CN110377127B

CN110377127B - Heat dissipation device

Info

Publication number: CN110377127B
Application number: CN201810329425.5A
Authority: CN
Inventors: 白廷文; 廖文能; 王友史
Original assignee: Acer Inc
Current assignee: Acer Inc
Priority date: 2018-04-13
Filing date: 2018-04-13
Publication date: 2024-03-22
Anticipated expiration: 2038-04-13
Also published as: CN110377127A

Abstract

A heat dissipation device comprises a base, a heat dissipation platform and at least one lifting module. At least one lifting module is arranged on the base and connected with the heat dissipation platform. At least one lifting module comprises a driving element, a sliding mechanism and a supporting piece. The sliding mechanism is connected to the driving element. The support piece is arranged on the sliding mechanism and connected with the heat dissipation platform. Wherein the sliding mechanism moves the support by the driving of the driving element, and the heat dissipation platform is lifted by the movement of the support.

Description

Heat dissipation device

Technical Field

The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device.

Background

The fan air inlet or the fan air outlet of the notebook computer is generally arranged at the bottom of the notebook computer or near the screen. The air sucked into the air suction port is discharged from the air outlet, so that the heat energy in the notebook computer is brought out by utilizing convection air. To enhance the effect of such a heat dissipation mechanism, various heat dissipation devices for notebook computers, such as a cooling pad (cooling pad) and a cooling stand (cooling stand), have been commercially available for a long time.

In order to exert the heat dissipation efficiency of the notebook computer, it is necessary to provide a sufficient flow of air from the suction port to the fan or to provide an exhaust path with a sufficiently large air outlet. Taking the heat dissipation frame as an example, the distance between the notebook computer and the desktop can be increased to provide an air convection space, so that the heat dissipation efficiency is enhanced. In order to save space, many heat dissipating devices are available on the market that can be lifted when in use and closed when not in use to save space. However, the heat sink devices on the market must be manually lifted or closed by the user.

Disclosure of Invention

The invention provides a heat dissipation device which can automatically lift a heat dissipation platform.

The heat dissipating device comprises a base, a heat dissipating platform and at least one lifting module. At least one lifting module is arranged on the base and connected with the heat dissipation platform. At least one lifting module comprises a driving element, a sliding mechanism and a supporting piece. The sliding mechanism is connected to the driving element. The support piece is arranged on the sliding mechanism and connected with the heat dissipation platform. Wherein the sliding mechanism moves the support by the driving of the driving element, and the heat dissipation platform is lifted by the movement of the support.

In order to make the above features and advantages of the present invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1A to 1C are schematic top, side and perspective views of a heat dissipating device according to an embodiment of the invention.

Fig. 2 is a schematic perspective view of a hidden cooling platform of the cooling device in fig. 1C.

Fig. 3 is a perspective exploded view of the heat dissipating device of fig. 1C.

Fig. 4A and 4B are enlarged perspective views of the heat sink of fig. 1B in a raised state and a closed state, respectively.

Fig. 5A and 5B are enlarged perspective views of a heat dissipating device according to another embodiment of the present invention in the raised state and the closed state of the heat dissipating device of fig. 1B, respectively.

Fig. 6A and fig. 6B are schematic perspective and side views of a heat dissipating device according to another embodiment of the invention in a lifted state.

Fig. 7 is a perspective exploded view of another embodiment of the heat dissipating device of fig. 6A in a lifted state.

Fig. 8A and fig. 8B are schematic perspective views of a hidden carrier plate of a heat dissipating platform of the heat dissipating device of fig. 1C.

[ symbolic description ]

10: portable electronic device

100. 100A, 100B, 100C: heat dissipation device

110. 110A: base seat

112: accommodating space

120. 120A, 120B: heat dissipation platform

130. 130A: frame body

132. 132A: frame

134. 134A: sliding bar

136. 136A: sliding connector

137: socket joint

138: positioning part

150: heat dissipation element

160. 160A, 160B: lifting module

170. 170A: sliding mechanism

172. 172A: body

174. 174A: sliding part

176: driving part

178: screw rod

180. 180A: driving element

190. 190A, 190B: support member

192: connecting part

194: support bar

A: groove

B: sliding channel

O: sliding rail

P: fixing element

Detailed Description

Fig. 1A to 1C are schematic top, side and perspective views of a heat dissipating device according to an embodiment of the invention. Fig. 2 is a schematic perspective view of a hidden cooling platform of the cooling device in fig. 1C. Fig. 3 is a perspective exploded view of the heat dissipating device of fig. 1C. Referring to fig. 1A to 3, in the present embodiment, the heat dissipating device 100 is suitable for use with a portable electronic device 10 (see fig. 4A and 4B), and the portable electronic device 10 is, for example, a notebook computer, but the present invention is not limited thereto. The heat dissipating device 100 includes a base 110, a heat dissipating platform 120, and at least one lifting module 160. The heat dissipation platform 120 is suitable for carrying the portable electronic device 10. The heat sink deck 120 may be lifted by driving the lifting module 160. In the present embodiment, the number of the lifting modules 160 is two, and in other embodiments, the number of the lifting modules 160 may be one or other, and the present invention is not limited thereto. In addition, in the present embodiment, the base 110 has two accommodating spaces 112, and two lifting modules 160 are respectively disposed in the two accommodating spaces 112, as shown in fig. 2.

Fig. 4A and 4B are enlarged perspective views of the heat sink of fig. 1B in a raised state and a closed state, respectively. The lifted state is a state in which the heat dissipating platform 120 is lifted by driving the lifting module 160, and the closed state is a state in which the heat dissipating platform 120 is located at the original position in a state in which the lifting module 160 is not driven. Referring to fig. 1B, 4A and 4B, each lifting module 160 includes a driving element 180, a sliding mechanism 170 and a support 190. The driving element 180 is, for example, a motor. The slide mechanism 170 is connected to the drive element 180. The supporting member 190 is disposed on the sliding mechanism 170 and connected to the heat dissipating platform 120. Wherein the sliding mechanism 170 moves the support 190 by the driving of the driving element 180, and the heat sink deck 120 is lifted by the movement of the support 190.

In detail, the sliding mechanism 170 includes a body 172, a screw 178, and a sliding portion 174. The screw 178 is connected to the driving member 180, and the screw 178 rotates relative to the body 172. The sliding portion 174 is slidably disposed on the body 172, the sliding portion 174 has an internal thread (not shown), and is pivotally connected to the screw 178, and the supporting member 190 is fixed to the sliding portion 174. Specifically, in the present embodiment, the body 172 is further provided with a driving member 176, and is pivotally connected between the driving element 180 and the screw 178 to avoid axial eccentricity between the driving element 180 and the screw 178, so as to improve the accuracy of aligning the axis of the driving element 180 to the axis of the screw 178, and the driving member 176 is, for example, a coupling. Therefore, when the driving element 180 rotates, the driving element 176 is driven to further drive the screw 178, and when the screw 178 is rotated, the sliding portion 174 pivoted to the screw 178 moves along the extending direction of the screw 178 by the screw thread action between the sliding portion 174 and the driving element 180.

For example, in the present embodiment, the initial position of the sliding portion 174 is located at the end of the screw 178 that is farther from the driving element 180, and when the driving element 180 is activated to rotate, the sliding portion 174 is moved to the end that is closer to the driving element 180 by the above-mentioned actuation. Since the supporting member 190 is fixed to the sliding portion 174, when the sliding portion 174 moves from the end farther from the driving element 180 to the end nearer thereto, the supporting member 190 rotates along with the movement of the sliding portion 174, thereby supporting and lifting the heat dissipating platform 120.

In the present embodiment, the support 190 includes a pair of connection portions 192 and a support bar 194. The pair of connection portions 192 are respectively disposed on the sliding mechanism 170 and the heat dissipation platform 120, and the supporting rod 194 is connected between the pair of connection portions 192. Specifically, one of the connection portions 192 is disposed and fixed to the sliding portion 174, and the support bar 194 is pivotally connected to the connection portion 192, so that the support bar 194 can rotate about the connection portion 192 as a pivot. One of the connection parts 192 fixed to the sliding part 174 (i.e., the connection part 192 connected to the sliding part 174) is moved by the operation of the sliding mechanism 170, and the support bar 194 is rotated by the movement of one of the connection parts 192 (i.e., the connection part 192 connected to the sliding part 174) to thereby raise the heat sink 120. And the other connecting portion 192 is connected between the support bar 194 and the heat dissipating platform 120.

Fig. 5A and 5B are enlarged perspective views of a heat dissipating device according to another embodiment of the present invention in the raised state and the closed state of the heat dissipating device of fig. 1B, respectively. Referring to fig. 5A and 5B, the heat dissipating device 100A of the present embodiment is similar to the heat dissipating device 100 of fig. 4A and 4B, but the difference between the two is that, in the present embodiment, the supporting member 190A of the lifting module 160A includes a connecting portion 192 and a supporting rod 194, the connecting portion 192 is disposed on the sliding mechanism 170, and the supporting rod 194 is connected between the connecting portion 192 and the heat dissipating platform 120. The connection portion 192 is moved by the sliding mechanism 170, and the support bar 194 is rotated by the movement of the connection portion 192 to raise the heat sink 120. Specifically, the connection portion 192 is disposed and fixed to the sliding portion 174, and both ends of the support bar 194 are pivotally connected to the connection portion 192 and the heat dissipating platform 120, respectively, so that the support bar 194 can rotate about the connection portion 192 as a pivot. The connection portion 192 is moved by the operation of the sliding mechanism 170, and the support bar 194 is rotated by the movement of the connection portion 192 to raise the heat dissipating platform 120.

Fig. 6A and fig. 6B are schematic perspective and side views of a heat dissipating device according to another embodiment of the invention in a lifted state. Referring to fig. 6A and 6B, the heat dissipating device 100B of the present embodiment is similar to the heat dissipating device 100 of fig. 1B and 1C, but the difference is that in the present embodiment, the lifting module 160B is, for example, a vertical lifting module. Specifically, the heat dissipating device 100B includes the heat dissipating platform 120A and two vertical lifting modules 160B, and the two vertical lifting modules 160B may directly stand on a horizontal plane. Each lifting module 160B includes a driving element 180A, a sliding mechanism 170A, and a support 190B, wherein the sliding mechanism 170A moves the support 190B by driving of the driving element 180, and the heat dissipation stage 120A is lifted by movement of the support 190B. In detail, in the present embodiment, the sliding mechanism 170A includes a body 172A, a driving member 176 and a screw 178, and the detailed lifting operation is similar to that of the heat dissipation module 100 of fig. 4A and 4B, so that the detailed description is omitted.

On the other hand, in the present embodiment, the heat dissipating platform 120A includes a frame 130, a carrier plate (not shown in the figure), and at least one heat dissipating element 150. A carrier plate (not shown) is disposed on the frame 130. The at least one heat dissipation element 150 is disposed on the frame 130, and the frame 130 surrounds the at least one heat dissipation element 150. The heat dissipation element 150 is, for example, a fan, in other words, the heat dissipation platform 120A is configured with the heat dissipation element 150, and the heat dissipation element 150 can be configured at any position in the frame 130.

In detail, in the present embodiment, the frame 130 includes a frame 132 and at least two sliding bars 134. Two ends of each at least two sliding bars 134 are respectively connected to two sides of the frame 132, and the at least two sliding bars 134 can slide along the extending directions of the two sides. In this way, the distance between the slide bar 134 and the frame 132 can be adjusted according to the heat dissipation elements 150 with different specifications.

The at least one heat dissipation element 150 is detachably connected to two of the at least two slide bars 134, and the at least one heat dissipation element 150 may be fixed to the at least two slide bars 134 or movable along the extending direction of the at least two slide bars 134. For example, in the present embodiment, two heat dissipation elements 150 are detachably connected between two adjacent slide bars 134 in sequence, and each heat dissipation element 150 can move along the extending direction of the two slide bars 134 correspondingly connected to adjust the position. In this way, the frame 130 of the heat dissipation platform 120A may be configured with a plurality of different heat dissipation elements 150 at the same time, and the positions thereof may be adjusted according to the usage situation, so as to achieve a good heat dissipation effect. In addition, the distance between the sliding rod 134 and the frame 132 can be adjusted to adapt to the heat dissipation elements 150 with different specifications.

Fig. 7 is a perspective exploded view of another embodiment of the heat dissipating device of fig. 6A in a lifted state. Referring to fig. 7, the heat dissipating device 100C of the present embodiment is similar to the heat dissipating module 100B of fig. 6A and 6B, but the difference between the two is that the number and the size of the heat dissipating elements 150 used in the present embodiment are different from those of the heat dissipating elements 150 used in the heat dissipating module 100B of fig. 6A. That is, the heat sink can be adjusted as required for different sizes and numbers of heat sink elements 150.

Specifically, in the present embodiment, the frame 130A includes a plurality of sliding connectors 136, and each sliding connector 136 has a socket 137 and a positioning portion 138. The socket 137 detachably sockets at least two slide bars 134. The positioning portion 138 is connected and fixed to at least one heat dissipating device 150. The sliding connection 136 is movably disposed on the at least two slide bars 134. Specifically, the four corners of the heat dissipation element 150 are connected to the two slide bars 134 through four sliding connectors 136, respectively. The socket portion 137 is, for example, a bent sheet structure, and the bent shape thereof may correspond to the shape of the slide bar 134. The positioning portion 138 is, for example, a columnar structure protruding from the surface, and the shape of the columnar structure may correspond to the shape of the positioning hole of the heat dissipation element 150. Therefore, the sliding connection 136 can be fixed to the heat dissipation element 150 through the positioning portion 138, and the heat dissipation element 150 can slide along the sliding rod 134 through the positioning portion 138 being sleeved to the sliding rod 134. In other words, the at least one heat dissipating device 150 can be moved by sliding the sliding connectors 136 on the at least two sliding bars 134, so as to adjust the position of the heat dissipating device 150 according to different usage conditions as shown in fig. 6A and 7, thereby achieving a good heat dissipating effect without using screws.

Fig. 8A and fig. 8B are schematic perspective views of a hidden carrier plate of a heat dissipating platform of the heat dissipating device of fig. 1C. Referring to fig. 8A and 8B, the heat dissipating device 100 of the present embodiment is similar to the heat dissipating device 100B of fig. 6A, but the difference between the two is that, in the present embodiment, the frame 130 further includes a plurality of sliding connectors 136A, each of the at least two sliding bars 134A has a sliding groove B, the extending direction of the sliding groove B is parallel to the extending direction of the at least two sliding bars 134A, and the sliding connectors 136A extend through the sliding groove B and are connected to at least one heat dissipating device 150. Specifically, the sliding connection 136A is, for example, a bolt and a nut, and the bolt is fixed to the nut through the sliding groove B and the heat dissipation element 150. In this way, the tightness of the sliding connection 136A can be adjusted to adjust the position of the heat dissipation element 150 on the two sliding bars 134A, so as to adapt to portable electronic devices with different specifications.

On the other hand, in the present embodiment, the two sides of the frame 132A have grooves a, and two ends of at least two sliding bars 134A are respectively accommodated in and connected to the grooves a on the two sides, and each of the at least two sliding bars 134A can slide along the extending direction of the groove a. In addition, the frame 132A has two sliding rails O and a plurality of fixing elements P respectively disposed at two ends of each of the at least two sliding bars 134A. The fixing elements P are detachably disposed on the two sliding rails O to fix at least two sliding bars 134A to the frame 132A. In other words, both ends of the slide bar 134A are received in both side grooves a of the frame 132A, and the slide bar 134A is fixed to the frame 132A by the slide rails O using the fixing members P corresponding to the number of the slide bars 134A. In this way, the tightness degree of the fixing element P can be adjusted to adjust the positions of the slide bar 134A and the heat dissipation element 150 on the two slide rails O, so as to adapt to portable electronic devices with different specifications.

In summary, in the heat dissipating device of the present invention, the heat dissipating device includes a base, a heat dissipating platform, and at least one lifting module, wherein the lifting module includes a driving element, a sliding mechanism, and a supporting member, and the sliding mechanism includes a body, a screw, and a sliding portion, wherein the driving element drives the screw, and the sliding portion moves relative to the body through rotation of the screw to rotate the supporting member, so that the heat dissipating platform is lifted. Therefore, the heat dissipation platform can be automatically lifted, and the comfort level of a user using the portable electronic device is improved. In addition, the heat dissipation platform comprises a frame body, a bearing plate and at least one heat dissipation element, wherein the frame body comprises a frame and at least two sliding rods, sliding connectors are arranged on the at least two sliding rods, and the heat dissipation element can move through sliding of the sliding connectors on the at least two sliding rods. Therefore, the position of the heat dissipation element can be adjusted according to different use conditions, and the heat dissipation effect of the portable electronic device is improved.

Although the invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, but rather may be modified or altered somewhat by persons skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A heat sink, comprising:

a base, comprising:

a frame body comprising:

the frame is provided with two sliding rails and a plurality of fixing elements; and

the two ends of each at least two sliding rods are respectively and slidably connected to two sides of the frame, the plurality of fixing elements are respectively arranged at two ends of each at least two sliding rods, the plurality of fixing elements are respectively and detachably penetrated through the two sliding rails so as to fix the at least two sliding rods to the frame, each of the two sides of the frame is provided with a groove, and the two ends of each at least two sliding rods are respectively accommodated in and slidably connected to the two grooves of the two sides; and

at least one heat dissipation element arranged on the frame body and detachably connected with two of the at least two sliding rods;

a heat dissipation platform; and

at least one lifting module set up in the base and connect in the heat dissipation platform, at least one lifting module includes:

a driving element;

a sliding mechanism connected to the driving element; and

the support piece is arranged on the sliding mechanism and connected with the heat dissipation platform, the sliding mechanism is driven by the driving element to move the support piece, and the heat dissipation platform is lifted through the movement of the support piece.

2. The heat sink of claim 1, wherein the sliding mechanism comprises:

a body;

a screw coupled to the drive element, the screw being adapted to rotate relative to the body; and

the sliding part is slidably arranged on the body and pivoted with the screw rod, the sliding part is provided with internal threads, the supporting piece is fixed on the sliding part, the driving element drives the screw rod to rotate, and the sliding part is driven by the screw rod to move relative to the body so as to rotate the supporting piece.

3. The heat sink of claim 1, wherein the support comprises:

the pair of connecting parts are respectively arranged on the sliding mechanism and the heat dissipation platform; and

and a support rod connected between the pair of connection parts, wherein one of the pair of connection parts moves through the action of the sliding mechanism, and the support rod is rotated through the movement of the connection part so as to lift the heat dissipation platform.

4. The heat dissipating device of claim 1, wherein the frame further comprises a plurality of sliding connectors movably disposed on the at least two sliding bars, each of the plurality of sliding connectors having a socket portion detachably engaging one of the at least two sliding bars and a positioning portion connected to and fixed to the corresponding heat dissipating element.

5. The heat dissipating device of claim 1, wherein the frame further comprises a plurality of sliding connectors, each of the at least two sliding bars has a sliding groove, an extending direction of each sliding groove is parallel to an extending direction of the corresponding sliding bar, and the plurality of sliding connectors penetrate through the plurality of sliding grooves and connect with the at least one heat dissipating element.

6. The heat dissipating device of claim 1, wherein the base has at least one accommodating space, and the at least one lifting module is disposed in the at least one accommodating space.