CN110429009B - 2-type solid relay with staggered structure - Google Patents
2-type solid relay with staggered structure Download PDFInfo
- Publication number
- CN110429009B CN110429009B CN201910813155.XA CN201910813155A CN110429009B CN 110429009 B CN110429009 B CN 110429009B CN 201910813155 A CN201910813155 A CN 201910813155A CN 110429009 B CN110429009 B CN 110429009B
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- layer
- circuit
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- 239000007787 solid Substances 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 74
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000000605 extraction Methods 0.000 claims abstract description 43
- 238000002955 isolation Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 238000003466 welding Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 5
- 230000005496 eutectics Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000006148 magnetic separator Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/04—Mounting complete relay or separate parts of relay on a base or inside a case
- H01H50/041—Details concerning assembly of relays
- H01H50/043—Details particular to miniaturised relays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/12—Ventilating; Cooling; Heating
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a 2-type solid relay with a staggered structure, which comprises an upper-layer printed board, a lower-layer radiating bottom board, a ceramic substrate, a flow guide column, 4 extraction rods, an input control circuit and an output power circuit. The input control circuit comprises an input pre-stage thick film circuit, a magnetic isolator and an input post-stage thick film circuit. According to the invention, through reasonably optimizing the distribution of the solid relay, the input pre-stage thick film circuit and the input post-stage thick film circuit are respectively arranged on the front side and the back side of the upper layer printed board, so that the two thick film circuit boards form physical isolation; meanwhile, the input control circuit is arranged on the upper layer printed board, the output power circuit is arranged on the lower layer radiating bottom board, and the input control circuit and the output power circuit realize the electrical control of the input control circuit to the output power circuit through the flow guide post, so that effective isolation is formed, and the phenomenon of electrical interference is avoided.
Description
Technical Field
The invention relates to the technical field of solid relays, in particular to a 2-type solid relay with a staggered structure.
Background
With the development of the electronic industry, the integration requirement of the solid state relay is higher and higher. In order to meet the miniaturization requirement, more and more solid relays adopt 2-type double-layer structures. However, the solid state relay of the present 2-class double layer structure has the following disadvantages: firstly, the distribution and design of the circuit functional components at the upper layer and the lower layer are unreasonable, so that interference problems are easy to occur among different layers, the space utilization rate is low, and the miniaturization requirement of devices is difficult to meet; secondly, only insulation resistance performance requirements are considered between the input circuit functional component and the output circuit functional component, and dielectric withstand voltage performance requirements are not considered, so that dielectric withstand voltage performance is poor; furthermore, each circuit functional component is only adhered to the upper layer or the lower layer substrate through the heat-conducting adhesive, and the bonding force between the circuit functional component and the base is not strong, so that the circuit functional component needs to be electrically and secondarily interconnected, and the heat conduction and heat dissipation rate of the circuit functional component is affected.
Disclosure of Invention
The invention aims to solve the problem that the design of a double-layer structure of the existing solid relay is unreasonable, and provides a 2-type solid relay with a staggered structure.
In order to solve the problems, the invention is realized by the following technical scheme:
a2-class solid relay with a staggered structure comprises an input pre-stage thick film circuit, a magnetic isolator, an input post-stage thick film circuit and an output power circuit; the device is characterized by further comprising an upper layer printed board, a lower layer radiating bottom board, a ceramic substrate, a flow guide column and 4 extraction rods; the upper layer printed board is provided with an isolation through hole, a diversion through hole and 4 upper layer leading-out through holes; the input front-stage thick film circuit is fixed on the upper surface of the upper-layer printed board in a welding mode, and the input front-stage thick film circuit and the upper-layer printed board are electrically connected; the input rear thick film circuit is fixed on the lower surface of the upper layer printed board in a welding mode, and the two are electrically connected; the input front-stage thick film circuit is opposite to the input rear-stage thick film circuit on the upper surface and the lower surface of the upper-layer printed board in a mirror image manner; the magnetic isolator is embedded in the isolation through hole and is electrically connected with the input front-stage thick film circuit and the input rear-stage thick film circuit through the upper layer printed board respectively; a ceramic counter bore and 4 lower layer leading-out through holes are formed in the lower layer radiating bottom plate; copper is coated on the upper surface and the lower surface of the ceramic substrate, and 2 ceramic leading-out through holes are formed in the ceramic substrate; the ceramic substrate is embedded into the ceramic counter bore, and 2 ceramic leading-out through holes on the ceramic substrate are respectively opposite to 2 lower layer leading-out through holes on the lower layer radiating bottom plate; the lower surface of the ceramic substrate is adhered to the bottom surface of the ceramic counter bore in a welding mode; the output power circuit is fixed on the upper surface of the ceramic substrate in a welding mode, and the output power circuit and the ceramic substrate are electrically connected; the upper end of the flow guide column penetrates through the flow guide through hole to be electrically connected with the upper layer printed board, and the lower end of the flow guide column is electrically connected with the upper surface of the ceramic substrate, so that the input control circuit can electrically control the output power circuit; the 4 extraction rods are respectively and insulatively fixed in 4 lower extraction through holes of the lower radiating bottom plate; the upper ends of the 2 extraction rods penetrate out of the upper surface of the lower-layer radiating bottom plate and are electrically connected with the upper-layer printed board through 1 upper-layer extraction through holes; the upper ends of the 2 extraction rods penetrate out of the upper surface of the lower-layer radiating bottom plate, are electrically connected with the ceramic substrate through 2 ceramic extraction through holes, and are electrically connected with the upper-layer printed board through 2 upper-layer extraction through holes; the lower ends of the 4 extraction rods are extracted from the lower surface of the lower heat dissipation bottom plate.
In the scheme, 4 extraction rods are respectively fixed with the lower-layer radiating bottom plate in an insulating manner through 1 insulating sheet.
In the scheme, 2 extraction rods are electrically connected with the ceramic substrate through 1 transition piece respectively.
In the scheme, the input front-stage thick film circuit and the input rear-stage thick film circuit are fixed on the upper layer printed board in a reflow soldering mode.
In the above scheme, the output power circuit is fixed on the ceramic substrate by means of eutectic soldering.
In the scheme, the magnetic isolator on the upper printed board and the ceramic substrate on the lower radiating bottom board are arranged in a staggered manner in the vertical direction.
In the scheme, the thickness of the copper coating on the upper surface of the ceramic substrate is larger than that of the copper coating on the lower surface of the ceramic substrate.
Compared with the prior art, the invention has the following characteristics:
1. the distribution of the solid relay is reasonably and optimally designed, and the input pre-stage thick film circuit and the input post-stage thick film circuit are respectively arranged on the front side and the back side of the upper layer printed board, so that the two thick film circuit boards form physical isolation; meanwhile, the input control circuit is arranged on the upper layer printed board, the output power circuit is arranged on the lower layer radiating bottom board, and the input control circuit and the output power circuit realize the electrical control of the input control circuit to the output power circuit through the flow guide post, so that effective isolation is formed, and the phenomenon of electrical interference is avoided;
2. through holes and counter bores on the upper printed board and the lower radiating bottom board are designed, and a ceramic substrate on the lower radiating bottom board and a magnetic isolator on the upper printed board are arranged in a staggered manner in the vertical direction, so that the height of a product can be effectively reduced, the internal space is fully utilized, the product integration level is improved, and the miniaturization design of the product is realized;
3. the input control circuit and the upper layer printed board and the output power circuit and the lower layer radiating bottom board are electrically interconnected in a welding mode, so that the steps of interconnection welding are reduced, the binding force between parts and assemblies is improved, and the problem of reduced binding force due to glue at high temperature is solved;
4. the ceramic substrate with double-sided copper coating can not only enhance the overload current capability, but also reduce the thermal resistance and increase the heat dissipation and conduction efficiency.
Drawings
Fig. 1 is a schematic perspective view of a 2-type solid relay with a staggered structure.
Fig. 2 is a side view of fig. 1.
Fig. 3 is a schematic structural diagram of an upper printed board.
Fig. 4 is a schematic structural diagram of a lower heat dissipation base plate.
Fig. 5 is a schematic structural view of a ceramic substrate.
Reference numerals in the drawings: 1. inputting a front-stage thick film circuit; 2. a magnetic isolator; 3. inputting a rear thick film circuit; 4. an output power circuit; 5. an upper layer printed board; 51. isolating the through holes; 52. a diversion through hole; 53. the upper layer is led out of the through hole; 6. a lower heat dissipation bottom plate; 61. a ceramic counter bore; 62. the lower layer is led out of the through hole; 7. a ceramic substrate; 71. a ceramic lead-out through hole; 8. a flow guiding column; 9. a lead-out rod; 10. an insulating sheet; 11. and a transition piece.
Detailed Description
The present invention will be further described in detail with reference to specific examples in order to make the objects, technical solutions and advantages of the present invention more apparent. In the examples, directional terms such as "upper", "lower", "middle", "left", "right", "front", "rear", and the like are merely directions with reference to the drawings. Accordingly, the directions of use are merely illustrative and not intended to limit the scope of the invention.
Referring to fig. 1-2, a type 2 solid relay with a staggered structure mainly comprises a relay circuit, an upper layer printed circuit board 5, a lower layer radiating bottom plate 6, a ceramic substrate 7, a flow guiding column 8 and 4 leading-out rods 9. The circuit principle structure of the relay circuit is the same as the prior art, and mainly comprises an input front-stage thick film circuit 1, a magnetic isolator 2, an input rear-stage thick film circuit 3 and an output power circuit 4. Wherein the input pre-stage thick film circuit 1, the magnetic isolator 2 and the input post-stage thick film circuit 3 form an input control circuit.
The upper layer printed circuit board 5 is provided with an isolation through hole 51, a diversion through hole 52 and 4 upper layer leading-out through holes 53, as shown in fig. 3. The input pre-stage thick film circuit 1 and the input post-stage thick film circuit 3 are designed by double-sided circuits, and the upper surface circuit and the lower surface circuit are electrically interconnected through metallized through holes. The input pre-stage thick film circuit 1 is fixed on the upper surface of the upper layer printed circuit 5 in a welding mode, and the two are electrically connected with the upper surface of the upper layer printed circuit 5 through palladium-silver pads arranged on the lower surface of the input pre-stage thick film circuit 1. The input rear thick film circuit 3 is fixed on the lower surface of the upper layer printed circuit 5 in a welding mode, and the palladium-silver pad arranged on the upper surface of the input rear thick film circuit 3 is electrically connected with the lower surface of the upper layer printed circuit 5. In the preferred embodiment of the invention, the input pre-stage thick film circuit 1 and the input post-stage thick film circuit 3 are respectively fixed and electrically interconnected with the upper layer printed circuit 5 at one time in a reflow soldering mode, and the welding fixing mode can effectively improve the binding force of the product, enhance the endurance environmental performance index and reduce the secondary connection step. The input front stage thick film circuit 1 and the input back stage thick film circuit 3 are mirror images of the upper and lower surfaces of the upper layer printed circuit board 5. The magnetic separator 2 is embedded in the separation through hole 51, so that the height can be effectively reduced. The primary of the magnetic isolator 2 is wound by an insulating leather wire, so that the voltage resistance performance of an input medium to an output medium can be enhanced. The magnetic isolator 2 is electrically connected with the input pre-stage thick film circuit 1 and the input post-stage thick film circuit 3 through the upper layer printed circuit board 5 respectively.
The lower heat dissipation bottom plate 6 is provided with a ceramic counter bore 61 and 4 lower extraction through holes 62, as shown in fig. 4. The upper and lower surfaces of the ceramic substrate 7 are both coated with copper, the upper surface of the ceramic substrate 7 is coated with copper for use as an overcurrent, and the lower surface of the ceramic substrate 7 is coated with copper for use as fixation and heat dissipation. In order to improve the overcurrent capability and heat dissipation efficiency of the product, the thickness of the upper surface copper coating of the ceramic substrate 7 should be greater than the thickness of the lower surface copper coating of the ceramic substrate 7. The ceramic substrate 7 is provided with 2 ceramic lead-out through holes 71 as shown in fig. 5. The ceramic substrate 7 is embedded into the ceramic counter bore 61, so that the height of the product can be reduced, the thermal resistance can be reduced, and the heat dissipation efficiency can be enhanced. The 2 ceramic extraction through holes 71 on the ceramic substrate 7 are respectively opposed to the 2 lower extraction through holes 62 on the lower heat dissipation base plate 6. The lower surface of the ceramic substrate 7 is attached to the bottom surface of the ceramic counterbore 61 by welding, which reduces the thermal resistance and improves the heat conduction efficiency. The ceramic substrate 7 serves as a carrier for the output power circuit 4, and the output power circuit 4 is fixed to the upper surface of the ceramic substrate 7 by soldering, and the two are electrically connected. In a preferred embodiment of the invention, the output power circuit 4 is fixed to the ceramic substrate 7 by means of eutectic bonding and forms an electrical interconnection by bonding. The ceramic substrate 7 on the lower-layer radiating bottom plate 6 and the magnetic isolator 2 on the upper-layer printed circuit board 5 are arranged in a staggered manner in the vertical direction, so that the internal space of the product can be effectively utilized.
Since the input control circuit of the invention is arranged on the upper layer printed circuit board 5 and the output power circuit 4 is arranged on the lower layer heat dissipation base plate 6, effective isolation is formed. The upper end of the flow guiding column 8 passes through the flow guiding through hole 52 to be electrically connected with the upper layer printed circuit board 5, and the lower end of the flow guiding column 8 is electrically connected with the upper surface of the ceramic substrate 7 so as to realize the electrical control of the input control circuit to the output power circuit 4.
The 4 extraction bars 9 are respectively and insulatively fixed in the 4 lower extraction through holes 62 of the lower heat dissipation base plate 6 to form a base assembly. In the preferred embodiment of the invention, 4 extraction bars 9 are respectively fixed with the lower heat dissipation base plate 6 in an insulating way through 1 insulating sheet 10. The extraction rod 9 and the lower heat dissipation base plate 6 can realize good insulation and withstand voltage characteristics due to the presence of the insulating sheet 10. Wherein, after 2 extraction rods 9, namely the upper ends of the input extraction rods 9 penetrate out from the upper surface of the lower layer heat dissipation bottom plate 6, the upper layer heat dissipation bottom plate is electrically connected with the upper layer printed circuit board 5 through 1 upper layer extraction through holes 53. The 2 extraction bars 9, that is, the upper ends of the output extraction bars 9, are electrically connected to the ceramic substrate 7 through the 2 ceramic extraction through holes 71 and to the upper printed circuit board 5 through the 2 upper extraction through holes 53 after being penetrated from the upper surface of the lower heat radiation base plate 6. In the preferred embodiment of the invention, 2 extraction bars 9 are each electrically connected to the ceramic substrate 7 by 1 transition piece 11. The transition piece 11 is sleeved on the extraction rod 9 and is arranged on the upper surface of the ceramic substrate 7, so that the connection reliability of the output power circuit 4 and the extraction rod 9 can be effectively enhanced. The lower ends of the 4 extraction rods 9 are extracted from the lower surface of the lower heat dissipation bottom plate 6. Finally, the relay is formed by sealing the shell through laser welding.
It should be noted that, the above embodiment only describes the case of 1 group of relay circuits, and in practice, the present invention may also be configured to simultaneously provide more than 2 groups of relay circuits on the upper layer printed circuit board 5 and the lower layer heat dissipation base plate 6. At this time, the isolation through holes 51, the diversion through holes 52 and the 4 upper extraction through holes 53 formed on the upper printed circuit board 5 are required to be multiplied correspondingly, and the ceramic counter bores 61 and the 4 lower extraction through holes 62 formed on the lower heat dissipation base plate 6 are required to be multiplied correspondingly, and in addition, the number of the ceramic substrates 7 is required to be multiplied correspondingly. In the embodiment of the invention shown in fig. 1-5, it is in fact the case that 4 sets of relay circuits are provided.
Although the embodiments of the present invention described above are illustrative, this is not a limitation of the present invention, and thus the present invention is not limited to the above-described specific embodiments. Other embodiments, which are apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein, are considered to be within the scope of the invention as claimed.
Claims (7)
1. A2-class solid relay with a staggered structure comprises an input pre-stage thick film circuit (1), a magnetic isolator (2), an input post-stage thick film circuit (3) and an output power circuit (4);
the LED lamp is characterized by further comprising an upper-layer printed circuit board (5), a lower-layer radiating bottom plate (6), a ceramic substrate (7), a flow guide column (8) and 4 extraction rods (9);
an isolation through hole (51), a diversion through hole (52) and 4 upper layer leading-out through holes (53) are formed in the upper layer printed circuit board (5); the input front-stage thick film circuit (1) is fixed on the upper surface of the upper-layer printed circuit board (5) in a welding mode, and the two are electrically connected; the input rear thick film circuit (3) is fixed on the lower surface of the upper layer printed circuit board (5) in a welding mode, and the two are electrically connected; the upper surface mirror image and the lower surface mirror image of the upper layer printed circuit board (5) are opposite to each other for the input front-stage thick film circuit (1) and the input rear-stage thick film circuit (3); the magnetic isolator (2) is embedded in the isolation through hole (51), and the magnetic isolator (2) is electrically connected with the input front-stage thick film circuit (1) and the input rear-stage thick film circuit (3) through the upper layer printed circuit (5) respectively;
a ceramic counter bore (61) and 4 lower layer leading-out through holes (62) are formed in the lower layer radiating bottom plate (6); copper is coated on the upper surface and the lower surface of the ceramic substrate (7), and 2 ceramic lead-out through holes (71) are formed in the ceramic substrate (7); the ceramic substrate (7) is embedded into the ceramic counter bore (61), and 2 ceramic lead-out through holes (71) on the ceramic substrate (7) are respectively opposite to 2 lower layer lead-out through holes (62) on the lower layer radiating bottom plate (6); the lower surface of the ceramic substrate (7) is adhered to the bottom surface of the ceramic counter bore (61) in a welding mode; the output power circuit (4) is fixed on the upper surface of the ceramic substrate (7) in a welding mode, and the two are electrically connected;
the upper end of the flow guide column (8) passes through the flow guide through hole (52) to be electrically connected with the upper layer printed circuit (5), and the lower end of the flow guide column (8) is electrically connected with the upper surface of the ceramic substrate (7) to realize the electrical control of the input control circuit to the output power circuit (4);
the 4 extraction rods (9) are respectively and insulatively fixed in 4 lower extraction through holes (62) of the lower radiating bottom plate (6); the upper ends of the 2 extraction rods (9) penetrate out of the upper surface of the lower-layer radiating bottom plate (6) and are electrically connected with the upper-layer printed circuit board (5) through 1 upper-layer extraction through holes (53); the upper ends of the 2 extraction rods (9) penetrate out of the upper surface of the lower-layer radiating bottom plate (6), are electrically connected with the ceramic substrate (7) through 2 ceramic extraction through holes (71), and are electrically connected with the upper-layer printed circuit board (5) through 2 upper-layer extraction through holes (53); the lower ends of the 4 extraction rods (9) are extracted from the lower surface of the lower heat dissipation bottom plate (6).
2. The 2-type solid relay with the staggered structure according to claim 1 is characterized in that 4 extraction rods (9) are respectively fixed with a lower-layer radiating bottom plate (6) in an insulating manner through 1 insulating sheet (10).
3. The 2-type solid relay with the staggered structure according to claim 1 is characterized in that 2 extraction rods (9) are electrically connected with a ceramic substrate (7) through 1 transition piece (11).
4. The 2-type solid relay with the staggered structure according to claim 1 is characterized in that an input front-stage thick film circuit (1) and an input rear-stage thick film circuit (3) are fixed on an upper-layer printed circuit board (5) through a reflow soldering mode.
5. A class 2 solid state relay of a staggered structure according to claim 1, characterized in that the output power circuit (4) is fixed to the ceramic substrate (7) by means of eutectic soldering.
6. The 2-type solid relay with the staggered structure according to claim 1 is characterized in that the magnetic isolator (2) on the upper printed circuit board (5) and the ceramic substrate (7) on the lower radiating bottom board (6) are staggered in the vertical direction.
7. A type 2 solid state relay of a staggered structure according to claim 1, characterized in that the thickness of the copper coating on the upper surface of the ceramic substrate (7) is greater than the thickness of the copper coating on the lower surface of the ceramic substrate (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813155.XA CN110429009B (en) | 2019-08-30 | 2019-08-30 | 2-type solid relay with staggered structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910813155.XA CN110429009B (en) | 2019-08-30 | 2019-08-30 | 2-type solid relay with staggered structure |
Publications (2)
| Publication Number | Publication Date |
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| CN110429009A CN110429009A (en) | 2019-11-08 |
| CN110429009B true CN110429009B (en) | 2024-03-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910813155.XA Active CN110429009B (en) | 2019-08-30 | 2019-08-30 | 2-type solid relay with staggered structure |
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| Country | Link |
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| CN (1) | CN110429009B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110784114B (en) * | 2019-11-14 | 2021-03-23 | 杭州必易微电子有限公司 | Voltage conversion circuit and conversion method for non-isolated AC-DC voltage conversion system |
| CN111834353B (en) * | 2020-07-17 | 2023-03-24 | 北京市科通电子继电器总厂有限公司 | SIP laminated structure |
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| WO2013150772A1 (en) * | 2012-04-02 | 2013-10-10 | 富士電機株式会社 | Power converter |
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| CN108109986A (en) * | 2017-07-13 | 2018-06-01 | 东莞市国瓷新材料科技有限公司 | A kind of power semiconductor integrated form encapsulation ceramic module and preparation method thereof |
| CN109244045A (en) * | 2018-09-29 | 2019-01-18 | 北方电子研究院安徽有限公司 | A kind of thick film substrate miniaturization Can encapsulating structure |
| CN210245421U (en) * | 2019-08-30 | 2020-04-03 | 桂林航天电子有限公司 | Class 2 solid relay with staggered structure |
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2019
- 2019-08-30 CN CN201910813155.XA patent/CN110429009B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202335182U (en) * | 2011-10-26 | 2012-07-11 | 遵义精星航天电器有限责任公司 | Solid relay |
| WO2013150772A1 (en) * | 2012-04-02 | 2013-10-10 | 富士電機株式会社 | Power converter |
| CN103700543A (en) * | 2013-12-13 | 2014-04-02 | 陕西群力电工有限责任公司 | Small sealing release delay relay with long delay time |
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| CN110429009A (en) | 2019-11-08 |
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