CN110400514B - Two-dimensional bar code structure and manufacturing method thereof - Google Patents
Two-dimensional bar code structure and manufacturing method thereof Download PDFInfo
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- CN110400514B CN110400514B CN201810374845.5A CN201810374845A CN110400514B CN 110400514 B CN110400514 B CN 110400514B CN 201810374845 A CN201810374845 A CN 201810374845A CN 110400514 B CN110400514 B CN 110400514B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/06009—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code with optically detectable marking
- G06K19/06046—Constructional details
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F3/0297—Forms or constructions including a machine-readable marking, e.g. a bar code
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Abstract
The invention discloses a two-dimensional bar code structure and a manufacturing method thereof. The first metal layer is located on the first substrate, wherein the first metal layer is provided with a plurality of sections and a plurality of hollow-out areas which are formed according to the two-dimensional matrix bar code pattern, and each hollow-out area is located between the two sections. The second substrate is located on the first metal layer, and the second metal layer is located on the second substrate. The first substrate, the second substrate and the second metal layer are provided with a plurality of through holes together, and the positions of the through holes correspond to the positions of the hollow-out areas. The second substrate and the second metal layer are provided with a plurality of blind holes together, and the positions of the blind holes correspond to the positions of the sections. A section of the first metal layer is exposed from the blind via. Therefore, the overlooking patterns of the through holes and the blind holes are two-dimensional matrix bar code patterns, the effect of forming the through holes and the blind holes in the same step by using laser can be achieved, and the space and time cost can be reduced.
Description
Technical Field
The invention relates to a two-dimensional bar code structure and a manufacturing method thereof.
Background
The traditional method for manufacturing the two-dimensional bar code structure on the plate with the copper foil on the surface mainly comprises the steps of capturing a two-dimensional bar code image under a copper surface by utilizing X-ray laser, forming a through hole at a corresponding position according to the captured image, and forming a two-dimensional bar code pattern through the difference between the copper surface and the through hole. However, X-ray lasers require additional off-line processing, thereby increasing space costs, time costs, and storage costs, as well as radiation concerns.
When the two-dimensional bar code structure is manufactured by using the traditional method, laser is easy to scatter because the copper surface is not subjected to surface treatment, so that the efficiency of forming the through hole is poor. In addition, volcanic holes and craters are easily formed at the through holes, resulting in poor hole patterns and reduced image recognizability.
Disclosure of Invention
One aspect of the present invention is to provide a two-dimensional barcode structure, which can achieve the effect of forming a through hole and a blind hole in the same step using laser, and can reduce space and time costs.
In some embodiments of the present invention, a two-dimensional barcode structure comprises a first substrate, a first metal layer, a second substrate, and a second metal layer. The first metal layer is located on the first substrate, wherein the first metal layer is provided with a plurality of sections and a plurality of hollow-out areas which are formed according to the two-dimensional matrix bar code pattern, and each hollow-out area is located between the two sections. The second substrate is located on the first metal layer, and the second metal layer is located on the second substrate. The first substrate, the second substrate and the second metal layer are provided with a plurality of through holes together, and the positions of the through holes correspond to the positions of the hollow-out areas. The second substrate and the second metal layer are provided with a plurality of blind holes together, and the positions of the blind holes correspond to the positions of the sections. The section of the first metal layer is exposed from the blind hole, and the overlooking pattern of the through hole and the blind hole is a two-dimensional matrix bar code pattern.
In some embodiments of the present invention, the first metal layer of the two-dimensional bar code structure is electrically isolated from the second metal layer.
In some embodiments of the present invention, the aperture of the blind hole and the aperture of the through hole of the two-dimensional barcode structure are in a range of 250nm to 270 nm.
In some embodiments of the present invention, the diameter of the blind hole of the two-dimensional barcode structure is the same as the diameter of the through hole.
In some embodiments of the invention, the width of the section of the first metal layer of the two-dimensional barcode structure is larger than the aperture of the blind hole.
In some embodiments of the present invention, the two-dimensional barcode structure further comprises a third metal layer on a surface of the first substrate opposite to the first metal layer.
In some embodiments of the present invention, the first substrate and the second substrate of the two-dimensional bar code structure have a first sidewall and a second sidewall facing one of the through holes, respectively, one of the sections of the first metal layer has a third sidewall facing one of the through holes, and the third sidewall is recessed from the first sidewall and the second sidewall.
Another technical aspect of the present invention is to provide a method for manufacturing a two-dimensional barcode structure.
In some embodiments of the present invention, a method for fabricating a two-dimensional barcode structure includes forming a first metal layer on a first substrate, wherein the first metal layer includes a plurality of sections and a plurality of hollow-out regions formed according to a two-dimensional matrix barcode pattern; forming a second substrate on the first metal layer; forming a second metal layer on a second substrate; and forming a plurality of through holes in the first base material, the second base material and the second metal layer by using laser, and forming a plurality of blind holes in the second base material and the second metal layer, wherein the positions of the through holes correspond to the positions of the hollowed-out areas, the positions of the blind holes correspond to the positions of the sections, and overlooking patterns of the through holes and the blind holes are two-dimensional matrix bar code patterns.
In some embodiments of the present invention, the method for manufacturing a two-dimensional barcode structure further comprises performing a surface treatment on the second metal layer before forming the through holes and the blind holes by using laser.
In some embodiments of the present invention, the method for manufacturing a two-dimensional barcode structure further includes positioning a plurality of two-dimensional matrix holes at the second metal layer according to the two-dimensional matrix barcode pattern before forming the through holes and the blind holes by using laser, where the positions of the two-dimensional matrix holes are positions of the through holes and the blind holes.
In the above embodiments of the present invention, the first metal layer is designed into the sections and the hollow-out areas according to the two-dimensional matrix barcode pattern by the image design method, so that the through holes are formed in the first substrate, the second substrate and the second metal layer, and the blind holes are formed in the second substrate and the second metal layer. The image contrast between the first metal layer exposed in the blind hole and the hollow through hole can display a two-dimensional matrix bar code pattern.
Drawings
FIG. 1 is a top view of a two-dimensional barcode structure according to an embodiment of the present invention.
FIG. 2 is a partial cross-sectional view of the two-dimensional barcode structure of FIG. 1 along line 2-2.
Fig. 3 is a top view of the partial two-dimensional barcode structure of fig. 2.
Fig. 4 is a flowchart of a method for manufacturing a two-dimensional barcode structure according to an embodiment of the present invention.
Fig. 5 to 7 are partial cross-sectional views of the manufacturing method according to fig. 4 at different stages.
FIG. 8 is a partial cross-sectional view of a two-dimensional barcode structure according to another embodiment of the invention.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, in some embodiments of the invention, such implementation details are not necessary. In addition, for the sake of simplicity, some conventional structures and elements are shown in the drawings in a simple schematic manner. And the thickness of layers and regions in the drawings may be exaggerated for clarity, and the same reference numerals denote the same elements in the description of the drawings.
FIG. 1 is a top view of a two-dimensional barcode structure 100 according to one embodiment of the invention. In the embodiment, the two-dimensional barcode structure 100 is formed on a circuit board 102, and a top view pattern of the two-dimensional barcode structure 100 is a two-dimensional matrix barcode pattern 101. The circuit board 102 is not necessary, and may be determined according to design requirements, and is not intended to limit the present invention. The two-dimensional matrix barcode pattern 101 is formed by arranging the blind holes 160 and the through holes 150, and the image contrast between the blind holes 160 and the through holes 150 can provide the identification of the two-dimensional matrix barcode pattern 101 of the two-dimensional barcode structure 100.
Fig. 2 is a partial cross-sectional view of the two-dimensional barcode structure 100 of fig. 1 along line 2-2. Referring to fig. 1 and fig. 2, the two-dimensional barcode structure 100 includes a first substrate 110, a first metal layer 120, a second substrate 130, and a second metal layer 140. The first metal layer 120 is located between the first substrate 110 and the second substrate 130, and has a plurality of sections 121 and a plurality of hollow-out regions 122 formed according to the two-dimensional matrix barcode pattern 101, and each hollow-out region 122 is located between two adjacent sections 121. The second substrate 130 is located between the first metal layer 120 and the second metal layer 140. The first substrate 110, the second substrate 130 and the second metal layer 140 have a plurality of through holes 150, and the positions of the through holes 150 correspond to the positions of the hollow-out regions 122. The second substrate 130 and the second metal layer 140 have a plurality of blind holes 160, and the positions of the blind holes 160 correspond to the positions of the sections 121. The section 121 of the first metal layer 120 is exposed from the blind via 160, and the top view pattern of the through via 150 and the blind via 160 is the two-dimensional matrix barcode pattern 101.
In the present embodiment, the first metal layer 120 is designed into the section 121 and the hollow-out region 122 between the first substrate 110 and the second substrate 130 according to the two-dimensional matrix barcode pattern 101 by an image design method, so as to conveniently form the through hole 150 and the blind hole 160 in the same step by using a laser. The image contrast between the exposed first metal layer 120 in the blind hole 160 and the hollow through hole 150 can display the two-dimensional matrix barcode pattern 101.
In the present embodiment, the first metal layer 120 and the second metal layer 140 of the two-dimensional bar code structure 100 are electrically insulated. In some embodiments, the material of the first metal layer 120 and the second metal layer 140 may be copper.
Please continue to refer to fig. 1 and fig. 2. In the embodiment, the through hole 150 of the two-dimensional barcode structure 100 has an aperture D1 on the surface of the second metal layer 140, the blind hole 160 of the two-dimensional barcode structure 100 has an aperture D2 on the surface of the second metal layer 140, the aperture D1 is substantially the same as the aperture D2, and the aperture D1 and the aperture D2 both can be in the range of 250nm to 270 nm.
In the present embodiment, the through hole 150 has an aperture D3 on the bottom surface of the first substrate 110, and the aperture D3 is smaller than the aperture D1. The hollow-out area 122 of the first metal layer 120 may have a width W1, and the width W1 may be greater than the apertures D1 and D3 of the through-hole 150. The first substrate 110 and the second substrate 130 of the two-dimensional barcode structure 100 respectively have a first sidewall 151 and a second sidewall 152 facing the through hole 150, and the first sidewall 151 of the first substrate 110 has a smaller profile than the second sidewall 152 of the second substrate 130. The section 121 of the first metal layer 120 has a third sidewall 153 facing the through hole 150, and the third sidewall 153 is retractable into the first sidewall 151 and the second sidewall 152. In addition, in this embodiment, the distance between two adjacent third sidewalls 153 is the width W1 of the hollow-out area 122. That is, any via 150 between aperture D1 and aperture D3 has an aperture diameter that is less than width W1.
In the present embodiment, the blind via 160 has an aperture D4 on the bottom surface of the second substrate 130, and the aperture D4 is smaller than the aperture D2. The section 121 of the first metal layer 120 may have a width W2, and the width W2 is greater than the apertures D2 and D4 of the blind via 160. The second substrate 130 and the second metal layer 140 of the two-dimensional barcode structure 100 commonly have a blind via sidewall 161 facing the blind via 160, and the profile of the blind via sidewall 161 decreases from the second metal layer 140 to the second substrate 130.
Fig. 3 is a top view of the partial two-dimensional barcode structure 100 of fig. 2. Referring to fig. 2 and fig. 3, in a top view of the two-dimensional barcode structure 100, the two-dimensional barcode structure includes a second metal layer 140, a through hole 150, a blind hole 160, and a first metal layer 120 exposed from the blind hole 160. For clarity, only the hole diameter D1 of the through hole 150 and the hole diameter D2 of the blind via 160 on the surface of the second metal layer 140 are shown in fig. 3.
In the embodiment, the width W1 of the hollow area 122 is greater than the apertures D1 and D3 of the through hole 150, so that the through hole 150 is prevented from being shielded by the first metal layer 120, and the width W2 of the section 121 is greater than the apertures D2 and D4 of the blind hole 160, so that the bottom of the blind hole 160 can be completely sealed by the section 121 of the first metal layer 120. The product yield of the two-dimensional barcode structure 100 can be improved.
In the present embodiment, the section 121 and the hollow-out area 122 may be rectangular. In some other embodiments, the sections 121 and the hollow-out regions 122 may have any shape. It should be understood that the width W2 of the segment 121 and the width W1 of the hollow-out region 122 may be the same or different, as long as the width W1 of the hollow-out region 122 is sufficient for the segment 121 not to extend into the through hole 150, and the width W2 of the segment 121 is sufficient for the bottom of the blind via 160 to be completely sealed by the segment 121 of the first metal layer 120.
Fig. 4 is a flowchart of a method for manufacturing a two-dimensional barcode structure according to an embodiment of the invention. First, in step S1, a first metal layer is formed on a first substrate, wherein the first metal layer includes a plurality of sections and a plurality of hollow-out areas formed according to a two-dimensional matrix barcode pattern. Next, in step S2, a second substrate is formed on the first metal layer. Next, in step S3, a second metal layer is formed on the second substrate. Finally, in step S4, a plurality of through holes are formed in the first substrate, the second substrate and the second metal layer by using laser, and a plurality of blind holes are formed in the second substrate and the second metal layer, wherein the positions of the through holes correspond to the positions of the hollow areas, the positions of the blind holes correspond to the positions of the sections, and the top view patterns of the through holes and the blind holes are two-dimensional matrix barcode patterns. In the following description, the above-described steps will be described.
Fig. 5 to 7 are partial cross-sectional views of the manufacturing method according to fig. 4 at different stages.
Referring to fig. 1 and fig. 5, in step S1, a first substrate 110 is provided, and a first metal layer 120 is formed on the first substrate 110. The first metal layer 120 includes a plurality of segments 121 and a plurality of hollow-out regions 122 formed according to the two-dimensional matrix barcode pattern 101, such that the first substrate 110 is exposed in the hollow-out regions 122. In addition, in the present embodiment, the section 121 of the first metal layer 120 may have a width W2, and any of the hollow-out regions 122 of the first metal layer 120 has a width W1.
Referring to fig. 1 and 6, in steps S2 and S3, a second substrate 130 is formed on the first metal layer 120, and then a second metal layer 140 is formed on the second substrate 130. In addition, the method for manufacturing the two-dimensional barcode structure 100 may further include performing a surface treatment on the second metal layer 140. In some embodiments, the surface treatment method may include tin spraying, nickel-gold plating, copper protective agent formation, etc., but the invention is not limited thereto, and the designer may freely select the surface treatment method according to the requirement.
By performing surface treatment on the second metal layer 140, scattering of laser on the surface of the second metal layer 140 in subsequent processes can be reduced, so that laser energy is concentrated, and phenomena of volcanic pores and collapsed pores are avoided. The second metal layer 140 after surface treatment can combine the subsequent process of forming the through holes 150 and the blind holes 160 with the process of the internal circuit of the circuit board 102 without additional off-line processes, thereby reducing the space and time costs. In addition, because the X-ray laser which is commonly used in the traditional process is not needed, the safety concern of the operating environment is reduced at the same time.
Referring to fig. 1 and fig. 7, in the present embodiment, a plurality of two-dimensional matrix holes are first located at the second metal layer 140 according to the two-dimensional matrix barcode pattern 101. The positions of the two-dimensional matrix holes correspond to the positions of the blind holes 160 and the through holes 150. Next, in step S4, the laser 170 is used to sequentially punch holes in the second metal layer 140 at the locations of the two-dimensional matrix of holes. In addition, in the present embodiment, the parameters of the laser 170 are adjusted such that the second metal layer 140 is broken down, but the first metal layer 120 is not broken down.
Therefore, by forming the first metal layer 120 according to the two-dimensional matrix barcode pattern 101 and combining the processes of the through holes 150 and the blind holes 160 with the processes of the internal circuits of the circuit board 102, after the laser 170 punches the two-dimensional matrix holes from above the second metal layer 140, a plurality of through holes 150 can be simultaneously formed in the first substrate 110, the second substrate 130 and the second metal layer 140, a plurality of blind holes 160 are formed in the second substrate 130 and the second metal layer 140, and the top view patterns of the through holes 150 and the blind holes 160 are the two-dimensional matrix barcode pattern 101. In this way, the two-dimensional barcode structure 100 of fig. 1 can be obtained.
In the present embodiment, the apertures D1 and D3 of the through hole 150 and the apertures D2 and D4 of the blind via 160 are all in the range of 250nm to 270 nm. Generally, the diameter of the conductive vias used to fill the conductive material in the internal circuit on the circuit board 102 is about 70nm, and the diameter of the vias 150 and 160 is about 260 nm. By increasing the difference between the aperture of the blind via 160 of the two-dimensional bar code structure 100 and the aperture of the conductive blind via for filling a conductive material in the internal circuit, the adsorption effect of the interior of the blind via 160 to the electroplating solution can be reduced in the subsequent electroplating process. Therefore, the blind via 160 and the conductive blind via can be formed in the same laser process step, and the blind via 160 and the conductive blind via can be prevented from being electrically connected, and an additional shielding step is not required to distinguish the blind via 160 from the conductive blind via.
It should be understood that, in the present embodiment, the two-dimensional barcode structure 100 is formed on the circuit board 102, and the number of the first substrate 110, the second substrate 130, the first metal layer 120, and the second metal layer 140 on the circuit board 102 is only illustrative, and a user can design more layers of substrates and metal layers according to actual requirements.
Fig. 8 is a partial cross-sectional view of a two-dimensional barcode structure 100a according to another embodiment of the present invention. The two-dimensional barcode structure 100a includes a first substrate 110, a first metal layer 120, a second substrate 130, and a second metal layer 140. The difference from the embodiment of fig. 2 is that: the two-dimensional barcode structure 100a further comprises a third metal layer 180. The third metal layer 180 is located on a surface of the first substrate 110 opposite to the first metal layer 120, i.e., on a lower surface of the first substrate 110. In this embodiment, after the two-dimensional barcode structure 100 of fig. 7 is formed, the third metal layer 180 may be electroplated or a substrate or a metal layer may be stacked. In addition, the size of the apertures D2 and D4 of the blind via 160 can prevent the absorption of electroplating solution in the blind via 160, so that the two-dimensional barcode structure 100a can be easily fabricated in combination with the internal circuit process of the circuit board 102 shown in fig. 1 without additional space and time costs and without interfering with the internal circuit doubt.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A two-dimensional bar code structure comprises a first substrate, a first metal layer, a second substrate and a second metal layer, wherein the first metal layer is positioned on the first substrate, the first metal layer is provided with a plurality of sections and a plurality of hollow-out areas which are formed according to a two-dimensional matrix bar code pattern, each hollow-out area is positioned between the two of the sections, the second substrate is positioned on the first metal layer, the second metal layer is positioned on the second substrate, and the two-dimensional bar code structure is characterized in that:
the first substrate, the second substrate and the second metal layer are provided with a plurality of through holes together, the positions of the through holes correspond to the positions of the hollow areas, the second substrate and the second metal layer are provided with a plurality of blind holes together, the positions of the blind holes correspond to the positions of the sections, the sections of the first metal layer are exposed from the blind holes, and the overlooking patterns of the through holes and the blind holes are the two-dimensional matrix bar code patterns.
2. The two-dimensional barcode structure of claim 1, wherein the first metal layer is electrically isolated from the second metal layer.
3. The two-dimensional barcode structure of claim 1, wherein the apertures of the plurality of blind holes and the apertures of the plurality of through holes are in a range of 250nm to 270 nm.
4. The two-dimensional barcode structure of claim 1, wherein the plurality of blind holes have the same aperture as the plurality of through holes.
5. The two-dimensional barcode structure of claim 1, wherein a width of the plurality of sections of the first metal layer is greater than an aperture of the plurality of blind holes.
6. The two-dimensional barcode structure of claim 1, further comprising:
and the third metal layer is positioned on the surface of the first substrate opposite to the first metal layer.
7. The two-dimensional barcode structure of claim 1, wherein the first substrate and the second substrate have a first sidewall and a second sidewall, respectively, facing one of the plurality of vias, one of the plurality of segments of the first metal layer has a third sidewall facing one of the plurality of vias, and the third sidewall is recessed from the first sidewall and the second sidewall.
8. A manufacturing method of a two-dimensional bar code structure comprises the steps of forming a first metal layer on a first substrate, wherein the first metal layer comprises a plurality of sections and a plurality of hollow-out areas which are formed according to a two-dimensional matrix bar code pattern; forming a second substrate on the first metal layer; forming a second metal layer on the second substrate, characterized in that:
forming a plurality of through holes in the first substrate, the second substrate and the second metal layer by using laser, and forming a plurality of blind holes in the second substrate and the second metal layer, wherein the positions of the through holes correspond to the positions of the hollow areas, the positions of the blind holes correspond to the positions of the sections, and the overlooking patterns of the through holes and the blind holes are the two-dimensional matrix barcode pattern.
9. The method of claim 8, further comprising:
performing surface treatment on the second metal layer before forming the plurality of through holes and the plurality of blind holes by using laser.
10. The method of claim 8, further comprising:
before the plurality of through holes and the plurality of blind holes are formed by using laser, the positions of the plurality of two-dimensional matrix holes on the second metal layer are positioned according to the two-dimensional matrix bar code pattern, and the positions of the plurality of two-dimensional matrix holes are the positions of the plurality of through holes and the plurality of blind holes.
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| CN1836242A (en) * | 2003-08-11 | 2006-09-20 | 技术转移服务股份有限公司 | 2-dimensional code formation method and formation device |
| CN201066551Y (en) * | 2007-07-19 | 2008-05-28 | 淄博泰宝防伪技术产品有限公司 | Holographic locating enchasing counterfeit prevention mark |
| CN103106842A (en) * | 2012-12-29 | 2013-05-15 | 中山国安火炬科技发展有限公司 | Partial holographic microvoid anti-fake film |
| CN205487116U (en) * | 2016-03-28 | 2016-08-17 | 河南冯氏电子科技有限公司 | Dedicated pollution -free fretwork child bar code of tire integration label |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9259891B2 (en) * | 2013-06-14 | 2016-02-16 | Electronic Imaging Services, Inc. | Pad of labels and labels for use on store shelves in a retail environment |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1836242A (en) * | 2003-08-11 | 2006-09-20 | 技术转移服务股份有限公司 | 2-dimensional code formation method and formation device |
| CN201066551Y (en) * | 2007-07-19 | 2008-05-28 | 淄博泰宝防伪技术产品有限公司 | Holographic locating enchasing counterfeit prevention mark |
| CN103106842A (en) * | 2012-12-29 | 2013-05-15 | 中山国安火炬科技发展有限公司 | Partial holographic microvoid anti-fake film |
| CN205487116U (en) * | 2016-03-28 | 2016-08-17 | 河南冯氏电子科技有限公司 | Dedicated pollution -free fretwork child bar code of tire integration label |
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