a surface B:
the method comprises the following steps: a photo-sensitive wet film was applied to the product substrate A, B side.
Step two: and drying the coated product substrate.
Step three: and (3) attaching a developing dry film or coating a developing material to the position of the product substrate B surface where the alignment target needs to be marked, and fixing the installation position of the light source according to the equipment table surface as shown in figure 3. A rectangular plane coordinate system is established on the rectangular table board, the lower left corner is a coordinate origin, the first light source is in a central position with coordinates (10,5) mm, the second light source is in a central position with coordinates (250,5) mm, and the first light source and the second light source are both circular light sources with the diameter of 5 mm. In this embodiment, the substrate is a rectangle with 450 × 450mm, the center of the pasting position of the developing material on the B-side of the substrate is 10mm and 250mm away from the right plate edge, and 5mm away from the lower plate edge, and the developing material is coated on the reverse side of the substrate to form a rectangle with 10 × 10mm, as shown in fig. 4.
Step four: and mounting and debugging the substrate.
Step five: and exposing and imaging the surface A of the substrate, and simultaneously opening a fixed ultraviolet light source of the table top to expose the surface B of the substrate to realize the step of printing the alignment MARK on the surface B of the substrate, as shown in FIG. 5.
Step six: the substrate is turned left and right, and the original downward surface is turned upward to receive exposure.
Step seven: and (3) carrying out exposure imaging on the B surface of the substrate, and accurately positioning the exposure position of the B surface pattern by the CCD according to the grabbed MARK position to finish the exposure imaging of the B surface of the base, as shown in FIG. 6.
The embodiment also discloses a marking system that laser direct imaging equipment positive and negative formation of image was counterpointed, including light source, exposure workstation, CCD image sensor and base plate, the light source is installed on the exposure workstation mesa, and the base plate is arranged in on the exposure workstation, and CCD image sensor is used for snatching the central coordinate of MARK on the base plate, the base plate is just, the reverse side covers has first sensitization chromogenic material, and the position that the base plate reverse side need be beaten the counterpoint MARK covers has second sensitization chromogenic material.
Specifically, as shown in fig. 7, the laser direct imaging apparatus includes a light source unit 1, a first lens group 2, a spatial light modulator group 3, a beam splitter 4, a second lens group 5, a substrate 6, an exposure workbench 7, a reflector 8, a CCD image sensor 9, a microscope 10, a first controller 11A, a second controller 11B, a stage movement controller 11C, a motor 12, and a computer 13, where the light source unit 1 is installed on a table of the exposure workbench 7, a substrate is placed on the exposure workbench 7, and the CCD image sensor 9 can capture a central coordinate of a MARK on the substrate through the stage movement controller 11C, an exposure position of a reverse side pattern of the substrate can be accurately positioned according to the central coordinate of the MARK, accurate alignment of forward and reverse side imaging of the laser direct imaging apparatus is realized, and cost can be reduced.
The first photosensitive developing material comprises a photosensitive wet film, and the second photosensitive developing material comprises a developing dry film or a developing material.
In the embodiment, the photosensitive color developing material with poor developing performance and low price and the photosensitive color developing material with good developing performance and high cost are combined for use, the photosensitive color developing material with good developing performance and high cost is covered at the position of the reverse side of the substrate, which needs to be aligned with the target, and the color of an exposure area is obviously changed when the substrate is exposed on the emitting surface, so that the exposure position of the reverse side graph of the substrate is accurately positioned.
Particularly, the shape formed by coating the second photosensitive color-developing material on the reverse side of the substrate is rectangular or circular or other shapes, and the requirement that the area is slightly larger than the marked MARK can be met. The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A marking method for front and back imaging alignment of laser direct imaging equipment is characterized by comprising the following steps:
s1, covering a first light-sensitive color-developing material on the front surface and the back surface of the substrate;
s2, drying the substrate coated with the first photosensitive color developing material;
s3, covering a second photosensitive developing material at a position where the alignment target needs to be printed on the reverse side of the substrate, wherein the developing property of the first photosensitive developing material is lower than that of the second photosensitive developing material;
and S4, after the substrate is installed and debugged, exposing and imaging the front surface and the back surface of the substrate.
2. The marking method for front-back imaging alignment of laser direct imaging equipment as claimed in claim 1, wherein the first photosensitive developing material comprises a photosensitive wet film.
3. The method for marking on front and back sides of a laser direct imaging device for imaging alignment as claimed in claim 1, wherein the second photo-chromic material comprises a developing dry film.
4. The marking method as claimed in claim 1, wherein a first light source and a second light source are fixedly disposed on the top of the laser imaging device, the first light source and the second light source are both ultraviolet light sources, and in step S4, after the substrate is mounted and debugged, the front and back surfaces of the substrate are exposed and imaged, including:
opening an ultraviolet light source to expose the back surface of the substrate while exposing and imaging the front surface of the substrate so as to print a contraposition target on the back surface of the substrate;
and turning the back surface of the substrate upwards, and positioning the back surface graph exposure position of the substrate according to the position of the alignment target to finish exposure imaging of the back surface of the substrate.
5. The marking method for front-back imaging alignment of the laser direct imaging device as claimed in claim 4, wherein the second photosensitive developing material is coated on the reverse surface of the substrate to form a rectangular or circular shape with a size larger than that of the alignment target.
6. The marking method for front-back imaging alignment of laser direct imaging equipment as claimed in claim 4, wherein the first light source and the second light source are both circular light sources.
7. The utility model provides a marking system that laser direct imaging equipment positive and negative formation of image was counterpointed, includes light source, exposure workstation, CCD image sensor and base plate, will be used for carrying out the light source that exposes to the base plate and install on the exposure workstation mesa, on the exposure workstation was arranged in to the base plate, CCD image sensor was used for snatching the central coordinate of counterpoint mark target on the base plate, its characterized in that, the base plate is just, the reverse side covers and has first sensitization colour developing material, and the position that the counterpoint mark target need be beaten to the base plate reverse side covers and has second sensitization colour developing material, first sensitization colour developing material's developing nature is poor in the developing nature of second sensitization development.
8. The laser direct imaging device front-back imaging alignment marking system as claimed in claim 7, wherein the first photo-chromic material comprises a photo-chromic wet film.
9. The laser direct imaging device front-back imaging alignment marking system as claimed in claim 7, wherein the second photo-chromic material comprises a developing dry film.
10. The laser direct imaging device front-back imaging alignment marking system as claimed in claim 7, wherein the second photo-chromic material is coated on the back side of the substrate to form a rectangular or circular shape with a size larger than the alignment target.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910686270.5A CN110441993B (en) | 2019-07-29 | 2019-07-29 | Marking method for front and back imaging alignment of laser direct imaging equipment |
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| CN201910686270.5A CN110441993B (en) | 2019-07-29 | 2019-07-29 | Marking method for front and back imaging alignment of laser direct imaging equipment |
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| CN110441993A CN110441993A (en) | 2019-11-12 |
| CN110441993B true CN110441993B (en) | 2021-08-13 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102681360A (en) * | 2012-04-24 | 2012-09-19 | 合肥芯硕半导体有限公司 | Alignment method for realizing circuit board double-sided figure alignment in laser imaging system |
| CN102890428A (en) * | 2012-09-18 | 2013-01-23 | 天津芯硕精密机械有限公司 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
| CN103529654A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Alignment method for internal layers in direct writing type photoetching system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6560248B1 (en) * | 2000-06-08 | 2003-05-06 | Mania Barco Nv | System, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation |
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- 2019-07-29 CN CN201910686270.5A patent/CN110441993B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102681360A (en) * | 2012-04-24 | 2012-09-19 | 合肥芯硕半导体有限公司 | Alignment method for realizing circuit board double-sided figure alignment in laser imaging system |
| CN102890428A (en) * | 2012-09-18 | 2013-01-23 | 天津芯硕精密机械有限公司 | Method for aligning exposure patterns on two sides of PCB (printed circuit board) |
| CN103529654A (en) * | 2013-10-29 | 2014-01-22 | 天津芯硕精密机械有限公司 | Alignment method for internal layers in direct writing type photoetching system |
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