CN110286441A - Optical antenna preparation method and optical chip - Google Patents
Optical antenna preparation method and optical chip Download PDFInfo
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- CN110286441A CN110286441A CN201910403568.0A CN201910403568A CN110286441A CN 110286441 A CN110286441 A CN 110286441A CN 201910403568 A CN201910403568 A CN 201910403568A CN 110286441 A CN110286441 A CN 110286441A
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- optical
- antenna
- waveguide region
- grating construction
- optical antenna
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The embodiment of the present invention provides a kind of optical antenna preparation method and optical chip, belongs to photon technology field.Include: to carry out single etch processing on default platform, obtains optical antenna；Wherein, optical antenna includes waveguide region and optical grating construction, and optical grating construction is located at the side of waveguide region.Method provided in an embodiment of the present invention obtains optical antenna by carrying out single etch processing on default platform.Optical antenna preparation method provided in an embodiment of the present invention and optical chip, can provide the coupling efficiency comparable with multiple etching.Due to that can be processed by single etch, the manufacturing process than multiple etching structure is more simple, can significantly reduce processing cost, so that application range is wider, practicability is preferable.
Description
Technical field
The present embodiments relate to photon technology field more particularly to a kind of optical antenna preparation method and optical chips.
Background technique
Optical antenna on chip will can mutually be converted in waveguide of the light on chip and free space, be integrated optics
The Primary Component of platform.In the related art, mainly by way of multiple etching, higher cost and coupling efficiency is lower.
In addition, the optical chip application range comprising optical antenna is relatively narrow, and practicability is poor.
Summary of the invention
To solve the above-mentioned problems, the embodiment of the present invention provides one kind and overcomes the above problem or at least be partially solved
State the optical antenna preparation method and optical chip of problem.
According to a first aspect of the embodiments of the present invention, a kind of optical antenna preparation method is provided, comprising:
Single etch processing is carried out on default platform, obtains optical antenna；Wherein, optical antenna include waveguide region and
Optical grating construction, optical grating construction are located at the side of waveguide region.
According to a second aspect of the embodiments of the present invention, a kind of optical chip is provided, comprising: based on the various of first aspect
Optical antenna prepared by any possible implementation in possible implementation；One of waveguide region in optical antenna
End is connect with the other structures in optical chip, so that optical path is connected to.
Optical antenna preparation method provided in an embodiment of the present invention and optical chip, by carrying out single on default platform
Lithography obtains optical antenna.Since the coupling efficiency comparable with multiple etching can be provided, and added by single etch
Work, the manufacturing process than multiple etching structure is more simple, can significantly reduce processing cost, so that application range is wider, it is practical
Property is preferable.
It should be understood that above general description and following detailed description be it is exemplary and explanatory, can not
Limit the embodiment of the present invention.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of flow diagram of optical antenna preparation method provided in an embodiment of the present invention；
Fig. 2 is that a kind of structure of optical antenna provided in an embodiment of the present invention is intended to；
Fig. 3 is that a kind of structure of optical antenna provided in an embodiment of the present invention is intended to；
Fig. 4 is a kind of schematic diagram of far-field radiation light field provided in an embodiment of the present invention；
Fig. 5 is a kind of schematic diagram of far-field radiation light field provided in an embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
Every other embodiment obtained without creative efforts, shall fall within the protection scope of the present invention.
Optical antenna on chip will can mutually be converted in waveguide of the light on chip and free space, be integrated optics
The Primary Component of chip.In the related art, mainly by way of multiple etching, higher cost.
For the problems in the relevant technologies, in conjunction with above description, the embodiment of the invention provides a kind of preparations of optical antenna
Method.Referring to Fig. 1, this method comprises: 101, the progress single etch processing on default platform；102, optical antenna is obtained.
Wherein, optical antenna includes waveguide region and optical grating construction, and optical grating construction is located at the side of waveguide region.Based on upper
The content for stating embodiment, as a kind of alternative embodiment, presetting platform is the wafer manufactured for integrated optics.Optical antenna
Structure can refer to Fig. 2, and in Fig. 2, the structure of 4 arcs composition is optical grating construction.The region of 5 cylindricalitys composition is waveguide section
Domain, the length of the waveguide region can be 80um as shown in the figure, or other specifications, the embodiment of the present invention do not make this
It is specific to limit.The region connecting with waveguide region is the region of external connection, which is used to connect with external optical path, the area
The length in domain can be 69um, and width can be 18um, or other specifications, the embodiment of the present invention do not limit this specifically
It is fixed.The corresponding region 1.4um is channel, is used for input waveguide, and 1.4um indicates channel width.It should be noted that input waveguide
Partial channel width is 1.4um primarily to matching the single mode waveguide width on default platform, the embodiment of the present invention is to this
It is not especially limited.By taking default platform is plate as an example, single etch waveguide region and optical grating construction on plate, shape knot
Structure can refer to Fig. 3.
Method provided in an embodiment of the present invention obtains optical antenna by carrying out single etch processing on default platform.
It since the coupling efficiency comparable with multiple etching can be provided, and is processed by single etch, than the system of multiple etching structure
It is more simple to make technique, can significantly reduce processing cost, so that application range is wider, practicability is preferable.
Content based on the above embodiment, as a kind of alternative embodiment, the wafer for integrated optics manufacture is
Nitrogenize the Silicon Wafer in Silicon Wafer or insulating substrate.It specifically, can be the nitridation Silicon Wafer of 200nm thickness.
Nitridation silicon platform have wide spectrum, low-loss, low-heat backscatter extinction logarithmic ratio, CMOS be compatible with many advantages, such as, bio-sensing,
The numerous areas such as laser radar have broad application prospects.Content based on the above embodiment, as a kind of alternative embodiment,
Default platform is nitridation silicon platform.It is, of course, also possible to be the platform of other techniques, the embodiment of the present invention does not limit this specifically
It is fixed.
Content based on the above embodiment, as a kind of alternative embodiment, optical grating construction is located at the side of waveguide region；Its
In, light is conducted by waveguide region, and is interfered by optical grating construction.
Content based on the above embodiment, as a kind of alternative embodiment, the waveguiding structure of waveguide region be slab waveguide,
Tapered transmission line or multi-mode interference coupler.
Content based on the above embodiment, as a kind of alternative embodiment, optical grating construction is made of grating tooth, grating tooth
Shape is rectangle or arc.
Content based on the above embodiment, as a kind of alternative embodiment, the screen periods of optical grating construction are 1.2um.
In conjunction with the content of above-described embodiment, the embodiment of the invention also provides a kind of optical chips.The optical chip includes:
Based on optical antenna prepared by any of the above-described optical antenna preparation method embodiment；Wherein, the waveguide region in optical antenna
One end and optical chip in other structures connection so that optical path be connected to.
Content based on the above embodiment, as a kind of alternative embodiment, if optical antenna is as the light in optical chip
Transmitter, then light sequentially enters in optical grating construction and free space in optical antenna from waveguide region；Wherein, in optical grating construction
Grating tooth have preset phase poor, by the interference of light, radiation spot can be formed in far field.Wherein, far-field radiation light field
The canescence region that schematic diagram can refer in Fig. 4 and Fig. 5, Fig. 4 and Fig. 5 is radiation spot.
Content based on the above embodiment, as a kind of alternative embodiment, if optical antenna as optical receiver, due to light
The invertibity on road, the then light on optical grating construction being radiated in optical antenna are coupled with antenna mould field, and are entered in waveguide region.
In order to make it easy to understand, by taking default platform is nitridation silicon platform as an example.Wherein, nitridation silicon platform can be silicon nitride core
Piece, thickness can be 200mm, and structure size can refer to Fig. 2 and Fig. 3.Wherein, the width of input waveguide part 1.4um be for
Single mode waveguide width in the selected nitridation silicon platform of matching.The screen periods of optical grating construction are 1.2um, and duty ratio can be
50%, radiation efficiency can be 37%.
Embodiment of the method described above is only schematical, wherein unit can be as illustrated by the separation member
Or may not be and be physically separated, component shown as a unit may or may not be physical unit, i.e.,
It can be located in one place, or may be distributed over multiple network units.It can select according to the actual needs therein
Some or all of the modules achieves the purpose of the solution of this embodiment.Those of ordinary skill in the art are not paying creative labor
In the case where dynamic, it can understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It realizes by means of software and necessary general hardware platform, naturally it is also possible to pass through hardware.Based on this understanding, on
Stating technical solution, substantially the part that contributes to existing technology can be embodied in the form of software products in other words, should
Computer software product may be stored in a computer readable storage medium, such as ROM/RAM, magnetic disk, CD, including several fingers
It enables and using so that a computer equipment (can be personal computer, server or the network equipment etc.) executes each implementation
Method described in certain parts of example or embodiment.
Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
Present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: it still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features；
And these are modified or replaceed, technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (9)
1. a kind of optical antenna preparation method characterized by comprising
Single etch processing is carried out on default platform, obtains optical antenna；Wherein, the optical antenna include waveguide region and
Optical grating construction, the optical grating construction are located at the side of the waveguide region.
2. the method according to claim 1, wherein the default platform is the crystalline substance manufactured for integrated optics
Circle.
3. according to the method described in claim 2, it is characterized in that, the wafer for integrated optics manufacture is nitridation silicon wafer
Silicon Wafer in round or insulating substrate.
4. the method according to claim 1, wherein the optical grating construction is located at the side of the waveguide region；
Wherein, light is conducted by the waveguide region, and is interfered by the optical grating construction.
5. the method according to claim 1, wherein the waveguiding structure of the waveguide region is slab waveguide, cone
Shape waveguide or multi-mode interference coupler.
6. the method according to claim 1, wherein the optical grating construction is made of grating tooth, the grating tooth
Shape be rectangle or arc.
7. a kind of optical chip characterized by comprising prepared based on method described in any one of claims 1 to 6
The optical antenna arrived；Other structures connection in one end and optical chip of waveguide region in the optical antenna, so that
Optical path connection.
8. optical chip according to claim 7, which is characterized in that if the optical antenna is as in the optical chip
Optical transmitting set, then light sequentially enters in optical grating construction and free space in the optical antenna from the waveguide region；Its
In, the grating tooth in the optical grating construction can form radiation spot in far field by the interference of light.
9. optical chip according to claim 7, which is characterized in that if the optical antenna as optical receiver, according to
The light penetrated on the optical grating construction in the optical antenna is coupled with antenna mould field, and is entered in the waveguide region.
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| CN201910403568.0A CN110286441B (en) | 2019-05-15 | 2019-05-15 | Optical antenna preparation method and optical chip |
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Cited By (1)
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|---|---|---|---|---|
| CN111399114A (en) * | 2020-04-02 | 2020-07-10 | 中国科学院微电子研究所 | Design method of grating antenna |
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| CN110286441B (en) | 2021-10-01 |
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