CN110411344B - Calibration method, calibration device, calibration system and electronic equipment - Google Patents
Calibration method, calibration device, calibration system and electronic equipment Download PDFInfo
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- CN110411344B CN110411344B CN201910721455.5A CN201910721455A CN110411344B CN 110411344 B CN110411344 B CN 110411344B CN 201910721455 A CN201910721455 A CN 201910721455A CN 110411344 B CN110411344 B CN 110411344B
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Abstract
The application provides a calibration method, a calibration device, a calibration system and an electronic device, wherein the calibration method comprises the following steps: acquiring a first distance, a second distance, a third distance and a fourth distance; and calibrating the preset polishing head circle to the target polishing head circle according to the first distance, the second distance, the third distance and the fourth distance so as to enable the first distance to be equal to the second distance, and enable the third distance to be equal to the fourth distance. Thus, by making the first distance equal to the second distance and the third distance equal to the fourth distance, the polishing head circle is calibrated to make the polishing head corresponding to the polishing head circle and the stage corresponding to the stage circle have the same coaxiality. The method for calibrating the positions of the polishing head and the loading and unloading platform is convenient and rapid, and has small error and high accuracy.
Description
Technical Field
The application relates to the technical field of chemical mechanical polishing, in particular to a calibration method, a calibration device, a calibration system and electronic equipment.
Background
The Chemical Mechanical Planarization (CMP) equipment comprises a polishing Head (Head) and a loading platform (Wafer Loader), when the polishing Head takes and unloads a Wafer from the loading platform, the polishing Head and the loading platform should be consistent in coaxiality, if the polishing Head takes and unloads the Wafer from the loading platform, the time for taking and placing the Wafer is too long, and if the alignment of the polishing Head and the loading platform is too large, the Wafer is broken and other serious results are caused. Therefore, before the chemical mechanical planarization apparatus is used, the polishing head and the stage need to be calibrated first. The traditional calibration method mainly comprises the steps of holding the ruler scale to repeatedly measure the difference between two circumferences of the polishing head and the loading and unloading platform, and repeatedly adjusting the position of the polishing head for multiple times after measurement so as to achieve the purpose of calibration. However, the result obtained by the conventional calibration method has a large error.
Disclosure of Invention
The application provides a calibration method, a calibration device, a calibration system and an electronic device, so as to solve the problem of large error of a calibration result.
In order to achieve the above purpose, the technical solutions provided in the embodiments of the present application are as follows:
in a first aspect, an embodiment of the present application provides a calibration method, including: acquiring a first distance, a second distance, a third distance and a fourth distance; the first distance is the shortest distance between a first calibration point and a preset polishing head circle, the second distance is the shortest distance between a second calibration point and the preset polishing head circle, the third distance is the smallest arc distance between a third calibration point and the preset polishing head circle, and the fourth distance is the smallest arc distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform; calibrating the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance and the fourth distance so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; and the target polishing head circle is a circle corresponding to the target position of the polishing head. Thus, by making the first distance equal to the second distance and the third distance equal to the fourth distance, the polishing head circle is calibrated to make the polishing head corresponding to the polishing head circle and the stage corresponding to the stage circle have the same coaxiality. The method for calibrating the positions of the polishing head and the loading and unloading platform is convenient and rapid, and has small error and high accuracy.
In an optional embodiment of the present application, before said obtaining the first distance, the method further comprises: acquiring first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point and fourth position information of the fourth calibration point; marking the first calibration point on the handling bench circle according to the first position information, marking the second calibration point on the handling bench circle according to the second position information, marking the third calibration point on the handling bench circle according to the third position information, and marking the fourth calibration point on the handling bench circle according to the fourth position information. Therefore, the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are marked on the stage circle, so that the electronic apparatus can perform highly accurate calibration of the positions of the polishing head and the stage based on the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
In an optional embodiment of the present application, the acquiring first position information of the first calibration point and second position information of the second calibration point includes: acquiring a first circle center of a track circle of the polishing head and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle; the second circle center is the circle center of the loading platform circle; and determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point are determined according to the position relationship among the polishing head track circle, the polishing head circle and the loading platform circle, so that the electronic equipment can perform high-accuracy calibration on the positions of the polishing head and the loading platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
In an alternative embodiment of the present application, the obtaining third position information of the third calibration point and fourth position information of the fourth calibration point includes: acquiring the radius of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the handling platform circle, and determining the first angle according to the cosine value; the first angle is an included angle between a first straight line and a second straight line, the first straight line is a connecting line of the first circle center and a second circle center, the second circle center is the circle center of the loading and unloading platform circle, and the second straight line is a connecting line of the first circle center and the third calibration point or the fourth calibration point; and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point are determined according to the position relationship among the polishing head track circle, the polishing head circle and the loading platform circle, so that the electronic equipment can perform high-accuracy calibration on the positions of the polishing head and the loading platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
In a second aspect, an embodiment of the present application provides a calibration apparatus, including: the first acquisition module is used for acquiring a first distance, a second distance, a third distance and a fourth distance; the first distance is the shortest distance between a first calibration point and a preset polishing head circle, the second distance is the shortest distance between a second calibration point and the preset polishing head circle, the third distance is the smallest arc distance between a third calibration point and the preset polishing head circle, and the fourth distance is the smallest arc distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform; a calibration module, configured to calibrate the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; and the target polishing head circle is a circle corresponding to the target position of the polishing head. Therefore, the calibration module calibrates the polishing head circle by making the first distance equal to the second distance and the third distance equal to the fourth distance, so that the polishing head corresponding to the polishing head circle is consistent with the stage coaxiality corresponding to the stage circle. The method for calibrating the positions of the polishing head and the loading and unloading platform is convenient and rapid, and has small error and high accuracy.
In an alternative embodiment of the present application, the apparatus further comprises: a second obtaining module, configured to obtain first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point; and the marking module is used for marking the first calibration point on the loading and unloading bench circle according to the first position information, marking the second calibration point on the loading and unloading bench circle according to the second position information, marking the third calibration point on the loading and unloading bench circle according to the third position information, and marking the fourth calibration point on the loading and unloading bench circle according to the fourth position information. Therefore, the marking module firstly marks the first calibration point, the second calibration point, the third calibration point and the fourth calibration point on the loading platform circle, so that the electronic equipment can perform high-accuracy calibration on the positions of the polishing head and the loading platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
In an optional embodiment of the present application, the second obtaining module is specifically configured to: acquiring a first circle center of a track circle of the polishing head and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle; the second circle center is the circle center of the loading platform circle; and determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point are determined according to the position relationship among the polishing head track circle, the polishing head circle and the loading platform circle, so that the electronic equipment can perform high-accuracy calibration on the positions of the polishing head and the loading platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
In an optional embodiment of the present application, the second obtaining module is specifically configured to: acquiring the radius of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the handling platform circle, and determining the first angle according to the cosine value; the first angle is an included angle between a first straight line and a second straight line, the first straight line is a connecting line of the first circle center and a second circle center, the second circle center is the circle center of the loading and unloading platform circle, and the second straight line is a connecting line of the first circle center and the third calibration point or the fourth calibration point; and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle. Therefore, the positions of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point are determined according to the position relationship among the polishing head track circle, the polishing head circle and the loading platform circle, so that the electronic equipment can perform high-accuracy calibration on the positions of the polishing head and the loading platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
In a third aspect, an embodiment of the present application provides a calibration system, including a measurement device and the calibration device described in the second aspect; the measuring device is used for measuring a first distance, a second distance, a third distance and a fourth distance, and the calibrating device is used for calibrating the position of the polishing head according to the first distance, the second distance, the third distance and the fourth distance; the first distance is the arc distance between a first calibration point and a preset polishing head circle, the second distance is the arc distance between a second calibration point and the preset polishing head circle, the third distance is the shortest distance between a third calibration point and the preset polishing head circle, and the fourth distance is the shortest distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform. Therefore, the first distance, the second distance, the third distance, and the fourth distance can be measured by the measuring device, so that the electronic apparatus can perform highly accurate calibration of the positions of the polishing head and the stage by making the first distance equal to the second distance and the third distance equal to the fourth distance.
In an alternative embodiment of the present application, the measuring device comprises: the device comprises a fixing piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece; the size and shape of the fixing piece are the same as those of the loading platform circle; the first measuring piece is arranged at a first position, corresponding to the platform circle, on the fixing piece, the second measuring piece is arranged at a second position, corresponding to the platform circle, on the fixing piece, the third measuring piece is arranged at a third position, corresponding to the platform circle, on the fixing piece, and the fourth measuring piece is arranged at a fourth position, corresponding to the platform circle, on the fixing piece; wherein the first position is a position of the first calibration point, the second position is a position of the second calibration point, the third position is a position of the third calibration point, and the fourth position is a position of the fourth calibration point. Therefore, the first measuring part, the second measuring part, the third measuring part, and the fourth measuring part on the measuring device are respectively disposed at the first position, the second position, the third position, and the fourth position, so that the electronic apparatus can perform highly accurate calibration of the positions of the polishing head and the stage according to the calibration method in the first aspect.
In a fourth aspect, an embodiment of the present application provides an electronic device, including: a processor, a memory, and a bus; the processor and the memory are communicated with each other through the bus; the memory stores program instructions executable by the processor, the processor invoking the program instructions capable of performing the calibration method of the first aspect.
In a fifth aspect, embodiments of the present application provide a non-transitory computer-readable storage medium storing computer instructions that cause the computer to perform the calibration method of the first aspect.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below. It is appreciated that the following drawings depict only certain embodiments of the application and are therefore not to be considered limiting of its scope, for those skilled in the art will be able to derive additional related drawings therefrom without the benefit of the inventive faculty.
Fig. 1 is a flowchart of a calibration method according to an embodiment of the present application;
FIG. 2 is a schematic diagram of the locations of a polishing head circle, a loading platform circle, and a polishing head track circle provided in an embodiment of the present application;
FIG. 3a is a schematic diagram of a polishing head circle provided in an embodiment of the present application before calibration in the CD direction;
FIG. 3b is a schematic diagram of a polishing head circle provided in an embodiment of the present application after calibration in the CD direction;
FIG. 4a is a schematic diagram of a polishing head circle provided in an embodiment of the present application before calibration in the AB direction;
FIG. 4b is a schematic diagram of a polishing head circle calibrated in the AB direction according to an embodiment of the present disclosure;
FIG. 5 is a flow chart of another calibration method provided by embodiments of the present application;
FIG. 6 is a flow chart of another calibration method provided by embodiments of the present application;
FIG. 7 is a schematic diagram of determining ABCD calibration points provided by an embodiment of the present application;
FIG. 8 is a flow chart of another calibration method provided by embodiments of the present application;
fig. 9 is a block diagram of a calibration apparatus according to an embodiment of the present disclosure;
fig. 10 is a schematic structural diagram of a measurement apparatus according to an embodiment of the present disclosure;
fig. 11 is a schematic view illustrating an installation of a measuring device and a loading/unloading platform according to an embodiment of the present disclosure;
fig. 12 is a block diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solution in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Referring to fig. 1, fig. 1 is a flowchart of a calibration method according to an embodiment of the present disclosure, where the calibration method includes the following steps:
step S101: and acquiring the first distance, the second distance, the third distance and the fourth distance.
For example, during the chemical mechanical planarization process, in order to ensure that the wafer is intact, the positions of the polishing head and the loading/unloading platform in the chemical mechanical planarization apparatus need to be calibrated. Among them, chemical mechanical planarization is a means for obtaining global planarization in integrated circuit manufacturing, and a flat, scratch-free and impurity-contaminated surface can be obtained by using chemical mechanical planarization. The chemical mechanical planarization equipment comprises a polishing head and a loading and unloading platform: the polishing head is used for polishing the wafer to be polished; the loading/unloading table is a tool for unloading the polished wafer after the wafer is polished by the polishing head. The main workflow of the chemical mechanical planarization apparatus can be briefly described as follows: a transfer robot (Wafer Exchanger) transfers a Wafer to be planarized onto a loading/unloading table; then the polishing head takes the wafer from the loading and unloading platform and carries out polishing process; and after polishing, the polishing head unloads the wafer from the loading platform, and then the wafer is grabbed by the transshipment mechanical arm to carry out cleaning and spin-drying processes. Therefore, if the positions of the polishing head and the loading platform do not meet the standard, i.e., the polishing head and the loading platform are not coaxial, the time for picking and placing the wafer by the polishing head is too long, and if the deviation between the polishing head and the center of the loading platform is too large, the wafer fragment can be caused.
To ensure that the wafer is not damaged during planarization, it is necessary to ensure that the polishing head and the stage are coaxial. As an embodiment, the electronic device may first acquire a first distance, a second distance, a third distance, and a fourth distance. The first distance is the shortest distance between the first calibration point and the preset polishing head circle, the second distance is the shortest distance between the second calibration point and the preset polishing head circle, the third distance is the smallest arc distance between the third calibration point and the preset polishing head circle, and the fourth distance is the smallest arc distance between the fourth calibration point and the preset polishing head circle.
Referring to fig. 2, fig. 2 is a schematic diagram illustrating positions of a polishing head circle, a loading/unloading platform circle, and a polishing head track circle according to an embodiment of the present disclosure. The preset polishing head circle is a circle corresponding to the initial position of the polishing head, the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform, and the polishing head track circle is a circle corresponding to the motion track of the polishing head. The electronic equipment can record the positions and the sizes of the loading platform and the polishing head in the chemical mechanical planarization equipment before calibration through the loading platform circle and the preset polishing head circle, so that the position of the polishing head can be calibrated according to the recorded positions and the recorded sizes. The positions of the loading platform circle and the polishing head circle are fixed, and the circle center position and the radius of the loading platform circle correspond to those of the loading platform in the actual chemical mechanical planarization equipment, namely, the circle center position and the radius of the loading platform circle are fixed and known. The polishing head circle corresponds to the polishing head in the actual chemical mechanical planarization apparatus, and therefore, the radius thereof is also fixedly known, and the position of the polishing head circle is the subject of calibration by the calibration method of the present application, the calibration being intended to coincide with the center of the above-mentioned stage circle. The polishing head track circle is a circle corresponding to the motion track of the polishing head in the actual operation process, and the radius and the center of the circle are also fixed and known.
In one embodiment, the ABCD four points in fig. 2 are the first calibration point, the second calibration point, the third calibration point and the fourth calibration point, respectively, and are located on the platform circle. The determination manner of the first calibration point a, the second calibration point B, the third calibration point C and the fourth calibration point D will be described in the following embodiments. In this embodiment, the first distance is the distance along line AA' in fig. 2, i.e., the shortest distance between the first calibration point a and the preset polishing head circle; the second distance is the distance of the line segment BB' in fig. 2, i.e. the shortest distance between the second calibration point B and the preset polishing head circle; the third distance is the distance of the arc CC' in fig. 2, i.e. the minimum arc distance between the third calibration point C and the preset polishing head circle; the fourth distance is the distance DD' arc in fig. 2, i.e., the minimum arc distance between the fourth calibration point D and the preset polishing head circle.
It should be noted that there are various ways for the electronic device to obtain the first distance, the second distance, the third distance, and the fourth distance, and the embodiments of the present application are not limited in particular. For example: the electronic equipment receives data input by an operator; or the electronic equipment reads pre-stored data from the server; alternatively, the electronic device itself measures data of the first distance, the second distance, the third distance, and the fourth distance, and the like.
Step S102: calibrating the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance and the fourth distance so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance.
For example, after obtaining the first distance, the second distance, the third distance, and the fourth distance in step S102, the electronic device may calibrate the polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the preset polishing head circle before calibration becomes the calibrated target polishing head circle. Then, the polishing head in the actual chemical mechanical planarization apparatus can be controlled to move to the position of the target polishing head circle, at which time the polishing head is coaxial with the stage circle. It should be noted that the electronic device may be used to control the movement of the polishing head, or the electronic device may send the position of the calibrated target polishing head circle to other devices, and the other devices control the movement of the polishing head, which may be selected by a person skilled in the art according to actual situations.
As an embodiment, the electronic device may make the first distance equal to the second distance and the third distance equal to the fourth distance for the purpose of making the centers of the stage circle and the polishing head circle coincide.
For example, the calibration process is as follows: referring to fig. 3a, fig. 3a is a schematic diagram of a polishing head circle provided in this embodiment before calibration in the CD direction, where the third distance CC 'is not equal to the fourth distance DD'; referring to fig. 3b, fig. 3b is a schematic diagram of a polishing head circle calibrated in the CD direction according to an embodiment of the disclosure, where the third distance CC 'is equal to the fourth distance DD'. Therefore, the angular position of the polishing Head circle can be calibrated in the arc CD direction (Head Rotation direction) first. Referring to fig. 4a, fig. 4a is a schematic diagram of a polishing head circle provided in an embodiment of the present application before calibration in an AB direction, where a first distance AA 'is not equal to a second distance BB'; referring to fig. 4b, fig. 4b is a schematic diagram of a polishing head circle provided in an embodiment of the present application after calibration in the AB direction, where the first distance AA 'is equal to the second distance BB'. Therefore, the linear position of the polishing Head circle can be subsequently calibrated in the linear AB direction (Head Sweep direction). After calibration in the CD direction and the AB direction, the calibrated loading and unloading platform circle coincides with the circle center of the polishing head.
It should be noted that the calibration process is only one solution provided by the embodiment of the present invention, and the AB direction may be calibrated first and then the CD direction may be calibrated, which may be selected by a person skilled in the art according to actual situations.
In the embodiment of the present application, the polishing head circle is calibrated by making the first distance equal to the second distance, and the third distance equal to the fourth distance, so that the polishing head corresponding to the polishing head circle and the stage corresponding to the stage circle have the same coaxiality. The method for calibrating the positions of the polishing head and the loading and unloading platform is convenient and rapid, and has small error and high accuracy.
Further, referring to fig. 5, fig. 5 is a flowchart of another calibration method according to an embodiment of the present application, before step S101, the calibration method further includes the following steps:
step S501: acquiring first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point.
Step S502: marking the first calibration point on the handling bench circle according to the first position information, marking the second calibration point on the handling bench circle according to the second position information, marking the third calibration point on the handling bench circle according to the third position information, and marking the fourth calibration point on the handling bench circle according to the fourth position information.
For example, before calibrating the positions of the polishing head circle and the stage circle, the electronic device may first acquire first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point, and mark the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point on the stage circle according to the acquired first position information, second position information, third position information, and fourth position information, so as to determine the first distance, the second distance, the third distance, and the fourth distance according to the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
In one embodiment, after acquiring the first position information, the second position information, the third position information, and the fourth position information, the electronic device may mark the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point on the stage in the actual chemical mechanical planarization apparatus based on the first position information, the second position information, the third position information, the fourth position information, and the position of the stage circle. Namely, before each chemical mechanical planarization device leaves the factory, the four points of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point are marked on the loading and unloading platform, so that the polishing head can be calibrated quickly and accurately when deviation occurs.
It should be noted that there are various ways for the electronic device to obtain the first position information of the first calibration point, the second position information of the second calibration point, the third position information of the third calibration point, and the fourth position information of the fourth calibration point, and the embodiments of the present application are not limited specifically. For example: the electronic equipment receives data input by an operator; or the electronic equipment reads pre-stored data from the server; alternatively, the electronic device itself derives position data or the like from the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
In the embodiment of the present application, the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are marked on the mounting stage circle, so that the electronic device can perform highly accurate calibration on the positions of the polishing head and the mounting stage according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
Further, referring to fig. 6, fig. 6 is a flowchart of another calibration method according to an embodiment of the present application, and step S401 includes the following steps:
step S601: acquiring a first circle center of a track circle of the polishing head and the loading and unloading platform circle; and the polishing head track circle is a circle corresponding to the polishing head running track.
For example, referring to fig. 2, as shown in fig. 2, the polishing head track circle is a circle corresponding to the polishing head motion track, and the radius and the center of the circle are fixed and known. In the process of determining the first calibration point and the second calibration point, the electronic device may first obtain a first center of a polishing head trajectory circle and a second center and a circumference of a stage circle, so that the first calibration point and the second calibration point may be subsequently determined by using the first center of the polishing head trajectory circle and the second center and the circumference of the stage circle.
It should be noted that there are various ways for the electronic device to obtain the first center of the track circle of the polishing head and the stage circle, and this embodiment of the present application is not limited specifically. For example: the electronic equipment receives data input by an operator; alternatively, the electronic device reads pre-stored data or the like from a server.
Step S602: and connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle.
For example, referring to fig. 7, fig. 7 is a schematic diagram of determining ABCD calibration points according to an embodiment of the present application. As shown in fig. 7, the first calibration point a and the second calibration point B are two intersections of the first straight line AB and the stage circle, respectively. The first straight line AB is a connecting line of a first circle center of a polishing head track circle and a second circle center of a loading and unloading platform circle. Therefore, the electronic device can connect the first center of circle and the second center of circle by using the first straight line, so that a first intersection point and a second intersection point of the first straight line and the platform circle can be obtained.
Step S603: and determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information.
For example, as described in step S602, the first and second intersection points of the first straight line and the stage circle are the first and second calibration points, respectively, and thus the electronic device may determine the position information of the first intersection point as the first position information of the first calibration point and the position information of the second intersection point as the second position information of the second calibration point.
In addition, after four points, i.e., the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point, on the mounting/dismounting table of one chemical mechanical planarization apparatus are determined, it is possible to achieve alignment of the coaxiality between the polishing heads and the mounting/dismounting table in a large number of apparatuses according to the interchangeability.
In the embodiment of the present application, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship between the polishing head track circle, the polishing head circle, and the stage circle, so that the electronic apparatus can perform highly accurate calibration on the positions of the polishing head and the stage according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
Further, referring to fig. 8, fig. 8 is a flowchart of another calibration method according to an embodiment of the present application, and step S401 further includes the following steps:
step S801: and acquiring the radius of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle.
For example, referring to fig. 2, as shown in fig. 2, the polishing head track circle is a circle corresponding to the polishing head motion track, and the radius and the center of the circle are fixed and known. In the process of determining the third calibration point and the fourth calibration point, the electronic device may first obtain the radius and the first center of the polishing head track circle and the second center of the stage circle and the circumference, so that the radius and the second center of the stage circle may be subsequently used to determine the third calibration point and the fourth calibration point.
It should be noted that there are various ways for the electronic device to obtain the radius of the polishing head track circle, the first center of the polishing head track circle, and the stage circle, and this embodiment of the present application is not limited specifically. For example: the electronic equipment receives data input by an operator; alternatively, the electronic device reads pre-stored data or the like from a server.
Step S802: and determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the loading platform circle, and determining the first angle according to the cosine value.
Illustratively, referring to FIG. 7, as shown in FIG. 7, the radii EO and EC of the polishing head track circle and the radii OE and OC of the platen circle are known, and the third calibration point C and the fourth calibration point D are the intersection points of the platen circle and the polishing head track circle, respectively. However, since the center of the track circle of the polishing head is provided with a cylinder in the actual chemical mechanical planarization apparatus, the specific position of the center E cannot be determined, and therefore, the specific position of the third calibration point C on the loading/unloading platform in the actual chemical mechanical planarization apparatus cannot be determined only according to the length of EC. For the above reasons, the specific position of the third calibration point C is determined by the following method:
referring to fig. 7, a first angle α in fig. 7 is an included angle between a first straight line OE and a second straight line OC, where the first straight line OE is a connection line between a first center E of the polishing head track circle and a second center O of the stage circle, and the second straight line OC is a connection line between the first center E of the polishing head track circle and the third calibration point C. The cosine of the first angle α is then:
wherein cos α is a cosine of the first angle α, a is a length of the first straight line OE, and b is a length of the second straight line OC.
After determining the cosine value of the first angle α, the first angle α may be determined as follows according to the cosine value of the first angle α:
wherein the content of the first and second substances,
is the cosine of the first angle alpha, alpha being the value of the first angle.
Step S803: and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle.
For example, after the value of the first angle α is determined in step S802, the third position information of the third calibration point on the handling circle may be determined according to the position of the first line OE and the value of the first angle α. It should be noted that the manner of determining the fourth position information of the fourth calibration point is the same as the manner of determining the third position information of the third calibration point, and the details are not repeated here.
Therefore, the third calibration point and the fourth calibration point determined in the above manner can mark the third calibration point C and the fourth calibration point D on the loading and unloading table of the actual chemical mechanical planarization equipment according to the position of the first calibration point a and the value of the first angle α, so as to facilitate quick and accurate calibration of the polishing head when deviation occurs.
In the embodiment of the present application, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship between the polishing head track circle, the polishing head circle, and the stage circle, so that the electronic apparatus can perform highly accurate calibration on the positions of the polishing head and the stage according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
Referring to fig. 9, fig. 9 is a block diagram of a calibration apparatus according to an embodiment of the present disclosure, where the calibration apparatus 90 includes: a first obtaining module 901, configured to obtain a first distance, a second distance, a third distance, and a fourth distance; the first distance is the arc distance between a first calibration point and a preset polishing head circle, the second distance is the arc distance between a second calibration point and the preset polishing head circle, the third distance is the shortest distance between a third calibration point and the preset polishing head circle, and the fourth distance is the shortest distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform; a calibration module 902, configured to calibrate the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; and the target polishing head circle is a circle corresponding to the target position of the polishing head.
In this embodiment, the calibration module 902 calibrates the polishing head circle by making the first distance equal to the second distance, and the third distance equal to the fourth distance, so that the polishing head corresponding to the polishing head circle and the stage corresponding to the stage circle have the same coaxiality. The method for calibrating the positions of the polishing head and the loading and unloading platform is convenient and rapid, and has small error and high accuracy.
Further, the calibration device 90 further includes: a second obtaining module, configured to obtain first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point; and the marking module is used for marking the first calibration point on the loading and unloading bench circle according to the first position information, marking the second calibration point on the loading and unloading bench circle according to the second position information, marking the third calibration point on the loading and unloading bench circle according to the third position information, and marking the fourth calibration point on the loading and unloading bench circle according to the fourth position information.
In this embodiment, the marking module firstly marks the first calibration point, the second calibration point, the third calibration point and the fourth calibration point on the mounting platform circle, so that the electronic device can perform highly accurate calibration on the positions of the polishing head and the mounting platform according to the first calibration point, the second calibration point, the third calibration point and the fourth calibration point.
Further, the second obtaining module is specifically configured to: acquiring a first circle center of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle; the second circle center is the circle center of the loading platform circle; and determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information.
In the embodiment of the present application, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship between the polishing head track circle, the polishing head circle, and the stage circle, so that the electronic apparatus can perform highly accurate calibration on the positions of the polishing head and the stage according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
Further, the second obtaining module is specifically configured to: acquiring the radius of a track circle of the polishing head and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track; determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the handling platform circle, and determining the first angle according to the cosine value; the first angle is an included angle between a first straight line and a second straight line, the first straight line is a connecting line of the first circle center and a second circle center, the second circle center is the circle center of the loading and unloading platform circle, and the second straight line is a connecting line of the first circle center and the third calibration point or the fourth calibration point; and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle.
In the embodiment of the present application, the positions of the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point are determined according to the positional relationship between the polishing head track circle, the polishing head circle, and the stage circle, so that the electronic apparatus can perform highly accurate calibration on the positions of the polishing head and the stage according to the first calibration point, the second calibration point, the third calibration point, and the fourth calibration point.
The embodiment of the present application further provides a calibration system, which includes a measuring device and the calibration device 90; the measuring device is used for measuring a first distance, a second distance, a third distance and a fourth distance, and the calibration device 90 is used for calibrating the position of the polishing head according to the first distance, the second distance, the third distance and the fourth distance; the first distance is the arc distance between a first calibration point and a preset polishing head circle, the second distance is the arc distance between a second calibration point and the preset polishing head circle, the third distance is the shortest distance between a third calibration point and the preset polishing head circle, and the fourth distance is the shortest distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform.
Further, referring to fig. 10, fig. 10 is a schematic structural diagram of a measurement apparatus according to an embodiment of the present application, where the measurement apparatus includes: the device comprises a fixing piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece; the size and shape of the fixing piece are the same as those of the loading platform circle; the first measuring piece is arranged at a first position, corresponding to the platform circle, on the fixing piece, the second measuring piece is arranged at a second position, corresponding to the platform circle, on the fixing piece, the third measuring piece is arranged at a third position, corresponding to the platform circle, on the fixing piece, and the fourth measuring piece is arranged at a fourth position, corresponding to the platform circle, on the fixing piece; wherein the first position is a position of the first calibration point, the second position is a position of the second calibration point, the third position is a position of the third calibration point, and the fourth position is a position of the fourth calibration point.
For example, in order to implement the calibration method in the foregoing embodiments, the calibration system provided in the embodiments of the present application may be utilized. The calibration system includes a measuring device and a calibration device 90.
As an embodiment, as shown in fig. 10, the measuring device includes a fixing member having a shape and a size equal to those of the mounting platform circle so that the measuring device can be fixed on the mounting platform circle. Referring to fig. 11, fig. 11 is an installation diagram of a measuring device and a loading platform according to an embodiment of the present application, in which a fixing member in the measuring device may be clamped on the loading platform. The measuring device further includes a plurality of measuring members, and as shown in fig. 10, the measuring device includes four measuring members, which are respectively disposed at a first calibration point, a second calibration point, a third calibration point, and a fourth calibration point on the fixing member corresponding to the mount table circle. Wherein, a plurality of measuring parts can be for cylindrical screw in dipperstick and arc angular surveying chi, are carved with the straight line scale on the cylinder of cylindrical screw in dipperstick, and the unit of measurement mm is carved with the angle scale on the arc angular surveying chi, and the unit of measurement is. For example, the first measuring member at the first position and the second measuring member at the second position may be cylindrical screw-in measuring scales, and the third measuring member at the third position and the fourth measuring member at the fourth position may be arc angle measuring scales.
As an embodiment, the step of calibrating the positions of the polishing head and the stage by using the calibration system is as follows:
in a first step, the calibration device determines the positions of the first, second, third and fourth calibration points and marks the first, second, third and fourth calibration points on the loading dock.
And secondly, determining the positions of the first measuring piece, the second measuring piece, the third measuring piece and the fourth measuring piece in the measuring device according to the positions of the first calibration point, the second calibration point, the third calibration point and the fourth calibration point determined by the calibration device.
And thirdly, clamping the measuring devices provided with the first measuring part, the second measuring part, the third measuring part and the fourth measuring part into the corresponding positions of the loading and unloading platform.
And fourthly, moving the first measuring piece and the second measuring piece until the first measuring piece and the second measuring piece touch the polishing table, stopping moving, and reading the first distance and the second distance from the first calibration point and the second calibration point to the polishing head.
And fifthly, moving the third measuring part and the fourth measuring part until the third measuring part and the fourth measuring part touch the polishing table, stopping moving, and reading a third distance and a fourth distance from the third calibrating point and the fourth calibrating point to the polishing head.
And sixthly, calibrating the positions of the polishing head and the loading and unloading platform by the calibrating device according to the first distance, the second distance, the third distance and the fourth distance.
In this embodiment, the first measuring device, the second measuring device, the third measuring device, and the fourth measuring device on the measuring device are respectively disposed at the first position, the second position, the third position, and the fourth position, and then the measuring device is used to measure the first distance, the second distance, the third distance, and the fourth distance, so that the electronic device can perform highly accurate calibration on the positions of the polishing head and the mounting platform by making the first distance equal to the second distance and the third distance equal to the fourth distance.
Referring to fig. 12, fig. 12 is a block diagram of an electronic device according to an embodiment of the present disclosure, where the electronic device includes: at least one processor 1201, at least one communication interface 1202, at least one memory 1203 and at least one communication bus 1204. The communication bus 1204 is used for implementing direct connection communication of these components, the communication interface 1202 is used for communicating signaling or data with other node devices, and the memory 1203 stores machine-readable instructions executable by the processor 1201. When the electronic device is in operation, the processor 1201 communicates with the memory 1203 via the communication bus 1204, and the machine readable instructions when executed by the processor 1201 perform the calibration method described above.
The processor 1201 may be an integrated circuit chip having signal processing capabilities. The Processor 1201 may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but may also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), an off-the-shelf programmable gate array (FPGA) or other programmable logic device, discrete gate or transistor logic, discrete hardware components. Which may implement or perform the various methods, steps, and logic blocks disclosed in the embodiments of the present application. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The Memory 1203 may include, but is not limited to, Random Access Memory (RAM), Read Only Memory (ROM), Programmable Read Only Memory (PROM), Erasable Read Only Memory (EPROM), electrically Erasable Read Only Memory (EEPROM), and the like.
Embodiments of the present application also provide a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions, which when executed by a computer, the computer is capable of performing the steps of the calibration method in the above embodiments, for example, including: acquiring a first distance, a second distance, a third distance and a fourth distance; calibrating the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance and the fourth distance so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (6)
1. A method of calibration, comprising:
acquiring a first distance, a second distance, a third distance and a fourth distance; the first distance is the shortest distance between a first calibration point and a preset polishing head circle, the second distance is the shortest distance between a second calibration point and the preset polishing head circle, the third distance is the smallest arc distance between a third calibration point and the preset polishing head circle, and the fourth distance is the smallest arc distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform;
calibrating the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance and the fourth distance so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; the target polishing head circle is a circle corresponding to the target position of the polishing head;
prior to the acquiring the first distance, the method further comprises:
acquiring first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point and fourth position information of the fourth calibration point;
marking the first calibration point on the handling bench circle according to the first position information, marking the second calibration point on the handling bench circle according to the second position information, marking the third calibration point on the handling bench circle according to the third position information, and marking the fourth calibration point on the handling bench circle according to the fourth position information;
wherein the obtaining first position information of the first calibration point and second position information of the second calibration point comprises:
acquiring a first circle center of a track circle of the polishing head and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track;
connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle; the second circle center is the circle center of the loading platform circle;
determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information;
the obtaining third position information of the third calibration point and fourth position information of the fourth calibration point includes:
acquiring the radius of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track;
determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the handling platform circle, and determining the first angle according to the cosine value; the first angle is an included angle between a first straight line and a second straight line, the first straight line is a connecting line of the first circle center and a second circle center, the second circle center is the circle center of the loading and unloading platform circle, and the second straight line is a connecting line of the first circle center and the third calibration point or the fourth calibration point;
and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle.
2. A calibration device, comprising:
the first acquisition module is used for acquiring a first distance, a second distance, a third distance and a fourth distance; the first distance is the shortest distance between a first calibration point and a preset polishing head circle, the second distance is the shortest distance between a second calibration point and the preset polishing head circle, the third distance is the smallest arc distance between a third calibration point and the preset polishing head circle, and the fourth distance is the smallest arc distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform;
a calibration module, configured to calibrate the preset polishing head circle to a target polishing head circle according to the first distance, the second distance, the third distance, and the fourth distance, so that the first distance is equal to the second distance, and the third distance is equal to the fourth distance; the target polishing head circle is a circle corresponding to the target position of the polishing head;
the device further comprises:
a second obtaining module, configured to obtain first position information of the first calibration point, second position information of the second calibration point, third position information of the third calibration point, and fourth position information of the fourth calibration point;
a marking module, configured to mark the first calibration point on the handling circle according to the first position information, mark the second calibration point on the handling circle according to the second position information, mark the third calibration point on the handling circle according to the third position information, and mark the fourth calibration point on the handling circle according to the fourth position information;
the second obtaining module is specifically configured to:
acquiring a first circle center of a track circle of the polishing head and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track;
connecting the first circle center and the second circle center by using a first straight line to obtain a first intersection point and a second intersection point of the first straight line and the platform circle; the second circle center is the circle center of the loading platform circle;
determining that the position information of the first intersection point is the first position information and the position information of the second intersection point is the second position information;
acquiring the radius of a polishing head track circle, a first circle center of the polishing head track circle and the loading and unloading platform circle; the polishing head track circle is a circle corresponding to the polishing head running track;
determining a cosine value of a first angle according to the radius of the track circle of the polishing head and the radius of the handling platform circle, and determining the first angle according to the cosine value; the first angle is an included angle between a first straight line and a second straight line, the first straight line is a connecting line of the first circle center and a second circle center, the second circle center is the circle center of the loading and unloading platform circle, and the second straight line is a connecting line of the first circle center and the third calibration point or the fourth calibration point;
and determining the third position information and the fourth position information according to the first angle, the first straight line and the platform circle.
3. A calibration system comprising a measuring device and a calibration device as claimed in claim 2;
the measuring device is used for measuring a first distance, a second distance, a third distance and a fourth distance, and the calibrating device is used for calibrating the position of the polishing head according to the first distance, the second distance, the third distance and the fourth distance;
the first distance is the arc distance between a first calibration point and a preset polishing head circle, the second distance is the arc distance between a second calibration point and the preset polishing head circle, the third distance is the shortest distance between a third calibration point and the preset polishing head circle, and the fourth distance is the shortest distance between a fourth calibration point and the preset polishing head circle; the first, second, third, and fourth calibration points are located on a dock circle; the preset polishing head circle is a circle corresponding to the initial position of the polishing head, and the loading and unloading platform circle is a circle corresponding to the fixed position of the loading and unloading platform.
4. The calibration system of claim 3, wherein the measurement device comprises: the device comprises a fixing piece, a first measuring piece, a second measuring piece, a third measuring piece and a fourth measuring piece;
the size and shape of the fixing piece are the same as those of the loading platform circle;
the first measuring piece is arranged at a first position, corresponding to the platform circle, on the fixing piece, the second measuring piece is arranged at a second position, corresponding to the platform circle, on the fixing piece, the third measuring piece is arranged at a third position, corresponding to the platform circle, on the fixing piece, and the fourth measuring piece is arranged at a fourth position, corresponding to the platform circle, on the fixing piece;
wherein the first position is a position of the first calibration point, the second position is a position of the second calibration point, the third position is a position of the third calibration point, and the fourth position is a position of the fourth calibration point.
5. An electronic device, comprising: a processor, a memory, and a bus;
the processor and the memory are communicated with each other through the bus;
the memory stores program instructions executable by the processor, the processor invoking the program instructions to perform the calibration method of claim 1.
6. A non-transitory computer-readable storage medium storing computer instructions that cause a computer to perform the calibration method of claim 1.
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| WO2023206982A1 (en) | 2021-05-11 | 2023-11-02 | 杭州众硅电子科技有限公司 | Device and method for calibrating operation positions of polishing head and loading and unloading platform |
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| TWI729511B (en) | 2021-06-01 |
| TW202107036A (en) | 2021-02-16 |
| CN110411344A (en) | 2019-11-05 |
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